A feeding device for cutting polycrystalline silicon core

Abstract

The present invention relates to the technical field of blanking for cutting silicon cores, and discloses a blanking device for cutting polycrystalline silicon cores, comprising a cutting component, a silicon core, a silicon wafer, a separation component, a blanking component and a cleaning component, wherein the cutting component is used for cutting the silicon wafer, the separation component is used for separating the silicon wafers formed after the cutting component cuts, and the cleaning component is used for cleaning the silicon wafers. By setting the blanking component, the working efficiency of the blanking operation is improved, and at the same time, the silicon wafer is cleaned during blanking, and the blanking component rotates the silicon wafer during cleaning so that the cleaning of the silicon wafer is more complete, which is convenient for subsequent production processing and improves production quality; by setting a second rotating shaft, it is convenient to change the axial orientation of the silicon wafer, which is beneficial to more complete cleaning of the silicon wafer; by setting a third rotating shaft, it is convenient to change the radial orientation of the silicon wafer, which is beneficial to the cleaning and blanking operations of the silicon wafer.

Description

Technical Field

[0001] The invention relates to the technical field of blanking for cutting silicon cores, in particular to a blanking device for cutting polycrystalline silicon cores. Background Art

[0002] A feeding device for cutting polysilicon cores is a device for cutting raw material rods from polysilicon to make silicon cores. At present, there are many feeding devices for cutting polysilicon cores on the market, but general feeding devices for cutting polysilicon cores fix single crystal silicon rods during the production of silicon wafers, and then cut the single crystal silicon rods through a cutting device to form silicon wafers. At present, in the process of cutting silicon rods into silicon wafers, on the one hand, residual powder and fragments are adsorbed on the surface of the silicon wafers, resulting in the powder and fragments being scattered and diffused during the feeding and conveying process, affecting the processing environment. On the other hand, the cleaning process of the slices during feeding will take up part of the working time, thereby affecting the working efficiency of feeding. Therefore, it is urgent to invent a feeding device for cutting polysilicon cores to solve the above problems. Summary of the invention

[0003] In view of the deficiencies in the prior art, the present invention provides a material cutting device for cutting polycrystalline silicon cores.

[0004] To achieve the above-mentioned solution, the present invention provides the following technical solutions: a feeding device for cutting polycrystalline silicon cores, comprising a cutting assembly, a silicon core, a silicon wafer, a separation assembly, a feeding assembly and a cleaning assembly, wherein the cutting assembly is used for cutting silicon wafers, the separation assembly is used for separating silicon wafers formed after cutting by the cutting assembly, the feeding assembly is used for feeding silicon wafers, and the cleaning assembly is used for cleaning silicon wafers. The cutting assembly comprises a cutting table, a groove is provided in the middle position of the cutting table, the silicon core is movably installed in the groove of the cutting table, a bracket is fixedly installed on one side of the cutting table and is located above the silicon core, a support is fixedly connected above the bracket, a cylinder is fixedly installed on the top of the support, a first motor is movably fixedly installed below the cylinder, both ends of the first motor are movably installed in the support, a cutting disk is movably installed on the first motor, one side of the separation assembly is fixedly installed at the bottom of the cutting table, the other side of the separation assembly is the feeding assembly, and the feeding assembly is movably connected to the cleaning assembly.

[0005] Preferably, the partition assembly includes a base, a connecting ring and a separator. The base is fixedly installed at the lower part of the cutting table. A first support rod is fixedly installed on both sides above the base. The connecting ring is fixedly connected above the first support rod, and the connecting ring evenly and fixedly installs four separators.

[0006] Preferably, the unloading assembly includes a first connecting block, a second connecting block, an exhaust pump and a conveyor belt. The first connecting block is square. A motor is arranged around the inside of the first connecting block. Each motor is movably mounted with a second rotating shaft. The second rotating shaft is movably connected to one end of the second connecting block. Two first connecting rods are fixedly mounted on the other end of the second connecting block. The first connecting rods are movably connected to the exhaust pump. The conveyor belt is located on one side of the cleaning assembly, and third support rods are installed at both ends of the conveyor belt.

[0007] Preferably, the cleaning assembly includes a cleaning plate and a second support rod, and the cleaning plate is fixedly mounted at the lower portion of the cleaning plate.

[0008] Preferably, the separator includes a separator block and a spring, the separator block has an inclined surface on one side close to the silicon core, and a flat surface on the side close to the unloading assembly. The separator block is located inside the separator and a movable rod is fixedly installed on one side. The movable rod is movably installed in the separator, and a limit block is fixedly installed on one end of the movable rod protruding from the separator, and the spring is located between the separator block and the compartment of the separator.

