A fine-tuning bracket for semiconductor chip testing

Abstract

The present invention relates to the field of semiconductor chip testing technology, and more specifically, to a fine-tuning bracket for semiconductor chip testing. The bracket includes a bracket body, the bracket body includes a horizontal frame and a vertical frame, a test slot is provided inside the top of the horizontal frame, a plurality of pins are welded on the surface of the chip body, an enabling component is provided inside the test slot, and the enabling component includes a contact terminal. When the regulating mechanism drives the enabling component to be fine-tuned left and right, the fit between the contact terminal and the plurality of pins changes, and the change is used to detect the change in the performance of the chip body caused by the contact between the pin and the contact terminal. When the regulating mechanism is adjusted left and right, it can also drive the air circulation inside the test slot. The present invention drives the enabling component to adjust left and right through the regulating mechanism, and the contact terminal slides accordingly, and the influence of the fit urgency between the contact terminal and the pin and the contact area between the contact terminal and the pin on the performance of the chip body can be tested.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor chip testing, in particular to a fine-tuning bracket for semiconductor chip testing. Background Art

[0002] Semiconductor chip testing is a key link in the semiconductor chip production process. The existing semiconductor testing device uses a tester to press the chip into the groove of the SOCKET board on the PCB test board, so that the pins on the chip are connected to the contact terminals of the SOCKET board to form a path. There are many uncertainties and slight differences in the semiconductor manufacturing process. Even under the same production conditions, the performance of each semiconductor device may have slight deviations, so fine-tuning tests are required when testing semiconductor chips.

[0003] For example, the patent with announcement number CN207472910U discloses a fine-tuning bracket for semiconductor chip testing, including a machine fixing seat, a universal fixing base installed on the machine fixing seat, and an L-shaped bracket base arranged on the universal fixing base and movable left and right; a differential head fixing block is installed on the universal fixing base, and a transverse differential head used in conjunction with the differential head fixing block is arranged on the horizontal plate of the bracket base, and the transverse micrometer screw of the transverse differential head abuts against the differential head fixing block. The fine-tuning bracket of the utility model has a reasonable structure, and the principle operation is clear and simple; it is very convenient to operate, saving working time and improving work efficiency.

[0004] During the chip testing process, when the bracket is adjusted up and down, the relationship between the tightness of the fit between the chip pins and the contact terminals and the chip performance can be adjusted (due to many uncertainties and slight differences in the semiconductor manufacturing process, the tightness of the fit between the chip pins and the contact terminals will affect the chip connection performance. If the chip pins are loosely connected to the contact terminals, it is easy to cause poor chip contact. If the chip pins and contact terminals are over-tightened, a large stress will be generated at the connection between the pins and the contact terminals, which may cause the pins or terminals to crack or even break due to stress fatigue during use). When the bracket is adjusted left and right, the impact of the contact area between the chip pins and the contact terminals can be detected. The overall adjustment of the bracket will drive the groove to move. During the movement, the relative position change between the inner walls of the grooves can easily lead to space extrusion, causing the inner walls of the grooves to touch the fragile surface of the semiconductor chip, thereby causing scratches, indentations, and even cracks to the chip, seriously affecting the quality and performance of the chip.

[0005] At the same time, during the chip testing process, the chip is powered on and located inside the groove. If the heat generated by the chip power-on cannot be dissipated in time, it will affect the accuracy of the test results and the performance and life of the chip.

[0006] In view of this, we propose a fine-tuning bracket for semiconductor chip testing. Summary of the invention

[0007] The purpose of the present invention is to provide a fine-tuning bracket for semiconductor chip testing, which can achieve the effect of conducting pin power-on testing on the chip body, ensure the normal transmission of electrical signals, and at the same time verify the integrity of the chip function, thereby solving the problems raised in the above-mentioned background technology.

