A Micro Led Chip Connection Adhesion Detection Device and Detection Method

Abstract

The present invention relates to a Micro Led chip connection adhesion detection device and a detection method, including a carrying and transferring mechanism for loading a chip to be detected and transferring the chip to be detected to a target detection position; a force and deformation detection mechanism, which includes a detection probe, a deformation module and a detection module. The detection probe is arranged on one side of the carrying and transferring mechanism and is used to contact the chip to be detected. The deformation module is connected to the detection probe and can sense the contact force of the detection probe and generate a corresponding deformation. The detection module is assembled with the deformation module and is used to convert the deformation amount of the deformation module into a displacement amount; and a data analysis device, which is electrically connected to the detection module and is used to convert the displacement amount obtained by the detection module into an electrical signal, so as to calculate the real-time detected connection adhesion force.

Description

Technical Field

[0001] The present invention relates to the technical field of Micro Led chip quality detection, and particularly to a Micro Led chip connection adhesion detection device and a detection method. Background Art

[0002] With the progress of LED technology, the reduction of chip size and pixel pitch has made LED screens more flexible, transparent, interactive and easy to modularly assemble, indicating that it may become a cross-functional and widely used cutting-edge display technology. Micro Led display is a next-generation display technology with advantages such as high brightness, high contrast, low power consumption, fast response time and excellent color performance. However, due to the too small size of Micro Led chips, when soldering the electrodes of Micro Led chips to the conductive traces on the substrate using solder, there may be uneven soldering of the solder, thus affecting the connection adhesion of the MicroLed chips installed on the substrate, and further leading to problems such as uneven brightness, color deviation, pixel failure, inconsistent response time and thermal management in Micro Led displays, thereby affecting the overall display quality and performance and seriously hindering the commercialization of Micro Led. Summary of the Invention

[0003] The purpose of the present invention is to provide a Micro Led chip connection adhesion detection device for solving the problem that the poor welding quality between the chip and the substrate affects the connection adhesion of the chip on the substrate, and further affects the display quality and performance.

[0004] According to one aspect of the present invention, there is provided a Micro Led chip connection adhesion detection device, which includes:

[0005] A carrying and transferring mechanism for loading the chip to be detected and transferring the chip to be detected to the target detection position;

[0006] A force and deformation detection mechanism, which includes a detection probe, a deformation module and a detection module. The detection probe is arranged on one side of the carrying and transferring mechanism for contacting the chip to be detected. The deformation module is connected to the detection probe and can sense the contact force of the detection probe and generate a corresponding deformation. The detection module is assembled with the deformation module for converting the deformation amount of the deformation module into a displacement amount;

[0007] A data analysis device, which is electrically connected to the detection module for converting the displacement amount obtained by the detection module into an electrical signal, so as to calculate the real-time detected connection adhesion size.

[0008] In one embodiment, the carrying and transferring mechanism includes a three-axis high-precision moving platform, a fixture, and a substrate. The three-axis high-precision moving platform provides moving forces in the X, Y, and Z axis directions. The fixture is arranged on the three-axis high-precision moving platform, and the substrate is clamped and fixed by the fixture. The substrate is used for welding and fixing the chip to be detected.

[0009] In one embodiment, the detection probe includes a probe body. The probe body includes a working area, and the working area is used to abut against one long side of the chip to be detected.

[0010] The working area is composed of a plurality of triangular faces spliced together. Among them, the length of the horizontal part of the working area is equal to the length of the long side of the chip to be detected, and one triangular face closest to the chip to be detected is provided with an inclination angle.

[0011] In one embodiment, the probe body further includes a clamping area, and the detection probe further includes a probe fixture, and the probe fixture is connected to the clamping area.

[0012] In one embodiment, the detection probe further includes two monitoring cameras. The monitoring cameras are used to monitor the real-time position of the probe body relative to the chip to be detected. One of the monitoring cameras is arranged directly above the probe body, and the other monitoring camera is arranged on one horizontal side of the probe body.

