Batch wafer coating equipment

Abstract

The present invention discloses a batch wafer coating equipment, comprising a cabinet, a wafer box transmission robot, a wafer box storage component, a front-opening interface mechanical component, a wafer transmission robot and a wafer coating reaction component, wherein a wafer box loading and placing table is arranged at one end of the cabinet, the wafer box transmission robot is arranged between the wafer box loading and placing table and the front-opening interface mechanical component, and a wafer box storage component is arranged above the front-opening interface mechanical component. Compared with ordinary CVD equipment and single-chip coating equipment, the equipment has lower maintenance and cleaning costs, which is reflected in a longer replacement cycle of parts and components, a simple and short operation process for replacing parts and components, lower specificity and lower cost of parts and components to be replaced, more convenient for updating and replacement, and higher efficiency, and can coat more wafers at one time, which reduces process pressure and time for large-volume wafer coating needs, and can meet most of the coating requirements of the market.

Description

Technical Field

[0001] The invention relates to a wafer coating component, in particular to a batch wafer coating device. Background Art

[0002] Chemical vapor deposition (CVD) is a method of synthesizing coatings or nanomaterials on the surface of a substrate through the reaction of chemical gases or vapors. It is widely used in the semiconductor industry to prepare high-quality thin films. During the CVD process of preparing thin films, the reaction gas first diffuses to the substrate surface and adsorbs. Next, on the surface of the substrate, these reaction gases undergo a chemical reaction, and the generated gaseous byproducts subsequently detach from the substrate surface and diffuse into space or are extracted by the exhaust system. Finally, the non-volatile solid-phase reaction products left on the substrate surface form the substrate oxide film. In the actual CVD coating process, firstly, the uniformity of the distribution of the reaction gas on the wafer surface is a key issue. If the distribution is uneven, it will lead to differences in the thickness and quality of the coating. Secondly, pressure and reaction temperature are also important conditions for determining the coating effect. They not only affect the rate and efficiency of the chemical reaction, but are also directly related to the physical and chemical properties of the film. Conventional CVD equipment often has shortcomings in these aspects. For example, the distribution of the reaction gas in the chamber may be uneven, resulting in unsatisfactory coating effects. In addition, the temperature and pressure control in the chamber may not be efficient enough, further affecting the quality and uniformity of the coating.

[0003] In summary, common problems with coating equipment currently available on the market include uneven gas distribution in the cavity, the inability to accurately control temperature and air pressure, and external impurities doped inside the cavity. These problems result in uneven film thickness and unstable physical and chemical properties, thus affecting its function. In addition, existing equipment occupies a large area, has many requirements for the installation environment, and parts that need to be frequently disassembled and assembled are difficult to replace. The present invention proposes a solution to the above problems. Summary of the invention

[0004] The purpose of the present invention is to provide a batch wafer coating equipment, which solves the problems that the existing equipment occupies a large area, has many requirements for the installation environment, and the parts that need to be frequently disassembled and assembled are difficult to replace.

[0005] The above technical objectives of the present invention are achieved through the following technical solutions:

[0006] A batch wafer coating equipment comprises a cabinet, a wafer box transfer robot, a wafer box storage component, a front-opening interface mechanical component, a wafer transfer robot and a wafer coating reaction component, wherein a wafer box loading and placing table is arranged at one end of the cabinet, the wafer box transfer robot is arranged between the wafer box loading and placing table and the front-opening interface mechanical component, and a wafer box storage component is arranged above the front-opening interface mechanical component, a wafer coating reaction component is arranged on the side of the front-opening interface mechanical component away from the wafer box storage component, and a wafer transfer robot is arranged between the front-opening interface mechanical component and the wafer coating reaction component.

[0007] Preferably, the wafer box transfer robot comprises a dual-axis truss fixed to one side of the cabinet, an electric slide is fixed on the movable structure of the dual-axis truss, and a wafer box placement table is fixed on the slider of the electric slide.

[0008] Preferably, the wafer box storage assembly includes a pallet fixed to one side of the cabinet, a first drive motor is fixed to the lower side of the pallet by screws, an output end of the first drive motor is fixedly connected to a rotating shaft, and an outer fixed sleeve of the rotating shaft is provided with a plurality of placement layers for placing wafer boxes.