[0008] To achieve the above object, the present invention provides a fine-tuning bracket for semiconductor chip testing, comprising a bracket body, the bracket body comprising a horizontal frame and a vertical frame, a test slot is provided inside the top of the horizontal frame, the test slot is used to provide a test site for the chip body, a plurality of pins are welded on the surface of the chip body, and the characteristics are:

[0009] An enabling component for conducting a power-on test on the chip body is arranged inside the test slot, and the enabling component includes a fine-tuning cavity located at the upper end of the inner cavity of the test slot, an enabling plate is slidably arranged inside the fine-tuning cavity, and a contact terminal is etched on the top surface of the enabling plate;

[0010] The enabling plate is supported by a regulating mechanism. When the regulating mechanism drives the enabling plate to be fine-tuned left and right, the fit between the contact terminal and the plurality of pins changes. The enabling plate is adjusted to achieve the effect of detecting the chip body, and the contact between the chip body and the inner wall of the test slot is reduced.

[0011] When the regulating mechanism drives the enabling plate to adjust left and right, it can also drive the air circulation inside the test slot to dissipate heat for the chip body being powered on for testing.

[0012] As a further improvement of the technical solution, the regulating mechanism includes a regulating chamber opened at the bottom of the fine-tuning cavity, two micro screws are rotatably arranged inside the regulating chamber, and mounting parts are movably sleeved on the surfaces of the two micro screws, and one end of the mounting part away from the micro screw is connected to the enabling plate by clamping, and a balancing groove is opened on the inner wall of one side of the regulating chamber;

[0013] The mounting part includes two sleeve rods movably sleeved on the surface of the micro screw rod, the two sleeve rods are clamped with the enabling plate through a mounting block, a balance rod is connected between the two sleeve rods, a scale component is fixedly installed on one end of the balance rod, and the end of the balance rod close to the scale component passes through the balance slot and extends out of the surface of the cross plate frame.

[0014] As a further improvement of the technical solution, the contact terminal includes a plurality of copper sheets arranged on the surface of the enabling plate, the top ends of the plurality of copper sheets are all provided with protrusions, and the surfaces of the plurality of protrusions are all inclined and undulating.

[0015] As a further improvement of the technical solution, two lateral accommodating holes are provided on the inner walls on both sides of the fine-tuning cavity, and two ends of the enabling plate are fixedly connected to two lateral docking rods that fit the left and right inner walls of the lateral accommodating holes.

[0016] As a further improvement of the present technical solution, a central cavity is formed between two adjacent lateral docking rods, and an edge folding page is provided between the two central cavities, one end of the edge folding page is connected to the end of the enabling plate, and the other end of the edge folding page is connected to the inner wall of the fine-tuning cavity.

[0017] As a further improvement of the technical solution, the inner wall of the test slot is paved with an inner wall insulating member.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. In the fine-tuning bracket for semiconductor chip testing, when the chip body is supported by the suction cup to enter the interior of the test slot, the pins on the side end of the chip body can contact the contact terminals on the surface of the enabling component located inside the test slot, thereby achieving the effect of power-on testing of the pins of the chip body, ensuring the normal transmission of electrical signals, and at the same time, verifying the integrity of the chip function and discovering potential faults in advance.

[0020] 2. In the fine-tuning bracket used for semiconductor chip testing, the surface of the contact terminal is undulating. When the regulating mechanism drives the enabling component to adjust left and right, the contact terminal slides accordingly, and the degree of fit between the contact terminal and the pin and the contact area between the contact terminal and the pin can be tested to determine the influence of the chip performance.

[0021] 3. In the fine-tuning bracket used for semiconductor chip testing, while the enabling component is adjusted left and right, the air at its side end is squeezed against the inner wall of the test slot. The naturally formed airflow can effectively promote the air circulation in the test slot, take away the heat generated by the power-on test of the chip body, and ensure the stability and reliability of the chip body during the test process.

[0022] 4. In the fine-tuning bracket for semiconductor chip testing, the enabling component arranged inside the test slot is moved left and right. Compared with the prior art in which the bracket body is moved up and down and left and right, the chip body is less likely to touch the inner wall of the test slot, and the chip body is protected to a certain extent. At the same time, combined with the regulating mechanism, the adjustment amplitude can also be clearly displayed, providing clear and intuitive information for the inspectors, facilitating data recording and analysis, and providing a basis for subsequent optimization and improvement. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 This is a schematic diagram of the internal structure of the enabling board test slot of the present invention;

[0025] Figure 3 For the present invention Figure 1 A schematic diagram of the structure at A;

[0026] Figure 4 It is a schematic diagram of the cross-plate frame cutaway structure of the present invention;

[0027] Figure 5 For the present invention Figure 4 Schematic diagram of the structure at B;

[0028] Figure 6 It is a top view of the overall structure of the present invention;

[0029] Figure 7 It is a schematic diagram of the structure of the pin and the contact terminal fitting direction of the present invention;

[0030] Figure 8 It is a schematic diagram of the mounting structure of the present invention.

