Infrared radiation intensity calculation method and device, and electronic equipment
By analyzing the finite element model of the target and calculating the projection area, the infrared radiation intensity was evaluated using the Planck formula, which solved the accuracy and efficiency of evaluating infrared radiation intensity in the prior art, and improved the evaluation accuracy of stealth performance.
Patent Information
- Application Number
- CN202411357390.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2044-09-27
AI Technical Summary
The prior art cannot accurately and efficiently evaluate the infrared radiation intensity of targets such as aircraft engines, affecting the improvement of stealth performance.
By analyzing the finite element model of the target, determining each component and finite element unit, calculating the projection of the detector on the target along the detection vector, calculating the projection area of the target component that is not obscured by other components, and using Planck based on the temperature and band range The formula calculates the infrared radiation intensity.
It achieves efficient and accurate evaluation of the infrared radiation intensity of the target components, shortens the design cycle, and improves the accuracy of stealth performance evaluation.
Smart Images

Figure CN118886280B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of aircraft design, and in particular to an infrared radiation intensity calculation method and device, and electronic equipment. Background Art
[0002] Evaluating the infrared calculation results of targets (such as aircraft engines), reducing the intensity of infrared radiation, and improving the stealth performance of the target is an important topic in modern military science training.
[0003] Accordingly, how to accurately and efficiently evaluate the infrared radiation intensity during the target design stage is a technical problem that needs to be solved urgently. Summary of the invention
[0004] The purpose of the embodiments of the present invention is to provide a method and device for calculating infrared radiation intensity, and an electronic device, which can solve the problem in the prior art that the infrared radiation intensity of a target cannot be accurately and efficiently evaluated.
[0005] In order to solve the above technical problems, the present invention provides the following technical solutions:
[0006] An embodiment of the present invention provides a method for calculating infrared radiation intensity, wherein the method comprises:
[0007] Analyze the finite element model of the target to determine the components contained in the target and the finite element units corresponding to the components; wherein one target includes at least two components, and each component includes multiple finite element units;
[0008] Determine the detector, detection vector and target component;
[0009] Calculate a first projection area of the target component that is not blocked by other components based on a projection generated by the detector detecting the target along the detection vector;
[0010] The infrared radiation intensity of the target component is calculated based on the first projection area, the temperature of the target component, and the wavelength range.
[0011] Optionally, the step of calculating a first projection area of the target component that is not blocked by other components according to a projection generated by the detector detecting the target along the detection vector comprises:
[0012] The node coordinates of the finite element unit corresponding to each component are transformed according to the detection vector to obtain the transformed coordinates of the nodes of the finite element unit corresponding to each component;
[0013] Constructing a rectangular diagram according to the transformed coordinates of the nodes, wherein the rectangular diagram includes all projections of the target finite element model;
[0014] Dividing the rectangular image into a plurality of pixel blocks, wherein each finite element unit corresponds to a plurality of pixel blocks;
[0015] Construct a sub-rectangular frame for each finite element unit;
[0016] For each second component included in the target, traverse each finite element unit corresponding to the second component to determine each first pixel block falling into the corresponding sub-rectangular frame and each second pixel block not falling into the corresponding sub-rectangular frame; wherein the second component is other components included in the target except the target component;
[0017] Generate a first list including index values of the first pixel blocks and a second list including index values of the second pixel blocks respectively;
[0018] A first projection area of the target component that is not blocked by other components is calculated according to the second list and the pixel blocks corresponding to each finite element unit included in the target component.
[0019] Optionally, the step of constructing a rectangular graph according to the transformed coordinates of the nodes includes:
[0020] Find the maximum value in the X direction, the minimum value in the X direction, the maximum value in the Y direction, and the minimum value in the Y direction from the transformed coordinates of each of the nodes;
[0021] A rectangular graph is constructed by taking the node corresponding to the maximum value in the X direction, the node corresponding to the minimum value in the X direction, the node corresponding to the maximum value in the Y direction and the node corresponding to the minimum value in the Y direction as rectangular graph nodes.
[0022] Optionally, for each second component included in the target, traversing each finite element unit corresponding to the second component, and determining each first pixel block falling into the corresponding sub-rectangular frame and each second pixel block not falling into the corresponding sub-rectangular frame includes:
[0023] For each second component included in the target, determining each finite element unit corresponding to the second component;
[0024] For each of the finite element units, determining each pixel block corresponding to the finite element unit;
[0025] For each target pixel block in each pixel block corresponding to the finite element unit, determining whether the target pixel block falls into the sub-rectangular frame corresponding to the finite element unit according to the relationship between the center coordinates of the target pixel block and the coordinates of each node of the finite element unit;
[0026] The target pixel block falling into the sub-rectangular frame is determined as the first pixel block, and the target pixel block not falling into the sub-rectangular frame is determined as the second pixel block.
[0027] Optionally, the target pixel blocks are pixel blocks corresponding to the finite element unit; or, the target pixel blocks are pixel blocks located at the edge of the sub-rectangular frame corresponding to the finite element unit.
