Ultrasonic embossing device and method for micro-nano array structure processing

Abstract

An ultrasonic embossing device and method for processing micro-nano array structures belongs to the field of fine processing technology for micro-nano array structures, and particularly relates to efficient micro-nano array structure processing for cross-scale functional surfaces. This device addresses the high cost, complex process, and poor surface quality issues associated with using existing embossing equipment to achieve cross-scale, multi-dimensional array microstructures on irregularly shaped surfaces. The device comprises a three-degree-of-freedom ultrasonic manipulator, a contact-type embossing mold, a sensing component, a six-degree-of-freedom platform, a structural support component, and a micro-displacement adjustment stage. The three-degree-of-freedom ultrasonic manipulator is used to manipulate the contact-type embossing mold for ultrasonic embossing, providing coordinated control of the embossing depth and force during the ultrasonic embossing process. The ultrasonic embossing device and method for processing micro-nano array structures are suitable for ultrasonic embossing of micro-nano array structures.

Description

Technical Field

[0001] The present invention relates to the technical field of fine processing of micro-nano array structures, and in particular to the efficient processing of micro-nano array structures of cross-scale functional surfaces. Background Art

[0002] Micro-nano array structures (also known as microstructure arrays, array microstructures, microstructured functional surfaces, or array microstructured functional surfaces) can impart unique properties to devices based on the inherent properties of materials, such as self-cleaning, anti-reflection, and adsorption. These structures have important applications in biomedicine, precision optics, and optoelectronic communications. Therefore, the fabrication of large-scale, high-precision, and low-cost array microstructured functional surfaces is of great significance.

[0003] Since the micro-nano array structure has complex array microstructure characteristics, traditional multi-axis precision milling machines cannot meet the needs of fine processing.

[0004] Although photolithography processing technology can produce complex micro-nano array structures, its equipment cost is high, the process is complex, and the processing efficiency is low, so its application range is not wide.

[0005] Imprinting technology has the advantages of high processing precision and simple operation. However, if existing imprinting equipment is used to realize the imprint processing of cross-scale multi-dimensional array microstructures on irregular curved surfaces, there are problems such as high cost, complex process and poor surface quality.

[0006] However, with the development of science and technology, optical equipment requires faster and more accurate tracking and aiming characteristics, and advanced imaging devices are required to have both higher surface quality and more complex array features (that is, micro-nano array structures need to be processed on special-shaped curved surfaces). The existing imprint processing technology cannot meet this demand. Summary of the Invention

[0007] The present invention proposes an ultrasonic embossing device and method for processing micro-nano array structures, which solves the problems of high cost, complex process and poor surface quality in the embossing process of cross-scale multi-dimensional array microstructures on irregular curved surfaces using existing embossing equipment.

[0008] The ultrasonic embossing device for processing micro-nano array structures described in the present invention has the following technical solutions:

[0009] The device comprises: a three-degree-of-freedom ultrasonic manipulator, a contact-type imprinting mold, a sensor detection component, a six-degree-of-freedom platform, a structural support component, and a micro-displacement adjustment platform;

[0010] The six-degree-of-freedom platform is used to place the sample to be processed and is also used to adjust the position and posture of the sample to be processed to perform indexing motion control;

[0011] One end of the three-degree-of-freedom ultrasonic manipulator is fixedly connected to one end of the micro-displacement adjustment platform; the other end of the micro-displacement adjustment platform is fixedly connected to the structural support component; the other end of the three-degree-of-freedom ultrasonic manipulator is detachably connected to the contact imprint mold;

[0012] The contact-type imprinting mold has a surface microstructure, and the surface microstructure is used to generate an interaction force with the surface of the sample to be processed to perform ultrasonic imprint processing;

[0013] The three-degree-of-freedom ultrasonic manipulator is used to replace the contact imprint mold with the corresponding surface microstructure according to the micro-nano array structure to be processed, and is also used to manipulate the contact imprint mold to perform ultrasonic imprint processing, and to coordinately control the imprint depth and imprint force during the ultrasonic imprint processing;

[0014] The micro-displacement adjustment stage is used to adjust the distance between the contact imprinting mold and the surface of the sample to be processed;

[0015] The sensing detection component is used to detect parameter data in the ultrasonic embossing process in real time and feed the parameter data back to the three-degree-of-freedom ultrasonic manipulator and the six-degree-of-freedom platform.

[0016] Furthermore, a preferred embodiment is provided, wherein the three-degree-of-freedom ultrasonic manipulator is used to generate ultrasonic linear vibrations in three degrees of freedom: axial vibration, horizontal lateral vibration, and horizontal longitudinal vibration; wherein:

[0017] The axial vibration is parallel to the embossing direction and is used to control the embossing depth during the ultrasonic embossing process;

[0018] The horizontal lateral vibration and the horizontal longitudinal vibration are perpendicular to the imprinting direction, and are used to generate ultrasonic vibration friction between the surface microstructure of the contact imprinting mold and the surface of the sample to be processed, so as to perform vibration-assisted imprinting.

[0019] Furthermore, a preferred embodiment is provided, wherein the three-degree-of-freedom ultrasonic manipulator comprises a support base, a piezoelectric element and a tool control end; the support base and the tool control end are respectively located at two ends of the piezoelectric element;

[0020] The support base is fixedly connected to one end of the micro-displacement adjustment platform;

[0021] The tool control end is detachably connected to the contact-type imprinting mold;

[0022] The piezoelectric element is formed by stacking multiple piezoelectric ceramic sheets, each of which has four partitions, and the partitions of the multiple piezoelectric ceramic sheets are aligned one by one;

[0023] The piezoelectric element is used to achieve longitudinal vibration and bending vibration deformation through zoned excitation.

