Multi-chip heat dissipation device, system and heat dissipation control method

Abstract

The present disclosure provides a multi-chip heat dissipation device, system, and heat dissipation control method. The device includes at least two vapor chambers, each of which is used to dissipate heat from a chip module. The evaporation zones of the two vapor chambers are connected via a first conductive pipe, and the condensation zones of the two vapor chambers are connected via a second conductive pipe. The device uses the first conductive pipe to transport a phase-change working fluid from the evaporation zone of the vapor chamber corresponding to a low-power chip module to the evaporation zone of the vapor chamber corresponding to a high-power chip module. The second conductive pipe transports the phase-change working fluid from the condensation zone of the vapor chamber corresponding to the high-power chip module to the condensation zone of the vapor chamber corresponding to the low-power chip module. This device not only ensures the safe and stable operation of multiple chip modules, but also solves the problem of wasting excess cooling capacity and excess heat dissipation capacity in the vapor chamber.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of electronic devices, and in particular to a multi-chip heat dissipation device, system and heat dissipation control method. Background Art

[0002] With the continuous development of semiconductor technology, the integration and power consumption density of chips are gradually increasing. If the heat generated by the chip cannot be effectively transferred to the outside world, heat will accumulate inside the chip and the temperature will rise, resulting in reduced device reliability, shortened chip service life, increased power consumption and other problems.

[0003] Currently, vapor chambers can be used to cool chips. However, as chip power consumption continues to increase, even with vapor chambers, the heat dissipation performance of the vapor chamber may not be sufficient to meet chip cooling requirements. While other methods can be used to improve the heat dissipation performance of vapor chambers, these either require additional space for a radiator or increase the number of heat exchanges, resulting in higher thermal resistance in the chip cooling system. Summary of the Invention

[0004] According to one aspect of the present disclosure, a multi-chip heat dissipation device is provided, comprising: at least two heat sinks, each of the heat sinks being used to dissipate heat for a chip module, the heat sinks having an evaporation zone and a condensation zone therein, the multi-chip heat dissipation device further comprising a conducting pipe group, the conducting pipe group being arranged between every two of the heat sinks, each of the conducting pipe groups comprising a first conducting pipe and a second conducting pipe, the evaporation zones of every two heat sinks being connected via the first conducting pipe, and the condensation zones of every two heat sinks being connected via the second conducting pipe.

[0005] According to another aspect of the present disclosure, a multi-chip heat dissipation system is provided, comprising the multi-chip heat dissipation device of the present application, at least one chip module, and at least one heat sink module;

[0006] The multi-chip heat dissipation device comprises a heat dissipation plate having a hot surface at a portion of its outer surface close to the evaporation zone, and a cold surface at a portion of its outer surface close to the condensation zone;

[0007] Each of the chip modules is provided on a hot surface corresponding to the outer surface of the vapor chamber, and each of the heat sink modules is provided on a cold surface corresponding to the outer surface of the vapor chamber;

[0008] According to another aspect of the present disclosure, a heat dissipation control method is provided, which is applied to the multi-chip heat dissipation system described in this application. The method includes:

[0009] Acquiring temperature information of chip modules corresponding to the two vapor chambers, wherein a conducting pipe group is provided between the two vapor chambers;

[0010] When it is determined based on the temperature information of the chip modules corresponding to the two heat spreaders that the chip modules corresponding to the two heat spreaders include a low-power chip module and a high-power module, the first conductive pipeline is controlled to transport the phase change working fluid in the evaporation zone of the heat spreader corresponding to the low-power chip module to the evaporation zone of the heat spreader corresponding to the high-power chip module, and the second conductive pipeline is controlled to transport the phase change working fluid in the condensation zone of the heat spreader corresponding to the high-power chip module to the condensation zone of the heat spreader corresponding to the low-power chip module.

[0011] In one or more technical solutions provided in this application, each conductive pipeline group includes a first conductive pipeline and a second conductive pipeline. The evaporation areas of each two vapor chambers are connected through the first conductive pipeline, and the condensation areas of each two vapor chambers are connected through the second conductive pipeline. If the chip module corresponding to one of the vapor chambers is a high-power chip module, it means that the phase change medium temperature of the vapor chamber corresponding to the high-power chip module is relatively high, making it difficult to effectively cool the high-power chip module. If the chip module corresponding to the other vapor chamber is a low-power chip module, it means that the phase change medium temperature of the vapor chamber corresponding to the low-power chip module is particularly low, which can not only effectively cool the low-power chip module, but also has a large amount of surplus cooling capacity and surplus heat dissipation capacity available for use. Based on this, the first conducting pipe can be used to transport the phase change working medium in the evaporation zone of the heat spreader corresponding to the low-power chip module to the evaporation zone of the heat spreader corresponding to the high-power chip module, thereby reducing the temperature of the phase change working medium in the evaporation zone of the heat spreader corresponding to the high-power chip module, so that the heat spreader corresponding to the high-power chip module can effectively cool the high-power chip. At the same time, the second conducting pipe can be used to transfer the phase change working medium in the condensation zone of the heat spreader corresponding to the high-power chip module to the condensation zone of the heat spreader corresponding to the low-power chip module, thereby using the heat spreader corresponding to the low-power chip module to dissipate heat, thereby reducing the heat dissipation pressure of the heat spreader corresponding to the high-power chip module. It can be seen that the multi-chip heat dissipation device of the present application can expand the scope of use of the multi-chip heat dissipation device and reduce the comprehensive heat exchange thermal resistance without increasing too much space and the number of heat exchanges.

[0012] Moreover, the present application can fully utilize the surplus cooling capacity and surplus heat dissipation capacity of the heat spreader corresponding to the low-power chip module through the first conductive pipe and the second conductive pipe through the heat spreader corresponding to the high-power chip module. This can not only ensure the safe and stable operation of the chip modules corresponding to different heat spreaders, but also solve the problem of waste of surplus cooling capacity and surplus heat dissipation capacity in some heat spreaders.

[0013] In addition, the evaporation areas of each two heat spreaders in the present application are connected through a first conductive pipe, and the condensation areas of each two heat spreaders are connected through a second conductive pipe. Therefore, the multi-chip heat dissipation device of the present application can not only be applied to scenarios with various chip module layout distances. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Further details, features and advantages of the present disclosure are disclosed in the following description of exemplary embodiments in conjunction with the accompanying drawings, in which:

[0015] Figure 1 A schematic diagram of an application scenario of a multi-chip heat dissipation device using two vapor chambers as an example is shown in an embodiment of the present application;

[0016] Figure 2 A partial structural diagram of a multi-chip heat dissipation device using two vapor chambers as an example in an embodiment of the present application is shown;

[0017] Figure 3 An exemplary structural diagram of a multi-chip heat dissipation device using two vapor chambers as an example is shown;

[0018] Figure 4 A schematic structural diagram of a controllable drive device according to an embodiment of the present application is shown;

[0019] Figure 5 A schematic structural diagram of a multi-chip heat dissipation device using four vapor chambers as an example is shown in an embodiment of the present application;

[0020] Figure 6 A schematic diagram of the heat dissipation control method according to an embodiment of the present application is shown;

[0021] Figure 7 shows a schematic block diagram of functional modules of a heat dissipation control device according to an exemplary embodiment of the present disclosure;

[0022] Figure 8 shows a schematic block diagram of a chip according to an exemplary embodiment of the present disclosure;

[0023] Figure 9 A structural block diagram of an exemplary electronic device that can be used to implement the embodiments of the present disclosure is shown. DETAILED DESCRIPTION

[0024] The following describes embodiments of the present disclosure in more detail with reference to the accompanying drawings. Although certain embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be construed as limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the present disclosure. It should be understood that the drawings and embodiments of the present disclosure are for illustrative purposes only and are not intended to limit the scope of protection of the present disclosure.

[0025] It should be understood that the various steps described in the method embodiments of the present disclosure may be performed in different orders and / or in parallel. In addition, the method embodiments may include additional steps and / or omit the steps shown. The scope of the present disclosure is not limited in this respect.

[0026] The term "including" and its variations used in this document are open inclusions, that is, "including but not limited to". The term "based on" means "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment"; the term "some embodiments" means "at least some embodiments". The relevant definitions of other terms will be given in the description below. It should be noted that the concepts of "first", "second", etc. mentioned in this disclosure are only used to distinguish different devices, modules or units, and are not used to limit the order or interdependence of the functions performed by these devices, modules or units.

