Silane modified single-component thermal conductive adhesive, preparation method and application thereof

Abstract

The application provides a silane modified single-component heat-conducting adhesive as well as a preparation method and application thereof, raw materials of the silane modified single-component heat-conducting adhesive include silane modified polymers, plasticizers, unmodified alumina, titanate modified aluminum hydroxide, silane modified alumina and thixotropic agents in specific proportions; by selecting the silane modified polymers as a base resin, and adding the unmodified alumina, the titanate modified aluminum hydroxide and the silane modified alumina to modify the silane modified single-component heat-conducting adhesive, and by adding the thixotropic agents and the plasticizers, the obtained silane modified single-component heat-conducting adhesive has excellent bonding performance, heat-conducting performance and flame-retardant performance, and can meet the use requirements of power battery modules.

Description

Technical Field

[0001] This invention belongs to the field of thermal conductive adhesive technology, specifically relating to a silane-modified one-component thermal conductive adhesive, its preparation method, and its application. Background Technology

[0002] With the continuous development of new energy vehicles, the requirements for power batteries are also becoming increasingly stringent. For the internal components of power battery modules, there are increasingly more requirements for heat transfer, vibration damping, sealing, solder joint protection, and so on. Therefore, the requirements for sealants are also becoming more stringent.

[0003] Silane-modified sealants combine the advantages of silicone and polyurethane sealants and are widely used in industrial applications. However, conventional silane-modified sealants cannot simultaneously meet the requirements of battery packs for both thermal conductivity and flame retardancy.

[0004] Therefore, developing a silane-modified one-component thermally conductive adhesive that combines excellent thermal conductivity and flame retardancy is a technical problem that urgently needs to be solved in this field. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the present invention aims to provide a silane-modified one-component thermally conductive adhesive, its preparation method, and its application. The silane-modified one-component thermally conductive adhesive possesses excellent thermal conductivity, adhesion, and flame retardant properties, which can meet the usage requirements of power battery modules.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] In a first aspect, the present invention provides a silane-modified one-component thermally conductive adhesive, wherein the raw materials for preparing the silane-modified one-component thermally conductive adhesive comprise the following components in parts by weight:

[0008] 80-120 parts by weight of silane-modified polymer;

[0009] Plasticizer 40-60 parts by weight;

[0010] Unmodified alumina A: 35-550 parts by weight;

[0011] Titanate-modified aluminum hydroxide, 225-375 parts by weight;

[0012] Silane-modified alumina, 75–125 parts by weight;

[0013] Thixotropic agent 2-10 parts by weight;

[0014] 1 to 3 parts by weight of curing agent.

[0015] The raw materials for the silane-modified one-component thermally conductive adhesive provided by this invention include specific proportions of silane-modified polymer, plasticizer, unmodified alumina A, titanate-modified aluminum hydroxide, silane-modified alumina, and thixotropic agent. All three fillers possess excellent flame retardancy and thermal conductivity. In particular, the titanate-modified aluminum hydroxide, obtained through activation modification with titanate, has a monomolecular film on its surface, significantly improving its flame retardancy and thermal conductivity compared to untreated aluminum hydroxide. Simultaneously, the silane-modified alumina effectively avoids the problems of agglomeration, oil-powder separation, and sedimentation that easily occur with ultrafine alumina due to its strong polarity and large specific surface area. Therefore, this invention selects a silane-modified polymer as the matrix and adds unmodified alumina, titanate-modified aluminum hydroxide, and silane-modified alumina fillers for modification, supplemented with thixotropic agent and plasticizer, resulting in a silane-modified one-component thermally conductive adhesive that combines excellent thermal conductivity, adhesion, and flame retardancy, meeting the requirements of power battery modules.

[0016] Preferably, the silane-modified polymer includes silane-modified polyether and / or silane-modified polyurethane.