[0009] Preferably, when the silicon wafer passes through the inclined surface of the partition block, it will drive the partition block to move. The movement of the partition block will compress the spring and drive the movable rod to move. When the silicon wafer moves to the plane position of the partition block, the spring will reset and drive the partition block and the movable rod to reset. At this time, the silicon wafer completes the separation, and the limit block is used to limit the movable rod when it is reset.

[0010] Preferably, a first gear is movably mounted on a first connecting rod connected to each second connecting block, the first gear is connected to a motor disposed in the first connecting rod, the first gear is movably connected to the second gear, the teeth of the first gear and the second gear are meshed, a third rotating shaft is movably mounted between the two first connecting rods, one end of the third rotating shaft is fixedly connected to the second gear, one end of the vacuum pump is fixedly mounted in the middle position of the third rotating shaft, and the other end of the vacuum pump is fixedly connected to a suction cup.

[0011] Preferably, the four motors in the first connecting block can rotate independently and drive the second rotating shaft movably connected thereto. The rotation of the second rotating shaft will drive the second connecting block to rotate. The first connecting rod will rotate with the second connecting block, thereby changing the direction of the first connecting rod. The rotation of the motor between each first connecting rod will drive the first gear to rotate. The rotation of the first gear will drive the second gear to rotate. The rotation of the second gear will drive the third rotating shaft to rotate. The rotation of the third rotating shaft will drive the vacuum pump to rotate. The rotation of the vacuum pump will drive the suction cup to rotate, thereby changing the direction of the suction cup.

[0012] Preferably, the interior of the cleaning disk is funnel-shaped, and a circle of first nozzles is evenly arranged on the upper inner portion of the cleaning disk, and the first nozzles face the center position above the cleaning disk.

[0013] Preferably, a second nozzle is fixedly installed on the lower part of the second support rod, the second nozzle is located above the cleaning disk, and the second nozzle faces the center position of the cleaning disk. A second motor is fixedly installed on the upper part of the second support rod, and a fourth rotating shaft is movably installed on the second motor, and the fourth rotating shaft is fixedly connected to the first connecting block.

[0014] Preferably, when the suction cup moves the silicon wafer above the cleaning plate, the first nozzle can clean the cut surface of the silicon wafer, and the second nozzle can clean the other side of the silicon wafer. When the suction cup rotates, it will drive the silicon wafer to rotate, so that the first nozzle and the second nozzle can clean the silicon wafer more fully.

[0015] Compared with the prior art, the present invention provides a material feeding device for cutting polycrystalline silicon cores, which has the following beneficial effects:

[0016] 1. The unloading device for cutting polysilicon cores is provided with an unloading component. When the unloading component is in operation, one silicon wafer is adsorbed, one silicon wafer is cleaned, and one silicon wafer is unloaded, thereby improving the working efficiency of the unloading operation. At the same time, the silicon wafer is cleaned during unloading, and the unloading component rotates the silicon wafer while it is being cleaned, so that the cleaning of the silicon wafer is more complete, which is convenient for subsequent production processing and improves production quality.

[0017] 2. The feeding device for cutting polysilicon cores is provided with a cleaning component. When the suction cup moves the silicon wafer between the first nozzle and the second nozzle, the first nozzle and the second nozzle are opened at the same time to clean the silicon wafer. Since the cut surface of the silicon wafer is at the bottom, it needs more thorough cleaning. During the cleaning process, the motor in the first connecting block drives the second rotating shaft to rotate twice, the second rotating shaft rotates twice, which drives the second connecting block to rotate twice, which drives the first connecting rod to rotate twice, the first connecting rod rotates twice, which drives the third rotating shaft to rotate twice, which drives the vacuum pump to rotate twice, which drives the suction cup and the silicon wafer to rotate twice, so that the cut surface of the silicon wafer is thoroughly cleaned, and then the first nozzle is stopped, and the second nozzle cleans the upper part of the silicon wafer to pour all impurities into the cleaning tray and collect them. While the cleaning is more thorough, it is also convenient to collect and process the liquid after cleaning.

[0018] 3. The unloading device for cutting polycrystalline silicon cores is provided with a separation component. When the silicon core completes one slicing, a silicon wafer is obtained. At this time, the silicon wafer will be located on the inclined side of the separation block in the separation component. When the silicon core continues to be sliced, the silicon core will be moved. At this time, the silicon core will drive the silicon wafer to move, so that the silicon wafer passes through the inclined surface of the separation block. When the silicon wafer passes through the inclined surface of the separation block, it will drive the separation block to move. The movement of the separation block will compress the spring and drive the movable rod to move at the same time. Then, the silicon wafer will pass through the inclined surface of the separation block to reach the plane position of the separation block. When the silicon wafer moves to the plane position of the separation block, the spring will reset and drive the separation block and the movable rod to reset. At this time, the silicon wafer is separated. The limit block is used to limit the movable rod when it is reset. At this time, the separation block separates the silicon wafer from the silicon wafer formed by the next slice, which is convenient for the unloading component to unload the silicon wafer.

