Semiconductor deposition equipment for facilitating semiconductor removal

Abstract

The present invention discloses a semiconductor deposition device which is convenient for semiconductor removal, relates to the technical field of semiconductor wafer deposition, and comprises a deposition mechanism, wherein the deposition mechanism comprises a bottom plate, a deposition device body is arranged above the bottom plate, an upper surface of the deposition device body is fixedly connected with an air inlet pipe, an inner bottom wall of the deposition device body is fixedly connected with a heating platform, and a closing mechanism is arranged above the bottom plate. The semiconductor deposition device which is convenient for semiconductor removal can always keep the semiconductor wafer in a relatively closed space by arranging a closed clamping unit, and when the semiconductor wafer storage box is opened to take out the semiconductor wafer, the surface of the semiconductor wafer will not be contaminated by external dust and impurities, thereby ensuring the cleanliness of the surface of the semiconductor wafer, increasing the closing property when the semiconductor deposition device takes out the semiconductor wafer, and also ensuring the subsequent processing quality of the semiconductor wafer to a certain extent.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wafer deposition, and in particular to a semiconductor deposition device which is convenient for semiconductor removal. Background Art

[0002] Semiconductor materials are a type of electronic materials that have semiconductor properties and can be used to make semiconductor devices and integrated circuits. Conductor materials can be classified according to their chemical composition, and amorphous and liquid semiconductors with special structures and properties can be classified separately. According to this classification method, semiconductor materials can be divided into elemental semiconductors, inorganic compound semiconductors, organic compound semiconductors, and amorphous and liquid semiconductors. Semiconductors are the main components of electronic components. In the process of manufacturing semiconductor devices, deposition equipment is required to heat the raw materials in solid or liquid form to generate steam or ion beams, which are then deposited on the surface of the semiconductor wafer substrate to form a thin film to protect the semiconductor wafer and facilitate the subsequent photolithography of the semiconductor wafer to form a circuit diagram.

[0003] When existing semiconductor deposition equipment performs thin film deposition on semiconductor wafers, the semiconductor wafers need to use ordinary wafer boxes to place the wafers during the production process to prevent the semiconductor wafers from being contaminated. When the wafers need to be placed inside the semiconductor material deposition equipment, the semiconductor wafer box needs to be opened. At this time, the outside air will contact the semiconductor wafer, making the surface of the semiconductor wafer with high requirements for surface cleanliness easily contaminated. In addition, the semiconductor wafer is located inside the box, which makes it inconvenient to quickly take out the semiconductor wafer and place it inside the semiconductor deposition equipment, affecting the overall efficiency and quality of semiconductor wafer thin film deposition.

[0004] When we consider the above problems, we will find that it is difficult to avoid the above problems at the same time when using the existing semiconductor deposition equipment, and even if it can be solved, it needs to be solved with the cooperation of external tools, thus failing to achieve the desired effect. Therefore, we propose a semiconductor deposition equipment that facilitates semiconductor removal. Summary of the invention

[0005] The object of the present invention is to provide a semiconductor deposition device that is convenient for semiconductor removal, so as to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above object, the present invention provides the following technical solution: a semiconductor deposition device for facilitating semiconductor removal, comprising a deposition mechanism, the deposition mechanism comprising a bottom plate, a deposition device body is arranged above the bottom plate, an air inlet pipe is fixedly connected to the upper surface of the deposition device body, a heating platform is fixedly connected to the inner bottom wall of the deposition device body, and a sealing mechanism is arranged above the bottom plate;

[0007] The sealing mechanism comprises a sealing clamping unit, which is arranged above the bottom plate and is used to prevent external impurities from contaminating the semiconductor;

[0008] The closing mechanism further comprises an automatic material taking unit, which is arranged inside the closing clamping unit and is used for automatic material taking and automatic material discharge of semiconductors;

[0009] A feeding mechanism is provided below the closed clamping unit, and the feeding mechanism is used in conjunction with the closing mechanism, and the feeding mechanism is used to feed the semiconductor to be deposited into the automatic material taking unit;

[0010] The closed clamping unit includes two closed frames, which are respectively arranged on both sides of the deposition equipment body, and storage boxes are arranged under the two closed frames. The upper surfaces of the two storage boxes are fixedly connected with fixed frames, and the two fixed frames are clamped in the interior of the closed frames. Two sliding frames are slidably connected inside the two fixed frames. A cover plate is fixedly connected to a side surface of each group of sliding frames close to each other. The number of sliding frames in each group is two, and the upper surfaces of the two cover plates are fixedly connected with a first permanent magnet. The front surfaces of the two closed frames are fixedly connected with a second permanent magnet. The front surfaces of the two second permanent magnets are attracted to the back surface of the first permanent magnet by magnetic force. Each The back of the sliding frame is fixedly connected with a third permanent magnet, each of the third permanent magnets is slidably connected to the inside of the fixed frame, the inner walls of the two fixed frames are fixedly connected with two fourth permanent magnets, the backs of the two closed frames are fixedly connected with auxiliary frames, the insides of the two auxiliary frames are slidably connected with sealing plates, the two sealing plates are slidably connected to the inside of the closed frames, the backs of the two sealing plates are fixedly connected with two compression springs, the other end of each compression spring is fixedly connected to the inner wall of the auxiliary frame, the outer surface of the deposition equipment body is fixedly connected to two symmetrical sealing frames, and the other side surfaces of the two sealing frames are fixedly connected to a side surface of the closed frame close to the deposition equipment body.