[0028] Optionally, the step of calculating a first projection area of the target component that is not blocked by other components according to the second list and the pixel blocks corresponding to each finite element unit included in the target component includes:
[0029] For each finite element unit included in the target component, traverse one by one to see whether the index value of each pixel block included in the finite element unit is in the second list; wherein the second list includes a second distance associated with each index value, and the second distance is the distance between the intersection of the pixel block corresponding to the index value and the finite element unit and the detector;
[0030] For each target pixel block whose index value is in the second list, determining a target index value corresponding to each target pixel block;
[0031] For each of the target pixel blocks, determining whether a first distance between an intersection of the target pixel block and the finite element unit and the detector is less than a second distance associated with a corresponding target index value;
[0032] Accumulate the target pixel block areas whose index values are in the second list and whose corresponding first distances are smaller than the second distance;
[0033] The accumulated area obtained after traversing all the finite element units included in the target component is determined as the first projection area of the target component that is not blocked by other components.
[0034] Optionally, the step of calculating the infrared radiation intensity of the target component based on the first projection area, the target component and the wavelength range includes:
[0035] Determine the blackbody spectral radiation brightness corresponding to the target component according to the temperature of the target component and the target wavelength within the wavelength band;
[0036] Calculating a second projection area perpendicular to the detector and the first projection area according to an angle between the normal of the first projection area and the detection vector;
[0037] The product of the black body spectrum radiation brightness and the second projection area is determined as the infrared radiation intensity of the target component.
[0038] Optionally, the step of determining the blackbody spectral radiation brightness corresponding to the target component according to the temperature of the target component and the target wavelength within the wavelength band includes:
[0039] The temperature of the target component, the target wavelength within the wavelength band, and a preset radiation constant are substituted into the Planck formula to calculate the blackbody spectral radiation brightness corresponding to the target component.
[0040] The embodiment of the present invention further provides an infrared radiation intensity calculation device, wherein the device comprises:
[0041] An analysis module, used for analyzing the finite element model of the target, determining the components contained in the target and the finite element units corresponding to the components; wherein one target includes at least two components, and each component includes multiple finite element units;
[0042] A determination module, used to determine the detector, the detection vector and the target component;
[0043] An area calculation module, configured to calculate a first projection area of the target component that is not blocked by other components based on a projection generated by the detector detecting the target along the detection vector;
[0044] The radiation intensity calculation module is used to calculate the infrared radiation intensity of the target component based on the first projection area, the temperature of the target component and the band range.
[0045] An embodiment of the present invention provides an electronic device, which includes a processor, a memory, and a program or instruction stored in the memory and executable on the processor, wherein the program or instruction, when executed by the processor, implements the steps of any one of the above-mentioned infrared radiation intensity calculation methods.
[0046] An embodiment of the present invention provides a readable storage medium, on which a program or instruction is stored. When the program or instruction is executed by a processor, the steps of any one of the above-mentioned infrared radiation intensity calculation methods are implemented.
[0047] The infrared radiation intensity calculation scheme provided by the embodiment of the present invention analyzes the finite element model of the target, determines the components contained in the target and the finite element units corresponding to each component; determines the detector, the detection vector and the target component; calculates the first projection area of the target component that is not blocked by other components based on the projection generated by the detector detecting the target along the detection vector; calculates the infrared radiation intensity of the target component based on the first projection area, the temperature and the band range of the target component. The scheme can efficiently and accurately estimate the infrared radiation intensity of a target such as an engine component. BRIEF DESCRIPTION OF THE DRAWINGS
[0048] Figure 1 is a flowchart showing a method for calculating infrared radiation intensity according to an embodiment of the present application;
[0049] Figure 2is a schematic diagram of a finite element model of an engine according to an embodiment of the present application;
[0050] Figure 3 is a schematic diagram showing the shielding relationship between the nozzle and the heat shield of an embodiment of the present application;
[0051] Figure 4 is a flowchart showing the steps of calculating a first projection area of a target component that is not blocked by other components in an embodiment of the present application;
[0052] Figure 5 is a schematic projection diagram showing the entire target finite element model of an embodiment of the present application;
[0053] Figure 6 is a schematic diagram showing coordinate points of each node after projection of a finite element unit in an embodiment of the present application;
[0054] Figure 7 It is a schematic diagram showing the position of the finite element unit in the projection of the component;
[0055] Figure 8 is a schematic diagram showing that a pixel block of an embodiment of the present application falls into a finite element unit;
[0056] Fig. 9 It is a structural block diagram of an infrared radiation intensity calculation device according to an embodiment of the present application. DETAILED DESCRIPTION
[0057] In order to make the technical problems, technical solutions and advantages to be solved by the present invention more clear, a detailed description will be given below with reference to the accompanying drawings and specific embodiments.