[0019] 4. The unloading device for cutting polysilicon cores sets a first connecting block and starts the second motor to rotate. The rotation of the second motor will drive the fourth shaft to rotate. The rotation of the fourth shaft will drive the first connecting block to rotate. The rotation of the first connecting block will drive the second shaft to rotate. The rotation of the second shaft will drive the second connecting block to rotate. The rotation of the second connecting block will drive the first connecting rod to rotate. The rotation of the first connecting rod will drive the third shaft to rotate. The rotation of the third shaft will drive the vacuum pump to rotate. The rotation of the vacuum pump will drive the suction cup to rotate, so that one silicon wafer can be adsorbed, one silicon wafer can be cleaned, and one silicon wafer can be unloaded at the same time during operation, thereby improving the working efficiency of the unloading operation.

[0020] 5. The feeding device for cutting polysilicon cores is provided with a second rotating shaft. The motor in the first connecting block will drive the second rotating shaft to rotate. The rotation of the second rotating shaft will drive the second connecting block to rotate. The rotation of the second connecting block will drive the first connecting rod to rotate. The rotation of the first connecting rod will drive the third rotating shaft to rotate. The rotation of the third rotating shaft will drive the vacuum pump to rotate. The rotation of the vacuum pump will drive the suction cup and the silicon wafer to rotate, which is convenient for changing the axial orientation of the silicon wafer and is conducive to more thorough cleaning of the silicon wafer.

[0021] 6. The unloading device for cutting polysilicon cores is provided with a third rotating shaft. The motor in the first connecting rod drives the first gear to rotate and drives the second gear to rotate. The rotation of the second gear drives the third rotating shaft to rotate. The rotation of the third rotating shaft drives the vacuum pump to rotate. The rotation of the suction cup drives the suction cup and the silicon wafer to rotate, which is convenient for changing the radial orientation of the silicon wafer and is beneficial for the cleaning and unloading operations of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the main structure of the present invention;

[0023] Figure 2 This is a schematic diagram of the structure of the cutting assembly of the present invention;

[0024] Figure 3 This is a schematic diagram of the structure of the separation component of the present invention;

[0025] Figure 4 This is a schematic diagram of the connection structure of the blanking component and the cleaning component of the present invention;

[0026] Figure 5 This is a schematic diagram of the structure of the blanking assembly of the present invention;

[0027] Figure 6 It is a schematic diagram of the structure of the vacuum extractor of the present invention;

[0028] Figure 7 It is a schematic diagram of the structure of the cleaning component of the present invention.

[0029] In the figure: 100, cutting assembly; 101, cutting table; 102, silicon core; 103, silicon wafer; 104, support; 105, cylinder; 106, first motor; 107, cutting disk; 108, bracket; 200, partition assembly; 201, base; 202, first support rod; 203, connecting ring; 204, separator; 205, partition block; 206, movable rod; 207, spring; 208, limit block; 300, blanking assembly; 301 , first connecting block; 302, second rotating shaft; 303, second connecting block; 304, first connecting rod; 305, first gear; 306, second gear; 307, third rotating shaft; 308, vacuum pump; 309, suction cup; 310, third support rod; 311, conveyor belt; 400, cleaning component; 401, cleaning plate; 402, second support rod; 403, second motor; 404, fourth rotating shaft; 405, first nozzle; 406, second nozzle. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] See also Figures 1 to 7A material unloading device for cutting a polycrystalline silicon core comprises a cutting assembly 100, a silicon core 102, a silicon wafer 103, a separation assembly 200, a material unloading assembly 300 and a cleaning assembly 400. The cutting assembly 100 is used to cut the silicon wafer 103, the separation assembly 200 is used to separate the silicon wafer 103 formed after the cutting assembly 100 cuts, the material unloading assembly 300 is used to unload the silicon wafer 103, and the cleaning assembly 400 is used to clean the silicon wafer 103. The cutting assembly 100 comprises a cutting table 101, a groove is provided in the middle of the cutting table 101, and the silicon core 102 is movably mounted on the cutting table 101. In the groove of the cutting table 101, a bracket 108 is fixedly installed on one side of the cutting table 101 and is located above the silicon core 102. A support 104 is fixedly connected above the bracket 108. A cylinder 105 is fixedly installed on the top of the support 104. A first motor 106 is movably fixedly installed below the cylinder 105. Both ends of the first motor 106 are movably installed in the support 104. A cutting disk 107 is movably installed on the first motor 106. One side of the partition component 200 is fixedly installed at the lower part of the cutting table 101, and the other side of the partition component 200 is a material unloading component 300. The material unloading component 300 is movably connected to the cleaning component 400.