[0017] Preferably, the silane-modified polymer can be any one or a combination of at least two of the following: Kaneka's S303H, SAX350, and SAX400; Momentive's SPUR+*1015 and SPUR+*1050; and AGC's ESS3430 and ESS2410.

[0018] Preferably, the plasticizer comprises phthalate compounds and / or polyether polyols, more preferably polyether polyols.

[0019] Preferably, the phthalate ester compound includes any one or a combination of at least two of diisononyl phthalate, diisooctyl phthalate, or diisodecyl phthalate.

[0020] Preferably, the number average molecular weight of the polyether polyol is 500 to 10,000, such as 500, 1,000, 2,000, 4,000, 6,000, 8,000 or 10,000.

[0021] Preferably, the polyether polyol includes polypropylene glycol (PPG), for example, any one or a combination of at least two of PPG 1000, PPG 2000, PPG 3000, PPG 4000 or PPG 8000.

[0022] Preferably, the unmodified alumina A includes plate-shaped alumina and / or polyhedral alumina, and more preferably a combination of plate-shaped alumina and polyhedral alumina. By using the above two unique shapes of alumina, they can make surface contact, and a larger contact area can be achieved with a lower dosage, thereby more effectively forming a thermal conductive path and further improving the thermal conductivity of the obtained silane-modified single-component thermally conductive adhesive.

[0023] Preferably, the diameter of the plate-shaped alumina is 1 to 15 μm, such as 1 μm, 2 μm, 4 μm, 6 μm, 8 μm, 10 μm, 12 μm, 14 μm or 15 μm.

[0024] Preferably, the particle size of the polyhedral alumina is 10–30 μm, such as 10 μm, 12 μm, 14 μm, 16 μm, 18 μm, 20 μm, 22 μm, 24 μm, 26 μm, 28 μm or 30 μm.

[0025] Preferably, the polyhedral alumina includes tetrahedral alumina.

[0026] Preferably, the particle size of the titanate-modified aluminum hydroxide is 2 to 10 μm, such as 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm or 10 μm.

[0027] Preferably, the titanate-modified aluminum hydroxide is obtained by activating and modifying unmodified aluminum hydroxide with a titanate coupling agent.

[0028] Preferably, the activation modification method specifically includes: first reacting unmodified aluminum hydroxide and titanate coupling agent at 100-110℃ (e.g., 100℃, 102℃, 104℃, 106℃, 108℃ or 110℃, etc.) for 3-5 min (e.g., 3 min, 3.2 min, 3.4 min, 3.6 min, 3.8 min, 4 min, 4.2 min, 4.4 min, 4.6 min, 4.8 min or 5 min, etc.), then adding a synergist and mixing for 1-5 min (e.g., 1 min, 1.5 min, 2 min, 2.5 min, 3 min, 3.5 min, 4 min, 4.5 min or 5 min, etc.) to obtain the titanate modified aluminum hydroxide.

[0029] In the above-mentioned activation and modification method, the synergist can be stearic acid, and the amount of the synergist can be 1 to 6 parts by weight, for example, 1, 2, 3, 4, 5 or 6 parts by weight, based on 100 parts by weight of aluminum hydroxide.

[0030] Furthermore, in the above-mentioned activation and modification method, the titanate coupling agent can be diluted before addition. The diluent used for dilution can be ethanol, and the mass percentage of the diluted titanate coupling agent can be 40%, 50%, 60%, etc.

[0031] Preferably, the mass ratio of the unmodified aluminum hydroxide to the titanate coupling agent is 100:(0.5-3), for example, 100:0.5, 100:1, 100:1.5, 100:2, 100:2.5 or 100:3, etc.

[0032] Preferably, the titanate coupling agent includes a monoalkoxy titanate coupling agent and / or a pyrophosphate type titanate coupling agent, more preferably a monoalkoxy titanate coupling agent and a pyrophosphate type titanate coupling agent.

