A pretreatment device for double-sided debonding of silicon wafers

Abstract

The present invention discloses a pretreatment device for double-sided degumming of silicon wafers, which relates to the technical field of silicon wafer degumming; in order to solve the efficiency problem; it specifically includes a conveyor belt arranged in an annular shape and a cleaning tank, a storage cylinder, and a drying box used in conjunction with the conveyor belt, wherein the cleaning tank, the storage cylinder, and the drying box are all arranged on the ground, and the discharge gap at the bottom of the storage cylinder is connected to the conveyor belt through a guide frame 1, and the feed port of the storage cylinder is connected to the conveyor belt through another guide frame 1, and the discharge gap and the feed port of the storage cylinder are respectively provided with a rotary material shifting component 2 and a rotary material shifting component 1, and the position of the conveyor belt between the cleaning tank and the drying box is provided with a grinding disc. On the one hand, the present invention can realize assembly line pretreatment by conveying through an annular conveyor belt, and cooperates with a cleaning tank, a drying box, a grinding disc, etc., and on the other hand, it can also be turned over to realize double-sided round treatment, thereby greatly increasing the pretreatment efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer degumming, and in particular to a pretreatment device for double-sided degumming of silicon wafers. Background Art

[0002] The main purpose of silicon wafer degumming pretreatment is to remove impurities such as metal powder, silicon powder, silicon carbide, cutting suspension, etc. attached to the surface of the silicon wafer during the cutting and grinding process, as well as to soften and remove the glue used to fix the silicon wafer to the crystal drag or glass plate, so that the surface of the silicon wafer reaches a certain degree of cleanliness to facilitate subsequent processing and use.

[0003] However, in the pretreatment process, simple immersion cleaning has a poor effect, so grinding and friction are also needed to completely remove impurities on the surface of the silicon wafer.

[0004] In the prior art, the pre-processing of silicon wafers has the following defects:

[0005] On the one hand, assembly line processing cannot be achieved, resulting in low pretreatment efficiency.

[0006] On the other hand, only one side can be processed at a time, and double-sided pre-processing cannot be achieved, which further reduces the pre-processing efficiency.

[0007] Therefore, in order to overcome the problem of low processing efficiency in the prior art, the present invention proposes a pretreatment device for double-sided debonding of silicon wafers. Summary of the invention

[0008] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a pretreatment device for double-sided debonding of silicon wafers.

[0009] In order to achieve the above object, the present invention adopts the following technical solutions:

[0010] A pretreatment device for double-sided debonding of silicon wafers, comprising a conveyor belt arranged in an annular shape and a cleaning pool, a storage cylinder and a drying box used in conjunction with the conveyor belt.

[0011] The cleaning tank, storage cylinder and drying box are all arranged on the ground, and the discharge gap at the bottom of the storage cylinder is connected to the conveyor belt through a guide frame 1, and the feeding port of the storage cylinder is connected to the conveyor belt through another guide frame 1, and the discharge gap and the feeding port of the storage cylinder are respectively provided with a rotary material shifting component 2 and a rotary material shifting component 1, a grinding disc is provided at a position of the conveyor belt between the cleaning tank and the drying box, and a turning portion is provided at a position of the conveyor belt located upstream of the rotary material shifting component 1.

[0012] Preferably: the flipping portion includes two sets of guide frames 2 fixed to the side walls of the conveyor belt and a top plate fixed to the top outer wall of the guide frame 2 by bolts, a flipping mechanism is arranged on the inner side of the guide frame 2, a multi-stage telescope is fixed to the top outer wall of the top plate by bolts, a suction cup assembly is fixed to the telescopic end of the multi-stage telescope by bolts, and the suction cup assembly is linked to the flipping mechanism through a linkage mechanism.

[0013] Furthermore: the flip mechanism includes a main shaft and a claw fixed to the inner end of the main shaft, the outer walls of the main shaft located on both sides of the guide frame 2 are rotatably connected with connecting rings, and the connecting rings are movably limited and matched with the guide frame 2 through a limiting wheel.

