A transplanting variable-distance vacuum transmission device

Abstract

The present invention discloses a transplanting variable-pitch vacuum transmission device, which belongs to the technical field of silicon wafer processing. The present invention includes a base, a first linear drive module is installed on the upper end of the base, and a support plate is installed on the first linear drive module, a guide frame is installed on one side of the support plate, and a second linear drive module is installed on the other side of the support plate; and also includes: the first conveyor and the second conveyor are both installed with a capacitive sensor. The transplanting variable-pitch vacuum transmission device can facilitate the effective cleaning of impurities attached to the surface of the conveyor belt during the conveyor belt transmission, and at the same time, the telescopic and movable adjustable cleaning structure is used to contact the conveyor belt only when the conveyor belt needs to be cleaned, and when the cleaning structure is in close contact with the conveyor belt, the contact area between the conveyor belt bracket and the conveyor belt is reduced, so that the load of the motor can be maintained at a normal level, and the conveying speed of the conveyor belt for silicon wafers is guaranteed under the same power.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer processing, in particular to a transplanting variable-distance vacuum transmission device. Background Art

[0002] As an important industrial raw material, silicon wafers are widely used in the production of solar cells, circuit boards and other products. When processing silicon wafers, they usually need to undergo multiple processes. In order to improve the processing efficiency of silicon wafers, corresponding transplanting variable-distance vacuum transmission devices are usually used to automatically transport silicon wafers.

[0003] For example, the announcement date is: 2021-06-04, and the name is: Negative pressure silicon wafer conveying flow line and silicon wafer detection and sorting equipment. The Chinese patent with the announcement number: CN112908915A includes a main conveying flow line, a negative pressure lifting device and a sub-conveying flow line; the main conveying flow line includes a plurality of conveying units, each conveying unit is arranged in sequence along the conveying direction, and a negative pressure lifting device is arranged between any two adjacent conveying units, and sub-conveying flow lines are arranged on both sides of any negative pressure lifting device; the negative pressure lifting device includes: a negative pressure adsorption mechanism, a lifting mechanism and a conveying mechanism, the negative pressure adsorption mechanism is driven by the lifting mechanism to perform lifting and lowering movements, and the conveying mechanism conveys the silicon wafers adsorbed by the negative pressure adsorption mechanism to the sub-conveying flow line on one side.

[0004] The above-mentioned prior art has the following technical problems: in order to prevent the silicon wafers from falling during transportation, the existing silicon wafer transmission device is provided with an adsorption structure when in use. However, when the conveyor belt is transporting the silicon wafers, it is not convenient to clean the impurities attached to the surface of the conveyor belt, which causes friction between the silicon wafers and the conveyor belt and causes surface wear. In addition, the general cleaning structure is always in a close fit with the conveyor belt regardless of whether the conveyor belt needs to be cleaned. In this way, the friction resistance of the conveyor belt is large due to the close contact between the conveyor belt and the cleaning structure during transmission, which increases the load of the motor and slows down the conveying speed of the conveyor belt for silicon wafers at the same power.

[0005] Therefore, we propose a transplanting variable-distance vacuum transmission device to solve the above-mentioned problems. Summary of the invention

[0006] The object of the present invention is to provide a transplanting variable-distance vacuum transmission device to solve the problem raised in the above-mentioned background technology that the existing silicon wafer transmission device on the market currently has an adsorption structure to prevent the silicon wafers from falling during transportation. However, when the conveyor belt is transporting the silicon wafers, it is not convenient to clean the impurities attached to the surface of the conveyor belt, which causes friction between the silicon wafers and the conveyor belt and causes surface wear. In addition, the general cleaning structure is always in a close fit with the conveyor belt regardless of whether the conveyor belt needs to be cleaned. In this way, the friction resistance of the conveyor belt is large due to the close contact between the conveyor belt and the cleaning structure during transmission, which increases the load of the motor and slows down the conveying speed of the conveyor belt for silicon wafers under the same power.