[0024] Furthermore, a preferred embodiment is provided, in which the tool control end adopts a variable amplitude rod structure for amplifying the particle displacement or speed of the mechanical vibration of the end, maintaining the amplitude stable, and improving the processing accuracy.

[0025] Furthermore, a preferred embodiment is provided, wherein the six-degree-of-freedom platform is used to drive the sample to be processed to move in six degrees of freedom directions;

[0026] The six degrees of freedom of motion include:

[0027] Translational movement along the X-axis, rotational movement around the X-axis, translational movement along the Y-axis, rotational movement around the Y-axis, translational movement along the Z-axis, and rotational movement around the Z-axis;

[0028] The movements in the six degrees of freedom are decoupled from each other and controlled independently.

[0029] Furthermore, a preferred embodiment is provided, wherein the six-degree-of-freedom platform is a six-degree-of-freedom piezoelectric platform;

[0030] The six-degree-of-freedom piezoelectric platform includes three moving parts: an X-axis moving part, a Y-axis moving part, and a Z-axis moving part, and the three moving parts are stacked in series along the Z-axis direction;

[0031] The X-axis motion component is used to drive the sample to be processed to perform translational motion along the X-axis direction and rotational motion around the X-axis direction;

[0032] The Y-axis motion component is used to drive the sample to be processed to perform translational motion along the Y-axis direction and rotational motion around the Y-axis direction;

[0033] The Z-axis motion component is used to drive the sample to be processed to perform translational motion along the Z-axis direction and rotational motion around the Z-axis direction.

[0034] Furthermore, a preferred embodiment is provided, wherein the moving component includes a linear motion platform and a rotary motion platform;

[0035] The linear motion platform includes a bending composite piezoelectric vibrator, a transmission screw sleeve, a thread output end and a mobile platform; the thread output end and the mobile platform are fixedly connected; the thread output end uses a circumferential limit to constrain the rotational freedom;

[0036] The curved composite piezoelectric vibrator is used to generate an elliptical motion trajectory, driving the transmission screw sleeve to perform coupled rotational and linear motion; the transmission screw sleeve is used to drive the thread output end to perform linear motion; the thread output end is used to drive the mobile platform to perform linear motion along the axis direction of the thread output end;

[0037] The rotary motion platform includes a bending composite piezoelectric vibrator, a threaded output end, and a moving platform; the threaded output end and the moving platform are connected by a linear sliding connection;

[0038] The bending composite piezoelectric vibrator is used to generate an elliptical motion trajectory, driving the thread output end to perform rotational and linear coupled motion; the thread output end is used to drive the mobile platform to perform rotational motion around the axis direction of the thread output end.

[0039] Furthermore, a preferred embodiment is provided, wherein the bending composite piezoelectric vibrator comprises a base, a piezoelectric element and a threaded top, and the three are fixedly connected;

[0040] The piezoelectric element is used to generate bending micro-motion in two orthogonal directions perpendicular to the axis;

[0041] The thread top end is used to amplify the bending micro-motion of the piezoelectric element to generate an elliptical motion trajectory, and is threadedly connected to the transmission screw sleeve or the thread output end to realize thread drive.

[0042] Further, a preferred embodiment is provided, wherein the structural support member includes support columns, beams and a base;

[0043] The upper surface of the base is used for arranging the six-degree-of-freedom platform;

[0044] The support column is vertically supported on the upper surface of the base; the crossbeam is fixedly arranged on the top of the support column; and the crossbeam is fixedly connected to the micro-displacement adjustment platform.

[0045] The present invention also proposes an ultrasonic embossing method for processing micro-nano array structures, and its technical solution is as follows:

[0046] The ultrasonic embossing method is implemented using the ultrasonic embossing device described above;

[0047] The ultrasonic embossing method comprises the following steps:

[0048] Step 1: Place the sample to be processed on a six-degree-of-freedom platform; the six-degree-of-freedom platform adjusts the position and posture of the sample to be processed according to the shape of the surface of the sample to be processed and the imprinting requirements;

[0049] Step 2: Replace and install the contact imprinting mold according to the imprinting requirements; adjust the distance between the contact imprinting mold and the surface of the sample to be processed by the micro-displacement adjustment stage;

[0050] Step 3: The three-degree-of-freedom ultrasonic manipulator controls the contact imprint mold to perform depth-controlled ultrasonic imprint processing according to the imprinting requirements;

[0051] At the same time, the sensing detection component detects the parameter data during the ultrasonic embossing process in real time and feeds the parameter data back to the three-degree-of-freedom ultrasonic manipulator and the six-degree-of-freedom platform;

[0052] The three-degree-of-freedom ultrasonic manipulator adjusts the embossing depth and embossing force in real time during the ultrasonic embossing process based on the parameter data obtained through feedback;

[0053] Step 4: The 6DOF platform adjusts the position and posture of the sample to be processed in real time based on the parameter data obtained through feedback, the shape of the sample surface to be processed, and the imprinting requirements, to achieve indexing motion control for the processing of micro-nano array structures.

[0054] Step 5: Under the coordinated control of the three-degree-of-freedom ultrasonic manipulator and the six-degree-of-freedom platform, the ultrasonic imprint processing of the cross-scale multi-dimensional micro-nano array structure of the sample to be processed on the plane, spherical or special-shaped surface is completed.