[0031] The meaning of each number in the figure is:

[0032] 1. Bracket body; 11. Horizontal frame; 12. Vertical frame; 13. Test slot; 10. Chip body; 101. Pins;

[0033] 2. Enabling component; 21. Enabling board; 22. Contact terminal; 221. Copper sheet; 222. Lug; 23. Fine-tuning cavity;

[0034] 3. Control mechanism; 31. Control chamber; 32. Mounting parts; 321. Balance rod; 322. Sleeve rod; 323. Mounting block; 33. Micro screw rod; 34. Balance slot; 35. Ruler parts;

[0035] 4. Lateral docking rod; 41. Lateral receiving socket;

[0036] 5. Middle cavity; 51. Edge folding pages;

[0037] 6. Inner wall insulation. DETAILED DESCRIPTION

[0038] The following will be combined with the accompanying drawings in the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Example 1

[0039] See also Figure 1 , Figure 2 and Figure 4 As shown, the purpose of this embodiment is to provide a fine-tuning bracket for semiconductor chip testing, including a bracket body 1, the bracket body 1 includes a horizontal frame 11 and a vertical frame 12, a test slot 13 is opened inside the top of the horizontal frame 11, the upper end of the inner cavity of the test slot 13 is a fine-tuning chamber 23, and the lower end of the inner cavity of the test slot 13 is a regulating chamber 31.

[0040] Among them, the test slot 13 is used to provide a testing place for the chip body 10. A plurality of pins 101 are welded on the surface of the chip body 10. An enabling component 2 for power-on testing of the chip body 10 is arranged inside the test slot 13. The enabling component 2 includes a fine-tuning cavity 23 opened inside the test slot 13. An enabling plate 21 is slidably arranged inside the fine-tuning cavity 23. The contact terminal 22 is located on the surface of the enabling plate 21. An electric wire is passed through the enabling plate 21 and connected to the contact terminal 22. The loop formed between the electric wire and the contact terminal 22 is connected to an external power supply, so that the contact terminal 22 is energized. When the chip body 10 needs to be tested, the chip body 10 is adsorbed and supported by a suction cup, and then the pins 101 at its side end are fitted with the contact terminal 22 to achieve the effect of power-on testing of the chip body 10.

[0041] When the regulating mechanism 3 drives the enabling plate 21 to be fine-tuned left and right, the fit between the contact terminal 22 and the plurality of pins 101 changes, which is used to detect the change in the performance of the chip body 10 caused by the contact condition between the pins 101 and the contact terminal 22. When the regulating mechanism 3 is adjusted left and right, it can also drive the air circulation inside the test slot 13 to dissipate heat for the chip body 10 that is being powered on for testing.

[0042] The regulating mechanism 3 includes a regulating chamber 31 opened at the bottom of the fine-tuning cavity 23. Two micro screws 33 are rotatably arranged inside the regulating chamber 31. The surfaces of the two micro screws 33 are movably sleeved with mounting parts 32. The end of the mounting part 32 away from the micro screw 33 is clamped and connected to the enabling plate 21. A balancing groove 34 is opened on the inner wall of one side of the regulating chamber 31.

[0043] The mounting member 32 includes two sleeve rods 322 movably sleeved on the surface of the micro screw 33. The two sleeve rods 322 are clamped with the enabling plate 21 via a mounting block 323. A balance rod 321 is connected between the two sleeve rods 322. A scale member 35 is fixedly mounted on one end of the balance rod 321. The end of the balance rod 321 close to the scale member 35 passes through the balance slot 34 and extends out of the surface of the cross plate frame 11.