[0011] Preferably, the upper surfaces of the two auxiliary frames are fixedly connected with reinforcing ribs, and the front surfaces of the two reinforcing ribs are fixedly connected to the back surface of the closed frame.

[0012] Preferably, the automatic material taking unit comprises a material taking rack, which is slidably connected to the inside of one of the sealing racks, and the right side of the material taking rack is fixedly connected to a clamping rack, and the clamping rack is located inside one of the closed racks, and the right side of the clamping rack is fixedly connected to two clamping plates, and the side surfaces of the two clamping plates close to each other are fixedly connected to a first rubber plate, and the insides of the two first rubber plates are fixedly connected to two connecting springs, and the other end of each connecting spring is fixedly connected to the inner wall of the clamping plate, and the front side of the deposition device body is fixedly connected to the limiting rack, and the front sides of the two sealing racks are connected to the limiting rack The back of the rack is fixedly connected, the inner part of the limiting rack is rotatably connected with a screw, the outer surface of the screw is threadedly connected with a moving plate, the moving plate is slidably connected to the inner part of the limiting rack, the back of the moving plate is fixedly connected to the front of the material taking rack, the left side of the limiting rack is fixedly connected with a first servo motor, the output end of the first servo motor power is fixedly connected to the left end of the screw, the interiors of the two storage boxes are slidably connected with storage racks, the inner walls of the two storage racks are fixedly connected with a plurality of positioning racks, the interiors of the plurality of positioning racks are slidably connected with clamping blocks, and the outer surface of each clamping block is fixedly connected with two complex A positioning spring, the other end of each of the return springs is fixedly connected to the inner wall of the positioning frame, the inner wall of each clamping block is fixedly connected to a second rubber plate, the inner wall of each second rubber plate is fixedly connected to a fixing spring, the other end of each fixing spring is fixedly connected to the inner wall of the clamping block, wherein the inner walls of the two positioning frames are jointly clamped with a wafer, wherein the outer surfaces of the two second rubber plates are in contact with the outer surface of the wafer, a pushing frame is provided inside the deposition equipment body, the upper surface of the pushing frame is fixedly connected to two return springs, the other ends of the two return springs are fixedly connected to the inner top wall of the material taking frame Fixedly connected, two symmetrical guide plates are fixedly connected to the upper surface of the heating table, and guide grooves are provided on the side surfaces of the two guide plates that are close to each other. Guide plates are movably hinged inside the two guide plates through pins, and the bottom surfaces of the two guide plates are in contact with the upper surface of the heating table. Two symmetrical sliding columns are fixedly connected to the outer surface of the pushing frame, and each of the sliding columns is located inside the guide plates. Two positioning springs are fixedly connected to the inner top wall of the deposition equipment body, and a toggle plate is fixedly connected to the bottom ends of the two positioning springs. A groove for the toggle plate to pass through is provided on the upper surface of the material picking frame.

[0013] Preferably, a first telescopic rod is provided inside the two positioning springs, the telescopic ends of the two first telescopic rods are fixedly connected to the inner top wall of the deposition equipment body, and the bottom ends of the two first telescopic rods are fixedly connected to the upper surface of the toggle plate.

[0014] Preferably, a second telescopic rod is provided inside the two return springs, the telescopic ends of the two second telescopic rods are fixedly connected to the inner top wall of the material picking rack, and the bottom ends of the two second telescopic rods are fixedly connected to the bottom surface of the pushing rack.

[0015] Preferably, the feeding mechanism includes two positioning seats, the bottom surfaces of the two positioning seats are fixedly connected to the upper surface of the bottom plate, the two storage boxes are clamped in the interior of the positioning seats, the interiors of the two positioning seats are rotatably connected to a rotating rod, a second servo motor is arranged above the bottom plate, the output end of the second servo motor is fixedly connected to the right end of the rotating rod, the outer surface of the rotating rod is fixedly connected to two first bevel gears, the interiors of the two storage boxes are rotatably connected to threaded rods, the outer surfaces of the two threaded rods are threadedly connected to connecting blocks, the two connecting blocks are fixedly connected to the storage racks, the outer surfaces of the two threaded rods are fixedly connected to rotating handles, the two rotating handles are located below the storage box, the bottom ends of the two threaded rods are fixedly connected to the second bevel gears, and the two second bevel gears are meshed with the first bevel gear.

[0016] Preferably, the front and back sides of the two storage racks are fixedly connected with auxiliary blocks, the inner walls of the two storage boxes are provided with sliding grooves, and the two auxiliary blocks are slidably connected inside the sliding grooves.

[0017] Preferably, the outer surface of the rotating rod is rotatably connected to two stabilizing frames, and the bottom surfaces of the two stabilizing frames are fixedly connected to the upper surface of the bottom plate.

[0018] Preferably, two support seats are fixedly connected to the bottom surface of the deposition device body, and the bottom surfaces of the two support seats are fixedly connected to the upper surface of the bottom plate.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. The present invention can keep the semiconductor wafer in a relatively closed space by providing a closed clamping unit. When the semiconductor wafer box is opened to take out the semiconductor wafer, the surface of the semiconductor wafer will not be contaminated by external dust and impurities, thereby ensuring the cleanliness of the surface of the semiconductor wafer, increasing the closedness of the semiconductor deposition equipment when taking out the semiconductor wafer, and also ensuring the subsequent processing quality of the semiconductor wafer to a certain extent.