[0007] To achieve the above object, the present invention provides the following technical solution: a transplanting variable-pitch vacuum transmission device, comprising a base, a first linear drive module is installed on the upper end of the base, and a support plate is installed on the first linear drive module, a guide frame is installed on one side of the support plate, and a second linear drive module is installed on the other side of the support plate, a first conveyor is installed on the second linear drive module, and a second conveyor is fixedly installed on the guide frame;

[0008] Also includes:

[0009] Capacitive sensors are installed on the first conveyor and the second conveyor, and drag-reducing cleaning components for self-cleaning the belts are installed on the first conveyor and the second conveyor. When cleaning the belts, the drag-reducing cleaning components can reduce the contact area with the belts, so that the motor can maintain a normal speed to transmit silicon wafers under the same power.

[0010] Preferably, the first conveyor and the second conveyor have the same structure, and the first conveyor includes a positioning frame, a docking platform, a conveyor belt, an air inlet, a main through slot, an air suction slot, an adsorption hole and a movable plate;

[0011] A connecting platform is fixedly installed on the upper end of the positioning frame, and a guide roller is installed on the side of the connecting platform, which is used for supporting and guiding the conveying belt. The outer side of the guide roller is sleeved with a conveying belt. An air inlet is installed on the side of the connecting platform, and the air inlet is connected to an external air pump, and the air inlet is connected to the main through groove, and the main through groove and the air suction groove are connected to each other. The main through groove and the air suction groove are both opened on the connecting platform, adsorption holes are opened on the conveying belt, and a movable plate is installed on the connecting platform.

[0012] By adopting the above technical solution, when the vacuum pump is pumping air, the airflow inside the main through groove and the air suction groove can be pumped out, so that a negative pressure state is formed inside the main through groove and the air suction groove.

[0013] Preferably, the conveyor belt is made of elastic material, and a plurality of adsorption holes are evenly distributed on the conveyor belt. When the adsorption holes on the conveyor belt are conveyed to the top of the connecting platform, the adsorption holes and the suction grooves on the connecting platform are located on the same straight line.

[0014] By adopting the above technical solution, when the conveyor belt is connected to the connecting platform for transmission, after negative pressure is formed inside the suction groove, the silicon wafer on the conveyor belt can be adsorbed through the adsorption holes.

[0015] Preferably, the movable plate is symmetrically arranged with respect to the transverse center axis of the connecting platform, and the movable plate can slide on the connecting platform.

[0016] By adopting the above technical solution, the movable plate slides on the connecting platform, so that the contact area between the movable plate and the conveyor belt can be reduced when the conveyor belt is cleaned.

[0017] Preferably, the drag reduction and cleaning component includes a connecting rod, a through pipe, a control valve, an auxiliary spring, a rubber block, a shunt pipe, a guide column, a snap-on cover, a center block, a return spring, a cleaning brush rod, a transmission gear, a lever and a guide rack;

[0018] The connecting rod is fixedly installed at the lower end of the movable plate, and the lower end of the connecting rod is inserted into the interior of the through pipe, a control valve is installed at the bottom of the through pipe, and the connecting rod is connected to the interior of the through pipe through an auxiliary spring, and the lower end of the through pipe is inserted into the interior of the main through groove, a rubber block is fixedly installed between the movable plate and the connecting platform, and the rubber blocks are connected to each other through a shunt pipe and a conducting column, the conducting column is fixedly installed in the middle of the card-joining cover, and the card-joining cover is fixed to the bottom of the conveyor, a center block is provided in the middle part of the lower end of the card-joining cover, and the middle rod body of the upper end of the center block is inserted into the interior of the conducting column, the interior of the conducting column is connected to each other through a reset spring and the interior of the center block, and a cleaning brush rod is installed on the side of the center block, the middle rod body of the cleaning brush rod is key-connected with a transmission gear, a guide rack is provided on the side of the transmission gear, and the guide rack is fixed to the lower end of the card-joining cover, and the lower end of the center block is fixedly connected with a shift rod.

[0019] By adopting the above technical solution, the connection rod can be reset after moving inside the through pipe by setting the auxiliary spring.

