Method for manufacturing a board and board

Abstract

The application relates to a plate preparation method, comprising the following steps: arranging a plurality of convex strips on a substrate, the plurality of convex strips being parallel and spaced; wherein the material of the convex strips has a first boiling point temperature; manufacturing a glue layer to cover the plurality of convex strips, and the glue layer is filled in the gap between adjacent convex strips and is attached to the substrate; wherein the material of the glue layer has a second melting point temperature, and the second melting point temperature is higher than the first boiling point temperature; curing the glue layer by using a first temperature; wherein the first temperature is lower than the first boiling point temperature; vaporizing the plurality of convex strips by using a second temperature to form a plurality of parallel and spaced microchannels between the glue layer and the substrate; wherein the second temperature is higher than or equal to the first boiling point temperature and is lower than the second melting point temperature. The plate preparation method disclosed by the application has low energy consumption, low cost and environmental protection. The application also provides a plate obtained by the above preparation method.

Description

Technical Field

[0001] This application relates to the field of micro-nano technology, and more particularly to a method for preparing a plate and a plate prepared by the method. Background Technology

[0002] The substrate contains multiple microchannels of micro- and nano-sized dimensions, which can be used to transport liquids, gases, or other substances. For example, coolant can be circulated within each microchannel to achieve liquid cooling. There are generally two methods for fabricating hollow microchannels: one uses a carbon-based substrate template, which is removed by calcination to form the hollow microchannel; the other uses silica microspheres as a substrate template, and is etched using chemical solutions such as hydrofluoric acid to form the hollow microchannel.

[0003] However, preparing microchannels by calcination or chemical etching is energy-intensive, costly, and environmentally unfriendly. Summary of the Invention

[0004] To address the aforementioned problems, this application provides a method for preparing a sheet material that reduces the cost and energy consumption of sheet material preparation and is environmentally friendly. This application also provides a sheet material prepared using this method. Specifically, it includes the following solutions:

[0005] This application provides a method for preparing a sheet material, comprising the following steps:

[0006] Multiple protrusions are provided on the substrate, and the multiple protrusions are parallel to each other and spaced apart; wherein, the material of the protrusions has a first boiling point temperature;

[0007] An adhesive layer is formed to cover multiple raised strips, and the adhesive layer fills the gaps between adjacent raised strips and is bonded to the substrate; wherein the material of the adhesive layer has a second melting point temperature, which is higher than a first boiling point temperature;

[0008] The adhesive layer is cured at a first temperature; wherein the first temperature is lower than the first boiling point temperature;

[0009] Multiple protrusions are vaporized at a second temperature to form multiple parallel and spaced microchannels between the adhesive layer and the substrate; wherein the second temperature is higher than or equal to the first boiling point temperature and lower than the second melting point temperature.

[0010] This application employs a multi-layered arrangement of protrusions to fill the gaps between adjacent protrusions and adhere to the substrate while the adhesive layer covers the protrusions. This creates an adhesive bond between the adhesive layer and the substrate. In subsequent steps, each microchannel is kept independent and spaced apart to prevent interconnection and ensure effective liquid transport. The parallel arrangement of the protrusions ensures parallelism in the microchannels formed in subsequent steps, guaranteeing optimal microchannel performance. A first temperature below the first boiling point is used to prevent interference with the protrusions during adhesive layer curing. A second temperature above or equal to the first boiling point but below the second melting point ensures effective vaporization of the protrusions while avoiding excessive heat that could affect the adhesive layer's setting effect.

[0011] This application achieves the formation of microchannels corresponding to each protrusion by covering and curing the adhesive layer onto the protrusions. This ensures that the size and shape of the formed microchannels meet specific requirements. Furthermore, removing the protrusions via vaporization creates hollow microchannels. This vaporization method is energy-efficient, simple to operate, reduces the cost of material preparation, and is environmentally friendly.

[0012] In one embodiment, a plurality of protrusions are vaporized at a second temperature, including:

[0013] Multiple protrusions are vaporized at a second temperature in a vacuum environment.

[0014] In this embodiment, by setting up a vacuum environment and using a second temperature to vaporize multiple protrusions, the first boiling point temperature of the protrusions can be reduced, thereby reducing the second temperature used to vaporize the protrusions, and further reducing the energy consumption and cost of vaporizing the protrusions.

[0015] In one embodiment, the first boiling point temperature is between 100°C and 250°C.

[0016] In this embodiment, by setting the first boiling point temperature between 100°C and 250°C, the preparation method of the plate material of this application is simple and controllable. At the same time, by setting the first boiling point temperature between 100°C and 250°C, energy consumption can be saved and costs reduced while ensuring the vaporization effect of the raised strip.

[0017] In one embodiment, multiple protrusions are vaporized in a vacuum environment at a second temperature less than 100°C.

[0018] In one embodiment, an adhesive layer is fabricated to cover a plurality of raised strips, including:

[0019] An adhesive layer is made to cover multiple raised strips, with each raised strip's opposite ends exposed in the adhesive layer along its own extension direction.

[0020] In this embodiment, by setting the two ends of each protrusion exposed in the adhesive layer along its own extension direction, the undesirable phenomenon that adhesive overflow may block the openings at the two ends of the microchannel when the adhesive layer covers multiple protrusions can be avoided, thereby improving the yield and product quality of the microchannel.

[0021] In one embodiment, the material of the raised strip includes at least one of paraffin, phenol, and DMSO.

[0022] In one embodiment, the adhesive layer may be a photosensitive adhesive (UV Glue, UV).

[0023] In one embodiment, the substrate can be made of a rigid material or a flexible material.

[0024] In one embodiment, a plurality of raised strips are provided on a substrate, including:

[0025] An adhesive layer is disposed on a substrate; wherein the material of the adhesive layer is the same as the material of the protrusion, and the material of the adhesive layer has a first melting point temperature;

[0026] An adhesive layer is printed using a mold; wherein the mold includes multiple recesses that are parallel to each other and spaced apart, and the shape of each recess matches the shape of the protrusion.

