An efficient wire cutting device for silicon wafers

Abstract

The present application discloses a high-efficiency wire cutting device for silicon wafers, which includes a frame, a crystal carrier, a crystal carrier mounting unit, a lifting drive unit, a wire pay-off unit, a wire take-up unit, a tensioning unit, a cutting fluid supply unit, a plurality of rotating rollers, a rotation drive unit, and a loading and unloading unit; the loading and unloading unit includes a connecting frame, an electric lifting rod, a vertical rail limiting sleeve, a vertical rail, a lifting seat, an electric push rod, and a translation frame. There is a horizontal sliding groove at the lifting seat, and a horizontal sliding rail matching the horizontal sliding groove at the translation frame. The cutting device of the present application can realize the automatic loading and unloading of the crystal carrier before and after cutting, greatly improving the production efficiency and automation level. During the loading and unloading process, precise positioning of each position of the crystal carrier can be ensured, and the participation of manual labor is minimized as much as possible, thereby improving the production efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer cutting, and more specifically, to a high-efficiency wire cutting device for producing silicon wafers. Background Art

[0002] A silicon wafer cutting device is a special equipment that uses specific cutting technology to cut silicon materials into thin slices. A wire cutting device for silicon wafers uses a high-speed moving metal wire to cut silicon materials. With the continuous growth of the demand for silicon wafers in the semiconductor and photovoltaic industries. As a key equipment for silicon wafer production, the market demand for wire cutting devices for silicon wafers has also expanded accordingly.

[0003] Existing silicon wafer cutting devices require manual loading and unloading. During the loading and unloading process, it is necessary to manually pull and push the crystal carrier, and the position of the crystal carrier needs to be adjusted during the pulling and pushing process to achieve precise positioning. However, the accuracy of manually positioning the crystal carrier by workers is low, the operation speed is relatively slow, and it depends on the proficiency of workers, so the operation is inconvenient, the loading and unloading efficiency is reduced, and the overall production cycle is prolonged. Summary of the Invention

[0004] The present invention aims to overcome the defects of the prior art and provides a high-efficiency wire cutting device for producing silicon wafers.

[0005] To achieve the above object, the present invention provides the following technical solution: A wire cutting device for silicon wafers, comprising a frame, a crystal carrier, a crystal carrier mounting unit for mounting the crystal carrier, a lifting drive unit for driving the lifting of the crystal carrier mounting unit, a wire feeding unit for feeding the wire, a wire winding unit for winding the wire, a tensioning unit for tensioning the cutting wire, a cutting fluid supply unit, a plurality of rotating rollers, a rotating drive unit for driving the plurality of rotating rollers to rotate, and a loading and unloading unit for loading and unloading; the loading and unloading unit includes a connecting frame fixedly connected to the frame, an electric lifting rod connected to the connecting frame, a vertical rail limiting sleeve connected to the connecting frame, a vertical rail cooperating with the vertical rail limiting sleeve, a lifting seat connected to both the vertical rail and the electric lifting rod, an electric push rod installed at the lifting seat, and a translation frame installed at the lifting seat and driven by the electric push rod. The lifting seat has a horizontal chute, and the translation frame has a horizontal slide rail cooperating with the horizontal chute.

[0006] The main improvement points of this application lie in the crystal carrier mounting unit, the crystal carrier, and the loading and unloading unit.

[0007] The lifting drive unit adopts any available lifting mechanism in the prior art. For example, an electric lifting rod and other electric lifting mechanisms.

[0008] The wire feeding unit, the wire winding unit, the rotating rollers, and the rotating roller drive unit can also adopt any available structure in the prior art.

[0009] In some embodiments, there are three rotating rollers, which are distributed in a triangular pattern, with two rotating rollers above and one rotating roller below.