[0021] 2. The present invention provides an automatic material picking unit, which can cooperate with the closed clamping unit to allow the wafer to complete automatic material picking and unloading in a relatively closed space, making the wafer picking and placing work in the storage box more convenient and quick, and the wafer will not be contaminated by the outside world due to taking the wafer, which effectively increases the convenience of semiconductor deposition equipment for wafer picking and placing, and further improves the overall efficiency of semiconductor wafer thin film deposition.

[0022] 3. The present invention is capable of automatically lifting the wafers on the storage rack upwards by providing a feeding mechanism, so as to facilitate taking out the wafers to be processed from the storage box on the material removal rack, or sending the processed wafers from the heating table into another storage box for collection and storage, so that the feeding and retrieving processes of the wafers inside the deposition equipment body have good automation effects, making the semiconductor deposition equipment more efficient and convenient in processing wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 It is a structural schematic diagram of the material taking rack of the present invention;

[0025] Figure 3 It is a cross-sectional structural schematic diagram of the fixing frame of the present invention;

[0026] Figure 4 It is a schematic cross-sectional structural diagram of the closed frame of the present invention;

[0027] Figure 5 It is a structural schematic diagram of the sealing frame of the present invention;

[0028] Figure 6 It is a structural schematic diagram of the storage rack of the present invention;

[0029] Figure 7 It is a schematic cross-sectional structural diagram of the positioning frame of the present invention;

[0030] Figure 8 It is a structural schematic diagram of the guide plate of the present invention;

[0031] Fig. 9 It is a schematic cross-sectional structural diagram of the storage box of the present invention;

[0032] Fig.10 It is a structural schematic diagram of the base plate of the present invention.

[0033] In the figure: 1, deposition mechanism; 11, bottom plate; 12, deposition equipment body; 13, air inlet pipe; 14, heating table; 2, closing mechanism; 21, closing clamping unit; 2101, closing frame; 2102, storage box; 2103, fixed frame; 2104, sliding frame; 2105, cover plate; 2106, first permanent magnet; 2107, second permanent magnet; 2108, fourth permanent magnet; 2109, third permanent magnet; 2110, auxiliary frame; 2111, sealing plate; 2112, compression spring; 2113, reinforcing rib; 2114, sealing frame; 22, automatic material taking unit; 2201, material taking frame; 2202, clamping frame; 2203, clamping plate; 2204, first rubber plate; 2205, connecting spring; 2206, limit frame; 2207, screw; 2208, moving plate; 2209, first servo motor; 2210, storage rack; 2211, positioning rack; 2212, clamping block; 2213, reset spring; 2214, second rubber plate; 2215, fixing spring; 2216, wafer; 2217, pushing rack; 2218, return spring; 2219, guide plate; 2220, guide groove; 2221, guide plate; 2222, sliding column; 2223, positioning spring; 2224, toggle plate; 2225, first telescopic rod; 2226, second telescopic rod; 3, feeding mechanism; 301, positioning seat; 302, rotating rod; 303, second servo motor; 304, first bevel gear; 305, threaded rod; 306, connecting block; 307, rotating handle; 308, second bevel gear; 309, auxiliary block; 310, sliding groove; 311, stabilizing rack; 312, supporting seat. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] Example 1: Please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 The present invention provides a technical solution: a semiconductor deposition device for facilitating semiconductor removal, comprising a deposition mechanism 1, the deposition mechanism 1 comprising a bottom plate 11, a deposition device body 12 is arranged above the bottom plate 11, an air inlet pipe 13 is fixedly connected to the upper surface of the deposition device body 12, a heating platform 14 is fixedly connected to the inner bottom wall of the deposition device body 12, and a closing mechanism 2 is arranged above the bottom plate 11;

[0036] The sealing mechanism 2 includes a sealing clamping unit 21 , which is disposed above the bottom plate 11 . The sealing clamping unit 21 is used to prevent external impurities from contaminating the semiconductor.

[0037] As a further limitation of the closing mechanism 2 of the present invention, the closing clamping unit 21 includes two closing frames 2101, the two closing frames 2101 are respectively arranged on both sides of the deposition equipment body 12, and storage boxes 2102 are arranged below the two closing frames 2101. The upper surfaces of the two storage boxes 2102 are fixedly connected with fixed frames 2103, and the two fixed frames 2103 are both clamped inside the closing frames 2101. The interiors of the two fixed frames 2103 are slidably connected to two sliding frames 2104, and the side of each group of sliding frames 2104 close to each other is fixed. The first permanent magnet 2106 is fixedly connected to the upper surface of the two cover plates 2105, and the front of the two closed frames 2101 is fixedly connected to the second permanent magnet 2107. The front of the two second permanent magnets 2107 is attracted to the back of the first permanent magnet 2106 by magnetic force. The back of each sliding frame 2104 is fixedly connected to the third permanent magnet 2109, and each third permanent magnet 2109 is slidably connected to the inside of the fixed frame 2103. The two fixed frames 2103 The inner wall of the two closed frames 2101 is fixedly connected with two fourth permanent magnets 2108, the backs of the two closed frames 2101 are fixedly connected with auxiliary frames 2110, the interiors of the two auxiliary frames 2110 are slidably connected with sealing plates 2111, the two sealing plates 2111 are slidably connected to the interior of the closed frames 2101, the backs of the two sealing plates 2111 are fixedly connected with two compression springs 2112, the other end of each compression spring 2112 is fixedly connected to the inner wall of the auxiliary frame 2110, and the outer surface of the deposition device body 12 is fixedly connected with two symmetrical sealing frames 2114, the other side surfaces of the two sealing frames 2114 are fixedly connected to the side surface of the closing frame 2101 close to the deposition device body 12. By setting the closing clamping unit 21, the semiconductor wafer can always be located in a relatively closed space. When the semiconductor wafer box is opened to take out the semiconductor wafer, the surface of the semiconductor wafer will not be contaminated by external dust and impurities, thereby ensuring the cleanliness of the surface of the semiconductor wafer, increasing the sealing performance of the semiconductor deposition device when taking out the semiconductor wafer, and also ensuring the subsequent processing quality of the semiconductor wafer to a certain extent;