[0044] See also Figure 4When the two micro screws 33 rotate at the same speed and in the same direction through the motor, the mounting part 32 sleeved on the surface of the micro screw 33 can be driven to slide horizontally in the fine-tuning cavity 23, thereby driving the enabling plate 21 and the contact terminal 22 set on the top thereof to move. As the contact terminal 22 moves, the fit between the pin 101 and the contact terminal 22 can be adjusted, so as to achieve the effect of testing the influence of the fit between the pin 101 and the contact terminal 22 on the performance of the chip body 10.

[0045] Combination Figure 8 It can be seen that the two sleeve rods 322 in the mounting part 32 are fixedly connected to the two mounting blocks 323, and the mounting blocks 323 are snap-connected to the enabling plate 21 (the snap-connection here can be set to a bayonet snap-connection, a reverse snap-connection, or other snap-connection methods, which is the prior art and will not be elaborated on, and is not shown in the figure). When testing different types of chip bodies 10, the enabling plate 21 can be replaced according to the number and position of the pins 101 in the chip body 10 to improve the overall applicability of the test bracket.

[0046] Further, combined with Figure 3 The upper and lower inner walls of the balancing groove 34 are in contact with the upper and lower surfaces of the balancing rod 321. Since the left and right movement of the mounting member 32 is achieved by rotating the micro screw 33, the micro screw 33 has a thread with a specific pitch. When the micro screw 33 rotates, the thread on its surface interacts with the thread structure inside the sleeve rod 322. Since the balancing rod 321 at the end of the mounting member 32 slides inside the balancing groove 34, the rotation direction of the mounting member 32 is restricted and cannot rotate with the micro screw 33. It can only move in a straight line along the axis direction of the micro screw 33, thereby making the enabling plate 21 in a stable state when moving. The enabling plate 21 moves stably, which can improve the accuracy of the test of the chip body 10. When the balancing rod 321 slides, the scale member 35 slides accordingly. Combined with the mark groove opened on the surface of the horizontal plate frame 11, the adjustment amplitude can be clearly displayed, which is more convenient for testers to record and analyze data.

[0047] Among them, the micro screw 33 is a miniaturized screw transmission device that can achieve precise linear motion control. Its surface pitch is small, and the pitch of the common micro screw 33 can be between 0.1 mm and 1 mm.

[0048] See also Figure 6 A middle cavity 5 is formed between two adjacent lateral docking rods 4 , and edge folding pages 51 are connected between the two sides of the enabling plate 21 and the inner wall of the fine-tuning cavity 23 , and the edge folding pages 51 are located inside the middle cavity 5 .

[0049] There is a certain gap between the left and right ends of the enabling plate 21 and the inner wall of the fine-tuning cavity 23. On the one hand, the installation position of the chip body 10 can be restricted, thereby reducing the chip body 10 from touching the inner wall of the test slot 13 when entering the test slot 13 for testing (when performing performance testing on the chip body 10, only the enabling plate 21 needs to be adjusted, and the entire bracket body 1 does not need to be adjusted, so that the position of the test slot 13 is fixed, thereby reducing the chip body 10 from touching the inner wall of the test slot 13). On the other hand, when the enabling plate 21 moves left and right, the edge folding page 51 can be driven to fold. As the edge folding page 51 is folded and squeezed, airflow is generated, which further enhances the gas flow effect inside the test slot 13, thereby effectively enhancing the cooling effect on the chip body 10.

[0050] In the prior art, the bracket body 1 is moved up and down and left and right to achieve the change of the fitting area between the test pin 101 and the contact terminal 22 and the compression degree of the pin 101 on the performance of the chip body 10. In view of this, the specific structure of the contact terminal 22 is disclosed in combination with the above structure. The contact terminal 22 includes a plurality of copper sheets 221 arranged on the surface of the enabling plate 21, and the tops of the plurality of copper sheets 221 are all provided with protrusions 222, and the surfaces of the plurality of protrusions 222 are all inclined and undulating.

