A film pasting device for semiconductor PI film

Abstract

The present invention discloses a film pasting device for semiconductor PI adhesive film, which relates to the field of semiconductor technology, and comprises a mounting plate and a film pasting mechanism installed on one side of the mounting plate, a moving mechanism is slidably installed on one side of the mounting plate, a clamping mechanism is symmetrically installed on both sides of one side of the moving mechanism, a placement plate is evenly installed at a position near the bottom of the clamping mechanism on the mounting plate, a circuit board is arranged on the placement plate, the clamping mechanism is used to take the circuit board, the moving mechanism is used to move to the position of the circuit board through the clamping mechanism, and a flipping structure is symmetrically arranged at a position near both ends of the placement plate on the upper part of the mounting plate, and the flipping structure is used to fasten both ends of the circuit board and flip it. In the present invention, through the set flipping structure, when the circuit board is pasted with film, the flipping structure clamps and flips both ends of the circuit board, thereby realizing the flipping of the circuit board, and the conveying mechanism drives the circuit board to move to the position of the film pasting mechanism, thereby improving the film pasting efficiency on both sides of the circuit board.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a film pasting device for a semiconductor PI film. Background Art

[0002] Polyimide film is a kind of film-type insulating material. It is made of pyromellitic anhydride (PMDA) and diaminodiphenyl ether (ODA) in a strong polar solvent through polycondensation and casting into a film and then imidization. It is yellow and transparent, with a relative density of 1.39 to 1.45. Polyimide film has excellent high and low temperature resistance, electrical insulation, adhesion, radiation resistance, and dielectric resistance. It can be used for a long time in the temperature range of -269℃ to 280℃, and can reach a high temperature of 400℃ in a short time. The glass transition temperatures are 280℃ (Upilex R), 385℃ (Kapton) and above 500℃ (Upilex S). The tensile strength is 200MPa at 20℃ and greater than 100MPa at 200℃. It is particularly suitable for use as a flexible printed circuit board substrate and various high-temperature resistant motor and electrical insulation materials.

[0003] According to the Chinese patent announcement number: CN 215514533U, a film pasting device for a single-sided adhesive film is disclosed, including a frame, a slide mechanism and a film pasting mechanism. The slide mechanism drives the product to slide left and right. The film pasting mechanism includes a vertical slide assembly, a feeding assembly, a film pasting assembly and a clamping plate assembly. The vertical slide assembly includes a vertical cylinder and a vertical slide slidably connected to the frame. The vertical cylinder pushes and pulls the vertical slide. The feeding assembly includes a feeding roller and a plurality of guide rollers rotatably connected to the vertical slide. A rolled single-sided adhesive film is placed on the feeding roller. The film pasting assembly is located at the front side of the clamping plate assembly. The clamping plate assembly is used to clamp the single-sided adhesive film. The film pasting assembly presses the single-sided adhesive film with the adhesive surface located at the lower side to paste it on the upper surface of the product. The slide mechanism drives the product to slide back and forth left and right, and the film pasting mechanism pastes the fixed-length single-sided adhesive film on the surface of the product. The device does not need to use a self-adhesive label with release paper, thereby greatly reducing the cost of labeling or film pasting. However, when using the above device, it is inconvenient to flip the circuit board, and the film can only be applied to one side of the circuit board. When the film needs to be applied to both sides of the circuit board, it needs to be flipped manually, thereby reducing the film application efficiency of the circuit board.

[0004] Therefore, it is inconvenient to perform the flipping operation on the circuit board when using the above device, which reduces the film pasting efficiency of the circuit board. Summary of the invention

[0005] In order to solve the above problems, the present invention provides a semiconductor PI film laminating device, which realizes the purpose of flipping the circuit board through the cooperation of the clamping mechanism and the flipping structure.

[0006] In order to achieve the above object, the present invention is achieved through the following technical solutions:

[0007] A film pasting device for semiconductor PI adhesive film comprises a mounting plate and a film pasting mechanism mounted on one side of the mounting plate, a moving mechanism is slidably mounted on one side of the mounting plate, and the moving mechanism comprises:

[0008] The mounting rail is symmetrically fixed to the upper portion of one side of the mounting plate.

[0009] Mounting block, slide mounted on the mounting rail.

[0010] The fixing plate is symmetrically fixed to the two ends of one side of the mounting block.