[0027] It should be noted that the modifications of "one" and "multiple" mentioned in the present disclosure are illustrative rather than restrictive, and those skilled in the art should understand that unless otherwise clearly indicated in the context, they should be understood as "one or more".

[0028] To ensure stable and efficient data center operations, a robust thermal management system is required, from chips to servers to infrastructure. Thermal management at the electronic component level, particularly at the chip level, is crucial. However, with the continuous advancement of semiconductor technology, chip integration and power density are increasing, posing significant challenges to chip thermal management.

[0029] In practical applications, if the heat generated by the chip cannot be effectively transferred to the outside world, it will cause heat accumulation inside the chip, resulting in increased temperature, reduced device reliability, shortened chip lifespan, and increased power consumption. As operating temperature rises, the failure rate of electronic equipment increases almost exponentially. At 70°C to 80°C, the reliability of electronic equipment decreases by 5% for every 1°C increase in temperature. Data shows that over 55% of electronic product failures are caused by excessively high operating temperatures, so it is crucial to keep chip temperatures within acceptable levels.

[0030] At present, the chip can be cooled by using a vapor chamber, which can be understood as a variant cooling form of a heat pipe. However, with the development of technologies such as intelligent computing and supercomputing, chip power consumption continues to increase. Even with the combination of a vapor chamber, the heat dissipation performance may not be able to meet the demand. On the one hand, the heat absorbed by the vapor chamber can be exported to other locations for heat dissipation at other locations. These methods require additional space to install the radiator, and are less applicable in servers and highly integrated electrical systems. On the other hand, heat pipes, liquid metals, etc. can be used to realize the export of heat from the vapor chamber, but this adds one heat exchange, resulting in a higher comprehensive heat exchange thermal resistance of the chip heat exchange system.

[0031] The inventors discovered that for multiple chips, the load rates of different chips within a server can also vary. Under most operating conditions, only a few chips operate at high power, while the rest maintain low power. In this case, the cooling system corresponding to the low-power chips has a large excess heat dissipation capacity, resulting in waste. When multiple chips are integrated into a heat spreader and cooled using a single cooling system, this solution is only suitable for scenarios where the chips are arranged compactly and cannot be applied to scenarios where the individual chips are spaced far apart.

[0032] To address the above issues, embodiments of the present application provide a multi-chip heat dissipation device and system that can be widely used in data center electronic equipment heat dissipation or other electronic device heat dissipation fields. Embodiments of the present application utilize a multi-chip heat dissipation device to dissipate heat for different chip modules, ensuring that each chip module has high heat exchange efficiency, thereby ensuring the safe and stable operation of the multi-chip heat dissipation system and being applicable to scenarios where chip modules are arranged at various distances.

[0033] The multi-chip heat dissipation device of the embodiment of the present application may include at least two heat sinks, each heat sink is used to dissipate heat for the chip module. The chip module here may include one chip or multiple chips. Each heat sink may include a shell, a capillary structure and a phase change medium. The capillary structure may be arranged in the shell, the phase change medium is filled in the shell, and the phase change medium can be adsorbed on the capillary structure. In addition, the heat sink may also include one or more support columns arranged in the shell, and the support columns can be arranged in the capillary structure as the skeleton of the capillary structure.

[0034] Exemplarily, the shell may include an upper shell and a lower shell, and the upper shell and the lower shell may be snapped together to form a sealed internal cavity. When the upper shell and the lower shell are snapped together, the upper shell and the lower shell may be welded together by welding (brazing), and one end of the capillary structure may be sintered to the inner wall of the lower shell, and the other end of the capillary structure may be sintered to the inner wall of the upper shell. When the support column is provided in the capillary structure as a skeleton of the capillary structure, one end of the support column may be sintered to the inner wall of the lower shell, and the other end of the support column may be sintered to the inner wall of the upper shell.

[0035] For example, the vapor chamber may have opposing upper and lower surfaces. The chip module may be disposed on the lower surface of the vapor chamber, while the heat sink module may be disposed on the upper surface. In this case, the vapor chamber has an evaporation zone and a condensation zone. For example, the area of ​​the internal cavity near the lower surface may be defined as the evaporation zone, while the area of ​​the internal cavity near the upper surface may be defined as the condensation zone.

[0036] Exemplarily, the above-mentioned heat spreader can be provided with an evaporation zone interface and a condensation zone interface. The evaporation zone interfaces of each two heat spreaders can be connected through the first conductive pipe included in the corresponding conductive pipe group, and the condensation zone interfaces of each two heat spreaders can be connected through the second conductive pipe included in the corresponding conductive pipe group.

[0037] The internal cavity of the heat spreader in the embodiment of the present application is a low vacuum environment. When the chip module is running, the liquid phase change working fluid in the evaporation zone of the heat spreader corresponding to the chip module can absorb the heat emitted by the chip module, causing the liquid phase change working fluid in the evaporation zone to absorb heat and turn into a gaseous phase change working fluid. The gaseous phase change working fluid can quickly diffuse into the entire internal cavity. When the gaseous phase change working fluid diffuses to the condensation zone, it can release heat in the condensation zone and turn into a liquid phase change working fluid, and release heat through the corresponding heat sink module. The condensed liquid phase change working fluid returns to the evaporation zone due to the capillary adsorption effect of the capillary structure. This process will be repeated in the internal cavity. Such a cycle can bring the heat generated by the chip module out to the external environment, playing a good role in heat conduction and temperature equalization.

[0038] The inventors discovered that the load rate of a data center is generally less than 30%, and the load rate within a server can also vary. Therefore, under most operating conditions, only a few chips operate at high power, while other chips maintain low power operation. Therefore, when the chip module corresponding to one of the heat sinks is a high-power chip module and the chip module corresponding to the other heat sink is a low-power chip module, the temperature of the high-power chip module is higher than that of the low-power chip module. In this case, the multi-chip heat dissipation device of the embodiment of the present application may further include a conductive pipe group, the number of which can be set according to actual conditions. For example, when a conductive pipe group can be set between every two heat sinks, the two heat sinks provided with the conductive pipe group can be adjacent to each other or not.

[0039] Each conductive pipe group includes a first conductive pipe and a second conductive pipe. The evaporation areas of each two vapor chambers are connected via the first conductive pipe, and the condensation areas of each two vapor chambers are connected via the second conductive pipe. In other words, two vapor chambers in a conductive pipe group can correspond to one conductive pipe group.

[0040] When the chip module corresponding to one of the heat spreaders is a high-power chip module and the chip module corresponding to the other heat spreader is a low-power chip module, the first conducting pipe is used to transport the phase change working fluid in the evaporation zone of the heat spreader corresponding to the low-power chip module to the evaporation zone of the heat spreader corresponding to the high-power chip module, and the second conducting pipe is used to transport the phase change working fluid in the condensation zone of the heat spreader corresponding to the high-power chip module to the condensation zone of the heat spreader corresponding to the low-power chip module.

[0041] Figure 1The following is a schematic diagram showing an application scenario of a multi-chip heat dissipation device using two heat sinks as an example. Figure 1 As shown, the multi-chip heat dissipation device 100 of the embodiment of the present application may include a first heat spreader 101A and a second heat spreader 102A. The chip module corresponding to the first heat spreader 101A is the first chip module 101B, and the chip module corresponding to the second heat spreader 102A is the second chip module 102B. The heat sink module corresponding to the first heat spreader 101A is the first heat sink module 101C, and the heat sink module corresponding to the second heat spreader 102A is the second heat sink module 102C.

[0042] like Figure 1 As shown, the phase-change working medium flow direction of the first conductive line 103A and the phase-change working medium flow direction of the second conductive line 103B in the embodiment of the present application vary depending on the power consumption type (low power consumption, high power consumption) of the first chip module 101B and the second chip module 102B. When the first chip module 101B is a high-power chip module and the second vapor chamber 102A is a low-power chip module, the phase-change working medium flow direction of the first conductive line 103A flows from the second vapor chamber 102A to the first vapor chamber 101A, and the phase-change working medium flow direction of the second conductive line 103B flows from the first vapor chamber 101A to the second vapor chamber 102A. When the first chip module 101B is a low-power chip module and the second chip module 102B is a high-power chip module, the phase-change medium in the first conducting pipe 103A flows from the first heat spreader 101A to the second heat spreader 102A, and the phase-change medium in the second conducting pipe 103B flows from the second heat spreader 102A to the first heat spreader 101A.

