A method for improving bulb implantation

Abstract

The present invention discloses a ball planting perfection method, which is applied to a ball planting perfection device; a workbench is installed on the lower frame of the device, a product placement table, a workbench calibration block, a needle height measuring device and a calibration camera are fixed at intervals on the top of the workbench, and a Mark camera, a scanning camera, a dispensing needle, a precision positioning camera, a ball replenishing needle, a ball removing needle and a ball box are installed on the upper frame of the device, and the ball box is located below the precision positioning camera; the method includes an equipment calibration step and a ball planting perfection step; the equipment calibration step includes camera position calibration, needle position calibration, needle height measurement calibration and ball removal hole position calibration; the ball planting perfection step is to repair the chip product according to the position updated in the equipment calibration step. The present invention accurately calibrates the positions of four cameras, the positions and height errors of three needles, and the positions of the ball removal holes, so that the ball planting perfection device can subsequently perform precise ball planting perfection on the chip product, thereby improving the quality of the chip product after ball planting perfection.

Description

Technical Field

[0001] The invention relates to the technical field of chip processing, and in particular to a ball planting perfection method. Background Art

[0002] After the ball implantation machine has finished implanting the chip, there may be a few missing balls, extra balls or poor implantation results. Such problems need to be solved by a ball implantation improvement device and the chip needs to be repaired. In the prior art, a Chinese invention patent with announcement number CN116581041B has disclosed a ball implantation improvement device. This type of ball implantation improvement device is generally equipped with a product placement table, a ball removal needle, a glue dispensing needle, a ball replenishment needle, and a scanning camera for scanning the chip implantation status.

[0003] When the ball planting and perfection equipment is transported to other workstations in the factory as needed, the ball removal needles, glue dispensing needles, ball replenishing needles, scanning cameras, etc. on the equipment may be slightly displaced during the transportation process. In the above case, if the equipment directly scans the chip, removes the balls, dispenses glue, and replenishes the balls, it may cause inaccurate positions of ball removal, glue dispensing, and ball replenishment, which will affect the quality of the chip products after repair, that is, the repair effect of the chip products is not good. In addition, after long-term use of the ball planting and perfection equipment, needle wear, needle offset, camera offset, etc. may occur, which will also affect the repair effect. Therefore, the ball planting and perfection equipment needs to be calibrated in a timely manner as needed. Due to the complex structure of the ball planting and perfection equipment, it is difficult to manually measure the positions of structures such as ball removal needles, glue dispensing needles, ball replenishing needles, and cameras, and there is a certain deviation in manual measurement, and accurate calibration cannot be guaranteed. Summary of the invention

[0004] The purpose of the present invention is to provide a ball planting perfection method, which can accurately calibrate the ball planting perfection equipment before reworking the chip, so as to achieve effective and accurate rework of the chip product by the ball planting perfection equipment and improve the quality of the chip product after rework.

[0005] The purpose of the present invention can be achieved through the following technical solutions:

[0006] A bulb planting perfection method, the method is applied to a bulb planting perfection device, the device comprises a lower frame and an upper frame fixed on the top of the lower frame, a workbench is installed on the lower frame, a product placement table, a workbench calibration block, a needle height measuring device and a calibration camera are fixed at intervals on the top of the workbench, a Mark camera, a scanning camera, a dispensing needle, a precision positioning camera, a ball replenishing needle, a ball removing needle and a ball box are installed on the upper frame, and the ball box is located below the precision positioning camera, characterized in that:

[0007] The method comprises an equipment calibration step and a ball planting perfection step;

[0008] The equipment calibration steps are as follows:

[0009] S1, camera position calibration: the workbench calibration block is moved to the bottom of the Mark camera, the scanning camera and the precision positioning camera through the workbench to take corresponding photos, and the positions of the three cameras are calculated and updated according to the captured images; the precision positioning camera and the calibration camera take photos of the same reference object respectively, and the position of the calibration camera is calculated and updated according to the captured images;

[0010] S2, needle position calibration: through the workbench, the calibration camera is moved to the bottom of the dispensing needle, the ball replenishing needle and the ball removing needle respectively to take pictures accordingly, and the positions of the three needles are calculated and updated according to the captured images;

[0011] S3, needle height calibration;

[0012] S4, ball taking hole position calibration: the ball taking hole provided on the top of the ball box is moved to the bottom of the precision positioning camera through the ball box fixing frame to take pictures, and the position of the ball taking hole is calculated and updated according to the taken images;

[0013] The steps of ball planting perfection are as follows:

[0014] The chip product is mounted on the product placement table, the position of the chip product is corrected using the Mark camera in the updated position, and then the chip product is scanned using the scanning camera in the updated position to confirm the defective position on the chip product; after the chip product is scanned, the ball implantation and perfection equipment performs ball removal processing and / or glue dispensing processing and / or ball filling processing on the defective position on the chip product in turn according to the scanning results and the positions of each component updated in the equipment calibration step.

[0015] In a specific implementation manner of the present invention, after replacing a new ball box on the ball box fixing frame, it is necessary to calibrate the position of the ball taking hole of the new ball box, and the steps are as follows:

[0016] The new ball box is moved to the bottom of the precision positioning camera by the ball box fixing frame to take pictures, and the position deviation between the ball taking hole of the ball box and the ball taking hole of the original ball box is calculated based on the captured image, and the position deviation is compensated in the subsequent translation action of the ball box fixing frame.

[0017] In a specific embodiment of the present invention, the steps of needle height measurement calibration are as follows:

[0018] The needle height measuring device is moved to the bottom of the dispensing needle, the ball replenishing needle and the ball removing needle through the workbench to perform corresponding height measurement calibration, so as to obtain the respective height errors of the above three needles and compensate the height errors in the subsequent lifting and lowering actions of the corresponding needles.

[0019] In a specific embodiment of the present invention, the needle height measuring device has a starting surface; the ball implantation and improvement equipment is provided with a standard installation position for each needle, the starting surface is a horizontal reference plane, and the height between the standard installation position and the horizontal reference plane is h1;

[0020] The altimetry calibration includes a step of collecting altitude error and a step of descent compensation.