[0027] The adhesive layer is cured at a third temperature and the mold is removed to form multiple protrusions on the substrate; wherein the third temperature is lower than the first melting point temperature.

[0028] In this embodiment, by using a mold to imprint the adhesive layer, the adhesive layer can be formed into raised strips with the same shape and size as the various recesses of the mold, thereby ensuring the shape and size of the raised strips, and thus ensuring the forming shape and size of the microchannels. By using a third temperature to cure the adhesive layer, the adhesive layer filling the recesses can be cured to form the corresponding raised strips. At the same time, curing the adhesive layer facilitates the separation between the adhesive layer and the mold, thereby achieving a "demolding" effect, so that the substrate and raised strips can be used in subsequent preparations. By setting the third temperature lower than the first melting point temperature of the adhesive layer, the curing of the adhesive layer can be prevented from being too high, which would affect the shaping of the adhesive layer. In other words, setting the third temperature lower than the first melting point temperature of the adhesive layer ensures the forming effect of the raised strips and prevents the raised strips from melting due to excessive temperature.

[0029] In one embodiment, the first melting point temperature is between -20°C and 80°C.

[0030] One embodiment employs a mold-pressed adhesive layer, comprising:

[0031] The adhesive layer is printed using a mold, and there is a gap between the mold surface near the substrate and the substrate, which is filled with the adhesive layer.

[0032] Then, after curing the adhesive layer at a third temperature and removing the mold, the process includes:

[0033] The adhesive layer is etched away from the surface of the substrate to expose the substrate between two adjacent protrusions.

[0034] In this embodiment, by leaving a gap between the mold surface near the substrate and the substrate, and filling the gap with an adhesive layer, adjacent protrusions are connected to each other, thereby improving the demolding effect and preventing some protrusions from falling off the substrate during demolding. This ensures the manufacturing effect and yield of the protrusions. By etching the adhesive layer away from the substrate surface, the substrate can be exposed between two adjacent protrusions, thus forming multiple spaced protrusions.

[0035] In one embodiment, etching the adhesive layer away from the surface of the substrate includes:

[0036] The adhesive layer is etched away from the substrate surface using plasma surface etching.

[0037] In this embodiment, by using plasma surface etching to etch the surface of the adhesive layer away from the substrate, the etching effect and etching uniformity of the adhesive layer can be guaranteed, thereby ensuring the shape and dimensional accuracy of the formed protrusion.

[0038] In one embodiment, the length of each protrusion exposed at its opposite ends along its own extension direction is between 0 and 10 cm.

[0039] In this embodiment, by setting the exposed length of each protrusion at its opposite ends to be between 0 and 10 cm, it is possible to prevent the adhesive layer from overflowing and blocking the two openings at both ends of the microchannel while controlling the exposed length of the protrusions to avoid material waste.

[0040] One embodiment includes, after curing the adhesive layer at a first temperature:

[0041] Based on a preset length, the adhesive layer and the ridge are cut at opposite ends of the ridge so that the two opposite sides of the adhesive layer along the extension direction of the ridge are parallel to each other.

[0042] In this embodiment, by cutting the adhesive layer and the protrusion at opposite ends of the protrusion based on a preset length, the two opposite sides of the adhesive layer along the extension direction of the protrusion are made parallel to each other. This ensures that the openings at opposite ends of the microchannel are parallel after formation and prevents any overflow of the adhesive layer from blocking the two openings at opposite ends of the microchannel. Simultaneously, by cutting the adhesive layer and the protrusion at the same time, the protrusion provides support for the adhesive layer, preventing deformation of the microchannel during the cutting process.

[0043] In one embodiment, the cross-sectional shape of the protrusion perpendicular to its extension direction is any one of rectangle, triangle, arc, or trapezoid.

[0044] In this embodiment, by setting the cross-sectional shape of the protrusion in the direction perpendicular to its extension to be any one of rectangle, triangle, arc, or trapezoid, the sheet material prepared by the method of this application can meet different needs, thereby improving the scope of use and applicability of the sheet material.

[0045] In one embodiment, the cross-sectional shape of the protrusion has a first width, which is 1 to 1000 μm.

[0046] In this embodiment, by setting the first width to 1 to 1000 μm, the sheet material prepared by the preparation method of this application can meet different needs, thereby improving the application range and applicability of the sheet material.

[0047] In one embodiment, along the direction in which the plurality of convex strips are arranged at intervals, there is a first spacing between two adjacent convex strips, the first spacing being 1 to 1000 μm.

[0048] In one embodiment, the extension length of the convex strip is greater than or equal to 10 cm.

[0049] In this embodiment, by setting the extension length of the protrusion to be greater than or equal to 10 cm, microchannels with an ultra-high aspect ratio can be formed, thereby further improving the application range and applicability of the sheet material prepared by the preparation method of this application.

[0050] In one embodiment, the extended shape of the convex strip is straight, arc-shaped, wavy, or zigzag.

[0051] This application also provides a sheet material, which is prepared by the sheet material preparation method described in any of the above embodiments.

[0052] Because the sheet material of this application is prepared by the sheet material preparation method described in any of the above embodiments, the sheet material of this application possesses all the possible beneficial effects of the sheet material prepared by the sheet material preparation method in any of the above embodiments. Attached Figure Description

[0053] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0054] Figure 1 This is a schematic diagram of the working scenario of the sheet material in this application;

[0055] Figure 2 This is a schematic diagram illustrating the workflow of the preparation method of the sheet material in this application;

[0056] Figure 3 A schematic diagram illustrating the workflow for setting multiple protrusions on a substrate;

[0057] Figure 4 This is a schematic diagram of the planar structure of the mold;

[0058] Figure 5 for Figure 4 A schematic diagram of the cross-sectional structure of the mold at position AA in the embodiment shown;

[0059] Figure 6 This is a schematic diagram of the structure from one side when the adhesive layer is imprinted using a mold;

[0060] Figure 7 This is a structural diagram showing the view from one side when the mold is being removed.