[0043] The following takes the first chip module as a high-power chip module and the second chip module as a low-power chip module as an example to illustrate the specific implementation process of the multi-chip heat dissipation device of the embodiment of the present application.

[0044] like Figure 1 As shown, when first chip module 101B is a high-power chip module and second chip module 102B is a low-power chip module, the temperature of the phase-change working fluid in first vapor chamber 101A is relatively high, while the temperature of the phase-change working fluid in the evaporation zone of second vapor chamber 102A is particularly low. Therefore, the internal vapor partial pressure of first vapor chamber 101A is greater than the internal vapor partial pressure of second vapor chamber 102A. In this case, the internal vapor partial pressure difference between first vapor chamber 101A and second vapor chamber 102A can be used as the power for transporting the phase-change working fluid. The liquid phase-change working fluid in the evaporation zone of second vapor chamber 102A is actively transported to the liquid phase-change working fluid in the evaporation zone of first vapor chamber 101A via first conductive pipe 103A, while the gaseous phase-change working fluid in the condensation zone of first vapor chamber 101A can be actively transported to the condensation zone of second vapor chamber 102A via second conductive pipe 103B.

[0045] like Figure 1 As shown, when first chip module 101B is a high-power chip module and second chip module 102B is a low-power chip module, it means that first vapor chamber 101A is unable to effectively cool first chip module 101B. First heat sink module 101C has a large heat dissipation pressure and cannot fully release the heat of the phase-change working medium in the condensation zone of first vapor chamber 101A. Second vapor chamber 102A can not only effectively cool second chip module 102B, but also has a large amount of surplus cooling capacity and surplus heat dissipation capacity to be utilized, and the heat dissipation pressure of second heat sink module 102C is not large. Based on this, first conductive pipe 103A can be used to transport the phase-change working medium in the evaporation zone of second vapor chamber 102A to the evaporation zone of first vapor chamber 101A, thereby reducing the temperature of the phase-change working medium in the evaporation zone of first vapor chamber 101A, so that first vapor chamber 101A can use the surplus cooling capacity of second vapor chamber 102A to effectively cool first chip module 101B. At the same time, the second conducting pipe 103B can be used to transport the phase change working medium in the condensation area of ​​the first heat sink 101A to the condensation area of ​​the second heat sink 102A, so that the first chip module 101B can use the second heat sink module 102C to dissipate heat, thereby reducing the heat dissipation pressure of the first heat sink module 101C.

[0046] It can be seen that the embodiment of the present application transfers and balances the heat dissipation capacity of different heat sinks, so that the heat dissipation capacity of the multi-chip heat dissipation device 100 can be fully utilized, ensuring effective cooling of each chip module and ensuring that multiple chip modules can operate safely and stably.

[0047] At the same time, if Figure 1 As shown, second conducting pipe 103B can be used to transfer the phase-change working fluid from the condensation zone of first vapor chamber 101A to the condensation zone of second vapor chamber 102A, thereby utilizing second vapor chamber 102A for heat dissipation. The heat of the phase-change working fluid from the second heat sink is then released via second heat sink module 102C, thereby reducing the heat dissipation pressure on first vapor chamber 101A. Thus, the multi-chip heat dissipation device 100 of the present embodiment can expand its application range and reduce the overall heat exchange resistance without requiring excessive space or heat exchange frequency.

[0048] Moreover, if Figure 1 As shown, the embodiment of the present application can fully utilize the surplus cooling capacity and surplus heat dissipation capacity of the second heat spreader 102A through the first heat spreader 101A and the second heat spreader 103B. This can not only ensure the safe and stable operation of the first chip module 101B, but also solve the problem of waste of surplus cooling capacity and surplus heat dissipation capacity in the second heat spreader 102A.

[0049] In addition, if Figure 1As shown, the evaporation zones in the first heat spreader 101A and the second heat spreader 102A of the embodiment of the present application are connected via a first conductive pipe 103A, and the condensation zones in the first heat spreader 101A and the second heat spreader 102A are connected via a second conductive pipe 103B. Therefore, the multi-chip heat dissipation device 100 of the embodiment of the present application can be applicable to scenarios with various chip module arrangement distances.

[0050] When the chip module corresponding to the heat spreader includes multiple chips, the heat spreader can be responsible for the heat dissipation of multiple chips. Compared with the heat spreader being responsible for the heat dissipation of one chip, the heat spreader being responsible for the heat dissipation of multiple chips can effectively reduce the number of heat spreaders in the multi-chip heat dissipation equipment, thereby reducing the total area of ​​the heat spreader and reducing investment costs.

[0051] In a possible implementation, the evaporation zone is provided with a first liquid absorption structure, and the condensation zone can be provided with a hydrophobic surface structure. Figure 1 As shown, the evaporation area of ​​the first heat spreader 101A can be provided with a first liquid absorbent core 101A1, and the condensation area of ​​the first heat spreader 101A can be provided with a first hydrophobic surface structure 101A2; the evaporation area of ​​the second heat spreader 102A can be provided with a second liquid absorbent core 102A1, and the condensation area of ​​the second heat spreader 102A can be provided with a second hydrophobic surface structure 102A2.

[0052] In the case of the above specific embodiment, after the gaseous phase change medium is condensed in the condensation area of ​​the heat plate, the hydrophobic surface structure will not absorb the liquid phase change medium. Figure 1 As shown, when the second conducting pipe 103B transfers the phase change medium in the condensation zone of the first vapor chamber 101A to the condensation zone of the second vapor chamber 102A, the phase change medium in the condensation zone of the first vapor chamber 101A can be better transferred to the condensation zone of the second vapor chamber 102A.

[0053] In one possible implementation, a first liquid absorption structure is provided in the evaporation zone of the embodiment of the present application, and a second liquid absorption structure is also provided in the first conducting pipe. The two ends of the second liquid absorption structure are respectively connected to two adjacent evaporation zones, and are used to assist in driving the liquid working medium to flow between the evaporation zones of the two heat sinks.

[0054] Illustratively, the first and second liquid-absorbing structures of the embodiments of the present application may be liquid-absorbing cores, which may be high-temperature resistant porous structures, such as high-temperature resistant liquid-absorbing fibers or high-temperature resistant sponges. The material of the high-temperature resistant porous structure may be selected according to the phase change working fluid.

[0055] Figure 2 A partial structural diagram of a multi-chip heat dissipation device using two heat sinks as an example is shown in the embodiment of the present application. Figure 2As shown, the evaporation area of ​​the first vapor chamber 101A and the evaporation area of ​​the second vapor chamber 102A in the embodiment of the present application are both provided with a first liquid wick structure. For example, a first liquid wick 101A1 can be provided in the evaporation area of ​​the first vapor chamber 101A, and a second liquid wick 102A1 can be provided in the evaporation area of ​​the second vapor chamber 102A.

[0056] like Figure 2 As shown, a second liquid absorbing structure 104 is provided within the first conducting conduit 103A of the embodiment of the present application. When the first chip module 101B is a high-power chip module and the second chip module 102B is a low-power chip module, during the operation of the first chip module 101B and the second chip module 102B, the liquid phase-change working fluid in the evaporation zone of the first vapor chamber 101A can absorb the heat emitted by the first chip module 101B and lock it through the first liquid wick 101A1. The liquid phase-change working fluid in the evaporation zone of the second vapor chamber 102A can absorb the heat emitted by the second chip module 102B and lock it through the second liquid wick 102A1.

[0057] like Figure 2 As shown, when the first conducting pipe 103A transports the phase change medium in the evaporation zone of the second heat spreader 102A to the evaporation zone of the first heat spreader 101A, the liquid phase change medium locked in the second liquid wick 102A1 can be accelerated to be conducted to the first liquid wick 1012A1 with the assistance of the second liquid wick structure 104, so that the first heat spreader 101A can better utilize the surplus cooling capacity of the second heat spreader 102A.