[0055] The present invention has the following beneficial effects:

[0056] 1. The ultrasonic embossing device for micro-nano array structure processing described in the present invention provides vibration-assisted embossing through a three-degree-of-freedom ultrasonic manipulator, which reduces stress concentration during the embossing process and improves the processing quality of the micro-nano array structure.

[0057] 2. The ultrasonic imprinting device for micro-nano array structure processing described in the present invention can use a six-degree-of-freedom platform to adjust the position and posture of the sample to be processed, and further use a six-degree-of-freedom piezoelectric platform based on piezoelectric drive technology for indexing control. It has high control accuracy, fast response, and easy to achieve multi-dimensional movement.

[0058] 3. The ultrasonic embossing device for micro-nano array structure processing described in this invention achieves high-quality embossing of cross-scale multi-dimensional micro-nano array structures on flat, spherical, and curved surfaces through the coordinated control of a three-degree-of-freedom ultrasonic manipulator and a six-degree-of-freedom platform.

[0059] 4. The ultrasonic embossing device for processing micro-nano array structures described in the present invention has the advantages of low equipment cost, simple processing process, fast molding speed and high processing quality. It can be widely used in the processing of micro-nano array structures in the fields of optical equipment, precision instruments, microelectronic devices, biomedicine, and materials and chemical engineering.

[0060] The ultrasonic embossing device and method for micro-nano array structure processing described in the present invention are suitable for ultrasonic embossing in micro-nano array structure processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0062] Figure 1 Schematic diagram of the structure of an ultrasonic embossing device for processing micro-nano array structures in one embodiment of the present invention;

[0063] Figure 2 This is a schematic structural diagram of a three-degree-of-freedom ultrasonic manipulator in one embodiment of the present invention;

[0064] Figure 3 This is a schematic structural diagram of a six-degree-of-freedom piezoelectric platform in one embodiment of the present invention;

[0065] Figure 4 This is a schematic structural diagram of a linear motion platform and a rotary motion platform in one embodiment of the present invention;

[0066] Figure 5 FIG1 is a schematic diagram of the structure of a bending composite piezoelectric vibrator in one embodiment of the present invention;

[0067] Figure 6 A schematic diagram of an imprinted sample of micro-nanostructure ultrasonic imprinting indexing motion in one embodiment of the present invention;

[0068] Reference numerals:

[0069] 1. Three-degree-of-freedom ultrasonic manipulator; 1-1. Support base; 1-2. Piezoelectric element; 1-3. Tool control end; 2. Contact imprinting mold; 3. Sensing detection component; 4. Six-degree-of-freedom piezoelectric platform; 4-1. X-axis motion component; 4-1-1. Linear motion platform; 4-1-2. Rotary motion platform; 4-1-1-2. Transmission screw sleeve; 4-1-1-1, 4-1-2-1, bending composite piezoelectric vibrator; 4- 1-1-3, 4-1-2-2, thread output end; 4-1-1-4, 4-1-2-3, moving platform; 4-1-1-1-1, base; 4-1-1-1-2, piezoelectric element; 4-1-1-1-3, thread top; 4-2, Y-axis moving component; 4-3, Z-axis moving component; 5, structural support component; 5-1, support column; 5-2, beam; 5-3, base; 6, micro-displacement adjustment table. DETAILED DESCRIPTION

[0070] In order to make the technical solutions and advantages of the present invention more clearly described, the specific embodiments of the present invention will be further described in detail and completely in conjunction with the accompanying drawings. The various embodiments described below are only part of the preferred embodiments of the present invention, rather than all implementation plans; the various embodiments described below are intended to explain the present invention and cannot be understood as limiting the present invention; the reasonable combination of the technical features defined in the various embodiments of the present invention, as well as all other implementation plans obtained by ordinary technicians in this field based on the embodiments of the present invention without making creative work, all fall within the scope of protection of the present invention.

[0071] Implementation Method 1: Combination Figure 1 This embodiment provides an ultrasonic embossing device for processing micro-nano array structures. The specific implementation contents are as follows:

[0072] An ultrasonic imprinting device for processing micro-nano array structures, comprising: a three-degree-of-freedom ultrasonic manipulator 1, a contact imprinting mold 2, a sensing detection component 3, a six-degree-of-freedom platform, a structural support component 5, and a micro-displacement adjustment platform 6;

[0073] The six-degree-of-freedom platform is used to place the sample to be processed and is also used to adjust the position and posture of the sample to be processed to perform indexing motion control;

[0074] One end of the three-degree-of-freedom ultrasonic manipulator 1 is fixedly connected to one end of the micro-displacement adjustment platform 6; the other end of the micro-displacement adjustment platform 6 is fixedly connected to the structural support component 5; the other end of the three-degree-of-freedom ultrasonic manipulator 1 is detachably connected to the contact imprint mold 2;

[0075] The contact imprinting mold 2 has a surface microstructure, and the surface microstructure is used to generate an interaction force with the surface of the sample to be processed to perform ultrasonic imprint processing;

[0076] The three-degree-of-freedom ultrasonic manipulator 1 is used to replace the contact imprint mold 2 with the corresponding surface microstructure according to the micro-nano array structure to be processed, and is also used to manipulate the contact imprint mold 2 to perform ultrasonic imprint processing, and to coordinately control the imprint depth and imprint force during the ultrasonic imprint processing;

[0077] The micro-displacement adjustment stage 6 is used to adjust the distance between the contact imprinting mold 2 and the surface of the sample to be processed;

[0078] The sensing detection component 3 is used to detect parameter data in the ultrasonic embossing process in real time, and feed back the parameter data to the three-degree-of-freedom ultrasonic manipulator 1 and the six-degree-of-freedom platform.

