Server boards and servers

Abstract

The present invention relates to a server card and a server. The server motherboard comprises: a main body, a first surface of the main body having a plug-in slot for inserting a gold finger setting end of a card to be connected; a plurality of first electrical connectors also provided on the first surface, the plurality of first electrical connectors being used to connect to preset circuits on the main body; a plurality of connection terminals, each correspondingly connected to the first electrical connectors, the end portions of the plurality of connection terminals extending into the plug-in slot and configured to abut against the gold fingers on the gold finger setting end when the gold finger setting end is inserted into the plug-in slot. The server card and server of the present invention have good signal consistency, good signal integrity, and high signal quality.

Description

Technical Field

[0001] The present invention relates to the field of computer technology, and in particular to a server board and a server. Background Art

[0002] As signal rates continue to increase, the requirements for signal integrity are also getting higher and higher. In order to ensure the quality of signal transmission in high-speed interconnection systems, it is usually necessary to strictly control signal insertion loss / return loss / impedance. Conventional server signal high-speed interconnection systems generally include a server motherboard with a slot-type connector reserved on the server motherboard. The riser card or standard card is connected to the server motherboard through this connector to achieve signal transmission. However, in the above-mentioned connection method through the connector, the connector itself has loss, resulting in poor signal integrity and poor signal quality. And due to the design / processing differences of various connector manufacturers, there are differences in the electrical performance of the connector, and signal consistency is difficult to control. Summary of the Invention

[0003] Based on this, it is necessary to provide a server board and server with better signal consistency, better signal integrity, and higher signal quality.

[0004] An embodiment of the present application provides a server motherboard, including:

[0005] A mainboard body, wherein a first surface of the mainboard body is provided with a plug-in slot for inserting a gold finger setting end of a card to be connected; a plurality of first electrical connectors are also provided on the first surface, and the plurality of first electrical connectors are used to connect to corresponding preset circuits on the mainboard body;

[0006] A plurality of connection terminals are connected to the first electrical connector in a one-to-one correspondence. The end portions of the plurality of connection terminals extend into the plug-in slot and are configured to abut against the gold fingers on the gold finger setting end in a one-to-one correspondence when the gold finger setting end is inserted into the plug-in slot.

[0007] By opening a plug-in slot on the first surface of the main body of the motherboard and setting a plurality of first electrical connectors, a plurality of connection terminals are connected to the first electrical connectors in a one-to-one correspondence, and the end portion structures of the plurality of connection terminals extend into the plug-in slot and are configured to abut against the gold fingers on the gold finger setting end in a one-to-one correspondence when the gold finger setting end is inserted into the plug-in slot. In this way, the gold fingers are connected to the first electrical connectors in a one-to-one correspondence through the portion of the connection terminal extending into the plug-in slot, thereby realizing electrical connection with the preset circuit on the main body.

[0008] Furthermore, unlike related art where the motherboard is connected to the board via a connector, which results in significant connector losses, the connection terminals directly contact the gold fingers on the board to be connected, achieving an electrical connection. This direct interconnection between the motherboard and the gold fingers significantly improves high-speed signal quality and reduces signal integrity issues. By omitting the connector, the problem of poor signal consistency caused by differences in connectors from different manufacturers is also resolved.

[0009] In one embodiment, the connecting terminal includes a first connecting section and a second connecting section arranged at an angle, the first connecting section is arranged on the first surface, one end of the first connecting section is electrically connected to the corresponding first electrical connector, and the other end is connected to the second connecting section, and the second connecting section extends into the plug-in slot.

[0010] With such a configuration, the second connection section located in the plug slot is responsible for abutting contact with the gold finger, and the first connection section located on the first surface is responsible for electrically connecting with the first electrical connector.

[0011] In one embodiment, the second connecting section is partially arched relative to the slot wall of the plug-in slot so as to elastically abut against the corresponding gold finger.

[0012] In this way, the electrical contact performance between the second connecting section and the corresponding pad on the gold finger is better, and the positioning of the gold finger can also be assisted.

[0013] In one embodiment, the first electrical connector is configured as a soldering pad, and the first connecting section is soldered to the first electrical connector;

[0014] A high-speed signal line and a layer-changing via hole connected to a preset circuit are provided in the mainboard body. The high-speed signal line is electrically connected to the layer-changing via hole, and the layer-changing via hole is electrically connected to the first electrical connector.

[0015] When the first electrical connector is a pad, the connecting terminal can be connected to the pad by welding. This allows for a simple connection between the first electrical connector and the connecting terminal. Of course, to achieve high-speed transmission, the layer-changing vias also require backdrilling to remove the via stub.

