Display substrate, manufacturing method and display panel

Abstract

The application provides a display substrate, a preparation method and a display panel, which comprise a substrate, a metal layer, a first insulating layer and a second insulating layer which are arranged in layers; one of the first insulating layer and the second insulating layer is provided with a first through hole, and the other is provided with a second through hole; wherein the first through hole is in the orthographic projection of the metal layer in the orthographic projection of the substrate; the second through hole is in communication with the first through hole, and the area of the orthographic projection of the second through hole in the substrate is smaller than the area of the orthographic projection of the first through hole in the substrate; the application sets the first through hole and the second through hole in the first insulating layer and the second insulating layer, and makes the size of the first through hole larger than that of the second through hole; when the display substrate is subjected to external pressure, the size difference between the first through hole and the second through hole can relieve the tension caused by the external pressure, enhance the bending resistance of the display substrate, and improve the durability of the display substrate and the market competitiveness of the product.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display substrate, a preparation method and a display panel. BACKGROUND

[0002] The display panel is one of the important media for information transmission, and its application has penetrated into various technical fields. With the continuous progress of display technology and the increasing demand of users, the display panel is not only continuously optimized in resolution, color restoration, response speed and other aspects, but also its durability and reliability have become key indicators to measure product quality. Due to different application scenarios of the display panel, when the surface of the display panel is pressed or impacted, a highly concentrated tension will be formed between the internal film layer structures of the display panel, especially in the areas with small area such as the opening position of the film layer structure. Under the action of the tension, tearing or cracking is easily caused on the surface of the film layer, which not only affects the structural integrity of the panel, but also reduces the trust of users on the product. SUMMARY

[0003] Therefore, the purpose of the present application is to provide a display substrate, a preparation method and a display panel to solve the above-mentioned technical problems.

[0004] In order to achieve the above purpose, the present application provides a display substrate, comprising a substrate, a metal layer, a first insulating layer and a second insulating layer which are stacked.

[0005] One of the first insulating layer and the second insulating layer is provided with a first through hole, and the other is provided with a second through hole; wherein the first through hole is located in the projection of the metal layer on the substrate; the second through hole is in communication with the first through hole, and the projection area of the second through hole on the substrate is smaller than the projection area of the first through hole on the substrate.

[0006] Based on the same inventive concept, the present application also provides a preparation method of a display substrate, comprising:

[0007] providing a substrate, and forming a metal layer on the surface of the substrate;

[0008] determining the pressure-bearing surface of the display substrate on the light-emitting side and the backlight side of the display substrate; wherein the light-emitting side and the backlight side are respectively located on the opposite sides of the display substrate;

[0009] in response to the pressure-bearing surface being the light-emitting side of the display substrate, forming a first insulating layer on the side of the metal layer away from the substrate, opening a first through hole in the first insulating layer, forming a second insulating layer on the side of the first insulating layer away from the substrate, and then opening a second through hole in the second insulating layer;

[0010] In response to the pressure surface being the backlight side of the display substrate, a first insulating layer is formed on the side of the metal layer away from the substrate, a second through hole is formed in the first insulating layer, a second insulating layer is formed on the side of the first insulating layer away from the substrate, and then a first through hole is formed in the second insulating layer; wherein the second through hole and the first through hole are in communication, and the projection area of the substrate is less than the projection area of the first through hole on the substrate.

[0011] Based on the same inventive concept, the application also provides a display panel comprising the display substrate as described above.

[0012] As can be seen from the above, the display substrate, the preparation method and the display panel provided by the application set the first through hole in one of the first insulating layer and the second insulating layer, set the second through hole in the other, and make the size of the first through hole greater than that of the second through hole. When the pressure surface of the display substrate is subjected to external pressure, the size difference between the first through hole and the second through hole can effectively balance the internal stress caused by the external pressure, compensate for the tension between the film layers, and reduce the problem of local tension concentration, so as to enhance the pressure resistance of the display substrate when it is subjected to bending deformation, avoid the phenomenon of tearing or cracking of the film layer caused by excessive tension strength, improve the durability and reliability of the display substrate, improve the product quality of the display substrate, and improve the trust of users for the product. BRIEF DESCRIPTION OF DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the application or the related art, the following will briefly introduce the drawings needed to be used in the embodiments or related art descriptions. Obviously, the drawings in the following description are only embodiments of the application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0014] Figure 1 It is a structural schematic diagram of the display substrate in the related art;

[0015] Figure 2 It is a deformation schematic diagram of the display substrate in the related art when it is subjected to external pressure;

[0016] Figures 3A-3D It is a preparation flowchart of the display substrate in the related art;

[0017] Figure 4 It is a structural schematic diagram of a display substrate in the application;

[0018] Figure 5 It is a deformation schematic diagram of the display substrate in the application when it is subjected to external pressure;

[0019] Figure 6 FIG. 4 is a structural schematic diagram of another display substrate in the present application;

[0020] Figure 7 FIG. 5 is a structural schematic diagram of still another display substrate in the present application;

[0021] Figure 8 FIG. 6 is a positional relationship diagram of an encapsulation adhesive layer and a transparent substrate in the present application;

[0022] Figure 9 FIG. 7 is a flowchart of a preparation method of a display substrate in the present application;

[0023] Figures 10A-10F FIG. 8 is a preparation flowchart of a display substrate in the related art.

[0024] Legend of reference signs:

[0025] 100, substrate substrate; F, external pressure;

[0026] 200, metal layer; 210, third through hole;

[0027] 300, non-metal layer; 310, through hole;

[0028] 410, first insulating layer; 420, second insulating layer;

[0029] 510, first through hole; 520, second through hole; 530, first stress surface; 540, second stress surface;

[0030] 600, encapsulation adhesive layer; 610, bonding part;

[0031] 700, transparent substrate. DETAILED DESCRIPTION

[0032] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application is further described in detail below with reference to specific embodiments and the accompanying drawings.