[0009] Preferably, the front-opening interface mechanical assembly includes a wafer box holder fixed on one side of the cabinet, a cylinder is fixed on the side of the wafer box holder, a wafer box lock is fixed on the output end of the cylinder, an interface groove is provided on the wafer box holder, linear electric slide rails are fixed on both sides of the interface groove and on the back side of the wafer box holder, a track door is fixedly connected between the sliders of the two linear electric slide rails, a plurality of suction cups are fixedly embedded on the track door, and the suction cups are connected to the vacuum generator through a hose.

[0010] Preferably, the wafer transfer robot includes a vertical electric slide fixed on one side of the cabinet, a second drive motor is fixed on the slider of the vertical electric slide, the output end of the second drive motor is fixedly connected to a horizontal electric slide, and a pneumatic clamp is fixed on the slider of the horizontal electric slide.

[0011] Preferably, the wafer coating reaction assembly includes a vacuum chamber fixed on one side of a cabinet, a wafer boat elevator and a coating chamber are fixedly installed on the upper side of the vacuum chamber, an electric door is installed on one side of the vacuum chamber, wherein an opening is provided on the side of the coating chamber facing the vacuum chamber, an electric heating jacket is fixedly provided in the opening of the coating chamber, a quartz tube is fixedly provided in the electric heating jacket, and a manifold is fixedly embedded in the bottom of the opening of the coating chamber.

[0012] Preferably, the wafer boat elevator includes a lifting electric slide rail fixed on the upper side of the vacuum chamber, a column rod is fixedly connected to the movable structure of the lifting electric slide rail, the bottom end of the column rod extends into the vacuum chamber and is fixedly connected to a tray, a third drive motor is fixedly connected to the bottom side of the tray, and the output end of the third drive motor passes through the tray and is fixedly connected to a wafer rack.

[0013] Preferably, at least two groups of the wafer box loading and placing platform and the front-opening interface mechanical components are provided, and positioning pins and sensors are installed on the wafer box loading and placing platform, the placing layer and the track door.

[0014] Beneficial effect: Compared with ordinary CVD equipment and single-wafer coating equipment, the batch wafer coating equipment of the present invention has lower maintenance and cleaning costs, which is reflected in the longer replacement cycle of parts and components, the simple operation and short time of the parts replacement process, the parts to be replaced are less specific and cheaper, more convenient to update and replace, and more efficient. More wafers can be coated at one time, and the process pressure and time are reduced for large quantities of wafer coating needs, which can meet most of the coating requirements of the market, and has a certain quality assurance in terms of coating uniformity and thickness, while ensuring the physical and chemical properties of the film. Due to the significant advantages of small footprint, compact structure and high degree of automation, it is particularly suitable for laboratories or production environments with limited space. In addition, its compact structural design not only improves the stability of the equipment, but also helps to reduce the manufacturing cost and maintenance difficulty of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional structural cross-sectional view of a batch wafer coating equipment;

[0016] Figure 2 It is a structural schematic diagram of a wafer box loading and placing table in a batch wafer coating equipment;

[0017] Figure 3 It is a schematic diagram of the structure of a wafer box transfer robot in a batch wafer coating equipment;

[0018] Figure 4 It is a structural schematic diagram of a wafer box storage component in a batch wafer coating device;

[0019] Figure 5 It is a front structural schematic diagram of a front-opening interface mechanical component in a batch wafer coating device;

[0020] Figure 6 It is a schematic diagram of the back structure of a front-opening interface mechanical component in a batch wafer coating device;

[0021] Figure 7It is a structural schematic diagram of a wafer transfer robot in a batch wafer coating device;

[0022] Figure 8 It is a structural cross-sectional view of a wafer coating reaction component in a batch wafer coating device;

[0023] Fig. 9 The figure is a schematic diagram of the structure of a wafer boat elevator in a batch wafer coating equipment.