[0021] The steps to collect height error are:

[0022] S3a, the controller controls the workbench to move so that the needle height measuring device is placed directly below the replaced needle;

[0023] S3b, the controller controls the new needle at the initial installation position to descend for the first time by a distance h1;

[0024] S3c, the controller controls the new needle to descend a distance h2 for the second time, and the new needle should descend below the horizontal reference plane for the second time;

[0025] S3d, after the new needle drops for the second time, the needle height measuring device measures the height h3 between the horizontal reference plane and the new needle and feeds it back to the controller, and the controller calculates the height error Δh=h2-h3 of the new needle;

[0026] S3e, the controller controls the new needle to return to the initial installation position;

[0027] The steps of descent compensation are:

[0028] The controller compensates the height error Δh to the standard descending height of the needle to control the needle to descend.

[0029] In a specific embodiment of the present invention, the needle height measuring device is a contact height sensor, and an elastic probe is vertically installed on the top of the needle height measuring device, and the top surface of the elastic probe is horizontally arranged; when the elastic probe is in a free state, the horizontal plane where the top surface of the elastic probe is located is the starting plane.

[0030] In a specific implementation of the present invention, in step S1, the reference object is a supplementary ball calibration block, and the supplementary ball calibration block is fixed on the front side of the ball box; the supplementary ball calibration block is moved to the bottom of the precise positioning camera through the ball box fixing frame to take pictures, and then the calibration camera is moved to the bottom of the supplementary ball calibration block through the workbench to take pictures.

[0031] In a specific implementation manner of the present invention, the ball planting and perfecting device drives the workbench to move horizontally through a first driving module, and the ball planting and perfecting device drives the ball box fixing frame to move horizontally through a second driving module.

[0032] In a specific embodiment of the present invention, when the ball planting perfection equipment determines that the problem of a defective position on the chip product is poor ball planting effect based on the scanning results, the ball planting perfection equipment sequentially uses the ball removal needle head at the updated position to remove the ball from the defective position, uses the glue dispensing needle head at the updated position to dispense glue to the defective position, and uses the ball replenishing needle head at the updated position and the ball taking hole of the ball box to replenish the ball on the defective position.

[0033] The beneficial effect of the present invention is that the ball planting and perfection equipment is accurately calibrated so that the ball planting and perfection equipment can subsequently perform effective and accurate ball planting and perfection on chip products, thereby improving the quality of chip products after ball planting and perfection. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The present invention will be further described below in conjunction with the accompanying drawings:

[0035] Figure 1 It is a front view of the ball planting and perfecting device of the present invention;

[0036] Figure 2 yes Figure 1 The enlarged schematic diagram of point A in the middle;

[0037] Figure 3 It is a partial structural schematic diagram of the ball planting and perfecting equipment in the present invention;

[0038] Figure 4 yes Figure 3 The enlarged schematic diagram of point B in the middle;

[0039] Figure 5 It is a partial structural schematic diagram of the ball box fixing frame in the present invention;

[0040] Figure 6 It is a partial structural schematic diagram of the plastic box fixing frame in the present invention;

[0041] Figure 7 It is a partial structural schematic diagram of the lower frame in the present invention.

[0042] Figure 8 It is a schematic diagram of the process of collecting height error steps.

[0043] The accompanying drawings are denoted as follows:

[0044] 10. Upper rack; 11. Mark camera; 12. Scanning camera; 13. Glue dispensing needle; 14. Precision positioning camera; 15. Ball replenishment needle; 16. Ball removal needle; 17. Ball box fixing frame; 171. Ball box; 1711. Ball removal hole; 172. Ball replenishment calibration block; 18. Glue box fixing frame; 181. Glue box;

[0045] 20. Lower frame; 21. Workbench; 22. Product placement table; 23. Workbench calibration block; 24. Calibration camera; 25. Needle height measuring device. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] A ball planting perfection method is provided, so that a ball planting perfection device can effectively and accurately repair chip products.

[0048] See also Figure 1 As shown, the ball implantation and perfection equipment includes a lower frame 20 and an upper frame 10 fixed above the lower frame 20. In this embodiment, the length direction of the upper frame 20 is the X axis, the width direction of the upper frame 10 is the Y axis, and the vertical direction is the Z axis.

[0049] See also Figure 3 , Figure 7 As shown, a horizontally arranged workbench 21 is installed on the top table of the lower frame 20. A product placement table 22, a workbench calibration block 23, a calibration camera 24 and a pin height measuring device 25 are fixed at intervals on the top of the workbench 21. Among them, a rotation drive module is arranged between the product placement table 22 and the workbench 21. The rotation drive module is a module driven by a rotary motor so that the product placement table 22 can rotate horizontally. The workbench calibration block 23 is arranged near the product placement table 22 and is located on the right side of the product placement table 22. The calibration camera 24 and the pin height measuring device 25 are fixed on the right edge of the workbench 21, and the pin height measuring device 25 is located behind the calibration camera 24.

[0050] The lens of the calibration camera 24 is arranged vertically upwards for photographing components installed on the upper frame 10 .

[0051] Among them, the top of the needle height measuring device 25 is equipped with an elastic probe. The elastic probe is set vertically, and its top surface is set horizontally. The top surface is a height measuring surface for contacting the needle. Since the area of ​​the height measuring surface is much larger than the area of ​​the needle to be measured, a slight deviation of the needle height measuring device on the X-axis and the Y-axis will not affect the height measuring accuracy of the needle height measuring device. Therefore, there is no need to calibrate the position of the needle height measuring device. When the elastic probe is in a free state, the horizontal plane where the height measuring surface is located is the starting plane. The principle of height measurement by the needle height measuring device 25 is as follows:

[0052] When the needle is placed on the starting surface, the needle just contacts the height measuring surface. At this time, if the needle moves downward again, the height measuring surface can be driven to move downward synchronously. The needle height measuring device 25 can obtain the height value of the needle moving downward from the starting surface by detecting the height value of the height measuring surface falling. Then, the needle moves upward to separate the needle from the height measuring surface. At this time, the elastic probe performs vertical reset rebound to reset the height measuring surface to the starting surface again, so as to perform the next height measurement.