[0016] In one embodiment, the first electrical connector is configured as a via, the first connecting section is plugged into the via, and is electrically connected to metal in the via;

[0017] A high-speed signal line connected to a preset circuit is provided in the main body of the mainboard, and the high-speed signal line is electrically connected to the via hole.

[0018] In specific implementation, the high-speed signal line can be a strip line. In order to achieve high-speed transmission, the via hole needs to be back-drilled to remove the via stub.

[0019] In one embodiment, the mainboard body includes a top surface and a bottom surface disposed opposite to each other; the first surface is the top surface;

[0020] The first electrical connector and the first connecting section are disposed on the top surface;

[0021] The slot depth of the plug-in slot is less than the thickness of the main board body; or the plug-in slot passes through the main board body.

[0022] This arrangement allows high-speed signals to be routed out of the top surface. The slot depth is less than the thickness of the motherboard, making it easier for the bottom wall of the slot to position the board to be connected. Alternatively, the slot can extend through the motherboard, making it more suitable for connecting boards of varying sizes.

[0023] In one embodiment, the mainboard body includes a top surface and a bottom surface disposed opposite to each other; the first surface is the bottom surface;

[0024] The first electrical connector and the first connecting section are arranged on the bottom surface, and the plug-in slot passes through the mainboard body;

[0025] With this configuration, high-speed signals are brought out from the bottom layer.

[0026] In one embodiment, a plurality of first electrical connectors are arranged on opposite sides of a slot of the plug slot;

[0027] The connection terminals connected to the first electrical connectors on the opposite sides respectively abut against the gold fingers on the opposite sides of the board to be connected.

[0028] In this way, the gold fingers are abutted on opposite sides of the board to be connected, which plays a role in mechanically fixing the board to be connected and makes the board to be connected more stable.

[0029] In one embodiment, the distance S2 between the first electrical connectors 30 on two opposite sides satisfies:

[0030] S2=h1+2*W2+2*W3;

[0031] Wherein, h1 is the thickness of the board to be connected; W2 is the distance between the first electrical connection terminal and the slot opening; W3 is the maximum protruding height of the portion of the connection terminal extending into the slot from the slot wall.

[0032] Such an arrangement can ensure that the to-be-connected board 40 with slightly different size specifications can be smoothly inserted into the plug-in slot 11 err, and can also ensure good electrical contact between the connecting terminal 20 and the gold finger 40 .

[0033] A second aspect of an embodiment of the present application provides a server, comprising the above-mentioned server mainboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 A schematic diagram of the exploded structure of the server motherboard and the board to be connected provided in an embodiment of the present application;

[0035] Figure 2 for Figure 1 A local enlarged view of point A;

[0036] Figure 3 A schematic cross-sectional view of a server motherboard according to an embodiment of the present application;

[0037] Figure 4 for Figure 3 A local enlarged view of point B;

[0038] Figure 5 A schematic diagram of another structure of a server motherboard provided in an embodiment of the present application;

[0039] Figure 6 for Figure 5 The cross-sectional structural diagram of the server motherboard shown;

[0040] Figure 7 for Figure 6 A local enlarged view of point C;

[0041] Figure 8 A schematic cross-sectional view of another structure of a server motherboard provided in an embodiment of the present application;

[0042] Figure 9 A schematic diagram of a three-dimensional structure of another structure of a server motherboard provided in an embodiment of the present application;

[0043] Figure 10 for Figure 9 A local enlarged view of point D;

[0044] Figure 11 A schematic diagram of another structure of a server motherboard provided in an embodiment of the present application;

[0045] Figure 12 A top view of a server motherboard provided in an embodiment of the present application;

[0046] Figure 13 for Figure 12 A local enlarged view of point E.

[0047] Description of Figure Numbers:

[0048] 100. Server motherboard; 10. Motherboard body; 101. First surface; 1011. Top surface; 1012. Bottom surface; 11. Plug slot; 20. Connecting terminal; 21. First connecting section; 22. Second connecting section; 30. First electrical connector; 40. Board to be connected; 41. Gold finger; 42. High-speed signal line; 43. Layer-changing via; 44. Via; 441. Metal. DETAILED DESCRIPTION

[0049] To make the above-mentioned objects, features, and advantages of the present invention more readily apparent, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following description sets forth numerous specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0050] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0051] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0052] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0053] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0054] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0055] The server board and server according to the embodiment of the present application are described below with reference to the accompanying drawings.