[0020] Preferably, the lower end of the connecting rod forms a seamless sliding connection structure with the through pipe through a fixed sealing ring, and the lower end of the through pipe is set to an open structure, and after the control valve on the through pipe is opened, its interior can be connected with the main through groove.

[0021] By adopting the above technical solution, when the control valve is opened, the internal air of the main through groove is evacuated to form a negative pressure, which can make the connecting rod move downward.

[0022] Preferably, the interior of the rubber block is configured as a hollow structure, and the airflow inside the rubber block can enter the interior of the conducting column through the shunt pipe, and the conducting column and the snap-on cover are vertically distributed.

[0023] By adopting the above technical solution, when the rubber block is subjected to external pressure, the air flow inside it can enter the interior of the conducting column through the shunt pipe.

[0024] Preferably, the middle rod end of the central block forms a seamless sliding connection structure with the conducting column through a fixed sealing ring, and two cleaning brush rods are symmetrically distributed on the central block, and a plurality of elastic bristles are evenly distributed on the cleaning brush rods.

[0025] By adopting the above technical solution, the rod body on the central block moves along the top of the conducting column, so that the cleaning brush rod on the side can be closely fitted with the conveyor belt.

[0026] Preferably, the cleaning brush rod and the center block are rotatably connected, and the transmission gear and the guide rack key-connected on the cleaning brush rod form an engaging transmission structure.

[0027] By adopting the above technical solution, when the cleaning brush rod moves upward, the transmission gear can be rotated through the guide rack. After the cleaning brush rod rotates, the bristles on it contact and disengage with the lever, so that impurities attached to the elastic bristles can be shaken off.

[0028] Compared with the prior art, the invention has the following beneficial effects: the transplanting variable-distance vacuum transmission device can effectively clean the impurities attached to the surface of the conveyor belt during the conveyor belt transmission, and at the same time, the retractable and movable adjustable cleaning structure is used to contact the conveyor belt only when the conveyor belt needs to be cleaned, and when the cleaning structure is in close contact with the conveyor belt, the contact area between the conveyor belt bracket and the conveyor belt is reduced, so that the load of the motor can be maintained at a normal level, and the conveying speed of the conveyor belt for silicon wafers is guaranteed under the same power;

[0029] 1. There are adsorption holes. After the capacitive sensor detects that the silicon wafer is in place, the main slot and the air intake slot are evacuated through the vacuum pump and the air inlet. At this time, the adsorption holes on the conveyor belt can stably adsorb the silicon wafer through negative pressure to prevent the silicon wafer from falling due to inertia;

[0030] 2. A rubber block is provided. When the control valve is opened, since the interior of the through pipe and the main through slot are interconnected, negative pressure is formed inside the main through slot, thereby attracting the connecting rod inside the through pipe to move downward. After the connecting rod moves, the movable plate can move downward synchronously. After the movable plate moves downward, it can squeeze the rubber block, so that the airflow inside the rubber block enters the interior of the conducting column through the shunt pipe. The increase of the airflow inside the conducting column can push the rod body on the center rod and the center block to move upward synchronously, thereby making the cleaning brush rod on the side of the center block fit closely with the conveyor belt. When the conveyor belt is working, the cleaning brush rod can be used to self-clean the conveyor belt;

[0031] Furthermore, although the cleaning brush rod increases the resistance of the conveyor belt after being in close contact with the conveyor belt, the movable plate that is in close contact with the conveyor belt in the initial state is separated from the conveyor belt, thereby reducing the contact area with the conveyor belt, thereby maintaining the resistance of the conveyor belt transmission within a normal range, and does not increase the load of the motor, thereby ensuring the conveying speed of the conveyor belt for the silicon wafer under the same power;

[0032] 3. A lever is provided, and when the center block moves upward, the cleaning brush rod can move synchronously. After the cleaning brush rod moves, the meshing connection between the transmission gear and the guide rack enables the cleaning brush rod to rotate synchronously. After the cleaning brush rod rotates, the contact and separation between the bristles on the cleaning brush rod and the lever can be used to shake off impurities attached to the cleaning brush rod. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is a schematic diagram of the front three-dimensional structure of the present invention;