[0011] The clamping mechanisms are symmetrically installed on both sides of one side of the moving mechanism, and the placement plates are evenly installed at the positions near the bottom of the clamping mechanisms on the mounting plate. The circuit boards are arranged on the placement plates. The clamping mechanisms are used to take the circuit boards, and the moving mechanism is used to move to the position of the circuit boards through the clamping mechanisms. The clamping mechanisms include:

[0012] The electric telescopic rod is fixedly connected to the fixing plate.

[0013] The connecting plate is fixedly connected to the power output end of the electric telescopic rod.

[0014] The clamping rods are symmetrically fixed to the four corners of the connecting plate close to the electric telescopic rod. The bottoms of the multiple clamping rods are commonly adsorbed with a circuit board. The multiple clamping rods pass through the fixing plate and extend to the placement plate position.

[0015] A flip structure is symmetrically arranged at the upper part of the mounting plate near the two ends of the placement plate. The flip structure is used to fasten the two ends of the circuit board and flip it. The flip structure includes:

[0016] There are multiple electric cylinders, which are fixedly connected to the upper part of the mounting plate at equal intervals, and a bearing plate is commonly installed on the tops of the multiple electric cylinders, and a mounting shell is fixedly connected to the upper part of the bearing plate.

[0017] The driving motor is fixedly connected to one end inside the mounting shell.

[0018] The rotating rod is rotatably mounted at a middle position inside the mounting shell, and a power output end of the driving motor and the rotating rod are connected by a belt.

[0019] The rotating block is fixedly connected to one end of the rotating rod.

[0020] There are two limit blocks, which are respectively fixed to the outer ring and inner ring positions of the rotating block close to the end face of the mounting shell. The two limit blocks extend out of the end face of the mounting shell, and the end face of the mounting shell is provided with a slide groove that matches the active trajectory of the two limit blocks, and the shape of the slide groove is semicircular.

[0021] A transmission rod is movably arranged at one end of the rotating rod away from the rotating block. The transmission rod extends to the outside of one side of the mounting shell. Transmission blocks are fixedly connected to the transmission rod at equal intervals along the circumferential direction. The inner side wall of the rotating rod is provided with a groove adapted to the movable trajectory of the transmission block, and the transmission block can move in the groove.

[0022] The fastening clip is fixedly connected to one end of the transmission rod away from the rotating rod.

[0023] The electric push rod is fixedly connected to the other end inside the installation shell, and the power output end of the electric push rod extends to the outside of the installation shell.

[0024] One end of the connecting rod is fixedly connected to the power output end of the electric driving rod, and the other end of the connecting rod is rotatably mounted on the transmission rod.

[0025] Further preferably, a conveying mechanism is provided at a position on the upper part of the installation plate near the film pasting mechanism, and the conveying mechanism is used to convey the circuit board to the position of the film pasting mechanism, and the film pasting mechanism films both sides of the circuit board.

[0026] Further preferably, a mounting shaft matching the belt specifications is provided on the power output end of the driving motor and the rotating rod.

[0027] More preferably, the conveying mechanism comprises:

[0028] The motor is fixedly connected to the upper part of the mounting plate at a position close to the film sticking mechanism.

[0029] The lead screw is fixedly connected to the power output end of the motor, and the upper part of the lead screw is slidably connected with a sliding block.

[0030] The movable plate is fixedly connected to the screw rod.

[0031] Compared with the prior art, the present invention has the following advantages: by setting a flipping structure, when a film is applied to a circuit board, the flipping structure clamps and flips the two ends of the circuit board, thereby realizing the turning over of the circuit board, and the conveying mechanism drives the circuit board to the position of the film applying mechanism, thereby realizing the film applying to both sides of the circuit board, thereby improving the film applying efficiency on both sides of the circuit board, and by setting multiple placement plates, multiple circuit boards can be placed at the same time when in use, further improving the flipping efficiency of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a structural schematic diagram of this embodiment;

[0033] Figure 2 It is a schematic diagram of the moving mechanism, the clamping mechanism and the conveying mechanism of this embodiment;

[0034] Figure 3 FIG. 4 is a schematic diagram of the flip structure of this embodiment.

