Silicon carbide micro powder grinding mechanism and grinding method thereof

Abstract

The present application discloses a silicon carbide micro-powder grinding mechanism and a grinding method thereof, belonging to the technical field of grinding mechanisms, comprising an outer cylinder and an inner cylinder fixed inside the outer cylinder, wherein a conical material guide seat is fixed at the middle position inside the outer cylinder, and air inlets are provided at equal intervals at the bottom of the outer cylinder outside the conical material guide seat along the circumferential direction of the outer cylinder, and an air inlet pipe connected to the air inlet is provided at the bottom of the outer cylinder; connecting ports are provided at equal intervals in the height direction of the inner cylinder, and a wind shield ring is fixed on the outside of the inner cylinder at the position of the connecting port, and a grinding mechanism for grinding silicon carbide is assembled inside the inner cylinder. The present application uses stable wind energy to blow up the ground silicon carbide micro-powder, and reduces a certain amount of wind force to blow directly during the rising process of the silicon carbide micro-powder, so that the larger particles of silicon carbide micro-powder fall by themselves in this case, and enter the grinding area for re-grinding, thereby improving the quality of the silicon carbide micro-powder.

Description

Technical Field

[0001] The present application relates to the technical field of grinding mechanisms, and in particular to a silicon carbide micro-powder grinding mechanism and a grinding method thereof. Background Art

[0002] Silicon carbide powder is made from natural quartz (SiO2) or fused quartz (amorphous SiO2 after natural quartz is melted at high temperature and cooled) through multiple processes such as crushing, ball milling (or vibration, air flow milling), flotation, acid washing and purification, and high-purity water treatment.

[0003] After a period of grinding in the existing grinding device, the silicon carbide micropowder that has met the standards and the silicon carbide micropowder that does not meet the standards are mixed together, and the final discharge requires screening. The silicon carbide micropowder that does not meet the standards after screening needs to be introduced into the grinding device again for grinding until it meets the standards. This wastes a lot of manpower and material resources, resulting in an insufficient effect of grinding the silicon carbide micropowder and low grinding efficiency. Therefore, the present application provides a silicon carbide micropowder grinding mechanism and a grinding method thereof. Summary of the invention

[0004] The main purpose of the present application is to provide a silicon carbide micropowder grinding mechanism and a grinding method thereof, which utilizes stable wind energy to blow up the ground silicon carbide micropowder. Although the wind force is reduced to a certain extent during the rising process of the silicon carbide micropowder, the larger particles of silicon carbide micropowder fall off by themselves in this case and enter the grinding area for re-grinding, thereby improving the quality of the silicon carbide micropowder.

[0005] To achieve the above-mentioned purpose, the present application provides a silicon carbide micro-powder grinding mechanism, comprising an outer cylinder and an inner cylinder fixed inside the outer cylinder, wherein a conical material guide seat is fixed at a middle position inside the outer cylinder, and air inlets are provided at equal intervals along the circumferential direction of the outer cylinder at the bottom of the outer cylinder outside the conical material guide seat, and an air inlet pipe connected to the air inlet is provided at the bottom of the outer cylinder;

[0006] The bottom of the inner cylinder is provided with material guide ports at equal intervals along the circumferential direction thereof, and a hinge plate is hinged inside the material guide ports, and connecting ports are provided at equal intervals along the height direction of the inner cylinder, and a wind shield ring is fixed on the outer side of the inner cylinder at the position of the connecting port, and through holes are provided on the wind shield ring at equal intervals, and a grinding mechanism for grinding silicon carbide is installed inside the inner cylinder;

[0007] The tops of the outer cylinder and the inner cylinder are fixedly connected with a connecting cover for guiding the silicon carbide powder.

[0008] Preferably, a support seat is fixedly mounted on the outer side of the outer cylinder.

[0009] Preferably, a feed pipe connected to the inner cylinder is connected to the top of the connecting cover, and discharge ports are provided at equal intervals along the circumferential direction of the connecting cover at the bottom of the connecting cover outside the outer cylinder, and a discharge pipe connected to the discharge port is provided at the bottom of the connecting cover.