[0056] Figure 1 A schematic diagram of the exploded structure of the server motherboard and the board to be connected provided in an embodiment of the present application; Figure 2 for Figure 1 A local enlarged view of point A; Figure 3 A schematic cross-sectional view of a server motherboard according to an embodiment of the present application; Figure 4 for Figure 3 A local enlarged view of point B; Figure 5 A schematic diagram of another structure of a server motherboard provided in an embodiment of the present application; Figure 6 for Figure 5 The cross-sectional structural diagram of the server motherboard shown; Figure 7 for Figure 6 A local enlarged view of point C; Figure 8 A schematic cross-sectional view of another structure of a server motherboard provided in an embodiment of the present application; Figure 9 A schematic diagram of a three-dimensional structure of another structure of a server motherboard provided in an embodiment of the present application; Figure 10 for Figure 9 A local enlarged view of point D; Figure 11 A schematic diagram of another structure of a server motherboard provided in an embodiment of the present application; Figure 12 A top view of a server motherboard provided in an embodiment of the present application; Figure 13 for Figure 12 A local enlarged view of point E.

[0057] Reference Figure 1 and Figure 2 In a first aspect, an embodiment of the present application provides a server motherboard 100 , comprising a motherboard body 10 and a plurality of connection terminals 20 .

[0058] The first surface 101 of the motherboard body 10 defines a socket 11 for inserting the gold finger mounting end of the to-be-connected card 40. A plurality of first electrical connectors 30 are also provided on the first surface 101 for correspondingly connecting to pre-set circuits (not shown) on the motherboard body 10.

[0059] Multiple connecting terminals 20 are connected to the first electrical connector 30 one by one, and the end portions of the multiple connecting terminals 20 extend into the plug-in slot 11 and are configured to abut against the gold fingers 41 on the gold finger setting end when the gold finger setting end is inserted into the plug-in slot 11.

[0060] By opening a plug-in slot 11 on the first surface 101 of the main body 10 and setting a plurality of first electrical connectors 30, a plurality of connection terminals 20 are connected to the first electrical connectors 30 in a one-to-one correspondence. The end portions of the plurality of connection terminals 20 extend into the plug-in slot 11 and are configured to abut against the gold fingers 41 on the gold finger setting end when the gold finger setting end is inserted into the plug-in slot 11. In this way, the gold fingers 41 are connected to the first electrical connector 30 in a one-to-one correspondence through the portion of the connection terminal 20 extending into the plug-in slot 11, thereby achieving electrical connection with the preset circuit on the main body 10.

[0061] Furthermore, unlike related art methods where the motherboard body is connected to the connected card 40 via a connector, which results in significant connector losses, the connecting terminals 20 directly contact the gold fingers 41 on the connected card 40 to achieve electrical connection. This direct interconnection between the motherboard body 10 and the gold fingers 41 significantly improves high-speed signal quality and reduces signal integrity issues. By omitting the connector, the problem of poor signal consistency caused by differences in connectors from different manufacturers is also resolved.

[0062] In the embodiment of the present application, the connecting terminal 20 includes a first connecting section 21 and a second connecting section 22 arranged at an angle. The first connecting section 21 is arranged on the first surface 101. One end of the first connecting section 21 is electrically connected to the corresponding first electrical connector 30, and the other end is connected to the second connecting section 22. The second connecting section 22 extends into the plug-in slot 11.

[0063] With this arrangement, the second connecting segment 22 within the socket 11 is responsible for abutting contact with the gold finger 41, while the first connecting segment 21 on the first surface 101 is responsible for electrically connecting to the first electrical connector 30. This also shortens the length of the connecting terminal 20. Furthermore, when the board 40 to be connected is inserted into the socket 11, the gold finger 41 located at the gold finger end faces the second connecting segment 22, allowing direct contact and connection with the corresponding second connecting segment 22 during insertion.

[0064] Furthermore, the second connecting section 22 is partially arched relative to the slot wall of the plug-in slot 11 so as to elastically abut against the corresponding gold finger 41 .

[0065] In this way, the electrical contact performance between the second connecting section 22 and the gold finger 41 is better, and the positioning of the gold finger 41 can also be assisted. Figure 2 and Figure 4 As shown, the second connecting section 22 is provided with an arched portion 221 , and the arched portion 221 can be pressed against the gold finger 41 .

[0066] In the embodiment of the present application, the first electrical connector 30 may be configured as a soldering pad. In this case, the first connecting section 21 is soldered to the first electrical connector 30 .

