A chip modeling component stability testing method and system based on production computing

Abstract

The present invention discloses a chip modeling component stability testing method and system based on production operation, the method comprising: modeling a chip through a chip modeling component, obtaining a state variable set and input variables of the modeled chip, and calculating a production operation value of each state variable in the state variable set through production operation; setting a chip modeling component stability evaluation model, and calculating a stability index of each state variable according to the state variables, the input variables and the production operation value; setting a stability threshold, and comparing the stability index with the stability threshold. If the stability index is less than or equal to the stability threshold, the modeled chip is in a stable state under the combination of the state variables and the input variables corresponding to the stability index.

Description

Technical Field

[0001] The present invention belongs to the field of chip testing technology, and more specifically, relates to a chip modeling component stability testing method and system based on production computing. Background Art

[0002] Chip modeling refers to the modeling and simulation of various parts of a chip by using computer-aided design tools and techniques when designing and developing an integrated circuit (IC) to ensure its performance, functionality, and reliability. Chip modeling usually includes the following steps:

[0003] Functional modeling: Determine the functional requirements and architecture of the chip, including logic circuits, memory cells, input / output interfaces, etc.

[0004] Behavioral modeling: Use a hardware description language (such as Verilog or VHDL) to describe the behavior of the chip for simulation and verification.

[0005] Circuit modeling: Detailed design of the chip's circuits, including transistor-level design and circuit layout.

[0006] Physical modeling: Considers how the chip will perform in its actual physical environment, including factors such as temperature, power consumption, and electromagnetic interference.

[0007] Verification and simulation: Use simulation tools to thoroughly test the chip to ensure it functions properly under a wide range of conditions.

[0008] However, there is no technical solution in the prior art that can perform efficient and comprehensive stability analysis on the chip modeled by the chip modeling component. Summary of the invention

[0009] In order to solve the above technical problems, the present invention proposes a chip modeling component stability testing method based on production computing, comprising:

[0010] Modeling the chip through the chip modeling component, obtaining the state variable set and input variables of the modeled chip, and calculating the production operation value of each state variable in the state variable set through production operation;

[0011] Setting a chip modeling component stability evaluation model, and calculating a stability index of each state variable according to the state variable, the input variable and the production operation value;

[0012] A stability threshold is set, and the stability index is compared with the stability threshold. If the stability index is less than or equal to the stability threshold, the chip is in a stable state under the combination of the state variable and the input variable corresponding to the stability index after modeling.

[0013] Further, the state variable set includes a plurality of state variables, wherein the state variables are:

[0014] After modeling, the voltage, current, clock signal frequency and phase difference of each node inside the chip are obtained.

[0015] Furthermore, the calculation of the production operation value includes:

[0016] ,

[0017] in, is a state variable The production value of is the modulus of the state variable set, is the adjustment factor of the module length, is the number of state variables, For the The first adjustment factor for the state variable, For the The second adjustment factor for the state variable, For the state variables.

[0018] Furthermore, the chip modeling component stability evaluation model includes:

[0019] ,

[0020] in, is a state variable The stability index, is a nonlinear dynamic function used to describe time Time state variable With input variables relationship.

[0021] Further, including:

[0022] ,

[0023] in, For the state variables, For the The first adjustment factor for the state variable, For the state variables, For the The first adjustment factor for the state variable, For the The second adjustment factor for the state variable, For the state variables.

[0024] Furthermore, nonlinear dynamic function include:

[0025] ,

[0026] in, is the chip capacitance value, For time Time state variables , For time Time Input variables , is the chip inductance value, is the chip resistance value, is the chip thermal voltage, is the chip saturation current.

[0027] Specifically, it also includes: finding the combination of the state variables and the input variables in a stable state as a balance point, traversing the combination of the state variables and the input variables adjacent to the balance point, if there is a stability index greater than the stability threshold, the chip is locally stable after modeling, if the stability indexes of all combinations of the state variables and the input variables are less than or equal to the stability threshold, the chip is completely stable after modeling.

[0028] Furthermore, it includes: the state variables and the input variables correspond one to one.