[0033] Preferably, the mass ratio of the monoalkoxy titanate coupling agent to the pyrophosphate titanate coupling agent is 1:(0.5-1.5), for example, 1:0.5, 1:0.7, 1:0.9, 1:1, 1:1.1, 1:1.3 or 1:1.5, etc.

[0034] Preferably, the particle size of the silane-modified alumina is 1 to 5 μm, such as 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm or 5 μm.

[0035] In this invention, a combination of plate-shaped alumina with a sheet diameter of 1–15 μm, polyhedral alumina with a particle size of 10–30 μm, titanate-modified aluminum hydroxide with a particle size of 2–10 μm, and silane-modified alumina with a particle size of 1–5 μm is selected. This not only effectively avoids the problem of agglomeration in the matrix, but also allows the fillers of various particle sizes to form the most complete thermal conductivity pathway in the silane-modified polymer matrix, thereby maximizing the thermal conductivity of the resulting silane-modified single-component thermally conductive adhesive.

[0036] Preferably, the silane-modified alumina is obtained by reacting silane coupling agent A with unmodified alumina B.

[0037] Preferably, the reaction temperature is 50 to 70°C, such as 50°C, 52°C, 54°C, 56°C, 58°C, 60°C, 62°C, 64°C, 66°C, 68°C, or 70°C.

[0038] Preferably, the reaction time is 4 to 6 hours, such as 4 hours, 4.2 hours, 4.4 hours, 4.6 hours, 4.8 hours, 5 hours, 5.2 hours, 5.4 hours, 5.6 hours, 5.8 hours, or 6 hours.

[0039] Preferably, the mass ratio of the unmodified alumina B to the silane coupling agent A is 100:(1-5), for example, 100:1, 100:1.5, 100:2, 100:2.5, 100:3, 100:3.5, 100:4, 100:4.5 or 100:5, etc.

[0040] Preferably, the thixotropic agent comprises any one or a combination of at least two of polyamide wax, hydrogenated castor oil, or fumed silica.

[0041] Preferably, the curing agent includes a chelated tin curing agent, such as Nitto Kasei Corporation's U-220 or U303 curing agent, or TIB 226 curing agent from TIB GmbH, Germany.

[0042] Preferably, the raw materials of the silane-modified one-component thermally conductive adhesive also include a heat stabilizer.

[0043] Preferably, the content of heat stabilizer in the raw material of the silane-modified one-component thermally conductive adhesive is 0.5 to 3 parts by weight, for example, 0.5 parts by weight, 1 part by weight, 1.5 parts by weight, 2 parts by weight, 2.5 parts by weight or 3 parts by weight.

[0044] Preferably, the heat stabilizer comprises a hindered phenolic heat stabilizer and / or a phosphite heat stabilizer; for example, the hindered phenolic heat stabilizer comprises antioxidant 1076 or antioxidant 245, and the phosphite heat stabilizer may be Irgafos 168 or van truss antioxidant. CA-SF.

[0045] Preferably, the raw materials of the silane-modified one-component thermally conductive adhesive also include a dehydrating agent.

[0046] Preferably, the content of dehydrating agent in the raw materials of the silane-modified one-component thermally conductive adhesive is 4 to 6 parts by weight, such as 4 parts by weight, 4.5 parts by weight, 5 parts by weight, 5.5 parts by weight, or 6 parts by weight.

[0047] Preferably, the dehydrating agent comprises vinyltrimethoxysilane and / or vinyltriethoxysilane.

[0048] Preferably, the raw materials for the silane-modified one-component thermally conductive adhesive further include silane coupling agent B.

[0049] Preferably, the content of silane coupling agent B in the raw material of the silane-modified one-component thermally conductive adhesive is 3 to 6 parts by weight, such as 3 parts by weight, 3.5 parts by weight, 4 parts by weight, 4.5 parts by weight, 5 parts by weight, 5.5 parts by weight, or 6 parts by weight.