[0014] On the basis of the above scheme: a toothed disc is fixed on the outer wall of the main shaft, and teeth that can engage with the toothed disc are fixed on the inner wall of the concave part of the second guide frame.

[0015] A better solution in the above-mentioned solution is: the limiting wheel component includes a side limiting wheel, a surface limiting wheel and a wheel axle, the surface limiting wheel is rotatably connected to the outer side of the connecting ring through the wheel axle, and the surface limiting wheel rolls and fits on the surface of the guide frame 2, the side limiting wheel is fixed to the outer wall of the surface limiting wheel, and the side limiting wheel contacts and fits on the side of the guide frame 2.

[0016] As a further solution of the present invention: the linkage mechanism includes a fixed tooth plate, a movable tooth plate and a gear, the fixed tooth plate is fixed to the side wall of the conveyor belt by bolts, the side wall of the movable tooth plate is fixed with a synchronous frame by bolts, and the synchronous frame is fixed to the top outer wall of the suction cup assembly by bolts.

[0017] At the same time, the gear is meshed with the outer wall of the fixed tooth plate and the movable tooth plate on the opposite side, and the end of the gear is rotatably connected to the same connecting frame, and the connecting frame is movably sleeved on the outer wall of the main shaft.

[0018] As a preferred embodiment of the present invention: the suction cup assembly includes a base and a slide plate slidably connected to the inside of the base, the inner wall of the slide plate is provided with uniform through holes, a suction nozzle is fixed to the bottom outer wall of the slide plate at the through holes, a spring 1 is buckled on the top outer wall of the slide plate, the other end of the spring 1 is buckled on the inner wall of the base, and a one-way valve component and a release component are respectively provided on the top of the base.

[0019] At the same time, the one-way valve component includes a hollow frame and a plurality of fan-shaped films, the outer circumferences of the hollow frame and the fan-shaped films are fixed to the inner wall of the base, the fan-shaped films are fitted with the end faces of the hollow frame, and the plurality of fan-shaped films can form a complete circular plane structure.

[0020] As a better solution of the present invention: the release part includes a conical ring, a plug and a second spring. The conical ring is fixed to the top outer wall of the base and is connected to the inner cavity of the base. The plug is movably arranged inside the conical ring, and the plug and the conical ring are matched through an inclined surface. One end of the second spring is buckled to the bottom outer wall of the plug, and the other end of the second spring is buckled to the top outer wall of the base.

[0021] The beneficial effects of the present invention are:

[0022] 1. The present invention, on the one hand, can realize assembly line pretreatment through the conveyor belt arranged in an annular manner, and cooperate with the cleaning tank, drying box, grinding disc, etc., and on the other hand, it can also be turned over to realize double-sided round treatment, thereby greatly increasing the pretreatment efficiency.

[0023] 2. The present invention is provided with a linkage mechanism, which can, on the one hand, integrate the power of the lifting and lowering of the suction cup assembly with the lifting and lowering of the main shaft to reduce the power source layout, and on the other hand, can also make the lifting speed of the suction cup assembly greater than the lifting speed of the main shaft, thereby preventing interference between the silicon wafer and the suction cup assembly during the flipping process, thereby increasing reliability.

[0024] 3. The present invention, by configuring the suction cup assembly to cooperate with the base, the slide plate, the one-way valve component and the release component, can realize the generation of negative pressure by relying on the position, and the disappearance of negative pressure by relying on the rigid limitation of the claws, thereby realizing the fully automated clamping and releasing of the silicon wafer by the suction cup assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the overall structure of a pretreatment device for double-sided debonding of silicon wafers proposed by the present invention;

[0026] Figure 2 This is a schematic diagram of the overall structure of the flipping portion of a pretreatment device for double-sided debonding of silicon wafers proposed by the present invention;

[0027] Figure 3 A schematic diagram of the structure of a flipping mechanism of a pretreatment device for double-sided debonding of silicon wafers proposed by the present invention;

[0028] Figure 4 This is a schematic cross-sectional structure diagram of a limiting wheel component of a pretreatment device for double-sided debonding of silicon wafers proposed by the present invention;