[0079] In this embodiment, a micro-nano array structure refers to a type of microstructured surface with a regularly distributed microscopic geometric topology and specific functions. The microscopic and macroscopic geometric morphologies of the micro-nano array structure determine the device's functions, such as optical, tribological, lubricating, and information storage. A micro-nano array structure may also be referred to as a microstructure array, array microstructure, microstructured functional surface, or array microstructured functional surface.

[0080] In this embodiment, the device can realize the imprint processing (or ultrasonic imprint processing) of cross-scale multi-dimensional micro-nano array structures on the sample to be processed on a plane, a spherical surface and an irregular curved surface.

[0081] In this embodiment, the indexing motion refers to the relative motion between the workpiece and the processing tool at a given angle or length interval.

[0082] In this embodiment, the surface microstructure of the contact imprint mold 2 corresponds one-to-one with the micro-nano array structure to be processed. Processing different micro-nano array structures requires using a contact imprint mold 2 with a corresponding surface microstructure. The contact imprint mold 2 and the three-degree-of-freedom ultrasonic manipulator 1 are detachably connected to facilitate replacement of the contact imprint mold 2.

[0083] In this embodiment, the parameter data includes temperature, stress and displacement during the ultrasonic embossing process.

[0084] In this embodiment, the structural support component 5 plays a supporting role, supporting the three-degree-of-freedom ultrasonic manipulator 1 , the micro-displacement adjustment platform 6 and the sensor detection component 3 .

[0085] Furthermore, in a preferred embodiment, the sensing detection component 3 has a detection end and a connecting section; the connecting section of the sensing detection component 3 is fixedly connected to the micro-displacement adjustment platform 6; the detection end of the sensing detection component 3 is used to detect the ultrasonic imprinting process between the surface microstructure of the contact imprinting mold 2 and the surface of the sample to be processed, and obtain parameter data.

[0086] In this embodiment, the ultrasonic imprinting device realizes the coordinated control of the three-degree-of-freedom ultrasonic manipulator 1 and the six-degree-of-freedom platform through real-time feedback from the sensing detection component 3, and on this basis, utilizes the contact imprinting mold 2 to realize high-quality imprinting processing of cross-scale multi-dimensional (complex) micro-nano array structures on planes, spherical surfaces or special-shaped surfaces.

[0087] In this embodiment, the ultrasonic embossing device uses low-cost components, is easy to install and operate, and can perform efficient and high-quality fine embossing processing.

[0088] Implementation Method 2: Combination Figure 1 and2 This embodiment is described as a further limitation of the ultrasonic embossing device for processing micro-nano array structures described in the first embodiment. The specific implementation contents are as follows:

[0089] The three-degree-of-freedom ultrasonic manipulator 1 is used to generate three-degree-of-freedom ultrasonic linear vibrations: axial vibration, horizontal lateral vibration, and horizontal longitudinal vibration; wherein:

[0090] The axial vibration is parallel to the embossing direction and is used to control the embossing depth during the ultrasonic embossing process;

[0091] The horizontal lateral vibration and the horizontal longitudinal vibration are perpendicular to the imprinting direction, and are used to generate ultrasonic vibration friction between the surface microstructure of the contact imprinting mold 2 and the surface of the sample to be processed, thereby performing vibration-assisted imprinting.

[0092] In this embodiment, the imprinting direction, that is, the direction of the imprinting depth during the imprinting process, is also the normal distance between the contact imprinting mold 2 and the surface of the sample to be processed.

[0093] In this embodiment, the “ultrasonic” in ultrasonic vibration friction is a technical term in the field of vibration, referring to a frequency higher than 20 kHz.

[0094] Implementation Method 3: Combination Figure 2 This embodiment further defines the ultrasonic embossing device for processing micro-nano array structures described in the second embodiment. The specific implementation contents are as follows:

[0095] The three-degree-of-freedom ultrasonic manipulator 1 includes a support base 1-1, a piezoelectric element 1-2 and a tool control end 1-3; the support base 1-1 and the tool control end 1-3 are respectively located at two ends of the piezoelectric element 1-2;

[0096] The support base 1-1 is fixedly connected to one end of the micro-displacement adjustment platform 6;

[0097] The tool control end 1-3 is detachably connected to the contact imprinting mold 2;

[0098] The piezoelectric element 1-2 is formed by stacking multiple piezoelectric ceramic sheets, each of which has four partitions, and the partitions of the multiple piezoelectric ceramic sheets are aligned one by one;

[0099] The piezoelectric element 1 - 2 is used to achieve longitudinal vibration and bending vibration deformation through partitioned excitation.

[0100] In this embodiment, three degrees of freedom of ultrasonic linear vibration are achieved through longitudinal vibration (i.e., longitudinal expansion and contraction) and flexural deformation (bending deformation in the horizontal orthogonal direction, a high-frequency linear bending deformation) of the piezoelectric element 1-2. The longitudinal direction is the imprinting direction, and the horizontal orthogonal directions are the horizontal and vertical directions perpendicular to the imprinting direction.

