A semiconductor processing platform based on positioning components

Abstract

The present invention relates to the field of semiconductor production machine tools, and provides a semiconductor processing platform based on a positioning component, including a machine body, a support leg, a plate-shaped frame, an edge grinding component, a movable positioning component and a debris recovery component, wherein the support leg is fixedly connected to the bottom wall of the machine body, and the plate-shaped frame is fixedly connected to the top wall of the machine body; the edge grinding component includes a motor, a linkage shaft and an edge grinding wheel, wherein the motor is fixedly connected to the top wall of the machine body, the linkage shaft is fixedly connected to the motor rotor, the edge grinding wheel is fixedly connected to the linkage shaft, and an edge grinding groove is provided on the edge grinding wheel; the movable positioning component includes a guide column, a pressure plate, a rotating column, a gear one, a buffer pressure head, a driven seat, a supporting column, a protruding seat and a spring member three. The debris recovery component includes a linkage wheel three, a gear two, a connecting seat two, a transmission belt two, a linkage wheel four, a fan blade two and a debris recovery box. The present invention can make the fixed wafer body automatically enter the edge grinding groove for edge grinding operation, and automatically make the debris fall into the debris recovery box for collection to prevent the debris from flying.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor production machine tools, and in particular to a semiconductor processing platform based on a positioning component. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators. Wafers are the basic materials in the semiconductor manufacturing process, and wafer processing is a key step in manufacturing integrated circuits and various semiconductor devices.

[0003] The current wafer processing technology uses methods such as the Czochralski method to stretch silicon ingots into cylindrical single-crystalline silicon wafers, which are then cut into thin slices by a cutting device to form wafer bodies. The cut wafer bodies then need to be edge-grinded to remove damaged layers, improve flatness, etc. However, most of the current edge grinding is done manually by holding the wafer body on an edge grinding device. This method is time-consuming and labor-intensive, and is likely to generate a large amount of debris that affects user health. Summary of the invention

[0004] In view of the above technical problems, the present invention aims to provide a semiconductor processing platform based on a positioning component. To solve the above technical problems, the present invention adopts the following technical solutions:

[0005] A semiconductor processing platform based on a positioning assembly comprises a machine body, a support leg, a plate-shaped frame, an edge grinding assembly, a movable positioning assembly and a debris recovery assembly, wherein the support leg is fixedly connected to the bottom wall of the machine body, and the plate-shaped frame is fixedly connected to the top wall of the machine body;

[0006] The edge grinding assembly includes a motor, a linkage shaft and an edge grinding wheel. The motor is fixed to the top wall of the machine body, the linkage shaft is fixed to the motor rotor, the edge grinding wheel is fixed to the linkage shaft, and an edge grinding groove is provided on the edge grinding wheel.

[0007] The movable positioning assembly includes a guide column, a pressure plate, a rotating column, a gear one, a buffer pressure head, a driven seat, a support column, a protruding seat and an elastic member three, the guide column is fixedly connected to the top wall of the driven seat, the pressure plate is slidably connected to the guide column, the rotating column is rotatably connected to the bottom wall of the pressure plate, the gear one is fixedly connected to the rotating column, a buffer groove is provided on the buffer pressure head, the rotating column is slidably connected to the inner wall of the buffer groove, the lower end of the rotating column is connected to the bottom wall of the buffer groove through the elastic member two, the driven seat is slidably connected to the top wall of the machine tool body, the support column is rotatably connected to the top wall of the driven seat, the protruding seat is fixedly connected to the top wall of the machine tool body, and the protruding seat is connected to the driven seat through the elastic member three;

[0008] The debris recovery component includes a linkage wheel three, a gear two, a connecting seat two, a transmission belt two, a linkage wheel four, a fan blade two and a debris recovery box. The linkage wheel three is fixedly connected to the linkage shaft. The connecting seat two and the debris recovery box are both fixedly connected to the plate-shaped frame. The linkage wheel four is rotatably connected to the bottom wall of the connecting seat two. The fan blade two is fixedly connected to the linkage wheel four. The linkage wheel four is connected to the linkage wheel three through the transmission belt two. The gear two is connected to the linkage shaft. A recovery chamber is provided on the debris recovery box, and a chip guard plate is fixedly connected to the top wall of the debris recovery box.