[0013] In one embodiment, the deformation module includes a movable block, a guide rail, a fixed block, a first mounting bracket, a second mounting bracket, and a deformation unit. The movable block is movably arranged on the guide rail and is connected to the detection probe. The fixed block is fixed on the guide rail and is arranged at an interval from the movable block. The first mounting bracket is arranged on the movable block, the second mounting bracket is arranged on the fixed block, and the deformation unit is connected between the first mounting bracket and the second mounting bracket.

[0014] In one embodiment, the deformation unit includes a linearly elastic member. One end of the linearly elastic member is connected to the first mounting bracket, and the other end of the linearly elastic member is connected to the second mounting bracket.

[0015] In one embodiment, the deformation unit further includes a reflective sheet. One end of the reflective sheet is connected to the first mounting bracket, and the other end of the reflective sheet is connected to the second mounting bracket.

[0016] The detection module includes a laser source and a position detector. The laser source is arranged above the reflector relatively and is used to emit laser to the reflector. The laser reaches the position detector after being reflected by the reflector, and the position detector is used to sense the position change of the laser.

[0017] In one embodiment, the data analysis device includes a computer and a feedback circuit. One end of the feedback circuit is electrically connected to the position detector, and the other end of the feedback circuit is electrically connected to the computer.

[0018] On the other hand, the present application also provides a detection method based on the above-mentioned Micro Led chip connection adhesion detection device, which includes the following steps:

[0019] Install the chip to be detected on the carrying and transferring mechanism, and control the carrying and transferring mechanism to drive the chip to be detected to move to the target detection position so that the chip to be detected contacts the detection probe.

[0020] The carrying and transferring mechanism continues to drive the chip to be detected to move towards the detection probe to generate extrusion stress, and the extrusion stress forces the deformation module to generate a deformation amount.

[0021] The detection module converts the detected deformation amount of the deformation module into a displacement amount, and when the displacement amount reaches the target connection adhesion size, controls the carrying and transferring mechanism to stop moving.

[0022] The detection module transmits the displacement amount to the data analysis device, and the data analysis device converts the displacement amount into an electrical signal, thereby calculating the size of the detection force.

[0023] Implementing the embodiments of the present invention will have the following beneficial effects:

[0024] When the Micro Led chip connection adhesion detection device of this solution is in use, first determine the critical connection adhesion between the chip to be detected and the substrate; install the chip to be detected on the carrying and transferring mechanism, and control the carrying and transferring mechanism to drive the chip to be detected to move to the target detection position so that the chip to be detected contacts the detection probe; the carrying and transferring mechanism continues to drive the chip to be detected to move towards the detection probe to generate a static extrusion force between the two, and the static extrusion force forces the deformation module to generate a deformation amount; the detection module converts the detected deformation amount of the deformation module into a displacement amount, and the detection module transmits the displacement amount to the data analysis device, and the data analysis device converts the displacement amount into an electrical signal, so as to calculate the real-time detected connection adhesion size. When the real-time detected connection adhesion size reaches the critical connection adhesion size, control the carrying and transferring mechanism to stop moving. By detecting the real-time detected connection adhesion size and comparing it with the theoretical critical connection adhesion (the critical connection adhesion is the maximum external force required to cause the two to tear apart when the chip to be detected and the substrate obtain a complete welding area and have the best welding strength. In this case, this external force can be the static extrusion force between the chip to be detected and the detection probe), it can be judged whether the electrodes of the chip to be detected and the conductive traces of the substrate are welded completely, thereby reducing the probability of problems such as uneven brightness, color deviation, pixel failure, and inconsistent response time in the Micro Led display, ensuring the overall display quality and performance, and improving the yield of the Micro Led display screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0026] Figure 1 It is a schematic structural diagram of a Micro Led chip connection adhesion detection device for an embodiment;

[0027] Figure 2 It is an assembly structure diagram of a probe body and a probe fixture for an embodiment;

[0028] Figure 3 For Figure 2 The left view structure diagram;

[0029] Figure 4 It is a schematic structural diagram of a probe body for an embodiment;

[0030] Figure 5 For Figure 4 The left view structure diagram;

[0031] Figure 6 It is a step flow chart of a detection method for the connection adhesion detection device of a Micro Led chip.