[0010] Further, the crystal carrier includes a substrate and two T-shaped guide rails fixedly connected to the substrate. The T-shaped guide rail includes a horizontal plate and a vertical plate connected to the horizontal plate. The top end of the horizontal plate has a strip-shaped groove, and a row of teeth is provided at the strip-shaped groove. The vertical plate also has a first circular through hole and a first strip-shaped through groove; the substrate also has two through holes; the horizontal plate also has positioning blind holes; the crystal carrier mounting unit includes two chute units that cooperate with the T-shaped guide rails. Both sides of the crystal carrier mounting unit have positioning electric telescopic rods, and the movable ends of the positioning electric telescopic rods can be inserted into the positioning blind holes. Two gear drive units are installed at the top end of the crystal carrier mounting unit. The gear drive units drive gears, and the gears at the two gear drive units respectively cooperate with the teeth of the two T-shaped guide rails; one end of the crystal carrier mounting unit has a positioning socket and an insertion rod. An extension plate is fixed to the end of the translation frame, a fixing block is fixed to the extension plate, and the fixing block is connected with a positioning plug rod that cooperates with the positioning socket; the two insertion rods of the crystal carrier mounting unit can be inserted between the two T-shaped guide rails of the crystal carrier and make the fixing block on the translation frame located between the two insertion rods.

[0011] Thus, the cooperation between the positioning plug rod and the positioning socket can enable precise connection and cooperation between the translation frame and the crystal carrier mounting unit. And the insertion rod can support the T-shaped guide rail, thus facilitating the transfer of the crystal carrier from the translation frame to the crystal carrier mounting unit.

[0012] Further, a pressure sensor that can be abutted by the end of the positioning plug rod is installed at the closed end of the positioning socket.

[0013] Thus, signal feedback can be carried out on the precise cooperation between the limit plug rod and the limit socket.

[0014] Further, the translation frame includes a top flat plate and two side vertical plates fixedly connected to the top flat plate; the side vertical plates have a second circular through hole and a second strip-shaped through groove; a translation drive unit is also installed at the side vertical plates. The translation drive unit includes a first end block, a second end block, a connecting slide rail connected between the first end block and the second end block, a motor installed at the first end block, a bearing installed at the second end block, a lead screw connected between the motor and the bearing, and a slide block installed on the connecting slide rail and driven by the lead screw. A first electric telescopic rod is installed at the side vertical plates, and the movable end of the first electric telescopic rod can pass through the second circular through hole and be inserted into the first circular through hole. A second electric telescopic rod is installed at the slide block, and the movable end of the second electric telescopic rod can pass through the second strip-shaped through groove and be inserted into the first strip-shaped through groove. The length of the second strip-shaped through groove is greater than the length of the first strip-shaped through groove.

[0015] Further, the length of the second strip-shaped through groove is greater than 10 times the length of the first strip-shaped through groove.

[0016] Further, it further includes a carrier and two insertion rods. The bottom end of the sliding seat has a first mounting hole, and a laser emitter is installed in the first mounting hole; the carrier is provided with a first indicator unit, a second indicator unit and two second mounting holes, and a light receiver cooperating with the laser emitter is installed in the second mounting hole; the carrier is further provided with four support blocks, and the support blocks are provided with insertion rod receiving grooves, and the insertion rods can be inserted into the through through holes and the insertion rods are located in the two insertion rod receiving grooves.

[0017] Thus, cooperation can be achieved between the carrier and the loading and unloading unit, and precise positioning of the carrier can be achieved through the laser emitter and the light receiver.

[0018] Further, each horizontal plate of the T-shaped guide rail has four positioning blind holes; both sides of the crystal holder mounting unit are provided with four positioning electric telescopic rods.

[0019] Thus, precise positioning and fixing of the crystal holder can be achieved when the crystal holder is installed on the crystal holder mounting unit, and thus the crystal holder mounting unit can drive the crystal holder to descend, so as to cut the silicon rod.

[0020] Further, there are two vertical rails and two vertical rail limit sleeves.

[0021] Further, one end of the chute unit is closed; the chute unit includes a first groove with a rectangular cross-section and a second groove with a rectangular cross-section communicating with the first groove, and the first groove and the second groove are arranged in an L-shaped layout.