[0058] The infrared radiation intensity calculation scheme provided in the embodiment of the present application can estimate the infrared radiation intensity of one or more components of the target. When estimating the infrared radiation intensity, it is necessary to first establish a projection vector for the component according to the position of the detector and the position of the target (such as an aircraft engine), calculate the remaining area of the selected component after being blocked by other components of the target under the projection vector, and estimate the infrared radiation of the target component based on the unblocked area of the component, the empirical temperature and band range assigned to the component, and Planck's formula. The calculation results can be used to perform a preliminary infrared radiation evaluation on the component, and the evaluation results can be further used as a design reference for the component or target structure.
[0059] The infrared radiation intensity calculation scheme provided in the embodiment of the present application is described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.
[0060] As attached Figure 1 As shown, the infrared radiation intensity calculation method of the embodiment of the present application includes the following steps:
[0061] Step 101: Analyze the finite element model of the target to determine the components included in the target and the finite element units corresponding to the components.
[0062] Wherein, an object includes at least two parts, and each part includes multiple finite element units.
[0063] The infrared radiation intensity calculation method in the embodiment of the present application is applied to an electronic device, which is a device with computing capabilities. An infrared radiation intensity calculation program is run on the processor of the electronic device to implement the infrared radiation intensity calculation method in the embodiment of the present application.
[0064] In the embodiment of the present application, a certain type of aircraft engine is taken as a target, and a nozzle contained in the engine is taken as a target component as an example to illustrate a method for calculating the infrared radiation intensity of the nozzle.
[0065] In the actual implementation process, the finite element model of the engine is as follows Figure 2 As shown, the finite element model of the analytical engine can determine that the engine includes components such as the nozzle and the heat shield. In this example, the nozzle is selected as the target component.
[0066] Figure 3 It is a schematic diagram of the shielding relationship between the nozzle and the heat shield. The heat shield partially shields the nozzle. In the embodiment of the present application, the focus is on calculating the area of the portion of the nozzle that is not shielded by the heat shield.
[0067] Depend on Figure 2 and Figure 3 It can be seen that the finite element model of the target (i.e., the aircraft engine) includes units and node coordinates. By parsing the file of the target finite element model, the information of each finite element unit (such as quadrilaterals, triangles, etc.) can be obtained, and the three-dimensional coordinates of each corner point (i.e., node) of each finite element unit can be obtained. At the same time, the grouping in the target finite element model can obtain the finite element units contained in each component in the target finite element model.
[0068] It should be noted that the target in the embodiments of the present application is only described by taking an aircraft engine as an example. In the actual implementation process, the target can be any appropriate object.
[0069] Step 102: Determine the detector, detection vector and target component.
[0070] Since the target includes multiple components, in the embodiment of the present application, one component is selected as the target component to calculate the infrared radiation intensity of the target component.
[0071] Step 103: Calculate a first projection area of the target component that is not blocked by other components based on the projection generated by the detector detecting the target along the detection vector.
[0072] Continue Figure 3For example, the nozzle is selected as the target component. The nozzle model is projected as follows Figure 3 As shown in the figure, a part of the nozzle is blocked by the heat shield, and the area of the entire nozzle that is not blocked is the required area. According to the definition of the detection point, the coordinates of the detection point and the definition of the direction vector, all the node coordinates in the target finite element model are projected along the direction vector to the projection plane perpendicular to the direction vector. On the projection plane (in the local coordinate system), all the coordinates in the z direction are the same, and only the x coordinate and the y coordinate are considered. Therefore, it is necessary to transform the coordinates of each finite element unit node in the target finite element model, and then calculate the area of the unblocked part of the target component based on the transformed node coordinates, that is, the first projection area.
[0073] For the specific implementation of calculating the first projection area, please refer to the relevant description in the subsequent embodiments, which will not be repeated here.
[0074] Step 104: Calculate the infrared radiation intensity of the target component based on the first projection area, the temperature of the target component, and the wavelength range.
[0075] In the embodiment of the present application, the infrared radiation intensity of the target component is calculated according to the temperature, the first projection area and the band range of the selected target component by Planck's formula, and the calculated infrared radiation intensity is used to perform infrared radiation evaluation on the target component.
[0076] A method for calculating the infrared radiation intensity of a target component based on the first projection area, the target component and the wavelength range includes the following sub-steps:
[0077] Sub-step 1, determining the blackbody spectral radiation brightness corresponding to the target component according to the temperature of the target component and the target wavelength within the wavelength band;
[0078] More specifically, the temperature of the target component, the target wavelength within the waveband range, and a preset radiation constant may be substituted into the Planck formula to calculate the blackbody spectral radiation brightness corresponding to the target component.
[0079] Planck's formula is as follows:
[0080] ;in, The temperature is T and the wavelength is The blackbody spectral radiation brightness, c1 and c2 are the first radiation constant and the second radiation constant respectively.