[0032] Wherein:

[0033] 100. Micro Led chip connection adhesion detection device; 10. Loading and transfer mechanism; 11. Three-axis high-precision moving platform; 12. Fixture; 13. Substrate; 20. Force deformation detection mechanism; 21. Detection probe; 211. Probe body; 211a. Working area; 211b. Clamping area; 212. Probe fixture; 213. Monitoring camera; 22. Deformation module; 221. Movable block; 222. Guide rail; 223. Fixed block; 224. First mounting bracket; 225. Second mounting bracket; 226. Linear elastic component; 227. Reflective sheet; 23. Detection module; 231. Laser source; 232. Position detector; 30. Data analysis device; 31. Computer; 32. Feedback circuit; 200. Chip to be detected. Specific embodiments

[0034] To facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0035] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used herein in the description of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0037] Please refer to Figures 1 - 5, a Micro Led chip connection adhesion detection device 100 described in an embodiment, is used to detect the integrity of the connection (welding) between the electrodes of the Micro Led chip and the conductive traces on the substrate 13, so as to evaluate the installation strength and connection quality of the Micro Led chip on the substrate 13.

[0038] Specifically in this case, the Micro Led chip connection adhesion detection device 100 includes a carrying and transferring mechanism 10, which is used to load the chip 200 to be detected and transfer the chip 200 to the target detection position; a force and deformation detection mechanism 20, which includes a detection probe 21, a deformation module 22 and a detection module 23. The detection probe 21 is arranged on one side of the carrying and transferring mechanism 10 and is used to contact the chip 200 to be detected. The deformation module 22 is connected to the detection probe 21 and can sense the contact force of the detection probe 21 and generate a corresponding deformation. The detection module 23 is assembled with the deformation module 22 and is used to convert the deformation amount of the deformation module 22 into a displacement amount; and a data analysis device 30, which is electrically connected to the detection module 23 and is used to convert the displacement amount obtained by the detection module 23 into an electrical signal, so as to calculate the detection force size.

[0039] Implementing the embodiments of the present invention will have the following beneficial effects: When the Micro Led chip connection adhesion detection device 100 of this solution is in use, first determine the critical connection adhesion between the chip 200 to be detected and the substrate 13; install the chip 200 to be detected on the carrier transfer mechanism 10, and control the carrier transfer mechanism 10 to drive the chip 200 to be detected to move to the target detection position so that the chip 200 to be detected contacts the detection probe 21; the carrier transfer mechanism 10 continues to drive the chip 200 to be detected to move towards the detection probe 21 to generate a static extrusion force between the two, and the static extrusion force forces the deformation module 22 to generate a deformation amount; the detection module 23 converts the detected deformation amount of the deformation module 22 into a displacement amount, and the detection module 23 transmits the displacement amount to the data analysis device 30. The data analysis device 30 converts the displacement amount into an electrical signal, thereby calculating the real-time detected connection adhesion. When the real-time detected connection adhesion reaches the critical connection adhesion, control the carrier transfer mechanism 10 to stop moving. By detecting the real-time detected connection adhesion and comparing it with the theoretical critical connection adhesion (the critical connection adhesion is the maximum external force required to cause the chip 200 to be detected and the substrate 13 to be torn apart when they obtain a complete welding area and have the best welding strength. In this case, this external force can be the static extrusion force between the chip 200 to be detected and the detection probe 21), it can be determined whether the electrodes of the chip 200 to be detected and the conductive traces of the substrate 13 are welded completely, thereby reducing the probability of problems such as uneven brightness, color deviation, pixel failure, and inconsistent response time in the Micro Led display, ensuring the overall display quality and performance, and improving the yield of the Micro Led display screen.

[0040] It should be noted that the chip 200 to be detected in this case can be a single chip or a chip array unit composed of multiple chips. When the chip 200 to be detected refers to a chip array unit, it is necessary to perform connection adhesion tests on each chip 200 to be detected in turn during detection.

[0041] At this time, there is a gap between two adjacent chips 200 to be detected, and the size of this gap should be sufficient to accommodate the detection probe 21 so that the detection probe 21 can contact the side surface of the chip 200 to be detected.