[0067] The motherboard body 10 is provided with a high-speed signal line 42 connected to the preset circuit and a layer-changing via 43. The high-speed signal line 42 is electrically connected to the layer-changing via 43, and the layer-changing via 43 is electrically connected to the first electrical connector 30. The high-speed signal line 42 can be provided inside the motherboard body.

[0068] When the first electrical connector 30 is a pad, the connection terminal 20 can be connected to the pad by welding. This allows for a simple connection between the first electrical connector 30 and the connection terminal 20. Of course, to achieve high-speed transmission, the layer-change via 43 also needs to be back-drilled to remove the via stub.

[0069] In a specific implementation, the high-speed signal line 42 may be a strip line. In order to achieve high-speed transmission, the layer-changing via 43 also needs to be back-drilled to remove the via stub.

[0070] Alternatively, the first electrical connector 30 can be an SMT pad, which can include high-speed differential signal pads, ground pads, and other low-speed signal or power pads. To ensure signal quality, the distance between the layer-change via 43 and the first electrical connector 30 should be minimized, or the layer-change via 43 can be directly connected to the pad. The ground pad should be connected to the GND plane as close as possible to ensure good return flow. The remaining low-speed / power pads can be routed as needed.

[0071] In the embodiment of the present application, the main body 10 includes a top surface 1011 and a bottom surface 1012 arranged opposite to each other. Figure 3 and Figure 4 As a possible implementation manner, the first surface 101 is the top surface 1011 .

[0072] The first electrical connector 30 and the first connecting section 21 are disposed on the top surface 1011. The plug slot 11 is provided on the top surface 1011, and the depth of the plug slot 11 is less than the thickness of the main body 10. Alternatively, the plug slot 11 penetrates the main body 10.

[0073] This arrangement allows high-speed signals to be routed from the top surface 1011. A board 40 to be connected can be plugged into the slot 11 from one side of the top surface 1011. The slot 11's depth is less than the thickness of the motherboard body 10, making it easier for the bottom wall of the slot 11 to position the board 40 to be connected. Alternatively, the slot 11 can extend through the motherboard body 10, making it more suitable for connecting boards 40 of varying sizes.

[0074] Continue to refer to Figure 5 、 Figure 6 and Figure 7 In some other embodiments, the first surface 101 is the bottom surface 1012, the socket 11 extends through the mainboard body 10, and the first electrical connector 30 and the first connecting section 21 are disposed on the bottom surface 1012. This arrangement allows high-speed signals to be routed out from the bottom surface 1012. It also facilitates insertion of the board 40 to be connected into the socket 11 from the top surface 1011 of the socket.

[0075] In addition, in the embodiments of this application, reference is made to Figure 8 、 Figure 9 、 Figure 10 In the case where the connecting terminal 20 and the first electrical connector 30 are arranged on the top surface 1011, the first electrical connector 30 is configured as a via 44, the first connecting section 21 is plugged into the via 44, and is electrically connected to the metal 441 in the via 44. Figure 11 In the example, when the connecting terminal 20 and the first electrical connector 30 are arranged on the bottom surface 1012, similarly, the first electrical connector 30 is constructed as a via 44, and the first connecting section 21 is inserted into the via 44 from one side of the bottom surface 1012 and is electrically connected to the metal 441 in the via 44.

[0076] In a specific implementation, a high-speed signal line 42 connected to a preset circuit is provided in the mainboard body 10 , and the high-speed signal line 42 is electrically connected to the via 44 .

[0077] In the present application, continue to refer to Figure 4A plurality of first electrical connectors 30 are arranged on opposite sides of the slot 11. The connection terminals 20 connected to the first electrical connectors 30 on opposite sides respectively abut against the gold fingers 41 on opposite sides of the board 40 to be connected.

[0078] In this way, the gold fingers 41 are abutted on opposite sides of the board 40 to be connected, exerting force on both sides of the board 40 to be connected, thereby mechanically fixing the board 40 to be connected and making it relatively stable. In a specific implementation, the multiple first electrical connectors 30 on one side of the socket 11 are arranged in a row along the length of the socket 11 to connect with the gold fingers 41 in a one-to-one correspondence.

[0079] In the embodiment of this application, Figure 12 and Figure 13 , the spacing S2 between the first electrical connectors 30 on the two opposite sides satisfies:

[0080] S2=h1+2*W2+2*W3;

[0081] Among them, h1 is the thickness of the board to be connected; W2 is the distance between the first electrical connection terminal and the slot opening; W3 is the maximum protruding height of the part of the connection terminal extending into the slot from the slot wall of the slot.