[0081] Sub-step 2, calculating a second projection area perpendicular to the first projection area and the detector according to the angle between the normal of the first projection area and the detection vector;
[0082] Assume that the first projected area is marked as , the angle between the normal of the first projection area and the direction vector of the detector is , then the area perpendicular to the detector, i.e. the second projection area, is: ; Sub-step 3, the product of the black body spectral radiation brightness and the second projection area is determined as the infrared radiation intensity of the target component.
[0083] The infrared radiation intensity calculation formula can be: .
[0084] It should be noted that the above is a process for calculating the infrared radiation intensity of a target component in the target. In actual implementation, the target component can be reselected and the above process can be repeated to calculate the infrared radiation intensity of other components.
[0085] In the embodiment of the present application, when calculating the infrared radiation intensity, the target component is first selected, and the unit information of the finite element is used to determine the occlusion relationship of the target component, and then the area of the remaining unoccluded part is estimated; then the Planck formula is used to quickly perform a preliminary infrared radiation intensity assessment.
[0086] Moreover, the infrared radiation intensity calculation results can also be accurately checked using the calculation results of the reverse Monte Carlo method, which enables rapid radiation intensity evaluation of the selected target components. This is not only efficient but also highly accurate in the calculated infrared radiation intensity results.
[0087] In an optional embodiment, a method of calculating a first projection area of a target component that is not blocked by other components according to a projection generated by the detector detecting the target along a detection vector comprises the following steps:
[0088] Step 201: transforming the node coordinates of the finite element unit corresponding to each component according to the detection vector to obtain the transformed coordinates of the nodes of the finite element unit corresponding to each component.
[0089] In the embodiment of the present application, the target is still an aircraft engine, and the target component is a nozzle included in the aircraft engine. Figure 2 and Figure 3 It can be seen that the nozzle is partially blocked by the heat shield, and the area after the entire nozzle is blocked is the first projection area that is not blocked by other components. According to the definition of the detection point, the coordinates of the detection point and the direction vector, all node coordinates in the target finite element model are projected along the direction vector to the projection plane perpendicular to the direction vector. On this projection plane (in the local coordinate system), all z-direction coordinates are the same, and only x- and y-coordinates are considered. The specific transformation formula is as follows:
[0090] The transformation matrix is as follows, where u z The direction vector defined for the detector is the detection vector: ;
[0091] The original coordinates of a node in the finite element unit are: x 1、 y 1、 z1, the transformed node coordinate is x 2、 y 2、 z2: ;
[0092] Step 202: Construct a rectangular graph according to the transformed coordinates of the nodes.
[0093] The coordinates of all nodes in the target finite element model are transformed to obtain transformed coordinates, and a rectangular diagram is constructed based on the transformed coordinates.
[0094] The rectangular diagram includes all projections of the target finite element model.
[0095] An alternative way to construct a rectangular map based on the transformed coordinates of the nodes can be as follows:
[0096] The maximum value in the X direction, the minimum value in the X direction, the maximum value in the Y direction and the minimum value in the Y direction are found from the transformed coordinates of each node; a rectangular graph is constructed with the nodes corresponding to the maximum value in the X direction, the minimum value in the X direction, the maximum value in the Y direction and the minimum value in the Y direction as rectangular graph nodes.
[0097] Step 203: Divide the rectangular image into a plurality of pixel blocks.
[0098] Each finite element unit corresponds to multiple pixel blocks.
[0099] After constructing the rectangular diagram, the x direction is divided into several pixels along the length direction, and the y direction is divided into several pixels along the length direction (such as 1000). The length xStep of each pixel in the x direction (i.e., the step length in the x direction) and the length yStep of each pixel in the y direction (i.e., the step length in the y direction) can be obtained. The area of each pixel block is xStep*yStep, and the index value of each pixel in the x direction and y direction can be expressed as xIndex, yIndex. The projection diagram of the entire target finite element model is as follows: Figure 5 As shown, a small black square represents a pixel block at a certain position.
[0100] Step 204: construct a sub-rectangular frame for each finite element unit.
[0101] After the projection is completed, first cycle the finite element units in the unselected parts. The finite element unit shape diagram is as follows Figure 6 As shown, the maximum and minimum values of each finite element in the x and y directions are respectively X1min, X1max, Y1min, and Y1max, thereby constructing a sub-rectangular frame of the finite element unit. The position of the finite element unit in the projection rectangle covering the entire component is as follows Figure 7 shown.
[0102] Step 205: for each second component included in the target, traverse each finite element unit corresponding to the second component to determine each first pixel block falling into the corresponding sub-rectangular frame and each second pixel block not falling into the corresponding sub-rectangular frame.
[0103] The second component is other components among the components included in the target except the selected target component.
[0104] The actual finite element unit is not a rectangle after projection, so it is necessary to judge whether the pixel block contained in the sub-rectangular frame is within the projection of the finite element unit. If it is, the index values of the x-direction and y-direction of the pixel block are recorded as occupied, otherwise it is recorded as unoccupied. In the actual implementation process, it is necessary to traverse each pixel block corresponding to each finite element unit of each second component, and generate an index value list for the pixel blocks that fall into the finite element unit and the pixel blocks that do not fall into the finite element unit.