[0009] Preferably, the movable positioning assembly also includes an elastic member 1, a mounting seat, a wedge member 1, a wedge member 2, a liquid drainage device, a liquid tank, a transmission box, a connecting seat 1, a linkage wheel 1, a fan blade 1, a transmission belt 1, a linkage wheel 2 and a wedge member 4. The pressure plate is connected to the mounting seat through the elastic member 1, the mounting seat is fixed to the guide column, the wedge member 1 is fixed to the pressure plate, the wedge member 2 is fixed to the driven seat, and the liquid drainage device is fixed to the plate-like frame.

[0010] A movable leaf is rotatably connected in the liquid drainage device, and the movable leaf is fixedly connected to the linkage shaft. The linkage shaft passes through the liquid drainage device, and a rigid tube 1 and a rigid tube 2 are fixedly connected to the liquid drainage device. The liquid tank is fixedly connected to the top wall of the machine tool body, and the liquid tank is filled with liquid. One end of the rigid tube 1 extends into the liquid tank, and the transmission box is slidably connected to the plate-shaped frame. The bottom wall of the transmission box is connected to the top wall of the machine tool body through an elastic member 4, and a wedge-shaped member 3 is fixedly connected to the bottom wall of the transmission box. A weight adjustment cavity is opened on the transmission box, and the rigid tube 2 extends into the weight adjustment cavity. The bottom wall of the weight adjustment cavity is connected to the bottom wall of the transmission box through a liquid discharge channel, and the side wall of the liquid discharge channel is connected to the outer wall of the transmission box through a valve channel. A blocking valve is slidably connected to the inner wall of the valve channel, and the blocking valve extends into the liquid discharge channel. A permanent magnet 2 is fixedly connected to the blocking valve, and a wind receiving piece is rotatably connected to the outer wall of the transmission box through a self-resetting rotating shaft, and a permanent magnet 1 is embedded in the wind receiving piece.

[0011] A connecting seat 1 is fixedly connected to the plate-shaped frame, a linkage wheel 1 is rotatably connected to the connecting seat 1, a fan blade 1 is fixedly connected to a linkage wheel 1, a linkage wheel 1 is connected to a linkage wheel 2 through a transmission belt 1, a linkage wheel 2 is fixedly connected to the linkage shaft, and a wedge-shaped piece 4 is fixedly connected to the plate-shaped frame.

[0012] Preferably, the edge grinding assembly further comprises a reducer, the reducer is fixedly connected to the plate-shaped frame, the linkage shaft is fixedly connected to the reducer input shaft, and the gear 2 is fixedly connected to the reducer output shaft.

[0013] Preferably, the reducer is a planetary gear reducer.

[0014] Preferably, the wind receiving piece is made of plastic.

[0015] Preferably, the plastic has a hollow structure.

[0016] Preferably, the second fan blade is located above the edge of the edging wheel, and the liquid discharge channel is located above the liquid tank.

[0017] Preferably, a slide rail is fixedly connected to the plate-shaped frame, and the transmission box is slidably connected to the slide rail.

[0018] Preferably, a limiting protrusion is fixedly connected to the barrier valve, and the limiting protrusion is located in the liquid discharge channel.

[0019] Preferably, a mass sensor is fixedly connected to the inner bottom wall of the debris recovery box, and the mass sensor is electrically connected to an alarm device arranged in the debris recovery box.

[0020] The present invention has the following beneficial effects:

[0021] The present invention is driven by a single electric component, that is, a motor, so that the buffer pressure head can press and fix the wafer body, automatically enter the fixed wafer body into the edge grinding groove, and the edge grinding groove can automatically perform an edge grinding operation on the wafer body, and automatically cause the debris to fall into the debris recovery box for collection to prevent the debris from flying and endangering the health of users. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention is further described using the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the present invention. A person skilled in the art can obtain other drawings based on the following drawings without creative work.

[0023] Figure 1 It is a structural schematic diagram of a semiconductor processing platform based on a positioning component of the present invention;

[0024] Figure 2 The present invention Figure 1 Structural diagram of the machine body, guide column, driven seat and plate frame;

[0025] Figure 3 The present invention Figure 1 Schematic diagram of the structure of the middle grinding wheel;

[0026] Figure 4 The present invention Figure 1 Schematic diagram of the structure of the middle reducer and gear 2;

[0027] Figure 5 The present invention Figure 1 The enlarged view of point A in the middle;

[0028] Figure 6 The present invention Figure 5 The enlarged view of point B in the middle;

[0029] Figure 7 The present invention Figure 6 Schematic diagram of the structure of the middle barrier valve.