[0101] Furthermore, in a preferred embodiment, the tool control end 1-3 adopts a variable amplitude rod structure to amplify the particle displacement or speed of the mechanical vibration of the end, maintain the amplitude stability, and improve the processing accuracy.

[0102] Implementation Method 4: Combination Figure 1 This embodiment is described as a further limitation of the ultrasonic embossing device for processing micro-nano array structures described in the first embodiment. The specific implementation contents are as follows:

[0103] The six-degree-of-freedom platform is used to drive the sample to be processed to move in six degrees of freedom directions;

[0104] The six degrees of freedom of motion include:

[0105] Translational movement along the X-axis, rotational movement around the X-axis, translational movement along the Y-axis, rotational movement around the Y-axis, translational movement along the Z-axis, and rotational movement around the Z-axis;

[0106] The movements in the six degrees of freedom are decoupled from each other and controlled independently.

[0107] In this embodiment, the Z-axis direction is a vertical direction, that is, an imprinting direction, that is, a direction of an imprinting depth during an imprinting process.

[0108] In this embodiment, the X-axis direction is horizontal.

[0109] In this embodiment, the Y-axis direction is the horizontal longitudinal direction.

[0110] In this embodiment, the six-degree-of-freedom platform can be implemented by using an existing six-degree-of-freedom platform.

[0111] In this embodiment, the six-degree-of-freedom platform is used to independently and collaboratively achieve cross-scale motion in six degrees of freedom. The cross-scale refers to having a millimeter-level travel and nanometer-level displacement resolution.

[0112] In this embodiment, the six-degree-of-freedom platform is used to realize indexing motion control of imprint processing of cross-scale multi-dimensional micro-nano array structures on planes, spherical surfaces, and special-shaped curved surfaces, wherein:

[0113] When processing micro-nano array structures on a plane, rotational motion around the X-axis, Y-axis, and Z-axis directions keeps the position constant, and translational motion along the X-axis, Y-axis, and Z-axis directions is used for indexing motion control during the processing of the micro-nano array structure;

[0114] When processing micro-nano array structures on spherical and irregular curved surfaces, the six-degree-of-freedom platform moves in coordination with the shape of the sample surface to be processed, realizing the adjustment of the processing surface and the indexing motion control during the processing of the micro-nano array structure.

[0115] Implementation Method 5: Combination Figure 3 This embodiment is described as a further limitation of the ultrasonic embossing device for processing micro-nano array structures described in the fourth embodiment. The specific implementation contents are as follows:

[0116] The six-degree-of-freedom platform is a six-degree-of-freedom piezoelectric platform 4;

[0117] The six-degree-of-freedom piezoelectric platform 4 includes three moving parts: an X-axis moving part 4-1, a Y-axis moving part 4-2, and a Z-axis moving part 4-3. The three moving parts are stacked in series along the Z-axis direction.

[0118] The X-axis motion component 4-1 is used to drive the sample to be processed to perform translational motion along the X-axis direction and rotational motion around the X-axis direction;

[0119] The Y-axis motion component 4-2 is used to drive the sample to be processed to perform translational motion along the Y-axis direction and rotational motion around the Y-axis direction;

[0120] The Z-axis motion component 4 - 3 is used to drive the sample to be processed to perform translational motion along the Z-axis direction and rotational motion around the Z-axis direction.

[0121] In this embodiment, the three moving components are stacked in series along the Z-axis direction, which is also called a three-stage series arrangement.

[0122] In this embodiment, the motions outputted by the three motion components are decoupled from each other, and the motion control is independent.

[0123] Implementation Method 6: Combination Figure 4 This embodiment is described as a further limitation of the ultrasonic imprinting device for micro-nano array structure processing described in the fifth embodiment. The specific implementation contents are as follows:

[0124] The moving parts include a linear motion platform 4-1-1 and a rotary motion platform 4-1-2;

[0125] The linear motion platform 4-1-1 includes a bending composite piezoelectric vibrator 4-1-1-1, a transmission screw sleeve 4-1-1-2, a thread output end 4-1-1-3 and a mobile platform 4-1-1-4; the thread output end 4-1-1-3 and the mobile platform 4-1-1-4 are fixedly connected; the thread output end 4-1-1-3 uses a circumferential limit to constrain the rotational freedom;

[0126] The bending composite piezoelectric vibrator 4-1-1-1 is used to generate an elliptical motion trajectory, driving the transmission screw sleeve 4-1-1-2 to perform rotational and linear coupled motion; the transmission screw sleeve 4-1-1-2 is used to drive the thread output end 4-1-1-3 to perform linear motion; the thread output end 4-1-1-3 is used to drive the mobile platform 4-1-1-4 to perform linear motion along the axis direction of the thread output end 4-1-1-3;

[0127] The rotary motion platform 4-1-2 includes a bending composite piezoelectric vibrator 4-1-2-1, a threaded output end 4-1-2-2 and a movable platform 4-1-2-3; a linear sliding connection is adopted between the threaded output end 4-1-2-2 and the movable platform 4-1-2-3;

[0128] The bending composite piezoelectric vibrator 4-1-2-1 is used to generate an elliptical motion trajectory, driving the thread output end 4-1-2-2 to perform rotational and linear coupled motion; the thread output end 4-1-2-2 is used to drive the mobile platform 4-1-2-3 to perform rotational motion around the axis direction of the thread output end 4-1-2-2.