[0035] : 1. mounting plate; 2. film sticking mechanism; 3. moving mechanism; 31. mounting rail; 32. mounting block; 33. fixing plate; 4. clamping mechanism; 41. electric telescopic rod; 42. connecting plate; 43. clamping rod; 5. placing plate; 6. flipping structure; 61. electric cylinder; 62. bearing plate; 63. mounting shell; 64. driving motor; 65. rotating rod; 66. rotating block; 67. limiting block; 68. transmission rod; 69. fastening clamp; 610. electric push rod; 611. connecting rod; 7. conveying mechanism; 71. motor; 72. screw rod; 73. sliding block; 74. movable plate; 8. circuit board. DETAILED DESCRIPTION

[0036] A film pasting device for a single-sided adhesive film disclosed in the prior art includes a frame, a slide mechanism and a film pasting mechanism. The slide mechanism drives the product to slide left and right. The film pasting mechanism includes a vertical slide assembly, a feeding assembly, a film pasting assembly and a clamping plate assembly. The vertical slide assembly includes a vertical cylinder and a vertical slide slidably connected to the frame. The vertical cylinder pushes and pulls the vertical slide. The feeding assembly includes a feeding roller and a plurality of guide rollers rotatably connected to the vertical slide. A rolled single-sided adhesive film is placed on the feeding roller. The film pasting assembly is located at the front side of the clamping plate assembly. The clamping plate assembly is used to clamp the single-sided adhesive film. The film pasting assembly presses the single-sided adhesive film with the adhesive surface located at the lower side to paste it on the upper surface of the product. The slide mechanism drives the product to slide back and forth left and right, and the film pasting mechanism pastes the fixed-length single-sided adhesive film on the surface of the product. The device does not need to use a self-adhesive label with release paper, thereby greatly reducing the cost of labeling or film pasting. However, when using the above device, it is inconvenient to flip the circuit board, and the film can only be applied to one side of the circuit board. When the film needs to be applied to both sides of the circuit board, it needs to be flipped manually, thereby reducing the film application efficiency of the circuit board.

[0037] Therefore, it is inconvenient to perform the flipping operation on the circuit board when using the above device, which reduces the film pasting efficiency of the circuit board.

[0038] In response to the above technical problems, the present application has made the following designs and ideas: In order to solve the problems existing in the prior art, it is envisaged that a certain flipping structure can have a better flipping effect on the circuit board than the slide mechanism in the prior art, so as to achieve the purpose of applying film to both sides of the circuit board.

[0039] The following is combined with Figures 1 to 3 The present invention is further described in detail.

[0040] A film laminating device for semiconductor PI film, such as Figure 1As shown, it includes a mounting plate 1 and a film-sticking mechanism 2 installed on one side of the mounting plate 1. Furthermore, the film-sticking mechanism 2 is a prior art and the present application does not limit it. A moving mechanism 3 is slidably installed on one side of the mounting plate 1. Clamping mechanisms 4 are symmetrically installed on both sides of one side of the moving mechanism 3. A placing plate 5 is evenly installed on the mounting plate 1 near the bottom of the clamping mechanism 4. A circuit board 8 is arranged on the placing plate 5. The clamping mechanism 4 is used to take the circuit board 8. The moving mechanism 3 is used to move the position of the circuit board 8 through the clamping mechanism 4. A flipping structure 6 is symmetrically arranged at a position on the upper part of the mounting plate 1 near both ends of the placing plate 5. The flipping structure 6 is used to fasten both ends of the circuit board 8 and flip it. Furthermore, the flipping angle of the circuit board 8 is 180°. A conveying mechanism 7 is arranged at a position on the upper part of the mounting plate 1 near the film-sticking mechanism 2. The conveying mechanism 7 is used to convey the circuit board 8 to the position of the film-sticking mechanism 2. The film-sticking mechanism 2 applies film to both sides of the circuit board 8.

[0041] By setting the flipping structure 6, when the circuit board 8 is pasted with film, the flipping structure 6 clamps and flips the two ends of the circuit board 8, so as to realize the turning over of the circuit board 8, and the conveying mechanism 7 drives the circuit board 8 to move to the position of the film pasting mechanism 2, so as to realize the film pasting on both sides of the circuit board 8, thereby improving the film pasting efficiency on both sides of the circuit board 8, and by setting multiple placement plates 5, multiple circuit boards 8 can be placed at the same time when in use, further improving the flipping efficiency of the circuit board 8.