[0105] The index value list includes not only the index value corresponding to the pixel block, but also the second distance associated with the index value, where the second distance is the distance between the intersection of the pixel block corresponding to the index value and the finite element unit and the detector.
[0106] A method for optionally traversing each finite element unit corresponding to the second component for each second component included in the target, and determining each first pixel block falling into the corresponding sub-rectangular frame and each second pixel block not falling into the corresponding sub-rectangular frame comprises the following steps:
[0107] Step 1: for each second component included in the target, determine each finite element unit corresponding to the second component;
[0108] Step 2: for each finite element unit, determine each pixel block corresponding to the finite element unit;
[0109] Step 3: for each target pixel block in each pixel block corresponding to the finite element unit, determine whether the target pixel block falls into the sub-rectangular frame corresponding to the finite element unit according to the relationship between the center coordinates of the target pixel block and the coordinates of each node of the finite element unit;
[0110] The target pixel blocks are the pixel blocks corresponding to the finite element unit; or, the target pixel blocks are the pixel blocks located at the edge of the sub-rectangular frame corresponding to the finite element unit.
[0111] Reference Figure 8 The schematic diagram of the pixel block in the finite element unit falls into the finite element unit. The method for judging whether the target pixel block falls into the finite element unit can be as follows:
[0112] The coordinates of the center point of the target pixel block are taken as the coordinate point, and the point is used to make a vector with each node of the finite element unit.
[0113] Defining vectors is the vector from the intersection point P of the target pixel block center and the finite element unit to each vertex of the surface element, is the number of finite element nodes.
[0114] Whether the target pixel block falls within the finite element unit is determined as follows: ;
[0115] In the formula To obtain the remainder, is the unit normal vector.
[0116] when When the condition holds true for all nodes included in the finite element unit, it means that the target pixel block falls into the finite element unit. When the condition does not hold true for any node, it means that the target pixel block does not fall into the finite element unit.
[0117] In actual calculation, if the pixel blocks corresponding to each finite element unit in the entire second component projection coverage matrix are cycled once, the calculation efficiency is low. Therefore, in order to improve the calculation efficiency, only the pixel blocks around the finite element unit can be cycled, and the covering rectangular block of the finite element unit, that is, the sub-rectangular frame, is obtained in the same way, and the starting position and ending position of the pixel block in the finite element unit rectangular block in the entire component rectangular diagram are calculated. The calculation method can be as follows:
[0118] The starting position of the pixel block in the x direction: istarnt = (X1min-Xmin) / xStep;
[0119] The starting position of the pixel block in the y direction jstart=(Y1min-Ymin) / yStep;
[0120] The end position of the pixel block in the x direction: iend = (X1max-Xmin) / xStep;
[0121] The end position of the pixel block in the y direction is jend=(Y1max-Ymin) / yStep.
[0122] Step 4: Determine the target pixel block that falls within the sub-rectangular frame as the first pixel block, and determine the target pixel block that does not fall within the sub-rectangular frame as the second pixel block.
[0123] This optional judgment method of determining whether a target pixel block falls within a corresponding finite element unit has a small amount of calculation and a high accuracy of the judgment result.
[0124] Step 206: Generate a first list containing index values of each first pixel block and a second list containing index values of each second pixel block respectively.
[0125] After the traversal and judgment of all pixel blocks corresponding to the unselected components, i.e., the second components, are completed, the pixel block index values occupied in the entire target finite element model projection are recorded in the first list, which can be defined as Set0; the unoccupied pixel index set is recorded in the second list, which can be defined as Set1.
[0126] Step 207: Calculate a first projection area of the target component that is not blocked by other components based on the second list and the pixel blocks corresponding to each finite element unit included in the target component.
[0127] After traversing all the finite element units behind all the unselected components in the target, traverse all the finite element units of the selected target components. Determine whether the projected pixel blocks corresponding to each finite element unit fall into the finite element unit. If it is determined that the index value of the pixel block is in Set1, further determine whether the distance between the intersection of the pixel block and the finite element unit and the detector is less than the minimum distance associated with the index value recorded in the second list. If it is satisfied, the area of the pixel block is accumulated to the first projection area that is not blocked by other components until all the finite element units of the target component are traversed. The area obtained after accumulation is the first projection area.
[0128] It should be noted that some pixel blocks in the finite element unit of the target component may fall into set0. The area of the pixel blocks in set0 does not participate in the accumulation, indicating that they are blocked by other components and cannot be seen along the vector direction of the detector.
