Wafer defect detection device and method

Abstract

The present invention discloses a wafer defect detection device and method, belonging to the field of wafer detection. A wafer defect detection device includes a device box, and also includes: a top plate, fixedly connected to the upper end of the device box, wherein a main detection head is fixedly installed at the lower end of the top plate, and auxiliary detection heads located on both sides of the main detection head are installed at the lower end of the top plate, and the auxiliary detection heads are not parallel to the main detection head; a detection table rotatably installed on the device box, wherein the main detection head is perpendicular to the upper end of the detection table, and a driving part for driving the detection table to rotate is provided in the device box; the present invention can significantly improve the accuracy of wafer detection and ensure the final quality of the wafer.

Description

Technical Field

[0001] The present invention relates to the field of wafer detection technology, and in particular to a wafer defect detection device and method. Background Art

[0002] Semiconductor wafers are one of the important basic materials for semiconductor device manufacturing. They are disc-shaped sheets made of high-purity semiconductor materials. They play a basic role in carrying and growing crystals in the industry. During production, materials guarantee the quality of semiconductor wafer production, and defect detection equipment is needed to perform defect detection on the production wafers.

[0003] In the prior art, when wafer defect detection equipment detects wafers, most of them place the wafers flat on the lower end of the optical detector, and then complete the irradiation detection work through the optical detector. This will make it difficult to detect defects such as small scratches on the wafer surface, which will cause some defective wafers to be unable to be accurately detected, affecting the quality of the wafers. Summary of the invention

[0004] The purpose of the present invention is to solve the problem in the prior art that wafer inspection accuracy is low and easily affects quality, and to propose a wafer defect inspection device and method.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A wafer defect detection device includes a device box and also includes: a top plate fixedly connected to the upper end of the device box, wherein a main detection head is fixedly installed at the lower end of the top plate, and auxiliary detection heads located on both sides of the main detection head are installed at the lower end of the top plate, and the auxiliary detection heads are not parallel to the main detection head; a detection table rotatably installed on the device box, wherein the main detection head is perpendicular to the upper end of the detection table, and a driving unit for driving the detection table to rotate is provided in the device box.

[0007] In order to drive the detection platform to rotate, preferably, the driving part includes a support column fixedly connected to the lower end of the detection platform, a sleeve is rotatably connected in the device box, and a plug rod is fixedly connected to the lower end of the support column, wherein the plug rod is longitudinally slidably connected in the sleeve, a motor is fixedly installed in the device box, a driving gear is fixedly installed on the output shaft of the motor, a driven gear meshing with the driving gear is fixedly installed on the outer wall of the sleeve, and a lifting part for driving the detection platform to move up and down is provided on the device box.

[0008] In order to drive the detection platform to move up and down, preferably, the lifting part includes a threaded rod rotatably connected to the upper end of the device box, a lifting block is threadedly connected to the threaded rod, and a lifting plate is fixedly connected to the lifting block, wherein the support column is rotatably connected to the lifting plate, and the threaded rod and the sleeve are connected by a chain drive.

[0009] In order to facilitate the adjustment of the deflection angle of the auxiliary detection head, preferably, a support is fixedly connected to the top plate, a rotating shaft is rotatably mounted on the support, the auxiliary detection head is fixedly mounted on the rotating shaft, and a deflection part for driving the rotating shaft to rotate is provided on the top plate.

[0010] In order to facilitate the rotation of the rotating shaft, preferably, the deflection part includes a main reel fixedly mounted on the rotating shaft, and an auxiliary reel fixedly mounted on the threaded rod, wherein a pull rope is fixedly wound on the outer wall of the main reel, the end of the pull rope is fixedly connected to the auxiliary reel, and a torsion spring is installed between the rotating shaft and the support.

[0011] In order to automatically adjust the position of the wafer, preferably, the detection platform is provided with a plurality of circumferentially distributed slide grooves, sliders are slidably installed in the plurality of slide grooves, rollers are rotatably installed on the plurality of sliders, and the detection platform is provided with a positioning portion for driving the plurality of sliders to approach the center of the detection platform.