[0053] A first drive module is provided between the workbench 21 and the lower frame 20. The first drive module is composed of a first X-axis linear drive module and a first Y-axis linear drive module. Both of the above linear drive modules are linear modules driven by servo motors, so that the workbench 21 can move along the X-axis and Y-axis directions.

[0054] See also Figure 1 to Figure 4 As shown, the top crossbeam of the upper frame 10 is provided with a Mark camera 11, a scanning camera 12, a dispensing needle 13, a precision positioning camera 14, a ball replenishing needle 15 and a ball removing needle 16 in sequence along the X-axis direction. In addition, a ball box fixing frame 17 and a glue box fixing frame 18 are also provided on the top crossbeam.

[0055] Among them, the lenses of the Mark camera 11, the scanning camera 12 and the precision positioning camera 14 are all set vertically downward. The needles of the glue dispensing needle 13, the ball replenishing needle 15 and the ball removing needle 16 are all set vertically downward. The Mark camera 11, the scanning camera 12, the glue dispensing needle 13, the precision positioning camera 14, the ball replenishing needle 15 and the ball removing needle 16 are respectively assembled on the top beam through the corresponding Z-axis linear drive modules. The Z-axis linear drive modules all use linear modules driven by servo motors, so that the Mark camera 11, the scanning camera 12, the glue dispensing needle 13, the precision positioning camera 14, the ball replenishing needle 15 and the ball removing needle 16 can move up and down along the Z-axis direction.

[0056] Among them, see Figure 5 As shown, a ball box 171 for storing solder balls is mounted on the ball box fixing frame 17. A ball replenishment calibration block 172 is fixed to the front side of the ball box 171. A ball taking hole 1711 for the ball replenishment needle 15 to take the ball is provided on the top of the ball box 171. A second drive module is provided between the ball box fixing frame 17 and the top crossbeam of the upper frame 10. The second drive module is composed of a second X-axis linear drive module and a second Y-axis linear drive module. The above two linear drive modules are both linear modules driven by servo motors, so that the ball box fixing frame 17 can move along the X-axis and Y-axis directions.

[0057] Furthermore, the ball box 171 is connected with an air pipe. When the ball replenishing needle 15 needs to take the ball, the air pipe connected to the ball box 171 blows air into the inner cavity of the ball box 171, blows the solder balls in the ball box 171 to the ball taking hole 1711, and then the ball replenishing needle 15 sucks the solder balls away through the suction action. If the ball taking hole 1711 is too large, the problem of flying balls will occur, that is, the solder balls will scatter outside the ball box 171. Therefore, the diameter of the ball taking hole 1711 needs to be set smaller to avoid the problem of flying balls. Since the diameter of the ball taking hole 1711 is small, a slight deviation of the ball taking hole 1711 in the X-axis direction and the Y-axis direction will affect the taking of the ball by the ball replenishing needle 15. Therefore, the position of the ball taking hole 1711 needs to be calibrated.

[0058] Among them, see Figure 6 As shown, a glue box 181 for storing glue is mounted on the glue box fixing frame 18. A glue taking port for the glue dispensing needle 13 to take glue is provided at the top of the glue box 181. A third drive module is provided between the glue box fixing frame 18 and the top crossbeam of the upper frame 10. The third drive module is composed of a third X-axis linear drive module and a third Y-axis linear drive module. Both of the above linear drive modules are linear modules driven by servo motors so that the glue box fixing frame 18 can move along the X-axis and Y-axis directions. Since the glue stored in the glue box 181 is viscous and not easy to spill, and the caliber of the glue taking port is much larger than the outer diameter of the glue dispensing needle 13, a slight deviation of the glue box 181 on the X-axis and Y-axis will not affect the glue dispensing needle 13 from taking glue. Therefore, there is no need to calibrate the position of the glue taking port.

[0059] When all components of the ball implanting and perfection equipment are set in their respective initial positions, the horizontal plane of the top surface of the product placement table 22 is located below the Mark camera 11, the scanning camera 12, the glue dispensing needle 13, the precision positioning camera 14, the ball replenishing needle 15, the ball removing needle 16, the ball box fixing frame 17 and the glue box fixing frame 18. The ball box 171 is located below and behind the needle head of the ball replenishing needle 15, and the glue box 181 is located below and behind the needle head of the glue dispensing needle 13.

[0060] The needle height measuring device, all driving modules and all cameras on the ball planting perfection device are respectively connected to the controller of the ball planting perfection device. The first driving module establishes a first driving coordinate system, and the first driving coordinate system is a two-dimensional coordinate system. When the workbench 21 is in the initial position, the position where the center of the workbench calibration block 23 is located is the origin of the first driving coordinate system. The X-axis direction of the first driving coordinate system is consistent with the X-axis direction of the ball planting perfection device, and its Y-axis direction is consistent with the Y-axis direction of the ball planting perfection device. The second driving module establishes a second driving coordinate system, and the second driving coordinate system is a two-dimensional coordinate system, with the initial position of the ball box fixing frame 17 as the origin, its X-axis direction is consistent with the X-axis direction of the ball planting perfection device, and its Y-axis direction is consistent with the Y-axis direction of the ball planting perfection device. The third driving module establishes a third driving coordinate system. The third driving coordinate system is a two-dimensional coordinate system, with the initial position of the glue box fixing frame 18 as the origin, its X-axis direction is consistent with the X-axis direction of the ball planting perfection device, and its Y-axis direction is consistent with the Y-axis direction of the ball planting perfection device.

[0061] When the ball planting and perfecting equipment is working, the staff can obtain the actual coordinates of the workbench calibration block 23 in the first driving coordinate system, the actual coordinates of the ball box fixing frame 17 in the second driving coordinate system, and the actual coordinates of the glue box fixing frame 18 in the third driving coordinate system through the controller. In addition, since the relative position between the workbench calibration block 23 and the center of the product placement table 22 is fixed, that is, the relative position between the two is known, the actual coordinates of the center of the product placement table 22 in the first driving coordinate system are also known.

[0062] The ball planting improvement method includes a device calibration step and a ball planting improvement step. The device calibration step is used after the ball planting improvement device is moved and for regular calibration of the ball planting improvement device.