[0033] It should be noted that, unless otherwise defined, technical terms or scientific terms used in the embodiments of the present application shall have the common meaning understood by one of ordinary skill in the art to which the embodiments of the present application belong. The terms "first", "second", and similar terms used in the embodiments of the present application do not denote any order, quantity, or importance, but are merely used to distinguish different components. The terms "include", "contain", and similar terms mean that the elements or objects before the terms encompass the elements or objects listed after the terms and their equivalents, and do not exclude other elements or objects. The terms "connect" or "connected" and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms "upper", "lower", "left", "right", and the like merely represent relative positional relationships, which can change when the absolute positions of the described objects change.

[0034] The embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0035] Display panels are one of the important media for information transmission and are widely used in various technical fields. With the continuous development of display technology and the increasing demand of users, display panels are continuously optimized in terms of resolution, color reproduction, response speed, and the like, and their durability and reliability have become one of the key indicators for measuring product quality.

[0036] Among them, the display substrate is one of the important components of the display panel. Specifically, as shown in Figure 1 and Figure 2 In the related art, the display substrate can include a substrate 100, a metal layer 200, and a non-metal layer 300 which are stacked, the metal layer 200 and the non-metal layer 300 are provided with through holes 310; in the display substrate, taking the frame area of the display substrate as an example, the display substrate can be prepared according to the preparation process as shown in Figures 3A-3D

[0037] As shown in Figures 3A-3D ​As shown, first, a substrate 100 is provided, a metal layer 200 is formed on the surface of the substrate 100 by a deposition process, and the metal layer 200 is patterned by exposure, etching and stripping processes; then, a non-metal layer 300 is formed on the side of the metal layer 200 away from the substrate 100 by a deposition process, so that the non-metal layer 300 can cover the metal layer 200, and the non-metal layer 300 and the metal layer 200 are patterned by exposure, etching and stripping processes to form a through hole 310 in the non-metal layer 300 and the metal layer 200 of the display substrate, and the metal layer 200 forms a mesh structure; since the through hole 310 is formed by an etching process, the cross-sectional area of the through hole 310 gradually decreases from the light-emitting side to the backlight side, that is, the bottom area of the formed through hole 310 is relatively small; then, Frit (glass frit) can be used to package the side of the non-metal layer 300 away from the substrate 100, and the through hole 310 is fixed and filled, so that the Frit covers the non-metal layer 300, and the Frit is cured by infrared curing technology to form a packaging adhesive layer 600 on the surface of the non-metal layer 300 and form a frame of the display substrate; at the same time, a transparent substrate 700 can be formed on the side of the packaging adhesive layer 600 away from the substrate 100, which is used to cover and protect the film layer structure in the display substrate without affecting the normal light emission of the display substrate.

[0038] Specifically, in the display substrate, the substrate 100 can be used as the bearing body of the display substrate to support and protect the components and film layer structure arranged on its surface, the metal layer 200 is in a mesh structure and is arranged between the substrate 100 and the non-metal layer 300, which is used to reinforce the frame area of the display substrate, and the light reflection performance of the metal layer 200 can also reflect infrared light, enhance the curing effect of the Frit in the through hole 310, and improve the packaging effect of the display substrate. The non-metal layer 300 is arranged on the side of the metal layer 200 away from the substrate 100, which is used to package and electrically insulate the metal layer 200, to avoid short circuit between the metal layer 200 and the metal wiring in the display substrate, and to improve the yield of the display substrate.

[0039] Specifically, as shown in Figure 2 In the preparation and use of the display substrate, its surface is usually subjected to external pressure F, such as pressing or collision; wherein the side of the display substrate subjected to the external pressure F can be a pressure-bearing surface, which can be the light-emitting side of the display substrate or the backlight layer of the display substrate, and the light-emitting side and the backlight side of the display substrate are arranged opposite to each other; as shown in Figure 2As shown, when the display substrate is subjected to external pressure F, such as pressure test or touch test before the display substrate leaves the factory, the display substrate will bend towards the backlight side of the display substrate under the action of the external pressure F; due to the deformation of the display substrate, a large tensile force is generated between the non-metallic layer 300, the metal layer 200 and the substrate 100 in the display substrate, and under the action of the tensile force, the shape of the through hole 310 also changes to compensate the tensile force between the metal layer 200 and the non-metallic layer 300. Since the cross section of the through hole 310 between the non-metallic layer 300 and the metal layer 200 is small, the compensation ability of the tensile force is limited. When the tensile force between the non-metallic layer 300 and the metal layer 200 in the display substrate is large, the area where the through hole 310 between the non-metallic layer 300 and the metal layer 200 is located is prone to tensile stress concentration, such as the a area in Figure 2 Under the action of the high-intensity tensile force, the metal layer 200 is prone to tearing and forming cracks, affecting the quality of the display substrate; if the display substrate is subjected to external pressure F again, the crack may continue to grow, and in severe cases, the display substrate may be damaged, which not only affects the normal use of the display substrate, but also affects the trust of the user on the product.

[0040] Therefore, the present application provides a display substrate, which comprises a substrate 100, a metal layer 200, a first insulating layer 410 and a second insulating layer 420 which are stacked; one of the first insulating layer 410 and the second insulating layer 420 is provided with a first through hole 510, and the other is provided with a second through hole 520; wherein the first through hole 510 is located in the projection of the metal layer 200 on the substrate 100; the second through hole 520 communicates with the first through hole 510, and the projection area of the second through hole 520 on the substrate 100 is smaller than that of the first through hole 510 on the substrate 100.