[0029] Figure 5 A schematic diagram of the linkage structure of a pretreatment device for double-sided debonding of silicon wafers proposed by the present invention;

[0030] Figure 6 A schematic diagram of the structure of a suction cup assembly of a pretreatment device for double-sided debonding of silicon wafers proposed by the present invention;

[0031] Figure 7 This is a schematic diagram of the structure of a one-way valve component of a pretreatment device for double-sided debonding of silicon wafers proposed by the present invention;

[0032] Figure 8 The present invention provides a schematic diagram of the structure of a release member of a pretreatment device for double-sided debonding of silicon wafers.

[0033] In the figure: 100, conveyor belt; 200, cleaning tank; 300, guide frame 1; 400, storage cylinder; 500, rotary material shifting assembly 1; 600, rotary material shifting assembly 2; 700, drying box; 800, grinding disc; 1, top plate; 2, multi-stage telescopic device; 3, guide frame 2; 4, linkage mechanism; 5, flip mechanism; 6, suction cup assembly; 7, main shaft; 8, toothed disc; 9, limit wheel; 10, claw; 11, connecting ring ; 12. Teeth; 13. Side limit wheel; 14. Surface limit wheel; 15. Wheel axle; 16. Fixed tooth plate; 17. Connecting frame; 18. Movable tooth plate; 19. Gear; 20. Synchronous frame; 21. Base; 22. One-way valve member; 23. Through hole; 24. Spring 1; 25. Suction nozzle; 26. Slide plate; 27. Release member; 28. Hollow frame; 29. ​​Conical ring; 30. Plug; 31. Spring 2; 32. Fan-shaped film. DETAILED DESCRIPTION

[0034] The technical solution of the present invention is further described in detail below in conjunction with specific implementation methods.

[0035] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0036] Embodiment 1:

[0037] A pretreatment device for double-sided debonding of silicon wafers, such as Figure 1-Figure 8 As shown, it includes a conveyor belt 100 arranged in a ring shape and a cleaning tank 200, a storage cylinder 400 and a drying box 700 used in conjunction with the conveyor belt 100, the cleaning tank 200, the storage cylinder 400 and the drying box 700 are all arranged on the ground, and the discharge gap at the bottom of the storage cylinder 400 is connected to the conveyor belt 100 through a guide frame 300, the feeding port of the storage cylinder 400 is connected to the conveyor belt 100 through another guide frame 300, and the discharge gap and the feeding port of the storage cylinder 400 are respectively provided with a rotary material shifting assembly 2 600 and a rotary material shifting assembly 1 500, the conveyor belt 100 is provided with a grinding disc 800 at a position between the cleaning tank 200 and the drying box 700, and the conveyor belt 100 is provided with a turning portion at a position upstream of the rotary material shifting assembly 500.

[0038] When the device is in use, the silicon wafers can be stacked in the storage tube 400, and then the rotating material shifting component 2 600 uses the arc-shaped rotating arm to shift them one by one from the bottom to the conveyor belt 100, and the conveyor belt 100 transports the silicon wafers into the cleaning tank 200 for immersion and cleaning, and then continues to transport them to the grinding disc 800 for grinding, and then enters the drying box 700 for drying, and then after being turned over by the turning part, the rotating material shifting component 1 500 uses the arc-shaped rotating arm to shift the silicon wafers into the storage tube 400, and the silicon wafers are circulated and pre-treated again to complete the operation.

[0039] This device, on the one hand, can realize assembly line pretreatment through the conveyor belt 100 arranged in an annular manner, and cooperate with the cleaning tank 200, the drying box 700, the grinding disc 800, etc. On the other hand, it can also be turned over to realize double-sided round treatment, thereby greatly increasing the pretreatment efficiency.