[0061] Figure 8 for Figure 6 The schematic diagram shown in the embodiment is a structural diagram from one side view when the adhesive layer is cured on the substrate;

[0062] Figure 9 for Figure 8 A schematic diagram of the structure of the etched adhesive layer from the side of the substrate surface away from the etched substrate in the embodiment shown.

[0063] Figure 10 for Figure 9 A schematic diagram of the planar structure when multiple protrusions are fabricated on the substrate in the illustrated embodiment;

[0064] Figure 11 A schematic diagram of the planar structure for creating an adhesive layer to cover multiple raised strips;

[0065] Figure 12 for Figure 11 The illustrated embodiment is a cross-sectional view of the structure at position BB.

[0066] Figure 13a This is a schematic diagram of the structure from one side of the protrusion in one possible embodiment;

[0067] Figure 13b for Figure 13a A schematic diagram of the microchannel formed corresponding to the protrusion in the embodiment shown, viewed from one side.

[0068] Figure 14a This is a schematic diagram of the structure from one side of the protrusion in one possible embodiment;

[0069] Figure 14b for Figure 14a A schematic diagram of the microchannel formed corresponding to the protrusion in the embodiment shown, viewed from one side.

[0070] Figure 15a This is a schematic diagram of the structure from one side of the protrusion in one possible embodiment;

[0071] Figure 15b for Figure 15a A schematic diagram of the microchannel formed corresponding to the protrusion in the embodiment shown, viewed from one side.

[0072] Figure 16a This is a schematic diagram of the planar structure of the protrusion in one possible embodiment;

[0073] Figure 16b for Figure 16a A schematic diagram of the planar structure of the plate material in the illustrated embodiment;

[0074] Figure 17a This is a schematic diagram of the planar structure of the protrusion in one possible embodiment;

[0075] Figure 17b for Figure 17a A schematic diagram of the planar structure of the plate material in the embodiment shown. Detailed Implementation

[0076] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0077] The following descriptions of the embodiments are based on the accompanying illustrations and are used to illustrate specific embodiments in which this application can be implemented. The component designations used herein, such as "first," "second," etc., are merely for distinguishing the described objects and do not have any sequential or technical meaning. Unless otherwise specified, the terms "connection" and "linkage" used in this application include both direct and indirect connections (linkages). Directional terms used in this application, such as "up," "down," "front," "rear," "left," "right," "inner," "outer," "side," etc., are merely for reference to the accompanying drawings. Therefore, the use of directional terms is for better and clearer explanation and understanding of this application, and does not indicate or imply that the referred device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this application.

[0078] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joint" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising," "may include," "include," or "may include" used in this application indicate the presence of the corresponding disclosed function, operation, element, etc., and do not limit one or more other functions, operations, elements, etc. Moreover, the terms "comprising" or "include" indicate the presence of the corresponding features, number, steps, operations, elements, components, or combinations thereof disclosed in the specification, but do not exclude the presence or addition of one or more other features, number, steps, operations, elements, components, or combinations thereof, and are intended to cover non-exclusive inclusion.

[0079] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0080] Please see Figure 1 , Figure 1 This is a schematic diagram of the working scenario of the sheet material 10 in this application. Figure 1 As shown, the board 10 includes an adhesive layer 11 and a substrate 12, with the adhesive layer 11 fixedly connected to the substrate 12. Multiple microchannels 111 are formed within the adhesive layer 11, each microchannel 111 extending through the adhesive layer 11 along its own extension direction.

[0081] Specifically, in Figure 1 In the illustrated embodiment, the substrate 12 is used to carry and support the adhesive layer 11, which is adhered and bonded to the substrate 12 to form a fixed connection. The adhesive layer 11 and the substrate 12 surround each other to form a plurality of microchannels 111. The microchannels 111 are parallel to each other and spaced apart from each other, so that substances such as gas, liquid or other forms can be transported through the microchannels 111.

[0082] For example, in one possible embodiment, the substrate 10 of this application can be a heat sink to dissipate heat from the battery or other heat-generating devices. Specifically, the heat sink has multiple parallel and spaced-apart microchannels 111, through which cool air or coolant can flow. The cool air, coolant, or other substances flowing through the microchannels 111 can carry away the heat dissipated by the battery or other heat-generating devices, thereby achieving the heat dissipation function.

[0083] For ease of description, this application will use plate 10 as an example for illustrative purposes in the following description.

[0084] It should be noted that, in this embodiment, the plate 10 is only used as a heat sink as an example for illustrative purposes, but it is not limited to the plate 10 being a heat sink. In other embodiments of this application, the plate 10 may be different functional structural components or devices, depending on the different functions it can achieve and the different design requirements it meets.

[0085] In one embodiment, the substrate 12 can be made of a rigid material or a flexible material. It is understood that by making the substrate 12 either rigid or flexible, different support forms for the adhesive layer 11 can be formed, thereby enabling the board 10 to be applied in different usage scenarios, meeting different functional requirements, and further improving the scope of use and applicability of the board 10 prepared by the board preparation method of this application.

[0086] In one embodiment, the substrate 12 may be, but is not limited to, a PET film.

[0087] Please see Figure 2 , Figure 2 This is a schematic diagram illustrating the workflow of the preparation method for the sheet material of this application. The preparation method of the sheet material of this application is used to prepare sheet material 10, such as... Figure 2 As shown, the method for preparing the board material in this application includes the following steps:

[0088] S100: A plurality of protrusions 20 are provided on the substrate 12, the plurality of protrusions 20 being parallel to each other and spaced apart; wherein, the material of the protrusions 20 has a first boiling point temperature;

[0089] For details, please refer to Figure 3 , Figure 3 This is a schematic diagram illustrating the workflow of setting multiple protrusions 20 on substrate 12. (See diagram below.) Figure 3 As shown, step S100 "setting a plurality of protrusions 20 on the substrate 12" includes:

[0090] S101. An adhesive layer 30 is provided on the substrate 12; wherein the material of the adhesive layer 30 is the same as the material of the protrusion 20, and the material of the adhesive layer 30 has a first melting point temperature;

[0091] In step S101, “an adhesive layer 30 is provided on the substrate 12”, the adhesive layer 30 is bonded to the substrate 12 to achieve a fixed connection between the adhesive layer 30 and the substrate 12, which facilitates demolding after the adhesive layer 30 forms the protrusion 20.