[0032] The partition assembly 200 includes a base 201, a connecting ring 203 and a separator 204. The base 201 is fixedly installed at the lower part of the cutting table 101. A first support rod 202 is fixedly installed on both sides above the base 201. The connecting ring 203 is fixedly connected above the first support rod 202, and four separators 204 are evenly fixedly installed on the connecting ring 203.

[0033] The unloading component 300 includes a first connecting block 301, a second connecting block 303, an exhaust pump 308 and a conveyor belt 311. The first connecting block 301 is square. A motor is arranged around the inside of the first connecting block 301. Each motor is movably mounted with a second rotating shaft 302. The second rotating shaft 302 is movably connected to one end of the second connecting block 303. The other end of the second connecting block 303 is fixedly mounted with two first connecting rods 304. The first connecting rods 304 are movably connected to the exhaust pump 308. The conveyor belt 311 is located on one side of the cleaning component 400. Third support rods 310 are installed at both ends of the conveyor belt 311.

[0034] The cleaning assembly 400 includes a cleaning plate 401 and a second support rod 402 , and the cleaning plate 401 is fixedly mounted at the lower portion of the cleaning plate 401 .

[0035] The separator 204 includes a separator block 205 and a spring 207. The separator block 205 has an inclined surface on one side close to the silicon core 102, and a flat surface on the other side close to the unloading assembly 300. The separator block 205 is located inside the separator 204 and a movable rod 206 is fixedly installed on one side. The movable rod 206 is movably installed in the separator 204. A limit block 208 is fixedly installed on one end of the movable rod 206 protruding from the separator 204. The spring 207 is located between the separator block 205 and the bin of the separator 204.

[0036] When the silicon wafer 103 passes through the inclined surface of the partition block 205, it will drive the partition block 205 to move. The movement of the partition block 205 will compress the spring 207 and drive the movable rod 206 to move. When the silicon wafer 103 moves to the plane position of the partition block 205, the spring 207 will reset and drive the partition block 205 and the movable rod 206 to reset. At this time, the silicon wafer 103 is separated, and the limit block 208 is used to limit the movable rod 206 when it is reset.

[0037] A first gear 305 is movably mounted on a first connecting rod 304 connected to each second connecting block 303, the first gear 305 is connected to a motor arranged in the first connecting rod 304, the first gear 305 is movably linked to the second gear 306, the first gear 305 is meshed with the second gear 306, a third rotating shaft 307 is movably mounted between the two first connecting rods 304, one end of the third rotating shaft 307 is fixedly connected to the second gear 306, one end of the vacuum pump 308 is fixedly mounted in the middle position of the third rotating shaft 307, and the other end of the vacuum pump 308 is fixedly connected to a suction cup 309.

[0038] The four motors in the first connecting block 301 can rotate independently and drive the second rotating shaft 302 movably connected thereto. The rotation of the second rotating shaft 302 will drive the second connecting block 303 to rotate. The first connecting rod 304 will rotate along with the second connecting block 303, thereby changing the direction of the first connecting rod 304. The rotation of the motor between each first connecting rod 304 will drive the first gear 305 to rotate. The rotation of the first gear 305 will drive the second gear 306 to rotate. The rotation of the second gear 306 will drive the third rotating shaft 307 to rotate. The rotation of the third rotating shaft 307 will drive the vacuum pump 308 to rotate. The rotation of the vacuum pump 308 will drive the suction cup 309 to rotate, thereby changing the direction of the suction cup 309.

[0039] The interior of the cleaning disk 401 is funnel-shaped. A circle of first nozzles 405 are evenly arranged on the upper inner portion of the cleaning disk 401 , and the first nozzles 405 face the center position above the cleaning disk 401 .

[0040] A second nozzle 406 is fixedly installed at the lower part of the second support rod 402, and the second nozzle 406 is located above the cleaning disk 401, and the second nozzle 406 faces the center position of the cleaning disk 401. A second motor 403 is fixedly installed at the upper part of the second support rod 402, and the second motor 403 is movably installed with a fourth rotating shaft 404, and the fourth rotating shaft 404 is fixedly connected to the first connecting block 301.