[0012] In order to enable multiple sliders to move simultaneously in the axial direction of the detection platform, preferably, the positioning part includes a reciprocating screw rotatably connected to multiple slide grooves, one end of the reciprocating screw extends to the outer wall of the detection platform and is fixedly installed with a passive gear, wherein the slider is threadedly connected to the outer wall of the reciprocating screw, and an arc-shaped rack meshing with the passive gear is installed on the device box.

[0013] In order to allow the passive gear to maintain contact with the arc-shaped rack for a period of time, preferably, an annular seat is fixedly connected to the device box, a sliding column is fixedly connected to the annular seat, and an outer tube is longitudinally slidably installed on the sliding column; wherein, the arc-shaped rack is fixedly installed on the outer tube, a lifting spring is installed between the arc-shaped rack and the annular seat, and an arc-shaped groove corresponding to the arc-shaped rack is provided on the lifting plate.

[0014] In order to place the wafer firmly on the upper end surface of the testing table, a suction cup is fixedly installed in the middle of the upper end of the testing table, and a rubber seat surrounding the suction cup is fixedly connected to the testing table, wherein a telescopic airbag is installed between the slider and the inner wall of the slide groove, and a connecting tube extending into the suction cup is fixedly connected to the telescopic airbag.

[0015] A method for wafer defect detection device, the operating steps are as follows:

[0016] Step 1: Place the wafer on the test bench and make sure the wafer is in the center of the test bench;

[0017] Step 2: Perform defect detection on the wafer through the main inspection head and the tilted auxiliary inspection head;

[0018] Step 3: Make the inspection table drive the wafer to rotate to change the position between the wafer and the auxiliary inspection head;

[0019] Step 4: While the wafer is rotating, bring the wafer close to the main inspection head and the auxiliary inspection head;

[0020] Step 5: While the wafer is rotating, the auxiliary inspection head changes the irradiation inspection angle.

[0021] Compared with the prior art, the present invention provides a wafer defect detection device, which has the following beneficial effects:

[0022] 1. The wafer defect detection device makes the defects of the wafer more obvious through the tilted irradiation detection of the auxiliary detection head, thereby significantly improving the accuracy of wafer detection and ensuring the final quality of the wafer.

[0023] 2. The wafer defect detection device drives the detection table to rotate through a motor, and the detection table can drive the wafer to rotate, so that the auxiliary detection head can irradiate and detect the wafer at different angles, significantly improving the accuracy of wafer defect detection.

[0024] 3. The wafer defect detection device drives the detection platform to move upward through the threaded rod, and the detection platform will drive the wafer close to the main detection head and the auxiliary detection head, so that the main detection head and the auxiliary detection head can detect the defects of the wafer more accurately.

[0025] 4. The wafer defect detection device drives the auxiliary reel to rotate through the threaded rod. The main reel will rotate under the action of the auxiliary reel, and drive the auxiliary detection head to deflect the angle through the rotating shaft, so that the auxiliary detection head can perform defect detection on the wafer through different detection angles, so as to further improve the detection accuracy.

[0026] 5. The wafer defect detection device drives the passive gear to roll on the arc-shaped rack through the detection table, and multiple sliders drive multiple rollers to intermittently approach and move away from the four sides of the wafer, so that the wafer automatically moves to the middle of the detection table to improve the effect of wafer detection.