[0129] A method of optionally calculating a first projection area of a target component that is not blocked by other components based on the second list and the pixel blocks corresponding to each finite element unit included in the target component may include the following steps:
[0130] Step 1: for each finite element unit included in the target component, traverse the index value of each pixel block included in the finite element unit one by one to see whether it is in the second list;
[0131] The second list includes a second distance associated with each index value, and the second distance is a distance between an intersection of a pixel block corresponding to the index value and a finite element unit and the detector;
[0132] Step 2: for each target pixel block whose index value is in the second list, determine the target index value corresponding to each target pixel block;
[0133] Step 3: for each target pixel block, determine whether a first distance between the intersection of the target pixel block and the finite element unit and the detector is less than a second distance associated with the corresponding target index value;
[0134] Step 4: Accumulate the areas of target pixel blocks whose index values are in the second list and whose corresponding first distances are smaller than the second distances;
[0135] Step 5: The accumulated area obtained after traversing all the finite element units contained in the target component is determined as the first projection area of the target component that is not blocked by other components.
[0136] It should be noted that after the index values of the pixel blocks are accumulated, the index values are no longer accumulated after the first projection area is calculated once, so as to avoid repeated superposition of areas.
[0137] The infrared radiation intensity calculation method provided in the embodiment of the present application analyzes the finite element model of the target, determines the components included in the target and the finite element units corresponding to each component; determines the detector, the detection vector and the target component; calculates the first projection area of the target component that is not blocked by other components based on the projection generated by the detector detecting the target along the detection vector; and calculates the infrared radiation intensity of the target component based on the first projection area, the temperature of the target component and the band range.
[0138] The method can efficiently and accurately estimate the infrared radiation intensity of a target such as an engine component. Since the infrared radiation intensity of a component can be efficiently estimated, the component design cycle can be shortened.
[0139] Moreover, this method can fuse infrared images of various targets with scenes. Compared with the prior art of coupling various targets with scenes for infrared radiation characteristic analysis, it takes less time and has higher estimation accuracy.
[0140] Fig. 9 A structural block diagram of an infrared radiation intensity calculation device for implementing an embodiment of the present application.
[0141] The infrared radiation intensity calculation device provided in the embodiment of the present application includes the following functional modules:
[0142] The analysis module 901 is used to analyze the finite element model of the target, and determine the components contained in the target and the finite element units corresponding to the components; wherein one target includes at least two components, and each component includes multiple finite element units;
[0143] A determination module 902 is used to determine the detector, the detection vector and the target component;
[0144] An area calculation module 903 is used to calculate a first projection area of the target component that is not blocked by other components based on a projection generated by the detector detecting the target along the detection vector;
[0145] The radiation intensity calculation module 904 is used to calculate the infrared radiation intensity of the target component based on the first projection area, the temperature of the target component and the wavelength range.
[0146] Optionally, the area calculation module includes:
[0147] The first submodule is used to transform the node coordinates of the finite element unit corresponding to each component according to the detection vector to obtain the transformed coordinates of the node of the finite element unit corresponding to each component;
[0148] A second submodule is used to construct a rectangular diagram according to the transformed coordinates of the nodes, wherein the rectangular diagram contains all projections of the target finite element model;
[0149] A third submodule is used to divide the rectangular image into a plurality of pixel blocks, wherein each finite element unit corresponds to a plurality of pixel blocks;
[0150] The fourth submodule is used to construct a sub-rectangular frame for each finite element unit;
[0151] A fifth submodule is used for traversing each finite element unit corresponding to each second component included in the target, and determining each first pixel block falling into the corresponding sub-rectangular frame and each second pixel block not falling into the corresponding sub-rectangular frame; wherein the second component is other components included in the target except the target component;
[0152] A sixth submodule, configured to respectively generate a first list including index values of each of the first pixel blocks and a second list including index values of each of the second pixel blocks;
[0153] The seventh submodule is used to calculate the first projection area of the target component that is not blocked by other components based on the second list and the pixel blocks corresponding to each finite element unit included in the target component.
[0154] Optionally, the second submodule is specifically used for:
[0155] Find the maximum value in the X direction, the minimum value in the X direction, the maximum value in the Y direction, and the minimum value in the Y direction from the transformed coordinates of each of the nodes;
[0156] A rectangular graph is constructed by taking the node corresponding to the maximum value in the X direction, the node corresponding to the minimum value in the X direction, the node corresponding to the maximum value in the Y direction and the node corresponding to the minimum value in the Y direction as rectangular graph nodes.
[0157] Optionally, the fifth submodule is specifically used for:
[0158] For each second component included in the target, determining each finite element unit corresponding to the second component;
[0159] For each of the finite element units, determining each pixel block corresponding to the finite element unit;
[0160] For each target pixel block in each pixel block corresponding to the finite element unit, determining whether the target pixel block falls into the sub-rectangular frame corresponding to the finite element unit according to the relationship between the center coordinates of the target pixel block and the coordinates of each node of the finite element unit;
[0161] The target pixel block falling into the sub-rectangular frame is determined as the first pixel block, and the target pixel block not falling into the sub-rectangular frame is determined as the second pixel block.
[0162] Optionally, the target pixel blocks are pixel blocks corresponding to the finite element unit; or, the target pixel blocks are pixel blocks located at the edge of the sub-rectangular frame corresponding to the finite element unit.