[0063] The equipment calibration steps include camera position calibration, needle position calibration, needle height calibration and ball hole position calibration.

[0064] S1. Camera position calibration.

[0065] The workbench calibration block 23 is moved to the bottom of the Mark camera 11, the scanning camera 12 and the precise positioning camera 14 through the workbench 21 to take corresponding photos, and the positions of the above three cameras are updated according to the captured images.

[0066] Specifically, taking Mark camera 11 as an example,

[0067] S11, position calibration of Mark camera 11, the steps are as follows:

[0068] S11a, the controller controls the workbench 21 to move so that the workbench calibration block 23 is placed directly below the Mark camera 11; at this time, the controller can know that the actual coordinates of the center of the workbench calibration block 23 in the first driving coordinate system are (x1, y1).

[0069] S11b, Mark camera 11 takes a picture of the workbench calibration block 23 to obtain a first calibration block image. The controller uses the center of the first calibration block image as the origin to build a first calibration block image coordinate system, whose X-axis direction is consistent with the X-axis direction of the ball planting perfection device, and its Y-axis direction is consistent with the Y-axis direction of the ball planting perfection device. The controller obtains the actual coordinates of the center of the workbench calibration block 23 in the first calibration block image coordinate system based on the first calibration block image as (m1, n1). It can be obtained that the actual coordinates of the Mark camera 11 in the first drive coordinate system are (x M ,y M ), where x M =x1-m1,y M =y1-n1.

[0070] Similarly, the actual coordinates of the scanning camera 12 in the first driving coordinate system can be obtained as (x 扫 ,y 扫 ), i.e. S12, position calibration of the scanning camera 12, the steps are as follows:

[0071] S12a, the controller controls the workbench 21 to move so that the workbench calibration block 23 is placed directly below the scanning camera 12; at this time, the controller can know that the actual coordinates of the center of the workbench calibration block 23 in the first driving coordinate system are (x2, y2).

[0072] S12b, the scanning camera 12 takes a picture of the workbench calibration block 23 to obtain a second calibration block image. The controller uses the center of the second calibration block image as the origin to establish a second calibration block image coordinate system, whose X-axis direction is consistent with the X-axis direction of the ball planting and improvement equipment, and whose Y-axis direction is consistent with the Y-axis direction of the ball planting and improvement equipment. The controller obtains the actual coordinates of the center of the workbench calibration block 23 in the second calibration block image coordinate system according to the second calibration block image as (m 扫 , n 扫 ). Thus, the actual coordinates of the scanning camera 12 in the first driving coordinate system can be obtained as (x 扫 ,y 扫 ). Among them, x 扫 =x2-m 扫 ,y 精 =y2-n 扫 .

[0073] Similarly, the actual coordinates of the precise positioning camera 14 in the first driving coordinate system are (x 精,y 精 ), i.e. S13, position calibration of the precise positioning camera 14, the steps are as follows:

[0074] S13a, the controller controls the workbench 21 to move so that the workbench calibration block 23 is placed directly below the precision positioning camera 14; at this time, the controller can know that the actual coordinates of the center of the workbench calibration block 23 in the first driving coordinate system are (x3, y3).

[0075] S13b, the precision positioning camera 14 takes a picture of the workbench calibration block 23 to obtain a third calibration block image. The controller uses the center of the third calibration block image as the origin to establish a third calibration block image coordinate system, whose X-axis direction is consistent with the X-axis direction of the ball planting and improvement equipment, and its Y-axis direction is consistent with the Y-axis direction of the ball planting and improvement equipment. The controller obtains the actual coordinates of the center of the workbench calibration block 23 in the third calibration block image coordinate system according to the third calibration block image (m 精 , n 精 ). Thus, the actual coordinates of the precise positioning camera 14 in the first driving coordinate system can be obtained as (x 精 ,y 精 ). Among them, x 精 =x3-m 精 ,y 精 =y3-n 精 .

[0076] The controller updates the position data of the mark camera 11 , the scanning camera 12 , and the precise positioning camera 14 .

[0077] S14, move the supplementary ball calibration block 172 to the bottom of the precise positioning camera 14 through the ball box fixing frame 17 to take pictures; move the calibration camera 24 to the bottom of the supplementary ball calibration block 172 through the workbench 21 to take pictures; update the position of the calibration camera 24 according to the images captured by the two cameras.

[0078] Specifically, the specific steps of step S14 are as follows:

[0079] S14a, the controller controls the ball box fixing frame 17 to move so that the supplementary ball calibration block 172 is placed directly below the precise positioning camera 14.

[0080] S14b, the precision positioning camera 14 takes a picture of the supplementary ball calibration block 172 to obtain a supplementary ball positioning block image. The controller uses the center of the supplementary ball positioning block image as the origin to establish a supplementary ball positioning block image coordinate system, whose X-axis direction is consistent with the X-axis direction of the ball planting improvement device, and its Y-axis direction is consistent with the Y-axis direction of the ball planting improvement device. The controller obtains the actual coordinates of the center of the supplementary ball calibration block 172 in the supplementary ball positioning block image coordinate system based on the supplementary ball positioning block image as (m2, n2). It is known that the actual coordinates of the precision positioning camera 14 in the first driving coordinate system are (x精 ,y 精 ), then the actual coordinates of the center of the ball-filling calibration block 172 in the first driving coordinate system are (x 精 +m2,y 精 +n2).

[0081] S14c, the calibration camera 24 takes a picture of the supplementary ball calibration block 172 to obtain the supplementary ball positioning block calibration image. The controller uses the center of the supplementary ball positioning block calibration image as the origin to establish a supplementary ball positioning block calibration image coordinate system, whose X-axis direction is consistent with the X-axis direction of the ball planting improvement device, and its Y-axis direction is consistent with the Y-axis direction of the ball planting improvement device. The controller obtains the actual coordinates of the center of the supplementary ball calibration block 172 in the supplementary ball positioning block calibration image coordinate system based on the supplementary ball positioning block calibration image as (m3, n3). It can be obtained that at this time, the actual coordinates of the calibration camera 24 in the first driving coordinate system are (x 标 ,y 标 ), where x 标 =x 精 +m2-m3,y 标 =y 精 +n2-n3.