[0034] Figure 2 It is a schematic diagram of the structure after the first conveyor and the second conveyor of the present invention are connected with an external conveyor;

[0035] Figure 3 This is a schematic diagram of the structure of the first linear drive module and the support plate of the present invention;

[0036] Figure 4 This is a schematic diagram of the positioning frame and the conveyor belt structure of the present invention;

[0037] Figure 5 For the present invention Figure 1 The enlarged structural diagram at A in the middle;

[0038] Figure 6 It is a schematic diagram of the structure of the capacitive sensor of the present invention;

[0039] Figure 7 This is a schematic diagram of the structure of the connection platform and the air inlet port of the present invention;

[0040] Figure 8 For the present invention Figure 7 The enlarged structural diagram at B in the middle;

[0041] Fig. 9 It is a schematic diagram of the transmission gear and guide rack structure of the present invention.

[0042] In the figure: 1. base; 2. first linear drive module; 3. support plate; 4. guide frame; 5. second linear drive module; 6. first conveyor; 601. positioning frame; 602. connecting platform; 603. transmission belt; 604. air inlet; 605. main through slot; 606. suction slot; 607. adsorption hole; 608. movable plate; 7. second conveyor; 8. capacitive sensor; 9. drag reduction and cleaning component; 901. connecting rod; 902. through pipe; 903. control valve; 904. auxiliary spring; 905. rubber block; 906. shunt pipe; 907. conduction column; 908. snap-on cover; 909. center block; 9010. reset spring; 9011. cleaning brush rod; 9012. transmission gear; 9013. lever; 9014. guide rack. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] Example 1: Please refer to Figure 1-Figure 9In order to prevent the silicon wafers from falling during transportation, the existing silicon wafer transmission device is provided with an adsorption structure when in use. However, when the conveyor belt is transporting the silicon wafers, it is not convenient to clean the impurities attached to the surface of the conveyor belt, which causes friction between the silicon wafers and the conveyor belt and causes surface wear. In addition, the general cleaning structure is always in a close fit with the conveyor belt regardless of whether the conveyor belt needs to be cleaned. In this way, the friction resistance of the conveyor belt is large due to the close contact between the conveyor belt and the cleaning structure during transmission, which increases the load of the motor and slows down the conveying speed of the conveyor belt for the silicon wafers under the same power. In order to solve this technical problem, this embodiment discloses the following technical contents, including a base 1 A first linear drive module 2 is installed at the upper end of the base 1, and a support plate 3 is installed on the first linear drive module 2, a guide frame 4 is installed on one side of the support plate 3, and a second linear drive module 5 is installed on the other side of the support plate 3, a first conveyor 6 is installed on the second linear drive module 5, and a second conveyor 7 is fixedly installed on the guide frame 4; capacitive sensors 8 are installed on the first conveyor 6 and the second conveyor 7, and drag reduction cleaning components 9 for self-cleaning of the belts are installed on the first conveyor 6 and the second conveyor 7. When cleaning the belt, the drag reduction cleaning component 9 can reduce the contact area with the belt, so that the motor can maintain a normal speed to transmit silicon wafers under the same power. The first conveyor 6 and the second conveyor 7 have the same structure, and the first conveyor 6 includes a positioning frame 601, a connecting platform 602, a conveying belt 603, an air inlet pipe port 604, a main through slot 605, an air suction slot 606, an adsorption hole 607 and a movable plate 608; a connecting platform 602 is fixedly installed on the upper end of the positioning frame 601, and a guide roller is installed on the side of the connecting platform 602, which is used to support and guide the conveying belt 603, and the outer side of the guide roller is sleeved with the conveying belt 603, and an air inlet pipe port 604 is installed on the side of the connecting platform 602, the air inlet pipe port 604 is connected to an external air pump, and the air inlet pipe port 604 is interconnected with the main through slot 605, the main through slot 605 and the air suction slot 606 are connected to each other, the main through slot 605 and the air suction slot 606 are both opened on the connecting platform 602, the conveying belt 603 is opened with an adsorption hole 607, and a movable plate 608 is installed on the connecting platform 602. The conveyor belt 603 is made of elastic material, and a plurality of adsorption holes 607 are evenly distributed on the conveyor belt 603. When the adsorption holes 607 on the conveyor belt 603 are conveyed to the top of the docking platform 602, the adsorption holes 607 and the suction grooves 606 on the docking platform 602 are located on the same straight line. The movable plate 608 is symmetrically arranged about the transverse central axis of the docking platform 602, and the movable plate 608 can slide on the docking platform 602.The connecting rod 901 is fixedly installed at the lower end of the movable plate 608, and the lower end of the connecting rod 901 is inserted into the interior of the through pipe 902. A control valve 903 is installed at the bottom of the through pipe 902, and the connecting rod 901 is connected to the interior of the through pipe 902 through an auxiliary spring 904. The lower end of the through pipe 902 is inserted into the interior of the main through groove 605. A rubber block 905 is fixedly installed between the movable plate 608 and the connecting platform 602, and the rubber block 905 is connected to the through pipe 903 through the shunt pipe 904. 6 and the conducting column 907 are connected to each other, the conducting column 907 is fixedly installed in the middle of the clamping cover 908, and the clamping cover 908 is fixed to the bottom of the conveyor, a center block 909 is arranged in the middle of the lower end of the clamping cover 908, and the upper middle rod body of the center block 909 is inserted into the interior of the conducting column 907, the interior of the conducting column 907 is connected to the interior of the center block 909 through the reset spring 9010, and a cleaning brush rod 9011 is installed on the side of the center block 909. The lower end of the connecting rod 901 forms a seamless sliding connection structure with the through pipe 902 through a fixed sealing ring, and the lower end of the through pipe 902 is set to an open structure, and after the control valve 903 on the through pipe 902 is opened, its interior can be connected to the main through groove 605. The inside of the rubber block 905 is set to a hollow structure, and the airflow inside the rubber block 905 can enter the inside of the conducting column 907 through the shunt pipe 906, and the conducting column 907 and the clamping cover 908 are vertically distributed. The middle rod end of the center block 909 forms a seamless sliding connection structure with the conducting column 907 through a fixed sealing ring in the circumference, and two cleaning brush rods 9011 are symmetrically distributed on the center block 909, and a plurality of elastic bristles are evenly distributed in the circumference of the cleaning brush rod 9011.

