A metal-based ceramic multilayer composite material and its processing technology

Abstract

The present invention relates to the technical field of layered structures, and specifically to a metal-based ceramic multilayer composite material and its processing technology. A metal-based ceramic multilayer composite material at least includes an upper plate, a middle plate and a lower plate arranged in sequence, a first partition plate arranged between the upper plate and the middle plate, and a second partition plate arranged between the middle plate and the lower plate, and the expansion coefficients of the upper plate, the middle plate and the lower plate decrease in sequence. Through the above arrangement, when the metal-based ceramic multilayer composite material is heated and expanded, the length difference between the two adjacent plates after expansion is smaller, and the shape is closer to a trapezoid. When it is used as a heat dissipation substrate, it can avoid the problem of a large gap between the heat sink and the high-power module on both sides of the heat dissipation substrate after expansion, and can improve the heat dissipation efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of layered structures, and in particular to a metal-based ceramic multilayer composite material and a processing technology thereof. Background Art

[0002] Metal-based ceramic composites are metal-based thermal management composites made of metal and ceramic. They have excellent properties such as high thermal conductivity, expansion coefficient matching the chip, light weight, and high rigidity. They are currently ideal high-power integrated circuit module packaging materials. Common metal-based ceramic composites are often made into heat dissipation substrates between high-power modules and toothed heat dissipation plates. They are made based on a metal base. Due to the different thermal expansion rates of the heat dissipation substrate, high-power module, and toothed heat dissipation plate, temperature changes during the heat dissipation process will cause gaps between the high-power module and the heat dissipation substrate or between the heat dissipation substrate and the toothed heat dissipation plate, affecting the heat dissipation effect. Summary of the invention

[0003] The present invention provides a metal-based ceramic multilayer composite material to solve the problem that the heat dissipation effect of the heat dissipation substrate made of the existing metal-based ceramic multilayer composite material is poor.

[0004] A metal-based ceramic multilayer composite material of the present invention adopts the following technical solution:

[0005] A metal-based ceramic multilayer composite material comprises at least an upper plate, a middle plate and a lower plate arranged in sequence, a first spacer plate arranged between the upper plate and the middle plate, and a second spacer plate arranged between the middle plate and the lower plate, wherein the expansion coefficient of the upper plate is greater than that of the middle plate; and the expansion coefficient of the middle plate is greater than that of the lower plate.

[0006] Furthermore, the upper plate, the middle plate and the lower plate are all made of ceramic-metal composite materials, and the first partition plate and the second partition plate are both made of metal composite plates.

[0007] Furthermore, the expansion coefficient of the upper plate is configured to be the same as the expansion coefficient of the toothed heat sink, and the expansion coefficient of the lower plate is the same as the expansion coefficient of the high-power module.

[0008] Furthermore, the material of the upper plate is B4C-(90%Cu-9%Al), in which the unit volume content of boron carbide B4C accounts for 47%; the material of the middle plate is B4C-(94%Cu-6%Zr), in which the unit volume content of boron carbide B4C accounts for 47%. In the temperature range of 20~900℃, the expansion coefficient of the middle plate is 11.1×10 -6 / ℃; the material of the lower plate is B4C-(94%Cu-6%Si), in which the unit volume content of boron carbide B4C accounts for 47%; the first partition plate is a copper-aluminum composite plate pressed by copper plate and aluminum plate; the second partition plate is a copper-zinc composite plate pressed by copper plate and zinc plate.

[0009] Furthermore, the first partition plate and / or the second partition plate are / is wavy or serrated.

[0010] Furthermore, the thickness of the first partition plate and / or the second partition plate gradually increases from the middle to the edge.

[0011] Furthermore, the wavelengths of the first spacer and the second spacer are the same.

[0012] Furthermore, the thickness of the first partition plate and the second partition plate are both 0.2 mm-1 mm.