[0042] Specifically, Figure 1 , Figure 2 , Figure 3 As shown, the flip structure 6 includes:

[0043] There are multiple electric cylinders 61, which are fixedly connected to the upper part of the mounting plate 1 at equal intervals, and a supporting plate 62 is commonly installed on the top of the multiple electric cylinders 61, and a mounting shell 63 is fixedly connected to the upper part of the supporting plate 62. Furthermore, the multiple electric cylinders 61 are arranged in two rows, and a supporting plate 62 is commonly installed between two electric cylinders 61 in a row.

[0044] The driving motor 64 is fixedly connected to one end of the mounting shell 63. Furthermore, the driving motor 64 is externally connected to a power source and a control panel.

[0045] The rotating rod 65 is rotatably mounted at a middle position inside the mounting shell 63 , and a power output end of the driving motor 64 and the rotating rod 65 are connected by a belt.

[0046] The rotating block 66 is fixedly connected to one end of the rotating rod 65 .

[0047] There are two limit blocks 67 , which are respectively fixed to the outer ring and the inner ring of the rotating block 66 close to the end surface of the mounting shell 63 .

[0048] Furthermore, the driving motor 64 drives the rotating rod 65 to rotate through the belt, and then the rotating rod 65 drives the rotating block 66 and the limit block 67 to rotate, and the limit block 67 rotates inside the mounting shell 63, and the mounting shell 63 limits the limit block 67, and then the limit block 67 limits the driving motor 64 through the rotating rod 65, thereby limiting the rotation of the driving motor 64.

[0049] Specifically, Figure 3 As shown, the power output end of the driving motor 64 and the rotating rod 65 are both provided with mounting shafts adapted to the specifications of the belt, so as to further improve the connection stability between the driving motor 64 and the rotating rod 65 .

[0050] Specifically, the two limit blocks 67 extend out of the end surface of the mounting shell 63 , and the end surface of the mounting shell 63 is provided with a slide groove adapted to the movable tracks of the two limit blocks 67 , and the shape of the slide groove is semicircular.

[0051] Furthermore, when the driving motor 64 drives the rotating block 66 and the limiting block 67 to rotate, the mounting shell 63 limits the limiting block 67, so that the number of rotations of the rotating rod 65 is half a circle.

[0052] Specifically, Figure 1 , Figure 2 , Figure 3 As shown, the flip structure 6 also includes:

[0053] The transmission rod 68 is movably arranged at one end of the rotating rod 65 away from the rotating block 66. The transmission rod 68 extends to the outside of one side of the mounting shell 63. Further, the transmission rod 68 can be extended and retracted at one end of the rotating block 66, and the rotating block 66 can drive the transmission rod 68 to rotate.

[0054] The fastening clip 69 is fixedly connected to one end of the transmission rod 68 away from the rotating rod 65 . Specifically, two fastening clips 69 can be clamped on both ends of the circuit board 8 .

[0055] The electric push rod 610 is fixed to the other end inside the mounting shell 63 , and the power output end of the electric push rod 610 extends to the outside of the mounting shell 63 .

[0056] One end of the connecting rod 611 is fixedly connected to the power output end of the electric driving rod 610 , and the other end of the connecting rod 611 is rotatably mounted on the transmission rod 68 .

[0057] Furthermore, the rotating rod 65 drives the fastening clamp 69 to rotate through the transmission rod 68, thereby realizing the flipping of the circuit board 8, and then the circuit board 8 can be flipped over to apply film to the other side after the film is applied to one side, thereby further improving the film application efficiency of the circuit board 8.

[0058] Specifically, transmission blocks are fixedly connected to the transmission rod 68 at equal intervals along the circumferential direction, and the inner side wall of the rotating rod 65 is provided with a groove adapted to the moving track of the transmission block, and the transmission block can move in the groove.

[0059] Furthermore, the rotating rod 65 can drive the transmission rod 68 to rotate, and when the electric push rod 610 drives the transmission rod 68 to move through the connecting rod 611, the rotating rod 65 can continuously drive the transmission rod 68 to rotate, thereby improving the transmission stability between the transmission rod 68 and the rotating rod 65.

[0060] Specifically, Figure 1 and Figure 2 As shown, the conveying mechanism 7 includes:

[0061] The motor 71 is fixedly connected to the upper part of the mounting plate 1 near the film sticking mechanism 2. Furthermore, the motor 71 is externally connected to a control panel and a power source.

[0062] The screw rod 72 is fixedly connected to the power output end of the motor 71 , and a sliding block 73 is slidably connected to the upper portion of the screw rod 72 .