[0163] Optionally, the seventh submodule is specifically used for:
[0164] For each finite element unit included in the target component, traverse one by one to see whether the index value of each pixel block included in the finite element unit is in the second list; wherein the second list includes a second distance associated with each index value, and the second distance is the distance between the intersection of the pixel block corresponding to the index value and the finite element unit and the detector;
[0165] For each target pixel block whose index value is in the second list, determining a target index value corresponding to each target pixel block;
[0166] For each of the target pixel blocks, determining whether a first distance between an intersection of the target pixel block and the finite element unit and the detector is less than a second distance associated with a corresponding target index value;
[0167] Accumulate the target pixel block areas whose index values are in the second list and whose corresponding first distances are smaller than the second distance;
[0168] The accumulated area obtained after traversing all the finite element units included in the target component is determined as the first projection area of the target component that is not blocked by other components.
[0169] Optionally, the radiation intensity calculation module includes:
[0170] An eighth submodule is used to determine the blackbody spectral radiation brightness corresponding to the target component according to the temperature of the target component and the target wavelength within the wavelength band;
[0171] A ninth submodule, configured to calculate a second projection area perpendicular to the detector and located between the first projection area and the detection vector according to an angle between the normal of the first projection area and the detection vector;
[0172] The tenth submodule is used to determine the product of the black body spectrum radiation brightness and the second projection area as the infrared radiation intensity of the target component.
[0173] Optionally, the eighth submodule is specifically used to: substitute the temperature of the target component, the target wavelength within the wavelength band, and a preset radiation constant into Planck's formula to calculate the blackbody spectral radiation brightness corresponding to the target component.
[0174] In the present application embodiment Fig. 9 The infrared radiation intensity calculation device shown may be a device having an operating system.
[0175] The operating system may be an Android operating system, an iOS operating system, or other possible operating systems, which are not specifically limited in the embodiments of the present application.
[0176] The embodiments of the present application provide Fig. 9 The infrared radiation intensity calculation device shown can realize Figure 1 To avoid repetition, the various processes implemented by the method embodiment are not described here.
[0177] Optionally, an embodiment of the present application also provides an electronic device, including a processor, a memory, and a program or instruction stored in the memory and executable on the processor. When the program or instruction is executed by the processor, the various processes performed by the above-mentioned infrared radiation intensity calculation device are implemented and the same technical effect can be achieved. To avoid repetition, it will not be described here.
[0178] It should be noted that the electronic device in the embodiment of the present application includes the server described above.
[0179] The processor is the processor in the electronic device described in the above embodiment.
[0180] The readable storage medium includes a computer-readable storage medium, such as a computer read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.
[0181] It should be noted that, in this article, the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.
[0182] Without more constraints, an element defined by the phrase "comprising a..." does not exclude the existence of other identical elements in the process, method, article or apparatus comprising the element.
[0183] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.
Claims
1. A method for calculating infrared radiation intensity, characterized in that: The method comprises: Analyze the finite element model of the target to determine the components contained in the target and the finite element units corresponding to the components; wherein one target includes at least two components, and each component includes multiple finite element units; Determine the detector, detection vector and target component; Calculate a first projection area of the target component that is not blocked by other components based on a projection generated by the detector detecting the target along the detection vector; Calculating the infrared radiation intensity of the target component based on the first projection area, the temperature of the target component, and the wavelength range; The step of calculating a first projection area of the target component that is not blocked by other components according to the projection generated by the detector detecting the target along the detection vector comprises: The node coordinates of the finite element unit corresponding to each component are transformed according to the detection vector to obtain the transformed coordinates of the nodes of the finite element unit corresponding to each component; Constructing a rectangular diagram according to the transformed coordinates of the nodes, wherein the rectangular diagram includes all projections of the target finite element model; Dividing the rectangular image into a plurality of pixel blocks, wherein each finite element unit corresponds to a plurality of pixel blocks; Construct a sub-rectangular frame for each finite element unit; For each second component included in the target, traverse each finite element unit corresponding to the second component to determine each first pixel block falling into the corresponding sub-rectangular frame and each second pixel block not falling into the corresponding sub-rectangular frame; wherein the second component is other components included in the target except the target component; Generate a first list containing index values of each first pixel block and a second list containing index values of each second pixel block respectively; wherein each pixel block corresponds to an index value; A first projection area of the target component that is not blocked by other components is calculated according to the second list and the pixel blocks corresponding to each finite element unit included in the target component.
2. The infrared radiation intensity calculation method according to claim 1, characterized in that: The step of constructing a rectangular graph according to the transformed coordinates of the nodes comprises: Find the maximum value in the X direction, the minimum value in the X direction, the maximum value in the Y direction, and the minimum value in the Y direction from the transformed coordinates of each of the nodes; A rectangular graph is constructed by taking the node corresponding to the maximum value in the X direction, the node corresponding to the minimum value in the X direction, the node corresponding to the maximum value in the Y direction and the node corresponding to the minimum value in the Y direction as rectangular graph nodes.