[0058] It can be seen that the embodiment of the present application can use multiple heat sinks to cool different chip modules. Every two heat sinks can be connected by a conductive pipe group, so that the multi-chip heat dissipation device can be applied not only to multiple chip modules with a compact arrangement, but also to multiple chip modules with a loose arrangement. Since the two ends of the second liquid absorption structure are respectively connected to the two adjacent evaporation zones, the embodiment of the present application can improve the diffusion capacity of the phase change working medium in the evaporation zone of the heat sink corresponding to the low-power chip module through the second liquid absorption structure. In addition, when the embodiment of the present application integrates multiple chip modules into multiple heat sinks of relatively small size, it can reduce the waste of heat sink materials and reduce the investment cost of the multi-chip heat dissipation device.

[0059] In a possible implementation, the first conducting pipe and the second conducting pipe included in each conducting pipe group in the embodiment of the present application may not be provided with any driving device, but the difference in internal vapor partial pressure of different vapor chambers is used as the driving force.

[0060] In practical applications, the two vapor chambers connected by the conductive piping group can be defined as the first vapor chamber and the second vapor chamber. When the temperature difference between the phase change medium of the first vapor chamber and the phase change medium of the second vapor chamber is large, the internal vapor pressure of the first vapor chamber and the internal vapor pressure of the second vapor chamber will differ significantly. Under this internal vapor pressure difference, the conductive piping groups corresponding to the first and second vapor chambers can share excess cooling capacity and excess heat dissipation capacity, thereby ensuring normal heat dissipation of the chip module corresponding to the first vapor chamber and the chip module corresponding to the second vapor chamber, reducing unnecessary waste of cooling capacity and heat dissipation capacity.

[0061] In order to better control the first and second conductive pipes included in the conductive pipe group of the embodiment of the present application, the multi-chip heat dissipation device of the embodiment of the present application may further include a controllable drive device, each of which may include a first controllable drive device, a second controllable drive device, or both. The first controllable drive device included in each controllable drive device is disposed on the first conductive pipe included in the corresponding conductive pipe group, and the second controllable drive device included in each controllable drive device is disposed on the second conductive pipe included in the corresponding conductive pipe group.

[0062] Figure 3 FIG. 1 shows an exemplary structural diagram of a multi-chip heat dissipation device using two heat sinks as an example. Figure 3 As shown, the multi-chip heat dissipation device of the embodiment of the present application includes a first conductive pipe 103A that can be provided with a first controllable driving device 105A, and a second conductive pipe 103B that can be provided with a second controllable driving device 105B.

[0063] In practical applications, the chip modules of the embodiments of the present application can be divided into high-power chip modules, low-power chip modules, and normal-power chip modules according to their power consumption. For example, the chip module type can be determined by setting a high-power chip threshold temperature and a low-power chip threshold. For example, when the temperature of the chip module is greater than the high-power chip threshold temperature, the chip module can be considered a high-power chip module, and when the temperature of the chip module is less than the low-power chip threshold temperature, the chip module can be considered a low-power chip module.

[0064] In some embodiments, as Figure 3 As shown, the first chip module 101B can be determined as a high-power chip module and the second chip module 102B can be determined as a low-power chip module based on the temperature of the first chip module 101B and the temperature of the second chip module 102B. In other embodiments, the first chip module 101B can be determined as a low-power chip module and the second chip module 102B can be determined as a high-power chip module based on the temperature of the first chip module 101B and the temperature of the second chip module 102B.

[0065] like Figure 3 As shown, taking the first chip module 101B as a high-power chip module and the second chip module 102B as a low-power chip module as an example, the first controllable driving device 105A can be controlled to conduct the first conductive pipe 103A, so that the first conductive pipe 103A transports the phase change working fluid in the evaporation zone of the second heat spreader 102A to the evaporation zone of the first heat spreader 101A, and the second controllable driving device 105B can be controlled to conduct the second conductive pipe 103B, so that the second conductive pipe 103B transports the phase change working fluid in the condensation zone of the first heat spreader 101A to the condensation zone of the second heat spreader 102A.

[0066] In an optional manner, the first controllable drive device and the second controllable drive device of the embodiment of the present application can be ordinary valves or drive pumps. The ordinary valves or drive pumps here are only used to control the on-off of the pipeline and are not directional. In this case, when the first conductive pipeline and the second conductive pipeline are connected, the driving force of the phase change working medium flow in the first conductive pipeline and the second conductive pipeline is determined by the internal vapor partial pressure of the two heat sinks and the internal vapor partial pressure pressure difference. As for the function of the valve of the first conductive pipeline and the valve of the second conductive pipeline, they are only used to open and close the first conductive pipeline and the second conductive pipeline.

[0067] In one embodiment, the first and second controllable drive devices of the present application may be bidirectional drive devices, which may be bidirectional valves or bidirectional pumps. In this case, the bidirectional drive devices can not only control the on-off state of the pipeline but also control the flow direction of the phase-change working fluid in the pipeline.

[0068] When the chip module corresponding to the first heat spreader is a high-power chip module and the chip module corresponding to the second heat spreader is a low-power chip module, the first bidirectional driving device can be controlled to conduct the first conducting pipe along the direction from the second heat spreader to the first heat spreader, and the second bidirectional driving device can also be controlled to conduct the second conducting pipe along the direction from the first heat spreader to the second heat spreader.

[0069] When the chip module corresponding to the first heat spreader is a low-power chip module and the chip module corresponding to the second heat spreader is a high-power chip module, the first bidirectional driving device can be controlled to conduct the second conducting pipeline along the direction from the first heat spreader to the second heat spreader, and the second bidirectional driving device can also be controlled to conduct the second conducting pipeline along the direction from the second heat spreader to the first heat spreader.

[0070] As can be seen, the driving force for the phase-change medium flow in the first and second conductive conduits of the present embodiment is determined by the internal vapor partial pressures of the two vapor chambers and the internal vapor partial pressure differential. The first bidirectional driving device can control the flow direction of the phase-change medium in the first conductive conduit by limiting the conduction direction of the first conductive conduit, ensuring that the first conductive conduit remains conductive while simultaneously controlling the flow direction of the phase-change medium in the first conductive conduit. The second bidirectional driving device can control the flow direction of the phase-change medium in the second conductive conduit by limiting the conduction direction of the second conductive conduit.

[0071] In one alternative, Figure 4 FIG. 1 shows a schematic structural diagram of a controllable drive device according to an embodiment of the present application. Figure 4 As shown, the controllable drive device 400 of the embodiment of the present application may include a four-way valve 401 and a one-way pump 402. The four-way valve 401 can be arranged on a conducting pipe 403. The first interface of the four-way valve 401 and the second interface of the four-way valve 401 can be connected to the conducting pipe 403. The third interface of the four-way valve 401 can be connected to the fourth interface of the four-way valve 401 through the one-way pump 402.

[0072] When the conducting pipeline is the first conducting pipeline, the first controllable driving device includes a first one-way pump and a first four-way valve. The first one-way pump is actually a liquid pump. The first interface of the first four-way valve and the second interface of the first four-way valve are connected to the first conducting pipeline, and the third interface of the first four-way valve is connected to the fourth interface of the first four-way valve through the first one-way pump.

[0073] Illustratively, the first conducting pipeline in an embodiment of the present application may include a first section of liquid pipeline and a second section of liquid pipeline. The evaporation zone interface of the first heat spreader can be connected to the first interface of the first four-way valve through the first section of liquid pipeline, and the second interface of the first four-way valve can be connected to the evaporation zone interface of the second heat spreader through the second section of liquid pipeline.

[0074] When the conducting pipeline is the second conducting pipeline, the second controllable driving device includes a second one-way pump and a second four-way valve. The second one-way pump is actually a steam pump. The first interface of the second four-way valve and the second interface of the second four-way valve are both connected to the second conducting pipeline, and the third interface of the second four-way valve is connected to the fourth interface of the second four-way valve through the second one-way pump.

[0075] Illustratively, the second conducting pipeline of the embodiment of the present application may include a first section of steam pipeline and a second section of steam pipeline. The condensation zone interface of the second heat spreader can be connected to the first interface of the first four-way valve through the first section of steam pipeline, and the second interface of the first four-way valve can be connected to the condensation zone interface of the second heat spreader through the second section of steam pipeline.