[0045] When silicon wafers are being transported, the capacitance sensor 8 on the conveyor can detect the presence of the silicon wafers. After the silicon wafers are in place, the vacuum pump is turned on to draw air into the main through slot 605 and the suction slot 606 through the air inlet port 604. At this time, the main through slot 605 and the suction slot 606 form a negative pressure after suction, and the adsorption hole 607 on the conveyor belt 603 and the suction slot 606 are located on the same vertical line. Therefore, the silicon wafer can be adsorbed and fixed through the suction slot 606. After the silicon wafers are adsorbed and fixed, the first linear drive module 2 is turned on. After the first linear drive module 2 is turned on, the support plate 3 is moved, so that the second conveyor 7 on the support plate 3 and the external conveyor are mutually connected. Align, then turn on the second linear drive module 5. After the second linear drive module 5 is turned on, the first conveyor 6 is aligned with the external conveyor, so as to realize the transplantation and pitch change of silicon wafers. The adsorption of silicon wafers by the adsorption holes 607 can prevent the silicon wafers from falling due to inertia when the pitch is changed. When it is necessary to clean the conveyor belt 603 on the conveyor, open the control valve 903 on the through pipe 902, so that the interior of the through pipe 902 is connected with the main through groove 605. At this time, after the interior of the main through groove 605 is evacuated, the negative pressure can be used to make the connecting rod 901 inside the through pipe 902 drive the movable plate 608 to move downward. After the movable plate 608 moves downward, it can squeeze the rubber block 905. The airflow inside the rubber block 905 enters the interior of the conducting column 907 through the shunt tube 906. Because the end of the shunt tube 906 connected to the conducting column 907 is located below the end of the rod body of the center block 909, the airflow entering the conducting column 907 can push the center block 909 to move upward. After the center block 909 moves upward, the side cleaning brush rod 9011 is in close contact with the conveyor belt 603. At this time, impurities on the surface of the conveyor belt 603 can be scraped off by the bristles on the cleaning brush rod 9011 during transportation. However, although the cleaning brush rod 9011 is in close contact with the conveyor belt 603, which increases the transmission resistance of the conveyor belt 603, the movable plate 608 that is in contact with the conveyor belt 603 in the initial state causes the conveyor belt 603 to detach, thereby reducing the contact area with the conveyor belt 603 and reducing the friction resistance. As a result, the conveyor belt 603 can maintain normal resistance within a normal range during transportation, and the load of the motor will not increase, thereby ensuring the conveying speed of the conveyor belt for the silicon wafer under the same power.