[0038] The upper surfaces of the two auxiliary frames 2110 are fixedly connected with reinforcing ribs 2113, and the front sides of the two reinforcing ribs 2113 are fixedly connected to the back sides of the closed frame 2101. The reinforcing ribs 2113 can increase the connection firmness between the auxiliary frames 2110 and the closed frame 2101, making it difficult for the auxiliary frames 2110 to loosen from the closed frame 2101, thereby improving the pressure-bearing capacity of the auxiliary frames 2110.

[0039] The specific implementation of this embodiment is as follows: when the fixing frame 2103 is inserted into the closed frame 2101, the back of the fixing frame 2103 will contact the front of the sealing plate 2111, and push the sealing plate 2111 to retract backward into the auxiliary frame 2110, and at the same time force the compression spring 2112 to contract, at this time, the connection channel between the closed frame 2101 and the sealing frame 2114 can be exposed, and in the process of the fixing frame 2103 being inserted into the closed frame 2101, the first permanent magnet 2106 and the second permanent magnet 2107 will contact each other, and at the same time, the limit The cover plate 2105 is positioned so that the cover plate 2105 stays outside the closed frame 2101, and the sliding frame 2104 is forced to slide inside the fixed frame 2103, so that the third permanent magnet 2109 and the fourth permanent magnet 2108 are out of contact, and the storage box 2102 can be opened. However, since the cover plate 2105 cooperates with the closed frame 2101 to block the gap between the storage box 2102 and the closed frame 2101, the semiconductor wafer can always be located in a relatively closed space. When taking out the semiconductor wafer, the surface of the semiconductor wafer will not be contaminated by dust and impurities from the outside, thereby ensuring the cleanliness of the surface of the semiconductor wafer, increasing the sealing of the semiconductor deposition equipment when taking out the semiconductor wafer, and also ensuring the processing quality of the subsequent semiconductor wafer to a certain extent. When it is necessary to take out the storage box 2102, it is only necessary to pull the storage box 2102 outward. At this time, since the first permanent magnet 2106 and the second permanent magnet 2107 are adsorbed together, the cover plate 2105 can be driven on the fixed frame 2103 in cooperation with the sliding frame 2104. Slide until the third permanent magnet 2109 and the fourth permanent magnet 2108 are attracted again, so that the cover plate 2105 closes the storage box 2102 and at the same time, the storage box 2102 is separated from the closing frame 2101 to complete the disassembly of the storage box 2102. In addition, the sealing plate 2111 will also re-close the opening at the bottom of the closing frame 2101 due to the elastic force of the compression spring 2112 and the auxiliary frame 2110, thereby ensuring that the storage box 2102 and the closing frame 2101 will not be contaminated by external impurities during the disassembly process of the storage box 2102.

[0040] Example 2: Please refer to Figure 2 , Figure 5 , Figure 6 , Figure 7 and Figure 8 The present invention provides a technical solution: a semiconductor deposition device that is convenient for taking out semiconductors. The present invention makes corresponding improvements to the technical problems mentioned in the background technology. The closing mechanism 2 also includes an automatic material picking unit 22, which is arranged inside the closing clamping unit 21. The automatic material picking unit 22 is used for automatic material picking and automatic material discharge of semiconductors.