[0041] As shown in Figures 4-8 The present application provides a display substrate with good durability and reliability; specifically, the display substrate comprises a substrate 100, a metal layer 200, a first insulating layer 410 and a second insulating layer 420, the substrate 100 can be used as the bearing body of the display substrate to support and protect the components and film layer structure arranged above, the metal layer 200 is arranged between the substrate 100 and the non-metallic layer 300 to reinforce the frame area of the display substrate, and the first insulating layer 410 and the second insulating layer 420 are arranged on the side of the metal layer 200 away from the substrate 100, which can reduce the preparation difficulty of the insulating layer and improve the insulation effect and packaging effect of the metal layer 200.

[0042] More specifically, one of the first insulating layer 410 and the second insulating layer 420 is provided with the first through hole 510, and the other is provided with the second through hole 520; wherein the first through hole 510 is located in the projection of the metal layer 200 on the substrate 100, so that the position of the first through hole 510 corresponds to the position of the metal layer 200, which is conducive to the curing of Frit in the first through hole 510 by the light reflection of the metal layer 200, and ensures good connection between the first insulating layer 410 and the metal layer 200; the second through hole 520 communicates with the first through hole 510, which is conducive to the filling of Frit in the second through hole 520 and the first through hole 510 during packaging, thereby improving the connection effect between the first insulating layer 410, the second insulating layer 420 and the metal layer 200, and improving the packaging performance of the display substrate; the projection area of the second through hole 520 on the substrate 100 is smaller than the projection area of the first through hole 510 on the substrate 100, that is, the size of the first through hole 510 is larger than the size of the second through hole 520; wherein the distance between the first through hole 510 and the pressure receiving surface can be smaller than the distance between the second through hole 520 and the pressure receiving surface; when the pressure receiving surface of the display substrate is subjected to external pressure F, the film layer farther away from the pressure receiving surface in the display substrate generates greater tension; since the first through hole 510 has a relatively large size, it also has a relatively large deformation allowance; by arranging the first through hole 510 on the first insulating layer 410 or the second insulating layer 420 away from the pressure receiving surface, the tension caused by the external pressure F can be compensated and balanced, so as to avoid the tearing of the film layer caused by the tension concentration at the edge of the first through hole 510, and to maintain the integrity of the display substrate.

[0043] In addition, since the size of the first through hole 510 is larger than the size of the second through hole 520, and the second through hole 520 is arranged on the first insulating layer 410 or the second insulating layer 420 close to the pressure receiving surface; wherein the first through hole 510 with a larger size can disperse and compensate the tension; since the tension generated by the film layer where the second through hole 520 is located is smaller than the tension suffered by the film layer where the first through hole 510 is located, by making the size of the second through hole 520 smaller than the size of the first through hole 510, the film layer retention rate of the film layer where the second through hole 520 is located can be improved, and the functional integrity of the display substrate is ensured, so that the display substrate has good supporting ability, which can maintain the necessary mechanical strength and adapt to the bending demand.

[0044] For example, as shown in Figure 4 when the light emitting layer of the display substrate is the pressure receiving surface, the first through hole 510 can be arranged on the first insulating layer 410, and the second through hole 520 can be arranged on the second insulating layer 420; when the pressure receiving surface of the display substrate is subjected to external pressure F, the display substrate bends towards the backlight side, as shown in Figure 5As shown in FIG. 6, the first through hole 510 can be arranged on the second insulating layer 420, and the second through hole 520 can be arranged on the first insulating layer 410. When the pressure receiving surface of the display substrate is subjected to external pressure F, the display substrate bends towards the light emitting side. Since the radius of curvature of the second insulating layer 420 is greater than that of the first insulating layer 410, the tensile force generated on the side of the second insulating layer 420 away from the pressure receiving surface is greater than that of the first insulating layer 410. Since the size of the first through hole 510 is greater than that of the second through hole 520, the first through hole 510 deforms under the action of the tensile force, so as to compensate and balance the tensile force generated by the second insulating layer 420, avoid the tensile force from concentrating on the contact area between the first through hole 510 and the metal layer 200, and prevent the metal layer 200 from being torn and cracks from being formed.

[0045] For example, as shown in FIG. 7, when the light emitting side of the display substrate is the pressure receiving surface, the first through hole 510 can be arranged on the first insulating layer 410, and the second through hole 520 can be arranged on the second insulating layer 420. When the pressure receiving surface of the display substrate is subjected to external pressure F, the display substrate bends towards the light emitting side. Since the radius of curvature of the first insulating layer 410 is greater than that of the second insulating layer 420, the tensile force generated on the side of the first insulating layer 410 away from the pressure receiving surface is greater than that of the second insulating layer 420. Since the size of the first through hole 510 is greater than that of the second through hole 520, the first through hole 510 deforms under the action of the tensile force, so as to compensate and balance the tensile force generated by the first insulating layer 410, avoid the tensile force from concentrating on the contact area between the first through hole 510 and the metal layer 200, and prevent the metal layer 200 from being torn and cracks from being formed. Figure 7 For example, as shown in FIG. 7, when the light emitting side of the display substrate is the pressure receiving surface, the first through hole 510 can be arranged on the first insulating layer 410, and the second through hole 520 can be arranged on the second insulating layer 420. When the pressure receiving surface of the display substrate is subjected to external pressure F, the display substrate bends towards the light emitting side. Since the radius of curvature of the first insulating layer 410 is greater than that of the second insulating layer 420, the tensile force generated on the side of the first insulating layer 410 away from the pressure receiving surface is greater than that of the second insulating layer 420. Since the size of the first through hole 510 is greater than that of the second through hole 520, the first through hole 510 deforms under the action of the tensile force, so as to compensate and balance the tensile force generated by the first insulating layer 410, avoid the tensile force from concentrating on the contact area between the first through hole 510 and the metal layer 200, and prevent the metal layer 200 from being torn and cracks from being formed.