[0041] When the suction cup 309 moves the silicon wafer 103 to the top of the cleaning plate 401, the first nozzle 405 can clean the cut surface of the silicon wafer 103, and the second nozzle 406 can clean the other side of the silicon wafer 103. When the suction cup 309 rotates, it will drive the silicon wafer 103 to rotate, so that the first nozzle 405 and the second nozzle 406 can clean the silicon wafer 103 more fully.

[0042] When in use, the silicon core 102 is sliced ​​by the cutting assembly 100, and the silicon core 102 is moved to a suitable position. The cylinder 105 drives the first motor 106 to move downward, and the first motor 106 drives the cutting disk 107 to move downward. The first motor 106 drives the cutting disk 107 to rotate during the movement. When the cutting disk 107 rotates and contacts the silicon core 102, the silicon core 102 is cut. At this time, one end of the silicon core 102 is located in the separation assembly 200. When the silicon core 102 completes one slice, a silicon wafer 103 is obtained. At this time, the silicon wafer 103 will be located on the inclined side of the separation block 205 in the separation assembly 200. When the silicon core 102 continues to be sliced, the silicon core 102 will be moved. At this time, the silicon core 102 will drive the silicon wafer 103 to move, thereby 03 passes through the inclined surface of the partition block 205. When the silicon wafer 103 passes through the inclined surface of the partition block 205, it will drive the partition block 205 to move. The movement of the partition block 205 will compress the spring 207 and drive the movable rod 206 to move. Then the silicon wafer 103 will pass through the inclined surface of the partition block 205 to reach the plane position of the partition block 205. When the silicon wafer 103 moves to the plane position of the partition block 205, the spring 207 will reset and drive the partition block 205 and the movable rod 206 to reset. At this time, the silicon wafer 103 is separated. The limit block 208 is used to limit the reset of the movable rod 206. At this time, the partition block 205 separates the silicon wafer 103 from the silicon wafer 103 formed by the next slice. At this time, there is a suction cup 309 on one side of the connecting ring 203 to suck the first connecting block 301 and will operate.

[0043] After a suction cup 309 sucks the silicon wafer 103 from the connecting ring 203, the second motor 403 is started to rotate 90 degrees counterclockwise. The second motor 403 rotates 90 degrees counterclockwise to drive the fourth shaft 404 to rotate 90 degrees counterclockwise. The fourth shaft 404 rotates 90 degrees counterclockwise to drive the first connecting block 301 to rotate 90 degrees counterclockwise. The first connecting block 301 rotates 90 degrees counterclockwise to drive the second shaft 302 to rotate 90 degrees counterclockwise. The second shaft 302 rotates 90 degrees counterclockwise to drive the second connecting block 303 to rotate 90 degrees counterclockwise. The second connecting block 303 rotates 90 degrees counterclockwise to drive the first connecting rod 304 to rotate counterclockwise. Rotate 90 degrees, the first connecting rod 304 rotates 90 degrees counterclockwise to drive the third rotating shaft 307 to rotate 90 degrees counterclockwise, the third rotating shaft 307 rotates 90 degrees counterclockwise to drive the vacuum pump 308 to rotate 90 degrees counterclockwise, the vacuum pump 308 rotates 90 degrees counterclockwise to drive the suction cup 309 to rotate 90 degrees counterclockwise, and the suction cup 309 and the silicon wafer 103 are moved to the top of the cleaning plate 401. In this process, the motor in the first connecting rod 304 drives the first gear 305 to rotate 90 degrees clockwise and drives the second gear 306 to rotate 90 degrees counterclockwise, and the second gear 306 rotates 90 degrees counterclockwise to drive the third rotating shaft 307 to rotate counterclockwise The needle rotates 90 degrees, the third shaft 307 rotates 90 degrees counterclockwise to drive the vacuum pump 308 to rotate 90 degrees counterclockwise, and the suction cup 309 rotates 90 degrees counterclockwise to drive the suction cup 309 and the silicon wafer 103 to rotate 90 degrees counterclockwise. When the suction cup 309 and the silicon wafer 103 move to the top of the cleaning plate 401, the suction cup 309 moves the silicon wafer 103 to between the first nozzle 405 and the second nozzle 406. At this time, the first nozzle 405 and the second nozzle 406 are opened at the same time to clean the silicon wafer 103. Since the cut surface of the silicon wafer 103 is at the bottom, it needs to be cleaned more thoroughly. During the cleaning process, the motor in the first connecting block 301 drives the second shaft 308 to rotate 90 degrees counterclockwise. The shaft 302 rotates twice, the second shaft 302 rotates twice, which will drive the second connecting block 303 to rotate twice, the second connecting block 303 rotates twice, which will drive the first connecting rod 304 to rotate twice, the first connecting rod 304 rotates twice, which will drive the third shaft 307 to rotate twice, the third shaft 307 rotates twice, which will drive the vacuum pump 308 to rotate twice, and the vacuum pump 308 rotates twice, which will drive the suction cup 309 and the silicon wafer 103 to rotate twice, so that the cut surface of the silicon wafer 103 is fully cleaned, and then the first nozzle 405 is stopped, and the second nozzle 406 cleans the upper part of the silicon wafer 103 to pour all impurities into the cleaning tray 401 and collect them.