[0010] Preferably, the grinding mechanism includes a first sieve cylinder and a second sieve cylinder opposite to the connecting port, and a gear ring fixedly connected to the top of the grinding mechanism, wherein the first sieve cylinder and the second sieve cylinder and the gear ring are connected to each other by a connecting rod, and a conical seat is fixed at the center position inside the first sieve cylinder and the second sieve cylinder, a rotating disk is rotatably connected to the middle position of the conical seat, and grinding rods are installed at equal intervals along the circumferential direction of the rotating disk, and a rotating shaft is vertically rotatably connected to the middle position of the grinding mechanism, and the rotating disk is sleeved on the rotating shaft.

[0011] Preferably, a driving gear is sleeved on the top of the rotating shaft, and the driving gear and the gear ring are meshed with each other through a transmission gear, and the transmission gear is connected to the bottom of the connecting cover through a bearing, and a groove for assembling a driving motor is opened at the middle position of the conical material guide seat, and the output end of the driving motor is connected to the bottom end of the rotation.

[0012] A grinding method for a silicon carbide micropowder grinding mechanism, characterized in that it comprises the following steps:

[0013] S1. First, silicon carbide is introduced into the grinding mechanism, and the first sieve cylinder and the second sieve cylinder are rotated in opposite directions to the grinding roller, and the sieve holes of the second sieve cylinder are smaller than the sieve holes of the first sieve cylinder;

[0014] S2. The ground silicon carbide powder is deposited on the inclined surface of the conical material guide seat, and then enters between the inner cylinder and the outer cylinder from the material guide port, and at the same time passes through the external wind source to the inside of the air inlet pipe, and enters between the inner cylinder and the outer cylinder through the air inlet, and the silicon carbide powder is raised along the inner cylinder and the outer cylinder by wind force;

[0015] S3. The silicon carbide powder rises under the action of wind and finally enters the discharge pipe from the discharge port on the connecting cover and is then discharged. During this process, some larger silicon carbide powders are collected by the wind shield ring arranged between the inner cylinder and the outer cylinder and enter the first sieve cylinder and the second sieve cylinder for further grinding.

[0016] The benefits of the present application are as follows: first, an external wind source is connected to the inside of the air inlet pipe, and the air enters the channel between the inner cylinder and the outer cylinder through the air inlet, and the wind force is used to raise the silicon carbide micropowder along the channel, and the rising silicon carbide micropowder enters the inside of the connecting cover along the channel, and then is discharged from the inside of the grinding mechanism through the discharge port and the discharge pipe. In this process, since the wind shield ring extends to the inside of the channel, the rising wind force and the silicon carbide micropowder are blocked, and the rising silicon carbide micropowder will rise along the gap between the wind shield ring and the channel, thereby changing the travel route of the silicon carbide micropowder. At the same time, under the obstruction of the wind shield ring, a wind pressure zone with weak wind force will be formed above the corresponding position of the wind shield ring, so that some silicon carbide micropowder with larger particles will fall on the wind shield ring by themselves, and then slide along the inclined surface and the connecting port on the inner side of the wind shield ring to the inside of the first sieve drum and the second sieve drum, and be ground again until the silicon carbide micropowder can be blown out by wind force, thereby ensuring that the quality of the silicon carbide micropowder meets the standards and improving the quality of the silicon carbide micropowder;

[0017] Secondly, due to the existence of the through holes and the connecting ports, part of the wind will enter the inner cylinder through the through holes and the connecting ports, causing a certain disturbance effect on the silicon carbide micropowder inside the inner cylinder, thereby causing the silicon carbide micropowder originally adsorbed inside the first sieve cylinder and the second sieve cylinder under the grinding action to produce a certain flipping effect under the disturbance effect of the wind, thereby preventing the accumulation of silicon carbide micropowder and improving the grinding effect of the silicon carbide micropowder. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings constituting a part of this application are used to provide a further understanding of this application, so that other features, purposes and advantages of this application become more obvious. The schematic embodiment drawings and their descriptions of this application are used to explain this application and do not constitute an improper limitation on this application. In the drawings:

[0019] Figure 1 It is a schematic diagram of the overall internal structure of the present invention.