[0022] Thus, the L-shaped layout can achieve cooperation with the T-shaped slide rail, so as to support the crystal holder.

[0023] Further, the top of the crystal holder mounting unit is fixedly connected with a connecting seat, and the connecting seat is connected with the lifting drive unit.

[0024] Thus, the lifting drive unit drives the crystal holder mounting unit to lift and lower.

[0025] Further, the machine frame has a side opening for the crystal holder to pass through, and a side door and a side door drive unit for driving the side door to lift and lower are provided at the side opening.

[0026] Thus, the side door is opened to facilitate the entry and exit of the crystal holder.

[0027] Further, the machine frame has a front opening, and a front door is provided at the front opening, and the front opening faces the plurality of rotating rollers.

[0028] Thus, it is convenient to perform corresponding operations on the front side.

[0029] Furthermore, it further includes a mobile trolley for installing the carrier frame, and the mobile trolley is provided with a braking device.

[0030] Thus, it is convenient to remove the cut silicon rod.

[0031] Beneficial effects:

[0032] 1. The cutting device of the present application can realize the automatic loading and unloading of the crystal holder before and after cutting, greatly improving the production efficiency and the degree of automation.

[0033] 2. The cutting device of the present application can ensure the precise positioning of each position of the crystal holder during the loading and unloading process, and minimize the participation of manual labor as much as possible, thereby improving the production efficiency. Description of the drawings

[0034] Figure 1 Schematic diagram of the silicon wafer cutting device;

[0035] Figure 2 Schematic diagram before the translation frame lifts the crystal holder;

[0036] Figure 3 Enlarged view of area A;

[0037] Figure 4 Schematic diagram of lifting the crystal holder;

[0038] Figure 5 Schematic diagram of another perspective of lifting the crystal holder;

[0039] Figure 6 Schematic diagram of the cooperation and connection between the translation frame and the crystal holder installation unit;

[0040] Figure 7 Schematic diagram of the process of inserting the crystal holder into the crystal holder installation unit;

[0041] Figure 8 Schematic diagram of inserting the crystal holder into the crystal holder installation unit and cooperating with the positioning electric telescopic rod;

[0042] Figure 9 Schematic diagram of the translation frame retreating and withdrawing from the side opening;

[0043] Figure 10 Schematic diagram of the cooperation and connection between the translation frame and the crystal holder installation unit again after cutting;

[0044] Figure 11 Schematic diagram of the process of driving the crystal holder to translate to the translation frame by using a gear, at this time the first strip-shaped through groove has moved to one end of the second strip-shaped through groove;

[0045] Figure 12 It is a schematic diagram of the process of moving the crystal holder to the translation frame. At this time, the sliding seat moves synchronously with the crystal holder;

[0046] Figure 13 It is a schematic diagram of using the first electric telescopic rod and the first circular through-hole to support the crystal holder when the crystal holder is moved to the specified position;

[0047] Figure 14 It is an enlarged view of area B;

[0048] Figure 15 It is a schematic diagram of the side opening when the translation frame is withdrawn;

[0049] Figure 16 It is an enlarged view of area C;

[0050] Figure 17 It is a schematic diagram after the crystal holder descends;

[0051] Figure 18 It is a schematic diagram of using two insertion rods to support the crystal holder;

[0052] Figure 19 It is a schematic diagram of the first electric telescopic rod and the second electric telescopic rod shortening and the lifting seat rising.

[0053] For the sake of simplicity and clarity of the illustration, Figure 1-19 only the crystal holder is shown in []. In fact, a silicon rod is bonded to the crystal holder through an adhesive plate and adhesive. And for the sake of simplicity and clarity of the illustration, Figure 2-19 for example, the lifting drive unit, wire winding unit, wire unwinding unit, tensioning unit, cutting fluid supply unit of the wafer cutting device in [] and the rest of the mechanical structure are not drawn. Only the parts related to the invention content of this application are drawn.