[0046] Embodiment 2: The technical contents disclosed in this embodiment are further improvements made on the basis of the above-mentioned embodiment 1. The following technical contents are disclosed in this embodiment: the middle rod body of the cleaning brush rod 9011 is keyed to a transmission gear 9012, a guide rack 9014 is provided on the side of the transmission gear 9012, and the guide rack 9014 is fixed to the lower end of the snap-on cover 908, and a lever 9013 is fixed to the lower end of the center block 909, the cleaning brush rod 9011 and the center block 909 are rotationally connected, and the transmission gear 9012 and the guide rack 9014 keyed on the cleaning brush rod 9011 constitute an engaged transmission structure.

[0047] When the center block 909 moves upward, the cleaning brush rod 9011 on the side can move synchronously, and when the cleaning brush rod 9011 moves upward, the transmission gear 9012 can mesh with the guide rack 9014, so that the transmission gear 9012 drives the cleaning brush rod 9011 to rotate. After the cleaning brush rod 9011 rotates, the bristles on it come into contact with the lever 9013 below, which can cause the bristles to bend and deform. When the cleaning brush rod 9011 rotates and the bristles on it are separated from the lever 9013, the bristles are reset by their own elasticity, and the reset bristles can shake off the impurities attached to themselves.

[0048] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0049] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A transplanting variable-pitch vacuum transmission device, comprising a base (1), a first linear drive module (2) being mounted on the upper end of the base (1), a support plate (3) being mounted on the first linear drive module (2), a guide frame (4) being mounted on one side of the support plate (3), and a second linear drive module (5) being mounted on the other side of the support plate (3), a first conveyor (6) being mounted on the second linear drive module (5), and a second conveyor (7) being fixedly mounted on the guide frame (4); It is characterized in that Also includes: The first conveyor (6) and the second conveyor (7) are both equipped with a capacitive sensor (8), and the first conveyor (6) and the second conveyor (7) are both equipped with a drag reduction cleaning component (9) for self-cleaning the belt, and the drag reduction cleaning component (9) can reduce the contact area with the belt when cleaning the belt, so that the motor can maintain a normal speed to transport silicon wafers under the same power; The first conveyor (6) and the second conveyor (7) have the same structure, and the first conveyor (6) comprises a positioning frame (601), a connection platform (602), a conveyor belt (603), an air inlet (604), a main through slot (605), an air suction slot (606), an adsorption hole (607) and a movable plate (608); A connection platform (602) is fixedly mounted on the upper end of the positioning frame (601), and a guide roller is mounted on the side of the connection platform (602), the guide roller is used to support and guide the conveying belt (603), the outer side of the guide roller is sleeved with the conveying belt (603), an air inlet (604) is mounted on the side of the connection platform (602), the air inlet (604) is connected to an external air pump, and the air inlet (604) is interconnected with a main through groove (605), the main through groove (605) and the air suction groove (606) are interconnected, the main through groove (605) and the air suction groove (606) are both provided on the connection platform (602), an adsorption hole (607) is provided on the conveying belt (603), and a movable plate (608) is mounted on the connection platform (602); The drag reduction and cleaning component (9) comprises a connecting rod (901), a through pipe (902), a control valve (903), an auxiliary spring (904), a rubber block (905), a shunt pipe (906), a guide column (907), a snap-on cover (908), a center block (909), a return spring (9010), a cleaning brush rod (9011), a transmission gear (9012), a lever (9013) and a guide rack (9014); The connecting rod (901) is fixedly mounted on the lower end of the movable plate (608), and the lower