A wafer NOTCH positioning and edge detection device

Abstract

The present invention relates to the technical field of wafer detection equipment, and discloses a wafer NOTCH positioning and edge detection equipment, comprising a NOTCH positioning component, a NOTCH image acquisition component, an edge image detection component, a wafer suction rotation component and an X-axis module, wherein the NOTCH positioning component, the NOTCH image acquisition component and the edge image detection component are arranged around a detection station, the wafer suction rotation component is installed on the X-axis module, the X-axis module drives the wafer suction rotation component to move until the wafer is located at the detection station, the wafer suction rotation component comprises a suction plate for adsorbing the wafer and a driving motor for driving the suction plate to rotate; the NOTCH positioning component comprises a NOTCH sensor, and the edge of the wafer located at the detection station is located in the sensing area of ​​the NOTCH sensor; the wafer NOTCH positioning and edge detection equipment provided by the present invention solves the problem of low efficiency of wafer edge detection in the prior art.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer detection equipment, and in particular to a wafer NOTCH positioning and edge detection equipment. Background Art

[0002] The chip substrate material is mainly sapphire wafer or silicon wafer. In the current chip manufacturing process, in order to ensure the consistency of the crystal structure of the sapphire wafer products in the subsequent process, one of the three a-plane angles of the crystal rod is removed to process it into a flat edge positioning edge. However, the disadvantage of this is that the waste ratio of sapphire substrate wafer reaches 6%-8%, resulting in a waste of crystal rod material costs. All chip processes will affect the output efficiency. In order to improve the utilization rate of sapphire substrate wafer materials, many manufacturers currently process a very small V-shaped Notch gap at the corresponding position of the outer circumference of the wafer, such as Figure 1 As shown, the flat edge positioning edge at the position corresponding to the original a-surface angle is replaced to reduce production material waste and improve efficiency.

[0003] The notch on the silicon wafer is used to mark the wafer direction and crystal orientation, usually located on the flat edge of the wafer. The notch is the mark left when the wafer is cut during the wafer manufacturing process. The location and shape of the notch are different, depending on the specifications of the wafer manufacturer. It can be a V-shaped or U-shaped groove, or other shapes, or even a section of the cut. The purpose of the notch is to help rotate and position the wafer to ensure the correct positioning of the wafer, which is very important in the chip manufacturing process. The cutting direction of silicon wafers is generally along the notch direction. In some cases, the wafer may be cut according to the direction of the flat edge or other special directional features. In some manufacturing processes, the cutting direction of the wafer may need to be aligned with the notch direction. This is because the notch can provide a certain reference coordinate system to ensure that the properties and parameters of the chip meet the specification requirements.

[0004] In the wafer manufacturing process, multiple processes need to be processed or inspected by automatic equipment. Before the chamfering, edge grinding, inspection, waxing, AOI and other processes are put on the machine, manual edge finding is required to make the wafer V-groove (NOTCH notch) in the turnover box face down or up. In order to locate the Notch notch, pure visual compensation is currently used on the market, and the automatic edge finding time is very long. Generally, the edge finding time for a single wafer takes more than 10 seconds, and the NOTCH notch is only a tiny notch, so the camera cannot quickly locate the position of the NOTCH notch. Summary of the invention

[0005] The object of the present invention is to provide a wafer NOTCH positioning and edge detection device to solve at least one of the above problems existing in the prior art.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A wafer NOTCH positioning and edge detection device, comprising a NOTCH positioning component, a NOTCH image acquisition component, an edge image detection component, a wafer suction rotation component and an X-axis module, wherein the NOTCH positioning component, the NOTCH image acquisition component and the edge image detection component are arranged around a detection station, the wafer suction rotation component is installed on the X-axis module, the X-axis module drives the wafer suction rotation component to move until the wafer is located at the detection station, and the wafer suction rotation component comprises a suction plate for suctioning the wafer and a driving motor for driving the suction plate to rotate;

[0008] The NOTCH positioning component includes a NOTCH sensor, and the edge of the wafer located at the detection station is located within the sensing area of ​​the NOTCH sensor;

[0009] The NOTCH image acquisition component includes a NOTCH image acquisition camera, and the NOTCH image acquisition camera is aligned with the edge of the wafer located at the inspection station from one side of the wafer;

[0010] The edge image detection component includes an upper edge camera, a lower edge camera and a wafer detection area. The edge of the wafer located at the detection station is located in the wafer detection area. The upper edge camera and the lower edge camera are tilted to align with the edge of the wafer located in the wafer detection area.

[0011] In the present technical solution, since the NOTCH positioning component, the NOTCH image acquisition component and the edge image detection component are arranged around the detection station, when the X-axis module drives the wafer suction rotation component to move until the wafer is located at the detection station, the edge of the wafer located at the detection station can be detected by the NOTCH positioning component, the NOTCH image acquisition component and the edge image detection component at the same time. Specifically, since the wafer suction rotation component includes a suction plate for adsorbing the wafer and a driving motor for driving the adsorption plate to rotate, the wafer is adsorbed and positioned on the adsorption plate to ensure that the wafer will not shift in the detection state. When the wafer is located at the detection station, a rapid self-inspection can be started. The driving motor drives the adsorption plate to rotate at a faster speed (120° / S), thereby driving the wafer to rotate rapidly. The wafer rotates one circle (360°) for the first time. During this process, the edge image detection component detects the edge defects of the wafer and determines whether the edge of the wafer has cracks, dirt, etc. If the wafer has edge defects, the X-axis module drives the wafer suction rotation component to move to the loading and unloading station. Synchronously, during the first rotation of the wafer, the NOTCH sensor detects the passage of the NOTCH notch and feeds back the detection signal to the controller, which records the position of the NOTCH notch. It should be noted that during the rapid self-test, when the NOTCH notch passes through the sensing area of ​​the NOTCH sensor, the NOTCH sensor will give the controller a rising edge electrical signal, and the controller will record the position of the NOTCH notch when it receives the signal. Because the rotation speed of this process is relatively fast, there will be a certain delay for the controller to respond to the signal. Therefore, the position recorded at this time is not particularly accurate and requires subsequent re-detection. During the re-detection, the drive motor drives the wafer to rotate 6° in the opposite direction at a faster speed (120° / S), and then rotates 10° in the forward direction at a slow speed (50° / S). The NOTCH sensor detects the NOTCH notch again. When the NOTCH notch is detected, the signal is fed back to the controller, and the controller records the current position of the NOTCH notch edge (the position accuracy is higher at this time). If the degree of the NOTCH notch is 1°, the center position of the NOTCH notch is the current position of the edge plus 0.5°. Since the angle between the NOTCH sensor and the NOTCH image acquisition camera is known, the controller can derive the wafer rotation angle required for NOTCH image acquisition based on the above parameters (the controller controls the rotation angle of the drive motor). The drive motor rotates the wafer to the position where the NOTCH notch is facing the NOTCH image acquisition camera, and then the NOTCH image acquisition camera takes a photo for compensation. Since the edge image detection component includes an upper edge camera, a lower edge camera, and a wafer detection area, the edge of the wafer located at the detection station is located in the wafer detection area, and the upper edge camera and the lower edge camera are tilted to align with the edge of the wafer located in the wafer detection area, which can more comprehensively detect wafer edge defects.

