A traceable circuit board multi-level processing management method and system

Abstract

The invention discloses a traceable multi-level processing management method and system for circuit boards, which relates to the technical field of PCB board processing, including: decomposing a pressing scheme into at least one basic pressing step, decomposing a pressing operation parameter into at least one basic pressing parameter; decomposing an etching scheme into at least one basic etching step, decomposing an etching operation parameter into at least one basic etching parameter; establishing an influence model of the basic pressing step on inspection indicators, establishing an influence model of the basic etching step on inspection indicators; obtaining electrical abnormality data of abnormal electrical performance indicators and appearance abnormality data of abnormal appearance detection indicators; obtaining corrected pressing basic parameters and corrected etching basic parameters. By setting a scheme decomposition module, a model building module, a quality detection module and a parameter adjustment module, the associated steps can be quickly discovered, and the parameters of the corresponding steps can be adjusted to avoid affecting the processing efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB board processing, and in particular to a traceable circuit board multi-level processing management method and system. Background Art

[0002] In the electronics industry, circuit boards are common and important components. Due to their high density, high reliability, and excellent electrical performance, they are widely used in various electronic products.

[0003] With the development of processing technology, more and more manufacturers are using automated processing equipment to replace traditional processing equipment. By investing in automated processing equipment in the daily processing and production process, it helps to improve the production efficiency of enterprises. However, due to the lack of management concepts for automated processing equipment, the equipment management is often not in place. When problems occur in circuit board processing, it is impossible to conduct traceability analysis and timely make targeted parameter adjustments, which affects the processing efficiency. Summary of the invention

[0004] In order to solve the above technical problems, a traceable circuit board multi-level processing management method and system are provided. This technical solution solves the problem raised in the above background technology that due to the lack of management concepts for automated processing equipment, the equipment management is often not in place. When problems occur in circuit board processing, it is impossible to conduct traceability analysis and timely make targeted parameter adjustments, which affects the processing efficiency.

[0005] In order to achieve the above purpose, the technical solution adopted by the present invention is:

[0006] A traceable multi-level processing management method for circuit boards, comprising:

[0007] Obtain the design requirements of the circuit board, determine the type of board material, lamination scheme and etching scheme of the circuit board based on the design requirements, and determine the lamination operation parameters of the lamination scheme and the etching operation parameters of the etching scheme based on historical data;

[0008] During processing, the circuit board is pressed according to the pressing operation parameters, and the circuit board is etched according to the etching operation parameters;

[0009] Decomposing the pressing scheme into at least one basic pressing step, decomposing the pressing operation parameters into at least one basic pressing parameter, and pairing the basic pressing steps with the basic pressing parameters;

[0010] Decomposing the etching scheme into at least one etching basic step, decomposing the etching operation parameters into at least one etching basic parameter, and pairing the etching basic steps with the etching basic parameters;

[0011] Based on the historical data, at least one electrical performance index and at least one appearance inspection index of the circuit board are obtained, and the at least one electrical performance index and the at least one appearance inspection index are integrated as an inspection index;

[0012] Establish a model for the impact of the basic pressing steps on the inspection indicators, and establish a model for the impact of the basic etching steps on the inspection indicators;

[0013] During the quality inspection, at least one electrical performance index and at least one appearance inspection index are inspected, and the quality inspection of the processed circuit board is performed to obtain electrical abnormality data of abnormal electrical performance index and appearance abnormality data of abnormal appearance inspection index;

[0014] According to the influence model of the basic pressing step on the inspection index and the influence model of the basic etching step on the inspection index, the electrical abnormality data of the abnormal electrical performance index and the appearance abnormality data of the abnormal appearance detection index are adjusted to obtain the corrected pressing basic parameters and the corrected etching basic parameters;

[0015] The circuit board is processed according to the modified pressing basic parameters and the modified etching basic parameters.

[0016] Preferably, decomposing the pressing scheme into at least one basic pressing step and decomposing the pressing operation parameters into at least one basic pressing parameter comprises the following steps:

[0017] According to the laminating scheme, a continuous laminating action is formed, and the continuous laminating action is decomposed into at least one basic laminating action, and each basic laminating action completes one laminating operation;

[0018] Generate basic pressing steps according to basic pressing actions;

[0019] The overlapping parts of the parameters of the basic pressing step and the pressing operation parameters are used as the basic pressing parameters.