[0020] Figure 2 It is a schematic diagram of the cross-sectional structure of the inner cylinder of the present invention.

[0021] Figure 3 It is a schematic diagram of the overall structure of the grinding mechanism of the present invention.

[0022] Figure 4 It is a schematic diagram of the structure of the first screen drum and the second screen drum of the present invention.

[0023] In the above figure, 100, outer cylinder; 101, air inlet; 102, air inlet pipe; 200, inner cylinder; 201, wind shield ring; 202, connecting port; 203, through hole; 204, material guide port; 205, hinged plate; 300, grinding mechanism; 301, gear ring; 302, transmission gear; 303, first screen cylinder; 304, second screen cylinder; 305, grinding rod; 306, rotating disk; 307, driving gear; 308, connecting rod; 309, conical seat; 400, conical material guide seat; 401, driving motor; 500, supporting seat; 600, connecting cover; 601, discharge port; 602, discharge pipe; 603, feed pipe. DETAILED DESCRIPTION

[0024] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only embodiments of a part of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work should fall within the scope of protection of the present application.

[0025] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application are described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, the process, method, system, product or equipment comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or equipment.

[0026] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0027] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0028] In addition, the terms "installed", "set", "provided with", "connected", "connected", and "socketed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0029] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0030] Embodiment 1

[0031] See also Figure 1-Figure 4 As shown, this embodiment provides a silicon carbide micro-powder grinding mechanism, comprising an outer cylinder 100 and an inner cylinder 200 fixed inside the outer cylinder 100, wherein a conical material guide seat 400 is fixed at the middle position inside the outer cylinder 100, and air inlets 101 are provided at equal intervals along the circumferential direction of the outer cylinder 100 at the bottom of the outer cylinder 100 outside the conical material guide seat 400, and an air inlet pipe 102 connected to the air inlet 101 is provided at the bottom of the outer cylinder 100, and the air is screened by the second sieve drum 304. After the silicon carbide powder falls onto the conical material guide seat 400, as the silicon carbide powder falling onto the conical material guide seat 400 increases, the hinge plate 205 hinged on the material guide port 204 opens, and the silicon carbide powder enters the channel between the inner cylinder 200 and the outer cylinder 100 along the inclined surface of the conical material guide seat 400, and then enters the inside of the air inlet pipe 102 through the external wind source, and enters the channel between the inner cylinder 200 and the outer cylinder 100 through the air inlet port 101, and the silicon carbide powder is lifted up along the channel by wind force;

[0032] In this embodiment, the bottom of the inner cylinder 200 is provided with material guide ports 204 at equal intervals along its circumferential direction, and a hinge plate 205 is hinged inside the material guide port 204, and connecting ports 202 are provided at equal intervals along the height direction of the inner cylinder 200, and a wind shield ring 201 is fixed to the outer side of the inner cylinder 200 at the position of the connecting port 202, and through holes 203 are provided on the wind shield ring 201 at equal intervals, and a grinding mechanism 300 for grinding silicon carbide is installed inside the inner cylinder 200, which extends to the inside of the channel through the wind shield ring 201, thereby blocking the rising wind force and silicon carbide powder, and the rising silicon carbide powder will rise along the gap between the wind shield ring 201 and the channel, thereby changing the travel route of the silicon carbide powder, and at the same time, under the obstruction of the wind shield ring 201, a wind shield ring 201 will be formed above the corresponding position In the weak wind pressure area, some larger silicon carbide powders will fall on the wind shield ring 201 by themselves, and then slide along the inclined surface and the connecting port 202 on the inner side of the wind shield ring 201 to the inside of the first sieve drum 303 and the second sieve drum 304 for further grinding until the silicon carbide powders can be blown out by wind force, thereby ensuring that the quality of the silicon carbide powders meets the standards and improving the quality of the silicon carbide powders. At the same time, due to the existence of the through hole 203 and the connecting port 202, part of the wind will enter the inner cylinder 200 along the through hole 203 and the connecting port 202, and have a certain disturbance effect on the silicon carbide powders inside the inner cylinder 200, so that the silicon carbide powders originally adsorbed inside the first sieve drum 303 and the second sieve drum 304 under the grinding action will have a certain flipping effect under the disturbance effect of the wind force, thereby preventing the silicon carbide powders from accumulating and improving the grinding effect of the silicon carbide powders.