[0063] The movable plate 74 is fixedly connected to the screw rod 72 . Furthermore, the circuit board 8 can be placed on the movable plate 74 .

[0064] Furthermore, the motor 71 can drive the screw rod 72 to rotate, and then the sliding block 73 drives the movable plate 74 to move, so that the movable plate 74 moves the circuit board 8 to the position of the film pasting mechanism 2, and the film pasting mechanism 2 films one side of the circuit board 8.

[0065] Specifically, Figure 1 and Figure 2 As shown, the moving mechanism 3 includes:

[0066] The mounting rail 31 is symmetrically fixed to the upper portion of one side of the mounting plate 1 .

[0067] The mounting block 32 is slidably mounted on the mounting rail 31 . Furthermore, the mounting block 32 can move on the mounting rail 31 .

[0068] The fixing plate 33 is symmetrically fixed to two ends of one side of the mounting block 32 .

[0069] Specifically, Figure 1 and Figure 2 As shown, the clamping mechanism 4 includes:

[0070] The electric telescopic rod 41 is fixedly connected to the fixing plate 33 . Furthermore, the electric telescopic rod 41 is externally connected to a power source and a control panel. Furthermore, the fixing plate 33 can drive the electric telescopic rod 41 to move on the mounting rail 31 of the mounting block 32 .

[0071] The connecting plate 42 is fixedly connected to the power output end of the electric telescopic rod 41 . Furthermore, the electric telescopic rod 41 can drive the connecting plate 42 to move up and down.

[0072] The clamping rods 43 are symmetrically fixed to the four corners of the connecting plate 42 on one side close to the electric telescopic rod 41 , and the circuit board 8 is adsorbed on the bottoms of the plurality of clamping rods 43 .

[0073] Furthermore, when the electric telescopic rod 41 drives the connecting plate 42 to move upward, the connecting plate 42 moves upward through the clamping rod 43, so that the clamping rod 43 drives the circuit board 8 to move upward. When the circuit board 8 is lowered onto the placement plate 5, the above steps are performed in reverse.

[0074] Specifically, a plurality of clamping rods 43 pass through the fixing plate 33 and extend to the position where the plate 5 is placed.

[0075] How it works

[0076] When in use, the circuit board 8 is placed on the movable plate 74, the motor 71 can drive the screw rod 72 to rotate, and then the sliding block 73 drives the movable plate 74 to move, so that the movable plate 74 moves the circuit board 8 to the position of the film pasting mechanism 2, and the film pasting mechanism 2 applies film to one side of the circuit board 8. Subsequently, the sliding block 73 drives the movable plate 74 to move the circuit board 8 with one side pasted with film to the bottom position of the clamping rod 43. At this time, the electric telescopic rod 41 drives the connecting plate 42 to move downward, and the connecting plate 42 moves downward through the clamping rod 43 and adsorbs the circuit board 8. Subsequently, the mounting block 32 drives the circuit board 8 to move to the position of the placement plate 5 by driving the fixed plate 33, and the circuit board 8 is placed on the placement plate 5. At this time, the two electric push rods 610 drive the transmission rod 68 to move mutually through the connecting rod 611. The two fastening clamps 69 can be clamped at the two ends of the circuit board 8. At this time, the electric cylinder 61 rises, and the two fastening clamps 69 drive the circuit board 8 to leave the placement plate 5. At the same time, the driving motor 64 drives the rotating rod 65 to rotate through the belt, and then the rotating rod 65, the transmission rod 68 and the fastening clamp 69 rotate, thereby realizing the flipping of the circuit board 8. At this time, the electric cylinder 61 descends, and the two fastening clamps 69 put the circuit board 8 back on the placement plate 5. At this time, the connecting plate 42 moves down through the clamping rod 43 and adsorbs the circuit board 8. Subsequently, the mounting block 32 drives the circuit board 8 to move to the position of the movable plate 74 by driving the fixed plate 33. The motor 71 can drive the circuit board 8 to move to the position of the film pasting mechanism 2, and the film pasting mechanism 2 applies film to the other side of the circuit board 8.

[0077] This specific embodiment is merely an explanation of the invention and is not a limitation of the invention. After reading this specification, those skilled in the art may make non-creative modifications to this embodiment as needed. However, as long as they are within the scope of protection of the invention, they are protected by patent law.