[0046] In some embodiments, the opposite sides of the first through hole 510 and the opposite sides of the second through hole 520 are respectively provided with first stress receiving surfaces 530 and second stress receiving surfaces 540. The distance between the first stress receiving surface 530 of the first through hole 510 and the substrate 100 is less than the distance between the second stress receiving surface 540 of the first through hole 510 and the substrate 100. The distance between the first stress receiving surface 530 of the second through hole 520 and the substrate 100 is less than the distance between the second stress receiving surface 540 of the second through hole 520 and the substrate 100.

[0047] For example, as shown in FIG. 7, when the light emitting side of the display substrate is the pressure receiving surface, the first through hole 510 can be arranged on the first insulating layer 410, and the second through hole 520 can be arranged on the second insulating layer 420. When the pressure receiving surface of the display substrate is subjected to external pressure F, the display substrate bends towards the light emitting side. Since the radius of curvature of the first insulating layer 410 is greater than that of the second insulating layer 420, the tensile force generated on the side of the first insulating layer 410 away from the pressure receiving surface is greater than that of the second insulating layer 420. Since the size of the first through hole 510 is greater than that of the second through hole 520, the first through hole 510 deforms under the action of the tensile force, so as to compensate and balance the tensile force generated by the first insulating layer 410, avoid the tensile force from concentrating on the contact area between the first through hole 510 and the metal layer 200, and prevent the metal layer 200 from being torn and cracks from being formed. Figure 4 and Figure 7As shown, when the pressure-bearing surface of the display substrate is subjected to external pressure F, for any film layer in the display substrate, the side close to the pressure-bearing surface is subjected to compressive stress, and the side away from the pressure-bearing surface is subjected to tensile stress, i.e. tension; for the first insulating layer 410 and the second insulating layer 420, one of the two is provided with the first through hole 510, and the other is provided with the second through hole 520, and the opposite sides of the first through hole 510 and the second through hole 520 are both provided with the first stress surface 530 and the second stress surface 540; the distance between the first stress surface 530 of the first through hole 510 and the substrate 100 is different from the distance between the second stress surface 540 of the first through hole 510 and the substrate 100; the distance between the first stress surface 530 of the second through hole 520 and the substrate 100 is less than the distance between the second stress surface 540 of the second through hole 520 and the substrate 100, for compensating and balancing the compressive stress and the tension when the display substrate is bent.

[0048] Exemplarily, when the light-emitting side of the display substrate is the pressure-bearing surface and is subjected to external pressure F, the first stress surface 530 of the first through hole 510 and the first stress surface 530 of the second through hole 520 are subjected to the tension generated in the film layer deformation process, and the first stress surface 530 of the first through hole 510 and the first stress surface 530 of the second through hole 520 are deformed under the action of the tension to compensate for the side of the first insulating layer 410 and the second insulating layer 420 away from the pressure-bearing surface; the second stress surface 540 of the first through hole 510 and the second stress surface 540 of the second through hole 520 are subjected to the compressive stress generated in the film layer deformation process, and the second stress surface 540 of the first through hole 510 and the second stress surface 540 of the second through hole 520 are deformed under the action of the compressive stress to compensate for the side of the first insulating layer 410 and the second insulating layer 420 close to the pressure-bearing surface; similarly, when the backlight side of the display substrate is the pressure-bearing surface and is subjected to external pressure F, the first stress surface 530 of the first through hole 510 and the first stress surface 530 of the second through hole 520 are subjected to the compressive stress generated in the film layer deformation process, and the first stress surface 530 of the first through hole 510 and the first stress surface 530 of the second through hole 520 are deformed under the action of the compressive stress to compensate for the side of the first insulating layer 410 and the second insulating layer 420 close to the pressure-bearing surface; the second stress surface 540 of the first through hole 510 and the second stress surface 540 of the second through hole 520 are subjected to the tension generated in the film layer deformation process, and the second stress surface 540 of the first through hole 510 and the second stress surface 540 of the second through hole 520 are deformed under the action of the tension to compensate for the side of the first insulating layer 410 and the second insulating layer 420 away from the pressure-bearing surface; which is conducive to reducing the local stress concentration between the film layers and reducing the risk of film layer tearing to prevent damage to the film layer material.

[0049] It should be noted that the shapes of the first force-bearing surface 530 and the second force-bearing surface 540 for the first through hole 510 and the second through hole 520 can be determined according to the specific structure and manufacturing process of the display substrate. For example, the first force-bearing surface 530 and the second force-bearing surface 540 can be circular or elliptical, or they can be polygons such as triangles or rectangles. When the first force-bearing surface 530 and the second force-bearing surface 540 are polygons such as triangles or rectangles, their apex corner areas need to be transitioned to remove the apex corners of the first force-bearing surface 530 and the second force-bearing surface 540, so as to avoid stress concentration in the apex corner areas of the first force-bearing surface 530 and the second force-bearing surface 540 due to external pressure F on the display substrate. This will not be elaborated here.

[0050] In some embodiments, the projected area of ​​the first force-bearing surface 530 of the first through-hole 510 on the substrate 100 is greater than the projected area of ​​the second force-bearing surface 540 of the second through-hole 520 on the substrate 100.