[0013] A processing technology for a metal-based ceramic multilayer composite material comprises the following steps:

[0014] S1, pressing a copper plate and an aluminum plate to form a copper-aluminum composite plate;

[0015] S2, pressing the copper plate and the zinc plate to form a copper-zinc composite plate; wherein the copper-aluminum composite plate and the copper-zinc composite plate have the same shape and thickness, and both are wavy or zigzag, continuously and evenly extended;

[0016] S3, vertically placing the pressed copper-aluminum composite plate and the copper-zinc composite plate in the cavity of the die-casting mold; the copper-aluminum composite plate and the copper-zinc composite plate divide the cavity of the die-casting mold into three chambers that are not connected to each other;

[0017] S4, filling the cavities of the three die-casting molds with the prepared ceramic powder; then placing the die-casting molds filled with the ceramic powder on a vibration table to vibrate and compact the ceramic powder;

[0018] S5, pouring three different molten metal liquids into the three cavities, wherein a well-proportioned molten copper-chromium mixture is poured into the cavity formed between the copper-aluminum composite plate and the copper-zinc composite plate, and a well-proportioned molten copper-aluminum mixture and a molten copper-silicon mixture are respectively poured into the remaining two cavities;

[0019] S6, using a press head to squeeze the injected molten metal liquid, so that the metal liquid infiltrates into the ceramic powder;

[0020] S7, after cooling under pressure for 5-20 minutes, take out the formed metal-based ceramic multilayer composite material.

[0021] A processing technology for a metal-based ceramic multilayer composite material, step S4 further includes the following steps:

[0022] S41, preheating the ceramic powder, the copper-aluminum composite plate and the copper-zinc composite plate in the die-casting mold to 450° C.;

[0023] S51, preheating the die casting mold and the press head, and spraying a release agent on the contact surface between the die casting mold and the press head and the molten metal.

[0024] The beneficial effects of the present invention are as follows: a metal-based ceramic multilayer composite material of the present invention sequentially arranges an upper plate, a middle plate and a lower plate, and a first partition plate arranged between the upper plate and the middle plate, and a second partition plate arranged between the middle plate and the lower plate, the expansion coefficient of the upper plate is greater than the expansion coefficient of the middle plate; the expansion coefficient of the middle plate is greater than the expansion coefficient of the lower plate. Through the above arrangement, if it is used as a heat dissipation substrate, when thermal expansion occurs, the length difference between the two adjacent plates after expansion is small, and the length of the upper plate after expansion is close to the length of the toothed heat dissipation plate, and the length of the lower plate after expansion is close to the length of the high-power module, and the shape of the overall heat dissipation substrate is close to a trapezoid, which can avoid the problem of a large gap between the toothed heat dissipation plates and the high-power modules on both sides of the heat dissipation substrate after expansion, and can improve the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0026] Figure 1 A schematic diagram of the structural coordination of a metal-based ceramic multilayer composite material provided in the first embodiment of the present invention with a toothed heat sink and a high-power module when the composite material is made into a heat dissipation substrate;

[0027] Figure 2 A schematic structural diagram of a heat dissipation substrate made of a metal-based ceramic multilayer composite material provided in Embodiment 1 of the present invention;

[0028] Figure 3 A schematic diagram of the structure of a heat dissipation substrate made of a metal-based ceramic multilayer composite material after expansion provided in Embodiment 1 of the present invention;

[0029] Figure 4 A comparison diagram of a metal composite plate before and after expansion in a heat dissipation substrate made of a metal-based ceramic multilayer composite material provided in Example 1 of the present invention;

[0030] Figure 5 A schematic structural diagram of a heat dissipation substrate made of a metal-based ceramic multilayer composite material provided in the second embodiment of the present invention;

[0031] Figure 6 A schematic diagram of the structure of a heat dissipation substrate made of a metal-based ceramic multilayer composite material after expansion provided in Embodiment 2 of the present invention;

[0032] Figure 7 A comparison diagram of a metal composite plate before and after expansion in a heat dissipation substrate made of a metal-based ceramic multilayer composite material provided in Example 2 of the present invention;

[0033] Figure 8 A schematic structural diagram of a copper-aluminum composite plate obtained by cold-rolling composite processing in a heat dissipation substrate made of a metal-based ceramic multilayer composite material provided in Example 1 of the present invention;