[0027] 6. The wafer defect detection device squeezes the retractable airbag through the slider, and the suction cup blows air to the bottom of the wafer through the upper port, so that an air wall will be generated at the bottom of the wafer. At this time, the friction between the wafer and the detection platform will be reduced, so when the roller pushes the wafer, the resistance of the wafer will be smaller, thereby reducing the wear of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic diagram of the first-view axonometric structure of a wafer defect detection device proposed by the present invention;

[0029] Figure 2 A schematic diagram of the isometric structure of a wafer defect detection device proposed by the present invention from a second viewing angle;

[0030] Figure 3 A schematic diagram of a partial isometric structure of a wafer defect detection device proposed by the present invention;

[0031] Figure 4 This is a schematic diagram of the isometric structure of a lifting plate of a wafer defect detection device proposed by the present invention;

[0032] Figure 5 This is a schematic diagram of the isometric structure of a detection platform of a wafer defect detection device proposed by the present invention;

[0033] Figure 6 A schematic diagram of the cross-sectional structure of a detection platform of a wafer defect detection device proposed by the present invention;

[0034] Figure 7 A schematic diagram of the isometric structure of an annular base of a wafer defect detection device proposed by the present invention;

[0035] Figure 8 This is a schematic structural diagram of a secondary inspection head of a wafer defect inspection device proposed by the present invention.

[0036] In the figure: 1. device box; 2. top plate; 3. main detection head; 4. auxiliary detection head; 5. detection table; 6. lifting plate; 7. support column; 8. plug rod; 9. sleeve; 10. motor; 11. driving gear; 12. driven gear; 13. threaded rod; 14. lifting block; 15. chain drive; 16. support; 17. rotating shaft; 18. main reel; 19. auxiliary reel; 20. pull rope; 21. slide groove; 22. reciprocating screw; 23. slider; 24. roller; 25. driven gear; 26. arc rack; 27. annular seat; 28. slide column; 29. ​​outer tube; 30. lifting spring; 31. suction cup; 32. telescopic airbag; 33. connecting pipe; 34. rubber seat; 35. arc groove. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0038] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0039] Embodiment 1:

[0040] Reference Figure 1-Figure 8 A wafer defect detection device includes a device box 1, and also includes: a top plate 2, which is fixedly connected to the upper end of the device box 1, wherein a main detection head 3 is fixedly installed at the lower end of the top plate 2, and auxiliary detection heads 4 located on both sides of the main detection head 3 are installed at the lower end of the top plate 2, the auxiliary detection heads 4 are not parallel to the main detection head 3, and both the auxiliary detection heads 4 and the main detection heads 3 use detection lights in optical detectors in the prior art; a detection table 5 rotatably installed on the device box 1, wherein the main detection head 3 is perpendicular to the upper end of the detection table 5, and the auxiliary detection head 4 can tilt to detect the wafer on the detection table 5, and a driving unit for driving the detection table 5 to rotate is provided in the device box 1.

[0041] When in use, the wafer is placed on the inspection table 5, and then the main inspection head 3 and the auxiliary inspection head 4 are started to inspect the surface of the wafer. Since the auxiliary inspection head 4 is inclined to the main inspection head 3, the auxiliary inspection head 4 will also be inclined to illuminate the wafer for inspection. The inclined illumination inspection will make the defects of the wafer more obvious, thereby significantly improving the accuracy of wafer inspection and ensuring the final quality of the wafer. During the inspection process, the driving unit can drive the inspection table 5 to rotate, and the inspection table 5 can drive the wafer to rotate, so that the auxiliary inspection head 4 can illuminate the wafer at different angles for inspection, thereby significantly improving the accuracy of wafer defect detection.

[0042] Embodiment 2:

[0043] Reference Figure 1-Figure 5 , which is basically the same as the first embodiment, and further discloses a specific implementation scheme of the driving unit.

[0044] The driving part in the wafer defect detection device includes a support column 7 fixedly connected to the lower end of the detection platform 5, a sleeve 9 is rotatably connected in the device box 1, and a plug rod 8 is fixedly connected to the lower end of the support column 7, wherein the plug rod 8 is longitudinally slidably connected in the sleeve 9, a motor 10 is fixedly installed in the device box 1, a driving gear 11 is fixedly installed on the output shaft of the motor 10, a driven gear 12 meshing with the driving gear 11 is fixedly installed on the outer wall of the sleeve 9, and a lifting part for driving the detection platform 5 to move up and down is provided on the device box 1.