[0029] The present invention also proposes a chip modeling component stability testing system based on production computing, comprising:

[0030] A module for calculating a production operation value is used to model the chip through a chip modeling component, obtain a state variable set and input variables of the modeled chip, and calculate a production operation value of each state variable in the state variable set through production operation;

[0031] A stability index calculation module is used to set a chip modeling component stability evaluation model, and calculate the stability index of each state variable according to the state variable, the input variable and the production operation value;

[0032] The test module is used to set a stability threshold and compare the stability index with the stability threshold. If the stability index is less than or equal to the stability threshold, the chip is in a stable state under the combination of the state variable and the input variable corresponding to the stability index after modeling.

[0033] Further, the state variable set includes a plurality of state variables, wherein the state variables are:

[0034] After modeling, the voltage, current, clock signal frequency and phase difference of each node inside the chip are obtained.

[0035] Compared with the prior art, the above technical solution conceived by the present invention has the following beneficial effects:

[0036] The present invention sets a chip modeling component stability evaluation model, calculates the stability index of each state variable according to the state variable, the input variable and the production operation value; sets a stability threshold, compares the stability index with the stability threshold, and if the stability index is less than or equal to the stability threshold, the modeled chip is in a stable state under the combination of the state variable and the input variable corresponding to the stability index. Through the above technical solution, the present invention can evaluate the stability of the chip modeled by the chip modeling component, and provide a test tool for R&D personnel. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 is a flow chart of the method of embodiment 1 of the present invention;

[0038] Figure 2 It is a system structure diagram of embodiment 2 of the present invention. DETAILED DESCRIPTION

[0039] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0040] The method provided by the present invention can be implemented in the following terminal environment, and the terminal may include one or more of the following components: a processor, a storage medium, and a display screen. The storage medium stores at least one instruction, and the instruction is loaded and executed by the processor to implement the method described in the following embodiment.

[0041] The processor may include one or more processing cores. The processor uses various interfaces and lines to connect various parts in the entire terminal, and executes various functions of the terminal and processes data by running or executing instructions, programs, code sets or instruction sets stored in the storage medium, and calling data stored in the storage medium.

[0042] The storage medium may include a random access memory (RAM) or a read-only memory (ROM). The storage medium may be used to store instructions, programs, codes, code sets or instructions.

[0043] The display is used to show the interactive cross-section of each application.

[0044] All subscripts in the formulas of the present invention are only used to distinguish parameters and have no actual meaning.

[0045] In addition, those skilled in the art can understand that the structure of the above terminal does not constitute a limitation on the terminal, and the terminal may include more or fewer components, or combine certain components, or arrange the components differently. For example, the terminal also includes components such as a radio frequency circuit, an input unit, a sensor, an audio circuit, and a power supply, which will not be described in detail here.

[0046] Example 1

[0047] like Figure 1 As shown, the present invention proposes a chip modeling component stability testing method based on production computing, comprising:

[0048] Step 101, modeling the chip through a chip modeling component, obtaining a state variable set and input variables of the modeled chip, and calculating a production operation value of each state variable in the state variable set through production operation;

[0049] Specifically, the state variable set includes multiple state variables, where the state variables are:

[0050] After modeling, the voltage, current, clock signal frequency and phase difference of each node inside the chip are obtained.

[0051] Step 102, setting a chip modeling component stability evaluation model, and calculating a stability index of each state variable according to the state variable, the input variable and the production operation value;

[0052] Specifically, the calculation of production operation values ​​includes:

[0053] ,

[0054] in, is a state variable The production value of is the modulus of the state variable set, is the adjustment factor of the module length, is the number of state variables, For the The first adjustment factor for the state variable, For the The second adjustment factor for the state variable, For the state variables.

[0055] Specifically, the chip modeling component stability evaluation model includes:

[0056] ,

[0057] in, is a state variable The stability index, is a nonlinear dynamic function used to describe time Time state variable With input variables relationship.

[0058] Specifically, they include:

[0059] ,

[0060] in, For the state variables, For the The first adjustment factor for the state variable, For the state variables, For the The first adjustment factor for the state variable, For the The second adjustment factor for the state variable, For the state variables.

[0061] Specifically, nonlinear dynamic function include:

[0062] ,

[0063] in, is the chip capacitance value, For time Time state variables , For time Time Input variables , is the chip inductance value, is the chip resistance value, is the chip thermal voltage, is the chip saturation current.

[0064] Step 103, setting a stability threshold, comparing the stability index with the stability threshold, if the stability index is less than or equal to the stability threshold, then after modeling, the chip is in a stable state under the combination of the state variable and the input variable corresponding to the stability index.