[0050] Preferably, the silane coupling agent B comprises any one or a combination of at least two of the following: 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, phenylamino-silane, triaminosilane, γ-mercaptopropyltrimethoxysilane, γ-ureapropyltrimethoxysilane, and γ-ureapropyltrihexyloxysilane or γ-methacryloyloxypropyltrimethoxysilane.

[0051] In a second aspect, the present invention provides a method for preparing a silane-modified one-component thermally conductive adhesive as described in the first aspect, the method comprising: mixing a silane-modified polymer, a plasticizer, unmodified alumina A, titanate-modified aluminum hydroxide, silane-modified alumina, a thixotropic agent, a curing agent, optionally a thermal stabilizer, optionally a dehydrating agent, and optionally a silane coupling agent B to obtain the silane-modified one-component thermally conductive adhesive.

[0052] Preferably, the preparation method specifically includes: stirring the silane-modified polymer, plasticizer, unmodified alumina A, titanate-modified aluminum hydroxide, silane-modified alumina, thixotropic agent, and heat stabilizer at 600–800 rpm (e.g., 600 rpm, 620 rpm, 640 rpm, 660 rpm, 680 rpm, 700 rpm, 720 rpm, 740 rpm, 760 rpm, 780 rpm, or 800 rpm, etc.) for 50–70 min (e.g., 50 min, 52 min, 54 min, 56 min, 58 min, 60 min, 62 min, 64 min, etc.). Stir for 100–120 min (e.g., 100°C, 105°C, 110°C, 115°C, or 120°C) at 300–600 rpm (e.g., 300 rpm, 350 rpm, 400 rpm, 450 rpm, 500 rpm, 550 rpm, or 600 rpm) for 100–140 min (e.g., 100 min, 110 min, 120 min, 130 min, or 140 min), then cool to 35–55°C (e.g., 35°C, 40°C, 45°C, 50°C, or 55°C). Add a dehydrating agent and stir at 200–300 rpm (e.g., 200 rpm, 220 rpm, 240 rpm, 260 rpm, 280 rpm, or 300 rpm) for 10–30 minutes (e.g., 10 minutes, 15 minutes, 20 minutes, 25 minutes, or 30 minutes). Then add silane coupling agent B and stir at 200–300 rpm (e.g., 200 rpm, 220 rpm, 240 rpm, 260 rpm, 280 rpm, or 300 rpm) for 20–30 minutes (e.g., 20 minutes, 22 minutes, 24 minutes, 26 minutes, 26 minutes, 27 minutes, 280 rpm, or 300 rpm) for 20–30 minutes (e.g., 20 minutes, 22 minutes, 24 minutes, 26 minutes, 27 minutes, 280 rpm, or 300 rpm). After stirring for 20-30 minutes (e.g., 20 min, 22 min, 24 min, 26 min, 28 min, or 30 min, etc.) at 200-300 rpm (e.g., 200 rpm, 220 rpm, 240 rpm, 260 rpm, 280 rpm, or 300 rpm, etc.), the mixture is then evacuated to a vacuum level not lower than 980 mbar (e.g., 980 mbar, 985 mbar, 990 mbar, 995 mbar, or 1000 mbar, etc.) to obtain the silane-modified one-component thermally conductive adhesive.

[0053] Thirdly, the present invention provides an application of the silane-modified single-component thermally conductive adhesive as described in the first aspect in a battery pack.

[0054] Compared with the prior art, the present invention has the following beneficial effects:

[0055] The raw materials of the silane-modified one-component thermally conductive adhesive provided by this invention include specific proportions of silane-modified polymer, plasticizer, unmodified alumina, titanate-modified aluminum hydroxide, silane-modified alumina, and thixotropic agent. By selecting the silane-modified polymer as the matrix resin and adding three fillers—unmodified alumina, titanate-modified aluminum hydroxide, and silane-modified alumina—for modification, and supplemented with thixotropic agent and plasticizer, the resulting silane-modified one-component thermally conductive adhesive possesses excellent thermal conductivity, adhesion, and flame retardant properties, which can meet the usage requirements of power battery modules. Detailed Implementation

[0056] The technical solution of the present invention will be further illustrated below through specific embodiments. Those skilled in the art should understand that the embodiments described are merely illustrative of the present invention and should not be construed as limiting the invention in any way.