[0082] S14d, the controller updates the position data of the calibration camera 24.

[0083] S2. Calibrate the needle position.

[0084] The calibration camera 24 is moved to the lower part of the dispensing needle 13, the ball removal needle 16 and the ball replenishing needle 15 through the workbench 21 to take pictures respectively. The positions of the three needles are calculated according to the captured images, which specifically includes the dispensing needle position calibration, the ball removal needle position calibration and the ball replenishing needle position calibration. The specific calibration steps are as follows:

[0085] S21, dispensing needle position calibration, the steps are as follows:

[0086] S21a, the controller controls the workbench 21 to move so that the calibration camera 24 is placed directly below the needle head of the dispensing needle 13.

[0087] S21b, the calibration camera 24 takes a picture of the dispensing needle 13 needle head to obtain the dispensing needle calibration image. The controller uses the center of the dispensing needle calibration image as the origin to establish a dispensing needle calibration image coordinate system, whose X-axis direction is consistent with the X-axis direction of the ball planting improvement device, and its Y-axis direction is consistent with the Y-axis direction of the ball planting improvement device. The controller obtains the actual coordinates of the dispensing needle 13 needle head in the dispensing needle calibration image coordinate system based on the dispensing needle calibration image as (m4, n4). It can be obtained that the actual coordinates of the dispensing needle 13 needle head in the first driving coordinate system are (x 点针 ,y 点针). Among them, x 点针 =x 标 +m4,y 点针 =y 标 +n4.

[0088] Similarly, the actual coordinates of the needle head of the ball replenishing needle 15 in the first driving coordinate system are (x 补针 ,y 补针 ), i.e. S22, ball replenishment needle position calibration, the steps are as follows:

[0089] S22a, the controller controls the workbench 21 to move so that the calibration camera 24 is placed directly below the needle head of the ball replenishing needle 15.

[0090] S22b, the calibration camera 24 takes a picture of the tip of the ball-supplementing needle 15 to obtain a calibration image of the ball-supplementing needle. The controller uses the center of the calibration image of the ball-supplementing needle as the origin to establish a coordinate system of the calibration image of the ball-supplementing needle, whose X-axis direction is consistent with the X-axis direction of the ball-planting and perfection device, and whose Y-axis direction is consistent with the Y-axis direction of the ball-planting and perfection device. The controller obtains the actual coordinates of the tip of the ball-supplementing needle 15 in the calibration image coordinate system according to the calibration image of the ball-supplementing needle as (m5, n5). Thus, it can be obtained that the actual coordinates of the tip of the ball-supplementing needle 15 in the first driving coordinate system are (x 补针 ,y 补针 ). Among them, x 补针 =x 标 +m5,y 补针 =y 标 +n5.

[0091] Similarly, the actual coordinates of the ball removal needle 16 in the first driving coordinate system can be obtained as (x 除针 ,y 除针 ), i.e. S23, except for the ball needle position calibration, the steps are as follows:

[0092] S23a, the controller controls the workbench 21 to move so that the calibration camera 24 is placed directly below the needle head of the ball removal needle 16.

[0093] S23b, the calibration camera 24 takes a picture of the ball removal needle 16 to obtain a ball removal needle calibration image. The controller uses the center of the ball removal calibration image as the origin to establish a ball removal needle calibration image coordinate system, whose X-axis direction is consistent with the X-axis direction of the ball planting and improvement equipment, and its Y-axis direction is consistent with the Y-axis direction of the ball planting and improvement equipment. The controller obtains the actual coordinates of the ball removal needle 16 in the ball removal needle calibration image coordinate system based on the ball removal needle calibration image as (m6, n6). It can be obtained that the actual coordinates of the ball removal needle 16 in the first driving coordinate system are (x 除针 ,y 除针 ), where x 除针 =x 标 +m6,y除针 =y 标 +n6.

[0094] The controller updates the position data of the dispensing needle 13, the ball removing needle 16, and the ball replenishing needle 15.

[0095] S3. Needle height calibration.

[0096] In the ball planting and finishing equipment, the dispensing needle 13, the ball replenishing needle 15, and the ball removing needle 16 need to be replaced. When replacing, the ideal situation is to install the needles of the dispensing needle 13, the ball replenishing needle 15, and the ball removing needle 16 to their respective standard installation positions, but the reality is that the actual installation position may be higher or lower than the standard installation position, so it is necessary to measure the needle height of the replaced dispensing needle 13, the ball replenishing needle 15, and the ball removing needle 16 respectively.

[0097] Taking the starting surface of the height measuring surface of the needle height measuring device as the horizontal reference plane, the controller controls the needle height measuring device to move to the bottom of each needle (i.e., the dispensing needle 13, the ball replenishing needle 15, and the ball removing needle 16). The height between the standard installation position and the horizontal reference plane is h1 (this height is saved in the controller of the ball planting improvement equipment).

[0098] The specific needle height measurement calibration specifically includes the steps of collecting height error and descent compensation.

[0099] refer to Figure 8 As shown in the figure, the process of collecting height error is:

[0100] S3a, the controller controls the workbench 21 to move so that the needle height measuring device 25 is placed directly below the replaced needle;

[0101] S3b, the controller controls the new needle at the initial installation position to descend for the first time by a distance h1;

[0102] S3c, the controller controls the new needle to descend a distance h2 for the second time, and the new needle should descend below the horizontal reference plane for the second time;

[0103] S3d, after the new needle drops for the second time, the needle height measuring device measures the height h3 between the horizontal reference plane and the new needle and feeds it back to the controller, and the controller calculates the height error Δh=h2-h3 of the new needle;

[0104] S3e, the controller controls the new needle to return to the initial installation position;

[0105] The steps of descent compensation are:

[0106] The controller compensates the height error Δh to the standard descending height of the needle to control the needle to descend.

[0107] The following is a detailed introduction to the needle height measurement calibration of the dispensing needle 13, the ball replenishing needle 15, and the ball removing needle 16.