[0045] During the detection process, the motor 10 is started, and the motor 10 will drive the driven gear 12 to rotate through the driving gear 11. The driven gear 12 will drive the insertion rod 8 to rotate through the sleeve 9. The insertion rod 8 will drive the detection table 5 to rotate through the support column 7. The detection table 5 can drive the wafer to rotate, so that the auxiliary detection head 4 can irradiate and detect the wafer at different angles, which significantly improves the accuracy of wafer defect detection. During the rotation of the sleeve 9, the sleeve 9 will drive the detection table 5 to move upward through the lifting part, and the detection table 5 will drive the wafer to approach the main detection head 3 and the auxiliary detection head 4, so that the main detection head 3 and the auxiliary detection head 4 can more accurately detect wafer defects.

[0046] Embodiment three:

[0047] Reference Figure 1-Figure 4 , which is basically the same as the second embodiment, and further discloses a specific implementation scheme of the lifting part.

[0048] The above-mentioned lifting part includes a threaded rod 13 rotatably connected to the upper end of the device box 1, a lifting block 14 is threadedly connected to the threaded rod 13, and a lifting plate 6 is fixedly connected to the lifting block 14, wherein the support column 7 is rotatably connected to the lifting plate 6, and the threaded rod 13 and the sleeve 9 are connected by a chain drive 15.

[0049] During the rotation of the sleeve 9, the sleeve 9 will drive the threaded rod 13 to rotate through the chain drive 15, and the threaded rod 13 will drive the lifting plate 6 to move upward through the lifting block 14, and the lifting plate 6 will drive the detection table 5 to move upward, and the detection table 5 will drive the wafer to approach the main detection head 3 and the auxiliary detection head 4, so that the main detection head 3 and the auxiliary detection head 4 can more accurately detect the defects of the wafer; in order to improve the detection effect, the motor 10 can be rotated intermittently, and the detection is completed each time the motor 10 stops, so as to prevent the moving wafer from affecting the detection result.

[0050] Embodiment 4:

[0051] Reference Figure 1-Figure 3 as well as Figure 8 , which is basically the same as the third embodiment, and further, a specific implementation scheme for adjusting the deflection angle of the auxiliary detection head 4 is specifically added.

[0052] The above-mentioned top plate 2 is fixedly connected to a support 16, a rotating shaft 17 is rotatably mounted on the support 16, the auxiliary detection head 4 is fixedly mounted on the rotating shaft 17, and a deflection part for driving the rotating shaft 17 to rotate is provided on the top plate 2, the deflection part includes a main reel 18 fixedly mounted on the rotating shaft 17, and an auxiliary reel 19 is fixedly mounted on the threaded rod 13, wherein a pull rope 20 is fixedly wound on the outer wall of the main reel 18, and the end of the pull rope 20 is fixedly connected to the auxiliary reel 19, and a torsion spring is installed between the rotating shaft 17 and the support 16.

[0053] When the threaded rod 13 rotates, the threaded rod 13 will also drive the auxiliary reel 19 to rotate, and the auxiliary reel 19 will wind the pull rope 20. The main reel 18 will rotate under the action of the auxiliary reel 19, and drive the auxiliary inspection head 4 to deflect at an angle through the rotating shaft 17, so that the auxiliary inspection head 4 can perform defect detection on the wafer through different detection angles, so as to further improve the detection accuracy. When the threaded rod 13 reverses, the torsion spring will also drive the rotating shaft 17 to reverse, and the rotating shaft 17 will drive the main reel 18 to reverse, so that the auxiliary inspection head 4 can be adjusted and reset in the reverse direction.

[0054] Embodiment five:

[0055] Reference Figure 1-Figure 7 , which is basically the same as the fourth embodiment, and further, a specific implementation plan for automatically positioning the wafer is specifically added.