[0057] The detailed information of some of the raw materials involved in the following specific implementation methods is shown below:

[0058] (1) Monoalkoxy titanate coupling agent: purchased from Nanjing Quanxi New Materials Co., Ltd., brand name QX-130;

[0059] (2) Pyrophosphate type titanium ester coupling agent: purchased from Nanjing Quanxi New Materials Co., Ltd., brand name QX-201;

[0060] (3) Silane coupling agent A: purchased from Dow Corning, brand name Z-6173;

[0061] (4) Silane-modified polyether: purchased from Kaneka, brand name S303H;

[0062] (5) Silane-modified polyurethane: purchased from Momentive, brand name SPUR+*1050;

[0063] (6) Plate-shaped alumina: average particle size is 8μm;

[0064] (7) Tetrahedral alumina: average particle size is 25 μm;

[0065] (8) Spherical alumina: average particle size is 8μm;

[0066] (9) Chelated tin curing agent: purchased from Nitto Kasei Corporation, brand name U-220;

[0067] (10) Heat stabilizer 1076: purchased from BASF;

[0068] (11) Heat stabilizer 168: purchased from BASF;

[0069] (12) Vinyltrimethoxysilane: purchased from Wacker Chemie, brand name A-171.

[0070] Preparation Example 1-1

[0071] A titanate-modified aluminum hydroxide, the preparation method of which includes the following steps:

[0072] (1) Mix the monoalkoxy titanate coupling agent and the pyrophosphate type titanate coupling agent at a mass ratio of 1:1, and dilute with ethanol to obtain a diluted titanate coupling agent with a mass percentage of 50%.

[0073] (2) Add 100 parts by weight of unmodified aluminum hydroxide (average particle size of 5 μm) to a high-speed mixer, and bring the temperature to 100°C under high-speed stirring. Dry the mixture in an open container for 10 min to remove moisture. Then slowly add 3 parts by weight of the diluted titanate coupling agent obtained in step (1), and activate and modify it at 100°C for 4 min. Then add 0.6 parts by weight of stearic acid, mix at 100°C for 3 min, and dry to obtain the titanate-modified aluminum hydroxide.

[0074] Preparation Examples 1-2

[0075] A titanate-modified aluminum hydroxide, which differs from Preparation Example 1-1 in that no pyrophosphate-type titanate coupling agent is added, while the other substances, amounts and preparation methods are the same as those in Preparation Example 1-1.

[0076] Preparation Examples 1-3

[0077] A titanate-modified aluminum hydroxide, which differs from Preparation Example 1-1 in that no monoalkoxy titanate coupling agent is added, while the other substances, amounts and preparation methods are the same as those in Preparation Example 1-1.

[0078] Comparative Preparation Example 1-1

[0079] An unmodified aluminum hydroxide with an average particle size of 5 μm.

[0080] Preparation Example 2-1

[0081] A silane-modified alumina, the preparation method of which includes the following steps:

[0082] (1) Mix 50 mL of ethanol and 50 mL of deionized water, and add 1% acetic acid to adjust the pH of the solution to 6 to obtain a compound solvent.

[0083] 2g of silane coupling agent A and 40g of ethanol were mixed to obtain a silane solution;

[0084] (2) Mix the compound solvent and silane solution and ultrasonically mix for 50 min. Add 100 parts by weight of unmodified alumina (average particle size of 2 μm) and mix evenly. Heat to 60 °C and react for 5 h. Filter, wash twice with ethanol, and dry at 80 °C for 24 h to obtain the silane-modified alumina.