[0024] Reference numerals:

[0025] 1. Cabinet; 2. Wafer box transfer robot; 3. Wafer box storage component; 4. Front-opening interface mechanical component; 5. Wafer transfer robot; 6. Wafer coating reaction component; 11. Wafer box loading and placement table; 21. Double-axis truss; 22. Electric slide; 23. Wafer box placement table; 31. Pallet; 32. First drive motor; 33. Rotating shaft; 34. Placement layer; 41. Wafer box clamping position; 42. Cylinder; 43. Wafer box lock; 44. Interface slot; 45. Linear electric slide; 4 6. Track door; 47. Suction cup; 48. Vacuum generator; 51. Vertical electric slide; 52. Second drive motor; 53. Horizontal electric slide; 54. Pneumatic gripper; 61. Vacuum chamber; 62. Wafer boat elevator; 63. Coating chamber; 64. Electric door; 63a. Electric heating sleeve; 63b. Quartz tube; 63c. Manifold; 62a. Lifting electric slide; 62b. Column; 62c. Tray; 62d. Third drive motor; 62e. Wafer rack; 7. Positioning pin; 8. Sensor. DETAILED DESCRIPTION

[0026] The following is only a preferred embodiment of the present invention, and the protection scope is not limited to this embodiment. All technical solutions under the concept of the present invention should belong to the protection scope of the present invention. At the same time, it should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

[0027] like Figure 1-Figure 9 As shown, a batch wafer coating equipment comprises a cabinet 1, a wafer box transmission robot 2, a wafer box storage component 3, a front-opening interface mechanical component 4, a wafer transmission robot 5 and a wafer coating reaction component 6, wherein a wafer box loading and placing table 11 is arranged at one end of the cabinet 1, the wafer box transmission robot 2 is arranged between the wafer box loading and placing table 11 and the front-opening interface mechanical component 4, and a wafer box storage component 3 is arranged above the front-opening interface mechanical component 4, a wafer coating reaction component 6 is arranged on a side of the front-opening interface mechanical component 4 away from the wafer box storage component 3, and a wafer transmission robot 5 is arranged between the front-opening interface mechanical component 4 and the wafer coating reaction component 6;

[0028] Specifically, the cabinet 1 serves as the basic structure of the equipment, and one end of the cabinet is provided with a wafer box loading and placing table 11 for loading the wafer box to be coated. The wafer box transfer robot 2 is responsible for taking the wafer box from the loading table to the front open interface mechanical component 4 or the upper wafer box storage component 3. The latter controls the placement layer 34 through the first drive motor 32 and the rotating shaft 33 to realize the orderly storage of the wafer box. The front open interface mechanical component 4 takes the wafer out of the box and prepares it for loading through the coordinated action of the cylinder 42 and the suction cup 47. The coating is carried out, and then the wafer transfer robot 5 uses its precise vertical electric slide rail 51 and horizontal electric slide rail 53 to safely transfer the wafer to the vacuum chamber 61 of the wafer coating reaction component 6. In the vacuum chamber 61, the wafer rack 62e enters the coating chamber 63 through the wafer boat elevator 62, and the high-quality coating process is completed under the joint action of the electric heating sleeve 63a, the quartz tube 63b and the manifold 63c. The automation of the entire process not only improves the production efficiency, but also ensures the consistency and reliability of the product.

[0029] Furthermore, the wafer box transfer robot 2 includes a dual-axis truss 21 fixed to one side of the cabinet 1, an electric slide 22 is fixed on the movable structure of the dual-axis truss 21, and a wafer box placement table 23 is fixed on the slider of the electric slide 22;

[0030] Specifically, the wafer box placement table 23 in the wafer box transfer robot 2 can complete the movement in the X-axis, Y-axis and Z-axis directions with the help of the dual-axis truss 21 and the electric slide 22. The movements in the three directions cooperate with each other to transport the wafer box to the wafer box placement table 23.

[0031] Furthermore, the wafer box storage assembly 3 includes a support plate 31 fixed to one side of the cabinet 1, a first drive motor 32 is fixed to the lower side of the support plate 31 by screws, a rotating shaft 33 is fixedly connected to the output end of the first drive motor 32, and a plurality of placement layers 34 for placing wafer boxes are fixedly sleeved on the outer side of the rotating shaft 33;

[0032] Specifically, four placement layers 34 are designed, each placement layer 34 is provided with four wafer box reserved positions, each wafer box reserved position is provided with a positioning pin 7 and a sensor 8, the first drive motor 32 can drive the placement layer 34 to rotate, the wafer box placement position can be replaced, and a photoelectric sensor is installed on the outer side of the output shaft of the first drive motor 32. The photoelectric sensor can detect the number of rotations of the output shaft, thereby judging the specific position of the wafer box to cooperate with the process flow.