[0030] Figure numerals: 1, machine body; 2, support foot; 3, guide column; 4, pressure plate; 5, elastic member 1; 6, mounting seat; 7, wedge member 1; 8, rotating column; 9, gear 1; 10, buffer pressure head; 11, buffer groove; 12, elastic member 2; 13, driven seat; 14, support column; 15, wafer body; 16, raised seat; 17, elastic member 3; 18, plate frame; 19, wedge member 2; 20, motor; 21, linkage shaft; 22, liquid drainage device; 23, movable leaf; 24, rigid tube 1; 25, rigid tube 2; 26, liquid tank; 27, transmission box; 28, weight adjustment chamber; 29, elastic member four; 30. wedge-shaped piece three; 31. discharge channel; 32. permanent magnet two; 33. barrier valve; 34. limit protrusion; 35. self-resetting shaft; 36. wind receiving piece; 37. permanent magnet one; 38. connecting seat one; 39. linkage wheel one; 40. fan blade one; 41. transmission belt one; 42. linkage wheel two; 43. edge grinding wheel; 44. edge grinding groove; 45. linkage wheel three; 46. reducer; 47. gear two; 48. connecting seat two; 49. transmission belt two; 50. linkage wheel four; 51. fan blade two; 52. debris recovery box; 53. chip guard plate; 54. wedge-shaped piece four; 55. valve channel; 56. slide rail. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, "first", "second", "third", and "fourth" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0033] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] like Figure 1-Figure 6 As shown, a semiconductor processing platform based on a positioning assembly includes a machine body 1, a support leg 2, a plate-shaped frame 18, an edge grinding assembly, a movable positioning assembly, and a debris recovery assembly. The support leg 2 is fixedly connected to the bottom wall of the machine body 1. The support leg 2 is provided with four and is fixedly connected to the machine body 1 by bolts. The plate-shaped frame 18 is fixedly connected to the top wall of the machine body 1.

[0035] The edge grinding assembly includes a motor 20, a linkage shaft 21 and an edge grinding wheel 43. The motor 20 is fixedly connected to the top wall of the machine tool body 1. The linkage shaft 21 is fixedly connected to the rotor of the motor 20. The motor 20 is a device that converts electrical energy into mechanical energy. It uses an energized coil to generate a rotating magnetic field and acts on the rotor to form a magneto-electrical power rotation torque. The motor 20 can be an asynchronous motor. The edge grinding wheel 43 is fixedly connected to the linkage shaft 21. The edge grinding wheel 43 is provided with an edge grinding groove 44. The outer surface of the edge grinding wheel 43 is a rough surface, so as to facilitate edge grinding of the wafer body 15.

[0036] The movable positioning assembly includes a guide column 3, a pressure plate 4, a rotary column 8, a gear 19, a buffer pressure head 10, a driven seat 13, a support column 14, a raised seat 16 and an elastic member 3 17. The guide column 3 is fixedly connected to the top wall of the driven seat 13, the pressure plate 4 is slidably connected to the guide column 3, the rotary column 8 is rotatably connected to the bottom wall of the pressure plate 4, the gear 19 is fixedly connected to the rotary column 8, a buffer groove 11 is provided on the buffer pressure head 10, the rotary column 8 is slidably connected to the inner wall of the buffer groove 11, the lower end of the rotary column 8 is connected to the bottom wall of the buffer groove 11 through an elastic member 2 12, the driven seat 13 is slidably connected to the top wall of the machine body 1, the support column 14 is rotatably connected to the top wall of the driven seat 13, the raised seat 16 is fixedly connected to the top wall of the machine body 1, and the raised seat 16 is connected to the driven seat 13 through an elastic member 3 17;

[0037] The debris recovery component includes a linkage wheel three 45, a gear two 47, a connecting seat two 48, a transmission belt two 49, a linkage wheel four 50, a fan blade two 51 and a debris recovery box 52. The linkage wheel three 45 is fixedly connected to the linkage shaft 21, the connecting seat two 48 and the debris recovery box 52 are both fixedly connected to the plate-shaped frame 18, the linkage wheel four 50 is rotatably connected to the bottom wall of the connecting seat two 48, the fan blade two 51 is fixedly connected to the linkage wheel four 50, the linkage wheel four 50 is connected to the linkage wheel three 45 through the transmission belt two 49, the gear two 47 is connected to the linkage shaft 21, a recovery chamber is opened in the debris recovery box 52, and a chip guard plate 53 is fixedly connected to the top wall of the debris recovery box 52. The chip guard plate 53 is used to prevent debris from flying and facilitate debris to fall into the recovery chamber of the debris recovery box 52.