[0051] See also Figure 7 As shown, when the enabling plate 21 moves left and right (wherein, the enabling plate 21 moves along the micro screw 33), the elastic pressure of the pin 101 itself can be adjusted through the undulating structure of the protrusion 222, so as to achieve the change of the performance of the chip body 10 caused by the tightness of the fit between the test pin 101 and the contact terminal 22. By increasing the left and right adjustment range of the enabling plate 21, the influence of the area of ​​fit between the pin 101 and the protrusion 222 on the performance of the chip body 10 can be detected. Therefore, only the enabling plate 21 is moved to achieve the effect of moving the bracket body 1 up and down and left and right, which simplifies the adjustment range. At the same time, only the enabling plate 21 is adjusted to avoid the overall movement of the bracket body 1, thereby reducing the situation where the chip body 10 touches the inner wall of the test slot 13 when the bracket body 1 is adjusted as a whole, thereby further protecting the chip body 10.

[0052] It should be disclosed that: the pin 101 is made of elastic metal material, and the tightness of the pin 101 and the contact terminal 22 is adjusted. This means that when the contact terminal 22 is adjusted left or right, elastic pressure can be applied to the pin 101 by means of the height difference on the surface of the protrusion 222 in the contact terminal 22, and the influence of the tightness between the pin 101 and the contact terminal 22 on the performance of the chip body 10 can be detected.

[0053] Considering that the enabling plate 21 and the mounting member 32 are mounted in a snap-fit ​​manner, during the test of the chip body 10, it is necessary to ensure the fine-tuning stability of the enabling plate 21. Therefore, in order to further improve the adjustment stability effect of the enabling plate 21, the Figure 5 As shown, two lateral docking rods 4 are fixedly connected to both ends of the enabling plate 21, and the side wall of the fine-tuning cavity 23 is provided with a lateral accommodating hole 41 which is horizontally fitted with the lateral docking rod 4, and the inner diameter of the lateral accommodating hole 41 is longer than the length of the lateral docking rod 4. When the enabling plate 21 is installed, the lateral docking rod 4 at one end is completely inserted into the lateral accommodating hole 41, and then the lateral docking rod 4 at the other end is aligned with the lateral accommodating hole 41 on the other side, and then the enabling plate 21 is moved toward the middle. At this time, the lateral docking rods 4 on both sides are respectively inserted into the lateral accommodating holes 41 on both sides, and then the enabling plate 21 can be snapped into the mounting member 32, which improves the overall stability of the enabling plate 21 without affecting the fine-tuning and installation process of the enabling plate 21.

[0054] The inner wall of the test slot 13 is paved with an inner wall insulating member 6 , which is preferably made of rubber material, so as to reduce signal interference, improve detection effect, and protect the chip body 10 .

[0055] In summary, the working principle of the present solution is as follows: when the chip body 10 needs to be tested, the chip body 10 is supported by the suction cup, and then the pin 101 at its side end is fitted with the contact terminal 22 to achieve the effect of power-on testing of the chip body 10. When the two micro-screws 33 are rotated at the same speed and in the same direction by the motor, the mounting part 32 sleeved on the surface of the micro-screw 33 can be driven to slide horizontally in the fine-tuning cavity 23, thereby driving the enabling plate 21 and the contact terminal 22 set on its top to move. In the process of moving left and right, the enabling plate 21 can adjust the position between the pin 101 and the protrusion 222. The tightness of the fit between the test pin 101 and the contact terminal 22 can be adjusted to achieve the change in the performance of the chip body 10 due to the tightness of the fit between the test pin 101 and the contact terminal 22. The enabling plate 21 is adjusted to the bottom end of the protrusion 222 to achieve the change in the performance of the chip body 10 due to the contact area between the test pin 101 and the protrusion 222. Therefore, only the enabling plate 21 is moved to achieve the effect of moving the bracket body 1 up and down and left and right, which simplifies the adjustment range. At the same time, only the enabling plate 21 is adjusted to reduce the situation where the chip body 10 touches the inner wall of the test slot 13, thereby further protecting the chip body 10.