[0034] Fig. 9 for Figure 8 A schematic diagram of the structure of the titanium-copper composite plate during stamping;

[0035] Fig.10 It is a schematic diagram of the state where the stamped copper-aluminum composite plate and the copper-zinc composite plate are installed in the cavity of the die-casting mold;

[0036] Fig.11 It is a schematic diagram of the state after ceramic powder is filled into the cavity of the die casting mold;

[0037] Fig.12 A schematic diagram of a state in which a molten metal is introduced into the cavity of a die-casting mold after ceramic powder is filled into the cavity and pressurized;

[0038] Fig.13 A schematic structural diagram of a copper-aluminum composite plate obtained by cold-rolling composite processing in a heat dissipation substrate made of a metal-based ceramic multilayer composite material provided in Example 2 of the present invention.

[0039] In the figure: 110, upper plate; 210, middle plate; 310, lower plate; 410, first spacer; 411, first folding surface; 412, second folding surface; 510, second spacer; 600, high-power module; 700, heat dissipation substrate; 800, toothed heat sink; 910, ceramic powder; 920, molten metal; 930, mounting block; 940, die-casting mold. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] like Figures 1 to 4As shown, embodiment 1 of the present invention provides a metal-based ceramic multilayer composite material, including an upper plate 110, a middle plate 210 and a lower plate 310 arranged in sequence, and a first partition plate 410 arranged between the upper plate 110 and the middle plate 210 and a second partition plate 510 arranged between the middle plate 210 and the lower plate 310, the expansion coefficient of the upper plate 110 is greater than the expansion coefficient of the middle plate 210; the expansion coefficient of the middle plate 210 is greater than the expansion coefficient of the lower plate 310.

[0042] Through the above-mentioned arrangement, if it is used as a heat dissipation substrate 700, when the heat dissipation substrate 700 expands due to heat, the length difference between the two adjacent plates after expansion is small, and by making the length of the upper plate 110 after expansion close to the length of the toothed heat dissipation plate, and the length of the lower plate 310 after expansion close to the length of the high-power module 600, the overall shape of the heat dissipation substrate 700 is made close to a trapezoid, which can avoid the problem of a large gap between the toothed heat dissipation plates on both sides of the expanded heat dissipation substrate 700 and the high-power module 600, and can improve the heat dissipation efficiency.

[0043] In this embodiment, the upper plate 110, the middle plate 210 and the lower plate 310 are all ceramic-metal composite materials, and their expansion coefficients are determined by the phase composition and the content of the phase per unit volume in the material. For example, the upper plate 110, the middle plate 210 and the lower plate 310 are ceramic-metal composite materials based on boron carbide. Specifically, the material of the upper plate 110 is B4C-(90%Cu-9%Al), in which the unit volume content of boron carbide B4C accounts for 47%. In the temperature range of 20 to 900°C, the expansion coefficient of the upper plate 110 is 12.3×10 -6 / ℃; the material of the middle plate 210 is B4C-(94%Cu-6%Zr), in which the unit volume content of boron carbide B4C accounts for 47%. In the temperature range of 20~900℃, the expansion coefficient of the middle plate 210 is 11.1×10 -6 / ℃, the lower plate 310 is B4C-(94%Cu-6%Si), in which the unit volume content of boron carbide B4C accounts for 47%. In the temperature range of 20~900℃, the expansion coefficient of the upper plate 110 is 10.9×10 -6 / °C, and the expansion coefficient of the upper plate 110 is configured to be the same as or close to the expansion coefficient of the toothed heat sink, and the expansion coefficient of the lower plate 310 is the same as or close to the expansion coefficient of the high-power module 600. During assembly, the lower plate 310 is in contact with the high-power module 600, and the upper plate 110 is in contact with the toothed heat sink, so as to avoid the problem of a large gap between the toothed heat sink on both sides of the heat dissipation substrate 700 and the high-power module 600.