[0054] Description of reference numerals in the drawings: frame 1; side opening 1.1; front opening 1.2; side door 1.3; main door 1.4; crystal holder 2; substrate 2.1; T-shaped guide rail 2.2; horizontal plate 2.2.1; vertical plate 2.2.2; teeth 2.3; first circular through hole 2.4; first strip-shaped through groove 2.5; through through hole 2.6; positioning blind hole 2.7; crystal holder mounting unit 3; chute unit 3.1; first groove 3.1.1; second groove 3.1.2; positioning electric telescopic rod 3.2; positioning jack 3.3; insertion rod 3.4; pressure sensor 3.5; connecting seat 3.6; rotating roller 4; connecting frame 5.1; electric lifting rod 5.2; vertical rail limiting sleeve 5.3; vertical rail 5.4; lifting seat 5.5; horizontal chute 5.5.1; electric push rod 5.6; translation frame 6; horizontal slide rail 6.1; extension plate 6.2; fixed block 6.3; positioning insertion rod 6.4; top flat plate 6.5; side vertical plate 6.6; second strip-shaped through groove 6.7; gear drive unit 7; gear 7.1; first end block 8.1; second end block 8.2; connecting slide rail 8.3; motor 8.4; lead screw 8.5; slide seat 8.6; first mounting hole 8.6.1; first electric telescopic rod 8.7; second electric telescopic rod 8.8; carrier 9; first indicator unit 9.1; second indicator unit 9.2; second mounting hole 9.3; support block 9.4; insertion rod 10. Detailed implementation manners

[0055] The embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present invention and should not be construed as a limitation to the present invention.

[0056] As shown in the figure, an efficient wire cutting device for silicon wafers includes a frame 1, a crystal holder 2, a crystal holder installation unit 3 for installing the crystal holder 2, a lifting drive unit for driving the lifting of the crystal holder installation unit 3, a wire feeding unit for feeding wire, a wire winding unit for winding wire, a tensioning unit for tensioning the cutting wire, a cutting fluid supply unit, a plurality of rotating rollers 4, a rotating drive unit for driving the rotation of the plurality of rotating rollers 4, and a loading and unloading unit for loading and unloading; the loading and unloading unit includes a connecting frame 5.1 fixedly connected to the frame 1, an electric lifting rod 5.2 connected to the connecting frame 5.1, a vertical rail limiting sleeve 5.3 connected to the connecting frame 5.1, a vertical rail 5.4 cooperating with the vertical rail limiting sleeve 5.3, a lifting seat 5.5 connected to both the vertical rail 5.4 and the electric lifting rod 5.2, an electric push rod 5.6 installed at the lifting seat 5.5, and a translation frame 6 installed at the lifting seat 5.5 and driven by the electric push rod 5.6. There is a horizontal chute 5.5.1 at the lifting seat 5.5, and a horizontal slide rail 6.1 cooperating with the horizontal chute 5.5.1 at the translation frame 6. The crystal holder 2 includes a substrate 2.1 and two T-shaped guide rails 2.2 fixedly connected to the substrate 2.1. The T-shaped guide rail 2.2 includes a horizontal plate 2.2.1 and a vertical plate 2.2.2 connected to the horizontal plate 2.2.1. The top end of the horizontal plate 2.2.1 has a strip-shaped groove, and a row of teeth 2.3 is provided at the strip-shaped groove. The vertical plate 2.2.2 also has a first circular through hole 2.4 and a first strip-shaped through groove 2.5; the substrate 2.1 also has two through holes 2.6; the horizontal plate 2.2.1 also has positioning blind holes 2.7; the crystal holder installation unit 3 includes two chute units 3.1 cooperating with the T-shaped guide rails 2.2. There are positioning electric telescopic rods 3.2 on both sides of the crystal holder installation unit 3. The movable end of the positioning electric telescopic rod 3.2 can be inserted into the positioning blind hole 2.7. Two gear drive units 7 are installed at the top end of the crystal holder installation unit 3. The gear drive unit 7 drives a gear 7.1. The gears 7.1 at the two gear drive units 7 cooperate with the teeth 2.3 of the two T-shaped guide rails 2.2 respectively; one end of the crystal holder installation unit 3 has a positioning socket 3.3 and an insertion rod 3.4. An extension plate 6.2 is fixed at the end of the translation frame 6. A fixed block 6.3 is fixed to the extension plate 6.2. The fixed block 6.3 is connected with a positioning insertion rod 6.4 cooperating with the positioning socket 3.3; the two insertion rods 3.4 of the crystal holder installation unit 3 can be inserted between the two T-shaped guide rails 2.2 of the crystal holder 2 and make the fixed block 6.3 at the translation frame 6 located between the two insertion rods 3.4. A pressure sensor 3.5 that can be abutted by the end of the positioning insertion rod 6.4 is installed at the closed end of the positioning socket 3.3.The translation frame 6 includes a top flat plate 6.5 and two side vertical plates 6.6 fixedly connected to the top flat plate 6.5; there are a second circular through-hole and a second strip-shaped through-slot 6.7 at the side vertical plate 6.6; a translation driving unit is also installed at the side vertical plate 6.6, and the translation driving unit includes a first end block 8.1, a second end block 8.2, a connecting slide rail 8.3 connected between the first end block 8.1 and the second end block 8.2, a motor 8.4 installed on the first end block 8.1, a bearing installed on the second end block 8.2, a lead screw 8.5 connected between the motor 8.4 and the bearing, and a slide block 8.6 installed on the connecting slide rail 8.3 and driven by the lead screw 8.5. A first electric telescopic rod 8.7 is installed at the side vertical plate 6.6, and the movable end of the first electric telescopic rod 8.7 can pass through the second circular through-hole and insert into the first circular through-hole 2.4. A second electric telescopic rod 8.8 is installed at the slide block 8.6, and the movable end of the second electric telescopic rod 8.8 can pass through the second strip-shaped through-slot 6.7 and insert into the first strip-shaped through-slot 2.5. The length of the second strip-shaped through-slot 6.7 is greater than the length of the first strip-shaped through-slot 2.5.