[0129] Furthermore, a preferred embodiment is provided, wherein the bending composite piezoelectric vibrator (4-1-1-1, 4-1-2-1) comprises a base 4-1-1-1-1, a piezoelectric element 4-1-1-1-2 and a threaded top 4-1-1-1-3, and the three are fixedly connected;

[0130] The piezoelectric element 4-1-1-1-2 is used to generate bending micro-motion in two orthogonal directions perpendicular to the axis;

[0131] The thread top 4-1-1-1-3 is used to amplify the bending micro-motion of the piezoelectric element 4-1-1-1-2 to generate an elliptical motion trajectory, and is threadedly connected to the transmission screw sleeve 4-1-1-2 or the thread output end 4-1-2-2 to realize thread drive (i.e., rotational and linear coupled motion).

[0132] In this embodiment, the linear motion platform 4-1-1 is a two-stage threaded transmission type piezoelectric driver, and the rotary motion platform 4-1-2 is a one-stage threaded transmission type piezoelectric driver, and the thread lead angle of the threaded drive structure used by both is smaller than the friction angle, which is used to achieve self-locking motion output.

[0133] In this embodiment, the two-stage threaded transmission piezoelectric driver (i.e., linear motion platform 4-1-1) realizes the decoupling of the rotational motion and linear motion of the threaded transmission by constraining the degree of freedom of the second-stage threaded transmission (i.e., the rotational degree of freedom), which is a creative improvement to the existing technology.

[0134] In this embodiment, the piezoelectric element may be a four-partition piezoelectric ceramic, and the corresponding linear motion platform or rotary motion platform belongs to a "threaded motor driven by a four-partition piezoelectric ceramic bending vibration composite stator".

[0135] In this embodiment, the six-degree-of-freedom piezoelectric platform using the linear motion platform and the rotational motion platform is a beam-type piezoelectric vibrator threaded motor driven six-degree-of-freedom piezoelectric platform. Compared with existing six-degree-of-freedom (piezoelectric) platforms, it has the following advantages:

[0136] (1) The cantilever beam bending vibration composite piezoelectric drive stator produces corresponding axial displacement at the same time as the bending vibration composite vibration ultrasonic elliptical vibration trajectory. Therefore, the cantilever beam bending vibration composite piezoelectric drive stator is driven by dual traveling waves at the same time, which has the advantage of large output force.

[0137] (2) The two-stage thread transmission type piezoelectric actuator reduces the output speed by configuring the pitch difference of the two-stage thread structure, thereby improving the output displacement resolution of the piezoelectric actuator, so that the displacement resolution can reach the nanometer level.

[0138] (3) The output stroke of the threaded transmission piezoelectric actuator is determined by the size of the transmission screw, and can achieve millimeter-level motion stroke.

[0139] In this embodiment, the X-axis motion component is composed of a linear motion platform and a rotary motion platform stacked in series; wherein:

[0140] The moving platform of the linear motion platform is used for translational motion along the X-axis direction;

[0141] The moving platform of the rotary motion platform is used for rotational motion around the X-axis direction.

[0142] In this embodiment, the Y-axis motion component is composed of a linear motion platform and a rotary motion platform stacked in series; wherein:

[0143] The moving platform of the linear motion platform is used for translational motion along the Y-axis direction;

[0144] The moving platform of the rotary motion platform is used for rotational motion around the Y-axis direction.

[0145] In this embodiment, the Z-axis motion component is composed of a linear motion platform and a rotary motion platform stacked in series; wherein:

[0146] The moving platform of the linear motion platform is used for translational motion along the Z-axis direction;

[0147] The moving platform of the rotary motion platform is used for rotating motion around the Z-axis direction.

[0148] Implementation Method 7: Combination Figure 1 This embodiment is described as a further limitation of the ultrasonic embossing device for processing micro-nano array structures described in the first embodiment. The specific implementation contents are as follows:

[0149] The structural support member 5 includes a support column 5-1, a beam 5-2 and a base 5-3;

[0150] The upper surface of the base 5-3 is used to arrange the six-degree-of-freedom platform;

[0151] The support column 5 - 1 is vertically supported on the upper surface of the base 5 - 3 ; the crossbeam 5 - 2 is fixedly arranged on the top of the support column 5 - 1 ; the crossbeam 5 - 2 is fixedly connected to the micro-displacement adjustment platform 6 .

[0152] In this embodiment, the support provided by the structural support component 5 reduces the impact of vibration-assisted embossing on the overall device and the entire embossing process (i.e., reduces the impact of friction vibration), and improves the accuracy of ultrasonic embossing of the micro-nano array structure.

[0153] Furthermore, in a preferred embodiment, the structural support component 5 is made of a high-rigidity material, such as steel, titanium alloy, etc.