[0033] In this embodiment, a connection cover 600 for guiding silicon carbide powder is fixedly connected to the top of the outer cylinder 100 and the inner cylinder 200 .

[0034] In this embodiment, a support seat 500 is fixedly mounted on the outer side of the outer cylinder 100, and the support seat 500 is used to support the grinding mechanism.

[0035] In this embodiment, a feed pipe 603 connected to the inner cylinder 200 is connected to the top of the connecting cover 600, and discharge ports 601 are evenly spaced along the circumferential direction of the connecting cover 600 at the bottom of the connecting cover 600 outside the outer cylinder 100, and a discharge pipe 602 connected to the discharge port 601 is provided at the bottom of the connecting cover 600. Wind force is used to raise the silicon carbide micropowder along the channel, and the rising silicon carbide micropowder enters the interior of the connecting cover 600 along the channel, and then is discharged from the interior of the grinding mechanism through the discharge port 601 and the discharge pipe 602.

[0036] like Figure 3 and Figure 4As shown, in this embodiment, the grinding mechanism 300 includes a first sieve drum 303 and a second sieve drum 304 which are opposite to the connection port 202, and a gear ring 301 which is fixedly connected to the top of the grinding mechanism 300, wherein the first sieve drum 303, the second sieve drum 304 and the gear ring 301 are connected to each other through a connecting rod 308, and a conical seat 309 is fixed at the center position of the first sieve drum 303 and the second sieve drum 304, and a rotating disk 306 is rotatably connected at the middle position of the conical seat 309, and the rotating disk 306 is rotated along the rotating disk 306. Grinding rods 305 are installed at equal intervals in the circumferential direction of the grinding mechanism 300, and a rotating shaft is vertically rotatably connected at the middle position of the grinding mechanism 300, and the rotating disk 306 is sleeved on the rotating shaft. The grinding rods 305 are used to grind the silicon carbide falling on the first sieve drum 303 and the second sieve drum 304. During the grinding process, the driving gear 307 and the gear ring 301 are meshed and driven by the transmission gear 302 to form a planetary gear structure, so that the rotation direction of the grinding rod 305 and the first sieve drum 303 and the second sieve drum 304 is opposite, thereby improving the grinding effect on the silicon carbide.

[0037] like Figure 3 As shown, in this embodiment, a driving gear 307 is sleeved on the top of the rotating shaft, and the driving gear 307 and the gear ring 301 are meshed with each other through a transmission gear 302, and the transmission gear 302 is connected to the bottom of the connecting cover 600 through a bearing, and a groove capable of assembling a driving motor 401 is opened at the middle position of the conical material guide seat 400, and the output end of the driving motor 401 is connected to the bottom end of the rotation, and the driving motor 401 is provided with power support through an external power supply, and the rotating shaft is driven to rotate by the driving motor 401, thereby driving the rotating disk 306 to rotate, and the driving gear 307 and the gear ring 301 are meshed and transmitted by the transmission gear 302 to form a planetary gear structure, so that the grinding rod 305 rotates in the opposite direction to the first screen drum 303 and the second screen drum 304, thereby improving the grinding effect on silicon carbide.