[0041] As a further limitation of the sealing mechanism 2 of the present invention, the automatic material taking unit 22 includes a material taking rack 2201, which is slidably connected to the inside of one of the sealing racks 2114, and the right side of the material taking rack 2201 is fixedly connected to a clamping rack 2202, and the clamping rack 2202 is located inside one of the sealing racks 2101. The right side of the clamping rack 2202 is fixedly connected to two clamping plates 2203, and the side surfaces of the two clamping plates 2203 close to each other are fixedly connected to a first rubber plate 2204, and the insides of the two first rubber plates 2204 are fixedly connected to two connecting springs 2205, and the other end of each connecting spring 2205 is fixedly connected to the inner wall of the clamping plate 2203, and the front side of the deposition equipment body 12 is fixed. The limiting frame 2206 is connected, the front sides of the two sealing frames 2114 are fixedly connected to the back side of the limiting frame 2206, the limiting frame 2206 is internally rotatably connected with a screw 2207, the outer surface of the screw 2207 is threadedly connected with a movable plate 2208, the movable plate 2208 is slidably connected to the inside of the limiting frame 2206, the back side of the movable plate 2208 is fixedly connected to the front side of the material taking frame 2201, the left side of the limiting frame 2206 is fixedly connected with a first servo motor 2209, the output end of the power of the first servo motor 2209 is fixedly connected to the left end of the screw 2207, the insides of the two storage boxes 2102 are slidably connected with storage frames 2210, and the inner walls of the two storage frames 2210 are fixedly connected with a plurality of positioning frames 22 11. A plurality of positioning frames 2211 are slidably connected to the inside of a clamping block 2212. The outer surface of each clamping block 2212 is fixedly connected to two return springs 2213. The other end of each return spring 2213 is fixedly connected to the inner wall of the positioning frame 2211. The inner wall of each clamping block 2212 is fixedly connected to a second rubber plate 2214. The inner wall of each second rubber plate 2214 is fixedly connected to a fixing spring 2215. The other end of each fixing spring 2215 is fixedly connected to the inner wall of the clamping block 2212. The inner walls of the two positioning frames 2211 are jointly clamped with a wafer 2216. The outer surfaces of the two second rubber plates 2214 are in contact with the outer surface of the wafer 2216. The deposition device A push frame 2217 is provided inside the body 12, and two return springs 2218 are fixedly connected to the upper surface of the push frame 2217, and the other ends of the two return springs 2218 are fixedly connected to the inner top wall of the material taking frame 2201. Two symmetrical guide plates 2219 are fixedly connected to the upper surface of the heating table 14, and guide grooves 2220 are provided on the side surfaces of the two guide plates 2219 close to each other. Guide plates 2221 are movably hinged inside the two guide plates 2219 through pins, and the bottom surfaces of the two guide plates 2221 are in contact with the upper surface of the heating table 14. Two symmetrical sliding columns 2222 are fixedly connected to the outer surface of the push frame 2217, and each sliding column 2222 is located inside the guide plate 2219.Two positioning springs 2223 are fixedly connected to the inner top wall of the deposition equipment body 12, and the bottom ends of the two positioning springs 2223 are fixedly connected to a toggle plate 2224. A groove for the toggle plate 2224 to pass through is provided on the upper surface of the material picking rack 2201. By setting the automatic material picking unit 22, the closed clamping unit 21 can be cooperated with to allow the wafer 2216 to complete the automatic material picking and unloading work in a relatively closed space, so that the wafer 2216 in the storage box 2102 is more convenient and quick to take and put. The wafer 2216 will not be contaminated by the outside world due to taking the wafer 2216, which effectively increases the convenience of semiconductor deposition equipment for taking and putting the wafer 2216, and further improves the overall efficiency of semiconductor wafer 2216 film sedimentation;

[0042] The two positioning springs 2223 are both provided with first telescopic rods 2225, the telescopic ends of the two first telescopic rods 2225 are both fixedly connected to the inner top wall of the deposition device body 12, and the bottom ends of the two first telescopic rods 2225 are both fixedly connected to the upper surface of the toggle plate 2224. The first telescopic rods 2225 can limit the telescopic direction of the positioning springs 2223, so that the positioning springs 2223 are not prone to excessive deviation when they are telescoped, thereby increasing the use accuracy of the positioning springs 2223;

[0043] A second telescopic rod 2226 is provided inside the two return springs 2218. The telescopic ends of the two second telescopic rods 2226 are fixedly connected to the inner top wall of the material picking rack 2201, and the bottom ends of the two second telescopic rods 2226 are fixedly connected to the bottom surface of the pushing rack 2217. The second telescopic rod 2226 can increase the rebound accuracy of the return spring 2218, so that the return spring 2218 can only be extended and retracted up and down, thereby improving the reliability of the use of the return spring 2218.

[0044] The specific implementation method of this embodiment is as follows: first, the first servo motor 2209 is started through an external control switch and power supply, and the power provided by the first servo motor 2209 is used in conjunction with the limit frame 2206 to drive the screw 2207 to rotate, and then the movable plate 2208 drives the material picking frame 2201 and the clamping frame 2202 to move to the right, until the clamping plate 2203 contacts the clamping block 2212 and pushes the clamping block 2212 to retract into the positioning frame 2211, forcing the return spring 2213 to retract. At this time, the fixed spring 2215 will also retract in conjunction with the elastic deformation of the second rubber plate 2214, and the second rubber plate 2214 will retract into the positioning frame 2211. At this time, the first rubber plate 2204 will replace the second rubber plate 221 4, and use the elastic force of the connecting spring 2205 to clamp the wafer 2216 from both sides of the wafer 2216, then the first servo motor 2209 rotates in the opposite direction, which can drive the wafer 2216 to move to the left and enter the deposition equipment body 12, and be located above the heating table 14. At this time, the right side of the toggle plate 2224 will contact the wafer 2216, forcing the wafer 2216 to separate from the first rubber plate 2204 and fall on the heating table 14 for thin film deposition processing, and then the first servo motor 2209 drives the material picking rack 2201 to move to the right again for the next material picking work, and the pushing rack 2217 will also move to the right with the material picking rack 2201 until the sliding column 2222 contacts the guide plate 2221, and use The inclination angle of the guide plate 2221 and the limit generated by the contact between the guide plate 2221 and the heating table 14 can force the sliding column 2222 to slide into the guide groove 2220 and allow the return spring 2218 to contract, so that the push frame 2217 moves upward by one end and breaks contact with the heating table 14, and the height of the push frame 2217 is higher than the wafer 2216 on the heating table 14 after the thin film deposition is completed. When the push frame 2217 moves upward, it will push the toggle plate 2224 to move upward and allow the positioning spring 2223 to contract, which can prevent the toggle plate 2224 from affecting the movement of the push frame 2217. When the push frame 2217 continues to slide to the right until the sliding column 2222 is disengaged from the guide groove 2220, due to the return spring 221 The elastic force of 8 will push the push frame 2217 to move downward, so that the sliding column 2222 is located in the groove below the guide plate 2219, and at this time, the clamping plate 2203 cooperates with the first rubber plate 2204 to complete the material removal of another wafer 2216. As the first servo motor 2209 reverses again, the push frame 2217 can push the processed wafer 2216 through the left sealing frame 2114 into the left closing frame 2101, and snap into the positioning frame 2211 on the left storage frame 2210, completing the unloading of the processed wafer 2216. During this process, the sliding column 2222 will slide in the groove below the guide plate 2219, and because the guide plate 2221 and the guide plate 2219 are hinged,Therefore, when the sliding column 2222 contacts the guide plate 2221, the guide plate 2221 rotates along the hinge point with the guide plate 2219, which will not affect the smooth movement of the sliding column 2222 to the left, so that the wafer 2216 can complete the automatic material collection and unloading work in a relatively closed space, making the wafer 2216 in the storage box 2102 more convenient and quick to take and put. The wafer 2216 will not be contaminated by the outside world due to taking the wafer 2216, which effectively increases the convenience of semiconductor deposition equipment for taking and putting the wafer 2216, and further improves the overall efficiency of semiconductor wafer 2216 film deposition.