3. The infrared radiation intensity calculation method according to claim 1, characterized in that: For each second component included in the target, traverse each finite element unit corresponding to the second component, and determine each first pixel block falling into the corresponding sub-rectangular frame and the second pixel block not falling into the corresponding sub-rectangular frame, including: For each second component included in the target, determining each finite element unit corresponding to the second component; For each of the finite element units, determining each pixel block corresponding to the finite element unit; For each target pixel block in each pixel block corresponding to the finite element unit, determining whether the target pixel block falls into the sub-rectangular frame corresponding to the finite element unit according to the relationship between the center coordinates of the target pixel block and the coordinates of each node of the finite element unit; The target pixel block falling into the sub-rectangular frame is determined as the first pixel block, and the target pixel block not falling into the sub-rectangular frame is determined as the second pixel block.
4. The infrared radiation intensity calculation method according to claim 3, characterized in that: The target pixel blocks are the pixel blocks corresponding to the finite element units; or, The target pixel blocks are pixel blocks located at the edge of the sub-rectangular frame corresponding to the finite element unit.
5. The infrared radiation intensity calculation method according to claim 1, characterized in that: The step of calculating a first projection area of the target component that is not blocked by other components according to the second list and the pixel blocks corresponding to each finite element unit included in the target component comprises: For each finite element unit included in the target component, traverse one by one to see whether the index value of each pixel block included in the finite element unit is in the second list; wherein the second list includes a second distance associated with each index value, and the second distance is the distance between the intersection of the pixel block corresponding to the index value and the finite element unit and the detector; For each target pixel block whose index value is in the second list, determining a target index value corresponding to each target pixel block; For each of the target pixel blocks, determining whether a first distance between an intersection of the target pixel block and the finite element unit and the detector is less than a second distance associated with a corresponding target index value; Accumulate the target pixel block areas whose index values are in the second list and whose corresponding first distances are smaller than the second distance; The accumulated area obtained after traversing all the finite element units included in the target component is determined as the first projection area of the target component that is not blocked by other components.
6. The infrared radiation intensity calculation method according to claim 1, characterized in that: The step of calculating the infrared radiation intensity of the target component based on the first projection area, the target component and the waveband range comprises: Determine the blackbody spectral radiation brightness corresponding to the target component according to the temperature of the target component and the target wavelength within the wavelength band; Calculating a second projection area perpendicular to the detector and the first projection area according to an angle between the normal of the first projection area and the detection vector; The product of the black body spectrum radiation brightness and the second projection area is determined as the infrared radiation intensity of the target component.
7. The infrared radiation intensity calculation method according to claim 6, characterized in that: The step of determining the blackbody spectral radiation brightness corresponding to the target component according to the temperature of the target component and the target wavelength within the wavelength band includes: The temperature of the target component, the target wavelength within the wavelength band, and a preset radiation constant are substituted into the Planck formula to calculate the blackbody spectral radiation brightness corresponding to the target component.
8. An infrared radiation intensity calculation device, characterized in that: The device comprises: An analysis module, used for analyzing the finite element model of the target, determining the components contained in the target and the finite element units corresponding to the components; wherein one target includes at least two components, and each component includes multiple finite element units; A determination module, used to determine the detector, the detection vector and the target component; An area calculation module, configured to calculate a first projection area of the target component that is not blocked by other components based on a projection generated by the detector detecting the target along the detection vector; A radiation intensity calculation module, used for calculating the infrared radiation intensity of the target component based on the first projection area, the temperature of the target component and the wavelength range; Wherein, the area calculation module includes: The first submodule is used to transform the node coordinates of the finite element unit corresponding to each component according to the detection vector to obtain the transformed coordinates of the node of the finite element unit corresponding to each component; A second submodule is used to construct a rectangular diagram according to the transformed coordinates of the nodes, wherein the rectangular diagram contains all projections of the target finite element model; A third submodule is used to divide the rectangular image into a plurality of pixel blocks, wherein each finite element unit corresponds to a plurality of pixel blocks; The fourth submodule is used to construct a sub-rectangular frame for each finite element unit; A fifth submodule is used for traversing each finite element unit corresponding to each second component included in the target, and determining each first pixel block falling into the corresponding sub-rectangular frame and each second pixel block not falling into the corresponding sub-rectangular frame; wherein the second component is other components included in the target except the target component; A sixth submodule, configured to respectively generate a first list including index values of each of the first pixel blocks and a second list including index values of each of the second pixel blocks; The seventh submodule is used to calculate the first projection area of the target component that is not blocked by other components based on the second list and the pixel blocks corresponding to each finite element unit included in the target component.
9. An electronic device, characterized in that: The electronic device includes a processor, a memory, and a program or instruction stored in the memory and executable on the processor, wherein the program or instruction is executed by the processor to execute the steps of any one of the infrared radiation intensity calculation methods described in claims 1-7.