[0038] In summary:

[0039] First, the silicon carbide is introduced into the inner cylinder 200 through the feed pipe 603 and falls on the first sieve drum 303. At the same time, the external power supply provides power support for the drive motor 401, and the drive motor 401 drives the rotating shaft to rotate, thereby driving the rotating disk 306 to rotate, and the silicon carbide falling on the first sieve drum 303 and the second sieve drum 304 is ground by the grinding rod 305. During the grinding process, the driving gear 307 and the gear ring 301 are meshed and driven by the transmission gear 302 to form a planetary gear structure, so that the grinding rod 305 and the first sieve drum 303 and the second sieve drum 304 rotate in opposite directions, thereby improving the grinding of the silicon carbide. The silicon carbide powder is screened by the second sieve drum 304 and then falls on the conical guide seat 400. As the silicon carbide powder falling on the conical guide seat 400 increases, the hinge plate 205 hinged on the guide port 204 opens, and the silicon carbide powder enters the channel between the inner cylinder 200 and the outer cylinder 100 along the inclined surface of the conical guide seat 400, and then enters the channel between the inner cylinder 200 and the outer cylinder 100 through the external wind source to the inside of the air inlet pipe 102, and enters the channel between the inner cylinder 200 and the outer cylinder 100 through the air inlet 101. The silicon carbide powder is raised along the channel by wind force, and the rising silicon carbide powder enters the inside of the connecting cover 600 along the channel, and then passes through The silicon carbide powder is discharged from the grinding mechanism through the discharge port 601 and the discharge pipe 602. During this process, since the wind shield ring 201 extends to the inside of the channel, the rising wind force and the silicon carbide powder are blocked. The rising silicon carbide powder will rise along the gap between the wind shield ring 201 and the channel, thereby changing the travel path of the silicon carbide powder. At the same time, under the obstruction of the wind shield ring 201, a wind pressure area with weak wind force will be formed above the corresponding position of the wind shield ring 201, so that some silicon carbide powder with larger particles will fall on the wind shield ring 201 by themselves, and then slide to the first sieve drum 303 and the second sieve drum along the inclined surface inside the wind shield ring 201 and the connecting port 202. 304, and grinding is performed again until the silicon carbide micropowder can be blown out by wind force, thereby ensuring that the quality of the silicon carbide micropowder meets the standard and improving the quality of the silicon carbide micropowder. At the same time, it is explained that although the through hole 203 is opened on the wind shield ring 201, compared with the wind force below the wind shield ring 201, the pressure of the wind blowing above the wind shield ring 201 is reduced due to the obstruction of the wind shield ring 201, so that the ground silicon carbide micropowder is blown up by using stable wind energy, although the wind force is reduced to a certain extent during the rising process of the silicon carbide micropowder, so that the larger particles of silicon carbide micropowder fall by themselves in this case and enter the grinding area for re-grinding;

[0040] At the same time, due to the existence of the through hole 203 and the connecting port 202, part of the wind will enter the inner cylinder 200 through the through hole 203 and the connecting port 202, which will have a certain disturbing effect on the silicon carbide micropowder inside the inner cylinder 200, so that the silicon carbide micropowder originally adsorbed inside the first sieve cylinder 303 and the second sieve cylinder 304 under the grinding action will produce a certain flipping effect under the disturbing effect of the wind, thereby preventing the accumulation of silicon carbide micropowder and improving the grinding effect of the silicon carbide micropowder.

[0041] Embodiment 2

[0042] A grinding method for a silicon carbide micropowder grinding mechanism, characterized in that it comprises the following steps:

[0043] S1. First, silicon carbide is introduced into the grinding mechanism, and the first sieve drum 303 and the second sieve drum 304 are rotated in opposite directions to the grinding roller 305, and the sieve holes of the second sieve drum 304 are smaller than the sieve holes of the first sieve drum 303;

[0044] S2, the ground silicon carbide powder is deposited on the inclined surface of the conical material guide seat 400, and then enters between the inner cylinder 200 and the outer cylinder 100 from the material guide port 204, and at the same time passes through the external wind source to the inside of the air inlet pipe 102, and enters between the inner cylinder 200 and the outer cylinder 100 through the air inlet 101, and the silicon carbide powder is raised along the inner cylinder 200 and the outer cylinder 100 by wind force;

[0045] S3. The silicon carbide powder rises under the action of wind, and finally enters the discharge pipe 602 from the discharge port 601 on the connecting cover 600, and is then discharged. During this process, some larger silicon carbide powders are collected by the wind shield ring 201 arranged between the inner cylinder 200 and the outer cylinder 100 and enter the first sieve drum 303 and the second sieve drum 304 for further grinding.