[0056] The above-mentioned detection platform 5 is provided with multiple circumferentially distributed slide grooves 21, the number of the slide grooves 21 is 3-8, and the preferred number in this application is 3. Slide blocks 23 are slidably installed in the multiple slide grooves 21, and rollers 24 are rotatably installed on the multiple sliders 23. The rollers 24 are perpendicular to the upper end surface of the detection platform 5. The detection platform 5 is provided with a positioning part for driving the multiple sliders 23 to approach the center of the detection platform 5. The positioning part includes a reciprocating screw 22 rotatably connected to the multiple slide grooves 21, one end of the reciprocating screw 22 extends to the outer wall of the detection platform 5 and is fixedly installed with a passive gear 25, wherein the slider 23 is threadedly connected to the outer wall of the reciprocating screw 22, and an arc-shaped rack 26 meshing with the passive gear 25 is installed on the device box 1.

[0057] When the inspection table 5 rotates, the inspection table 5 drives the passive gear 25 to roll on the arc rack 26, and the passive gear 25 drives the reciprocating screw 22 to rotate, and the reciprocating screw 22 drives the slider 23 to slide back and forth in the slide groove 21, and the multiple sliders 23 drive the multiple rollers 24 to intermittently approach and move away from the periphery of the wafer, so that the wafer automatically moves to the middle of the inspection table 5, so as to improve the effect of wafer detection.

[0058] An annular seat 27 is fixedly connected to the above-mentioned device box 1, a sliding column 28 is fixedly connected to the annular seat 27, and an outer tube 29 is longitudinally slidably installed on the sliding column 28; wherein, the arc-shaped rack 26 is fixedly installed on the outer tube 29, a lifting spring 30 is installed between the arc-shaped rack 26 and the annular seat 27, and an arc-shaped groove 35 corresponding to the arc-shaped rack 26 is provided on the lifting plate 6.

[0059] When the lifting plate 6 is lifted upward, the passive gear 25 will move in the direction away from the arc-shaped rack 26. At this time, the lifting spring 30 will lift the arc-shaped rack 26 upward, and the arc-shaped rack 26 and the passive gear 25 will remain for a period of time to ensure that the arc-shaped rack 26 can make the roller 24 move back and forth once. After the passive gear 25 is separated from the arc-shaped rack 26, the roller 24 is away from the periphery of the wafer.

[0060] A suction cup 31 is fixedly installed in the middle of the upper end of the above-mentioned testing platform 5, and a rubber seat 34 surrounding the suction cup 31 is fixedly connected to the testing platform 5, wherein a telescopic airbag 32 is installed between the slider 23 and the inner wall of the slide groove 21, and a connecting tube 33 extending into the suction cup 31 is fixedly connected to the telescopic airbag 32.

[0061] When the slider 23 moves toward the center of the inspection table 5, the slider 23 will squeeze the telescopic airbag 32, and the telescopic airbag 32 will release air to the suction cup 31 through the connecting tube 33, and the suction cup 31 will blow air to the bottom of the wafer through the upper port, so that an air wall will be generated at the bottom of the wafer. At this time, the friction between the wafer and the inspection table 5 will be reduced, so when the roller 24 pushes the wafer, the resistance of the wafer will be smaller, thereby reducing the wear of the wafer. When the slider 23 is reset, the telescopic airbag 32 will suck air to the suction cup 31 through the connecting tube 33, and the suction cup 31 will suck the wafer through the rubber seat 34, so that the wafer stays on the inspection table 5 more firmly, avoiding the rotating inspection table 5 from causing the wafer to shift in position, thereby ensuring the accuracy of wafer defect detection.