[0044] Then start the second motor 403 to rotate 90 degrees counterclockwise, the second motor 403 rotates 90 degrees counterclockwise to drive the fourth shaft 404 to rotate 90 degrees counterclockwise, the fourth shaft 404 rotates 90 degrees counterclockwise to drive the first connecting block 301 to rotate 90 degrees counterclockwise, the first connecting block 301 rotates 90 degrees counterclockwise to drive the second shaft 302 to rotate 90 degrees counterclockwise, the second shaft 302 rotates 90 degrees counterclockwise to drive the second connecting block 303 to rotate 90 degrees counterclockwise, the second connecting block 303 rotates 90 degrees counterclockwise to drive the first connecting rod 304 to rotate counterclockwise The first connecting rod 304 rotates 90 degrees clockwise, and the first connecting rod 304 rotates 90 degrees counterclockwise to drive the third rotating shaft 307 to rotate 90 degrees counterclockwise. The third rotating shaft 307 rotates 90 degrees counterclockwise to drive the vacuum pump 308 to rotate 90 degrees counterclockwise. The vacuum pump 308 rotates 90 degrees counterclockwise to drive the suction cup 309 to rotate 90 degrees counterclockwise. At this time, the suction cup 309 and the silicon wafer 103 are moved to the top of the conveyor belt 311. In this process, the motor in the first connecting block 301 drives the second rotating shaft 302 to rotate 90 degrees counterclockwise. The second rotating shaft 302 rotates 90 degrees counterclockwise. The second connecting block 303 will be driven to rotate 90 degrees counterclockwise, and the second connecting block 303 will be driven to rotate 90 degrees counterclockwise, which will drive the first connecting rod 304 to rotate 90 degrees counterclockwise, and the first connecting rod 304 will be driven to rotate 90 degrees counterclockwise, which will drive the third rotating shaft 307 to rotate 90 degrees counterclockwise, and the third rotating shaft 307 will be driven to rotate 90 degrees counterclockwise, which will drive the vacuum pump 308 to rotate 90 degrees counterclockwise, and the vacuum pump 308 will be driven to rotate 90 degrees counterclockwise, which will drive the suction cup 309 and the silicon wafer 103 to rotate 90 degrees counterclockwise. At the same time, the motor in the first connecting rod 304 will drive the first The gear 305 will rotate 90 degrees counterclockwise and drive the second gear 306 to rotate 90 degrees clockwise. The second gear 306 will rotate 90 degrees clockwise, which will drive the third shaft 307 to rotate 90 degrees clockwise. The third shaft 307 will rotate 90 degrees clockwise, which will drive the vacuum pump 308 to rotate 90 degrees clockwise. The suction cup 309 will rotate 90 degrees clockwise, which will drive the suction cup 309 and the silicon wafer 103 to rotate 90 degrees clockwise. Finally, the suction cup 309 will move the silicon wafer 103 to one end of the conveyor belt 311. At this time, the suction cup 309 can be controlled to put down the silicon wafer 103 to complete the unloading.