[0092] In one embodiment, the first melting point temperature is between -20°C and 80°C.

[0093] In one embodiment, the adhesive layer 30 is made of at least one of paraffin, phenol, and DMSO.

[0094] S102. The adhesive layer 30 is imprinted using a mold 40; wherein the mold 40 includes a plurality of recesses 43 that are parallel to each other and spaced apart, and the shape of each recess 43 matches the shape of the protrusion 20.

[0095] Please refer to the following: Figure 4 and Figure 5 , Figure 4 This is a schematic diagram of the planar structure of mold 40. Figure 5 for Figure 4 A schematic cross-sectional view of the mold 40 at position AA in the illustrated embodiment. Figure 4 and Figure 5 As shown, a mold 40 is provided first. The mold 40 has a plurality of recesses 43, which are parallel to each other and spaced apart, and the shape and size of each recess 43 are the same as the shape and size of the microchannel 111.

[0096] Specifically, in Figure 4 In the illustrated embodiment, the mold 40 includes a support plate 41, and a photosensitive adhesive layer 42 can be prepared on the support plate 41 by means of laser direct writing, development, and finally photosensitive adhesive transfer, so as to form a plurality of parallel and spaced recesses 43 on the photosensitive adhesive layer 42. Figure 4 The area indicated by the thin diagonal line is the recessed portion 43). Finally, the photosensitive adhesive layer 42 is cured to shape the multiple recessed portions 43 formed, so that the mold 40 will not deform during subsequent preparation processes, affecting the shape and dimensional accuracy of the microchannels 111 of the plate 10.

[0097] It should be noted that, in Figure 4This description exemplifies only one possible implementation of the recessed portion 43, and does not limit the implementation of the recessed portion 43 in this application to this method. In other embodiments of this application, multiple parallel and spaced recessed portions 43 can be prepared by other methods or processes to form a mold 40. That is, this application does not limit the forming and preparation methods of the mold 40.

[0098] For example, in one possible embodiment, a plurality of parallel and spaced recesses 43 can be formed by first exposing a photomask, then transferring the photosensitive adhesive, and finally curing the photosensitive adhesive layer 42.

[0099] At the same time, Figure 4 In the illustrated embodiment, a rectangular cross-sectional shape of the recess 43 perpendicular to its extension direction is used as an example for illustrative purposes, but the cross-sectional shape of the recess 43 is not limited to being rectangular. In other embodiments of this application, the cross-sectional shape of the recess 43 can also be triangular, arc-shaped, trapezoidal, or any other shape.

[0100] For further details, please refer to Figure 6 , Figure 6 This is a schematic diagram of the structure from one side when the adhesive layer 30 is imprinted using mold 40. (See diagram below.) Figure 6 As shown, based on the shape of the mold 40, the substrate 12 and the adhesive layer 30 fixedly connected to the substrate 12 can be imprinted using a hot stamping method, so that the adhesive layer 30 fills each recess 43. The hot stamping temperature can be, but is not limited to, 10°C above the melting point temperature of the adhesive layer 30 material and below the boiling point temperature of the adhesive layer 30 material, to melt the adhesive layer 30 for stamping while avoiding excessive temperature that could cause the adhesive layer 30 to vaporize.

[0101] By using the mold 40 to imprint the adhesive layer 30, the adhesive layer 30 can form convex strips 20 with the same shape and size as each recess 43 of the mold 40, thereby ensuring the shape and size of the convex strips 20, that is, ensuring the forming shape and size of the microchannel 111.

[0102] In one embodiment, step S102, "imprinting the adhesive layer 30 using the mold 40," includes:

[0103] The adhesive layer 30 is pressed using a mold 40, and a gap is left between the surface of the mold 40 near the substrate 12 and the substrate 12, and the gap is filled with the adhesive layer 30.

[0104] Please refer to the following for details. Figure 6 .exist Figure 6In the embodiment shown, based on the shape of the mold 40, the adhesive layer 30 is imprinted onto the mold 40 by hot pressing, so that the adhesive layer 30 fills each recess 43.

[0105] A gap is left between the mold 40 and the substrate 12. The adhesive layer 30 has a plurality of protrusions 30a and a plurality of connecting portions 30b arranged alternately on the side facing the mold 40. That is, the shape and size of each protrusion 30a corresponds to the shape and size of each recess 43, and each connecting portion 30b connects two adjacent protrusions 30a.

[0106] In this embodiment, by leaving a gap between the mold 40 and the substrate 12, the adjacent protrusions 30a (corresponding to the ridges 20 formed after etching) are connected to each other, thereby improving the demolding effect and preventing some protrusions 30a from falling off the substrate 12 during the demolding process, thus ensuring the manufacturing effect and yield of the ridges 20.

[0107] S103. The adhesive layer 30 is cured at a third temperature and the mold 40 is removed to form a plurality of protrusions 20 on the substrate 12; wherein the third temperature is lower than the first melting point temperature.

[0108] Please see Figure 7 , Figure 7 This is a structural diagram showing the view from one side when mold 40 is removed. Figure 7 In the embodiment shown, the adhesive layer 30 is cured at a third temperature, which can cure the adhesive layer 30 filling the recess 43 to form a corresponding protrusion 20.