[0033] Further, the front-opening interface mechanical assembly 4 includes a wafer box clamp 41 fixed to one side of the cabinet 1, a cylinder 42 is fixed to the side of the wafer box clamp 41, a wafer box lock 43 is fixed to the output end of the cylinder 42, an interface groove 44 is provided on the wafer box clamp 41, linear electric slide rails 45 are fixed on both sides of the interface groove 44 and located on the back of the wafer box clamp 41, a track door 46 is fixedly connected between the sliders of the two linear electric slide rails 45, and a plurality of suction cups 47 are fixedly embedded on the track door 46, and the suction cups 47 are connected to the vacuum generator 48 through a hose;

[0034] Specifically, the hose allows the suction force generated by the vacuum generator 48 to be transmitted to the suction cup 47, so that the movement of the track door 46 and the vacuum adsorption effect will not conflict with each other. A pressure relief valve is also provided on the vacuum generator 48 to release the suction force of the suction cup 47, so as to facilitate the removal of the wafer box after the deposition process is completed.

[0035] Specifically, the cylinder 42 drives the wafer box lock 43 to move to press the wafer box, thereby stabilizing the wafer box. After the suction cup 47 is evacuated by the vacuum generator 48, it can be adsorbed on the rear door of the wafer box, and then the linear electric slide 45 drives the track door 46 to move to one side to expose the wafer and prevent the wafer box from moving when loading and unloading materials. It is worth mentioning that the wafers that have completed the deposition process will also be transported back to the wafer box and transferred away after sealing.

[0036] Furthermore, the wafer transfer robot 5 includes a vertical electric slide rail 51 fixed to one side of the cabinet 1, a second drive motor 52 is fixed to the slider of the vertical electric slide rail 51, an output end of the second drive motor 52 is fixedly connected to a horizontal electric slide rail 53, and a pneumatic clamp 54 is fixed to the slider of the horizontal electric slide rail 53;

[0037] Specifically, the wafer transfer robot 5 includes motion devices for the Z axis, Y axis and R axis, wherein the vertical electric slide 51 can complete the Z axis motion, the transverse electric slide 53 can complete the Y axis motion, and the second drive motor 52 can complete the R axis motion. During operation, the second drive motor 52 under the vertical electric slide 51 drives the entire transverse electric slide 53 to rotate, and the transverse electric slide 53 drives the pneumatic clamp 54 to move back and forth, and the wafer transfer operation is completed through the coordination of motion on each axis.

[0038] Further, the wafer coating reaction assembly 6 includes a vacuum chamber 61 fixed to one side of the cabinet 1, a wafer boat elevator 62 and a coating chamber 63 are fixedly installed on the upper side of the vacuum chamber 61, an electric door 64 is installed on one side of the vacuum chamber 61, wherein the coating chamber 63 is provided with an opening on the side facing the vacuum chamber 61, an electric heating jacket 63a is fixedly sleeved in the opening of the coating chamber 63, a quartz tube 63b is fixedly sleeved in the electric heating jacket 63a, and a manifold 63c is fixedly embedded in the bottom of the opening of the coating chamber 63;

[0039] Specifically, the electric heating jacket 63a can heat the space in the coating chamber 63 and control the temperature in the coating chamber 63 to quickly reach the standard. The quartz tube 63b has the advantage of high temperature resistance, and the manifold 63c controls the gas dispatching in the vacuum chamber 61 and the coating chamber 63, such as vacuuming, filling with special gases and other gas pressure operations;

[0040] Specifically, a glass window is fixedly embedded in the side wall of the vacuum chamber 61, which is convenient for observing the internal situation. The electric door 64 is opened and closed by an electric push rod. When opened, the main body of the electric door 64 moves to one side through a slide rail, so that the wafer can be moved in or out. A sealing hole is provided on the upper side of the vacuum chamber 61, and a sealing ring is embedded in the sealing hole. When the column rod 62b slides up and down, the vacuum chamber 61 can be ensured to be in a closed state.

[0041] Further, the wafer boat elevator 62 includes an electric lift rail 62a fixed to the upper side of the vacuum chamber 61, a column 62b is fixedly connected to the movable structure of the electric lift rail 62a, the bottom end of the column 62b extends into the vacuum chamber 61 and is fixedly connected to a tray 62c, a third drive motor 62d is fixedly connected to the bottom side of the tray 62c, and an output end of the third drive motor 62d passes through the tray 62c and is fixedly connected to a wafer rack 62e;

[0042] Specifically, the lifting electric slide rail 62a can drive the column rod 62b to move up and down, and the column rod 62b drives the tray 62c to move up and down. The tray 62c lifts the wafer rack 62e in and out of the coating chamber 63 to complete the loading and unloading procedures of the deposition process. When the deposition process is carried out, the tray 62c will be squeezed and sealed with the sealing ring on the inner side of the opening of the coating chamber 63, thereby ensuring that the vacuum and high temperature process requirements are met.