[0045] When unloading is completed, start the second motor 403 to rotate 90 degrees counterclockwise, the second motor 403 rotates 90 degrees counterclockwise to drive the fourth shaft 404 to rotate 90 degrees counterclockwise, the fourth shaft 404 rotates 90 degrees counterclockwise to drive the first connecting block 301 to rotate 90 degrees counterclockwise, the first connecting block 301 rotates 90 degrees counterclockwise to drive the second shaft 302 to rotate 90 degrees counterclockwise, the second shaft 302 rotates 90 degrees counterclockwise to drive the second connecting block 303 to rotate 90 degrees counterclockwise, the second connecting block 303 rotates 90 degrees counterclockwise to drive the first connecting rod 304 to rotate 90 degrees counterclockwise, the first connecting rod 304 rotates 90 degrees counterclockwise to drive the third shaft 307 to rotate 90 degrees counterclockwise, the third shaft 307 rotates 90 degrees counterclockwise to drive the vacuum pump 308 to rotate 90 degrees counterclockwise, and the vacuum pump 308 rotating 90 degrees counterclockwise will drive the suction cup 309 to rotate 90 degrees counterclockwise, and the unloaded suction cup 309 will be operated to the highest point of the unloading component 300. During this process, the motor in the first connecting block 301 will drive the second rotating shaft 302 to rotate 90 degrees counterclockwise, and the second rotating shaft 302 rotating 90 degrees counterclockwise will drive the second connecting block 303 to rotate 90 degrees counterclockwise, and the second connecting block 303 rotating 90 degrees counterclockwise will drive the first connecting rod 304 to rotate 90 degrees counterclockwise, and the first connecting rod 304 rotating 90 degrees counterclockwise will drive the third rotating shaft 307 to rotate 90 degrees counterclockwise, and the third rotating shaft 307 rotating 90 degrees counterclockwise will drive the vacuum pump 308 to rotate 90 degrees counterclockwise, and the vacuum pump 308 rotating 90 degrees counterclockwise will drive the suction cup 309 to rotate 90 degrees counterclockwise to complete the reset.

[0046] When the second motor 403 is started to rotate 90 degrees counterclockwise, the second motor 403 rotates 90 degrees counterclockwise to drive the fourth shaft 404 to rotate 90 degrees counterclockwise, the fourth shaft 404 rotates 90 degrees counterclockwise to drive the first connecting block 301 to rotate 90 degrees counterclockwise, the first connecting block 301 rotates 90 degrees counterclockwise to drive the second shaft 302 to rotate 90 degrees counterclockwise, the second shaft 302 rotates 90 degrees counterclockwise to drive the second connecting block 303 to rotate 90 degrees counterclockwise, and the second connecting block 303 rotates 90 degrees counterclockwise. When the connecting block 303 rotates 90 degrees counterclockwise, the first connecting rod 304 rotates 90 degrees counterclockwise, which drives the third rotating shaft 307 to rotate 90 degrees counterclockwise. When the third rotating shaft 307 rotates 90 degrees counterclockwise, it drives the vacuum pump 308 to rotate 90 degrees counterclockwise. When the vacuum pump 308 rotates 90 degrees counterclockwise, it drives the suction cup 309 to rotate 90 degrees counterclockwise. At this time, the unloaded 109 can continue to operate the next silicon wafer 103.

[0047] When the unloading component 300 is in operation, it will adsorb a silicon wafer 103, clean a silicon wafer 103, and unload a silicon wafer 103, thereby improving the working efficiency of the unloading operation. At the same time, the silicon wafer 103 is cleaned during unloading, and the unloading component 300 will rotate the silicon wafer 103 while it is being cleaned so that the cleaning of the silicon wafer 103 is more thorough, which is convenient for subsequent production processing and improves production quality.

[0048] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A material unloading device for cutting polycrystalline silicon cores, comprising a cutting assembly (100), a silicon core (102), a silicon wafer (103), a separation assembly (200), a material unloading assembly (300) and a cleaning assembly (400), wherein the cutting assembly (100) is used to cut the silicon wafer (103), the separation assembly (200) is used to separate the silicon wafer (103) formed after the cutting assembly (100) cuts, the material unloading assembly (300) is used to unload the silicon wafer (103), and the cleaning assembly (400) is used to clean the silicon wafer (103), characterized in that: The cutting assembly (100) comprises a cutting table (101), a groove is provided in the middle of the cutting table (101), a silicon core (102) is movably mounted in the groove of the cutting table (101), a bracket (108) is fixedly mounted on one side of the cutting table (101) and is located above the silicon core (102), a support (104) is fixedly connected above the bracket (108), a cylinder (105) is fixedly mounted on the top of the support (104), a first motor (106) is movably fixedly mounted below the cylinder (105), both ends of the first motor (106) are movably mounted in the support (104), a cutting disc (107) is movably mounted on the first motor (106), one side of the partition assembly (200) is fixedly mounted on the lower part of the cutting table (101), the other side of the partition assembly (200) is a material discharge assembly (300), and the material discharge assembly (300) is movably connected to the cleaning assembly (400); The partition assembly (200) comprises a base (201), a connecting ring (203) and a separator (204); the base (201) is fixedly mounted on the lower part of the cutting table (101); a first support rod (202) is fixedly mounted on both sides above the base (201); the connecting ring (203) is fixedly connected above the first support rod (202); and the connecting ring (203) is evenly fixedly mounted with four separators (204); The material unloading assembly (300) comprises a first connecting block (301), a second connecting block (303), an exhauster (308) and a conveyor belt (311). The first connecting block (301) is square. A motor is arranged around the inside of the first connecting block (301). Each motor is movably mounted with a second rotating shaft (302). The second rotating shaft (302) is movably connected to one end of the second connecting block (303). Two first connecting rods (304) are fixedly mounted on the other end of the second connecting block (303). The first connecting rods (304) are movably connected to the exhauster (308). The conveyor belt (311) is located at one side of the cleaning assembly (400). Third supporting rods (310) are mounted at both ends of the conveyor belt (311). The cleaning assembly (400) comprises a cleaning plate (401) and a second support rod (402), wherein the cleaning plate (401) is fixedly mounted on the lower part of the cleaning plate (401).