[0076] When the chip module corresponding to the first heat spreader is a high-power chip module and the chip module corresponding to the second heat spreader is a low-power chip module, the phase-change working medium in the evaporation zone of the second heat spreader can be controlled to enter the first conducting pipe, and then enter the first four-way valve through the first interface of the first four-way valve, and then flow from the third interface of the first four-way valve to the fourth interface of the first four-way valve under the drive of the first one-way pump, and then return to the first conducting pipe from the second interface of the first four-way valve, and finally enter the evaporation zone of the first heat spreader. At the same time, the phase-change working medium in the condensation zone of the first heat spreader can be controlled to enter the second conducting pipe, and then enter the second four-way pipe through the first interface of the second four-way valve, and then flow from the third interface of the second four-way valve to the fourth interface of the second four-way valve under the drive of the second one-way pump, and then return to the second conducting valve from the second interface of the second four-way valve, and finally enter the condensation zone of the second heat spreader.

[0077] When the chip module corresponding to the first heat spreader is a low-power chip module and the chip module corresponding to the second heat spreader is a high-power chip module, the phase-change working medium in the evaporation zone of the first heat spreader can be controlled to enter the first conducting pipe, and then enter the first four-way valve through the second interface of the first four-way valve, and then flow from the third interface of the first four-way valve to the fourth interface of the first four-way valve under the drive of the first one-way pump, and then return to the first conducting pipe from the first interface of the first four-way valve, and finally enter the evaporation zone of the second heat spreader. At the same time, the phase-change working medium in the condensation zone of the second heat spreader can be controlled to enter the second conducting pipe, and then enter the second four-way valve through the second interface of the second four-way valve, and then flow from the third interface of the second four-way valve to the fourth interface of the second four-way valve under the drive of the second one-way pump, and then return to the second conducting valve from the first interface of the second four-way valve, and finally enter the condensation zone of the first heat spreader.

[0078] As can be seen, the driving force for the phase-change medium flow in the first and second conductive lines of the present embodiment can include the internal vapor partial pressure and pressure difference of the two vapor chambers, as well as the driving force provided by the corresponding one-way pumps. Furthermore, the first four-way valve can limit the flow direction of the first conductive line, ensuring that the first conductive line is conductive while controlling the flow direction of the phase-change medium in the first conductive line. The second four-way valve can limit the flow direction of the second conductive line, ensuring that the second conductive line is conductive while controlling the flow direction of the phase-change medium in the second conductive line.

[0079] In one possible implementation, when the multi-chip heat dissipation device includes more than two heat sinks, every two heat sinks can form a group of heat sinks, and combined with a conductive pipeline group to share surplus cooling and surplus heat dissipation capacity. For example, when the number of heat sinks is four, the first heat sink and the second heat sink can be used as the first group of heat sinks, combined with the first conductive pipeline group to share surplus cooling and surplus heat dissipation capacity, and the third heat sink and the fourth heat sink can be used as the second group of heat sinks, combined with the second conductive pipeline group to share surplus cooling and surplus heat dissipation capacity. Of course, the second heat sink and the third heat sink can also be used as the third group of heat sinks, combined with the third conductive pipeline group to share surplus cooling and surplus heat dissipation capacity, and the first heat sink and the fourth heat sink can also be used as the fourth group of heat sinks, combined with the fourth conductive pipeline group to share surplus cooling and surplus heat dissipation capacity.

[0080] In order to improve the heat dissipation capacity, at least one conductive pipeline group in the embodiment of the present application includes multiple conductive pipeline groups, and the multi-chip heat dissipation device also includes at least one group of distributors, each group of distributors including a first distributor and a second distributor. The first distributor included in each group of distributors can be a liquid distributor, and the first distributor can be provided on the first conductive pipeline included in the at least two conductive pipeline groups. In this case, the first distributor is equivalent to a temporary storage and temperature redistribution device for the phase change working medium in the first conductive pipeline included in the at least two conductive pipeline groups. This can not only increase the overall filling amount of the phase change working medium in the multi-chip heat dissipation device, but also redistribute the temperature of the phase change working medium in different first conductive pipelines by temporarily storing the phase change working medium in different first conductive pipelines.

[0081] Similarly, the second manifold included in each manifold group can be a steam manifold, which can be installed on the second conductive lines included in the at least two conductive line groups. In this case, the second manifold acts as a temporary storage and temperature redistribution device for the phase-change working fluid within the second conductive lines included in the at least two conductive line groups. This not only increases the overall filling volume of the phase-change working fluid in the multi-chip heat sink, but also redistributes the temperature of the phase-change working fluid within different second conductive lines by temporarily storing the phase-change working fluid in different second conductive lines.

[0082] It can be seen that the multi-chip heat dissipation device of the embodiment of the present application can improve the overall heat dissipation capacity of the multi-chip heat dissipation device by increasing the overall phase change working medium and temperature redistribution.

[0083] Figure 5 The schematic diagram of the structure of the multi-chip heat dissipation device using four heat sinks as an example in the embodiment of the present application is shown. Figure 5 As shown, the multi-chip heat dissipation device 500 of the embodiment of the present application may include a first vapor chamber 501 , a second vapor chamber 502 , a third vapor chamber 503 and a fourth vapor chamber 504 .

[0084] like Figure 5 As shown, the evaporation area interface of the above-mentioned first heat spreader 501 can be connected to the evaporation area interface of the second heat spreader 502 through the first liquid pipeline L1, the evaporation area interface of the third heat spreader 503 can be connected to the evaporation area interface of the fourth heat spreader 504 through the second liquid pipeline L2, and the first liquid pipeline L1 and the second liquid pipeline L2 can be connected to the liquid distributor F1.

[0085] like Figure 5 As shown, the condensation zone interface of the above-mentioned first heat spreader 501 is connected to the condensation zone interface of the second heat spreader 502 through the first steam pipe G1, the condensation zone interface of the third heat spreader 503 is connected to the condensation zone interface of the fourth heat spreader 504 through the second steam pipe G2, and the first steam pipe G1 and the second steam pipe G2 can be connected to the steam distributor F2.

[0086] like Figure 5 As shown, when the first chip module corresponding to the first vapor chamber 501 and the third chip module corresponding to the third vapor chamber 503 are both low-power chip modules, and the second chip module corresponding to the second vapor chamber 502 and the fourth chip module corresponding to the fourth vapor chamber 504 are both high-power chip modules, in this case, the evaporation zone phase change working fluid of the first vapor chamber 501 and the evaporation zone phase change working fluid of the third vapor chamber 503 can simultaneously enter the liquid distributor F1 for temperature redistribution. The evaporation zone phase change working fluid flowing out of one outlet of the liquid distributor F1 can enter the second vapor chamber 502 through the first liquid pipeline L1, and the evaporation zone phase change working fluid flowing out of the other outlet of the liquid distributor F1 can enter the fourth vapor chamber 504 through the second liquid pipeline L2.

[0087] like Figure 5 As shown, the condensation zone phase change working fluid of the second heat spreader 502 and the condensation zone phase change working fluid of the fourth heat spreader 504 can simultaneously enter the steam distributor F2 for temperature redistribution, the condensation zone phase change working fluid flowing out of one outlet of the steam distributor F2 can enter the first heat spreader 501 through the first steam pipeline G1, and the condensation zone phase change working fluid flowing out of the other outlet of the steam distributor F2 can enter the third heat spreader 503 through the second steam pipeline G2.

[0088] The present invention also provides a multi-chip heat dissipation system, which may include a multi-chip heat dissipation device, at least two chip modules, and at least two heat sink modules. The multi-chip heat dissipation device may be the multi-chip heat dissipation device described above in the present invention.

[0089] The multi-chip heat dissipation device of the embodiment of the present application includes a heat sink having a hot surface on its outer surface near the evaporation zone, and each chip module is disposed on the hot surface on the outer surface of the corresponding heat sink. The chip module may include a single chip or multiple chips. The outer surface of each heat sink has a cold surface on its outer surface near the condensation zone, and each heat sink module may be disposed on the cold surface on the outer surface of the corresponding heat sink.

[0090] The heat sink module in the embodiments of the present application can be in the form of an air-cooled fin heat sink, a liquid cooling plate, a microchannel heat sink, or the like, or can be in the form of a low-temperature cooling medium. For example, a vapor chamber can be immersed in the low-temperature cooling medium. It should be understood that the structure and material of the heat sink module in the embodiments of the present application are not limited and can be set according to actual circumstances.