[0012] This device can use the wafer to detect edge cracks (the wafer needs to be rotated 360° for edge detection) and trigger the NOTCH sensor to perform a rough positioning of the NOTCH notch (positioning accuracy 0.1°), and then move it to the NOTCH image acquisition camera's photo position for high-precision compensation. The device can complete the product's NOTCH notch positioning and edge detection within 5 seconds, significantly improving detection efficiency.

[0013] Furthermore, it also includes a wafer regularization assembly and a Z-axis module, wherein the Z-axis module is located at the loading and unloading station, the wafer regularization assembly is installed on the Z-axis module, and the Z-axis module drives the wafer regularization assembly to rise and fall, and the wafer regularization assembly includes multiple wafer support seats and multiple PIN rods, the multiple wafer support seats are used to support the edges of the wafers, and the multiple PIN rods move toward the wafer until the wafer is restricted to a preset position. The Z-axis module lowers the wafer at a preset position onto the suction plate for positioning through the wafer regularization assembly, and then drives the wafer to move a straight line to the detection station via the X-axis module.

[0014] The Z-axis module drives the wafer regularization assembly to move up and down during loading and unloading. For example, when loading, the Z-axis module drives the wafer regularization assembly to rise, and the wafer on the wafer support seat rises, so that it is a certain distance away from the adsorption plate. Multiple PIN rods move toward the wafer until the wafer is restricted to a preset position (this step is to regularize the wafer). After that, the Z-axis module drives the wafer regularization assembly to descend until the wafer is lowered onto the adsorption plate, and the wafer is adsorbed and positioned by the adsorption plate. This can avoid directly adjusting the position of the wafer on the adsorption plate, which will cause wear on the wafer due to friction.

[0015] Furthermore, in order to enable the suction plate to cooperate with the wafer aligning assembly in an upper and lower position relationship so that the aligning wafer can be lowered onto the suction plate, and at the same time, the wafer suction rotation assembly can be moved out of the U-shaped opening under the drive of the X-axis module to move the wafer to the inspection station, the wafer aligning assembly includes a U-shaped bracket, the wafer suction rotation assembly is located in the U-shaped opening of the U-shaped bracket, a plurality of wafer support seats are arranged on the U-shaped bracket, and a plurality of wafer support seats are located around the U-shaped opening, and a PIN rod driving assembly is provided on the U-shaped bracket, and the PIN rod driving assembly drives the plurality of PIN rods to move toward the wafer direction.

[0016] Furthermore, in order to provide a PIN rod driving assembly that is convenient for driving the PIN rod to move toward the wafer direction at the same time and limit the wafer to a preset position, the PIN rod driving assembly includes a left movable arm and a right movable arm, the left movable arm and the right movable arm are vertically mounted with a PIN rod, the left movable arm and the right movable arm are horizontally slidably mounted on a U-shaped bracket, the sliding direction of the left movable arm and the right movable arm is perpendicular to the moving direction of the wafer suction rotation assembly, a turntable is provided on the U-shaped bracket, the turntable is located between the driving ends of the left movable arm and the right movable arm, the turntable is connected to the left movable arm through a first connecting arm, and the turntable is connected to the right movable arm through a second connecting arm, a motor is installed on the U-shaped bracket, an eccentric wheel is provided on the output shaft of the motor, the eccentric wheel drives the left movable arm or the right movable arm to slide horizontally, and a first elastic member and a second elastic member are respectively provided between the driving end of the left movable arm and the U-shaped bracket and between the driving end of the right movable arm and the U-shaped bracket.

[0017] Specifically, the motor drives the eccentric wheel to rotate, and when the protruding end of the eccentric wheel abuts against the left movable arm or the right movable arm, the left movable arm or the right movable arm is pushed to a position with a larger spacing, and multiple PIN rods are also in a position away from the preset position of the wafer. At this time, it is in the loading state, and the robot places the wafer on multiple wafer support seats to support the edge of the wafer. After that, the motor drives the eccentric wheel to continue to rotate. Since the protrusion of the eccentric wheel is away from the left movable arm or the right movable arm, and the left movable arm and the right movable arm move toward the approaching direction under the action of the first elastic member and the second elastic member, the PIN rods installed on the left movable arm and the right movable arm move toward the direction close to the wafer, thereby limiting the wafer to the preset position.

[0018] During the specific rotation of the eccentric wheel, if it drives the right moving arm to move, then since the right moving arm is connected to the turntable through the second connecting arm, the turntable can be driven to rotate through the second connecting arm, and since the turntable is connected to the left moving arm through the first connecting arm, the turntable synchronously drives the left moving arm through the first connecting arm, thereby realizing the synchronous movement away of the left moving arm and the right moving arm. If the eccentric wheel continues to rotate, then under the action of the first elastic member and the second elastic member, the left moving arm and the right moving arm move closer, and the position of the wafer is limited by driving multiple PIN rods, thereby regularizing the position of the wafer on the wafer support seat, ensuring that the wafer can be moved down to the suction plate and positioned accurately.

[0019] Furthermore, in order to control the maximum moving distance of the left moving arm or the right moving arm, a travel sensor is provided on the U-shaped bracket, and a travel block is provided on the left moving arm or the right moving arm. When the left moving arm or the right moving arm slides horizontally, the travel block passes through the sensing area of ​​the travel sensor.

[0020] Furthermore, in order to better realize the driving of the left movable arm or the right movable arm, a connecting arm is provided on the left movable arm or the right movable arm, a bearing is provided on the connecting arm, and the eccentric wheel is in rolling cooperation with the bearing.

[0021] Furthermore, in order to improve the image acquisition effect of the NOTCH notch of the wafer, the NOTCH image acquisition component includes an upper light source, a lower light source and a side light source. The upper light source and the lower light source are arranged in an eight-shaped manner above and below the edge of the wafer. The side light source is located on the side close to the NOTCH image acquisition camera. A shooting hole is provided on the side light source, and the shooting field of view of the NOTCH image acquisition camera is aligned with the shooting hole.