[0045] Example 3: Please refer to Fig. 9 and Fig.10 The present invention provides a technical solution: a semiconductor deposition device that is convenient for semiconductor removal. The present invention makes corresponding improvements to the technical problems mentioned in the background technology. A feeding mechanism 3 is arranged under the closed clamping unit 21. The feeding mechanism 3 is used in conjunction with the closing mechanism 2. The feeding mechanism 3 is used to feed the semiconductor to be deposited into the automatic material removal unit 22.

[0046] As a further limitation of the feeding mechanism 3 of the present invention, the feeding mechanism 3 includes two positioning seats 301, the bottom surfaces of the two positioning seats 301 are fixedly connected to the upper surface of the bottom plate 11, the two storage boxes 2102 are clamped in the interior of the positioning seats 301, the interiors of the two positioning seats 301 are commonly rotatably connected with a rotating rod 302, a second servo motor 303 is arranged above the bottom plate 11, the output end of the second servo motor 303 is fixedly connected to the right end of the rotating rod 302, the outer surface of the rotating rod 302 is fixedly connected to two first bevel gears 304, the interiors of the two storage boxes 2102 are rotatably connected with threaded rods 305, the outer surfaces of the two threaded rods 305 are threadedly connected with connecting blocks 306, the two connecting blocks 306 are fixedly connected to the storage rack 2210, and the outer surfaces of the two threaded rods 305 are fixedly connected to the storage rack 2210. The two surfaces are fixedly connected with a rotating handle 307, and the two rotating handles 307 are both located below the storage box 2102. The bottom ends of the two threaded rods 305 are fixedly connected with a second bevel gear 308, and the two second bevel gears 308 are meshed with the first bevel gear 304. By setting the feeding mechanism 3, the wafer 2216 on the storage rack 2210 can be automatically lifted upward, so that the material rack 2201 can take out the wafer 2216 to be processed from the storage box 2102, or send the processed wafer 2216 from the heating table 14 to another storage box 2102 for collection and storage, so that the feeding and taking processes of the wafer 2216 in the deposition equipment body 12 have good automation effects, making the semiconductor deposition equipment more efficient and convenient for processing the wafer 2216;

[0047] The front and back sides of the two storage racks 2210 are fixedly connected with auxiliary blocks 309, and the inner walls of the two storage boxes 2102 are provided with sliding grooves 310. The two auxiliary blocks 309 are slidably connected inside the sliding grooves 310. The auxiliary blocks 309 slide inside the sliding grooves 310, which can increase the stability of the storage racks 2210 when they move up and down, so that the storage racks 2210 are not prone to excessive shaking when they move up and down.

[0048] The outer surface of the rotating rod 302 is rotatably connected to two stabilizing frames 311, and the bottom surfaces of the two stabilizing frames 311 are fixedly connected to the upper surface of the bottom plate 11. The stabilizing frames 311 can reduce the rotation swing of the rotating rod 302 without affecting the rotation of the rotating rod 302, so that the rotating rod 302 is more stable and reliable when rotating;

[0049] The bottom surface of the deposition device body 12 is fixedly connected to two support seats 312 , and the bottom surfaces of the two support seats 312 are fixedly connected to the upper surface of the base plate 11 . The support seats 312 can support and fix the position of the deposition device body 12 , thereby increasing the firmness of the deposition device body 12 .

[0050] The specific implementation method of this embodiment is as follows: first, the second servo motor 303 is started by an external control switch and power supply. When the storage box 2102 and the fixing frame 2103 are inserted into the closed frame 2101, the bottom of the storage box 2102 will also be inserted into the positioning seat 301. At the same time, the first bevel gear 304 and the second bevel gear 308 will mesh with each other. At this time, the second servo motor 303 uses the rotating rod 302 to drive the first bevel gear 304 to rotate and cooperate with the second bevel gear 308 to drive the threaded rod 305 to rotate, so that the threaded rod 305 cooperates with the connecting block 306 to allow the storage rack 2210 to move upward a distance and be inserted into the closed frame 2101. Since the storage rack 2210 is inserted into the closed frame 2101, it can not only be moved in The gap between the storage box 2102 and the closed frame 2101 is closed in one step, and the position between the storage box 2102 and the closed frame 2101 is positioned to prevent the storage box 2102 from being loosened after being stuck in the closed frame 2101. At the same time, the top positioning frame 2211 of the storage frame 2210 can be located at the material picking position of the material picking frame 2201, which is convenient for the subsequent material picking work of the top wafer 2216. Since the servo motor can convert the voltage signal into torque and speed to drive the control object, the rotor speed of the servo motor is controlled by the input signal and can respond quickly. In the automatic control system, it is used as an actuator and has the characteristics of small electromechanical time constant and high linearity, and can convert the received electrical signal into electric The angular displacement or angular velocity output on the machine shaft, and then, when the material picking rack 2201 completes a material picking and discharges the processed wafer 2216, during the return process of the material picking rack 2201, that is, when the material picking rack 2201 is not in contact with the storage boxes 2102 on the left and right sides, the second servo motor 303 will again cooperate with the first bevel gear 304 and the second bevel gear 308 through the rotating rod 302 to rotate the threaded rod 305 to make the connecting block 306 drive the storage rack 2210 to move a short distance upward in the storage box 2102, so that the wafer 2216 on the other set of positioning racks 2211 is located at the material picking position of the material picking rack 2201, until all wafers 2216 are processed, at this time the storage rack 2210 Most of them are inserted upward into the closed rack 2101. Finally, the storage rack 2210 can be moved downward again into the storage box 2102 by simply reversing the second servo motor 303, so that the semiconductor sedimentation equipment can automatically lift up the wafer 2216 on the storage rack 2210, making it easier for the material removal rack 2201 to take out the wafer 2216 to be processed from the storage box 2102, or to send the processed wafer 2216 from the heating table 14 to another storage box 2102 for collection and storage, so that the feeding and retrieval processes of the wafer 2216 inside the deposition equipment body 12 have good automation effects, making the semiconductor deposition equipment more efficient and convenient in processing the wafer 2216.