[0056] When the mounting member 32 moves left and right, the balancing rod 321 can slide inside the balancing groove 34 to perform balance adjustment, which effectively improves the moving stability of the enabling plate 21, and then improves the accuracy of the chip body 10 test. When the balancing rod 321 slides, the scale member 35 slides accordingly. Combined with the scale groove opened on the surface of the cross plate frame 11, the adjustment range can be clearly displayed, which is more convenient for testers to record and analyze data. There is a certain gap between the left and right ends of the enabling plate 21 and the inner wall of the fine-tuning cavity 23. On the one hand, the installation position of the chip body 10 can be restricted to reduce the chip body 10 When entering the test groove 13 for testing, the situation of touching the inner wall of the test groove 13 is reduced. On the other hand, when the enabling plate 21 moves left and right, it drives the edge folding page 51 to fold. As the edge folding page 51 is folded and squeezed, airflow is generated, which further improves the gas flow effect inside the test groove 13, and effectively improves the cooling effect of the chip body 10.

[0057] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A fine-tuning bracket for semiconductor chip testing, comprising a bracket body (1), the bracket body (1) comprising a horizontal frame (11) and a vertical frame (12), a test slot (13) being provided inside the top of the horizontal frame (11), the test slot (13) being used to provide a testing location for the chip body (10), a plurality of pins (101) being welded on the surface of the chip body (10), characterized in that: An enabling component (2) for conducting an electrical test on the chip body (10) is disposed inside the test slot (13), the enabling component (2) comprising a fine-tuning cavity (23) located at the upper end of the inner cavity of the test slot (13), an enabling plate (21) being slidably disposed inside the fine-tuning cavity (23), and a contact terminal (22) being etched on the top surface of the enabling plate (21); The enabling plate (21) is supported by a regulating mechanism (3). When the regulating mechanism (3) drives the enabling plate (21) to be fine-tuned left and right, the fit between the contact terminal (22) and the plurality of pins (101) changes. The enabling plate (21) is adjusted to achieve the effect of detecting the chip body (10), thereby reducing the possibility of the chip body (10) contacting the inner wall of the test slot (13). When the regulating mechanism (3) drives the enabling plate (21) to adjust left and right, it can also drive the air inside the test slot (13) to circulate and circulate, thereby providing heat dissipation treatment for the chip body (10) being powered on for testing; The regulating mechanism (3) comprises a regulating chamber (31) disposed at the bottom of the fine-tuning cavity (23); two micro screws (33) are rotatably disposed inside the regulating chamber (31); mounting members (32) are movably sleeved on the surfaces of the two micro screws (33); one end of the mounting member (32) away from the micro screws (33) is snap-connected to the enabling plate (21); and a balancing groove (34) is disposed on one side of the inner wall of the regulating chamber (31); The mounting member (32) comprises two sleeve rods (322) movably sleeved on the surface of the micro screw rod (33); the two sleeve rods (322) are clamped with the enabling plate (21) via a mounting block (323); a balance rod (321) is connected between the two sleeve rods (322); a scale member (35) is fixedly mounted on one end of the balance rod (321); and an end of the balance rod (321) close to the scale member (35) passes through a balance slot (34) and extends out of the surface of the horizontal plate frame (11).

2. The fine-tuning bracket for semiconductor chip testing according to claim 1, characterized in that: The contact terminal (22) comprises a plurality of copper sheets (221) arranged on the surface of the enabling plate (21), the top ends of the plurality of copper sheets (221) are all provided with protruding sheets (222), and the surfaces of the plurality of protruding sheets (222) are all inclined and undulating.

3. The fine-tuning bracket for semiconductor chip testing according to claim 1, characterized in that: Two lateral accommodating holes (41) are provided on both inner walls of the fine-tuning cavity (23), and two lateral docking rods (4) that fit the left and right inner walls of the lateral accommodating holes (41) are fixedly connected to both ends of the enabling plate (21).

4. The fine-tuning bracket for semiconductor chip testing according to claim 3, characterized in that: A central cavity (5) is formed between two adjacent lateral docking rods (4), and an edge folding leaf (51) is provided between the two central cavities (5), one end of the edge folding leaf (51) is connected to the end of the enabling plate (21), and the other end of the edge folding leaf (51) is connected to the inner wall of the fine-tuning cavity (23).

5. The fine-tuning bracket for semiconductor chip testing according to claim 1, characterized in that: An inner wall insulating member (6) is provided on the inner wall of the test slot (13).

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