[0051] like Figures 4-8 As shown, for the display substrate, by respectively providing a first through-hole 510 and a second through-hole 520 in the first insulating layer 410 and the second insulating layer 420, making the size of the first through-hole 510 larger than the size of the second through-hole 520, and making the distance between the first through-hole 510 and the pressure-bearing surface larger than the distance between the second through-hole 520 and the pressure-bearing surface, the resistance of the display substrate to internal stress caused by external pressure F can be improved, thereby avoiding tearing or damage to the film layer in the display substrate; specifically, since the first through-hole 510 and the second through-hole 520 are formed by etching process, the area of ​​the first force-bearing surface 530 of the first through-hole 510 is smaller than that of its second force-bearing surface. The area of ​​the first force-bearing surface 530 of the second through-hole 520 is smaller than the area of ​​its second force-bearing surface 540. By making the projected area of ​​the first force-bearing surface 530 of the first through-hole 510 on the substrate 100 larger than the projected area of ​​the second force-bearing surface 540 of the second through-hole 520 on the substrate 100, the size of the first through-hole 510 can be much larger than the size of the second through-hole 520. This ensures that when the display substrate is bent by external pressure F, the first force-bearing surface 530 and the second force-bearing surface 540 of the first through-hole 510 can compensate for the tension generated by the film layer, thereby compensating for the tension between the film layers and reducing the problem of tension concentration in local areas.

[0052] In some embodiments, the cross-section of the first through hole 510 and / or the second through hole 520 perpendicular to the substrate 100 is an inverted trapezoid.

[0053] like Figures 4-8As shown, by making the cross-section of the first through-hole 510 and / or the second through-hole 520 perpendicular to the substrate 100 an inverted trapezoid, the area of ​​the first force-bearing surface 530 of the first through-hole 510 is smaller than the area of ​​its second force-bearing surface 540, and the area of ​​the first force-bearing surface 530 of the second through-hole 520 is smaller than the area of ​​its second force-bearing surface 540. This facilitates the direct etching of the first through-hole 510 and the second through-hole 520 into the first insulating layer 410 and the second insulating layer 420 using an etching process, reducing the difficulty of manufacturing the display substrate. At the same time, when using Frit to encapsulate the display substrate, Frit needs to fill into the first through-hole 510 and the second through-hole 520. When the cross-section of the first through-hole 510 and the second through-hole 520 perpendicular to the substrate 100 is an inverted trapezoid, Frit can fill the first through-hole 510 and the second through-hole 520 more fully, which is beneficial to improving the encapsulation effect of the display substrate.

[0054] In some embodiments, the diameter of the first force-bearing surface 530 of the first through hole 510 is 3μm-8μm, and the diameter of the second force-bearing surface 540 of the first through hole 510 is 5μm-10μm; the diameter of the first force-bearing surface 530 of the second through hole 520 is 2.5μm-4μm, and the diameter of the second force-bearing surface 540 of the second through hole 520 is 3μm-5μm.

[0055] like Figure 4 As shown, when the light-emitting side of the display substrate is a pressure-bearing surface, the first through-hole 510 can be disposed in the first insulating layer 410, and the second through-hole 520 can be disposed in the second insulating layer 420. Since the size of the first through-hole 510 is larger than the size of the second through-hole 520, the diameter of the first force-bearing surface 530 of the first through-hole 510 can be set to 3μm-8μm, and the diameter of its second force-bearing surface 540 can be set to 5μm-10μm. The diameter of the first force-bearing surface 530 of the second through-hole 520 can be set to 2.5μm-4μm. The diameter of the second force-bearing surface 540 can be set to 3μm-5μm. For example, the first force-bearing surface 530 and the second force-bearing surface 540 of the first through hole 510 can be set to 6μm and 8μm respectively, and the first force-bearing surface 530 and the second force-bearing surface 540 of the second through hole 520 can be set to 3μm and 4μm respectively, so that the first through hole 510 and the second through hole 520 are distributed in a stepped manner, which is beneficial to the tension compensation and balance of the first insulating layer 410 and the second insulating layer 420 when the display substrate is subjected to external pressure F.

[0056] In some embodiments, the first through holes 510 and the second through holes 520 are each provided in plurality; specifically, a plurality of first through holes 510 are provided in one of the first insulating layer 410 and the second insulating layer 420, and a plurality of second through holes 520 are provided in the other one, which is advantageous to effectively balance the internal stress caused by the external pressure F of the display substrate, improve the resistance and compensation effect of the film layers in the display substrate to the tension, and improve the product quality of the display substrate; for example, as shown in Figure 4 In the frame area of the display substrate, the first through holes 510 and the second through holes 520 can be arranged according to the width of the frame area, for example, two first through holes 510 and two second through holes 520 can be arranged oppositely, which will not be described here.

[0057] In some embodiments, the first through holes 510 and the second through holes 520 are arranged oppositely; or, the first through holes 510 and the second through holes 520 are arranged staggeredly.