[0108] S31, Dispensing needle height calibration

[0109] The needle height measurement calibration of the dispensing needle 13 includes the steps of collecting the height error of the dispensing needle and compensating the drop of the dispensing head. Taking the starting surface of the height measurement surface of the needle height measurement device as the horizontal reference plane, the height between the standard installation position of the dispensing needle (i.e., the dispensing head) and the horizontal reference plane is h 1点 (This height is stored in the controller of the ball implantation equipment).

[0110] The steps for collecting the height error of the dispensing needle are as follows:

[0111] S31a, the controller controls the workbench 21 to move so that the needle height measuring device 25 is placed directly below the needle of the replaced dispensing needle 13;

[0112] S31b, the controller controls the new dispensing head at the initial installation position to descend for the first time h 1点 distance;

[0113] S31c, the controller controls the new dispensing head to descend for the second time h 2点 Distance, the new dispensing head should descend below the horizontal reference plane for the second descent;

[0114] S31d, the needle height measuring device measures the height h between the horizontal reference plane and the new dispensing head after the new dispensing head descends for the second time 3点 And feedback to the controller, the controller calculates the height error Δh of the new dispensing head 点 =h 2点 -h 3点 ;

[0115] S31e, the controller controls the new dispensing head to return to the initial installation position;

[0116] The steps for dispensing head descent compensation are:

[0117] The controller converts the height error Δh 点 Compensation for the standard drop height H of the dispensing needle 1点 , to control the new dispensing head to perform the dipping action;

[0118] The controller converts the height error Δh 点 Compensation for the standard drop height H of the dispensing needle 2点 , to control the new dispensing head to perform dispensing action.

[0119] S32, needle height calibration of ball supplement needle 15

[0120] The needle height calibration of the ball replenishing needle 15 includes the steps of collecting the height error of the ball replenishing needle and compensating the drop of the ball replenishing head (i.e. the needle of the ball replenishing needle).

[0121] Taking the starting surface of the height measuring surface of the needle height measuring device as the horizontal reference plane, the height between the standard installation position of the needle of the ball replenishing needle and the horizontal reference plane is h. 1补 (This height is stored in the controller of the ball implantation equipment).

[0122] The steps to collect the height error of the ball filling needle are as follows:

[0123] S32a, the controller controls the workbench 21 to move so that the needle height measuring device 25 is placed directly below the ball replenishing head of the replaced ball replenishing needle 15;

[0124] S32b, the controller controls the new ball filling head at the initial installation position to descend for the first time h 1补 distance;

[0125] S32c, the controller controls the new ball-filling head to descend for the second time h 2补 Distance, the new ball head should descend below the horizontal reference plane for the second descent;

[0126] S32d, the needle height measuring device measures the height h between the horizontal reference plane and the new ball filling head after the new ball filling head descends for the second time 3补 And feedback to the controller, the controller calculates the height error Δh of the new ball head 补 =h 2补 -h 3补 ;

[0127] S33d, the controller controls the new ball-filling head to return to the initial installation position.

[0128] The steps for compensating the drop of the ball filling head are as follows:

[0129] The controller converts the height error Δh 补 Compensate for the standard drop height H of the ball picking needle 1补 , to control the new ball-making head to take the ball;

[0130] The controller converts the height error Δh 补 Compensate for the standard drop height H of the ball replenishment needle 2补 , to control the new ball-catching head to perform the ball-catching action.

[0131] S33, except for the needle height calibration of ball needle 16

[0132] The needle height measurement calibration of the ball removal needle 16 includes the steps of collecting the height error of the ball removal needle and compensating the descent of the ball removal head (i.e. the needle of the ball removal head).

[0133] Take the starting surface of the height measuring surface of the needle height measuring device as the horizontal reference plane, and the height between the standard installation position of the needle except the ball needle and the horizontal reference plane is h 1除 (This height is stored in the controller of the ball implantation equipment).

[0134] The steps to collect the height error of the ball removal needle are as follows:

[0135] S32a, the controller controls the workbench 21 to move so that the needle height measuring device 25 is placed directly below the ball removing head of the replaced ball removing needle 16;

[0136] S32b, the controller controls the new ball removal head at the initial installation position to descend for the first time h 1除 distance;

[0137] S32c, the controller controls the new ball removal head to descend for the second time h 2除 Distance, the new ball head should be lowered to below the horizontal reference plane for the second descent;

[0138] S32d, the needle height measuring device measures the height h between the horizontal reference plane and the new ball filling head after the new ball removal head descends for the second time. 3除 And feedback to the controller, the controller calculates the height error Δh of the new ball head 除 =h 2除 -h 3除 ;

[0139] S32d, the controller controls the new ball removal head to return to the initial installation position.

[0140] The steps for ball head drop compensation are as follows:

[0141] The controller converts the height error Δh 除 Compensate for the ball removal needle's standard ball removal height H 1除 , to control the new ball removal head to perform the ball removal action.

[0142] S4. Calibrate the ball hole position.

[0143] The ball taking hole position calibration is used to calibrate the position of the ball taking hole 1711 of the ball box 171. After the ball box 171 on the ball box fixing frame 17 is replaced again, the position of the ball taking hole 1711 needs to be calibrated again.

[0144] Assume that before the ball box 171 is replaced, the position of the ball box 171 is accurate, that is, the controller controls the ball box fixing frame 17 to move from the starting position to the position (X i-1 ,Y i-1)(i is the number of times the ball box is replaced, i=1, 2, 3...), the center of the ball taking hole 1711 of the ball box 171 is exactly aligned with the center of the image taken by the precision positioning camera. After the ball box 171 on the ball box fixing frame 17 is replaced again, the controller controls the ball box fixing frame 17 to move from the starting position to the position (X) in the second driving coordinate system. i-1 ,Y i-1 ), due to the movement of the replaced ball box, the center of the ball taking hole 1711 of the new ball box 171 will deviate from the center of the image captured by the calibration precision positioning camera, and the deviation position data is the position deviation between the center hole of the ball taking hole 711 of the new ball box 171 and the center hole of the ball taking hole 711 of the old ball box 171. Therefore, after each replacement of the ball box 171 on the ball box fixing frame 17, the controller needs to compensate for the deviation position data when controlling the movement of the ball box fixing frame 17, and the specific steps are as follows:

[0145] S41, the ball box 171 is moved to the lower part of the precise positioning camera 14 through the ball box fixing frame 17 to take a picture, and the position of the ball taking hole 1711 is calculated according to the taken image.