[0109] Simultaneously, by curing the adhesive layer 30, it is easy to separate the adhesive layer 30 from the mold 40, thereby achieving a "demolding" effect, so that the substrate 12 and the protrusion 20 can be used in subsequent preparations. By setting the third temperature lower than the first melting point temperature of the adhesive layer 30, it is possible to avoid the third temperature being too high during the curing of the adhesive layer 30, which would affect the shaping of the adhesive layer 30. In other words, setting the third temperature lower than the first melting point temperature of the adhesive layer 30 can ensure the molding effect of the protrusion 20 and prevent the protrusion 20 from melting due to excessive temperature.

[0110] In one embodiment, after curing the adhesive layer 30 at a third temperature and removing the mold 40, the process includes:

[0111] The adhesive layer 30 is etched away from the surface of the substrate 12 to expose the substrate 12 between two adjacent protrusions 20.

[0112] Please refer to the following for details. Figure 8 and Figure 9 , Figure 8 for Figure 6The schematic diagram shown in the embodiment is a structural view from one side when the adhesive layer 30 is cured on the substrate 12. Figure 9 for Figure 8 This is a schematic diagram of the structure of the etched adhesive layer 30 in the embodiment, viewed from the side opposite to the surface of the substrate 12. Figure 8 In the embodiment shown, after the adhesive layer 30 is cured at a third temperature and the mold 40 is removed, the adhesive layer 30 formed on the substrate 12 has a plurality of parallel and spaced protrusions 30a and a connecting portion 30b connecting two adjacent protrusions 30a.

[0113] like Figure 9 As shown, the adhesive layer 30 is etched away from the surface of the substrate 12 to expose the substrate 12 between two adjacent protrusions 20.

[0114] In other words, based on the height of the connecting portion 30b, the adhesive layer 30 is etched away from the surface of the substrate 12, that is, the connecting portion 30b is completely etched to expose the surface of the substrate 12 between the two protrusions 30a. After etching, each protrusion 30a becomes a raised strip 20.

[0115] Understandably, by etching the adhesive layer 30 away from the surface of the substrate 12, the substrate 12 can be exposed between two adjacent protrusions 30a, thereby forming a plurality of mutually spaced protrusions 20.

[0116] In one embodiment, etching the adhesive layer 30 away from the surface of the substrate 12 includes:

[0117] The surface of the adhesive layer 30 facing away from the substrate 12 is etched using plasma surface etching.

[0118] In this embodiment, by using plasma surface etching to etch the surface of the adhesive layer 30 away from the substrate 12, the etching effect and etching uniformity of the adhesive layer 30 can be guaranteed, thereby ensuring the shape and dimensional accuracy of the formed protrusion 20.

[0119] Please see Figure 10 , Figure 10 for Figure 9 This is a schematic diagram of the planar structure when multiple protrusions 20 are fabricated on the substrate 12 in the illustrated embodiment. Figure 10 As shown, multiple protrusions 20 are arranged at intervals so that when the adhesive layer 11 is subsequently prepared to cover the multiple protrusions 20, the adhesive layer 11 can fill the gap between two adjacent protrusions 20 and adhere to the substrate 12, thereby enabling the adhesive layer 11 to form an adhesive effect with the substrate 12. In subsequent steps, each microchannel 111 is made independent and spaced apart to avoid the microchannels 111 from communicating with each other and affecting the liquid transport effect.

[0120] Meanwhile, by setting multiple convex strips 20 to be parallel to each other, the microchannels 111 made in subsequent steps are made to be parallel to each other, thereby ensuring the effectiveness of the microchannels 111.

[0121] In one embodiment, the material of the raised strip 20 may be, but is not limited to, at least one of paraffin, phenol, and DMSO. Specifically, the raised strip 20 is made of the adhesive layer 30, that is, the material of the raised strip 20 is the same as the material of the adhesive layer 30.

[0122] In one embodiment, the first boiling point temperature of the material of the raised strip 20 is between 100°C and 250°C. By setting the first boiling point temperature between 100°C and 250°C, the preparation method of the plate of this application is simple and controllable. At the same time, by setting the first boiling point temperature between 100°C and 250°C, energy consumption can be saved and costs can be reduced while ensuring the vaporization effect of the raised strip 20.

[0123] S200: An adhesive layer 11 is formed to cover a plurality of protrusions 20, and the adhesive layer 11 fills the gap between adjacent protrusions 20 and is bonded to the substrate 12; wherein, the material of the adhesive layer 11 has a second melting point temperature, which is higher than the first boiling point temperature.

[0124] Please refer to the following: Figure 11 and Figure 12 , Figure 11 A schematic diagram of the planar structure for fabricating adhesive layer 11 to cover multiple raised strips 20. Figure 12 for Figure 11 The illustrated embodiment shows a cross-sectional structural diagram at position BB. (See diagram below.) Figure 11 As shown, the adhesive layer 11 can be applied to the raised strip 20 by heat embossing.

[0125] In one embodiment, the adhesive layer 11 can be a photosensitive adhesive (UV Glue, UV).

[0126] exist Figure 11 In the illustrated embodiment, step 200, "fabricating adhesive layer 11 to cover the plurality of raised strips 20", includes:

[0127] An adhesive layer 11 is made to cover a plurality of protrusions 20, with each protrusion 20 having its opposite ends exposed in the adhesive layer 11 along its own extending direction.

[0128] Specifically, such as Figure 11 As shown, each protrusion 20 has a first end 20a and a second end 20b along its own extension direction. The first end 20a and the second end 20b extend outward along the opposite sides of the adhesive layer 11 and are exposed outward.

[0129] Understandable, Figure 11In the embodiment shown, each protrusion 20 is positioned such that its opposite ends along its own extending direction are exposed above the adhesive layer 11, i.e., as shown... Figure 11 The extended first end 20a and second end 20b shown can prevent the adhesive layer 11 from overflowing and blocking the openings at opposite ends of the microchannel 111 when the adhesive layer 11 is used to cover multiple protrusions 20, thereby improving the yield and product quality of the microchannel 111.