[0038] like Figure 1-Figure 7As shown, in an optional embodiment of the present invention, the movable positioning assembly further includes an elastic member 5, a mounting seat 6, a wedge member 7, a wedge member 19, a liquid drainage device 22, a liquid tank 26, a transmission box 27, a connecting seat 38, a linkage wheel 39, a fan blade 40, a transmission belt 41, a linkage wheel 42 and a wedge member 44, the pressing plate 4 is connected to the mounting seat 6 through the elastic member 5, the mounting seat 6 is fixed to the guide column 3, the wedge member 7 is fixed to the pressing plate 4, the wedge member 19 is fixed to the driven seat 13, and the liquid drainage device The liquid drainage device 22 is fixedly connected to the plate-shaped frame 18, and a movable leaf 23 is rotatably connected in the liquid drainage device 22. The movable leaf 23 is fixedly connected to the linkage shaft 21. The linkage shaft 21 passes through the liquid drainage device 22. A rigid tube 1 24 and a rigid tube 2 25 are fixedly connected to the liquid drainage device 22. A liquid tank 26 is fixedly connected to the top wall of the machine tool body 1. The liquid tank 26 is filled with liquid, which can also be tap water. One end of the rigid tube 1 24 extends into the liquid tank 26. A transmission box 27 is slidably connected to the plate-shaped frame 18. The bottom wall of the transmission box 27 is connected to the top wall of the machine tool body 1 through an elastic member 29. The transmission box 27 is connected to the wall, and there is no liquid in the weight adjustment chamber 28. Only under the gravity of the transmission box 27, the transmission box 27 will not compress the elastic member 4 29 to the limit state, so that when the liquid enters the weight adjustment chamber 28, the transmission box 27 can move downward. The bottom wall of the transmission box 27 is fixedly connected with a wedge-shaped member 30, and the transmission box 27 is provided with a weight adjustment chamber 28. The rigid tube 25 extends into the weight adjustment chamber 28. The bottom wall of the weight adjustment chamber 28 is connected to the bottom wall of the transmission box 27 through the discharge channel 31, and the side wall of the discharge channel 31 is connected to the outer wall of the transmission box 27 through the valve channel 55. The inner wall of the valve channel 55 is slidably connected to the resistance The isolation valve 33 extends into the discharge channel 31, and a permanent magnet 2 32 is fixedly connected to the isolation valve 33. The outer wall of the transmission box 27 is rotatably connected to a wind receiving piece 36 through a self-resetting rotating shaft 35. A permanent magnet 1 37 is embedded on the wind receiving piece 36. A connecting seat 1 38 is fixedly connected to the plate-like frame 18, and a linkage wheel 1 39 is rotatably connected to the connecting seat 1 38. A fan blade 1 40 is fixedly connected to a linkage wheel 1 39. The linkage wheel 1 39 is connected to a linkage wheel 2 42 through a transmission belt 1 41. The linkage wheel 2 42 is fixedly connected to the linkage shaft 21, and a wedge piece 4 54 is fixedly connected to the plate-like frame 18.

[0039] like Figure 1 , 4 As shown, in an optional embodiment of the present invention, the edging assembly also includes a reducer 46, the reducer 46 is fixedly connected to the plate frame 18, the linkage shaft 21 and the input shaft of the reducer 46 are fixedly connected, and the gear 2 47 is fixedly connected to the output shaft of the reducer 46.

[0040] like Figure 1 , 4As shown, in an optional embodiment of the present invention, the reducer 46 is a planetary gear reducer. The planetary gear reducer can reduce the rotation speed of the second gear 47 to prevent the wafer body 15 from rotating too fast and affecting the edge grinding quality.

[0041] like Figure 1 , 6 As shown, in an optional implementation of the present invention, the wind receiving piece 36 is made of plastic.

[0042] like Figure 1 , 6 As shown, in an optional embodiment of the present invention, the plastic is a hollow structure. The plastic of the hollow structure is relatively light and can be easily driven by the wind generated by the fan blade 40.