[0040] In order to solve the flipping problem; Figure 2 As shown, the flipping portion includes two sets of guide frames 23 fixed to the side walls of the conveyor belt 100 and a top plate 1 fixed to the top outer wall of the guide frame 23 by bolts, a flipping mechanism 5 is arranged on the inner side of the guide frame 23, a multi-stage telescope 2 is fixed to the top outer wall of the top plate 1 by bolts, a suction cup assembly 6 is fixed to the telescopic end of the multi-stage telescope 2 by bolts, and the suction cup assembly 6 is linked to the flipping mechanism 5 by a linkage mechanism 4.

[0041] When the silicon wafer is carried to the bottom of the suction cup assembly 6, the multi-stage telescopic device 2 controls the suction cup assembly 6 to descend, absorbs and lifts the silicon wafer, and then the two sets of flipping mechanisms 5 limit the clamping of the side of the silicon wafer, the suction cup assembly 6 releases the clamp, and then the flipping mechanism 5 turns the silicon wafer over and releases the clamp, and the silicon wafer falls back on the top of the conveyor belt 100 for transportation.

[0042] The flipping mechanism 5 includes a main shaft 7 and a claw 10 fixed to the inner end of the main shaft 7. The outer walls of the main shaft 7 on both sides of the guide frame 2 3 are rotatably connected with connecting rings 11. The connecting rings 11 are movably limited and matched with the guide frame 2 3 through a limiting wheel 9. A toothed disc 8 is fixed to the outer wall of the main shaft 7, and teeth 12 that can engage with the toothed disc 8 are fixed to the inner wall of the concave part of the guide frame 2 3.

[0043] When the suction cup assembly 6 is lifted up so that the silicon wafer is at the height of the claw 10, the claw 10 also slides to the concave part of the guide frame 2 3, so that the claws 10 are guided and limited by the limiting wheel 9 so that the claws 10 are brought closer to each other to clamp the silicon wafer, and as the claws 10 continue to move upward, the toothed disc 8 engages with the teeth 12 to rotate the spindle 7, driving the silicon wafer to turn over. After turning over, the spindle 7 continues to move upward, the limiting wheel 9 disengages from the concave part of the guide frame 2 3, and the claws 10 move outward to loosen the clamp on the silicon wafer, and the silicon wafer falls back to the surface of the conveyor belt 100 to continue being conveyed.

[0044] The limiting wheel component 9 includes a side limiting wheel 13, a surface limiting wheel 14 and a wheel axle 15. The surface limiting wheel 14 is rotatably connected to the outer side of the connecting ring 11 through the wheel axle 15, and the surface limiting wheel 14 rolls and fits on the surface of the guide frame 2 3. The side limiting wheel 13 is fixed to the outer wall of the surface limiting wheel 14, and the side limiting wheel 13 contacts and fits on the side of the guide frame 2 3.

[0045] The surface limiting wheel 14 and the side limiting wheel 13 are respectively matched with mutually perpendicular planes of the guide frame 2 3 , thereby realizing the limiting of the entire main shaft 7 .

[0046] The linkage mechanism 4 includes a fixed tooth plate 16, a movable tooth plate 18 and a gear 19. The fixed tooth plate 16 is fixed to the side wall of the conveyor belt 100 by bolts. The side wall of the movable tooth plate 18 is fixed with a synchronous frame 20 by bolts. The synchronous frame 20 is fixed to the top outer wall of the suction cup assembly 6 by bolts. The gear 19 is meshed with the outer wall on the opposite side of the fixed tooth plate 16 and the movable tooth plate 18, and the end of the gear 19 is rotatably connected to the same connecting frame 17, and the connecting frame 17 is movably sleeved on the outer wall of the main shaft 7.

[0047] When the suction cup assembly 6 is raised or lowered, it can drive the synchronous frame 20 to rise or fall, thereby causing the movable tooth plate 18 to rise or fall, and then the gear 19 is raised or lowered through the meshing action of the movable tooth plate 18 and the fixed tooth plate 16, thereby driving the main shaft 7 to rise or fall through the connecting frame 17. At the same time, the lifting speed of the main shaft 7 is half of the lifting speed of the suction cup assembly 6.