[0091] In practical applications, the phase-change medium in the evaporation zone of each vapor chamber in the embodiment of the present application can absorb the heat generated by the corresponding chip module, changing from a liquid phase-change medium to a gaseous phase-change medium. The phase-change medium in the condensation zone of each vapor chamber can dissipate heat through a heat sink module, causing the gaseous phase-change medium to become a liquid phase-change medium and return to the evaporation zone of the corresponding vapor chamber. The beneficial effects of the multi-chip cooling system of the embodiment of the present application can be referenced to the beneficial effects of the multi-chip cooling device described above and will not be detailed here.

[0092] refer to Figure 1 In the embodiment of the present application, the hot surface of the first heat spreader 101A is provided with a first chip module 101B, the cold surface of the first heat spreader 101A is provided with a first heat sink module 101C, the hot surface of the second heat spreader 102A is provided with a second chip module 102B, and the cold surface of the second heat spreader 102A is provided with a second heat sink module 102C.

[0093] In some embodiments, each heat sink module can be integrated onto the cold surface of a vapor chamber. For example, when the vapor chamber housing includes an upper shell and a lower shell, the hot surface of the vapor chamber can be the outer surface of the lower shell, and the vapor chamber's cold laminating film can be the outer surface of the lower shell.

[0094] In other embodiments, the multi-chip heat dissipation system of the present application may further include at least one set of thermally conductive interface structures, each set of thermally conductive interface structures including a first thermally conductive interface structure and a second thermally conductive interface structure. The first thermally conductive interface structure and the second thermally conductive interface structure may be thermally conductive structures with relatively good thermal conductivity, such as heat sinks, phase change metal sheets, etc., or materials with relatively good thermal conductivity, such as silicone grease or thermal adhesive.

[0095] Each chip module is mounted on the hot surface of the corresponding vapor chamber via a first thermal interface structure, thereby reducing the contact thermal resistance between the chip module and the vapor chamber and improving the heat absorption efficiency of the phase change medium in the vapor chamber's evaporation zone. Each heat sink module is mounted on the cold surface of the corresponding vapor chamber via a second thermal interface structure, thereby reducing the contact thermal resistance between the vapor chamber and the heat sink module and improving the heat dissipation capacity of the vapor chamber.

[0096] An embodiment of the present application also provides a heat dissipation control method, which can be executed by an electronic device or a chip applied to an electronic device. The method can flexibly control a multi-chip heat dissipation device, which can have two heat sinks, a first conductive pipe and a second conductive pipe. Figure 6 FIG. 1 shows a flow chart of the heat dissipation control method according to an embodiment of the present application. Figure 6 As shown, the heat dissipation control method of the embodiment of the present application may include:

[0097] Step 601: Obtain temperature information of chip modules corresponding to two vapor chambers, wherein a conductive pipeline group is provided between the two vapor chambers. When the chip module includes multiple chips, the temperature information of the chip module may include the temperatures of the multiple chips.

[0098] Step 602: Based on the temperature information of the chip modules corresponding to the two vapor chambers, determine whether the chip modules corresponding to the two vapor chambers include a low-power chip module and a high-power module.

[0099] In practical applications, the embodiment of the present application determines the temperature of each chip module based on the temperature information of each chip module corresponding to each heat sink. When the temperature of the chip module is greater than the high power consumption threshold temperature of the chip module, the chip module is determined to be a high power consumption chip module. When the temperature of the chip module is less than the low power consumption threshold temperature of the chip module, the power consumption type of the chip module is determined to be a low power consumption chip module. For example, when a chip module includes multiple chips, the temperature of the chip with the highest temperature among the multiple chips included in the same chip module can be obtained from the temperatures of the multiple chips included in the same chip module, and this temperature is defined as the temperature of the chip module.

[0100] Step 603: When the chip modules corresponding to the two heat spreaders include a low-power chip module and a high-power module, control the first conductive pipeline to transport the phase change working fluid in the evaporation zone of the heat spreader corresponding to the low-power chip module to the evaporation zone of the heat spreader corresponding to the high-power chip module, and control the second conductive pipeline to transport the phase change working fluid in the condensation zone of the heat spreader corresponding to the high-power chip module to the condensation zone of the heat spreader corresponding to the low-power chip module.

[0101] In practical applications, a first controllable drive device can be provided in the first conducting conduit, and a second controllable drive device can be provided in the second conducting conduit. When the two chip modules include a low-power chip module and a high-power module, the first conducting conduit can be controlled to conduct and conduct in a certain direction by controlling the first controllable drive device, while the second conducting conduit can be controlled to conduct and conduct in a certain direction by controlling the second controllable drive device.

[0102] For example, based on the temperature information of each chip module corresponding to each heat spreader, the temperature of each chip module is determined. When the temperature of the chip module is greater than the high power consumption threshold temperature of the chip module, the chip module is determined to be a high power consumption chip module; when the temperature of the chip module is less than the low power consumption threshold temperature of the chip module, the chip module is determined to be a low power consumption chip module. Figure 1 For example, the temperature of the first chip module is T1, the temperature of the second chip module is T2, and the high power consumption threshold temperature is T up , the low power consumption threshold temperature is T down .

[0103] When T1<T down , T2>T up , indicating that the first chip module has relatively low power consumption and sufficient heat dissipation, and can be a low-power chip module. The second chip module has relatively high power consumption and heat dissipation close to the limit, and can be a high-power chip module. When the first controllable drive device and the second controllable drive device both include a four-way valve and a one-way pump, the one-way pump included in the first controllable drive device is a liquid pump, and the one-way pump included in the second controllable drive device is a steam pump. The operating state of the four-way valve included in the first controllable drive device can be detected to determine whether the phase-change working medium flow direction in the evaporation zone is from the first vapor chamber to the second vapor chamber. At the same time, the operating state of the four-way valve included in the second controllable drive device can be detected to determine whether the phase-change working medium flow direction in the condensation zone is from the second vapor chamber to the first vapor chamber.

[0104] If the phase change working medium flow direction in the evaporation zone is from the first vapor chamber to the second vapor chamber, and the phase change working medium flow direction in the condensation zone is from the second vapor chamber to the first vapor chamber, the original operating state of the four-way valve is maintained.

[0105] If the phase change working medium flow direction in the evaporation zone changes from the second vapor chamber to the first vapor chamber, the operating state of the four-way valve can be changed so that the phase change working medium flow direction in the evaporation zone changes from the first vapor chamber to the second vapor chamber.

[0106] If the phase change working medium flow direction in the condensation zone changes from the first vapor chamber to the second vapor chamber, the operating state of the four-way valve can be changed so that the phase change working medium flow direction in the condensation zone changes from the second vapor chamber to the first vapor chamber.

[0107] When T2>T up , T1<T down , indicating that the first chip module has low power consumption and sufficient heat dissipation, and can be a low-power chip module. The second chip module has high power consumption and heat dissipation close to the limit, and can be a high-power chip module. In this case, you can refer to T1<T down , T2>T up The operation status of the four-way valve is controlled by the relevant description of down , T2<T down , indicating that the power consumption of the first chip module and the second chip module is relatively low, the heat dissipation is sufficient, and the steam pump and the liquid pump can be turned off to reduce power consumption.

[0108] In one or more technical solutions provided in the embodiments of the present application, each conductive pipe group includes a first conductive pipe and a second conductive pipe, the evaporation areas of each two vapor chambers are connected through the first conductive pipe, and the condensation areas of each two vapor chambers are connected through the second conductive pipe. If the chip module corresponding to one of the vapor chambers is a high-power chip module, this means that the phase change medium temperature of the vapor chamber corresponding to the high-power chip module is relatively high, making it difficult to effectively cool the high-power chip module; if the chip module corresponding to the other vapor chamber is a low-power chip module, this means that the phase change medium temperature of the evaporation area of ​​the vapor chamber corresponding to the low-power chip module is particularly low, which not only can effectively cool the low-power chip module, but also has a large amount of surplus cooling capacity and surplus heat dissipation capacity available for use. Based on this, the first conducting pipe can be used to transport the phase change working medium in the evaporation zone of the heat spreader corresponding to the low-power chip module to the evaporation zone of the heat spreader corresponding to the high-power chip module, thereby reducing the temperature of the phase change working medium in the evaporation zone of the heat spreader corresponding to the high-power chip module, so that the heat spreader corresponding to the high-power chip module can effectively cool the high-power chip. At the same time, the second conducting pipe can be used to transfer the phase change working medium in the condensation zone of the heat spreader corresponding to the high-power chip module to the condensation zone of the heat spreader corresponding to the low-power chip module, so that the heat spreader corresponding to the low-power chip module is used to dissipate heat, thereby reducing the heat dissipation pressure of the heat spreader corresponding to the high-power chip module. It can be seen that the multi-chip heat dissipation device of the embodiment of the present application can expand the scope of use of the multi-chip heat dissipation device and reduce the comprehensive heat exchange thermal resistance without increasing too much space and the number of heat exchange times.