[0057] The length of the second strip-shaped through-slot 6.7 is more than 10 times the length of the first strip-shaped through-slot 2.5. It further includes a carrier 9 and two insertion rods 10. There is a first mounting hole 8.6.1 at the bottom end of the slide block 8.6, and a laser emitter is installed in the first mounting hole 8.6.1; there is a first indicator unit 9.1, a second indicator unit 9.2 and two second mounting holes 9.3 at the carrier 9, and a light receiver cooperating with the laser emitter is installed in the second mounting holes 9.3; there are also four support blocks 9.4 at the carrier 9, and there are insertion rod receiving grooves at the support blocks 9.4. The insertion rod 10 can be inserted into the through-hole 2.6 and the insertion rod 10 is located in the two insertion rod receiving grooves. There are four positioning blind holes 2.7 at the horizontal plate 2.2.1 of each T-shaped guide rail 2.2; both sides of the crystal holder mounting unit 3 have four positioning electric telescopic rods 3.2. Both the vertical rail 5.4 and the vertical rail limit sleeve 5.3 have two. One end of the chute unit 3.1 is closed; the chute unit 3.1 includes a first slot 3.1.1 with a rectangular cross-section and a second slot 3.1.2 with a rectangular cross-section communicating with the first slot, and the first slot 3.1.1 and the second slot 3.1.2 are arranged in an L-shaped layout. The frame 1 has a side opening 1.1 and a front opening 1.2. The side opening 1.1 is for the crystal holder 2 to pass through, and there is a side door 1.3 and a side door driving unit for driving the side door 1.3 to lift and lower at the side opening 1.1; there is a front door 1.4 at the front opening 1.2, and the front opening 1.2 faces the multiple rotating rollers 4.