[0085] Comparative Preparation Example 2-1

[0086] An unmodified alumina with an average particle size of 2 μm.

[0087] Examples 1-9 and Comparative Examples 1-6

[0088] Examples 1-9 and Comparative Examples 1-6 each provide a silane-modified one-component thermally conductive adhesive, and the components and their amounts are shown in Table 1 and Table 2.

[0089] In Tables 1 and 2, the amount of each component is in parts by weight.

[0090] Table 1

[0091]

[0092]

[0093] Table 2

[0094]

[0095] The preparation methods of the silane-modified one-component thermally conductive adhesives provided in Examples 1-9 and Comparative Examples 1-6 include the following steps:

[0096] The silane-modified polymer, plasticizer, unmodified alumina A, titanate-modified aluminum hydroxide (or unmodified aluminum hydroxide), silane-modified alumina (or unmodified alumina), thixotropic agent, and heat stabilizer were stirred at 700 rpm for 50 min, heated to 110°C, stirred at 500 rpm for 120 min, then cooled to 40°C, a dehydrating agent was added, and the mixture was stirred at 250 rpm for 20 min. Then, a silane coupling agent was added, and the mixture was stirred at 250 rpm for 25 min. Finally, a curing agent was added, and the mixture was stirred at 250 rpm for 25 min. The mixture was then evacuated to a vacuum degree of not less than 980 mbar to obtain the silane-modified one-component thermally conductive adhesive.

[0097] Performance testing:

[0098] (1) Adhesion performance: The test was conducted according to GB / T43747-2024 "Evaluation of the adhesion of sealant by strip peeling method", and the damage area and damage type were determined according to GB / T 16997-1997 "Representation of the main failure types of adhesives". The test substrate was aluminum 5052. In the test results, CF represents cohesive failure and AF represents interfacial peeling. For example, 10CF represents 100% cohesive failure and 5CF / 5AF represents 50% cohesive failure + 50% interfacial peeling.

[0099] (2) Flame retardant performance: The test was conducted in accordance with the method provided in standard GB / T13488-1992 "Determination of the flammability of rubber by vertical burning method".

[0100] (3) Thermal conductivity: The thermal conductivity was tested according to the method provided in ASTM D5470-2017, "Standard Test Method for Thermal Transfer Properties of Thermally Conductive Insulating Materials".

[0101] The silane-modified single-component thermally conductive adhesives provided in Examples 1-9 and Comparative Examples 1-6 were tested according to the above test methods, and the test results are shown in Table 3.

[0102] Table 3

[0103]

[0104]

[0105] According to the data in Table 3:

[0106] The bonding performance tests of the silane-modified single-component thermally conductive adhesives provided in Examples 1-9 show that the peel strength with aluminum 5052 can reach 80% cohesive failure, the flame retardant performance can reach FV-0 level, and the thermal conductivity is 1.19-1.39W / mK, which combines excellent bonding performance, flame retardant performance and thermal conductivity.

[0107] The bonding performance tests of the silane-modified single-component thermally conductive adhesives provided in Examples 1 to 3 showed that the peel strength with aluminum 5052 could reach 100% cohesive failure, the flame retardant performance could reach FV-0 level, and the thermal conductivity was 1.31 to 1.39 W / mK.

[0108] Compared with Example 1, the thermally conductive adhesives provided in Comparative Examples 1 to 6 all fail to simultaneously possess excellent adhesion, thermal conductivity, and flame retardant properties. The specific analysis is as follows:

[0109] Among them, the thermally conductive adhesive provided in Comparative Example 1 has poor adhesion performance because it does not contain unmodified alumina, but only titanate-modified aluminum hydroxide and silane-modified alumina. The peel strength with aluminum material 5052 can only reach 30% cohesive failure.

[0110] The thermally conductive adhesive provided in Comparative Example 2 did not contain titanate-modified aluminum hydroxide, but instead contained unmodified aluminum hydroxide, resulting in a significant decrease in adhesion, flame retardancy, and thermal conductivity.