[0048] The device is provided with a linkage mechanism 4, which can, on the one hand, integrate the power of the lifting and lowering of the suction cup assembly 6 and the lifting and lowering of the main shaft 7 to reduce the power source layout, and on the other hand, can also make the lifting speed of the suction cup assembly 6 greater than the lifting speed of the main shaft 7, thereby preventing the silicon wafer from interfering with the suction cup assembly 6 during the flipping process, thereby increasing reliability.

[0049] When the present embodiment is in use, the silicon wafers can be stacked in the storage cylinder 400, and then the rotating material shifting assembly 2 600 uses the arc-shaped rotating arm to shift them one by one from the bottom to the conveyor belt 100, and the conveyor belt 100 transports the silicon wafers into the cleaning tank 200 for immersion and cleaning, and then continues to transport them to the grinding disc 800 for grinding, and then enters the drying box 700 for drying, and then after turning over by the turning part, the rotating material shifting assembly 1 500 uses the arc-shaped rotating arm to shift the silicon wafers into the storage cylinder 400 again, and the silicon wafers are circulated and pre-treated again to complete the operation, when the suction cup assembly 6 is lifted up so that the silicon wafer is at the height of the claw 10, the claw 10 also slides to the inner concave part of the guide frame 2 3, thereby being guided by the limiting wheel 9. The limit makes the claws 10 move closer to each other to clamp the silicon wafer, and as the claws 10 continue to move upward, the toothed disc 8 engages with the teeth 12, causing the spindle 7 to rotate, driving the silicon wafer to turn over. After turning over, the spindle 7 continues to move upward, the limiting wheel 9 disengages from the recessed part of the guide frame 23, and the claws 10 move outward to loosen the silicon wafer, and the silicon wafer falls back to the surface of the conveyor belt 100 for continued transportation. When the suction cup assembly 6 is lifted or lowered, it can drive the synchronous frame 20 to lift or lower, thereby causing the movable tooth plate 18 to lift or lower, and then the gear 19 is lifted or lowered through the meshing action of the movable tooth plate 18 and the fixed tooth plate 16, thereby driving the spindle 7 to lift or lower through the connecting frame 17. At the same time, the lifting speed of the spindle 7 is half of the lifting speed of the suction cup assembly 6.

[0050] Embodiment 2:

[0051] A pretreatment device for double-sided debonding of silicon wafers, such as Figure 6 , Figure 7 , Figure 8 As shown, in order to solve the adsorption problem; this embodiment makes the following improvements on the basis of the first embodiment: the suction cup assembly 6 includes a base 21 and a slide plate 26 slidably connected to the inside of the base 21, the inner wall of the slide plate 26 is provided with uniform through holes 23, a suction nozzle 25 is fixed to the bottom outer wall of the slide plate 26 located at the through holes 23, a spring 24 is buckled on the top outer wall of the slide plate 26, and the other end of the spring 24 is buckled to the inner wall of the base 21.

[0052] A one-way valve member 22 and a release member 27 are respectively disposed on the top of the base 21 .

[0053] When the base 21 descends and the suction nozzle 25 contacts the silicon wafer, the base 21 continues to descend, and the slide plate 26 is limited, so that the slide plate 26 shrinks to the inside of the base 21, and the gas in the inner cavity of the base 21 is discharged through the one-way valve member 22. Then, when the base 21 rises, the slide plate 26 tends to move downward due to the elastic force of the spring 24, so that the inner cavity of the base 21 generates negative pressure, and the negative pressure is transmitted to the suction nozzle 25, and the silicon wafer is adsorbed by the suction nozzle 25. When the claw 10 clamps the silicon wafer, the release member 27 opens, and the outside air enters the inner cavity of the base 21, and the negative pressure disappears, thereby loosening the clamp.

[0054] The one-way valve member 22 includes a hollow frame 28 and a plurality of fan-shaped films 32. The outer circumferences of the hollow frame 28 and the fan-shaped films 32 are fixed to the inner wall of the base 21. The fan-shaped films 32 are fitted with the end faces of the hollow frame 28, and the plurality of fan-shaped films 32 can form a complete circular planar structure.