[0020] Preferably, the pairing of the basic pressing steps with the basic pressing parameters comprises the following steps:

[0021] Pair the Press Basic Parameters with the Press Basic Step that are consistent with the parameters performed by the Press Basic Step.

[0022] Preferably, decomposing the etching scheme into at least one basic etching step and decomposing the etching operation parameter into at least one basic etching parameter comprises the following steps:

[0023] The continuous etching process in which the etching parameters in the etching scheme are not changed is regarded as the basic etching step;

[0024] The part where the parameters of the etching basic step execution overlap with the etching operation parameters is taken as the etching basic parameters.

[0025] Preferably, the pairing of the etching basic steps with the etching basic parameters comprises the following steps:

[0026] Pair the etch base step with etch base parameters that are consistent with the parameters at which the etch base step is performed.

[0027] Preferably, the establishment of the influence model of the basic pressing steps on the inspection index comprises the following steps:

[0028] Under the condition that the basic pressing parameters of the basic pressing step are changed, obtaining the changed electrical performance index and appearance inspection index as the first electrical performance related index and the first appearance inspection related index;

[0029] Determine the lamination change range of the basic lamination parameters;

[0030] Under the condition that the change range of the pressing basic parameter of the pressing basic step is the pressing change range, a first electrical change reference value of the first electrical performance related index and a first appearance change reference value of the first appearance detection related index are obtained.

[0031] Preferably, the establishment of the influence model of the basic etching steps on the inspection index comprises the following steps:

[0032] Under the condition that the etching basic parameters of the etching basic step are changed, obtaining the changed electrical performance index and appearance inspection index as the second electrical performance related index and the second appearance inspection related index;

[0033] Determine the etching change range of the basic etching parameters;

[0034] Under the condition that the change amplitude of the etching basic parameter of the etching basic step is the etching change amplitude, a second electrical change reference value of the second electrical performance related index and a second appearance change reference value of the second appearance detection related index are obtained.

[0035] Preferably, the quality inspection of the processed circuit board includes the following steps:

[0036] During the inspection, electrical data of at least one electrical performance indicator and appearance data of at least one appearance inspection indicator are obtained;

[0037] Based on the historical data, obtaining electrical standard data of at least one electrical performance indicator and appearance standard data of at least one appearance inspection indicator;

[0038] Calculate the gap between the electrical data and the electrical standard data corresponding to the same electrical performance index to obtain the electrical gap value;

[0039] Determine whether the electrical gap value is greater than a preset value. If not, do not do anything. If yes, take the electrical performance index as an abnormal electrical performance index and the electrical data as electrical abnormal data.

[0040] Calculate the difference between the appearance data and the appearance standard data corresponding to the same appearance inspection index to obtain the appearance difference value;

[0041] Determine whether the difference between the appearance data corresponding to the same appearance detection index and the appearance standard data is greater than a preset value. If not, no processing is performed. If so, the appearance detection index is used as an abnormal appearance detection index and the appearance data is used as appearance abnormality data.

[0042] Preferably, the adjusting of the electrical abnormality data of the abnormal electrical performance index and the appearance abnormality data of the abnormal appearance detection index comprises the following steps:

[0043] In the impact model of the basic pressing steps on the inspection index, the basic pressing steps corresponding to the first electrical performance related index and the first appearance inspection related index that are consistent with the abnormal electrical performance index and the abnormal appearance inspection index are obtained as the target basic pressing steps;

[0044] Obtaining an electrical gap value corresponding to the abnormal electrical performance indicator, dividing the electrical gap value by a first electrical change reference value to obtain a first electrical change coefficient;

[0045] Obtaining an appearance difference value corresponding to the abnormal appearance detection index, and dividing the appearance difference value by a first appearance change reference value to obtain a first appearance change coefficient;

[0046] The first electrical change coefficient and the first appearance change coefficient are averaged and multiplied by the pressing change amplitude to obtain a first actual change amplitude;

[0047] Modifying the pressing basic parameters of the target pressing basic step according to the first actual change amplitude to obtain the modified pressing basic parameters;

[0048] In the influence model of the basic etching step on the inspection index, the basic etching step corresponding to the second electrical performance correlation index and the second appearance detection correlation index consistent with the abnormal electrical performance index and the abnormal appearance detection index is obtained as the target basic etching step;

[0049] Obtaining an electrical gap value corresponding to the abnormal electrical performance indicator, dividing the electrical gap value by a second electrical change reference value to obtain a second electrical change coefficient;

[0050] Obtaining an appearance difference value corresponding to the abnormal appearance detection index, and dividing the appearance difference value by a second appearance change reference value to obtain a second appearance change coefficient;

[0051] The second electrical change coefficient and the second appearance change coefficient are averaged and multiplied by the appearance change amplitude to obtain a second actual change amplitude;

[0052] The etching basic parameters of the target etching basic step are modified according to the second actual change amplitude to obtain the corrected etching basic parameters.