[0042] Please refer to Figure 1 , in one of the embodiments, the carrier transfer mechanism 10 includes a three-axis high-precision moving platform 11, a fixture 12, and a substrate 13. The three-axis high-precision moving platform 11 provides moving forces in the XYZ three-axis directions. The fixture 12 is arranged on the three-axis high-precision moving platform 11, and the substrate 13 is clamped and fixed by the fixture 12. The substrate 13 is used for welding and fixing the chip 200 to be detected.

[0043] It can be understood that the three-axis high-precision moving platform 11 is specifically composed of an X-axis moving module, a Y-axis moving module, and a Z-axis moving module. It can drive the fixture 12 and the substrate 13 to move linearly with high precision in the positive and negative directions along the three axes of the X-axis, Y-axis, and Z-axis respectively or synchronously, so as to ensure that the detection probe 21 can accurately move to each gap and effectively contact different chips 200 to be detected. The fixture 12 is used to clamp and fix the substrate 13, thereby preventing the substrate 13 and the chips 200 to be detected mounted thereon from moving or rotating in the XY-axis direction due to the contact force of the detection probe 21 during the test, which may affect the test results.

[0044] Please refer to Figure 4 and Figure 5 , specifically, in the above embodiment, the detection probe 21 includes a probe body 211. The probe body 211 includes a working area 211a, and the working area 211a is used to contact one long side of the chip 200 to be detected. Thereby, the contact area between the detection probe 21 and the chip 200 to be detected can be increased, so as to improve the stability when the two are mutually extruded.

[0045] The working area 211a is composed of a plurality of triangular surfaces spliced together. Among them, the horizontal part length of the working area 211a is equal to the length of the long side of the chip 200 to be detected, and one triangular surface closest to the chip 200 to be detected is provided with an inclination angle. In this way, when the detection probe 21 reaches the gap between two adjacent chips 200 to be detected, it can avoid accidentally touching other non-target chips 200 to be detected while contacting the target chip 200 to be detected, which may affect the force and deformation accuracy of the detection probe 21.

[0046] Furthermore, the probe body 211 further includes a clamping area 211b, and the detection probe 21 further includes a probe fixture 212. The probe fixture 212 is connected to the clamping area 211b. The probe fixture 212 is used to clamp and fix the detection probe 21 to ensure that the detection probe 21 can stably and reliably contact the chip 200 to be detected.

[0047] In one of the embodiments, the detection probe 21 further includes two monitoring cameras 213. The monitoring cameras 213 are used to monitor the real-time position of the probe body 211 relative to the chip 200 to be detected. One of the monitoring cameras 213 is arranged directly above the probe body 211, and the other monitoring camera 213 is arranged on the horizontal side of the probe body 211. The two monitoring cameras 213 respectively capture the detection probe 21 from different angles, so as to monitor the real-time position of the detection probe 21 relative to the chip 200 to be detected, so as to make timely adjustments to situations such as displacement and skew, and ensure the smooth progress of the detection process.

[0048] Please refer to Figure 1, in yet another embodiment, the deformation module 22 includes a movable block 221, a guide rail 222, a fixed block 223, a first mounting bracket 224, a second mounting bracket 225, and a deformation unit. The movable block 221 is movably disposed on the guide rail 222 and connected to the detection probe 21. The fixed block 223 is fixedly disposed on the guide rail 222 and arranged at an interval from the movable block 221. The first mounting bracket 224 is disposed on the movable block 221, and the second mounting bracket 225 is disposed on the fixed block 223. The deformation unit is connected between the first mounting bracket 224 and the second mounting bracket 225.

[0049] The movable block 221 is configured to be able to slide freely on the guide rail 222, and the sliding friction force between the movable block 221 and the guide rail 222 is much smaller than the connection adhesion force of the chip 200 to be detected on the substrate 13, so as to avoid interfering with the detection result. The fixed block 223 is configured to be fixedly installed on the guide rail 222 and immovable. The connection manner between the two can be at least one of, but not limited to, screwing, clamping, welding, bonding, etc. The first mounting bracket 224 and the second mounting bracket 225 jointly install and support the deformation unit, and the distance between the first mounting bracket 224 and the second mounting bracket 225 provides the space required for the deformation unit to deform.