[0022] Furthermore, in order to provide a structure that is convenient for adjusting the NOTCH image acquisition camera and light source, the NOTCH image acquisition component includes a slide base plate, a mounting base plate, a mounting side plate, an upper L-shaped adjustment plate, an upper light source height adjustment component, a lower L-shaped adjustment plate, a lower light source height adjustment component and a camera mounting frame, a first slide is provided between the slide base plate and the mounting base plate, the lower end of the mounting side plate is fixedly connected to the mounting base plate and the two are L-shaped, the upper L-shaped adjustment plate is arranged at the upper end of the mounting side plate, the lower L-shaped adjustment plate is arranged at the upper end of the mounting base plate, the upper L-shaped adjustment plate and the lower L-shaped adjustment plate are both provided with X-axis strip holes and Y-axis strip holes, the Y-axis strip holes on the upper L-shaped adjustment plate are adjustably fixedly connected to the upper end of the mounting side plate by fasteners, the X-axis strip holes on the upper L-shaped adjustment plate are adjustably fixedly connected to the upper light source height adjustment component by fasteners, and the upper light source is tiltedly installed on the upper light source height adjustment component;

[0023] The Y-direction strip hole on the lower L-shaped adjustment plate is adjustably fixedly connected to the upper end of the mounting base plate through a fastener, and the X-direction strip hole on the lower L-shaped adjustment plate is adjustably fixedly connected to the lower light source height adjustment assembly through a fastener, and the lower light source is tiltedly installed on the lower light source height adjustment assembly;

[0024] The mounting side plate is provided with an arc-shaped slide, and the camera mounting frame includes a first slide base plate, a second slide base plate, a slide connecting plate and a camera mounting seat. The first slide base plate is L-shaped, and the side plate of the first slide base plate is adjustably slidably matched with the arc-shaped slide through a sliding member. A second slide is provided between the back plate of the first slide base plate and the second slide base plate, one side of the second slide base plate is fixedly connected to the slide connecting plate, the slide connecting plate extends toward the rear, and a third slide is provided between the inner side of the slide connecting plate and the camera mounting seat, and the NOTCH image acquisition camera is installed on the camera mounting seat.

[0025] Furthermore, in order to improve the detection effect of wafer edge defects, the edge image detection component includes an arc light source, one end of which has an opening. When the wafer moves to the detection station, the edge of the wafer enters the wafer detection area within the arc light source from the opening.

[0026] Furthermore, in order to provide a structure that facilitates adjustment of the upper edge camera, the lower edge camera and the light source, the edge image detection component includes a vertical plate and an upper camera adjustment component, a lower camera adjustment component and a light source adjustment component arranged on the vertical plate, the upper edge camera and the lower edge camera are respectively mounted on the upper camera adjustment component and the lower camera adjustment component, the upper camera adjustment component and the lower camera adjustment component both include a bottom plate, a connecting plate, a first L-shaped connecting plate, a second L-shaped connecting plate and a camera mounting plate, the vertical plate is symmetrically provided with an upper arc adjustment rail and a lower arc adjustment rail, the bottom plate is adjustably slidably matched with the corresponding upper arc adjustment rail or the lower arc adjustment rail, the connecting plate is tilted and fixed on the bottom plate, a first slide assembly is arranged between the connecting plate and the first L-shaped connecting plate, a second slide assembly is arranged between the end plate of the first L-shaped connecting plate facing forward and the second L-shaped connecting plate, one side of the second L-shaped connecting plate is fixedly connected to the camera mounting plate, the upper edge camera and the lower edge camera are respectively mounted on the corresponding camera mounting plates;

[0027] The light source adjustment assembly includes a light source base plate, a first connecting plate, a second connecting plate, a first L-shaped light source connecting plate, a second L-shaped light source connecting plate and a light source connecting plate, a first light source slide is provided between the light source base plate and the first connecting plate, the first connecting plate is fixedly connected to the second connecting plate at one end close to the light source, a second light source slide is provided between the second connecting plate and the first L-shaped light source connecting plate, a third light source slide is provided between the horizontal end plate of the first L-shaped light source connecting plate and the second L-shaped light source connecting plate, a fourth light source slide is provided between the vertical plate of the second L-shaped light source connecting plate and the light source connecting plate, and the arc-shaped light source is fixedly mounted on the light source connecting plate.

[0028] The beneficial effects of the present invention are as follows: In this technical solution, since the NOTCH positioning component, the NOTCH image acquisition component and the edge image detection component are arranged around the detection station, when the X-axis module drives the wafer suction rotation component to move until the wafer is located at the detection station, the edge of the wafer located at the detection station can be detected by the NOTCH positioning component, the NOTCH image acquisition component and the edge image detection component at the same time. Specifically, since the wafer suction rotation component includes an adsorption plate for adsorbing the wafer and a driving motor for driving the adsorption plate to rotate, the wafer is adsorbed and positioned on the adsorption plate to ensure that the wafer will not shift in the detection state. When the wafer is located at the detection station, a quick self-inspection can be started. The driving motor drives the adsorption plate to rotate at a faster speed (120° / S), thereby driving the wafer to rotate quickly. The wafer rotates one circle (360°) for the first time. During this process, the edge image detection component detects the edge defects of the wafer and determines whether the edge of the wafer has cracks, dirt, etc. If the wafer has edge defects, the X-axis module drives the wafer suction rotation component to move to the loading and unloading station. Synchronously, during the first rotation of the wafer, the NOTCH sensor detects the passage of the NOTCH notch and feeds back the detection signal to the controller, which records the position of the NOTCH notch. It should be noted that during the rapid self-test, when the NOTCH notch passes through the sensing area of ​​the NOTCH sensor, the NOTCH sensor will give the controller a rising edge electrical signal, and the controller will record the position of the NOTCH notch when it receives the signal. Because the rotation speed of this process is relatively fast, there will be a certain delay for the controller to respond to the signal. Therefore, the position recorded at this time is not particularly accurate and requires subsequent re-detection. During the re-detection, the drive motor drives the wafer to rotate 6° in the opposite direction at a faster speed (120° / S), and then rotates 10° in the forward direction at a slow speed (50° / S). The NOTCH sensor detects the NOTCH notch again. When the NOTCH notch is detected, the signal is fed back to the controller, and the controller records the current position of the NOTCH notch edge (the position accuracy is higher at this time). If the degree of the NOTCH notch is 1°, the center position of the NOTCH notch is the current position of the edge plus 0.5°. Since the angle between the NOTCH sensor and the NOTCH image acquisition camera is known, the controller can derive the wafer rotation angle required for NOTCH image acquisition based on the above parameters (the controller controls the rotation angle of the drive motor). The drive motor rotates the wafer to the position where the NOTCH notch is facing the NOTCH image acquisition camera, and then the NOTCH image acquisition camera takes a photo for compensation. Since the edge image detection component includes an upper edge camera, a lower edge camera, and a wafer detection area, the edge of the wafer located at the detection station is located in the wafer detection area, and the upper edge camera and the lower edge camera are tilted to align with the edge of the wafer located in the wafer detection area, which can more comprehensively detect wafer edge defects.