[0109] Moreover, the embodiment of the present application can fully utilize the surplus cooling capacity and surplus heat dissipation capacity of the heat spreader corresponding to the low-power chip module through the first conductive pipe and the second conductive pipe through the heat spreader corresponding to the high-power chip module. This can not only ensure the safe and stable operation of the chip modules corresponding to different heat spreaders, but also solve the problem of waste of surplus cooling capacity and surplus heat dissipation capacity in some heat spreaders.

[0110] In addition, in the embodiment of the present application, the evaporation areas of each two heat sinks are connected through a first conductive pipe, and the condensation areas of each two heat sinks are connected through a second conductive pipe. Therefore, the multi-chip heat dissipation device of the present application can not only be applied to scenarios with various chip module layout distances.

[0111] The above mainly introduces the solution provided by the embodiment of the present disclosure from the perspective of an electronic device. It is understandable that, in order to realize the above functions, the electronic device includes a hardware structure and / or software module corresponding to the execution of each function. Those skilled in the art should easily realize that, in combination with the units and algorithm steps of each example described in the embodiments disclosed herein, the present disclosure can be implemented in the form of hardware or a combination of hardware and computer software. Whether a function is executed in a hardware or computer software driven hardware manner depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present disclosure.

[0112] The embodiments of the present disclosure can divide the functional units of the electronic device according to the above method examples. For example, each functional module can be divided according to each function, or two or more functions can be integrated into one processing module. The above integrated modules can be implemented in the form of hardware or in the form of software functional modules. It should be noted that the division of modules in the embodiments of the present disclosure is schematic and is only a logical function division. In actual implementation, there may be other division methods.

[0113] In the case of dividing each functional module according to each function, the exemplary embodiment of the present disclosure provides a heat dissipation control device, which is applied to the multi-chip heat dissipation system of the embodiment of the present application. The heat dissipation control device can be an electronic device or a chip applied to an electronic device. Figure 7 FIG. 1 shows a schematic block diagram of functional modules of a heat dissipation control device according to an exemplary embodiment of the present disclosure. Figure 7 As shown, the heat dissipation control device 700 includes:

[0114] An acquisition module 701 is configured to acquire temperature information of chip modules corresponding to two vapor chambers, wherein a conducting pipe group is provided between the two vapor chambers;

[0115] The control module 702 is used to control the first conductive line to transport the phase change working fluid in the evaporation zone of the heat spreader corresponding to the low-power chip module to the evaporation zone of the heat spreader corresponding to the high-power chip module, and to control the second conductive line to transport the phase change working fluid in the condensation zone of the heat spreader corresponding to the high-power chip module to the condensation zone of the heat spreader corresponding to the low-power chip module when it is determined based on the temperature information of the chip modules corresponding to the two heat spreaders that the two chip modules include a low-power chip module and a high-power chip module.

[0116] In one possible implementation, the device also includes a processing module 703, which is used to determine the temperature of the chip module corresponding to each heat spreader based on the temperature information of the chip module corresponding to each heat spreader; when the temperature of the chip module corresponding to the heat spreader is greater than the high power consumption threshold temperature of the chip module, the chip module is determined to be a high power consumption chip module; when the temperature of the chip module corresponding to the heat spreader is lower than the low power consumption threshold temperature of the chip module, the chip module is determined to be a low power consumption chip module.

[0117] Figure 8 FIG. 1 shows a schematic block diagram of a chip according to an exemplary embodiment of the present disclosure. Figure 8 As shown, the chip 800 includes one or more (including two) processors 801 and a communication interface 802. The communication interface 802 can support the electronic device to perform the data sending and receiving steps in the above method, and the processor 801 can support the electronic device to perform the data processing steps in the above method.

[0118] Optional, such as Figure 8 As shown, the chip 800 also includes a memory 803, which may include a read-only memory and a random access memory, and provides operation instructions and data to the processor. Part of the memory may also include a non-volatile random access memory (NVRAM).

[0119] In some embodiments, as Figure 8 As shown, the processor 801 performs corresponding operations by calling the operation instructions stored in the memory (the operation instructions may be stored in the operating system). The processor 801 controls the processing operations of any one of the terminal devices, and the processor may also be called a central processing unit (CPU). The memory 803 may include a read-only memory and a random access memory, and provides instructions and data to the processor 801. A portion of the memory 803 may also include NVRAM. For example, in an application, the memory, the communication interface, and the memory are coupled together through a bus system, wherein the bus system may include a power bus, a control bus, and a status signal bus in addition to a data bus. However, for the sake of clarity, in Figure 8 Various buses are labeled as bus system 804 .

[0120] The methods disclosed in the above embodiments of the present disclosure can be applied to or implemented by a processor. The processor may be an integrated circuit chip with signal processing capabilities. During implementation, each step of the above method can be completed by hardware integrated logic circuits in the processor or by software instructions. The above processor may be a general-purpose processor, a digital signal processor (DSP), an ASIC, a field-programmable gate array (FPGA), or other programmable logic device, a discrete gate or transistor logic device, or a discrete hardware component. The methods, steps, and logic block diagrams disclosed in the embodiments of the present disclosure can be implemented or executed. The general-purpose processor may be a microprocessor or any conventional processor. The steps of the methods disclosed in conjunction with the embodiments of the present disclosure can be directly implemented and executed by a hardware decoding processor, or by a combination of hardware and software modules in the decoding processor. The software module can be located in a storage medium well-known in the art, such as random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, registers, etc. The storage medium is located in the memory, and the processor reads the information in the memory and, in conjunction with its hardware, completes the steps of the above method.

[0121] The exemplary embodiments of the present disclosure further provide an electronic device, comprising: at least one processor; and a memory communicatively connected to the at least one processor. The memory stores a computer program executable by the at least one processor, the computer program being configured to cause the electronic device to perform a method according to an exemplary embodiment of the present disclosure when executed by the at least one processor.

[0122] Exemplary embodiments of the present disclosure further provide a non-transitory computer-readable storage medium storing a computer program, wherein the computer program, when executed by a processor of a computer, is used to cause the computer to perform a method according to an embodiment of the present disclosure.

[0123] Exemplary embodiments of the present disclosure further provide a computer program product, including a computer program, wherein when the computer program is executed by a processor of a computer, it is used to cause the computer to perform the method according to the embodiment of the present disclosure.

[0124] refer to Figure 9, a block diagram of an electronic device 900 that can serve as a server or client of the present disclosure will now be described, which is an example of a hardware device that can be applied to various aspects of the present disclosure. The electronic device is intended to represent various forms of digital electronic computer devices, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present disclosure described and / or required herein.

[0125] like Figure 9 As shown, the electronic device 900 includes a computing unit 901, which can perform various appropriate actions and processes according to a computer program stored in a read-only memory (ROM) 902 or a computer program loaded from a storage unit 908 into a random access memory (RAM) 903. Various programs and data required for the operation of the device 900 can also be stored in the RAM 903. The computing unit 901, the ROM 902, and the RAM 903 are connected to each other via a bus 904. An input / output (I / O) interface 905 is also connected to the bus 904.