[0043] Furthermore, the wafer box loading and placing platform 11 and the front-opening interface mechanical assembly 4 are each provided with at least two groups, and the wafer box loading and placing platform 11, the placing layer 34 and the track door 46 are each installed with positioning pins 7 and sensors 8;

[0044] Specifically, the front end of the cabinet 1 is provided with an automatic wafer box loading and placing table 11 and a manual wafer box loading and placing table 11, and the higher automatic wafer box loading and placing table 11 is equipped with a wafer box loading system, so that the equipment can be fully automated, or semi-automatically operated with manual assistance. It is worth noting that a wafer radio frequency identification reader is installed on the side of the wafer box loading and placing table 11, and the radio frequency identification reader is used to determine the process status of the wafer, so as to determine whether it needs to be moved out or moved into the equipment;

[0045] Specifically, the front-opening interface mechanical assembly 4 is provided with two groups, the upper and lower groups, and the upper and lower layers have the same characteristics, which can effectively improve the processing efficiency;

[0046] Specifically, the positioning pin 7 is used to ensure that the wafer box or wafer is correctly aligned and positioned in the equipment, helping the equipment to identify and fix the wafer box or wafer in the correct position to facilitate subsequent coating or other process operations. The sensor 8 is used to monitor and control the position status of the wafer box or wafer to ensure that they are placed correctly, and can provide feedback to the control system for automated operation and monitoring. The sensor 8 may include but is not limited to proximity sensors 8, position sensors 8 or pressure sensors 8, etc., which are used to detect the existence, position or status of an object.

[0047] The working principle includes the following steps:

[0048] 1. The wafer box placement table 23 on the wafer box transfer robot 2 can move in the vertical direction with the help of the dual-axis truss 21, and the wafer box placement table 23 can also move horizontally with the help of the electric slide 22, so that the wafer box placed on the wafer box loading and placement table 11 can be transferred to the wafer box placement table 23, and the wafer box placement table 23 moves the wafer box to the front opening interface mechanical component 4 or the wafer box storage component 3;

[0049] 2. The wafer box transferred by the wafer box placement table 23 to the front-opening interface mechanical assembly 4 is limited in the interface slot 44, and the cylinder 42 drives the wafer box lock 43 to move to press the wafer box. After the suction cup 47 is evacuated by the vacuum generator 48, it can be adsorbed on the rear door of the wafer box, and then the linear electric slide 45 drives the track door 46 to move to one side to expose the wafer;

[0050] 3. The pneumatic gripper 54 on the wafer transfer robot 5 can move up and down and forward and backward with the help of the vertical electric slide rail 51 and the horizontal electric slide rail 53, and the pneumatic gripper 54 can also rotate with the help of the second drive motor 52, so as to move the wafer in the wafer box to the front of the vacuum chamber 61. At the same time, the electric door 64 is opened, and the pneumatic gripper 54 places the clamped wafer on the wafer rack 62e in the vacuum chamber 61;

[0051] Fourth, after the pneumatic gripper 54 leaves the vacuum chamber 61, the electric door 64 is closed again, and the vacuum chamber 61 will be evacuated. After the internal air pressure reaches the process requirement, the lifting electric slide rail 62a drives the column 62b to rise, so that the tray 62c lifts the wafer rack 62e into the coating chamber 63. During the deposition process, the tray 62c will be sealed with the opening of the coating chamber 63 by a sealing strip, so as to ensure that the vacuum and high temperature process requirements are met;

[0052] 5. During the deposition process, the third driving motor 62d drives the wafer rack 62e to rotate at a constant speed, so that the wafer can be heated and purged with chemical gas as evenly as possible, thereby ensuring the quality of the coating;

[0053] 6. When deposition is completed, the wafer rack 62e descends into the vacuum chamber 61, the electric door 64 reopens, and the pneumatic clamp 54 moves the wafer out to the empty wafer box in the front-opening interface mechanical component 4, and then the linear electric slide 45 drives the track door 46, and the track door 46 drives the rear door of the empty wafer box to close, the suction cup 47 releases pressure, and the wafer box placement table 23 moves the wafer box loaded with the coated wafers to the upper placement layer 34. It is worth mentioning that the first drive motor 32 can drive the placement layer 34 to rotate, and the placement position of the wafer box can be changed. The overhead crane system in the workshop brings the wafer box containing the coated wafers out of the equipment.