[0055] When the gas in the inner cavity of the base 21 is squeezed, the pressure is transmitted to the fan-shaped film 32. The fan-shaped film 32 is deformed outward under the pressure, so that the gas can be discharged into the atmosphere through the gap between the hollow frame 28 and the fan-shaped film 32. When the inner cavity of the base 21 is under negative pressure, the fan-shaped film 32 fits with the hollow frame 28 to seal it, thereby realizing the one-way passage function.

[0056] The release member 27 includes a conical ring 29, a plug 30 and a spring 31. The conical ring 29 is fixed to the top outer wall of the base 21 and is connected to the inner cavity of the base 21. The plug 30 is movably arranged inside the conical ring 29, and the plug 30 and the conical ring 29 are matched through an inclined surface. One end of the spring 31 is buckled to the bottom outer wall of the plug 30, and the other end of the spring 31 is buckled to the top outer wall of the base 21.

[0057] When there is positive pressure in the base 21, the gag 30 is subjected to positive pressure, and the gag 30 fits tightly with the conical ring 29. When the clamp needs to be loosened, the silicon wafer is rigidly limited by the claw 10, and the negative pressure in the base 21 tends to increase, thereby increasing the attraction of the negative pressure on the gag 30 until the attraction is greater than the elastic force applied by the spring 2 31 to the gag 30. The gag 30 then moves, and a gap is generated between the conical ring 29 and the gag 30, and the gas instantly enters the inner cavity of the base 21 to balance the negative pressure.

[0058] When the present embodiment is in use, when the gas in the inner cavity of the base 21 is squeezed, the pressure is transmitted to the fan-shaped film 32, and the fan-shaped film 32 is deformed outward under the pressure, so that the gas can be discharged into the atmosphere through the gap between the hollow frame 28 and the fan-shaped film 32. When the inner cavity of the base 21 is under negative pressure, the fan-shaped film 32 fits with the hollow frame 28 to seal and realize the one-way passage function. When the base 21 is under positive pressure, the plug 30 is subjected to positive pressure, and the plug 30 fits tightly with the conical ring 29. When the clamp needs to be loosened, the silicon wafer is rigidly limited by the claw 10, and the negative pressure in the base 21 tends to increase, thereby increasing the attraction of the negative pressure on the plug 30, until the attraction is greater than the elastic force applied by the spring 2 31 to the plug 30, the plug 30 moves, and a gap is generated between the conical ring 29 and the plug 30, and the gas instantly enters the inner cavity of the base 21 to balance the negative pressure.

[0059] The device, by configuring the suction cup assembly 6 to cooperate with the base 21, the slide plate 26, the one-way valve component 22, and the release component 27, can make it possible to rely on the position when negative pressure is generated, and rely on the rigid limit of the claw 10 when negative pressure disappears, thereby enabling the suction cup assembly 6 to clamp and release the silicon wafer completely automatically.

[0060] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A pretreatment device for double-sided debonding of silicon wafers, comprising a conveyor belt (100) arranged in an annular shape, and a cleaning pool (200), a storage cylinder (400), and a drying box (700) used in conjunction with the conveyor belt (100), characterized in that: The cleaning tank (200), storage cylinder (400) and drying box (700) are all arranged on the ground, and the discharge gap at the bottom of the storage cylinder (400) is connected to the conveyor belt (100) through a guide frame 1 (300), and the feed port of the storage cylinder (400) is connected to the conveyor belt (100) through another guide frame 1 (300), and the discharge gap and the feed port of the storage cylinder (400) are respectively provided with a rotary material shifting assembly 2 (600) and a rotary material shifting assembly 1 (500), and the conveyor belt (100) is provided with a grinding disc (800) at a position between the cleaning tank (200) and the drying box (700), and the conveyor belt (100) is provided with a turning portion at a position upstream of the rotary material shifting assembly 1 (500); The turning portion comprises two sets of guide frames (3) fixed to the side walls of the conveyor belt (100) and a top plate (1) fixed to the top outer wall of the guide frame (3) by bolts, a turning mechanism (5) is arranged on the inner side of the guide frame (3), a multi-stage telescopic device (2) is fixed to the top outer wall of the top plate (1) by bolts, a suction cup assembly (6) is fixed to the telescopic end of the multi-stage telescopic device (2) by bolts, and the suction cup assembly (6) is linked to the turning mechanism (5) by a linkage mechanism (4).