[0082] This arrangement ensures that boards 40 with slightly different dimensions can be smoothly inserted into the socket 11, while also ensuring good electrical contact between the connecting terminals 20 and the gold fingers 40. In practice, the center-to-center spacing between two adjacent first electrical connectors 30 is equal to the center-to-center spacing between two corresponding adjacent gold fingers 41. This center-to-center spacing can be, for example, 1 mm. The thickness of the board 40 can be, for example, 1.57 mm.

[0083] Furthermore, the length of the insertion slot 11 is generally related to the number of first electrical connectors 30 and can be slightly larger by 1-2 mm than the length of the board 40 to be connected. This length can also be adjusted based on actual needs to facilitate smooth insertion even if the board 40 to be connected has a slight size error.

[0084] In addition, in the embodiment of the present application, the connection terminal 20 can be connected to the first electrical connector 30 by welding or crimping during the PCBA stage. Since the connection terminal 20 has a certain degree of elasticity and ductility due to the provision of the arched portion 221, when the board 40 to be connected is inserted into the insertion slot 11, the connection terminal 20 can abut against the corresponding gold finger 41, thereby assisting in positioning the board 40 to be connected.

[0085] A second aspect of the present application further provides a server (not shown). The server includes a chassis and the aforementioned server motherboard 100. The server motherboard 100 is mounted within the chassis (not shown), and a board 40 to be connected is plugged into the server motherboard via a socket 11. The structure, function, and operating principle of the server motherboard 100 have been previously described in detail and will not be further elaborated here.

[0086] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0087] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A server motherboard, characterized in that: include: A mainboard body, wherein a first surface of the mainboard body is provided with a plug-in slot for inserting a gold finger setting end of a board to be connected; A plurality of first electrical connectors are further provided on the first surface, and the plurality of first electrical connectors are used to connect to the preset circuits on the main board body; a plurality of connecting terminals connected to the first electrical connector in a one-to-one correspondence, wherein end portions of the plurality of connecting terminals extend into the plug-in slot and are configured to abut against the gold fingers on the gold finger setting end in a one-to-one correspondence when the gold finger setting end is inserted into the plug-in slot; The connecting terminal includes a first connecting section and a second connecting section arranged at an angle, the first connecting section is arranged on the first surface, one end of the first connecting section is electrically connected to the corresponding first electrical connector, and the other end is connected to the second connecting section, and the second connecting section extends into the plug-in slot.

2. The server motherboard according to claim 1, wherein: The second connecting section is partially arched relative to the slot wall of the plug-in slot so as to be elastically abutted against the corresponding gold finger.

3. The server motherboard according to claim 1, wherein: The first electrical connector is configured as a soldering pad, and the first connecting section is soldered to the first electrical connector; A high-speed signal circuit connected to a preset circuit and a layer-changing via are provided in the main body of the main board. The high-speed signal circuit is electrically connected to the layer-changing via, and the layer-changing via is electrically connected to the first electrical connector.

4. The server motherboard according to claim 1, wherein: The first electrical connector is configured as a via hole, the first connecting section is plugged into the via hole, and is electrically connected to the metal in the via hole; A high-speed signal line connected to a preset circuit is provided in the main body of the mainboard, and the high-speed signal line is electrically connected to the via hole.

5. The server motherboard according to claim 1, wherein: The mainboard body includes a top surface and a bottom surface arranged opposite to each other; the first surface is the top surface; The first electrical connector and the first connecting section are provided on the top surface; The slot depth of the plug-in slot is smaller than the thickness of the main board body; or the plug-in slot passes through the main board body.

6. The server motherboard according to claim 1, wherein: The main body comprises a top surface and a bottom surface arranged opposite to each other; the first surface is the bottom surface; The first electrical connector and the first connecting section are arranged on the bottom surface, and the plug-in slot passes through the mainboard body.

7. The server motherboard according to any one of claims 1 to 6, wherein: A plurality of the first electrical connectors are arranged on opposite sides of the slot of the plug slot; The connection terminals connected to the first electrical connectors on the two opposite sides respectively abut against the gold fingers on the two opposite sides of the board to be connected.

8. The server motherboard according to claim 7, wherein: The distance S2 between the first electrical connectors on the two opposite sides satisfies: S2=h1+2*W2+2*W3; Among them, h1 is the thickness of the board to be connected; W2 is the distance between the first electrical connection terminal and the slot opening of the plug-in slot; W3 is the maximum protruding height of the part of the connection terminal extending into the plug-in slot from the slot wall of the plug-in slot.

9. A server, characterized in that: The server motherboard comprises the server motherboard according to any one of claims 1 to 8.

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