end of the connecting rod (901) is inserted into the interior of the through pipe (902). A control valve (903) is installed at the bottom of the through pipe (902), and the connecting rod (901) and the interior of the through pipe (902) are connected to each other through an auxiliary spring (904). The lower end of the through pipe (902) is inserted into the interior of the main through groove (605). A rubber block (905) is fixedly mounted between the movable plate (608) and the connecting platform (602), and the rubber block (905) is connected to each other through a shunt pipe (906) and a conducting column (907). The conducting column (907) is fixedly mounted in the middle of the snap-on cover (908), and the snap-on cover (908) is fixedly mounted. At the bottom of the conveyor, a center block (909) is provided in the middle of the lower end of the snap-on cover (908), and the middle rod body of the upper end of the center block (909) is inserted into the interior of the conducting column (907), the interior of the conducting column (907) and the interior of the center block (909) are connected to each other through a return spring (9010), and a cleaning brush rod (9011) is installed on the side of the center block (909), the middle rod body of the cleaning brush rod (9011) is key-connected with a transmission gear (9012), a guide rack (9014) is provided on the side of the transmission gear (9012), and the guide rack (9014) is fixed to the lower end of the snap-on cover (908), and the lower end of the center block (909) is fixedly connected with a shifting rod (9013).

2. The variable-distance vacuum transmission device for transplanting according to claim 1, characterized in that: The conveyor belt (603) is made of an elastic material, and a plurality of adsorption holes (607) are evenly distributed on the conveyor belt (603). When the adsorption holes (607) on the conveyor belt (603) are conveyed to the top of the connection platform (602), the adsorption holes (607) and the air suction grooves (606) on the connection platform (602) are located on the same straight line.

3. The variable-distance vacuum transmission device for transplanting according to claim 2, characterized in that: The movable plate (608) is symmetrically arranged with respect to the transverse center axis of the connection platform (602), and the movable plate (608) is capable of sliding on the connection platform (602).

4. The variable-distance vacuum transmission device for transplanting according to claim 1, characterized in that: The lower end of the connecting rod (901) forms a seamless sliding connection structure with the through pipe (902) via a fixed sealing ring, and the lower end of the through pipe (902) is arranged to be an open structure. After the control valve (903) on the through pipe (902) is opened, its interior can be communicated with the main through groove (605).

5. The variable-distance vacuum transmission device for transplanting according to claim 1, characterized in that: The interior of the rubber block (905) is configured as a hollow structure, and the airflow inside the rubber block (905) can enter the interior of the conducting column (907) through the diverter pipe (906), and the conducting column (907) and the snap-on cover (908) are vertically distributed.

6. The variable-distance vacuum transmission device for transplanting according to claim 1, characterized in that: The middle rod end of the central block (909) is connected to the conductive column (907) via a fixed sealing ring in the circumferential direction to form a seamless sliding connection structure, and two cleaning brush rods (9011) are symmetrically distributed on the central block (909), and a plurality of elastic bristles are evenly distributed in the circumferential direction of the cleaning brush rod (9011).

7. The variable-distance vacuum transmission device for transplanting according to claim 1, characterized in that: The cleaning brush rod (9011) and the central block (909) are rotatably connected, and the transmission gear (9012) and the guide rack (9014) key-connected on the cleaning brush rod (9011) form a meshing transmission structure.

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