[0053] A traceable circuit board multi-stage processing management system, used to implement the above-mentioned traceable circuit board multi-stage processing management method, comprising:

[0054] A parameter acquisition module, wherein the parameter acquisition module determines the type of board material, the pressing scheme and the etching scheme of the circuit board, and determines the pressing operation parameters of the pressing scheme and the etching operation parameters of the etching scheme based on historical data;

[0055] A processing module, wherein the processing module performs a pressing process on the circuit board according to pressing operation parameters, and performs an etching process on the circuit board according to etching operation parameters;

[0056] A scheme decomposition module, wherein the scheme decomposition module decomposes the pressing scheme into at least one pressing basic step, decomposes the pressing operation parameter into at least one pressing basic parameter, and pairs the pressing basic step with the pressing basic parameter; decomposes the etching scheme into at least one etching basic step, decomposes the etching operation parameter into at least one etching basic parameter, and pairs the etching basic step with the etching basic parameter;

[0057] An index acquisition module, wherein the index acquisition module acquires at least one electrical performance index and at least one appearance inspection index of the circuit board;

[0058] A model building module, wherein the model building module builds a model of the influence of the basic pressing steps on the inspection index, and builds a model of the influence of the basic etching steps on the inspection index;

[0059] A quality inspection module, which performs quality inspection on the processed circuit board to obtain electrical abnormality data of abnormal electrical performance indicators and appearance abnormality data of abnormal appearance inspection indicators;

[0060] A parameter adjustment module, which adjusts the electrical abnormality data of the abnormal electrical performance index and the appearance abnormality data of the abnormal appearance detection index to obtain a corrected pressing basic parameter and a corrected etching basic parameter;

[0061] A correction processing module is used to process the circuit board according to the correction pressing basic parameters and the correction etching basic parameters.

[0062] Compared with the prior art, the present invention has the following beneficial effects:

[0063] By setting up a scheme decomposition module, a model building module, a quality inspection module and a parameter adjustment module, the scheme in the processing process is decomposed to obtain the basic pressing steps and the basic etching steps and the corresponding processing parameters, and the extent of change in the quality inspection index values ​​caused by the parameter changes in the basic pressing steps and the basic etching steps is determined. In this way, when the quality of the circuit board is abnormal, traceability analysis can be carried out, the related steps can be quickly discovered, and the parameters of the corresponding steps can be adjusted, so that the processing flow parameters can be adjusted in time to avoid affecting the processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0064] Figure 1 It is a schematic flow chart of the traceable multi-stage processing management method of circuit boards of the present invention;

[0065] Figure 2 It is a schematic diagram of decomposing the pressing scheme into at least one basic pressing step and decomposing the pressing operation parameters into at least one basic pressing parameter flow chart of the present invention;

[0066] Figure 3 It is a schematic diagram of decomposing an etching scheme into at least one basic etching step and decomposing an etching operation parameter into at least one basic etching parameter flow chart of the present invention;

[0067] Figure 4 It is a schematic flow chart of the model of the influence of the basic steps of lamination on the inspection indexes of the present invention;

[0068] Figure 5 A schematic flow chart of a model for establishing the influence of basic etching steps on inspection indicators according to the present invention;

[0069] Figure 6 It is a schematic diagram of the quality inspection process of the processed circuit board according to the present invention;

[0070] Figure 7 It is a schematic diagram of a flow chart of adjusting the electrical abnormality data of the abnormal electrical performance index and the appearance abnormality data of the abnormal appearance detection index according to the present invention. DETAILED DESCRIPTION

[0071] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art may think of other obvious variations.