2. A pretreatment device for double-sided degumming of silicon wafers according to claim 1, characterized in that: The turning mechanism (5) comprises a main shaft (7) and a clamping claw (10) fixed to the inner end of the main shaft (7); the outer walls of the main shaft (7) located on both sides of the second guide frame (3) are rotatably connected to connecting rings (11); the connecting rings (11) are movably limited and matched to the second guide frame (3) through a limiting wheel (9).

3. A pretreatment device for double-sided degumming of silicon wafers according to claim 2, characterized in that: A toothed disc (8) is fixed to the outer wall of the main shaft (7), and teeth (12) that can engage with the toothed disc (8) are fixed to the inner wall of the concave portion of the second guide frame (3).

4. A pretreatment device for double-sided degumming of silicon wafers according to claim 2, characterized in that: The limiting wheel component (9) comprises a side limiting wheel (13), a surface limiting wheel (14) and a wheel axle (15); the surface limiting wheel (14) is rotatably connected to the outer side of the connecting ring (11) via the wheel axle (15), and the surface limiting wheel (14) rolls on the surface of the second guide frame (3); the side limiting wheel (13) is fixed to the outer wall of the surface limiting wheel (14), and the side limiting wheel (13) contacts and fits on the side surface of the second guide frame (3).

5. The pretreatment equipment for double-sided degumming of silicon wafer according to claim 2, characterized in that: The linkage mechanism (4) comprises a fixed tooth plate (16), a movable tooth plate (18) and a gear (19); the fixed tooth plate (16) is fixed to the side wall of the conveyor belt (100) by means of bolts; the side wall of the movable tooth plate (18) is fixed with a synchronous frame (20) by means of bolts; and the synchronous frame (20) is fixed to the top outer wall of the suction cup assembly (6) by means of bolts.

6. A pretreatment device for double-sided degumming of silicon wafers according to claim 5, characterized in that: The gear (19) is meshed with the outer walls of the fixed tooth plate (16) and the movable tooth plate (18) on opposite sides, and the end of the gear (19) is rotatably connected to the same connecting frame (17), and the connecting frame (17) is movably sleeved on the outer wall of the main shaft (7).

7. The pretreatment equipment for double-sided degumming of silicon wafer according to claim 2, characterized in that: The suction cup assembly (6) comprises a base (21) and a slide plate (26) slidably connected to the inside of the base (21); the inner wall of the slide plate (26) is provided with uniform through holes (23); a suction nozzle (25) is fixed to the bottom outer wall of the slide plate (26) located at the through holes (23); a spring (24) is buckled to the top outer wall of the slide plate (26); the other end of the spring (24) is buckled to the inner wall of the base (21); and a one-way valve member (22) and a release member (27) are respectively provided on the top of the base (21).

8. The pretreatment equipment for double-sided degumming of silicon wafers according to claim 7, characterized in that: The one-way valve component (22) comprises a hollow frame (28) and a plurality of fan-shaped films (32), wherein the outer circumferences of the hollow frame (28) and the fan-shaped films (32) are fixed to the inner wall of the base (21), the fan-shaped films (32) are fitted with the end surface of the hollow frame (28), and the plurality of fan-shaped films (32) can form a complete circular plane structure.

9. The pretreatment equipment for double-sided degumming of silicon wafers according to claim 8, characterized in that: The release member (27) comprises a conical ring (29), a plug (30) and a second spring (31); the conical ring (29) is fixed to the top outer wall of the base (21) and communicates with the inner cavity of the base (21); the plug (30) is movably arranged inside the conical ring (29), and the plug (30) and the conical ring (29) are matched through an inclined surface; one end of the second spring (31) is buckled to the bottom outer wall of the plug (30), and the other end of the second spring (31) is buckled to the top outer wall of the base (21).

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