[0130] It should be noted that, in Figure 11 In the illustrated embodiment, the example given is that the first end 20a and the second end 20b each extend to the same length, but this is not limited to the first end 20a and the second end 20b each extending to the same length. In other embodiments of this application, the first end 20a and the second end 20b each extend to different lengths, that is, they can be adjusted according to actual design requirements, and this application does not specifically limit this.

[0131] One embodiment is also described below. Figure 11 .like Figure 11 As shown, the lengths of the two opposite ends of each protrusion 20 along its own extension direction are between 0 and 10 cm. That is, the lengths of the first end 20a and the second end 20b extending are each between 0 and 10 cm.

[0132] In this embodiment, by setting the exposed length of each protrusion 20 at its opposite ends to be between 0 and 10 cm, it is possible to prevent the adhesive layer 11 from overflowing and blocking the two openings at both ends of the microchannel 111, while controlling the exposed length of the protrusion 20 to avoid material waste.

[0133] S300, the adhesive layer 11 is cured at a first temperature; wherein, the first temperature is lower than the first boiling point temperature;

[0134] Please refer to the following for details. Figure 12 .like Figure 12 As shown, the adhesive layer 11 is cured at the first temperature, which can form microchannels 111 corresponding to each protrusion 20, thereby ensuring the size and shape of the formed microchannels 111 so that the size and shape of the formed microchannels 111 can meet the requirements.

[0135] Understandably, by setting the first temperature below the first boiling point temperature, it is possible to ensure that when the adhesive layer 11 is cured at the first temperature, the first temperature is not too high and thus avoids adverse effects on the shape and size of the raised strip 20.

[0136] In one embodiment, after step S300 "curing adhesive layer 11 at a first temperature", the process includes:

[0137] Based on a preset length, the adhesive layer 11 and the protrusion 20 are cut at opposite ends of the protrusion 20 so that the two opposite sides of the adhesive layer 11 along the extension direction of the protrusion 20 are parallel to each other.

[0138] Understandably, along the extension direction of the raised strips 20, during the process of the adhesive layer 11 imprinting and covering multiple raised strips 20, the opposite side surfaces of the adhesive layer 11 are flush with the opposite ends of the raised strips 20. At this time, some adhesive layer 11 may overflow and block the opposite ends of the raised strips 20. After the raised strips 20 are vaporized, this part of the adhesive layer 11 may affect the normal use effect of the formed microchannels 111.

[0139] In this embodiment, by cutting the adhesive layer and the protrusion 20 at opposite ends of the protrusion 20 based on a preset length, the two opposite sides of the adhesive layer 11 along the extension direction of the protrusion 20 can be made parallel to each other, thereby ensuring that the openings at opposite ends of the microchannel 111 are parallel to each other after the microchannel 111 is formed, and ensuring that possible overflow of the adhesive layer 11 can block the two openings at opposite ends of the microchannel 111.

[0140] At the same time, by cutting the adhesive layer 11 and the protrusion 20 simultaneously, the protrusion 20 can provide support for the adhesive layer 11, thus avoiding the deformation of the microchannel 111 during the cutting process of the adhesive layer 11.

[0141] One embodiment, please continue reading Figure 12 .like Figure 12 As shown, the cross-sectional shape of the protrusion 20 has a first width W1, which is 1 to 1000 μm. The first width W1 is the maximum dimension of the cross-sectional shape of the protrusion 20.

[0142] In this embodiment, by setting the first width W1 of the protrusion 20 to 1 to 1000 μm, the maximum size of the cross-sectional shape of the microchannel 111 formed therecorresponding to it is also 1 to 1000 μm, thereby enabling the plate 10 prepared by the plate preparation method of this application to meet different needs and improve the application range and applicability of the plate 10.

[0143] In one embodiment, along the direction in which the plurality of protrusions 20 are arranged at intervals, there is a first gap between two adjacent protrusions 20, the first gap being 1 to 1000 μm.

[0144] In one embodiment, the extension length of the protrusion 20 is greater than or equal to 10 cm.

[0145] In this embodiment, by setting the extension length of the protrusion 20 to be greater than or equal to 10 cm, a microchannel 111 with an ultra-high aspect ratio can be formed, thereby further improving the application range and applicability of the plate 10 prepared by the preparation method of the plate of this application.

[0146] For example, in one possible embodiment, when the first width W1 is 8 μm and the extension length of the protrusion 20 is equal to 10 cm, the aspect ratio of each microchannel 111 formed by each corresponding protrusion 20 in the plate 10 prepared by the method of this application can reach 1.25 × 10⁻⁶. 6 .

[0147] S400, a plurality of protrusions 20 are vaporized at a second temperature to form a plurality of parallel and spaced microchannels 111 between the adhesive layer 11 and the substrate 12; wherein the second temperature is higher than or equal to the first boiling point temperature and lower than the second melting point temperature.

[0148] For details, please refer to Figure 1 After step S400, "vaporizing multiple protrusions 20 at a second temperature", multiple parallel and spaced microchannels 111 are formed between the adhesive layer 11 and the substrate 12. The structure of the formed microchannels 111 is shown in the figure below. Figure 1 As shown. In other words, after vaporizing multiple protrusions 20, multiple parallel and spaced microchannels 111 can be formed, thereby completing the preparation of the plate 10.

[0149] By setting a second temperature higher than or equal to the first boiling point temperature and lower than the second melting point temperature, when multiple protrusions 20 are vaporized using the second temperature, the vaporization effect of the protrusions 20 can be guaranteed while avoiding excessively high temperatures that could affect the setting effect of the adhesive layer 11.

[0150] In one embodiment, step S400, "vaporizing the plurality of protrusions 20 at a second temperature," includes:

[0151] Multiple protrusions 20 are vaporized at a second temperature in a vacuum environment.

[0152] In this embodiment, the substrate 12, the adhesive layer 11 and the protrusion 20 disposed on the substrate 12 can be placed in a vacuum environment, thereby reducing the first boiling point temperature of the protrusion 20, thereby reducing the second temperature used to vaporize the protrusion 20, and further reducing the energy consumption and cost of vaporizing the protrusion 20.