[0072] Reference Figure 1 As shown, a traceable multi-level processing management method for circuit boards includes:

[0073] Obtain the design requirements of the circuit board, determine the type of board material, lamination scheme and etching scheme of the circuit board based on the design requirements, and determine the lamination operation parameters of the lamination scheme and the etching operation parameters of the etching scheme based on historical data;

[0074] During processing, the circuit board is pressed according to the pressing operation parameters, and the circuit board is etched according to the etching operation parameters;

[0075] Decomposing the pressing scheme into at least one basic pressing step, decomposing the pressing operation parameters into at least one basic pressing parameter, and pairing the basic pressing steps with the basic pressing parameters;

[0076] Decomposing the etching scheme into at least one etching basic step, decomposing the etching operation parameters into at least one etching basic parameter, and pairing the etching basic steps with the etching basic parameters;

[0077] Based on the historical data, at least one electrical performance index and at least one appearance inspection index of the circuit board are obtained, and the at least one electrical performance index and the at least one appearance inspection index are integrated as an inspection index;

[0078] Establish a model for the impact of the basic pressing steps on the inspection indicators, and establish a model for the impact of the basic etching steps on the inspection indicators;

[0079] During the quality inspection, at least one electrical performance index and at least one appearance inspection index are inspected, and the quality inspection of the processed circuit board is performed to obtain electrical abnormality data of abnormal electrical performance index and appearance abnormality data of abnormal appearance inspection index;

[0080] According to the influence model of the basic pressing step on the inspection index and the influence model of the basic etching step on the inspection index, the electrical abnormality data of the abnormal electrical performance index and the appearance abnormality data of the abnormal appearance detection index are adjusted to obtain the corrected pressing basic parameters and the corrected etching basic parameters;

[0081] The circuit board is processed according to the modified pressing basic parameters and the modified etching basic parameters.

[0082] Reference Figure 2 As shown, decomposing the pressing scheme into at least one basic pressing step and decomposing the pressing operation parameters into at least one basic pressing parameter comprises the following steps:

[0083] According to the laminating scheme, a continuous laminating action is formed, and the continuous laminating action is decomposed into at least one basic laminating action, and each basic laminating action completes one laminating operation;

[0084] Generate basic pressing steps according to basic pressing actions;

[0085] The overlapping parts of the parameters of the basic pressing step and the pressing operation parameters are used as the basic pressing parameters.

[0086] The pressing scheme includes multiple processes, and each process has different corresponding parameters. Therefore, when there is a problem with the finished circuit board product, it means that the processing parameters are abnormal and need to be adjusted. However, since the usual management method does not decompose the pressing scheme, it is necessary to check and debug repeatedly to complete the parameter adjustment, which will greatly increase the adjustment time. Therefore, in order to facilitate traceability, the pressing scheme is decomposed into at least one basic pressing step. When adjusting, the corresponding steps are adjusted for parameters to reduce time.

[0087] Pairing the basic steps of pressing with the basic parameters of pressing includes the following steps:

[0088] Pair the Press Basic Parameters with the Press Basic Step that are consistent with the parameters performed by the Press Basic Step.

[0089] Reference Figure 3 As shown, decomposing the etching scheme into at least one basic etching step, and decomposing the etching operation parameters into at least one basic etching parameter comprises the following steps:

[0090] The continuous etching process in which the etching parameters in the etching scheme are not changed is regarded as the basic etching step;

[0091] The part where the parameters of the etching basic step execution overlap with the etching operation parameters is taken as the etching basic parameters.

[0092] The etching plan includes multiple processes, and each process has different corresponding parameters. Therefore, when there is a problem with the finished product of the circuit board, it means that the processing parameters are abnormal and need to be adjusted. However, since the usual management method does not decompose the etching plan, it is necessary to check and debug repeatedly to complete the parameter adjustment, which will greatly increase the adjustment time. Therefore, in order to facilitate traceability, the etching plan is decomposed into at least one basic etching step. When adjusting, the corresponding steps are adjusted for parameters to reduce the time.

[0093] Pairing the etching basic steps with the etching basic parameters includes the following steps:

[0094] Pair the etch base step with etch base parameters that are consistent with the parameters at which the etch base step is performed.

[0095] Reference Figure 4 As shown in the figure, establishing the influence model of the basic pressing steps on the inspection indicators includes the following steps:

[0096] Under the condition that the basic pressing parameters of the basic pressing step are changed, obtaining the changed electrical performance index and appearance inspection index as the first electrical performance related index and the first appearance inspection related index;

[0097] Determine the lamination change range of the basic lamination parameters;

[0098] Under the condition that the change range of the pressing basic parameter of the pressing basic step is the pressing change range, a first electrical change reference value of the first electrical performance related index and a first appearance change reference value of the first appearance detection related index are obtained.