Claims

1. A film laminating device for semiconductor PI adhesive film, comprising a mounting plate (1) and a film laminating mechanism (2) mounted on one side of the mounting plate (1), characterized in that: A moving mechanism (3) is slidably mounted on one side of the mounting plate (1), and the moving mechanism (3) comprises: A mounting rail (31) symmetrically fixed to an upper portion of one side of the mounting plate (1); A mounting block (32) slidably mounted on the mounting rail (31); A fixing plate (33) symmetrically fixed to two ends of one side of the mounting block (32); The two sides of one side of the moving mechanism (3) are symmetrically mounted with clamping mechanisms (4); a placement plate (5) is evenly mounted on the mounting plate (1) at a position close to the bottom of the clamping mechanism (4); a circuit board (8) is arranged on the placement plate (5); the clamping mechanism (4) is used to take the circuit board (8); the moving mechanism (3) is used to move to the position of the circuit board (8) through the clamping mechanism (4); the clamping mechanism (4) comprises: An electric telescopic rod (41) fixedly connected to the fixing plate (33); A connecting plate (42) fixedly connected to the power output end of the electric telescopic rod (41); Clamping rods (43) are symmetrically fixed to four corners of the connecting plate (42) on one side close to the electric telescopic rod (41), the bottoms of a plurality of the clamping rods (43) are commonly adsorbed with the circuit board (8), and the plurality of the clamping rods (43) pass through the fixing plate (33) and extend to an upper position of the placement plate (5); A flip structure (6) is symmetrically arranged at a position on the upper part of the mounting plate (1) close to the two ends of the placement plate (5), and the flip structure (6) is used to fasten the two ends of the circuit board (8) and flip it. The flip structure (6) comprises: A plurality of electric cylinders (61) are fixedly connected to the upper portion of the mounting plate (1) at equal intervals, and a bearing plate (62) is commonly installed on the tops of the plurality of electric cylinders (61), and a mounting shell (63) is fixedly connected to the upper portion of the bearing plate (62); A driving motor (64) fixedly connected to one end inside the mounting shell (63); A rotating rod (65) is rotatably mounted at a middle position inside the mounting shell (63), and a power output end of the driving motor (64) and the rotating rod (65) are connected by a belt; A rotating block (66) fixedly connected to one end of the rotating rod (65); There are two limit blocks (67), which are respectively fixed to the outer ring and inner ring of the rotating block (66) at positions close to the end surface of the mounting shell (63); the two limit blocks (67) extend out of the end surface of the mounting shell (63); and the end surface of the mounting shell (63) is provided with a slide groove adapted to the movable tracks of the two limit blocks (67), and the shape of the slide groove is semicircular; a transmission rod (68) movably arranged at one end of the rotating rod (65) away from the rotating block (66), the transmission rod (68) extending to the outside of one side of the mounting shell (63), the transmission blocks being fixedly connected to the transmission rod (68) at equal intervals along the circumferential direction, and the inner side wall of the rotating rod (65) being provided with a groove matching the movable track of the transmission block, and the transmission block being movable in the groove; A fastening clamp (69) fixedly connected to an end of the transmission rod (68) away from the rotating rod (65); An electric push rod (610) is fixedly connected to the other end inside the mounting shell (63), and a power output end of the electric push rod (610) extends to the outside of the mounting shell (63); One end of the connecting rod (611) is fixedly connected to the power output end of the electric driving rod (610), and the other end of the connecting rod (611) is rotatably mounted on the transmission rod (68).

2. The semiconductor PI film laminating device according to claim 1, characterized in that: A conveying mechanism (7) is provided at a position on the upper part of the mounting plate (1) close to the film pasting mechanism (2), and the conveying mechanism (7) is used to convey the circuit board (8) to the position of the film pasting mechanism (2), and the film pasting mechanism (2) applies film to both sides of the circuit board (8).

3. The semiconductor PI film laminating device according to claim 1, characterized in that: The power output end of the driving motor (64) and the rotating rod (65) are both provided with a mounting shaft that matches the specifications of the belt.

4. The semiconductor PI film laminating device according to claim 2, characterized in that: The conveying mechanism (7) comprises: An electric motor (71) is fixedly connected to the upper portion of the mounting plate (1) at a position close to the film sticking mechanism (2); A screw rod (72) is fixedly connected to the power output end of the motor (71), and a sliding block (73) is slidably connected to the upper portion of the screw rod (72); The movable plate (74) is fixedly connected to the screw rod (72).

Images