[0029] This device can use the wafer to detect edge cracks (the wafer needs to be rotated 360° for edge detection) and trigger the NOTCH sensor to perform a rough positioning of the NOTCH notch (positioning accuracy 0.1°), and then move it to the NOTCH image acquisition camera's photo position for high-precision compensation. The device can complete the product's NOTCH notch positioning and edge detection within 5 seconds, significantly improving detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of a structure with a NOTCH notch on an existing wafer;

[0031] Figure 2 It is a structural schematic diagram of the first viewing angle of the present invention;

[0032] Figure 3 It is a structural schematic diagram of the second viewing angle of the present invention;

[0033] Figure 4 It is a structural schematic diagram of the detection state of the present invention;

[0034] Figure 5 This is a schematic diagram of the structure of the wafer being regularly positioned in the present invention;

[0035] Figure 6 It is a schematic diagram of the structure of the wafer aligning assembly in the present invention;

[0036] Figure 7 It is a structural schematic diagram of the NOTCH image acquisition component in the present invention;

[0037] Figure 8 It is a structural schematic diagram of the edge image detection component in the present invention.

[0038] In the figure: X-axis module 1; suction plate 2; DD motor 3; NOTCH sensor 4; NOTCH sensor 4; sensing area 5; NOTCH image acquisition camera 6; wafer 7; upper edge camera 8; lower edge camera 9; wafer detection area 10; Z-axis module 11; wafer support seat 12; PIN rod 13; U-shaped bracket 14; U-shaped opening 15; left movable arm 16; right movable arm 17; turntable 18; first connecting arm 19; second connecting arm 20; motor 21; eccentric wheel 22; first elastic member 23; second elastic member 24; connecting arm 25; bearing 26; travel sensor 27; travel baffle 28; upper light source 29; lower light source 30; side light source 31; shooting hole 32; slide base plate 33; mounting base plate 34; mounting side plate 35; upper L-shaped adjustment plate 36; upper light source height adjustment assembly 37; lower L-shaped adjustment plate 38; lower light source height adjustment assembly 39; first slide 41; X-axis strip hole 42; Y-axis strip hole 43; arc slide 44; first slide base plate 45; second slide base plate 46; slide connecting plate 47; camera mounting seat 48; second slide 49; third slide 50; arc light source 51; vertical plate 52; base plate 53; connecting plate 54; first L-shaped connecting plate 55; second L-shaped connecting plate 56; camera mounting plate 57; upper arc adjustment track 58; lower arc adjustment track 59; first slide assembly 60; second slide assembly 61; light source base plate 62; first connecting plate 63; second connecting plate 64; first L-shaped light source connecting plate 65; second L-shaped light source connecting plate 66; light source connecting plate 67; first light source slide 68; second light source slide 69; third light source slide 70; fourth light source slide 71; NOTCH gap 72. DETAILED DESCRIPTION

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the present invention will be briefly introduced below in combination with the drawings and the description of the embodiments or the prior art. Obviously, the following description of the structure of the drawings is only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention.

[0040] Embodiment 1:

[0041] like Figure 2-Figure 8As shown, this embodiment provides a wafer NOTCH positioning and edge detection device, including a NOTCH positioning component, a NOTCH image acquisition component, an edge image detection component, a wafer suction rotation component and an X-axis module 1. The NOTCH positioning component, the NOTCH image acquisition component and the edge image detection component are arranged around the detection station, the wafer suction rotation component is installed on the X-axis module 1, and the X-axis module 1 drives the wafer suction rotation component to move until the wafer is located at the detection station. The wafer suction rotation component includes a suction plate 2 for adsorbing the wafer 7 and a driving motor for driving the suction plate 2 to rotate. The driving motor is a DD motor 3. The suction plate 2 is provided with a plurality of adsorption holes, and the adsorption holes are connected to the negative pressure device through pipelines.

[0042] The NOTCH positioning component includes a NOTCH sensor 4. Preferably, the NOTCH sensor 4 can be a regional optical fiber sensor of Keyence. The edge of the wafer 7 located at the detection station is located in the sensing area 5 of the NOTCH sensor 4.

[0043] The NOTCH image acquisition component includes a NOTCH image acquisition camera 6, which is aligned with the edge of the wafer 7 located at the inspection station from one side of the wafer 7;

[0044] The edge image detection component includes an upper edge camera 8, a lower edge camera 9 and a wafer detection area 10. The edge of the wafer 7 located at the detection station is located in the wafer detection area 10. The upper edge camera 8 and the lower edge camera 9 are tilted to align with the edge of the wafer 7 located in the wafer detection area 10. Preferably, the upper edge camera 8 and the lower edge camera 9 use 4K cameras, and the edge of the product is detected at the same time. The NOTCH positioning component, the NOTCH image acquisition component and the edge image detection component can quickly complete the positioning of the Notch notch 72 of the wafer 7 and the edge detection.

[0045] In the present technical solution, since the NOTCH positioning component, the NOTCH image acquisition component and the edge image detection component are arranged around the detection station, when the X-axis module 1 drives the wafer suction rotation component to move until the wafer 7 is located at the detection station, the edge of the wafer 7 located at the detection station can be detected by the NOTCH positioning component, the NOTCH image acquisition component and the edge image detection component at the same time. Specifically, since the wafer suction rotation component includes a suction plate 2 for adsorbing the wafer 7 and a DD motor 3 for driving the suction plate 2 to rotate, the wafer 7 adsorbs and positions. It is located on the suction plate 2 to ensure that the wafer 7 will not shift in the detection state. When the wafer 7 is located at the detection station, a quick self-test can be started. The DD motor 3 drives the suction plate 2 to rotate at a faster speed (120° / S), thereby driving the wafer 7 to rotate quickly. The wafer 7 rotates one circle (360°) for the first time. During this process, the edge image detection component detects the edge defects of the wafer 7 and determines whether there are cracks, dirt, etc. on the edge of the wafer 7. If there are edge defects on the wafer 7, the X-axis module 1 drives the wafer suction rotation component to move to the loading and unloading station. Synchronously, during the first rotation of the wafer 7, the NOTCH sensor 4 detects the NOTCH gap 72 passing by and feeds back the detection signal to the controller, and the controller records the position of the NOTCH gap 72. It should be noted that during the quick self-test, when the NOTCH gap 72 passes through the sensing area of ​​the NOTCH sensor, the NOTCH sensor will give the controller an electrical signal with a rising edge. When the controller receives the signal, it will record the position of the NOTCH gap 72. Because the speed of this process is relatively fast, there will be a certain delay for the controller to respond to the signal. Therefore, the position recorded at this time is not particularly accurate and needs to be re-tested. After the NOTCH gap 72 passes through the sensing area of ​​the NOTCH sensor again, DD motor 3 drives wafer 7 to rotate 6° in the opposite direction at a faster speed (120° / S), and then rotates 10° in the forward direction at a slow speed (50° / S). When the NOTCH sensor detects the edge of NOTCH notch 72 again, it feeds back the signal to the controller. The controller records the current position of the edge of NOTCH notch 72 (the position accuracy is higher at this time). If the degree of NOTCH notch 72 is 1°, the center position of NOTCH notch 72 is the current position of the edge plus 0.5°. Since the angle between the NOTCH sensor and the NOTCH image acquisition camera is known, the controller can obtain the rotation angle of wafer 7 required for NOTCH image acquisition based on the above parameters (the controller controls the rotation angle of DD motor 3). DD motor 3 rotates wafer 7 to the position where NOTCH notch 72 is facing NOTCH image acquisition camera 6, and then NOTCH image acquisition camera 6 takes a photo for compensation.Since the edge image detection component includes an upper edge camera 8, a lower edge camera 9 and a wafer detection area 10, the edge of the wafer 7 located at the detection station is located in the wafer detection area 10, and the upper edge camera 8 and the lower edge camera 9 are tilted to align with the edge of the wafer 7 located in the wafer detection area 10, which can more comprehensively realize the detection of edge defects of the wafer 7.