[0099] The purpose of establishing a model of the impact of the basic pressing steps on inspection indicators is to determine the degree of change of related indicators caused by parameter changes in the basic pressing steps. Therefore, the parameter change value of the basic pressing steps can be determined according to the actual demand for changes in related indicators, and then corresponding adjustments can be made to complete the parameter adjustment.

[0100] Reference Figure 5 As shown, establishing the influence model of the basic etching steps on the inspection indicators includes the following steps:

[0101] Under the condition that the etching basic parameters of the etching basic step are changed, obtaining the changed electrical performance index and appearance inspection index as the second electrical performance related index and the second appearance inspection related index;

[0102] Determine the etching change range of the basic etching parameters;

[0103] Under the condition that the change amplitude of the etching basic parameter of the etching basic step is the etching change amplitude, a second electrical change reference value of the second electrical performance related index and a second appearance change reference value of the second appearance detection related index are obtained.

[0104] The purpose of establishing a model of the impact of the basic etching steps on inspection indicators is to determine the degree of change of the related indicators caused by the parameter changes of the basic etching steps. Therefore, the parameter change value of the basic etching steps can be determined according to the actual demand for changes in the related indicators, and then corresponding adjustments can be made to complete the parameter adjustment.

[0105] Among them, the basic step of pressing and the basic step of etching have different focuses, so their associated indicators are different.

[0106] Reference Figure 6 As shown, the quality inspection of the processed circuit board includes the following steps:

[0107] During the inspection, electrical data of at least one electrical performance indicator and appearance data of at least one appearance inspection indicator are obtained;

[0108] Based on the historical data, obtaining electrical standard data of at least one electrical performance indicator and appearance standard data of at least one appearance inspection indicator;

[0109] Calculate the gap between the electrical data and the electrical standard data corresponding to the same electrical performance index to obtain the electrical gap value;

[0110] Determine whether the electrical gap value is greater than a preset value. If not, do not do anything. If yes, take the electrical performance index as an abnormal electrical performance index and the electrical data as electrical abnormal data.

[0111] Calculate the difference between the appearance data and the appearance standard data corresponding to the same appearance inspection index to obtain the appearance difference value;

[0112] Determine whether the difference between the appearance data corresponding to the same appearance detection index and the appearance standard data is greater than a preset value. If not, no processing is performed. If so, the appearance detection index is used as an abnormal appearance detection index and the appearance data is used as appearance abnormality data.

[0113] The purpose of the detection is to determine the abnormal electrical performance indicators and abnormal appearance detection indicators of the circuit board after processing is completed. Therefore, according to the steps associated with the abnormal electrical performance indicators and the abnormal appearance detection indicators, the parameters of the corresponding steps are adjusted, so that the values ​​of the abnormal electrical performance indicators and the abnormal appearance detection indicators can be restored to the normal range.

[0114] Reference Figure 7 As shown, adjusting the electrical abnormality data of the abnormal electrical performance index and the appearance abnormality data of the abnormal appearance detection index includes the following steps:

[0115] In the impact model of the basic pressing steps on the inspection index, the basic pressing steps corresponding to the first electrical performance related index and the first appearance inspection related index that are consistent with the abnormal electrical performance index and the abnormal appearance inspection index are obtained as the target basic pressing steps;

[0116] Obtaining an electrical gap value corresponding to the abnormal electrical performance indicator, dividing the electrical gap value by a first electrical change reference value to obtain a first electrical change coefficient;

[0117] Obtaining an appearance difference value corresponding to the abnormal appearance detection index, and dividing the appearance difference value by a first appearance change reference value to obtain a first appearance change coefficient;

[0118] The first electrical change coefficient and the first appearance change coefficient are averaged and multiplied by the pressing change amplitude to obtain a first actual change amplitude;

[0119] Modifying the pressing basic parameters of the target pressing basic step according to the first actual change amplitude to obtain the modified pressing basic parameters;

[0120] In the influence model of the basic etching step on the inspection index, the basic etching step corresponding to the second electrical performance correlation index and the second appearance detection correlation index consistent with the abnormal electrical performance index and the abnormal appearance detection index is obtained as the target basic etching step;