[0058] Specifically, when the display substrate is subjected to the external pressure F, the opposite sides of any film layer in the display substrate respectively generate the compression stress and the tension, and the thicker the film layer is, the greater the tension generated on the side far away from the pressure receiving surface; for example, as shown in Figure 4 and Figure 7 When the thickness difference between the first insulating layer 410 and the second insulating layer 420 is small, a plurality of first through holes 510 can be provided in one of the first insulating layer 410 and the second insulating layer 420, and a plurality of second through holes 520 can be provided in the other one, at this time, any first through hole 510 and any second through hole 520 are arranged oppositely, which is advantageous to effectively balance the internal stress caused by the external pressure F; as shown in Figure 6 When the thickness of the first insulating layer 410 is smaller than the thickness of the second insulating layer 420, and the difference is large, the display substrate is bent after being subjected to the external pressure F, and the tension on the first insulating layer 410 is greater than the tension on the second insulating layer 420, therefore, the number of the first through holes 510 arranged in the first insulating layer 410 can be increased to improve the compensation effect of the tension on the first insulating layer 410; at the same time, in order to ensure that the first through holes 510 and the second through holes 520 are connected to each other so that the Frit can be filled into the first through holes 510 and the second through holes 520, the first through holes 510 and the second through holes 520 can be arranged staggeredly to meet the application requirements of the display substrate.

[0059] In some embodiments, the metal layer 200 is provided with a third through hole 210; the orthographic projection of the third through hole 210 on the substrate 100 is located in the orthographic projection of the first through hole 510 on the substrate 100, and the third through hole 210 is in communication with the first through hole 510; or, the third through hole 210 is in communication with the second through hole 520.

[0060] For example, as shown in Figures 4-8As shown, by providing a third through hole 210 on the metal layer 200, the patterned metal layer 200 can form a grid structure. The third through hole 210 can be directly connected to the first through hole 510 or to the second through hole 520. When Frit fills the first through hole 510 and the second through hole 520, the metal layer 200 can directly fill the third through hole 210. After the Frit is cured, since the cured Frit extends into the first through hole 510, the second through hole 520 and the third through hole 210, the connection between the first metal layer 200, the first insulating layer 410 and the second insulating layer 420 can be strengthened, thereby further increasing the durability and reliability of the display substrate.

[0061] In some embodiments, the display substrate further includes an encapsulating adhesive layer 600, which is disposed on the side of the second insulating layer 420 away from the substrate 100; the encapsulating adhesive layer 600 is provided with a bonding portion 610 protruding on the side near the substrate 100, the bonding portion 610 extending into the first through hole 510 and the second through hole 520, and is adapted to the first through hole 510 and the second through hole 520.

[0062] Specifically, such as Figure 8 As shown, Frit can be used to form an encapsulating adhesive layer 600 on the side of the first insulating layer 410 away from the substrate 100, for encapsulating and protecting the underlying film structure. Due to the different dimensions between the first through hole 510 and the second through hole 520, a stepped structure is formed between the first through hole 510 and the second through hole 520. When Frit fills into the first through hole 510 and the second through hole 520, after Frit cures, a protruding bonding portion 610 is formed on the side of the encapsulating adhesive layer 600 away from the substrate 100. The bonding portion 610 is adapted to the stepped structure formed by the first through hole 510 and the second through hole 520, which helps to improve the fixing effect between the bonding portion 610 and the first insulating layer 410 and the second insulating layer 420, thereby increasing the reliability of the connection between the film structures in the display substrate.

[0063] Furthermore, when the encapsulating adhesive layer 600 encapsulates the bezel area of ​​the display substrate, a dark-colored adhesive such as black can be used to form the encapsulating adhesive layer 600, so that the encapsulating adhesive layer 600 formed after curing has a good light absorption effect and prevents light leakage from the display substrate; alternatively, a white or gray adhesive can be used to form the encapsulating adhesive layer 600, so that the encapsulating adhesive layer 600 formed after curing has a good reflective effect and reflects the light that shines on the surface of the encapsulating adhesive layer 600, thereby improving the light utilization rate of the display substrate and improving the light emission effect of the display substrate.

[0064] In some embodiments, the display substrate further comprises a transparent substrate 700 disposed on the side of the encapsulation layer 600 away from the substrate 100, and the transparent substrate 700 covers the projection of the encapsulation layer 600 on the substrate 100.

[0065] As shown in Figure 8 , the display substrate provided by the present application further comprises a transparent substrate 700. After forming the encapsulation layer 600 on the surface of the second insulating layer 420 by using Firt, the transparent substrate 700 can be disposed on the side of the encapsulation layer 600 away from the substrate 100, and the transparent substrate 700 covers the projection of the encapsulation layer 600 on the substrate 100, so as to cover and protect the encapsulation layer 600 and avoid damage to the surface of the display substrate.

[0066] It should be noted that the transparent substrate 700 can be formed of a transparent material to reduce interference with the light output effect of the display substrate. Therefore, the transparent substrate 700 can be formed of a rigid material such as glass and optical quartz, or a flexible material such as polyimide, and will not be described here.

[0067] Based on the same inventive concept, according to Figure 9 and Figures 10A-10F , the present application further provides a preparation method of a display substrate, comprising:

[0068] S10: as shown in Figure 10A , a substrate 100 is provided, and a metal layer 200 is formed on the surface of the substrate 100.

[0069] In this step, when preparing the display substrate, the substrate 100 can be provided as a bearing body of the display substrate. Then, the metal layer 200 is prepared on the surface of the substrate 100 by using a deposition process, and the metal layer 200 formed by the exposure, etching and stripping processes is patterned to improve the encapsulation effect of the display substrate.

[0070] The substrate 100 can be formed of a flexible substrate such as a material such as polyimide, or a rigid substrate such as a material such as glass, optical quartz and optical ceramic, and will not be described here.

[0071] S20: determining the pressure-bearing surface of the display substrate on the light-emitting side and the backlight side of the display substrate; wherein the light-emitting side and the backlight side are respectively located on the opposite sides of the display substrate.