[0154] Implementation Method 8: Combination Figure 1 This embodiment provides an ultrasonic embossing method for processing micro-nano array structures. The specific implementation contents are as follows:

[0155] The ultrasonic embossing method is implemented by using the ultrasonic embossing device described in the above embodiment;

[0156] The ultrasonic embossing method comprises the following steps:

[0157] Step 1: Place the sample to be processed on a six-degree-of-freedom platform; the six-degree-of-freedom platform adjusts the position and posture of the sample to be processed according to the shape of the surface of the sample to be processed and the imprinting requirements;

[0158] Step 2: Replace and install the contact imprinting mold 2 according to the imprinting requirements; adjust the distance between the contact imprinting mold 2 and the surface of the sample to be processed by the micro-displacement adjustment stage 6;

[0159] Step 3: The three-degree-of-freedom ultrasonic manipulator 1 controls the contact imprinting mold 2 to perform depth-controlled ultrasonic imprinting according to the imprinting requirements;

[0160] At the same time, the sensing detection component 3 detects the parameter data during the ultrasonic embossing process in real time and feeds the parameter data back to the three-degree-of-freedom ultrasonic manipulator 1 and the six-degree-of-freedom platform;

[0161] The three-degree-of-freedom ultrasonic manipulator 1 adjusts the embossing depth and embossing force in real time during the ultrasonic embossing process according to the parameter data obtained through feedback;

[0162] Step 4: The 6DOF platform adjusts the position and posture of the sample to be processed in real time based on the parameter data obtained through feedback, the shape of the sample surface to be processed, and the imprinting requirements, to achieve indexing motion control for the processing of micro-nano array structures.

[0163] Step 5: Under the coordinated control of the three-degree-of-freedom ultrasonic manipulator 1 and the six-degree-of-freedom platform, the ultrasonic embossing processing of the cross-scale multi-dimensional micro-nano array structure of the sample to be processed on the plane, spherical or special-shaped surface is completed.

[0164] The above further describes the technical solution provided by the present invention in detail through several specific embodiments in order to highlight the advantages and benefits of the technical solution provided by the present invention. However, the several specific embodiments described above are not intended to limit the present invention. Any reasonable changes and improvements to the present invention, reasonable combinations of implementation methods and equivalent replacements based on the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An ultrasonic embossing device for processing micro-nano array structures, characterized in that: The device comprises: a three-degree-of-freedom ultrasonic manipulator (1), a contact-type imprinting mold (2), a sensor detection component (3), a six-degree-of-freedom platform, a structural support component (5), and a micro-displacement adjustment platform (6); The six-degree-of-freedom platform is used to place the sample to be processed and is also used to adjust the position and posture of the sample to be processed to perform indexing motion control; One end of the three-degree-of-freedom ultrasonic manipulator (1) is fixedly connected to one end of the micro-displacement adjustment platform (6); the other end of the micro-displacement adjustment platform (6) is fixedly connected to the structural support component (5); the other end of the three-degree-of-freedom ultrasonic manipulator (1) is detachably connected to the contact imprinting mold (2); The contact-type imprinting mold (2) has a surface microstructure, and the surface microstructure is used to generate an interaction force with the surface of the sample to be processed to perform ultrasonic imprint processing; The three-degree-of-freedom ultrasonic manipulator (1) is used to replace a contact-type imprinting mold (2) having a corresponding surface microstructure according to a micro-nano array structure to be processed, and is also used to manipulate the contact-type imprinting mold (2) to perform ultrasonic imprinting processing, and to coordinately control the imprinting depth and imprinting force during the ultrasonic imprinting processing; The micro-displacement adjustment platform (6) is used to adjust the distance between the contact imprinting mold (2) and the surface of the sample to be processed; The sensing detection component (3) is used to detect parameter data in the ultrasonic embossing process in real time, and feed the parameter data back to the three-degree-of-freedom ultrasonic manipulator (1) and the six-degree-of-freedom platform; The three-degree-of-freedom ultrasonic manipulator (1) is used to generate three-degree-of-freedom ultrasonic linear vibrations: axial vibration, horizontal lateral vibration, and horizontal longitudinal vibration; wherein: The axial vibration is parallel to the embossing direction and is used to control the embossing depth during the ultrasonic embossing process; The horizontal lateral vibration and the horizontal longitudinal vibration are perpendicular to the imprinting direction and are used to generate ultrasonic vibration friction between the surface microstructure of the contact imprinting mold (2) and the surface of the sample to be processed, thereby performing vibration-assisted imprinting.

2. The ultrasonic embossing device for micro-nano array structure processing according to claim 1, characterized in that: The three-degree-of-freedom ultrasonic manipulator (1) comprises a support base (1-1), a piezoelectric element (1-2) and a tool control end (1-3); the support base (1-1) and the tool control end (1-3) are respectively located at two ends of the piezoelectric element (1-2); The support base (1-1) is fixedly connected to one end of the micro-displacement adjustment platform (6); The tool control end (1-3) is detachably connected to the contact-type imprinting mold (2); The piezoelectric element (1-2) is formed by stacking multiple piezoelectric ceramic sheets, each of which has four partitions, and the partitions of the multiple piezoelectric ceramic sheets are aligned one by one; The piezoelectric element (1-2) is used to achieve longitudinal vibration and bending vibration deformation through partitioned excitation.

3. The ultrasonic embossing device for micro-nano array structure processing according to claim 2, characterized in that: The tool control end (1-3) adopts a variable amplitude rod structure, which is used to amplify the particle displacement or speed of the mechanical vibration of the end, maintain the amplitude stability, and improve the processing accuracy.

4. The ultrasonic embossing device for micro-nano array structure processing according to claim 1, characterized in that: The six-degree-of-freedom platform is used to drive the sample to be processed to move in six degrees of freedom directions; The six degrees of freedom of motion include: Translational movement along the X-axis, rotational movement around the X-axis, translational movement along the Y-axis, rotational movement around the Y-axis, translational movement along the Z-axis, and rotational movement around the Z-axis; The movements in the six degrees of freedom are decoupled from each other and controlled independently.