[0051] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0052] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor deposition device for facilitating semiconductor removal, comprising a deposition mechanism (1), characterized in that: The deposition mechanism (1) comprises a bottom plate (11), a deposition device body (12) is arranged above the bottom plate (11), an air inlet pipe (13) is fixedly connected to the upper surface of the deposition device body (12), a heating platform (14) is fixedly connected to the inner bottom wall of the deposition device body (12), and a sealing mechanism (2) is arranged above the bottom plate (11); The sealing mechanism (2) comprises a sealing clamping unit (21), the sealing clamping unit (21) being arranged above the bottom plate (11), and the sealing clamping unit (21) being used to prevent external impurities from contaminating the semiconductor; The closing mechanism (2) further comprises an automatic material taking unit (22), the automatic material taking unit (22) being arranged inside the closing clamping unit (21), the automatic material taking unit (22) being used for automatic material taking and automatic material discharge of semiconductors; A feeding mechanism (3) is provided below the closed clamping unit (21), the feeding mechanism (3) being used in conjunction with the closing mechanism (2), and the feeding mechanism (3) being used to feed the semiconductor to be deposited into the automatic material taking unit (22); The closed snap-in unit (21) comprises two closed frames (2101), the two closed frames (2101) are respectively arranged on both sides of the deposition device body (12), a storage box (2102) is arranged below the two closed frames (2101), the upper surfaces of the two storage boxes (2102) are fixedly connected to a fixing frame (2103), the two fixing frames (2103) are snap-connected to the inside of the closed frames (2101), and the insides of the two fixing frames (2103) are slidably connected to two sliding The sliding frames (2104) are fixedly connected to a cover plate (2105) on one side of each group of sliding frames (2104) close to each other. The number of sliding frames (2104) in each group is two. The upper surfaces of the two cover plates (2105) are fixedly connected to a first permanent magnet (2106). The front surfaces of the two closed frames (2101) are fixedly connected to a second permanent magnet (2107). The front surfaces of the two second permanent magnets (2107) are attracted to the back surfaces of the first permanent magnet (2106) by magnetic force. The back of the sliding frame (2104) is fixedly connected to a third permanent magnet (2109), each of the third permanent magnets (2109) is slidably connected to the inside of the fixed frame (2103), the inner walls of the two fixed frames (2103) are fixedly connected to two fourth permanent magnets (2108), the backs of the two closed frames (2101) are fixedly connected to auxiliary frames (2110), the insides of the two auxiliary frames (2110) are slidably connected to sealing plates (2111), and the two sealing plates (2111) are fixedly connected to the inner walls of the two fixed frames (2103). Both are slidably connected to the inside of the closed frame (2101), the back sides of the two sealing plates (2111) are fixedly connected to two compression springs (2112), the other end of each compression spring (2112) is fixedly connected to the inner wall of the auxiliary frame (2110), the outer surface of the deposition device body (12) is fixedly connected to two symmetrical sealing frames (2114), and the other side surfaces of the two sealing frames (2114) are fixedly connected to a side surface of the closed frame (2101) close to the deposition device body (12).

2. The semiconductor deposition device for facilitating semiconductor removal according to claim 1, characterized in that: The upper surfaces of the two auxiliary frames (2110) are both fixedly connected with reinforcing ribs (2113), and the front surfaces of the two reinforcing ribs (2113) are both fixedly connected to the back surface of the closed frame (2101).