[0050] When the three-axis high-precision moving platform 11 drives the chip 200 to be detected and the detection probe 21 to move towards each other and applies an extrusion force to the detection probe 21, the detection probe 21 transmits the force to the first mounting bracket 224 through the movement of the movable block 221, and then transmits it to the deformation unit. The first mounting bracket 224 and the second mounting bracket 225 move closer to each other, thereby squeezing the deformation unit and forcing the deformation unit to deform. The magnitude of this deformation directly represents the magnitude of the extrusion force between the chip 200 to be detected and the detection probe 21. The detection module 23 calculates the magnitude of the real-time detected connection adhesion force by detecting the deformation amount of the deformation unit in real time, converting it into a displacement amount, and transmitting the displacement amount to the data analysis device 30.

[0051] Specifically, the deformation unit includes a linearly elastic member 226. One end of the linearly elastic member 226 is connected to the first mounting bracket 224, and the other end of the linearly elastic member 226 is connected to the second mounting bracket 225. The linearly elastic member 226 is used to convert the force received by the detection probe 21 into its own deformation. The linearly elastic element follows the linear elasticity theory and only undergoes elastic deformation along the length direction of the guide rail 222 during the detection process.

[0052] Further, the deformation unit further includes a reflector 227. One end of the reflector 227 is connected to the first mounting bracket 224, and the other end of the reflector 227 is connected to the second mounting bracket 225. The detection module 23 includes a laser source 231 and a position detector 232. The laser sources 231 are relatively arranged above the reflector 227 and are used to emit lasers to the reflector 227. The lasers reach the position detector 232 after being reflected by the reflector 227, and the position detector 232 is used to sense the position change of the lasers.

[0053] After the linear elastic component 226 is extruded and deformed, the reflector 227 will also be bent and deformed synchronously, so that the position of the laser irradiated on the surface of the reflector 227 by the laser source 231 reflected onto the position detector 232 will change. This displacement (i.e., the magnitude of the position change) can directly characterize the deformation degree of the reflector 227 and the linear elastic component 226. The position detector 232 converts the change in the landing position of the laser at intervals into an electrical signal and transmits it to the data analysis device 30.

[0054] In one embodiment, the data analysis device 30 includes a computer 31 and a feedback circuit 32. One end of the feedback circuit 32 is electrically connected to the position detector 232, and the other end of the feedback circuit 32 is electrically connected to the computer 31. The feedback circuit 32 is used to transmit the electrical signal of the position detector 232 to the computer 31 for analysis. The computer 31 is used to collect and process the electrical signal to generate real-time detection of the connection adhesion force, and at the same time control the three-axis high-precision moving platform 11, the detection probe 21, etc.

[0055] Please refer to Figure 6 On the other hand, the present application further provides a detection method based on the above Micro Led chip connection adhesion detection device 100, which includes the following steps:

[0056] S10. Install the chip 200 to be detected on the carrying and transferring mechanism 10, and control the carrying and transferring mechanism 10 to drive the chip 200 to be detected to move to the target detection position so that the chip 200 to be detected abuts against the detection probe 21.

[0057] S20. The carrying and transferring mechanism 10 continues to drive the chip 200 to be detected to move towards the detection probe 21 to generate extrusion stress, and the extrusion stress forces the deformation module 22 to generate a deformation amount.

[0058] S30. The detection module 23 converts the detected deformation amount of the deformation module 22 into a displacement amount, and when the displacement amount reaches the target connection adhesion force magnitude, control the carrying and transferring mechanism 10 to stop moving.

[0059] S40. The detection module 23 transmits the displacement amount to the data analysis device 30, and the data analysis device 30 converts the displacement amount into an electrical signal, thereby calculating the magnitude of the detection force.

[0060] The above-described embodiments merely represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation to the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the appended claims.