[0062] A method for wafer defect detection device, the operating steps are as follows:

[0063] Step 1: Place the wafer on the testing platform 5 and place the wafer in the middle of the testing platform 5;

[0064] Step 2: Perform defect detection on the wafer through the main detection head 3 and the tilted auxiliary detection head 4;

[0065] Step 3: Make the inspection table 5 drive the wafer to rotate to change the position between the wafer and the auxiliary inspection head 4;

[0066] Step 4: While the wafer is rotating, the wafer is brought close to the main inspection head 3 and the auxiliary inspection head 4;

[0067] Step 5: While the wafer is rotating, the auxiliary inspection head 4 changes the irradiation inspection angle.

[0068] When the wafer defect detection device is used, the wafer is placed on the detection table 5, and then the main detection head 3 and the auxiliary detection head 4 are started to detect the surface of the wafer. Since the auxiliary detection head 4 is inclined to the main detection head 3, the auxiliary detection head 4 will also be inclined to illuminate and detect the wafer. The inclined illumination detection will make the defects of the wafer more obvious, thereby significantly improving the accuracy of wafer detection and ensuring the final quality of the wafer.

[0069] During the detection process, the motor 10 is started, and the motor 10 will drive the driven gear 12 to rotate through the driving gear 11. The driven gear 12 will drive the insertion rod 8 to rotate through the sleeve 9. The insertion rod 8 will drive the detection table 5 to rotate through the support column 7. The detection table 5 can drive the wafer to rotate, so that the auxiliary detection head 4 can irradiate and detect the wafer at different angles, significantly improving the accuracy of wafer defect detection.

[0070] During the rotation of the sleeve 9, the sleeve 9 will drive the threaded rod 13 to rotate through the chain drive 15, and the threaded rod 13 will drive the lifting plate 6 to move upward through the lifting block 14, and the lifting plate 6 will drive the detection table 5 to move upward, and the detection table 5 will drive the wafer to approach the main detection head 3 and the auxiliary detection head 4, so that the main detection head 3 and the auxiliary detection head 4 can more accurately detect the defects of the wafer; in order to improve the detection effect, the motor 10 can be rotated intermittently, and the detection is completed each time the motor 10 stops, so as to prevent the moving wafer from affecting the detection result.

[0071] When the threaded rod 13 rotates, the threaded rod 13 will also drive the auxiliary reel 19 to rotate, and the auxiliary reel 19 will wind the pull rope 20. The main reel 18 will rotate under the action of the auxiliary reel 19, and drive the auxiliary inspection head 4 to deflect the angle through the rotating shaft 17, so that the auxiliary inspection head 4 can perform defect detection on the wafer through different detection angles, so as to further improve the detection accuracy.

[0072] When the detection table 5 rotates, the detection table 5 will drive the passive gear 25 to roll on the arc rack 26, and the passive gear 25 will drive the reciprocating screw 22 to rotate. The reciprocating screw 22 will drive the slider 23 to slide back and forth in the slide groove 21, and the multiple sliders 23 will drive the multiple rollers 24 to intermittently approach and move away from the four sides of the wafer, so that the wafer is automatically moved to the middle of the detection table 5 to improve the effect of wafer detection.

[0073] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and inventive concepts of the present invention within the technical scope disclosed by the present invention, and they should be covered by the protection scope of the present invention.