[0065] Specifically, it also includes: finding the combination of the state variables and the input variables in a stable state as a balance point, traversing the combination of the state variables and the input variables adjacent to the balance point, if there is a stability index greater than the stability threshold, the chip is locally stable after modeling, if the stability indexes of all combinations of the state variables and the input variables are less than or equal to the stability threshold, the chip is completely stable after modeling.

[0066] Specifically, it includes: the state variables and the input variables are in one-to-one correspondence.

[0067] Example 2

[0068] like Figure 2 As shown, the embodiment of the present invention also proposes a chip modeling component stability testing system based on production computing, including:

[0069] A module for calculating a production operation value is used to model the chip through a chip modeling component, obtain a state variable set and input variables of the modeled chip, and calculate a production operation value of each state variable in the state variable set through production operation;

[0070] Specifically, the state variable set includes multiple state variables, where the state variables are:

[0071] After modeling, the voltage, current, clock signal frequency and phase difference of each node inside the chip are obtained.

[0072] A stability index calculation module is used to set a chip modeling component stability evaluation model, and calculate the stability index of each state variable according to the state variable, the input variable and the production operation value;

[0073] Specifically, the calculation of production operation values ​​includes:

[0074] ,

[0075] in, is a state variable The production value of is the modulus of the state variable set, is the adjustment factor of the module length, is the number of state variables, For the The first adjustment factor for the state variable, For the The second adjustment factor for the state variable, For the state variables.

[0076] Specifically, the chip modeling component stability evaluation model includes:

[0077] ,

[0078] in, is a state variable The stability index, is a nonlinear dynamic function used to describe time Time state variable With input variables relationship.

[0079] Specifically, they include:

[0080] ,

[0081] in, For the state variables, For the The first adjustment factor for the state variable, For the state variables, For the The first adjustment factor for the state variable, For the The second adjustment factor for the state variable, For the state variables.

[0082] Specifically, nonlinear dynamic function include:

[0083] ,

[0084] in, is the chip capacitance value, For time Time state variables , For time Time Input variables , is the chip inductance value, is the chip resistance value, is the chip thermal voltage, is the chip saturation current.

[0085] The test module is used to set a stability threshold and compare the stability index with the stability threshold. If the stability index is less than or equal to the stability threshold, the chip is in a stable state under the combination of the state variable and the input variable corresponding to the stability index after modeling.

[0086] Specifically, it also includes: finding the combination of the state variables and the input variables in a stable state as a balance point, traversing the combination of the state variables and the input variables adjacent to the balance point, if there is a stability index greater than the stability threshold, the chip is locally stable after modeling, if the stability indexes of all combinations of the state variables and the input variables are less than or equal to the stability threshold, the chip is completely stable after modeling.

[0087] Specifically, it includes: the state variables and the input variables are in one-to-one correspondence.

[0088] Example 3

[0089] An embodiment of the present invention further provides a storage medium storing a plurality of instructions, wherein the instructions are used to implement the chip modeling component stability testing method based on production operation.

[0090] Optionally, in this embodiment, the above storage medium may be located in any computer terminal in a computer terminal group in a computer network, or in any mobile terminal in a mobile terminal group.

[0091] Optionally, in this embodiment, the storage medium is configured to store program codes for executing the method steps: Step 101, modeling the chip through a chip modeling component, obtaining a state variable set and input variables of the modeled chip, and calculating a production operation value of each state variable in the state variable set through production operation;

[0092] Specifically, the state variable set includes multiple state variables, where the state variables are:

[0093] After modeling, the voltage, current, clock signal frequency and phase difference of each node inside the chip are obtained.

[0094] Step 102, setting a chip modeling component stability evaluation model, and calculating a stability index of each state variable according to the state variable, the input variable and the production operation value;

[0095] Specifically, the calculation of production operation values ​​includes:

[0096] ,

[0097] in, is a state variable The production value of is the modulus of the state variable set, is the adjustment factor of the module length, is the number of state variables, For the The first adjustment factor for the state variable, For the The second adjustment factor for the state variable, For the state variables.

[0098] Specifically, the chip modeling component stability evaluation model includes:

[0099] ,

[0100] in, is a state variable The stability index, is a nonlinear dynamic function used to describe time Time state variable With input variables relationship.