[0058] As shown in the figure, the specific loading and unloading process: The wire collection is as Figure 2As shown, the crystal carrier is supported by the insertion rods at the carrier frame, and at this time, the worker adjusts the position of the carrier frame (actually adjusts the position of the trolley) so that the two optical receivers can receive the optical signals of the two laser generators, thereby realizing the confirmation of the position of the carrier frame (the first indicator unit lights up after the position is confirmed). Then the translation frame descends so that the two T-shaped guide rails of the crystal carrier are located between the two side vertical plates of the translation frame, and the end of the first electric telescopic rod is inserted into the first circular through hole, and the end of the second electric telescopic rod is inserted into the first strip-shaped through groove, so that the translation frame can lift the crystal carrier. After the first and second electric telescopic rods extend, the second indicator unit lights up. Then as Figure 4-5 shown, the electric lifting rod rises so that the height of the crystal carrier matches that of the crystal carrier mounting unit. Then as Figure 6 shown, the electric push rod pushes the translation frame so that the positioning insertion rod is inserted into the positioning insertion hole. At this time, as Figure 6 described, the tooth teeth and the corresponding gears have meshed together. Then as Figure 7 shown, the first electric telescopic rod shortens and disengages from the cooperation with the first circular through hole, but the second electric telescopic rod is still in the extended state and cooperates with the first strip-shaped through groove, so as to support the crystal carrier, and driven by the motor, the slide seat and the crystal carrier translate synchronously (after translating a certain distance, the second electric telescopic rod also shortens and disengages from the cooperation with the first strip-shaped through groove), so as to insert the crystal carrier into the crystal carrier mounting unit. Then as Figure 8 shown, the crystal carrier is completely translated into the crystal carrier mounting unit, and the positioning electric telescopic rod is used to precisely limit the position of the crystal carrier. Then as Figure 9 shown, the translation frame retracts. At this time, the side door can be closed for corresponding cutting operations.

[0059] After cutting, as Figure 10 shown, the translation frame translates again so that the positioning insertion rod and the positioning insertion hole are in cooperation. Then as Figure 11 shown, the crystal carrier translates outward a certain distance under the drive of the gear, so that the positions of the first strip-shaped through groove and the second strip-shaped through groove overlap. Then as Figure 12 shown, the second electric telescopic rod extends, so that the end of the second electric telescopic rod extends into the first strip-shaped through groove to realize the support of the crystal carrier, and then the slide seat and the crystal carrier translate synchronously under the drive of the motor. Then as Figure 13 shown, after the crystal carrier is translated to the designated position, the movable end of the first electric telescopic rod extends into the first circular through hole to realize the positioning and support of the crystal carrier. Then as Figure 15 shown, the translation frame retracts backward under the drive of the electric push rod. Then as Figure 17 shown, the laser generator and the optical receiver cooperate again to confirm the positions of the crystal carrier and the carrier frame. After the confirmation is completed, the crystal carrier is lowered to the designated position. Then as Figure 18 shown, two insertion rods are inserted to realize the support of the crystal carrier. Then asFigure 19 As shown, both the two first electric telescopic rods and the two second electric telescopic rods are shortened, so that the lifting seat rises. The worker removes the cut silicon rod by a trolley and then loads a new silicon rod to repeat the above process.

[0060] Although the present invention has been illustrated and described with respect to the preferred embodiments, those skilled in the art should understand that various changes and modifications can be made to the present invention as long as they do not exceed the scope defined by the claims of the present invention.