Claims

1. A batch wafer coating equipment, characterized in that: The invention comprises a cabinet (1), a wafer box transfer robot (2), a wafer box storage component (3), a front-opening interface mechanical component (4), a wafer transfer robot (5) and a wafer coating reaction component (6); a wafer box loading and placing table (11) is arranged at one end of the cabinet (1); the wafer box transfer robot (2) is arranged between the wafer box loading and placing table (11) and the front-opening interface mechanical component (4); a wafer box storage component (3) is arranged above the front-opening interface mechanical component (4); a wafer coating reaction component (6) is arranged on a side of the front-opening interface mechanical component (4) away from the wafer box storage component (3); and a wafer transfer robot (5) is arranged between the front-opening interface mechanical component (4) and the wafer coating reaction component (6); The front-opening interface mechanical assembly (4) comprises a wafer box clamp (41) fixed on one side of the cabinet (1), a cylinder (42) is fixed on the side of the wafer box clamp (41), a wafer box lock (43) is fixed on the output end of the cylinder (42), an interface groove (44) is provided on the wafer box clamp (41), linear electric slide rails (45) are fixed on both sides of the interface groove (44) and located on the back of the wafer box clamp (41), a track door (46) is fixedly connected between the sliders of the two linear electric slide rails (45), and a plurality of suction cups (47) are fixedly embedded on the track door (46), and the suction cups (47) are connected to the vacuum generator (48) through a hose; The wafer coating reaction assembly (6) comprises a vacuum chamber (61) fixed on one side of the cabinet (1); a wafer boat elevator (62) and a coating chamber (63) are fixedly installed on the upper side of the vacuum chamber (61); an electric door (64) is installed on one side of the vacuum chamber (61); an opening is provided on the side of the coating chamber (63) facing the vacuum chamber (61); an electric heating jacket (63a) is fixedly provided in the opening of the coating chamber (63); a quartz tube (63b) is fixedly provided in the electric heating jacket (63a); and a manifold (63c) is fixedly embedded in the bottom of the opening of the coating chamber (63); The wafer boat elevator (62) includes an electric lift rail (62a) fixed on the upper side of a vacuum chamber (61); a column rod (62b) is fixedly connected to the movable structure of the electric lift rail (62a); the bottom end of the column rod (62b) extends into the vacuum chamber (61) and is fixedly connected to a tray (62c); the bottom side of the tray (62c) is fixedly connected to a third drive motor (62d); the output end of the third drive motor (62d) passes through the tray (62c) and is fixedly connected to a wafer rack (62e).

2. The batch wafer coating equipment according to claim 1, characterized in that: The wafer box transfer robot (2) comprises a double-axis truss (21) fixed to one side of the cabinet (1), an electric slide (22) is fixed on the movable structure of the double-axis truss (21), and a wafer box placement table (23) is fixed on the slider of the electric slide (22).

3. The batch wafer coating equipment according to claim 2, characterized in that: The wafer box storage assembly (3) comprises a support plate (31) fixed to one side of the cabinet (1); a first drive motor (32) is fixed to the lower side of the support plate (31) by screws; an output end of the first drive motor (32) is fixedly connected to a rotating shaft (33); and a plurality of placement layers (34) for placing wafer boxes are fixedly sleeved on the outer side of the rotating shaft (33).

4. The batch wafer coating equipment according to claim 3, characterized in that: The wafer transfer robot (5) comprises a vertical electric slide rail (51) fixed to one side of the cabinet (1), a second drive motor (52) being fixed to a slider of the vertical electric slide rail (51), an output end of the second drive motor (52) being fixedly connected to a transverse electric slide rail (53), and a pneumatic clamp (54) being fixed to a slider of the transverse electric slide rail (53).

5. The batch wafer coating equipment according to claim 4, characterized in that: The wafer box loading and placing platform (11) and the front-opening interface mechanical assembly (4) are each provided with at least two groups, and positioning pins (7) and sensors (8) are each installed on the wafer box loading and placing platform (11), the placing layer (34) and the track door (46).

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