[0101] Specifically, they include:

[0102] ,

[0103] in, For the state variables, For the The first adjustment factor for the state variable, For the state variables, For the The first adjustment factor for the state variable, For the The second adjustment factor for the state variable, For the state variables.

[0104] Specifically, nonlinear dynamic function include:

[0105] ,

[0106] in, is the chip capacitance value, For time Time state variables , For time Time Input variables , is the chip inductance value, is the chip resistance value, is the chip thermal voltage, is the chip saturation current.

[0107] Step 103, setting a stability threshold, comparing the stability index with the stability threshold, if the stability index is less than or equal to the stability threshold, then after modeling, the chip is in a stable state under the combination of the state variable and the input variable corresponding to the stability index.

[0108] Specifically, it also includes: finding the combination of the state variables and the input variables in a stable state as a balance point, traversing the combination of the state variables and the input variables adjacent to the balance point, if there is a stability index greater than the stability threshold, the chip is locally stable after modeling, if the stability indexes of all combinations of the state variables and the input variables are less than or equal to the stability threshold, the chip is completely stable after modeling.

[0109] Specifically, it includes: the state variables and the input variables are in one-to-one correspondence.

[0110] Example 4

[0111] An embodiment of the present invention also proposes an electronic device, including a processor and a storage medium connected to the processor, wherein the storage medium stores multiple instructions, and the instructions can be loaded and executed by the processor to enable the processor to perform a chip modeling component stability testing method based on production operations.

[0112] Specifically, the electronic device of this embodiment may be a computer terminal, and the computer terminal may include: one or more processors, and a storage medium.

[0113] Among them, the storage medium can be used to store software programs and modules, such as a chip modeling component stability testing method based on industrial operation in an embodiment of the present invention, and the corresponding program instructions / modules. The processor executes various functional applications and data processing by running the software programs and modules stored in the storage medium, that is, realizing the above-mentioned chip modeling component stability testing method based on industrial operation. The storage medium may include high-speed random storage media, and may also include non-volatile storage media, such as one or more magnetic storage systems, flash memory, or other non-volatile solid-state storage media. In some instances, the storage medium may further include storage media remotely arranged relative to the processor, and these remote storage media can be connected to the terminal via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, corporate intranet, local area network, mobile communication network and combinations thereof.

[0114] The processor can call the information and application stored in the storage medium through the transmission system to execute the method steps: Step 101, modeling the chip through the chip modeling component, obtaining the state variable set and input variables of the modeled chip, and calculating the production operation value of each state variable in the state variable set through production operation;

[0115] Specifically, the state variable set includes multiple state variables, where the state variables are:

[0116] After modeling, the voltage, current, clock signal frequency and phase difference of each node inside the chip are obtained.

[0117] Step 102, setting a chip modeling component stability evaluation model, and calculating a stability index of each state variable according to the state variable, the input variable and the production operation value;

[0118] Specifically, the calculation of production operation values ​​includes:

[0119] ,

[0120] in, is a state variable The production value of is the modulus of the state variable set, is the adjustment factor of the module length, is the number of state variables, For the The first adjustment factor for the state variable, For the The second adjustment factor for the state variable, For the state variables.

[0121] Specifically, the chip modeling component stability evaluation model includes:

[0122] ,

[0123] in, is a state variable The stability index, is a nonlinear dynamic function used to describe time Time state variable With input variables relationship.

[0124] Specifically, they include:

[0125] ,

[0126] in, For the state variables, For the The first adjustment factor for the state variable, For the state variables, For the The first adjustment factor for the state variable, For the The second adjustment factor for the state variable, For the state variables.

[0127] Specifically, nonlinear dynamic function include:

[0128] ,

[0129] in, is the chip capacitance value, For time Time state variables , For time Time Input variables , is the chip inductance value, is the chip resistance value, is the chip thermal voltage, is the chip saturation current.

[0130] Step 103, setting a stability threshold, comparing the stability index with the stability threshold, if the stability index is less than or equal to the stability threshold, then after modeling, the chip is in a stable state under the combination of the state variable and the input variable corresponding to the stability index.

[0131] Specifically, it also includes: finding the combination of the state variables and the input variables in a stable state as a balance point, traversing the combination of the state variables and the input variables adjacent to the balance point, if there is a stability index greater than the stability threshold, the chip is locally stable after modeling, if the stability indexes of all combinations of the state variables and the input variables are less than or equal to the stability threshold, the chip is completely stable after modeling.