[0111] The thermally conductive adhesive provided in Comparative Example 3, which did not contain titanate-modified aluminum hydroxide but only unmodified aluminum oxide and silane-modified aluminum oxide, also showed a significant decrease in adhesion, flame retardancy and thermal conductivity.

[0112] The thermally conductive adhesives provided in Comparative Examples 4 and 5 showed a significant decrease in both bonding and thermal conductivity due to the absence of silane-modified alumina and the addition of unmodified alumina.

[0113] The thermally conductive adhesive provided in Comparative Example 6 had poor adhesion, flame retardancy, and thermal conductivity because no fillers were added.

[0114] The applicant declares that this invention illustrates a silane-modified one-component thermally conductive adhesive, its preparation method, and its application through the above embodiments. However, this invention is not limited to the above embodiments, meaning that this invention does not necessarily rely on the above embodiments for implementation. Those skilled in the art should understand that any improvements to this invention, equivalent substitutions of raw materials, additions of auxiliary components, and selection of specific methods, etc., all fall within the protection and disclosure scope of this invention.

Claims

1. A one-part heat conductive silicone adhesive modified with silane, characterized in that, The raw materials of the silane modified single-component thermal conductive adhesive include the following components by weight: Silane modified polymer 80-120 parts by weight; Plasticizer 40-60 parts by weight; Unmodified alumina A 350-550 parts by weight; Titanate modified aluminum hydroxide 225-375 parts by weight; Silane modified alumina 75-125 parts by weight; Thixotropic agent 2-10 parts by weight; Curing agent 1-3 parts by weight; The silane modified polymer includes silane modified polyether and / or silane modified polyurethane; The unmodified alumina A includes a combination of plate-like alumina and polyhedral alumina; The titanate modified aluminum hydroxide is obtained by activating and modifying unmodified aluminum hydroxide with a titanate coupling agent; The titanate coupling agent includes a monoalkoxy titanate coupling agent and a pyrophosphate type titanium coupling agent; The silane modified alumina is obtained by the reaction of silane coupling agent A and unmodified alumina B; The plate-like alumina has a flake diameter of 1-15 μm; The polyhedral alumina has a particle size of 10-30 μm; The titanate modified aluminum hydroxide has a particle size of 2-10 μm; The silane modified alumina has a particle size of 1-5 μm.

2. The one-part heat conductive silicone adhesive of claim 1, wherein, The plasticizer includes phthalate compounds and / or polyether polyols.

3. The silane-modified one-component thermally conductive adhesive according to claim 2, characterized in that, The phthalate compounds include any one or a combination of at least two of diisononyl phthalate, diisooctyl phthalate or diisodecyl phthalate.

4. The silane-modified one-component thermally conductive adhesive according to claim 2, characterized in that, The polyether polyol has a number average molecular weight of 500-10000.

5. The silane-modified one-component thermally conductive adhesive according to claim 2, characterized in that, The polyether polyol includes polypropylene glycol.

6. The one-part, silane-modified, thermally conductive adhesive of claim 1, wherein, The polyhedral alumina includes tetradecahedral alumina.

7. The one-part heat-conductive silicone adhesive of claim 1, wherein the one-part heat-conductive silicone adhesive is a room temperature vulcanizable silicone adhesive. The mass ratio of the unmodified aluminum hydroxide and the titanate coupling agent is 100:(0.5-3).

8. The one-part, silane-modified, thermally conductive adhesive of claim 1, wherein, The mass ratio of the monoalkoxy titanate coupling agent and the pyrophosphate type titanium coupling agent is 1:(0.5-1.5).

9. The one-part heat-conductive silicone adhesive of claim 1, wherein the one-part heat-conductive silicone adhesive is cured at a temperature of 100°C for 30 minutes. The mass ratio of the unmodified alumina B and the silane coupling agent A is 100:(1-5).