[0043] like Figure 1 As shown, in an optional embodiment of the present invention, the second fan blade 51 is located above the edge of the edging wheel 43 , and the liquid discharge channel 31 is located above the liquid tank 26 .

[0044] like Figure 1 , 5 As shown, in an optional embodiment of the present invention, a slide rail 56 is fixedly connected to the plate-shaped frame 18, and the transmission box 27 is slidably connected to the slide rail 56. The slide rail 56 guides the transmission box 27.

[0045] like Figure 1 , 6 As shown, in an optional embodiment of the present invention, a limiting protrusion 34 is fixedly connected to the barrier valve 33, and the limiting protrusion 34 is located in the liquid discharge channel 31. The limiting protrusion 34 prevents the barrier valve 33 from being separated from the valve channel 55.

[0046] like Figure 1 As shown, in an optional embodiment of the present invention, a mass sensor is fixedly connected to the inner bottom wall of the debris recovery box 52, and the mass sensor is electrically connected to an alarm device disposed in the debris recovery box 52. The mass sensor can detect the mass of the debris in the recovery chamber, and when the mass of the debris exceeds a preset value, the alarm device issues an alarm message, such as an alarm sound, to remind the user to handle the debris.

[0047] Implementation process: In the initial state, gear 1 9 and gear 2 47 are in a non-meshing state, the buffer pressure head 10 is located above the support column 14 and a gap is reserved between the two, the gap height is higher than the thickness of the wafer body 15, the wafer body 15 is placed on the upper end of the support column 14, the motor 20 is turned on, the rotor of the motor 20 drives the linkage shaft 21, the linkage wheel 2 42, the movable blade 23, the grinding groove 44, the linkage wheel 3 45 and the input shaft of the reducer 46 to rotate, the gear 2 47 rotates slowly after being decelerated by the reducer 46, the linkage wheel 2 42 drives the linkage wheel 1 39 and the fan blade 1 40 to rotate quickly through the transmission belt 1 41, the fan blade 1 40 generates wind, and the wind force blows the wind receiving piece 36 upward, so that the wind receiving piece 36 rotates around the self-resetting shaft 35 in reverse As the clockwise direction rotates, the wind-receiving piece 36 pushes the blocking valve 33 and the permanent magnet 2 32 to move left, and the blocking valve 33 blocks the liquid discharge channel 31. The wind-receiving piece 36 and the outer wall of the transmission box 27 abut against each other, and the movable leaf 23 rotates rapidly to generate centrifugal force, so that the liquid in the liquid tank 26 enters the weight adjustment chamber 28 through the rigid tube 1 24 and the rigid tube 2 25. The mass of the transmission box 27 gradually increases, and the transmission box 27 overcomes the elastic force of the elastic piece 4 29 and moves downward, so that the wedge piece 3 30 pushes the wedge piece 2 19 and the driven seat 13 to move right, and the wafer body 15 is embedded in the grinding groove 44 of the grinding wheel 43, the gear 2 47 and the gear 1 9 are meshed, and the wedge piece 4 54 pushes the wedge piece 1 7, the rotating column 8, and the buffer pressure head 10 to move downward, and the buffer pressure head 10 presses the wafer body 15. The wafer body 15 is pressed and fixed, the elastic member 2 12 is compressed, the edging wheel 43 grinds the wafer body 15, and the rotation directions of the edging wheel 43 and the edging groove 44 are opposite, so the edging efficiency is improved, and the debris flying out of the wafer body 15 is blocked by the chip blocking plate 53, and the linkage wheel 3 45 drives the transmission belt 2 49, the linkage wheel 4 50, and the fan blade 2 51 to rotate, and the wind generated by the fan blade 2 51 blows the debris into the debris recovery box 52 below, thereby preventing the debris from flying and affecting the health of users, and conveniently recovering the debris, eliminating the troublesome process of subsequent manual cleaning, improving production efficiency, and improving user comfort. After the edging is completed, the motor 20 is turned off, the linkage shaft 21 stops rotating, and other components linked to the linkage shaft 21 also stop rotating, and the wind is After the blade 36 loses the push of wind force, it reverses clockwise and resets under the action of the self-reset force of the self-reset shaft 35, and the permanent magnet 1 37 adsorbs the permanent magnet 2 32, so that the permanent magnet 2 32 and the blocking valve 33 move to the right until the limit protrusion 34 and the right wall of the liquid discharge channel 31 are against each other, and the blocking valve 33 releases the blockage of the liquid discharge channel 31, and the liquid in the weight adjustment chamber 28 flows back into the liquid tank 26 through the liquid discharge channel 31. After the mass of the transmission box 27 is reduced, it moves up and resets under the elastic force of the elastic member 4 29. After the wedge member 2 19 loses the thrust of the wedge member 3 30, it moves left and resets under the elastic force of the elastic member 3 17. After the wedge member 1 7 is separated from the wedge member 4 54, it moves up and resets under the elastic force of the elastic member 1 5. The buffer pressure head 10 releases the pressing and fixing of the wafer body 15.The wafer body 15 after edge grinding can be taken out for subsequent cleaning and thermal oxidation operations.