5. The ultrasonic embossing device for micro-nano array structure processing according to claim 4, characterized in that: The six-degree-of-freedom platform is a six-degree-of-freedom piezoelectric platform (4); The six-degree-of-freedom piezoelectric platform (4) includes three moving parts: an X-axis moving part (4-1), a Y-axis moving part (4-2), and a Z-axis moving part (4-3), wherein the three moving parts are stacked in series along the Z-axis direction; The X-axis motion component (4-1) is used to drive the sample to be processed to perform translational motion along the X-axis direction and rotational motion around the X-axis direction; The Y-axis motion component (4-2) is used to drive the sample to be processed to perform translational motion along the Y-axis direction and rotational motion around the Y-axis direction; The Z-axis motion component (4-3) is used to drive the sample to be processed to perform translational motion along the Z-axis direction and rotational motion around the Z-axis direction.

6. The ultrasonic embossing device for micro-nano array structure processing according to claim 5, characterized in that: The moving parts include a linear motion platform (4-1-1) and a rotary motion platform (4-1-2); The linear motion platform (4-1-1) comprises a bending composite piezoelectric vibrator (4-1-1-1), a transmission screw sleeve (4-1-1-2), a threaded output end (4-1-1-3) and a mobile platform (4-1-1-4); the threaded output end (4-1-1-3) and the mobile platform (4-1-1-4) are fixedly connected; the threaded output end (4-1-1-3) uses a circumferential limit to constrain the rotational freedom; The bending composite piezoelectric vibrator (4-1-1-1) is used to generate an elliptical motion trajectory, driving the transmission screw sleeve (4-1-1-2) to perform rotational and linear coupled motion; the transmission screw sleeve (4-1-1-2) is used to drive the thread output end (4-1-1-3) to perform linear motion; the thread output end (4-1-1-3) is used to drive the mobile platform (4-1-1-4) to perform linear motion along the axis direction of the thread output end (4-1-1-3); The rotary motion platform (4-1-2) includes a bending composite piezoelectric vibrator (4-1-2-1), a threaded output end (4-1-2-2) and a movable platform (4-1-2-3); a linear sliding connection is adopted between the threaded output end (4-1-2-2) and the movable platform (4-1-2-3); The bending composite piezoelectric vibrator (4-1-2-1) is used to generate an elliptical motion trajectory to drive the thread output end (4-1-2-2) to perform rotational and linear coupled motion; the thread output end (4-1-2-2) is used to drive the mobile platform (4-1-2-3) to perform rotational motion around the axis direction of the thread output end (4-1-2-2).

7. The ultrasonic embossing device for micro-nano array structure processing according to claim 6, characterized in that: The bending composite piezoelectric vibrator (4-1-1-1, 4-1-2-1) comprises a base (4-1-1-1-1), a piezoelectric element (4-1-1-1-2) and a threaded top (4-1-1-1-3), and the three are fixedly connected; The piezoelectric element (4-1-1-1-2) is used to generate bending micro-motion in two orthogonal directions perpendicular to the axis; The thread top end (4-1-1-1-3) is used to amplify the bending micro-motion of the piezoelectric element (4-1-1-1-2) to generate an elliptical motion trajectory, and is threadedly connected to the transmission screw sleeve (4-1-1-2) or the thread output end (4-1-2-2) to realize thread drive.

8. The ultrasonic embossing device for micro-nano array structure processing according to claim 1, characterized in that: The structural support component (5) comprises a support column (5-1), a crossbeam (5-2) and a base (5-3); The upper surface of the base (5-3) is used for arranging the six-degree-of-freedom platform; The supporting column (5-1) is vertically supported on the upper surface of the base (5-3); the crossbeam (5-2) is fixedly arranged on the top of the supporting column (5-1); and the crossbeam (5-2) is fixedly connected to the micro-displacement adjustment platform (6).

9. An ultrasonic embossing method for processing micro-nano array structures, characterized in that: The ultrasonic embossing method is implemented by using the ultrasonic embossing device according to any one of claims 1 to 8; The ultrasonic embossing method comprises the following steps: Step 1: Place the sample to be processed on a six-degree-of-freedom platform; the six-degree-of-freedom platform adjusts the position and posture of the sample to be processed according to the shape of the surface of the sample to be processed and the imprinting requirements; Step 2, according to the imprinting requirements, replace and install the contact imprinting mold (2); the micro-displacement adjustment table (6) adjusts the distance between the contact imprinting mold (2) and the surface of the sample to be processed; Step 3, the three-degree-of-freedom ultrasonic manipulator (1) controls the contact-type imprinting mold (2) to perform depth-controllable ultrasonic imprinting processing according to the imprinting requirements; At the same time, the sensing detection component (3) detects parameter data during the ultrasonic embossing process in real time, and feeds back the parameter data to the three-degree-of-freedom ultrasonic manipulator (1) and the six-degree-of-freedom platform; The three-degree-of-freedom ultrasonic manipulator (1) adjusts the embossing depth and embossing force in real time during the ultrasonic embossing process according to the parameter data obtained through feedback; Step 4: The 6DOF platform adjusts the position and posture of the sample to be processed in real time based on the parameter data obtained through feedback, the shape of the sample surface to be processed, and the imprinting requirements, to achieve indexing motion control for the processing of micro-nano array structures. Step 5: Under the coordinated control of the three-degree-of-freedom ultrasonic manipulator (1) and the six-degree-of-freedom platform, the ultrasonic embossing processing of the cross-scale multi-dimensional micro-nano array structure of the sample to be processed on the plane, spherical surface or special-shaped curved surface is completed.

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