[0046] This device can use the wafer 7 to detect edge cracks (the edge detection wafer 7 needs to be rotated 360°) and trigger the NOTCH sensor to perform a rough positioning of the NOTCH notch 72 (positioning accuracy 0.1°), and then move to the NOTCH image acquisition camera 6 to take pictures for high-precision compensation. The device can complete the NOTCH notch 72 positioning and edge detection of the product within 5 seconds, and the detection efficiency is significantly improved.

[0047] Embodiment 2:

[0048] This embodiment is optimized based on the above-mentioned embodiment 1.

[0049] It also includes a wafer regularization assembly and a Z-axis module 11. The Z-axis module 11 is located at the loading and unloading stations. The wafer regularization assembly is installed on the Z-axis module 11. The Z-axis module 11 drives the wafer regularization assembly to move up and down. The wafer regularization assembly includes multiple wafer support seats 12 and multiple PIN rods 13. The multiple wafer support seats 12 are used to support the edge of the wafer 7. The multiple PIN rods 13 move toward the direction of the wafer 7 until the wafer 7 is restricted to a preset position. The Z-axis module 11 lowers the wafer 7 at the preset position onto the suction plate 2 for positioning through the wafer regularization assembly, and then drives the wafer 7 to move linearly to the detection station through the X-axis module 1.

[0050] The Z-axis module 11 drives the wafer alignment assembly to move up and down during loading and unloading. For example, during loading, the Z-axis module 11 drives the wafer alignment assembly to rise, and the wafer 7 on the wafer support seat 12 rises, thereby being a certain distance away from the adsorption plate 2. Multiple PIN rods 13 move toward the direction of the wafer 7 until the wafer 7 is restricted to a preset position (this step is the mechanical positioning of the wafer 7). Then, the Z-axis module 11 drives the wafer alignment assembly to descend until the wafer 7 is lowered onto the adsorption plate 2. The wafer 7 is adsorbed and positioned by the adsorption plate 2. This can avoid directly adjusting the position of the wafer 7 on the adsorption plate 2, which will cause wear on the wafer 7 due to friction.

[0051] Embodiment three:

[0052] This embodiment is optimized based on the above-mentioned embodiment 2.

[0053] In order to ensure that the suction plate 2 and the wafer aligning assembly have an upper and lower positional relationship, so that the aligned wafer 7 can be lowered onto the suction plate 2, and at the same time, the wafer suction rotation assembly can be moved out of the U-shaped opening 15 under the drive of the X-axis module 1 to move the wafer 7 to the inspection station, the wafer aligning assembly includes a U-shaped bracket 14, the wafer suction rotation assembly is located in the U-shaped opening 15 of the U-shaped bracket 14, a plurality of wafer support seats 12 are arranged on the U-shaped bracket 14, and the plurality of wafer support seats 12 are located around the U-shaped opening 15, and a PIN rod driving assembly is provided on the U-shaped bracket 14, and the PIN rod driving assembly drives the plurality of PIN rods 13 to move toward the direction of the wafer 7.

[0054] Embodiment 4:

[0055] This embodiment is optimized based on the above-mentioned embodiment 3.

[0056] In order to provide a PIN rod driving assembly that is convenient for driving the PIN rod 13 to move toward the wafer 7 at the same time and limit the wafer 7 to a preset position, the PIN rod driving assembly includes a left movable arm 16 and a right movable arm 17, the PIN rod 13 is vertically installed on the left movable arm 16 and the right movable arm 17, the left movable arm 16 and the right movable arm 17 are horizontally slidably installed on the U-shaped bracket 14, the sliding direction of the left movable arm 16 and the right movable arm 17 is perpendicular to the moving direction of the wafer suction rotating assembly, and a turntable 18 is provided on the U-shaped bracket 14, and the turntable 18 is located on the left Between the driving ends of the side moving arm 16 and the right moving arm 17, the turntable 18 is connected to the left moving arm 16 through the first connecting arm 19, and the turntable 18 is connected to the right moving arm 17 through the second connecting arm 20. A motor 21 is installed on the U-shaped bracket 14, and an eccentric wheel 22 is provided on the output shaft of the motor 21. The eccentric wheel 22 drives the left moving arm 16 or the right moving arm 17 to slide horizontally. A first elastic member 23 and a second elastic member 24 are respectively provided between the driving end of the left moving arm 16 and the U-shaped bracket 14, and between the driving end of the right moving arm 17 and the U-shaped bracket 14.

[0057] It should be noted that the wafer support seat 12 is provided with a sensor for detecting whether the wafer 7 is placed in place, and an Omron diffuse reflection touch sensor can be used. After the controller receives the sensing signal, it controls the motor 21 to drive the PIN rod 13 to achieve mechanical positioning of the wafer 7.

[0058] Specifically, the motor 21 drives the eccentric wheel 22 to rotate. When the protruding end of the eccentric wheel 22 abuts against the left movable arm 16 or the right movable arm 17, the left movable arm 16 or the right movable arm 17 is pushed to a position with a larger spacing, and multiple PIN rods 13 are also in a position away from the preset position of the wafer 7. At this time, it is in the loading state, and the robot places the wafer 7 on multiple wafer support seats 12 to support the edge of the wafer 7. After that, the motor 21 drives the eccentric wheel 22 to continue to rotate. Since the protrusion of the eccentric wheel 22 is away from the left movable arm 16 or the right movable arm 17, and the left movable arm 16 and the right movable arm 17 move in a direction of approaching under the action of the first elastic member 23 and the second elastic member 24, the PIN rods 13 installed on the left movable arm 16 and the right movable arm 17 move in a direction close to the wafer 7, thereby limiting the wafer 7 to the preset position.