[0048] The present invention drives a single electric component, namely, the motor 20, so that the buffer pressure head 10 can press and fix the wafer body 15, automatically enter the fixed wafer body 15 into the edge grinding groove 44, and cause the edge grinding groove 44 to automatically grind the wafer body 15, automatically block the discharge channel 31, and automatically cause the debris to fall into the debris recovery box 52 for collection to prevent the debris from flying and endangering the health of the user. After the electric component motor 20 stops running, the components that have been linked can be automatically reset. The present invention has high linkage, can quickly perform automatic edge grinding on the wafer body 15, and improve the production efficiency of semiconductors.

[0049] The components, modules, mechanisms and devices not described in detail in the present invention are all universal standard parts or components known to those skilled in the art, and their structures and principles can be known to those skilled in the art through technical manuals or conventional experimental methods.

[0050] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention, rather than to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the present invention.

Claims

1. A semiconductor processing platform based on a positioning component, characterized in that: The machine tool comprises a machine body (1), a support leg (2), a plate-shaped frame (18), an edge grinding assembly, a movable positioning assembly and a debris recovery assembly, wherein the support leg (2) is fixedly connected to the bottom wall of the machine body (1), and the plate-shaped frame (18) is fixedly connected to the top wall of the machine body (1); The edge grinding assembly comprises a motor (20), a linkage shaft (21) and an edge grinding wheel (43); the motor (20) is fixedly connected to the top wall of the machine tool body (1); the linkage shaft (21) is fixedly connected to the rotor of the motor (20); the edge grinding wheel (43) is fixedly connected to the linkage shaft (21); and an edge grinding groove (44) is provided on the edge grinding wheel (43); The movable positioning assembly comprises a guide column (3), a pressure plate (4), a rotating column (8), a gear (9), a buffer pressure head (10), a driven seat (13), a support column (14), a protruding seat (16) and a third elastic member (17), wherein the guide column (3) is fixedly connected to the top wall of the driven seat (13), the pressure plate (4) is slidably connected to the guide column (3), the rotating column (8) is rotatably connected to the bottom wall of the pressure plate (4), the gear (9) is fixedly connected to the rotating column (8), and the buffer pressure head ( A buffer groove (11) is provided on the upper surface of the machine tool body (1), a rotating column (8) is slidably connected to the inner wall of the buffer groove (11), a lower end of the rotating column (8) is connected to the bottom wall of the buffer groove (11) through a second elastic member (12), a driven seat (13) is slidably connected to the top wall of the machine tool body (1), a supporting column (14) is rotatably connected to the top wall of the driven seat (13), a raised seat (16) is fixedly connected to the top wall of the machine tool body (1), and the raised seat (16) is connected to the driven seat (13) through a third elastic member (17); The debris recovery component comprises a linkage wheel three (45), a gear two (47), a connecting seat two (48), a transmission belt two (49), a linkage wheel four (50), a fan blade two (51) and a debris recovery box (52), wherein the linkage wheel three (45) is fixedly connected to the linkage shaft (21), the connecting seat two (48) and the debris recovery box (52) are both fixedly connected to the plate-shaped frame (18), the linkage wheel four (50) is rotatably connected to the bottom wall of the connecting seat two (48), the fan blade two (51) is fixedly connected to the linkage wheel four (50), the linkage wheel four (50) is connected to the linkage wheel three (45) through the transmission belt two (49), the gear two (47) is connected to the linkage shaft (21), a recovery chamber is provided on the debris recovery box (52), and a chip guard plate (53) is fixedly connected to the top wall of the debris recovery box (52); The movable positioning assembly further comprises an elastic member 1 (5), a mounting seat (6), a wedge member 1 (7), a wedge member 2 (19), a liquid drainage device (22), a liquid storage box (26), a transmission box (27), a connecting seat 1 (38), a linkage wheel 1 (39), a fan blade 1 (40), a transmission belt 1 (41), a linkage wheel 2 (42) and a wedge member 4 (54); the pressure plate (4) is connected to the mounting seat (6) via the elastic member 1 (5); the mounting seat (6) is fixedly connected to the guide column (3); the wedge member 1 (7) is fixedly connected to the pressure plate (4); and the wedge member 2 (19) is fixedly connected to the driven seat. (13), a liquid drainage device (22) is fixedly connected to the plate-shaped frame (18), a movable leaf (23) is rotatably connected in the liquid drainage device (22), the movable leaf (23) is fixedly connected to the linkage shaft (21), the linkage shaft (21) passes through the liquid drainage device (22), a rigid tube 1 (24) and a rigid tube 2 (25) are fixedly connected to the liquid drainage device (22), a liquid tank (26) is fixedly connected to the top wall of the machine tool body (1), the liquid tank (26) is filled with liquid, one end of the rigid tube 1 (24) extends into the liquid tank (26), and a transmission box (27) is slidably connected to the plate-shaped frame (18) The bottom wall of the transmission box (27) is connected to the top wall of the machine tool body (1) through an elastic member 4 (29), a wedge-shaped member 3 (30) is fixedly connected to the bottom wall of the transmission box (27), a weight adjustment chamber (28) is provided on the transmission box (27), a rigid tube 2 (25) extends into the weight adjustment chamber (28), the bottom wall of the weight adjustment chamber (28) is connected to the bottom wall of the transmission box (27) through a discharge channel (31), a side wall of the discharge channel (31) is connected to the outer wall of the transmission box (27) through a valve channel (55), an inner wall of the valve channel (55) is slidably connected to a blocking valve (33), the blocking valve (33) extends into the discharge channel (31), and the blocking valve ( A permanent magnet 2 (32) is fixedly connected to the outer wall of the transmission box (27) through a self-resetting rotating shaft (35), a wind receiving piece (36) is rotatably connected to the wind receiving piece (36), a permanent magnet 1 (37) is embedded in the wind receiving piece (36), a connecting seat 1 (38) is fixedly connected to the plate-shaped frame (18), a linkage wheel 1 (39) is rotatably connected to the connecting seat 1 (38), a fan blade 1 (40) is fixedly connected to the linkage wheel 1 (39), the linkage wheel 1 (39) is connected to the linkage wheel 2 (42) through a transmission belt 1 (41), the linkage wheel 2 (42) is fixedly connected to the linkage shaft (21), and a wedge-shaped piece 4 (54) is fixedly connected to the plate-shaped frame (18).