3. The semiconductor deposition device for facilitating semiconductor removal according to claim 1, characterized in that: The automatic material taking unit (22) comprises a material taking frame (2201), wherein the material taking frame (2201) is slidably connected to the inside of one of the sealing frames (2114), and a clamping frame (2202) is fixedly connected to the right side of the material taking frame (2201), and the clamping frame (2202) is located inside one of the sealing frames (2101), and two clamping plates (2203) are fixedly connected to the right side of the clamping frame (2202), and the side surfaces of the two clamping plates (2203) close to each other are fixedly connected to a first rubber plate (2204), and the insides of the two first rubber plates (2204) are fixedly connected to two connecting springs (2205), and the other end of each connecting spring (2205) is connected to the clamping plate (2 The front side of the deposition device body (12) is fixedly connected to the limiting frame (2206), the front sides of the two sealing frames (2114) are fixedly connected to the back side of the limiting frame (2206), the inside of the limiting frame (2206) is rotatably connected to a screw rod (2207), the outer surface of the screw rod (2207) is threadedly connected to a movable plate (2208), the movable plate (2208) is slidably connected to the inside of the limiting frame (2206), the back side of the movable plate (2208) is fixedly connected to the front side of the material taking frame (2201), the left side of the limiting frame (2206) is fixedly connected to a first servo motor (2209), the output end of the power of the first servo motor (2209) is connected to the screw rod (2207), and the output end of the power of the first servo motor (2209) is connected to the screw rod (2207). The left end of the rod (2207) is fixedly connected, the interiors of the two storage boxes (2102) are slidably connected with storage racks (2210), the inner walls of the two storage racks (2210) are fixedly connected with a plurality of positioning racks (2211), the interiors of the plurality of positioning racks (2211) are slidably connected with clamping blocks (2212), the outer surface of each clamping block (2212) is fixedly connected with two return springs (2213), the other end of each return spring (2213) is fixedly connected to the inner wall of the positioning rack (2211), the inner wall of each clamping block (2212) is fixedly connected with a second rubber plate (2214), and the inner wall of each second rubber plate (2214) is fixedly connected with a fixing spring (2215), the other end of each of the fixed springs (2215) is fixedly connected to the inner wall of the clamping block (2212), wherein the inner walls of the two positioning frames (2211) are jointly clamped with a wafer (2216), wherein the outer surfaces of the two second rubber plates (2214) are in contact with the outer surface of the wafer (2216), a pushing frame (2217) is arranged inside the deposition equipment body (12), the upper surface of the pushing frame (2217) is fixedly connected to two return springs (2218), the other ends of the two return springs (2218) are fixedly connected to the inner top wall of the material taking frame (2201), and the upper surface of the heating platform (14) is fixedly connected to two symmetrical guide plates (2219),A guide groove (2220) is provided on the side of the two guide plates (2219) that are close to each other. A guide plate (2221) is movably hinged inside the two guide plates (2219) through a pin shaft. The bottom surfaces of the two guide plates (2221) are in contact with the upper surface of the heating platform (14). Two symmetrical sliding columns (2222) are fixedly connected to the outer surface of the pushing frame (2217). Each sliding column (2222) is located inside the guide plate (2219). Two positioning springs (2223) are fixedly connected to the inner top wall of the deposition device body (12). The bottom ends of the two positioning springs (2223) are fixedly connected to a toggle plate (2224). A groove for the toggle plate (2224) to pass through is provided on the upper surface of the material taking frame (2201).

4. The semiconductor deposition device for facilitating semiconductor removal according to claim 3, characterized in that: A first telescopic rod (2225) is provided inside each of the two positioning springs (2223); the telescopic ends of the two first telescopic rods (2225) are fixedly connected to the inner top wall of the deposition device body (12); and the bottom ends of the two first telescopic rods (2225) are fixedly connected to the upper surface of the toggle plate (2224).

5. The semiconductor deposition device for facilitating semiconductor removal according to claim 3, characterized in that: The two return springs (2218) are each provided with a second telescopic rod (2226), the telescopic ends of the two second telescopic rods (2226) are each fixedly connected to the inner top wall of the material taking frame (2201), and the bottom ends of the two second telescopic rods (2226) are each fixedly connected to the bottom surface of the pushing frame (2217).

6. The semiconductor deposition device for facilitating semiconductor removal according to claim 3, characterized in that: The feeding mechanism (3) comprises two positioning seats (301), the bottom surfaces of the two positioning seats (301) are fixedly connected to the upper surface of the bottom plate (11), the two storage boxes (2102) are clamped inside the positioning seats (301), the insides of the two positioning seats (301) are connected to a rotating rod (302) for common rotation, a second servo motor (303) is arranged above the bottom plate (11), the output end of the second servo motor (303) is fixedly connected to the right end of the rotating rod (302), the outer surface of the rotating rod (302) is fixedly connected to two first bevel gears (304), and the two The storage box (2102) is rotatably connected to a threaded rod (305) inside, the outer surfaces of the two threaded rods (305) are threadedly connected to a connecting block (306), the two connecting blocks (306) are fixedly connected to the storage rack (2210), the outer surfaces of the two threaded rods (305) are fixedly connected to a rotating handle (307), the two rotating handles (307) are located below the storage box (2102), the bottom ends of the two threaded rods (305) are fixedly connected to a second bevel gear (308), and the two second bevel gears (308) are meshingly connected to the first bevel gear (304).

7. The semiconductor deposition device for facilitating semiconductor removal according to claim 3, characterized in that: Auxiliary blocks (309) are fixedly connected to the front and back sides of the two storage racks (2210), and sliding grooves (310) are provided on the inner walls of the two storage boxes (2102), and the two auxiliary blocks (309) are slidably connected inside the sliding grooves (310).

8. The semiconductor deposition device for facilitating semiconductor removal according to claim 6, characterized in that: The outer surface of the rotating rod (302) is rotatably connected to two stabilizing frames (311), and the bottom surfaces of the two stabilizing frames (311) are fixedly connected to the upper surface of the bottom plate (11).

9. The semiconductor deposition device for facilitating semiconductor removal according to claim 1, characterized in that: Two support seats (312) are fixedly connected to the bottom surface of the deposition equipment body (12), and the bottom surfaces of the two support seats (312) are fixedly connected to the upper surface of the bottom plate (11).

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