[0153] In other words, the first boiling point temperature of the raised strip 20 varies with air pressure, and the comparison between the second temperature and the first boiling point temperature is also under the same conditions. By changing the air pressure environment in which the raised strip 20 is located, the first boiling point temperature of the raised strip 20 can be changed. When the raised strip 20 is vaporized in a vacuum environment, since the first boiling point temperature of the raised strip 20 decreases in the vacuum environment, the second temperature of the vaporized raised strip 20 also decreases, thereby further reducing the energy consumption of vaporizing the raised strip 20, that is, further achieving the effect of low energy consumption and low cost in preparing the sheet material 10.

[0154] In one embodiment, a plurality of protrusions 20 are vaporized in a vacuum environment at a second temperature, the difference between the second temperature and the first boiling point temperature of the protrusions 20 in a standard atmospheric pressure environment being greater than or equal to 100°C.

[0155] It should be noted that, in Figures 8-12 In the illustrated embodiment, the cross-sectional shape of the protrusion 20 and its corresponding microchannel 111 in the direction perpendicular to their extension is exemplified, but it is not limited to the fact that the cross-sectional shape of the protrusion 20 and its corresponding microchannel 111 in the direction perpendicular to their extension can only be rectangular. In other embodiments of this application, the cross-sectional shape of the protrusion 20 and its corresponding microchannel 111 may be adaptively adjusted according to actual design requirements or functional requirements of the microchannel 111, and this application does not impose any limitations on this.

[0156] One embodiment is also described below. Figure 13a and Figure 13b , Figure 13a This is a schematic diagram of the structure from one side of the protrusion 20 in one possible embodiment. Figure 13b for Figure 13a A schematic diagram of the structure of the microchannel 111 formed corresponding to the protrusion 20 in the illustrated embodiment, viewed from one side. (See diagram below.) Figure 13a As shown, the cross-sectional shape of the protrusion 20 perpendicular to its extension direction is triangular.

[0157] like Figure 13b As shown, when the cross-sectional shape of the protrusion 20 is triangular in the direction perpendicular to its extension, the cross-sectional shape of the microchannel 111 formed after the protrusion 20 is vaporized is triangular.

[0158] One embodiment is also described below. Figure 14a and Figure 14b , Figure 14a This is a schematic diagram of the structure from one side of the protrusion 20 in one possible embodiment. Figure 14b for Figure 14a A schematic diagram of the structure of the microchannel 111 formed corresponding to the protrusion 20 in the illustrated embodiment, viewed from one side. (See diagram below.) Figure 14a As shown, the cross-sectional shape of the protrusion 20 perpendicular to its own extension direction is arc-shaped.

[0159] like Figure 14b As shown, when the cross-sectional shape of the protrusion 20 is arc-shaped in the direction perpendicular to its extension, the cross-sectional shape of the microchannel 111 formed after the protrusion 20 is vaporized is arc-shaped.

[0160] One embodiment is also described below. Figure 15a and Figure 15b , Figure 15a This is a schematic diagram of the structure from one side of the protrusion 20 in one possible embodiment. Figure 15b for Figure 15a A schematic diagram of the structure of the microchannel 111 formed corresponding to the protrusion 20 in the illustrated embodiment, viewed from one side. (See diagram below.) Figure 15a As shown, the cross-sectional shape of the protrusion 20 perpendicular to its extension direction is trapezoidal.

[0161] like Figure 14b As shown, when the cross-sectional shape of the protrusion 20 is trapezoidal in the direction perpendicular to its extension, the cross-sectional shape of the microchannel 111 formed after the protrusion 20 is vaporized is trapezoidal.

[0162] In one embodiment, the cross-sectional shape of the protrusion 20 and the corresponding microchannel 111 can also be a combination of various shapes such as triangle, rectangle, arc, and trapezoid.

[0163] By setting the cross-sectional shape of the protrusion 20 perpendicular to its extension direction to be any one or more of rectangle, triangle, arc or trapezoid, the plate 10 prepared by the preparation method of the plate of this application has a triangular, arc or trapezoidal cross-sectional shape, thereby enabling the microchannel 111 of the plate 10 to meet different needs and improve the application range and applicability of the plate 10.

[0164] It should be noted that, in Figures 8-12 In the illustrated embodiments, the extension shape of the protrusion 20 and the corresponding microchannel 111 is exemplified by a straight line, but it is not limited to the protrusion 20 and the corresponding microchannel 111 being only straight lines. In other embodiments of this application, the extension shape of the protrusion 20 and the corresponding microchannel 111 may be adaptively adjusted according to actual design requirements or functional requirements of the microchannel 111, and this application does not impose any limitations on this.

[0165] One embodiment is also described below. Figure 16a and Figure 16b , Figure 16a This is a schematic diagram of the planar structure of the protrusion 20 in one possible embodiment. Figure 16b for Figure 16a A schematic diagram of the planar structure of the plate 10 in the illustrated embodiment. Figure 16a In the embodiment shown, the extended shape of the protrusion 20 is arc-shaped.

[0166] like Figure 16b As shown, after the adhesive layer 11 is covered and cured, the protrusion 20 is vaporized, and the extended shape of the microchannel 111 formed therein is arc-shaped.

[0167] One embodiment is also described below. Figure 17a and Figure 17b , Figure 17aThis is a schematic diagram of the planar structure of the protrusion 20 in one possible embodiment. Figure 17b for Figure 17a A schematic diagram of the planar structure of the plate 10 in the illustrated embodiment. Figure 17a In the embodiment shown, the extended shape of the protrusion 20 is wavy.

[0168] like Figure 17b As shown, after the adhesive layer 11 is covered and cured, the protrusion 20 is vaporized, and the extended shape of the microchannel 111 formed therein is wavy.

[0169] In one embodiment, the extended shape of the protrusion 20 can also be a zigzag shape, then the extended shape of the microchannel 111 formed after vaporization is also a zigzag shape (not shown in the figure).