2. A semiconductor processing platform based on a positioning component according to claim 1, characterized in that: The edge grinding assembly further comprises a reducer (46), the reducer (46) being fixedly connected to the plate-shaped frame (18), the linkage shaft (21) being fixedly connected to the input shaft of the reducer (46), and the second gear (47) being fixedly connected to the output shaft of the reducer (46).

3. A semiconductor processing platform based on a positioning component according to claim 2, characterized in that: The reducer (46) is a planetary gear reducer.

4. A semiconductor processing platform based on a positioning component according to claim 3, characterized in that: The material of the wind receiving piece (36) includes plastic.

5. A semiconductor processing platform based on a positioning assembly according to claim 4, characterized in that: The plastic has a hollow structure.

6. A semiconductor processing platform based on a positioning assembly according to claim 1, characterized in that: The second fan blade (51) is located above the edge of the edging wheel (43), and the liquid discharge channel (31) is located above the liquid storage box (26).

7. A semiconductor processing platform based on a positioning assembly according to claim 1, characterized in that: A slide rail (56) is fixedly connected to the plate-shaped frame (18), and the transmission box (27) is slidably connected to the slide rail (56).

8. A semiconductor processing platform based on a positioning assembly according to claim 1, characterized in that: A limiting protrusion (34) is fixedly connected to the barrier valve (33), and the limiting protrusion (34) is located in the liquid discharge channel (31).

9. A semiconductor processing platform based on a positioning component according to any one of claims 1 to 8, characterized in that: A mass sensor is fixedly connected to the inner bottom wall of the debris recovery box (52), and the mass sensor is electrically connected to an alarm device arranged in the debris recovery box (52).

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