[0059] Specifically, during the rotation of the eccentric wheel 22, if it drives the right moving arm 17 to move, since the right moving arm 17 is connected to the turntable 18 through the second connecting arm 20, the turntable 18 can be driven to rotate through the second connecting arm 20, and since the turntable 18 is connected to the left moving arm 16 through the first connecting arm 19, the turntable 18 synchronously drives the left moving arm 16 through the first connecting arm 19, thereby realizing the synchronous movement away of the left moving arm 16 and the right moving arm 17. If the eccentric wheel 22 continues to rotate, then under the action of the first elastic member 23 and the second elastic member 24, the left moving arm 16 and the right moving arm 17 move closer, and the position of the wafer 7 is limited by driving the multiple PIN rods 13, thereby regularizing the position of the wafer 7 on the wafer support seat 12, ensuring that the wafer 7 can be moved down to the suction plate 2 and positioned accurately.

[0060] Preferably, the length of the right movable arm 17 is greater than that of the left movable arm 16 , two PIN rods 13 are provided on the right movable arm 17 , and one PIN rod 13 is provided on the left movable arm 16 , and the three PIN rods 13 are distributed in an isosceles triangle.

[0061] Embodiment five:

[0062] This embodiment is optimized based on the above-mentioned embodiment 4.

[0063] In order to control the maximum moving distance of the left moving arm 16 or the right moving arm 17, a travel sensor 27 is provided on the U-shaped bracket 14, and a travel baffle 28 is provided on the left moving arm 16 or the right moving arm 17. When the left moving arm 16 or the right moving arm 17 slides horizontally, the travel baffle 28 passes through the sensing area of ​​the travel sensor 27.

[0064] Embodiment six:

[0065] This embodiment is optimized based on the above-mentioned embodiment 4.

[0066] In order to better realize the driving of the left movable arm 16 or the right movable arm 17 , a connecting arm 25 is provided on the left movable arm 16 or the right movable arm 17 , and a bearing 26 is provided on the connecting arm 25 , and the eccentric wheel 22 and the bearing 26 are rollingly matched.

[0067] Embodiment seven:

[0068] This embodiment is optimized based on the above-mentioned embodiment 1.

[0069] In order to improve the image acquisition effect of the NOTCH notch 72 of the wafer, the NOTCH image acquisition component includes an upper light source 29, a lower light source 30 and a side light source 31. The upper light source 29 and the lower light source 30 are arranged in an eight-shaped manner above and below the edge of the wafer 7. The side light source 31 is located on the side close to the NOTCH image acquisition camera 6. A shooting hole 32 is provided on the side light source 31, and the shooting field of view of the NOTCH image acquisition camera 6 is aligned with the shooting hole 32.

[0070] Embodiment eight:

[0071] This embodiment is optimized based on the above-mentioned embodiment 7.

[0072] In order to provide a structure that is convenient for adjusting the NOTCH image acquisition camera 6 and the light source, the NOTCH image acquisition assembly includes a slide base plate 33, a mounting base plate 34, a mounting side plate 35, an upper L-shaped adjustment plate 36, an upper light source height adjustment assembly 37, a lower L-shaped adjustment plate 38, a lower light source height adjustment assembly 39 and a camera mounting frame. A first slide 41 is provided between the slide base plate 33 and the mounting base plate 34. The lower end of the mounting side plate 35 is fixedly connected to the mounting base plate 34 and the two are L-shaped. The upper L-shaped adjustment plate 36 The upper end of the mounting side plate 35 is arranged, and the lower L-shaped adjustment plate 38 is arranged at the upper end of the mounting bottom plate 34. The upper L-shaped adjustment plate 36 and the lower L-shaped adjustment plate 38 are both provided with an X-direction strip hole 42 and a Y-direction strip hole 43. The Y-direction strip hole 43 on the upper L-shaped adjustment plate 36 is adjustably fixedly connected to the upper end of the mounting side plate 35 through a fastener. The X-direction strip hole 42 on the upper L-shaped adjustment plate 36 is adjustably fixedly connected to the upper light source height adjustment assembly 37 through a fastener. The upper light source 29 is tiltedly installed on the upper light source height adjustment assembly 37.

[0073] The Y-direction strip hole 43 on the lower L-shaped adjustment plate 38 is adjustably fixedly connected to the upper end of the mounting base plate 34 through a fastener, and the X-direction strip hole 42 on the lower L-shaped adjustment plate 38 is adjustably fixedly connected to the lower light source height adjustment assembly 39 through a fastener, and the lower light source 30 is tiltedly installed on the lower light source height adjustment assembly 39;

[0074] An arc-shaped slide 44 is provided on the mounting side plate 35, and the camera mounting frame includes a first slide base plate 45, a second slide base plate 46, a slide connecting plate 47 and a camera mounting seat 48. The first slide base plate 45 is L-shaped, and the side plate of the first slide base plate 45 is adjustably slidably matched with the arc-shaped slide 44 through a sliding member. A second slide 49 is provided between the back plate of the first slide base plate 45 and the second slide base plate 46, one side of the second slide base plate 46 is fixedly connected to the slide connecting plate 47, and the slide connecting plate 47 extends toward the rear. A third slide 50 is provided between the inner side of the slide connecting plate 47 and the camera mounting seat 48, and the NOTCH image acquisition camera 6 is installed on the camera mounting seat 48.

[0075] Embodiment nine:

[0076] This embodiment is optimized based on the above-mentioned embodiment 1.

[0077] In order to improve the detection effect of edge defects of wafer 7, the edge image detection component includes an arc light source 51, one end of which has an opening. When wafer 7 moves to the detection station, the edge of wafer 7 enters the wafer detection area 10 in the arc light source 51 through the opening.

[0078] Embodiment ten:

[0079] This embodiment is optimized based on the above-mentioned embodiment 9.