Claims

1. A silicon carbide micro-powder grinding mechanism, comprising an outer cylinder (100) and an inner cylinder (200) fixed inside the outer cylinder (100), wherein: A conical material guide seat (400) is fixed at a middle position inside the outer cylinder (100), characterized in that air inlets (101) are provided at equal intervals at the bottom of the outer cylinder (100) outside the conical material guide seat (400) along the circumferential direction of the outer cylinder (100), and an air inlet pipe (102) connected to the air inlet (101) is provided at the bottom of the outer cylinder (100); The bottom of the inner cylinder (200) is provided with material guide ports (204) at equal intervals along the circumferential direction thereof, a hinge plate (205) is hingedly connected inside the material guide port (204), connecting ports (202) are provided at equal intervals along the height direction of the inner cylinder (200), a wind shielding ring (201) is fixed on the outside of the inner cylinder (200) at the position of the connecting port (202), through holes (203) are provided on the wind shielding ring (201) at equal intervals, and a grinding mechanism (300) for grinding silicon carbide is installed inside the inner cylinder (200); A connection cover (600) for guiding silicon carbide micropowder is fixedly connected to the top of the outer cylinder (100) and the inner cylinder (200); A support seat (500) is fixedly mounted on the outer side of the outer cylinder (100); A feed pipe (603) connected to the inner cylinder (200) is connected to the top of the connection cover (600), and discharge ports (601) are provided at equal intervals along the circumferential direction of the connection cover (600) at the bottom of the connection cover (600) outside the outer cylinder (100), and a discharge pipe (602) connected to the discharge port (601) is provided at the bottom of the connection cover (600); The grinding mechanism (300) comprises a first sieve drum (303) and a second sieve drum (304) which are opposite to the connection port (202), and a gear ring (301) fixedly connected to the top of the grinding mechanism (300), wherein the first sieve drum (303), the second sieve drum (304) and the gear ring (301) are connected to each other via a connecting rod (308), and a conical seat (309) is fixed at the center position inside the first sieve drum (303) and the second sieve drum (304), a rotating disk (306) is rotatably connected at the middle position of the conical seat (309), and grinding rollers (305) are installed at equal intervals along the circumferential direction of the rotating disk (306), and a rotating shaft is vertically rotatably connected at the middle position of the grinding mechanism (300), and the rotating disk (306) is sleeved on the rotating shaft; A driving gear (307) is sleeved on the top of the rotating shaft, and the driving gear (307) and the gear ring (301) are meshed with each other via a transmission gear (302), and the transmission gear (302) is connected to the bottom of the connecting cover (600) via a bearing, and a groove capable of assembling a driving motor (401) is provided at the middle position of the conical material guide seat (400), and the output end of the driving motor (401) is connected to the bottom end of the rotating shaft.

2. The grinding method of the silicon carbide micro powder grinding mechanism according to claim 1, characterized in that: The following steps are involved: S1. First, silicon carbide is introduced into the grinding mechanism, and the first sieve drum (303) and the second sieve drum (304) are rotated in opposite directions to the grinding roller (305), and the sieve holes of the second sieve drum (304) are smaller than the sieve holes of the first sieve drum (303); S2, the ground silicon carbide micropowder is deposited on the inclined surface of the conical material guide seat (400), and then enters between the inner cylinder (200) and the outer cylinder (100) from the material guide port (204), and at the same time enters the air inlet pipe (102) through an external air source, and enters between the inner cylinder (200) and the outer cylinder (100) through the air inlet port (101), and the silicon carbide micropowder is raised along the space between the inner cylinder (200) and the outer cylinder (100) by wind force; S3. The silicon carbide micropowder that rises under the action of wind finally enters the inside of the discharge pipe (602) from the discharge port (601) on the connecting cover (600) and is then discharged. During this process, some larger silicon carbide micropowders are collected by the wind shield ring (201) arranged between the inner cylinder (200) and the outer cylinder (100) and enter the first sieve cylinder (303) and the second sieve cylinder (304) for further grinding.

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