[0146] Specifically, S41 includes the following steps:

[0147] S411, after re-changing the ball box 171 on the ball box fixing frame 17, the controller controls the ball box fixing frame 17 to move from the starting position to the position (X i-1 ,Y i-1 ).

[0148] S412, the precision positioning camera 14 takes a picture of the ball taking hole 1711 of the ball box 171 to obtain a ball hole calibration image. The controller uses the center of the ball hole calibration image as the origin to establish a ball hole calibration image coordinate system, whose X-axis direction is consistent with the X-axis direction of the ball planting and improvement equipment, and its Y-axis direction is consistent with the Y-axis direction of the ball planting and improvement equipment. The controller obtains the actual coordinates of the center of the ball taking hole 1711 in the ball hole calibration image coordinate system according to the ball hole calibration image as (m7, n7). The numerical data of the coordinates (m7, n7) is the position deviation between the center hole of the ball taking hole 711 of the new ball box 171 and the center hole of the ball taking hole 711 of the old ball box 171. Therefore, after each replacement of the ball box 171 on the ball box fixing frame 17, the controller needs to compensate for the deviation position data when controlling the movement of the ball box fixing frame 17, and compensate the deviation position data to the subsequent translation action of the ball box fixing frame, that is, to move the ball box fixing frame 17 in the second driving coordinate system to the actual coordinate (X i , Y i ) where X i =X i-1 -m7,Y i = Y Yi-1 -n7. At coordinates (X i , Y i ) position, the center of the ball hole 1711 and the position of the precision positioning camera 14 are just aligned vertically.

[0149] Knowing the actual coordinates of the needle head of the ball replenishing needle 15 and the precise positioning camera 14 in the first driving coordinate system, the controller can be used to control the ball box fixing frame 17 to move to the actual coordinate (X i -x 精 +x 补针 , Y i -y 精 +y 补针 ) position, the center of the ball taking hole 1711 and the position of the needle head of the ball replenishing needle 15 are just aligned up and down.

[0150] S42, the controller controls the ball box fixing frame 17 to move in the second driving coordinate system so that the coordinate position data of the ball taking hole 1711 is respectively moved to the position directly below the precision positioning camera and the position directly below the ball replenishing needle, and updates and saves the data.

[0151] The steps to complete the ball planting are:

[0152] S5. Chip product scanning.

[0153] S51 , assemble the chip product to be repaired on the product placement table 22 , and the controller controls the workbench 21 to move according to the updated position of the Mark camera 11 , so that the product placement table 22 is placed directly below the Mark camera 11 .

[0154] S52, the Mark camera 11 takes a picture of the chip product, identifies the Mark point on the chip product based on the captured image, and the controller compares the identified Mark point with the Mark coordinates in the previously saved template, and then corrects the position of the chip product by driving the first drive module and the rotation drive module to make the chip product correct (that is, the position coordinates of the Mark point on the chip product coincide with the position coordinates of the Mark point in the template).

[0155] S53 , after confirming that the chip product is placed correctly, the controller controls the workbench 21 to move according to the updated position of the scanning camera 12 , so that the workbench 21 and the scanning camera 12 cooperate with each other, thereby completing the scanning of the chip product by the scanning camera 12 .

[0156] S54. The device obtains defect locations and corresponding problems on the chip product based on the scanned image.

[0157] S6. Chip product return.

[0158] Specifically, if the problem of the defective position is determined to be missing balls, the device will subsequently perform glue dispensing and ball supplementation on the defective position in sequence. If the problem of the defective position is determined to be multiple balls, the device will subsequently perform ball removal on the defective position in sequence. If the problem of the defective position is determined to be poor ball implantation, the device will subsequently perform ball removal, glue dispensing and ball supplementation on the defective position in sequence.

[0159] When the defect location is caused by poor ball implantation, the specific repair steps are as follows:

[0160] S61, ball removal process

[0161] S611, the controller controls the workbench 21 to move according to the updated position of the ball removal needle 16 so that the actual coordinates of the defect position in the first driving coordinate system are (x 除针 ,y 除针 ), that is, the defect position is aligned with the needle head of the ball removal needle 16.

[0162] S612, the controller controls the ball removal needle 16 to descend (H 1除 +Δh 除 ), and then control the ball removal needle 16 to suck up the solder ball on the defective position and transfer it to the solder ball storage chamber.

[0163] S613: The controller controls the ball removal needle to reset, that is, return to the initial installation position.

[0164] S62, glue dispensing process steps

[0165] S621, the controller controls the workbench 21 to move according to the updated position of the dispensing needle 13 and makes the actual coordinates of the defect position in the first driving coordinate system be (x 点针 ,y 点针 ), that is, at this time, the defect position is aligned with the needle head of the glue dispensing needle 13; then, the controller controls the glue box fixing frame 18 to move so that the glue taking port on the top of the glue box 181 is placed directly below the needle head of the glue dispensing needle 13.

[0166] S622, the controller controls the dispensing needle 13 to descend (H 1点 +Δh 点 ), and then the controller controls the glue dispensing needle 13 to dip the glue at the glue outlet of the glue box 181.

[0167] S623, after dipping in glue, the controller controls the glue dispensing needle 13 to rise to the initial installation position, and the controller controls the glue box fixing frame 18 to return to the initial position.

[0168] S624, the controller controls the dispensing needle 13 to descend (H 2点 +Δh点 ) to dispense glue at the defective location.

[0169] S625. After dispensing the glue, the controller controls the glue dispensing needle 13 to rise to the initial installation position.

[0170] S63, ball supplement processing steps

[0171] S631, the controller controls the workbench 21 to move according to the updated position of the ball-replenishing needle 15, so that the actual coordinates of the position to be defective in the first driving coordinate system are (x 补针 ,y 补针 ), that is, the defect position is aligned with the needle head of the ball filling needle 15; then, the controller controls the ball box fixing frame 17 to move according to the actual position of the ball taking hole 1711, so that the ball taking hole 1711 is aligned with the needle head of the glue dispensing needle 13.