[0080] In order to provide a structure that is convenient for adjusting the upper edge camera 8, the lower edge camera 9 and the light source, the edge image detection component includes a vertical plate 52 and an upper camera adjustment component, a lower camera adjustment component and a light source adjustment component arranged on the vertical plate 52. The upper edge camera 8 and the lower edge camera 9 are respectively installed on the upper camera adjustment component and the lower camera adjustment component. The upper camera adjustment component and the lower camera adjustment component both include a bottom plate 53, a connecting plate 54, a first L-shaped connecting plate 55, a second L-shaped connecting plate 56 and a camera mounting plate 57. The vertical plate 52 is symmetrically provided with an upper arc adjustment component. Track 58 and lower arc-shaped adjustment track 59, bottom plate 53 and corresponding upper arc-shaped adjustment track 58 or lower arc-shaped adjustment track 59 are adjustable and slidably matched, connecting plate 54 is tilted and fixed on bottom plate 53, a first slide assembly 60 is provided between connecting plate 54 and first L-shaped connecting plate 55, a second slide assembly 61 is provided between the front end plate of first L-shaped connecting plate 55 and second L-shaped connecting plate 56, one side of second L-shaped connecting plate 56 is fixedly connected with camera mounting plate 57, upper edge camera 8 and lower edge camera 9 are respectively installed on corresponding camera mounting plate 57;

[0081] The light source adjustment assembly includes a light source base plate 62, a first connecting plate 63, a second connecting plate 64, a first L-shaped light source connecting plate 65, a second L-shaped light source connecting plate 66 and a light source connecting plate 67. A first light source slide 68 is provided between the light source base plate 62 and the first connecting plate 63. The end of the first connecting plate 63 close to the light source is fixedly connected to the second connecting plate 64. A second light source slide 69 is provided between the second connecting plate 64 and the first L-shaped light source connecting plate 65. A third light source slide 70 is provided between the horizontal end plate of the first L-shaped light source connecting plate 65 and the second L-shaped light source connecting plate 66. A fourth light source slide 71 is provided between the vertical plate of the second L-shaped light source connecting plate 66 and the light source connecting plate 67. The arc light source 51 is fixedly mounted on the light source connecting plate 67.

[0082] The working steps of this equipment are as follows:

[0083] S1. Wafer 7 loading and positioning: the Z-axis module 11 drives the wafer aligning assembly to rise, and the multiple PIN rods 13 of the wafer aligning assembly are in a loading state. Then, the upstream manipulator places the wafer 7 on the wafer support seat 12. After the wafer 7 detected by the sensor is in place, the motor 21 drives the eccentric wheel to rotate. Under the action of the first elastic member 23 and the second elastic member 24, the PIN rod 13 moves toward the wafer 7 until the wafer 7 is positioned at a preset position by the PIN rod 13. Then, the Z-axis module 1 drives the wafer aligning assembly to descend until the wafer 7 moves down to the adsorption plate 2, and the adsorption plate 2 adsorbs and positions the wafer 7.

[0084] S2, the X-axis module 1 drives the wafer suction rotating assembly to move until the wafer 7 is located at the inspection station;

[0085] S3, fast self-test: DD motor 3 rotates 360° at a relatively fast speed (120° / S), NOTCH sensor 4 detects the edge of NOTCH notch 72 and feeds back the detection signal to the controller, the controller records the position of the edge of NOTCH notch 72, and the edge image detection component synchronously detects edge defects of wafer 7;

[0086] S3, re-test: DD motor 3 drives wafer 7 to rotate 6° in the opposite direction at a faster speed (120° / S);

[0087] S4, DD motor moves forward 10° at 50° / S. When NOTCH sensor 4 detects the edge of NOTCH notch 72 again, it feeds back the signal to the controller to calculate the current center position of Notch notch 72:

[0088] S5. The DD motor drives the wafer 7 to rotate to the photographing position of the NOTCH image acquisition camera 6 at a speed of 120° / S. The NOTCH notch 72 is located at the photographing position. The NOTCH image acquisition camera 6 takes pictures for compensation. The photographing compensation is specifically achieved by comparing the current product position with the standard position. If there is a difference in the position, the vision will send the compensation value back to the PLC controller and control the DD motor 3 to drive the wafer 7 to move for compensation.

[0089] S6. The X-axis module 1 drives the wafer suction rotating assembly to move to the loading and unloading station. The PIN rod 13 of the wafer regularization assembly is away from the edge of the wafer 7, waiting for the robot to pick up the material. At the same time, the detection result data is uploaded to the MES system, and the picture is stored in the device PC.

[0090] Preferably, because dust is easily accumulated inside the module during movement, in order to ensure the cleanliness of wafer 7 during inspection, a negative pressure air pipe can be provided to prevent the dust inside the module from being contaminated on the product.

[0091] This equipment communicates with the upstream robot to load and unload wafers 7, adopts DD motor 3, X-axis module 1 adopts linear motor, and wafer aligning assembly is driven by servo motor. The equipment has fast response speed and high precision. It can realize fast loading and unloading while meeting the precision requirements, thus reducing the equipment operation time.

[0092] In the above embodiment, NOTCH image acquisition camera 6, upper edge camera 8 and lower edge camera 9 are all made of German brand, Basler, and the camera is equipped with a linear array camera CMOS photosensitive chip, with a line frequency of 26 kHz and a resolution of 4k. The lens adopts an industrial F-mount lens AZURE-2428MF 24MM 5 million pixel manual aperture fixed focus lens machine vision lens. The light source of the device adopts blue light of a special band light source, and is illuminated by coaxial light.

[0093] This equipment is fully automatic in loading and unloading, and no human intervention is required. This equipment is only a link in wafer inspection. The equipment can be embedded in the front side inspection, back side inspection equipment and other matching designs of the wafer.

[0094] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wafer NOTCH positioning and edge detection device, characterized in that: It includes a NOTCH positioning component, a NOTCH image acquisition component, an edge image detection component, a wafer suction rotation component and an X-axis module. The NOTCH positioning component, the NOTCH image acquisition component and the edge image detection component are arranged around the detection station. The wafer suction rotation component is installed on the X-axis module. The X-axis module drives the wafer suction rotation component to move until the wafer is located at the detection station. The wafer suction rotation component includes a suction plate for sucking the wafer and a driving motor for driving the suction plate to rotate; The NOTCH positioning component includes a NOTCH sensor, and the edge of the wafer located at the detection station is located within the sensing area of ​​the NOTCH sensor; The NOTCH image acquisition component includes a NOTCH image acquisition camera, and the NOTCH image acquisition camera is aligned with the edge of the wafer located at the inspection station from one side of the wafer; The edge image detection component includes an upper edge camera, a lower edge camera and a wafer detection area, the edge of the wafer located at the detection station is located in the wafer detection area, and the upper edge camera and the lower edge camera are tilted and aligned with the edge of the wafer located in the wafer detection area; The NOTCH image acquisition assembly includes an upper light source, a lower light source and a side light source, wherein the upper light source and the lower light source are arranged in an eight-shaped manner above and below the edge of the wafer, and the side light source is located on a side close to the NOTCH image acquisition camera. A shooting hole is provided on the side light source, and the shooting field of view of the NOTCH image acquisition camera is aligned with the shooting hole; The edge image detection component includes an arc light source, one end of which has an opening. When the wafer moves to the detection station, the edge of the wafer enters the wafer detection area in the arc light source from the opening.