Claims

1. A Micro Led chip connection adhesion detection device, characterized in that: include: A carrying and transferring mechanism, wherein the carrying and transferring mechanism is used to load the chip to be detected and transfer the chip to be detected to a target detection position; A force deformation detection mechanism, the force deformation detection mechanism comprises a detection probe, a deformation module and a detection module, the detection probe is arranged at one side of the carrying and transferring mechanism, and is used to contact with the chip to be detected, the deformation module is connected to the detection probe, and can sense the contact force of the detection probe and produce a corresponding deformation, the detection module is assembled with the deformation module, and is used to convert the deformation of the deformation module into a displacement, wherein the static extrusion force between the detection probe and the chip to be detected forces the deformation module to produce a deformation; A data analysis device, the data analysis device is electrically connected to the detection module, and is used to convert the displacement obtained by the detection module into an electrical signal, so as to calculate and obtain the real-time detection connection adhesion force; Wherein, the deformation module includes a movable block, a guide rail, a fixed block, a first mounting bracket, a second mounting bracket and a deformation unit, the movable block is movably arranged on the guide rail and connected to the detection probe, the fixed block is fixed on the guide rail and arranged at intervals with the movable block, the first mounting bracket is arranged on the movable block, the second mounting bracket is arranged on the fixed block, and the deformation unit is connected between the first mounting bracket and the second mounting bracket.

2. The Micro Led chip connection adhesion detection device according to claim 1, characterized in that: The carrying and transferring mechanism includes a three-axis high-precision mobile platform, a fixture and a substrate. The three-axis high-precision mobile platform provides movement force in the three-axis directions of XYZ. The fixture is arranged on the three-axis high-precision mobile platform. The substrate is clamped and fixed by the fixture. The substrate is used for welding and fixing the chip to be tested.

3. The Micro Led chip connection adhesion detection device according to claim 1, characterized in that: The detection probe comprises a probe body, the probe body comprises a working area, and the working area is used to contact a long side of a chip to be detected; The working area is composed of a plurality of triangular faces, wherein the length of the horizontal portion of the working area is equal to the length of the long side of the chip to be detected, and a triangular face closest to the chip to be detected is provided with an inclination angle.

4. The Micro Led chip connection adhesion detection device according to claim 3, characterized in that: The probe body further includes a clamping area, and the detection probe further includes a probe fixture, and the probe fixture is connected to the clamping area.

5. The Micro Led chip connection adhesion detection device according to claim 3, characterized in that: The detection probe also includes two monitoring cameras, which are used to monitor the real-time position of the probe body relative to the chip to be detected. One of the monitoring cameras is arranged directly above the probe body, and the other monitoring camera is arranged on the horizontal side of the probe body.

6. The Micro Led chip connection adhesion detection device according to claim 1, characterized in that: The deformation unit includes a linear elastic component, one end of the linear elastic component is connected to the first mounting bracket, and the other end of the linear elastic component is connected to the second mounting bracket.

7. The Micro Led chip connection adhesion detection device according to claim 6, characterized in that: The deformation unit further includes a reflective sheet, one end of which is connected to the first mounting bracket, and the other end of which is connected to the second mounting bracket; The detection module includes a laser source and a position detector. The laser source is arranged relatively above the reflective sheet and is used to emit laser light to the reflective sheet. The laser light reaches the position detector after being reflected by the reflective sheet. The position detector is used to sense the position change of the laser light.

8. The Micro Led chip connection adhesion detection device according to claim 7, characterized in that: The data analysis device includes a computer and a feedback circuit, one end of the feedback circuit is electrically connected to the position detector, and the other end of the feedback circuit is electrically connected to the computer.

9. A detection method based on the Micro Led chip connection adhesion detection device according to any one of claims 1 to 8, characterized in that: The steps include: Determine the critical connection adhesion between the chip to be tested and the substrate; The chip to be detected is mounted on the carrying and transferring mechanism, and the carrying and transferring mechanism is controlled to drive the chip to be detected to move to the target detection position so that the chip to be detected is in contact with the detection probe; The carrying and transferring mechanism continues to drive the chip to be tested to move toward the testing probe to generate a static squeezing force between the two, and the static squeezing force forces the deformation module to generate a deformation amount; The detection module converts the detected deformation of the deformation module into displacement, and the detection module transmits the displacement to the data analysis device. The data analysis device converts the displacement into an electrical signal, thereby calculating the real-time detection connection adhesion force. When the real-time detection connection adhesion force reaches the critical connection adhesion force, the load-bearing transfer mechanism is controlled to stop moving.

Images