[0072] In this step, according to the application requirements and use scenarios of the display substrate, the pressure-bearing surface of the display substrate is determined among the light-emitting layer and the backlight side of the display substrate, and one of the light-emitting side and the backlight side of the display substrate is taken as the pressure-bearing area of the display substrate to bear the external pressure F; wherein the light-emitting side and the backlight side are located on opposite sides of the display substrate, and the light-emitting side can be the side of the display substrate away from the substrate 100, and the backlight side can be the side of the display substrate where the substrate 100 is exposed.

[0073] S30: as shown in Figures 10B-10F response to the pressure-bearing surface being the light-emitting side of the display substrate, a first insulating layer 410 is formed on the side of the metal layer 200 away from the substrate 100, a first through hole 510 is opened in the first insulating layer 410, and a second insulating layer 420 is formed on the side of the first insulating layer 410 away from the substrate 100, and a second through hole 520 is opened in the second insulating layer 420.

[0074] In this step, after determining that the light-emitting side of the display substrate is the pressure-bearing surface, when the light-emitting side of the display substrate is subjected to external pressure F, the first insulating layer 410 and the second insulating layer 420 will bend towards the substrate 100, at this time the tensile force generated by the first insulating layer 410 is greater than the tensile force generated by the second insulating layer 420; therefore, the first insulating layer 410 can be formed on the side of the metal layer 200 away from the substrate 100 by using a deposition process, and the first through hole 510 can be opened in the first insulating layer 410 by using an exposure, etching and stripping process; then the second insulating layer 420 is formed on the side of the first insulating layer 410 away from the substrate 100 by using a deposition process, and the second through hole 520 is opened in the second insulating layer 420 by using an exposure, etching and stripping process, so that the first through hole 510 and the second through hole 520 are connected, to ensure the compensation effect of the tensile force generated by the first insulating layer 410 by the first through hole 510 and the compensation effect of the tensile force generated by the second insulating layer 420 by the second through hole 520, so as to improve the durability and reliability of the display substrate.

[0075] S40: in response to the pressure-bearing surface being the backlight side of the display substrate, a first insulating layer 410 is formed on the side of the metal layer 200 away from the substrate 100, a second through hole 520 is opened in the first insulating layer 410, and a second insulating layer 420 is formed on the side of the first insulating layer 410 away from the substrate 100, and a first through hole 510 is opened in the second insulating layer 420; wherein the second through hole 520 is in communication with the first through hole 510, and the orthographic projection area of the substrate 100 is smaller than the orthographic projection area of the first through hole 510 on the substrate 100.

[0076] In this step, after determining the backlight side of the display substrate as its pressure bearing surface, when the backlight side of the display substrate is subjected to external pressure F, the first insulating layer 410 and the second insulating layer 420 will bend towards the film layer above the second insulating layer, at this time, the tensile force generated by the second insulating layer 420 is greater than the tensile force generated by the first insulating layer 410; Therefore, the first insulating layer 410 can be formed on the side of the metal layer 200 away from the substrate 100 by using a deposition process, and the second through hole 520 can be opened in the first insulating layer 410 by using an exposure, etching and stripping process; Then the second insulating layer 420 is formed on the side of the first insulating layer 410 away from the substrate 100 by using a deposition process, and the first through hole 510 is opened in the second insulating layer 420 by using an exposure, etching and stripping process, so that the second through hole 520 and the first through hole 510 are connected, to ensure the compensation effect of the tensile force generated by the second through hole 520 on the first insulating layer 410, and the compensation effect of the tensile force generated by the first through hole 510 on the second insulating layer 420, to improve the durability and reliability of the display substrate.

[0077] It should be noted that when the second insulating layer 420 is prepared, in order to prevent the first through hole 510 or the second through hole 520 opened in the first insulating layer 410 from being blocked during the deposition of the second insulating layer 420, when the corresponding through hole of the second insulating layer 420 is prepared, a negative photoresist can be used, and the deposition material in the first through hole 510 or the second through hole 520 provided on the first insulating layer 410 can be removed by exposure technology, to ensure that the first through hole 510 and the second through hole 520 are connected; Or a sacrificial layer (not marked in the figure) can be filled in the first through hole 510 or the second through hole 520 on the first insulating layer 410 in advance, and then the sacrificial layer is removed after the second insulating layer 420 is prepared, and the first through hole 510 and the second through hole 520 can be opened in the first insulating layer 410 or the second insulating layer 420, respectively, which will not be described here.

[0078] Based on the same inventive concept, the present application also provides a display panel, comprising the display substrate in any one of the above embodiments; Specifically, since the display panel can include the display substrate in any one of the above embodiments, it has all the beneficial effects of the display substrate in any one of the embodiments; In addition, the display panel in the above can be applied in devices with display function such as mobile phones, tablet computers, televisions, smart watches, self-service terminals and vehicle display screens, and the like, which will not be described here.

[0079] It is to be understood that the foregoing description is exemplary of the application only and is intended to provide an overview for the understanding of the present application and is not intended to limit the application to the specific form described. From the above description, one skilled in the art can easily ascertain the manner of using the application, the method of operation and the combination of parts and steps to implement the application. Since many modifications, variations, alterations, and equivalents of the application will no doubt become apparent to those skilled in the art once given the benefit of the foregoing description, it is desired that only such limitations be placed on the application as defined by the appended claims to be interpreted in accordance with the specifications and the pertinent prior art.

[0080] Each of the individual embodiments in the present application is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between embodiments can be mutually referred to.

[0081] The description of the application is given for the purpose of exemplification and description and is not intended to be exhaustive or to limit the application to the precise form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. Embodiments are chosen and described in order to best explain the principles of the application and its practical application to thereby enable others skilled in the art to best utilize the application in various embodiments and with various modifications as are suited to the particular use contemplated.