[0126] like Figure 9 As shown, multiple components within electronic device 900 are connected to I / O interface 905, including an input unit 906, an output unit 907, a storage unit 908, and a communication unit 909. Input unit 906 can be any type of device capable of inputting information into electronic device 900. Input unit 906 can receive input digital or character information and generate key input signals related to user settings and / or function control of the electronic device. Output unit 907 can be any type of device capable of presenting information and may include, but is not limited to, a display, a speaker, a video / audio output terminal, a vibrator, and / or a printer. Storage unit 908 may include, but is not limited to, a magnetic disk or an optical disk. Communication unit 909 allows electronic device 900 to exchange information / data with other devices via computer networks such as the Internet and / or various telecommunication networks, and may include, but is not limited to, a modem, a network card, an infrared communication device, a wireless communication transceiver and / or a chipset, such as a Bluetooth™ device, a WiFi device, a WiMax device, a cellular communication device, and / or the like.

[0127] like Figure 9As shown, the computing unit 901 can be various general and / or special processing components with processing and computing capabilities. Some examples of the computing unit 901 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various computing units that run machine learning model algorithms, digital signal processors (DSPs), and any appropriate processors, controllers, microcontrollers, etc. The computing unit 901 performs the various methods and processes described above. For example, in some embodiments, the method of the embodiment of the present application can be implemented as a computer software program, which is tangibly included in a machine-readable medium, such as a storage unit 908. In some embodiments, part or all of the computer program can be loaded and / or installed on the electronic device 900 via the ROM 902 and / or the communication unit 909. In some embodiments, the computing unit 901 can be configured to perform the method of the embodiment of the present application in any other appropriate manner (e.g., by means of firmware).

[0128] The program code for implementing the method of the present disclosure can be written in any combination of one or more programming languages. These program codes can be provided to a processor or controller of a general-purpose computer, a special-purpose computer, or other programmable data processing device so that when the program code is executed by the processor or controller, the functions / operations specified in the flow chart and / or block diagram are implemented. The program code can be executed entirely on the machine, partially on the machine, as a stand-alone software package, partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0129] In the context of the present disclosure, a machine-readable medium can be a tangible medium that can contain or store a program for use by or in conjunction with an instruction execution system, device or equipment. A machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium can include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or equipment, or any suitable combination of the foregoing. A more specific example of a machine-readable storage medium can include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0130] As used in this disclosure, the terms "machine-readable medium" and "computer-readable medium" refer to any computer program product, apparatus, and / or device (e.g., a magnetic disk, an optical disk, a memory, a programmable logic device (PLD)) for providing machine instructions and / or data to a programmable processor, including machine-readable media that receive machine instructions as machine-readable signals. The term "machine-readable signal" refers to any signal used to provide machine instructions and / or data to a programmable processor.

[0131] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the computer. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0132] The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer having a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include a local area network (LAN), a wide area network (WAN), and the Internet.

[0133] Computer systems may include clients and servers. A client and server are generally remote from each other and typically interact through a communication network. The client and server relationship arises through computer programs running on the respective computers and having a client-server relationship to each other.

[0134] In the above embodiments, they can be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented using software, they can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer programs or instructions. When the computer program or instructions are loaded and executed on a computer, the processes or functions described in the embodiments of the present disclosure are performed in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, a terminal, a user device, or other programmable device. The computer program or instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer program or instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired or wireless means. The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium, such as a floppy disk, a hard disk, or a tape; it can also be an optical medium, such as a digital video disc (DVD); it can also be a semiconductor medium, such as a solid state drive (SSD).

[0135] Although the present disclosure has been described with reference to specific features and embodiments thereof, it will be apparent that various modifications and combinations may be made thereto without departing from the spirit and scope of the present disclosure. Accordingly, this specification and the drawings are merely illustrative of the present disclosure as defined by the appended claims and are deemed to cover any and all modifications, variations, combinations or equivalents within the scope of the present disclosure. Obviously, those skilled in the art may make various modifications and variations to the present disclosure without departing from the spirit and scope of the present disclosure. Thus, the present disclosure is intended to include such modifications and variations if they fall within the scope of the claims of the present disclosure and their equivalents.

Claims

1. A multi-chip heat dissipation device, characterized in that: include: At least two vapor chambers, each of which is used to dissipate heat from the chip module, and each vapor chamber has an evaporation area and a condensation area. The multi-chip heat dissipation device further includes a conductive pipe group, wherein the conductive pipe group is provided between every two vapor chambers, and each conductive pipe group includes a first conductive pipe and a second conductive pipe. The evaporation areas of every two vapor chambers are connected via the first conductive pipe, and the condensation areas of every two vapor chambers are connected via the second conductive pipe. There are multiple conductive pipeline groups, and the multi-chip heat dissipation device further includes a first divider and a second divider; The first distributor is provided on a first conducting line included in at least two of the conducting line groups, and the second distributor is provided on a second conducting line included in at least two of the conducting line groups.

2. The multi-chip heat dissipation device according to claim 1, characterized in that: The evaporation zone is provided with a first liquid absorption structure, and the first conducting pipe is also provided with a second liquid absorption structure. The two ends of the second liquid absorption structure are respectively connected to the two adjacent evaporation zones to assist in driving the liquid working medium to flow between the evaporation zones of the two heat sinks.

3. The multi-chip heat dissipation device according to claim 1, wherein: The two heat spreaders of the conducting pipeline group are arranged to be adjacent two heat spreaders.

4. The multi-chip heat dissipation device according to claim 1, wherein: The multi-chip heat dissipation device further includes a controllable driving device; The controllable drive device includes a first controllable drive device, which is arranged on the first conducting pipeline; and / or each group of the controllable drive devices includes a second controllable drive device, which is arranged on the second conducting pipeline.

5. The multi-chip heat dissipation device according to claim 4, characterized in that: The first controllable driving device and the second controllable driving device are both bidirectional driving devices; The first controllable drive device includes a first one-way pump and a first four-way valve, wherein the first interface of the first four-way valve and the second interface of the first four-way valve are both connected to the first conducting pipe, and the third interface of the first four-way valve is connected to the fourth interface of the first four-way valve through the first one-way pump; The second controllable drive device includes a second one-way pump and a second four-way valve, the first interface of the second four-way valve and the second interface of the second four-way valve are both connected to the second conducting pipe, and the third interface of the second four-way valve is connected to the fourth interface of the second four-way valve through the second one-way pump.

6. A multi-chip heat dissipation system, characterized in that: The multi-chip heat dissipation device comprises the multi-chip heat dissipation device according to any one of claims 1 to 5, at least two chip modules and at least two heat sink modules; The multi-chip heat dissipation device comprises a heat dissipation plate having a hot surface at a portion of its outer surface close to the evaporation zone, and a cold surface at a portion of its outer surface close to the condensation zone; Each chip module is arranged on a hot surface corresponding to the outer surface of the vapor chamber, and each heat sink module is arranged on a cold surface corresponding to the outer surface of the vapor chamber.

7. The multi-chip heat dissipation system according to claim 6, characterized in that: The multi-chip heat dissipation system further includes a first thermally conductive interface structure and a second thermally conductive interface structure; Each chip module is arranged on a hot surface corresponding to the outer surface of the vapor chamber through the first thermal conductive interface structure, and each heat sink module is arranged on a cold surface corresponding to the outer surface of the vapor chamber through the second thermal conductive interface structure.

8. A heat dissipation control method, characterized in that: Applied to the multi-chip heat dissipation system according to claim 6 or 7, the method comprises: Acquiring temperature information of chip modules corresponding to two vapor chambers, wherein a conducting pipe group is provided between the two vapor chambers; When it is determined based on the temperature information of the chip modules corresponding to the two heat spreaders that the chip modules corresponding to the two heat spreaders include a low-power chip module and a high-power module, the first conductive pipeline is controlled to transport the phase change working fluid in the evaporation zone of the heat spreader corresponding to the low-power chip module to the evaporation zone of the heat spreader corresponding to the high-power chip module, and the second conductive pipeline is controlled to transport the phase change working fluid in the condensation zone of the heat spreader corresponding to the high-power chip module to the condensation zone of the heat spreader corresponding to the low-power chip module.

9. The method according to claim 8, characterized in that The method further comprises: Determining the temperature of the chip module corresponding to each vapor chamber based on the temperature information of the chip module corresponding to each vapor chamber; When the chip module corresponding to the vapor chamber has a temperature greater than a high power consumption threshold temperature of the chip module, determining that the chip module is a high power consumption chip module; When the temperature of the chip module corresponding to the vapor chamber is lower than the low power consumption threshold temperature of the chip module, it is determined that the chip module is a low power consumption chip module.

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