2. A wafer NOTCH positioning and edge detection device according to claim 1, characterized in that: It also includes a wafer regularization assembly and a Z-axis module, wherein the Z-axis module is located at the loading and unloading stations, the wafer regularization assembly is installed on the Z-axis module, and the Z-axis module drives the wafer regularization assembly to move up and down, the wafer regularization assembly includes multiple wafer support seats and multiple PIN rods, the multiple wafer support seats are used to support the edges of the wafers, and the multiple PIN rods move toward the wafer until the wafer is restricted to a preset position. The Z-axis module lowers the wafer at a preset position onto the suction plate for positioning through the wafer regularization assembly, and then drives the wafer to move in a straight line to the detection station via the X-axis module.

3. A wafer NOTCH positioning and edge detection device according to claim 2, characterized in that: The wafer aligning assembly includes a U-shaped bracket, the wafer suction rotation assembly is located in the U-shaped opening of the U-shaped bracket, multiple wafer support seats are arranged on the U-shaped bracket, and multiple wafer support seats are located around the U-shaped opening. A PIN rod driving assembly is provided on the U-shaped bracket, and the PIN rod driving assembly drives multiple PIN rods to move toward the wafer direction.

4. The wafer NOTCH positioning and edge detection device according to claim 3, characterized in that: The PIN rod driving assembly includes a left movable arm and a right movable arm, wherein a PIN rod is vertically installed on the left movable arm and the right movable arm, and the left movable arm and the right movable arm are horizontally slidably installed on a U-shaped bracket, and the sliding direction of the left movable arm and the right movable arm is perpendicular to the moving direction of the wafer suction rotation assembly. A turntable is provided on the U-shaped bracket, and the turntable is located between the driving ends of the left movable arm and the right movable arm, the turntable is connected to the left movable arm through a first connecting arm, and the turntable is connected to the right movable arm through a second connecting arm. A motor is installed on the U-shaped bracket, and an eccentric wheel is provided on the output shaft of the motor. The eccentric wheel drives the left movable arm or the right movable arm to slide horizontally, and a first elastic member and a second elastic member are respectively provided between the driving end of the left movable arm and the U-shaped bracket and between the driving end of the right movable arm and the U-shaped bracket.

5. The wafer NOTCH positioning and edge detection device according to claim 4, characterized in that: A travel sensor is provided on the U-shaped bracket, and a travel baffle is provided on the left movable arm or the right movable arm. When the left movable arm or the right movable arm slides horizontally, the travel baffle passes through the sensing area of ​​the travel sensor.

6. The wafer NOTCH positioning and edge detection device according to claim 4, characterized in that: A connecting arm is provided on the left movable arm or the right movable arm, a bearing is provided on the connecting arm, and the eccentric wheel is in rolling cooperation with the bearing.

7. The wafer NOTCH positioning and edge detection device according to claim 1, characterized in that: The NOTCH image acquisition assembly includes a slide base plate, a mounting base plate, a mounting side plate, an upper L-shaped adjustment plate, an upper light source height adjustment assembly, a lower L-shaped adjustment plate, a lower light source height adjustment assembly and a camera mounting frame, a first slide is provided between the slide base plate and the mounting base plate, the lower end of the mounting side plate is fixedly connected to the mounting base plate and the two are L-shaped, the upper L-shaped adjustment plate is arranged at the upper end of the mounting side plate, the lower L-shaped adjustment plate is arranged at the upper end of the mounting base plate, the upper L-shaped adjustment plate and the lower L-shaped adjustment plate are both provided with X-direction strip holes and Y-direction strip holes, the Y-direction strip holes on the upper L-shaped adjustment plate are adjustably fixedly connected to the upper end of the mounting side plate through fasteners, the X-direction strip holes on the upper L-shaped adjustment plate are adjustably fixedly connected to the upper light source height adjustment assembly through fasteners, and the upper light source is tiltedly installed on the upper light source height adjustment assembly; The Y-direction strip hole on the lower L-shaped adjustment plate is adjustably fixedly connected to the upper end of the mounting base plate through a fastener, and the X-direction strip hole on the lower L-shaped adjustment plate is adjustably fixedly connected to the lower light source height adjustment assembly through a fastener, and the lower light source is tiltedly installed on the lower light source height adjustment assembly; The mounting side plate is provided with an arc-shaped slide, and the camera mounting frame includes a first slide base plate, a second slide base plate, a slide connecting plate and a camera mounting seat. The first slide base plate is L-shaped, and the side plate of the first slide base plate is adjustably slidably matched with the arc-shaped slide through a sliding member. A second slide is provided between the back plate of the first slide base plate and the second slide base plate, one side of the second slide base plate is fixedly connected to the slide connecting plate, and the slide connecting plate extends toward the rear. A third slide is provided between the inner side of the slide connecting plate and the camera mounting seat, and the NOTCH image acquisition camera is installed on the camera mounting seat.

8. The wafer NOTCH positioning and edge detection device according to claim 1, characterized in that: The edge image detection component comprises a vertical plate and an upper camera adjustment component, a lower camera adjustment component and a light source adjustment component arranged on the vertical plate, the upper edge camera and the lower edge camera are respectively mounted on the upper camera adjustment component and the lower camera adjustment component, the upper camera adjustment component and the lower camera adjustment component both comprise a bottom plate, a connecting plate, a first L-shaped connecting plate, a second L-shaped connecting plate and a camera mounting plate, the vertical plate is symmetrically provided with an upper arc adjustment rail and a lower arc adjustment rail, the bottom plate is adjustably slidably matched with the corresponding upper arc adjustment rail or the lower arc adjustment rail, the connecting plate is obliquely fixed to the bottom plate, a first slide assembly is arranged between the connecting plate and the first L-shaped connecting plate, a second slide assembly is arranged between the end plate of the first L-shaped connecting plate facing forward and the second L-shaped connecting plate, one side of the second L-shaped connecting plate is fixedly connected to the camera mounting plate, the upper edge camera and the lower edge camera are respectively mounted on the corresponding camera mounting plates; The light source adjustment assembly includes a light source base plate, a first connecting plate, a second connecting plate, a first L-shaped light source connecting plate, a second L-shaped light source connecting plate and a light source connecting plate, a first light source slide is provided between the light source base plate and the first connecting plate, the first connecting plate is fixedly connected to the second connecting plate at one end close to the light source, a second light source slide is provided between the second connecting plate and the first L-shaped light source connecting plate, a third light source slide is provided between the horizontal end plate of the first L-shaped light source connecting plate and the second L-shaped light source connecting plate, a fourth light source slide is provided between the vertical plate of the second L-shaped light source connecting plate and the light source connecting plate, and the arc-shaped light source is fixedly mounted on the light source connecting plate.

Images