[0121] Obtaining an electrical gap value corresponding to the abnormal electrical performance indicator, dividing the electrical gap value by a second electrical change reference value to obtain a second electrical change coefficient;

[0122] Obtaining an appearance difference value corresponding to the abnormal appearance detection index, and dividing the appearance difference value by a second appearance change reference value to obtain a second appearance change coefficient;

[0123] The second electrical change coefficient and the second appearance change coefficient are averaged and multiplied by the appearance change amplitude to obtain a second actual change amplitude;

[0124] The etching basic parameters of the target etching basic step are modified according to the second actual change amplitude to obtain the corrected etching basic parameters.

[0125] Since the basic pressing step and the basic etching step have different focuses, their associated indicators are different. Therefore, the parameter adjustment is divided into two parts. Since the influence model of the basic pressing step on the inspection indicator and the influence model of the basic etching step on the inspection indicator respectively provide the change values ​​of the associated indicators under the change amplitude of pressing and the change amplitude of etching, the change coefficient can be determined according to the actual electrical gap value and the appearance gap value, thereby, the corrected basic pressing parameters and the corrected basic etching parameters are obtained, and for the indicators without abnormalities, the original parameters of the corrected basic pressing parameters and the corrected basic etching parameters remain consistent.

[0126] A traceable circuit board multi-stage processing management system, used to implement the above-mentioned traceable circuit board multi-stage processing management method, comprising:

[0127] A parameter acquisition module, wherein the parameter acquisition module determines the type of board material, the pressing scheme and the etching scheme of the circuit board, and determines the pressing operation parameters of the pressing scheme and the etching operation parameters of the etching scheme based on historical data;

[0128] A processing module, wherein the processing module performs a pressing process on the circuit board according to pressing operation parameters, and performs an etching process on the circuit board according to etching operation parameters;

[0129] A scheme decomposition module, wherein the scheme decomposition module decomposes the pressing scheme into at least one pressing basic step, decomposes the pressing operation parameter into at least one pressing basic parameter, and pairs the pressing basic step with the pressing basic parameter; decomposes the etching scheme into at least one etching basic step, decomposes the etching operation parameter into at least one etching basic parameter, and pairs the etching basic step with the etching basic parameter;

[0130] An index acquisition module, wherein the index acquisition module acquires at least one electrical performance index and at least one appearance inspection index of the circuit board;

[0131] A model building module, wherein the model building module builds a model of the influence of the basic pressing steps on the inspection index, and builds a model of the influence of the basic etching steps on the inspection index;

[0132] A quality inspection module, which performs quality inspection on the processed circuit board to obtain electrical abnormality data of abnormal electrical performance indicators and appearance abnormality data of abnormal appearance inspection indicators;

[0133] A parameter adjustment module, which adjusts the electrical abnormality data of the abnormal electrical performance index and the appearance abnormality data of the abnormal appearance detection index to obtain a corrected pressing basic parameter and a corrected etching basic parameter;

[0134] A correction processing module is used to process the circuit board according to the correction pressing basic parameters and the correction etching basic parameters.

[0135] Furthermore, the present solution also proposes a storage medium on which a computer-readable program is stored, and when the computer-readable program is called, the above-mentioned traceable multi-level processing management method for circuit boards is executed.

[0136] It is understandable that the storage medium may be a magnetic medium, such as a floppy disk, a hard disk, or a magnetic tape; an optical medium, such as a DVD; or a semiconductor medium, such as a solid state drive (SSD).

[0137] In summary, the advantages of the present invention are: by setting a scheme decomposition module, a model building module, a quality detection module and a parameter adjustment module, the scheme in the processing process is decomposed to obtain the basic pressing steps and the basic etching steps and the corresponding processing parameters, and the change range of the quality detection index value caused by the parameter change of the basic pressing steps and the basic etching steps is determined, so that when the quality of the circuit board is abnormal, traceability analysis can be performed, the related steps can be quickly discovered, and the parameters of the corresponding steps can be adjusted, so that the processing flow parameters can be adjusted in time to avoid affecting the processing efficiency.

[0138] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions only describe the principles of the present invention. The present invention may be subject to various changes and improvements without departing from the spirit and scope of the present invention. These changes and improvements fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the attached claims and their equivalents.