[0132] Specifically, it includes: the state variables and the input variables correspond one to one.

[0133] The serial numbers of the above embodiments of the present invention are only for description and do not represent the advantages or disadvantages of the embodiments.

[0134] In the above embodiments of the present invention, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0135] In the several embodiments provided by the present invention, it should be understood that the disclosed technical content can be implemented in other ways. Among them, the system embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of units or modules, which can be electrical or other forms.

[0136] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0137] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0138] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for a computer device (which can be a personal computer, a server or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, read-only storage medium (ROM, Read-Only Memory), random access storage medium (RAM, Random Access Memory), mobile hard disk, magnetic disk or optical disk and other media that can store program codes.

[0139] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. A chip modeling component stability testing method based on production computing, characterized in that: include: Modeling the chip through the chip modeling component, obtaining the state variable set and input variables of the modeled chip, and calculating the production operation value of each state variable in the state variable set through production operation; The state variable set includes a plurality of state variables, wherein the state variables are: voltage, current, clock signal frequency and phase difference of each node inside the chip after modeling; The calculated values ​​include: ， in, is a state variable The production value of is the modulus of the state variable set, is the adjustment factor of the module length, is the number of state variables, For the The first adjustment factor for the state variable, For the The second adjustment factor for the state variable, For the state variables; Setting a chip modeling component stability evaluation model, and calculating a stability index of each state variable according to the state variable, the input variable and the production operation value; The chip modeling component stability evaluation model includes: ， in, is a state variable The stability index, is a nonlinear dynamic function used to describe time Time state variable With input variables relationship; ， in, For the state variables, For the The first adjustment factor for the state variable, For the state variables, For the The first adjustment factor for the state variable, For the The second adjustment factor for the state variable, For the state variables; Nonlinear dynamic function include: ， in, is the chip capacitance value, For time Time state variables , For time Time Input variables , is the chip inductance value, is the chip resistance value, is the chip thermal voltage, is the chip saturation current; A stability threshold is set, and the stability index is compared with the stability threshold. If the stability index is less than or equal to the stability threshold, the chip is in a stable state under the combination of the state variable and the input variable corresponding to the stability index after modeling.

2. A chip modeling component stability testing method based on production calculation as claimed in claim 1, characterized in that: Also includes: Find the combination of the state variables and the input variables in a stable state as the equilibrium point, traverse the combination of the state variables and the input variables adjacent to the equilibrium point, if there is a stability index greater than the stability threshold, the chip is locally stable after modeling, if the stability indexes of all combinations of the state variables and the input variables are less than or equal to the stability threshold, the chip is completely stable after modeling.

3. A chip modeling component stability testing method based on production calculation as claimed in claim 2, characterized in that: include: The state variables and the input variables correspond one to one.

4. A chip modeling component stability testing system based on production computing, characterized in that: include: A module for calculating a production operation value is used to model the chip through a chip modeling component, obtain a state variable set and input variables of the modeled chip, and calculate a production operation value of each state variable in the state variable set through production operation; The state variable set includes a plurality of state variables, wherein the state variables are: voltage, current, clock signal frequency and phase difference of each node inside the chip after modeling; The calculated values ​​include: ， in, is a state variable The production value of is the modulus of the state variable set, is the adjustment factor of the module length, is the number of state variables, For the The first adjustment factor for the state variable, For the The second adjustment factor for the state variable, For the state variables; A stability index calculation module is used to set a chip modeling component stability evaluation model, and calculate the stability index of each state variable according to the state variable, the input variable and the production operation value; The chip modeling component stability evaluation model includes: ， in, is a state variable The stability index, is a nonlinear dynamic function used to describe time Time state variable With input variables relationship; ， in, For the state variables, For the The first adjustment factor for the state variable, For the state variables, For the The first adjustment factor for the state variable, For the The second adjustment factor for the state variable, For the state variables; Nonlinear dynamic function include: ， in, is the chip capacitance value, For time Time state variables , For time Time Input variables , is the chip inductance value, is the chip resistance value, is the chip thermal voltage, is the chip saturation current; The test module is used to set a stability threshold and compare the stability index with the stability threshold. If the stability index is less than or equal to the stability threshold, the chip is in a stable state under the combination of the state variable and the input variable corresponding to the stability index after modeling.

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