[0044] In this embodiment, the first partition plate 410 and the second partition plate 510 are metal composite plates, wherein the first partition plate 410 is a copper-aluminum composite plate formed by pressing a copper plate and an aluminum plate; the second partition plate 510 is a copper-zinc composite plate formed by pressing a copper plate and a zinc plate, so as to facilitate the combination of the metal composite plate and the ceramic-metal composite material. In another embodiment, the upper plate 110, the middle plate 210 and the lower plate 310 can also be made of the same material, and the expansion coefficient can be reduced by increasing the unit volume content of boron carbide. It is only necessary to ensure that the expansion coefficients of two of the ceramic-metal composite plates are close to the expansion coefficients of the toothed heat sink and the high-power module 600, respectively, and the expansion coefficient of the other ceramic-metal composite plate is between the expansion coefficients of the upper and lower ceramic-metal composite plates. In addition, the material of the first partition plate 410 and the second partition plate 510 can be the same as the metal material in the ceramic-metal composite material on both sides thereof.

[0045] In this embodiment, the first spacer 410 and / or the second spacer 510 are continuously arranged in a wave shape or a zigzag shape. On the one hand, the contact surface between the ceramic-metal composite plate and the first spacer 410 or the second spacer 510 can be increased, thereby improving the heat dissipation efficiency. On the other hand, when the three ceramic-metal composite plates and the first spacer 410 and the second spacer 510 expand, the contact positions are prevented from being separated, resulting in damage to the heat dissipation substrate 700 formed by the entire metal-ceramic multilayer composite material.

[0046] In the second embodiment, different from the first embodiment, the thickness of the first partition plate 410 and / or the second partition plate 510 gradually increases from the middle to the two ends. Specifically, taking the first partition plate 410 as an example, Fig.13 As shown, b is the thickness of the middle of the first partition plate 410, a is the thickness of the two ends of the first partition plate 410, a is greater than b, and the vertical line in the middle of the first partition plate 410 is the central axis of the first partition plate 410. For the first partition plate 410 or the second partition plate 510 with uniform thickness, when expansion occurs, the degree of deformation gradually increases from the central axis to the left and right sides thereof. Figures 2 to 3As shown, taking the first partition plate 410 as an example, the first partition plate 410 includes a plurality of first folded surfaces 411 and second folded surfaces 412 connected in sequence, the first folded surfaces 411 and the second folded surfaces 412 form a V-shape with an opening facing upward, and the distance from the first folded surface 411 to the middle of the first partition plate 410 is smaller than the distance from the second folded surface 412 to the middle of the first partition plate 410. Since the expansion coefficient of the ceramic-metal composite plate on the upper side of the first partition plate 410 is greater than the expansion coefficient of the ceramic-metal composite plate on the lower side, when expansion occurs, the ceramic-metal composite plate on the upper layer The expansion degree of the plate is greater than that of the lower ceramic-metal composite plate, which makes the squeezing force of the upper ceramic-metal composite plate on the first partition plate 410 greater than that of the lower ceramic-metal composite plate on the first partition plate 410, so that the thickness of the first folded surface 411 of the two folded surfaces forming the trough is greater than the thickness of the second folded surface 412, and the farther away from the middle of the first partition plate 410, the greater the deformation degree, which makes the thickness of the two folded surfaces forming the peaks or troughs at both ends of the first partition plate 410 one largest and one smallest, such as Figure 4 As shown, 410A is the first partition plate 410 before expansion in the first embodiment, and 410B is the first partition plate 410 after expansion in the first embodiment. Figures 5 to 7 As shown, if the thickness of the first spacer 410 and / or the second spacer 510 is set to gradually increase from the middle to both ends, even if the first spacer 410 and the ceramic-metal composite plates on both sides thereof expand, the shape distribution of the first spacer 410 after deformation is relatively uniform, thereby avoiding excessive expansion that affects the use effect of the first spacer 410.

[0047] In this embodiment, the wavelengths of the first spacer 410 and the second spacer 510 are the same, and the first spacer 410 and the second spacer 510 are initially arranged in parallel. The thickness of the first spacer 410 and the second spacer 510 are both 0.2 mm-1 mm, and are suitable for conventional heat dissipation substrates 700.