Claims

1. An efficient production silicon wafer wire cutting device, characterized in that: It comprises a frame, a crystal support, a crystal support installation unit for installing the crystal support, a lifting drive unit for driving the crystal support installation unit to lift and lower, a wire-releasing unit for releasing the wire, a wire-receiving unit for retrieving the wire, a tensioning unit for tensioning the cutting wire, a cutting liquid supply unit, a plurality of rotating rollers, a rotating drive unit for driving the plurality of rotating rollers to rotate, and a loading and unloading unit for loading and unloading materials; the loading and unloading unit comprises a connecting frame fixedly connected to the frame, an electric lifting rod connected to the connecting frame, a vertical rail limiting sleeve connected to the connecting frame, a vertical rail matched with the vertical rail limiting sleeve, and a lifting seat connected to both the vertical rail and the electric lifting rod, an electric push rod installed at the lifting seat, and a translation frame installed at the lifting seat and driven by the electric push rod, the lifting seat is provided with a horizontal slide groove, and the translation frame is provided with a horizontal slide rail matched with the horizontal slide groove; The crystal support includes a base plate and two T-shaped guide rails fixedly connected to the base plate, the T-shaped guide rail includes a horizontal plate and a vertical plate connected to the horizontal plate, the top of the horizontal plate has a strip groove, the strip groove has a row of teeth, and the vertical plate also has a first circular through hole and a first strip through groove; the base plate also has two through holes; the horizontal plate also has a positioning blind hole; the crystal support installation unit includes two slide slot units that cooperate with the T-shaped guide rails, and both sides of the crystal support installation unit have positioning electric telescopic rods, and the movable end of the positioning electric telescopic rod can be inserted into In the positioning blind hole, two gear drive units are installed on the top of the crystal support installation unit, and the gear drive units drive gears, and the gears at the two gear drive units respectively cooperate with the teeth of the two T-shaped guide rails; one end of the crystal support installation unit has a positioning socket and an insertion rod, and the end of the translation frame is fixed with an extension plate, and the extension plate is fixed with a fixed block, and the fixed block is connected with a positioning plug rod that cooperates with the positioning socket; the two insertion rods of the crystal support installation unit can be inserted between the two T-shaped guide rails of the crystal support and make the fixed block at the translation frame located between the two insertion rods; The translation frame comprises a top plate and two side vertical plates fixedly connected to the top plate; the side vertical plates are provided with a second circular through hole and a second strip through slot; a translation driving unit is also installed on the side vertical plates, and the translation driving unit comprises a first end block, a second end block, a connecting slide rail connected between the first end block and the second end block, a motor installed on the first end block, a bearing installed on the second end block, a screw rod connected between the motor and the bearing, and a slide seat installed on the connecting slide rail and driven by the screw rod; a first electric telescopic rod is installed on the side vertical plates, and the movable end of the first electric telescopic rod can pass through the second circular through hole and be inserted into the first circular through hole; a second electric telescopic rod is installed on the slide seat, and the movable end of the second electric telescopic rod can pass through the second strip through slot and be inserted into the first strip through slot, and the length of the second strip through slot is greater than the length of the first strip through slot; The high-efficiency production silicon wafer wire cutting device also includes a carrier and two plugging rods, the bottom end of the slide seat has a first mounting hole, a laser transmitter is installed in the first mounting hole; the carrier has a first indicator light unit, a second indicator light unit and two second mounting holes, a light receiver matching the laser transmitter is installed in the second mounting holes; the carrier also has four support blocks, the support blocks have plugging rod accommodating grooves, the plugging rod can be inserted into the through hole and the plugging rod is located in the two plugging rod accommodating grooves; Each T-shaped guide rail has four blind positioning holes at its horizontal plate; both sides of the crystal support mounting unit have four electric positioning telescopic rods; One end of the slide slot unit is closed; the slide slot unit comprises a first slot with a rectangular cross section and a second slot with a rectangular cross section connected to the first slot, and the first slot and the second slot are arranged in an L shape.

2. The high-efficiency silicon wafer wire cutting device according to claim 1, characterized in that: The closed end of the positioning plug hole is equipped with a pressure sensor that can be abutted by the end of the positioning plug rod.

3. The high-efficiency silicon wafer wire cutting device according to claim 1, characterized in that: The length of the second strip-shaped through groove is greater than 10 times the length of the first strip-shaped through groove.

4. The high-efficiency production silicon wafer wire cutting device according to claim 1, characterized in that: The vertical rails and the vertical rail limiting sleeves are both provided with two.

5. The high-efficiency silicon wafer wire cutting device according to claim 1, characterized in that: The frame has a side opening and a front opening, the side opening is used for the crystal tray to pass through, and the side opening is provided with a side door and a side door driving unit for driving the side door to rise and fall; The front opening is provided with a front door, and the front opening faces the plurality of rotating rollers.

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