[0170] By setting the extension shape of the protrusion 20 to any one of straight line, arc, wave or zigzag, the plate 10 prepared by the preparation method of the plate of this application has a corresponding extension shape of straight line, arc, wave or zigzag, thereby enabling the microchannel 111 of the plate 10 to meet different needs and improve the application range and applicability of the plate 10.

[0171] For example, in one possible embodiment, when the plate 10 is a heat dissipation plate, the extension shape of each microchannel 111 in the plate 10 is set to be a wave shape that is parallel to each other and spaced apart. Coolant is introduced into the microchannel 111 to achieve heat dissipation function, which can improve the heat dissipation effect and heat dissipation uniformity of the plate 10.

[0172] There are generally two methods for fabricating hollow microchannels: one is to use a carbon-based substrate template and remove the template by calcination to form a hollow microchannel; the other is to use silica microspheres as a substrate template and etch them using chemical solutions such as hydrofluoric acid to form a hollow microchannel. However, fabricating microchannels using calcination or chemical etching methods is energy-intensive, costly, and environmentally unfriendly.

[0173] This application forms microchannels 111 corresponding to each of the protrusions 20 by covering the protrusions 20 with the adhesive layer 11 and curing the adhesive layer 11. This ensures that the size and shape of the formed microchannels 111 meet the requirements.

[0174] By removing the protrusions 20 through vaporization, a hollow microchannel 111 can be formed. Furthermore, vaporization is a low-energy-consumption and simple-to-operate method, which reduces the cost of preparing the sheet material 10 and is environmentally friendly.

[0175] Furthermore, the sheet material 10 of this application is prepared by the sheet material preparation method provided in any of the above embodiments. Therefore, the sheet material 10 of this application has all the possible beneficial effects of the sheet material prepared by the sheet material preparation method in any of the above embodiments.

[0176] It should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of embodiments of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0177] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0178] It should be understood that the application of this application is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims. Those skilled in the art will understand that implementing all or part of the processes of the above embodiments, and making equivalent changes according to the claims of this application, still falls within the scope of this application.

Claims

1. A method for preparing a board material, characterized in that, Includes the following steps: Multiple protrusions are provided on a substrate, the multiple protrusions being parallel to each other and spaced apart; wherein, the material of the protrusions has a first boiling point temperature; An adhesive layer is formed to cover the plurality of protrusions, and the adhesive layer fills the gaps between adjacent protrusions and is bonded to the substrate; wherein the material of the adhesive layer has a second melting point temperature, the second melting point temperature being higher than the first boiling point temperature; The adhesive layer is cured at a first temperature; wherein the first temperature is lower than the first boiling point temperature; The plurality of protrusions are vaporized at a second temperature to form a plurality of parallel and spaced microchannels between the adhesive layer and the substrate; wherein the second temperature is higher than or equal to the first boiling point temperature and lower than the second melting point temperature.

2. The method for preparing the plate according to claim 1, characterized in that, The vaporization of the plurality of protrusions at a second temperature includes: The plurality of protrusions are vaporized in a vacuum environment at a second temperature.

3. The method for preparing the plate according to claim 1, characterized in that, The first boiling point temperature is between 100℃ and 250℃.

4. The method for preparing the plate according to claim 1, characterized in that, The process of creating an adhesive layer to cover the plurality of raised strips includes: The adhesive layer is made to cover the plurality of protrusions, with each of the protrusions having its opposite ends exposed in the adhesive layer along its own extension direction.

5. The method for preparing the plate according to any one of claims 1 to 4, characterized in that, The material of the raised strip includes at least one of paraffin, phenol, and DMSO.

6. The method for preparing the plate according to any one of claims 1 to 4, characterized in that, The provision of multiple raised strips on the substrate includes: An adhesive layer is disposed on a substrate; wherein the material of the adhesive layer is the same as the material of the protrusion, and the material of the adhesive layer has a first melting point temperature; The adhesive layer is imprinted using a mold; wherein the mold includes a plurality of recesses arranged parallel to each other and spaced apart, and the shape of each recess matches the shape of the protrusion; The adhesive layer is cured at a third temperature and the mold is removed to form the plurality of protrusions on the substrate; wherein the third temperature is lower than the first melting point temperature.

7. The method for preparing the plate according to claim 6, characterized in that, The method of using a mold to imprint the adhesive layer includes: The adhesive layer is imprinted using the mold, and a gap is left between the surface of the mold near the substrate and the substrate, the gap being filled with the adhesive layer; Then, after curing the adhesive layer at a third temperature and removing the mold, the process includes: The adhesive layer is etched away from the surface of the substrate to expose the substrate between two adjacent protrusions.

8. The method for preparing the plate according to claim 1, characterized in that, After curing the adhesive layer at the first temperature, the process includes: The adhesive layer and the protrusion are cut at opposite ends of the protrusion based on a preset length, so that the two opposite sides of the adhesive layer along the extension direction of the protrusion are parallel to each other.

9. The method for preparing the plate according to claim 1, characterized in that, The cross-sectional shape of the protrusion perpendicular to its extension direction is any one of rectangle, triangle, arc, or trapezoid.

10. The method for preparing the plate according to claim 9, characterized in that, The cross-sectional shape of the protrusion has a first width, which is 1~1000μm; And / or, along the direction in which the plurality of protrusions are arranged at intervals, there is a first spacing between two adjacent protrusions, the first spacing being 1~1000μm.

11. The method for preparing the plate according to claim 1, characterized in that, The extension length of the convex strip is greater than or equal to 10cm.

12. A type of board material, characterized in that, The board is prepared by the board preparation method according to any one of claims 1 to 11. The board includes a plurality of microchannels, each of the microchannels being independent of each other and arranged at intervals, along the plane direction of the board and perpendicular to the direction in which the plurality of microchannels are arranged at intervals, and each microchannel penetrating the board.

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