[0172] S632, the controller similarly controls the needle head of the ball replenishing needle 15 to descend (H 1补 +Δh 补 ) to get the ball from the ball taking hole 1711;

[0173] S633, after taking the ball, the controller controls the needle head of the ball replenishing needle 15 to rise to the initial installation position, and the controller also controls the ball box fixing frame 17 to return to the initial position;

[0174] S634, the controller controls the needle head of the ball replenishing needle 15 to descend (H 2补 +Δh 补 ) to fill in the defective position.

[0175] S635, after the balls are replenished, the controller controls the needle head of the ball replenishing needle 15 to rise to the initial installation position.

[0176] It can be seen from the above detailed description that the present invention accurately calibrates the ball planting and perfection equipment so that the ball planting and perfection equipment can subsequently perform effective and accurate ball planting and perfection on chip products, thereby improving the quality of chip products after ball planting and perfection.

[0177] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A method for improving ball planting, which is applied to a ball planting improvement device, wherein the device comprises a lower frame and an upper frame fixed on the top of the lower frame, wherein a workbench is installed on the lower frame, and a product placement table, a workbench calibration block, a needle height measuring device and a calibration camera are fixed at intervals on the top of the workbench, and a Mark camera, a scanning camera, a dispensing needle, a precision positioning camera, a ball replenishing needle, a ball removing needle and a ball box are installed on the upper frame, and the ball box is located below the precision positioning camera, characterized in that: The method comprises an equipment calibration step and a ball planting perfection step; The equipment calibration steps are as follows: S1, camera position calibration: the workbench calibration block is moved to the bottom of the Mark camera, the scanning camera and the precision positioning camera through the workbench to take corresponding photos, and the positions of the three cameras are calculated and updated according to the captured images; the precision positioning camera and the calibration camera take photos of the same reference object respectively, and the position of the calibration camera is calculated and updated according to the captured images; S2, needle position calibration: through the workbench, the calibration camera is moved to the bottom of the dispensing needle, the ball replenishing needle and the ball removing needle respectively to take pictures accordingly, and the positions of the three needles are calculated and updated according to the captured images; S3, needle height calibration; S4, ball taking hole position calibration: the ball taking hole provided on the top of the ball box is moved to the bottom of the precision positioning camera through the ball box fixing frame to take pictures, and the position of the ball taking hole is calculated and updated according to the taken images; The steps of ball planting are as follows: The chip product is mounted on the product placement table, the position of the chip product is corrected using the Mark camera in the updated position, and then the chip product is scanned using the scanning camera in the updated position to confirm the defective position on the chip product; after the chip product is scanned, the ball implantation and perfection equipment performs ball removal processing and / or glue dispensing processing and / or ball filling processing on the defective position on the chip product in turn according to the scanning results and the positions of each component updated in the equipment calibration step.

2. The ball planting perfection method according to claim 1, characterized in that: After replacing a new ball box on the ball box fixing frame, the position of the ball taking hole of the new ball box needs to be calibrated, and the steps are as follows: The new ball box is moved to the bottom of the precision positioning camera by the ball box fixing frame to take pictures, and the position deviation between the ball taking hole of the ball box and the ball taking hole of the original ball box is calculated based on the captured image, and the position deviation is compensated in the subsequent translation action of the ball box fixing frame.

3. The ball planting perfection method according to claim 1, characterized in that: The steps of needle height calibration are as follows: The needle height measuring device is moved to the bottom of the dispensing needle, the ball replenishing needle and the ball removing needle through the workbench to perform corresponding height measurement calibration, so as to obtain the respective height errors of the above three needles and compensate the height errors in the subsequent lifting and lowering actions of the corresponding needles.

4. The ball planting perfection method according to claim 3, characterized in that: The needle height measuring device has a starting surface; the ball planting and perfecting equipment is provided with a standard installation position for each needle, the starting surface is a horizontal reference plane, and the height between the standard installation position and the horizontal reference plane is h1; The height measurement calibration includes a height error collection step and a descent compensation step; The steps to collect height error are: S3a, the controller controls the workbench to move so that the needle height measuring device is placed directly below the replaced needle; S3b, the controller controls the new needle at the initial installation position to descend for the first time by a distance h1; S3c, the controller controls the new needle to descend a distance h2 for the second time, and the new needle should descend below the horizontal reference plane for the second time; S3d, after the new needle drops for the second time, the needle height measuring device measures the height h3 between the horizontal reference plane and the new needle and feeds it back to the controller, and the controller calculates the height error Δh=h2-h3 of the new needle; S3e, the controller controls the new needle to return to the initial installation position; The steps of descent compensation are: The controller compensates the height error Δh to the standard descending height of the needle to control the needle to descend.

5. The ball planting perfection method according to claim 4, characterized in that: The needle height measuring device is a contact height sensor, and an elastic probe is vertically installed on the top of the needle height measuring device, and the top surface of the elastic probe is horizontally arranged; when the elastic probe is in a free state, the horizontal plane where the top surface of the elastic probe is located is the starting plane.

6. The ball planting perfection method according to claim 1, characterized in that: In step S1, the reference object is a supplementary ball calibration block, which is fixed on the front side of the ball box; the supplementary ball calibration block is moved to the bottom of the precise positioning camera through the ball box fixing frame to take pictures, and then the calibration camera is moved to the bottom of the supplementary ball calibration block through the workbench to take pictures.

7. The ball planting perfection method according to claim 1, characterized in that: The ball planting and perfecting device drives the workbench to move horizontally through the first driving module, and the ball planting and perfecting device drives the ball box fixing frame to move horizontally through the second driving module.

8. The ball planting perfection method according to claim 1, characterized in that: When the ball planting perfection equipment determines, based on the scanning results, that the problem of a defective position on the chip product is poor ball planting effect, the ball planting perfection equipment sequentially uses the ball removal needle head at the updated position to remove the ball from the defective position, uses the glue dispensing needle head at the updated position to dispense glue to the defective position, and uses the ball replenishing needle head at the updated position and the ball taking hole of the ball box to replenish the ball on the defective position.

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