Claims

1. A traceable multi-level processing management method for circuit boards, characterized in that: include: Obtain the design requirements of the circuit board, determine the type of board material, lamination scheme and etching scheme of the circuit board based on the design requirements, and determine the lamination operation parameters of the lamination scheme and the etching operation parameters of the etching scheme based on historical data; During processing, the circuit board is pressed according to the pressing operation parameters, and the circuit board is etched according to the etching operation parameters; Decomposing the pressing scheme into at least one basic pressing step, decomposing the pressing operation parameters into at least one basic pressing parameter, and pairing the basic pressing steps with the basic pressing parameters; Decomposing the etching scheme into at least one etching basic step, decomposing the etching operation parameters into at least one etching basic parameter, and pairing the etching basic steps with the etching basic parameters; Based on the historical data, at least one electrical performance index and at least one appearance inspection index of the circuit board are obtained, and the at least one electrical performance index and the at least one appearance inspection index are integrated as an inspection index; Establish a model for the impact of the basic pressing steps on the inspection indicators, and establish a model for the impact of the basic etching steps on the inspection indicators; During the quality inspection, at least one electrical performance index and at least one appearance inspection index are inspected, and the quality inspection of the processed circuit board is performed to obtain electrical abnormality data of abnormal electrical performance index and appearance abnormality data of abnormal appearance inspection index; According to the influence model of the basic pressing step on the inspection index and the influence model of the basic etching step on the inspection index, the electrical abnormality data of the abnormal electrical performance index and the appearance abnormality data of the abnormal appearance detection index are adjusted to obtain the corrected pressing basic parameters and the corrected etching basic parameters; Process the circuit board according to the modified basic parameters of lamination and the modified basic parameters of etching; Decomposing the etching scheme into at least one basic etching step and decomposing the etching operation parameter into at least one basic etching parameter comprises the following steps: The continuous etching process in which the etching parameters in the etching scheme are not changed is regarded as the basic etching step; The overlap between the parameters of the etching basic step execution and the etching operation parameters is used as the etching basic parameters; The pairing of the etching basic steps with the etching basic parameters comprises the following steps: Pairing etching basic parameters consistent with parameters performed by the etching basic step with the etching basic step; The establishment of the influence model of the basic etching steps on the inspection index comprises the following steps: Under the condition that the etching basic parameters of the etching basic step are changed, obtaining the changed electrical performance index and appearance inspection index as the second electrical performance related index and the second appearance inspection related index; Determine the etching change range of the basic etching parameters; Under the condition that the change amplitude of the etching basic parameter of the etching basic step is the etching change amplitude, a second electrical change reference value of the second electrical performance related index and a second appearance change reference value of the second appearance detection related index are obtained.

2. A traceable multi-level processing management method for circuit boards according to claim 1, characterized in that: Decomposing the pressing scheme into at least one basic pressing step and decomposing the pressing operation parameters into at least one basic pressing parameter comprises the following steps: According to the laminating scheme, a continuous laminating action is formed, and the continuous laminating action is decomposed into at least one basic laminating action, and each basic laminating action completes one laminating operation; Generate basic pressing steps according to basic pressing actions; The overlapping parts of the parameters of the basic pressing step and the pressing operation parameters are used as the basic pressing parameters.

3. A traceable circuit board multi-stage processing management method according to claim 2, characterized in that: The pairing of the basic pressing steps with the basic pressing parameters comprises the following steps: Pair the Press Basic Parameters with the Press Basic Step that are consistent with the parameters performed by the Press Basic Step.

4. A traceable circuit board multi-stage processing management method according to claim 3, characterized in that: The establishment of the influence model of the basic pressing steps on the inspection index comprises the following steps: Under the condition that the basic pressing parameters of the basic pressing step are changed, obtaining the changed electrical performance index and appearance inspection index as the first electrical performance related index and the first appearance inspection related index; Determine the lamination change range of the basic lamination parameters; Under the condition that the change range of the pressing basic parameter of the pressing basic step is the pressing change range, a first electrical change reference value of the first electrical performance related index and a first appearance change reference value of the first appearance detection related index are obtained.