[0082] Those of ordinary skill in the art will understand that the above discussion of any of the embodiments is merely exemplary and is not intended to be limiting of the scope of the application (including the claims) to these examples; the above embodiments or technical features among different embodiments can also be combined, steps can be implemented in any order, and there are many other variations of the aspects of the embodiments of the application as described above, which are not provided in detail for the sake of brevity.

[0083] Although the present application has been described in connection with certain specific embodiments thereof, many modifications, equivalent substitutions and variations will be apparent to those skilled in the art from the foregoing description.

[0084] The embodiments of the present application are intended to cover all such modifications, equivalents substitutions and variations as falling within the scope of the appended claims. Accordingly, any omission, modification, equivalent substitution, improvement, etc. made in the spirit and principle of the embodiments of the present application shall be included in the protection scope of the present application.

Claims

1. A display substrate, characterized by, The display substrate is provided with a light-emitting side and a backlight side on opposite sides thereof, and comprises a substrate, a metal layer, a first insulating layer and a second insulating layer which are stacked; One of the first insulating layer and the second insulating layer is provided with a first through hole, and the other is provided with a second through hole; the first through hole is located in the projection of the metal layer on the substrate; the second through hole is in communication with the first through hole, and the projection area of the second through hole on the substrate is smaller than that of the first through hole; the metal layer is provided with a third through hole which is in communication with one of the first through hole and the second through hole and is located in the projection of the first through hole on the substrate; The light-emitting side is a pressure-bearing surface, the first through hole is arranged in the first insulating layer, the second through hole is arranged in the second insulating layer, and the size of the first through hole is greater than that of the second through hole; after the pressure-bearing surface is subjected to external pressure, the display substrate is bent towards the backlight side, so as to balance and compensate the tension on the first insulating layer through the first through hole, so as to prevent the tension from tearing the metal layer; The backlight side is a pressure-bearing surface, the first through hole is arranged in the second insulating layer, the second through hole is arranged in the first insulating layer, and the size of the first through hole is greater than that of the second through hole; after the pressure-bearing surface is subjected to external pressure, the display substrate is bent towards the light-emitting side, so as to balance and compensate the tension on the second insulating layer through the first through hole, so as to prevent the tension from tearing the upper film layer of the second insulating layer.

2. The display substrate of claim 1, wherein, The opposite sides of the first through hole and the opposite sides of the second through hole are respectively provided with first stress surfaces and second stress surfaces; The distance between the first stress surface of the first through hole and the substrate is smaller than the distance between the second stress surface of the first through hole and the substrate; the distance between the first stress surface of the second through hole and the substrate is smaller than the distance between the second stress surface of the second through hole and the substrate. 3.The display substrate of claim 2, wherein, The projection area of the first stress surface of the first through hole on the substrate is greater than the projection area of the second stress surface of the second through hole on the substrate.

4. The display substrate of claim 2, wherein, The cross section of the first through hole and / or the second through hole perpendicular to the substrate is an inverted trapezoid.

5. The display substrate of claim 4, wherein, The diameter of the first stress surface of the first through hole is 3-8 μm, and the diameter of the second stress surface of the first through hole is 5-10 μm; The diameter of the first stress surface of the second through hole is 2.5-4 μm, and the diameter of the second stress surface of the second through hole is 3-5 μm. 6.The display substrate of claim 1, wherein, The first through hole and the second through hole are both provided with a plurality of through holes. 7.The display substrate of claim 2, wherein, The first through hole and the second through hole are arranged oppositely or are arranged in a staggered manner. 8.The display substrate of claim 1, wherein, The display substrate further comprises: An encapsulation adhesive layer is disposed on the side of the second insulating layer away from the substrate; a bonding portion is disposed on the side of the encapsulation adhesive layer close to the substrate; the bonding portion extends into the first and second through holes and is adapted to the first and second through holes.

9. A method for preparing a display substrate, characterized in that, Comprise: A substrate is provided, and a metal layer is formed on the surface of the substrate; A pressure-bearing surface of the display substrate is determined on the light-emitting side and the backlight side of the display substrate; wherein the light-emitting side and the backlight side are located on opposite sides of the display substrate, respectively; In response to the pressure-bearing surface being the light-emitting side of the display substrate, a first insulating layer is formed on the side of the metal layer away from the substrate, and a first through hole is formed in the first insulating layer; a second insulating layer is formed on the side of the first insulating layer away from the substrate, and a second through hole is formed in the second insulating layer; the size of the first through hole is greater than the size of the second through hole; after the pressure-bearing surface is subjected to external pressure, the display substrate bends towards the backlight side, so as to balance and compensate the tension on the first insulating layer through the first through hole, so as to prevent the metal layer from being torn; In response to the pressure-bearing surface being the backlight side of the display substrate, a first insulating layer is formed on the side of the metal layer away from the substrate, and a second through hole is formed in the first insulating layer; a second insulating layer is formed on the side of the first insulating layer away from the substrate, and a first through hole is formed in the second insulating layer; the size of the first through hole is greater than the size of the second through hole; after the pressure-bearing surface is subjected to external pressure, the display substrate bends towards the light-emitting side, so as to balance and compensate the tension on the second insulating layer through the first through hole, so as to prevent the upper film layer of the second insulating layer from being torn; wherein the second through hole is in communication with the first through hole, and the orthographic projection area of the substrate is smaller than the orthographic projection area of the first through hole on the substrate; The metal layer is provided with a third through hole, the third through hole is in communication with one of the first and second through holes, and the orthographic projection of the substrate is located within the orthographic projection of the first through hole on the substrate.

10. A display panel, characterized by, The display substrate comprises any one of claims 1-8.

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