2. A material feeding device for cutting polycrystalline silicon cores according to claim 1, characterized in that: The separator (204) comprises a separator block (205) and a spring (207); the side of the separator block (205) close to the silicon core (102) is an inclined surface; the side of the separator block (205) close to the blanking assembly (300) is a flat surface; a movable rod (206) is fixedly installed on one side of the separator block (205) located inside the separator (204); the movable rod (206) is movably installed in the separator (204); a limit block (208) is fixedly installed on one end of the movable rod (206) protruding from the separator (204); and the spring (207) is located between the separator block (205) and the compartment of the separator (204).

3. A material feeding device for cutting polycrystalline silicon cores according to claim 2, characterized in that: When the silicon wafer (103) passes through the inclined surface of the partition block (205), it drives the partition block (205) to move. The movement of the partition block (205) compresses the spring (207) and drives the movable rod (206) to move. When the silicon wafer (103) moves to the plane position of the partition block (205), the spring (207) resets and drives the partition block (205) and the movable rod (206) to reset. At this time, the silicon wafer (103) is separated. The limit block (208) is used to limit the movable rod (206) when it is reset.

4. The material feeding device for cutting polycrystalline silicon cores according to claim 1, characterized in that: A first gear (305) is movably mounted on a first connecting rod (304) connected to each second connecting block (303); the first gear (305) is connected to a motor disposed in the first connecting rod (304); the first gear (305) is movably linked to a second gear (306); the first gear (305) and the second gear (306) are meshed with each other; a third rotating shaft (307) is movably mounted between the two first connecting rods (304); one end of the third rotating shaft (307) is fixedly connected to the second gear (306); one end of the vacuum pump (308) is fixedly mounted at a middle position of the third rotating shaft (307); and the other end of the vacuum pump (308) is fixedly connected to a suction cup (309).

5. The material feeding device for cutting polycrystalline silicon cores according to claim 4, characterized in that: The four motors in the first connecting block (301) can rotate independently and drive the second rotating shaft (302) movably connected thereto; the rotation of the second rotating shaft (302) will drive the second connecting block (303) to rotate; the first connecting rod (304) will rotate along with the second connecting block (303), thereby changing the direction of the first connecting rod (304); the rotation of the motor between each first connecting rod (304) will drive the first gear (305) to rotate; the rotation of the first gear (305) will drive the second gear (306) to rotate; the rotation of the second gear (306) will drive the third rotating shaft (307) to rotate; the rotation of the third rotating shaft (307) will drive the vacuum pump (308) to rotate; the rotation of the vacuum pump (308) will drive the suction cup (309) to rotate, thereby changing the direction of the suction cup (309).

6. A material feeding device for cutting polycrystalline silicon cores according to claim 5, characterized in that: The interior of the cleaning disk (401) is funnel-shaped, and a circle of first nozzles (405) are evenly arranged on the upper inner portion of the cleaning disk (401), with the first nozzles (405) facing the central position above the cleaning disk (401).

7. A material feeding device for cutting polycrystalline silicon cores according to claim 6, characterized in that: A second nozzle (406) is fixedly mounted on the lower part of the second support rod (402), the second nozzle (406) is located above the cleaning disc (401), and the second nozzle (406) faces the center of the cleaning disc (401); a second motor (403) is fixedly mounted on the upper part of the second support rod (402), a fourth rotating shaft (404) is movably mounted on the second motor (403), and the fourth rotating shaft (404) is fixedly connected to the first connecting block (301).

8. The material feeding device for cutting polycrystalline silicon cores according to claim 7, characterized in that: When the suction cup (309) moves the silicon wafer (103) to the top of the cleaning plate (401), the first nozzle (405) can clean the cut surface of the silicon wafer (103), and the second nozzle (406) can clean the other side of the silicon wafer (103). When the suction cup (309) rotates, it drives the silicon wafer (103) to rotate, so that the first nozzle (405) and the second nozzle (406) can clean the silicon wafer (103) more fully.

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