5. A traceable multi-stage processing management method for circuit boards according to claim 4, characterized in that: The quality inspection of the processed circuit board comprises the following steps: During the inspection, electrical data of at least one electrical performance indicator and appearance data of at least one appearance inspection indicator are obtained; Based on the historical data, obtaining electrical standard data of at least one electrical performance indicator and appearance standard data of at least one appearance inspection indicator; Calculate the gap between the electrical data and the electrical standard data corresponding to the same electrical performance index to obtain the electrical gap value; Determine whether the electrical gap value is greater than a preset value. If not, do not do anything. If yes, take the electrical performance index as an abnormal electrical performance index and the electrical data as electrical abnormal data. Calculate the difference between the appearance data and the appearance standard data corresponding to the same appearance inspection index to obtain the appearance difference value; Determine whether the difference between the appearance data corresponding to the same appearance detection index and the appearance standard data is greater than a preset value. If not, no processing is performed. If so, the appearance detection index is used as an abnormal appearance detection index and the appearance data is used as appearance abnormality data.

6. A traceable multi-stage processing management method for circuit boards according to claim 5, characterized in that: The adjusting of the electrical abnormality data of the abnormal electrical performance index and the appearance abnormality data of the abnormal appearance detection index comprises the following steps: In the impact model of the basic pressing steps on the inspection index, the basic pressing steps corresponding to the first electrical performance related index and the first appearance inspection related index that are consistent with the abnormal electrical performance index and the abnormal appearance inspection index are obtained as the target basic pressing steps; Obtaining an electrical gap value corresponding to the abnormal electrical performance indicator, dividing the electrical gap value by a first electrical change reference value to obtain a first electrical change coefficient; Obtaining an appearance difference value corresponding to the abnormal appearance detection index, and dividing the appearance difference value by a first appearance change reference value to obtain a first appearance change coefficient; The first electrical change coefficient and the first appearance change coefficient are averaged and multiplied by the pressing change amplitude to obtain a first actual change amplitude; Modifying the pressing basic parameters of the target pressing basic step according to the first actual change amplitude to obtain the modified pressing basic parameters; In the influence model of the basic etching step on the inspection index, the basic etching step corresponding to the second electrical performance correlation index and the second appearance detection correlation index consistent with the abnormal electrical performance index and the abnormal appearance detection index is obtained as the target basic etching step; Obtaining an electrical gap value corresponding to the abnormal electrical performance indicator, dividing the electrical gap value by a second electrical change reference value to obtain a second electrical change coefficient; Obtaining an appearance difference value corresponding to the abnormal appearance detection index, and dividing the appearance difference value by a second appearance change reference value to obtain a second appearance change coefficient; The second electrical change coefficient and the second appearance change coefficient are averaged and multiplied by the appearance change amplitude to obtain a second actual change amplitude; The etching basic parameters of the target etching basic step are modified according to the second actual change amplitude to obtain the corrected etching basic parameters.

7. A traceable circuit board multi-stage processing management system, used to implement the traceable circuit board multi-stage processing management method as claimed in any one of claims 1 to 6, characterized in that: include: A parameter acquisition module, wherein the parameter acquisition module determines the type of board material, the pressing scheme and the etching scheme of the circuit board, and determines the pressing operation parameters of the pressing scheme and the etching operation parameters of the etching scheme based on historical data; A processing module, wherein the processing module performs a pressing process on the circuit board according to pressing operation parameters, and performs an etching process on the circuit board according to etching operation parameters; A scheme decomposition module, wherein the scheme decomposition module decomposes the pressing scheme into at least one pressing basic step, decomposes the pressing operation parameter into at least one pressing basic parameter, and pairs the pressing basic step with the pressing basic parameter; decomposes the etching scheme into at least one etching basic step, decomposes the etching operation parameter into at least one etching basic parameter, and pairs the etching basic step with the etching basic parameter; An index acquisition module, wherein the index acquisition module acquires at least one electrical performance index and at least one appearance inspection index of the circuit board; A model building module, wherein the model building module builds a model of the influence of the basic pressing steps on the inspection index, and builds a model of the influence of the basic etching steps on the inspection index; A quality inspection module, which performs quality inspection on the processed circuit board to obtain electrical abnormality data of abnormal electrical performance indicators and appearance abnormality data of abnormal appearance inspection indicators; A parameter adjustment module, which adjusts the electrical abnormality data of the abnormal electrical performance index and the appearance abnormality data of the abnormal appearance detection index to obtain a corrected pressing basic parameter and a corrected etching basic parameter; A correction processing module is used to process the circuit board according to the correction pressing basic parameters and the correction etching basic parameters.

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