[0048] like Figures 8 to 12 As shown, a processing technology of a metal-based ceramic multilayer composite material comprises the following steps:

[0049] S1, pressing a copper plate and an aluminum plate to form a copper-aluminum composite plate;

[0050] S2, pressing the copper plate and the zinc plate to form a copper-zinc composite plate; wherein the copper-aluminum composite plate and the copper-zinc composite plate have the same shape and thickness, and both are wavy or zigzag, continuously and evenly extended;

[0051] S3, vertically placing the pressed copper-aluminum composite plate and copper-zinc composite plate in the cavity of the die-casting mold 940; the copper-aluminum composite plate and the copper-zinc composite plate divide the cavity of the die-casting mold 940 into three unconnected chambers; specifically, two mounting blocks 930 are provided on the die-casting mold 940, and the copper-aluminum composite plate and the copper-zinc composite plate are installed on the die-casting mold 940 through the mounting blocks 930, and the interval setting is maintained.

[0052] S4, filling the configured ceramic powder 910 into the cavities of the three die-casting molds 940; then placing the die-casting molds 940 filled with the ceramic powder 910 on a vibration table to vibrate and compact the ceramic powder 910;

[0053] S5, then pouring three different molten metal liquids 920 into the three cavities, wherein a well-proportioned molten copper-chromium mixture is poured into the cavity formed between the copper-aluminum composite plate and the copper-zinc composite plate, and a well-proportioned molten copper-aluminum mixture and a molten copper-silicon mixture are respectively poured into the remaining two cavities;

[0054] S6, using a press head to squeeze the injected molten metal 920, so that the molten metal penetrates into the ceramic powder 910;

[0055] S7, after cooling under pressure for 5-20 minutes, take out the formed metal-based ceramic multilayer composite material.

[0056] The processing technology of the metal-based ceramic multilayer composite material of this embodiment further comprises the following steps after step S4 and before step S5:

[0057] S41, preheating the ceramic powder 910, the copper-aluminum composite plate and the copper-zinc composite plate in the die-casting mold 940 to 450° C.;

[0058] S51, preheating the die casting mold 940 and the press head, and spraying a mold release agent on the contact surface between the die casting mold 940 and the molten metal 920, so as to facilitate the separation of the press head from the formed molten metal 920.

[0059] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A metal-based ceramic multilayer composite material, characterized in that: At least including an upper plate, a middle plate and a lower plate arranged in sequence, a first spacer arranged between the upper plate and the middle plate, and a second spacer arranged between the middle plate and the lower plate, the expansion coefficient of the upper plate is greater than the expansion coefficient of the middle plate; the expansion coefficient of the middle plate is greater than the expansion coefficient of the lower plate; The expansion coefficient of the upper plate is configured to be the same as the expansion coefficient of the toothed heat sink, and the expansion coefficient of the lower plate is the same as the expansion coefficient of the high-power module; The material of the upper plate is B4C-(90%Cu-9%Al), in which the unit volume content of boron carbide B4C accounts for 47%; the material of the middle plate is B4C-(94%Cu-6%Zr), in which the unit volume content of boron carbide B4C accounts for 47%. In the temperature range of 20~900℃, the expansion coefficient of the middle plate is 11.1×10 -6 / ℃; the material of the lower plate is B4C-(94%Cu-6%Si), in which the unit volume content of boron carbide B4C accounts for 47%; the first partition plate is a copper-aluminum composite plate pressed by copper plate and aluminum plate; the second partition plate is a copper-zinc composite plate pressed by copper plate and zinc plate.

2. The metal-based ceramic multilayer composite material according to claim 1, characterized in that: The first partition plate and / or the second partition plate are / is wavy or serrated.

3. The metal-based ceramic multilayer composite material according to claim 2, characterized in that: The thickness of the first partition plate and / or the second partition plate gradually increases from the middle to the edge.

4. The metal-based ceramic multilayer composite material according to claim 2, characterized in that: The wavelengths of the first spacer and the second spacer are the same.

5. The metal-based ceramic multilayer composite material according to claim 1, characterized in that: The thickness of the first partition plate and the second partition plate are both 0.2 mm-1 mm.

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