Claims

1. A wafer defect detection device, comprising a device box (1), characterized in that: Also includes: A top plate (2) is fixedly connected to the upper end of the device box (1). Wherein, a main detection head (3) is fixedly mounted on the lower end of the top plate (2), and auxiliary detection heads (4) located on both sides of the main detection head (3) are mounted on the lower end of the top plate (2), and the auxiliary detection heads (4) are not parallel to the main detection head (3); Rotate the detection table (5) mounted on the device box (1), The main detection head (3) is perpendicular to the upper end of the detection platform (5), and a driving unit for driving the detection platform (5) to rotate is provided in the device box (1); The driving part comprises a support column (7) fixedly connected to the lower end of the detection platform (5), a sleeve (9) is rotatably connected in the device box (1), and a plug rod (8) is fixedly connected to the lower end of the support column (7). The insertion rod (8) is longitudinally slidably connected in the sleeve (9), a motor (10) is fixedly installed in the device box (1), a driving gear (11) is fixedly installed on the output shaft of the motor (10), a driven gear (12) meshingly connected with the driving gear (11) is fixedly installed on the outer wall of the sleeve (9), and a lifting part for driving the detection platform (5) to move up and down is provided on the device box (1); The lifting part comprises a threaded rod (13) rotatably connected to the upper end of the device box (1), a lifting block (14) being threadedly connected to the threaded rod (13), and a lifting plate (6) being fixedly connected to the lifting block (14). The support column (7) is rotatably connected to the lifting plate (6), and the threaded rod (13) and the sleeve (9) are connected via a chain drive (15); The detection platform (5) is provided with a plurality of circumferentially distributed slide grooves (21), a plurality of slide blocks (23) are slidably mounted in the plurality of slide grooves (21), a plurality of rollers (24) are rotatably mounted on the plurality of slide blocks (23), and a positioning portion is provided on the detection platform (5) for driving the plurality of slide blocks (23) to approach the center of the detection platform (5); A suction cup (31) is fixedly mounted in the middle of the upper end of the detection platform (5), and a rubber seat (34) surrounding the suction cup (31) is fixedly connected to the detection platform (5). A telescopic airbag (32) is installed between the sliding block (23) and the inner wall of the sliding groove (21), and a connecting pipe (33) extending into the suction cup (31) is fixedly connected to the telescopic airbag (32).

2. A wafer defect detection device according to claim 1, characterized in that: The top plate (2) is fixedly connected to a support (16), a rotating shaft (17) is rotatably mounted on the support (16), the auxiliary detection head (4) is fixedly mounted on the rotating shaft (17), and a deflection portion for driving the rotating shaft (17) to rotate is provided on the top plate (2).

3. A wafer defect detection device according to claim 2, characterized in that: The deflection unit comprises a main reel (18) fixedly mounted on a rotating shaft (17), and an auxiliary reel (19) fixedly mounted on the threaded rod (13). A pull rope (20) is fixedly wound on the outer wall of the main reel (18), the end of the pull rope (20) is fixedly connected to the auxiliary reel (19), and a torsion spring is installed between the rotating shaft (17) and the support (16).

4. The wafer defect detection device according to claim 1, characterized in that: The positioning portion comprises a reciprocating screw (22) rotatably connected to a plurality of slide grooves (21), one end of the reciprocating screw (22) extending to the outer wall of the detection platform (5) and fixedly mounted with a passive gear (25). The slider (23) is threadedly connected to the outer wall of the reciprocating screw (22), and an arc-shaped rack (26) meshingly connected to the passive gear (25) is installed on the device box (1).

5. The wafer defect detection device according to claim 4, characterized in that: An annular seat (27) is fixedly connected to the device box (1), a sliding column (28) is fixedly connected to the annular seat (27), and an outer tube (29) is longitudinally slidably mounted on the sliding column (28); The arc-shaped rack (26) is fixedly mounted on the outer tube (29), a lifting spring (30) is installed between the arc-shaped rack (26) and the annular seat (27), and an arc-shaped groove (35) corresponding to the arc-shaped rack (26) is provided on the lifting plate (6).

6. A method of a wafer defect detection device, comprising a wafer defect detection device according to any one of claims 1 to 5, characterized in that: The steps are as follows: Step 1: placing the wafer on the testing platform (5) and placing the wafer in the middle of the testing platform (5); Step 2: Perform defect detection on the wafer using the main detection head (3) and the tilted auxiliary detection head (4); Step 3: causing the inspection table (5) to drive the wafer to rotate, so as to change the position between the wafer and the auxiliary inspection head (4); Step 4: While the wafer is rotating, the wafer is brought close to the main inspection head (3) and the auxiliary inspection head (4); Step 5: While the wafer is rotating, the auxiliary inspection head (4) changes the irradiation inspection angle.

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