10. The one-part, silane-modified, thermally conductive adhesive of claim 1, wherein, The thixotropic agent includes any one or a combination of at least two of polyamide wax, hydrogenated castor oil or fumed silica.

11. The one-part, silane-modified, thermally conductive adhesive of claim 1, wherein, The curing agent includes a chelated tin curing agent.

12. The one-part, silane-modified, thermally conductive adhesive of claim 1, wherein, The raw materials of the silane modified single-component thermal conductive adhesive further include a heat stabilizer.

13. The silane-modified one-component thermally conductive adhesive according to claim 12, characterized in that, The content of the heat stabilizer in the raw materials of the silane modified single-component thermal conductive adhesive is 0.5-3 parts by weight.

14. The silane-modified one-component thermally conductive adhesive according to claim 12, characterized in that, The heat stabilizer includes a hindered phenolic heat stabilizer and / or a phosphite heat stabilizer.

15. The one-part, silane-modified, thermally conductive adhesive of claim 1, wherein, The raw materials of the silane modified single-component thermal conductive adhesive further include a water removal agent.

16. The one-part, heat-conducting, silane-modified silicone gel of claim 15, wherein, The content of the water removal agent in the raw materials of the silane modified single-component thermal conductive adhesive is 4-6 parts by weight.

17. The one-part, heat-conducting, silane-modified silicone gel of claim 15, wherein, The water removal agent includes vinyl trimethoxysilane and / or vinyl triethoxysilane.

18. The one-part, silane-modified, thermally conductive adhesive of claim 1, wherein, The raw materials of the silane modified single-component thermal conductive adhesive further include silane coupling agent B.

19. The one-part, heat-conducting, silane-modified silicone gel of claim 18, wherein, The content of the silane coupling agent B in the raw materials of the silane modified single-component thermal conductive adhesive is 3-6 parts by weight.

20. The one-part, heat-conducting, silane-modified silicone gel of claim 18, wherein, The silane coupling agent B includes any one or a combination of at least two of 2-(3,4-epoxycyclohexyl)ethyl trimethoxysilane, gamma-glycidoxypropyl trimethoxysilane, gamma-glycidoxypropyl triethoxysilane, gamma-aminopropyl trimethoxysilane, gamma-aminopropyl triethoxysilane, N-beta-(aminoethyl)-gamma-aminopropyl trimethoxysilane, gamma-mercaptopropyl trimethoxysilane, gamma-ureidopropyl trimethoxysilane and gamma-methacryloyloxypropyl trimethoxysilane.

21. A method of preparing the silane-modified one-component thermal conductive adhesive according to any one of claims 1 to 20, characterized by, The preparation method comprises mixing the silane-modified polymer, the plasticizer, the unmodified alumina A, the titanate-modified aluminum hydroxide, the silane-modified alumina, the thixotropic agent, the curing agent, optionally the heat stabilizer, optionally the water-removing agent and optionally the silane coupling agent B to obtain the silane-modified single-component thermal conductive adhesive.

22. The method of claim 21, wherein, The preparation method specifically comprises stirring the silane-modified polymer, the plasticizer, the unmodified alumina A, the titanate-modified aluminum hydroxide, the silane-modified alumina, the thixotropic agent and the heat stabilizer at 600-800 rpm for 50-70 min, heating to 100-120℃, stirring at 300-600 rpm for 100-140 min, cooling to 35-55℃ again, adding the water-removing agent, stirring at 200-300 rpm for 10-30 min, adding the silane coupling agent B again, stirring at 200-300 rpm for 20-30 min, finally adding the curing agent, stirring at 200-300 rpm for 20-30 min, and vacuumizing to a vacuum degree of not less than 980 mbar to obtain the silane-modified single-component thermal conductive adhesive.

23. Use of the silane-modified single-component thermal conductive adhesive according to any one of claims 1-20 in a battery pack.

Images