Chip carrier frame cutting and leveling device and method

Abstract

The present invention discloses a chip carrier frame cutting and leveling device and method, which belongs to the technical field of semiconductor device processing. The chip carrier frame cutting and leveling device includes n leveling devices arranged at a predetermined distance, n-1 stacking units respectively arranged between two adjacent leveling devices, and one end limit unit, one lower cutting component, and one unloading unit. Each stacking unit includes an upper cutting component and a stacking side limit component. The chip carrier frame cutting and leveling method includes the steps of loading, cutting sub-plates, placing sub-plates, transferring workpieces and sub-plates as a whole, cutting out chip carrier frames, and stacking. The present invention alternately leveled and cut the chip carrier frame, which is finally convenient for stacking and collection, and can improve the efficiency of chip carrier frame production.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor device processing, and in particular to a chip carrier frame cutting and leveling device and method. Background Art

[0002] Chip carrier frames, also known as lead frames, have two main processes: punching and etching. The punching process is more common in actual production. The main steps of this process include: punching, electroplating, cutting and leveling, packaging, etc. The raw material used is copper coil. Specifically, when making chip carrier frames, a row of multiple chip carrier frames are punched and electroplated in the width direction of the copper coil. In the prior art, it is necessary to cut off multiple rows of connected chip carrier frames each time along the length direction of the copper coil, put the cut whole into a leveling machine for leveling, and then cut each chip carrier frame, and then manually stack and collect these chip carrier frames, which is relatively complicated to operate. Summary of the invention

[0003] In view of the above-mentioned defects, the present invention provides a chip carrier frame cutting and leveling device and method, which alternately performs leveling and cutting, and finally facilitates stacking and collection, thereby improving the efficiency of chip carrier frame production.

[0004] In order to achieve the purpose of the present invention, the following technologies are proposed:

[0005] A chip carrier frame cutting and leveling device, comprising:

[0006] n leveling devices arranged at predetermined intervals;

[0007] n-1 stacking units are respectively arranged between two adjacent leveling devices, each stacking unit includes an upper cutting assembly and a stacking side limit assembly; the upper cutting assembly includes a pair of first linear mechanisms, and a first laser cutter with a cutting head facing vertically downward is provided at the output end of the first linear mechanism; the stacking side limit assembly includes a pair of vertically arranged second linear mechanisms, and a lifting plate is provided at the upper end of the output shaft, and a third linear mechanism is provided on the outer side of the lifting plate, and a side limit plate is provided at the output end of the third linear mechanism;

[0008] The end limit unit disposed above the stacking unit includes two linear moving mechanisms that move bidirectionally in a direction parallel to the conveying direction of the workpiece, a fourth linear mechanism is vertically disposed at the sliding end thereof, and an inverted T-shaped plate is disposed at the lower end of the output shaft of the fourth linear mechanism;

[0009] The cutting assembly arranged at the conveying end side of the workpiece comprises a fifth linear mechanism, a sixth linear mechanism is arranged on the sliding end of the fifth linear mechanism, and a second laser cutter is arranged at one side of the output end of the sixth linear mechanism, and the cutting head thereof is vertically facing upward;

[0010] The unloading unit arranged at the other side of the conveying end of the workpiece includes a seventh linear mechanism, a rotating motor is arranged at its sliding end, and two clamping mechanisms arranged along its axial direction are arranged at the output end of the rotating motor. Further, a first cutting seat is arranged below each first laser cutter.

[0011] Furthermore, an extension plate is provided on the outer side surface of the lifting plate, and the third linear mechanism is provided on the extension plate.

[0012] Furthermore, the lower end surface of the side limit plate is slidably matched with the upper end surface of the lifting plate.

[0013] Furthermore, a transverse plate is provided at one end of the output shaft of the sixth linear mechanism, a C-shaped frame is provided at one end of the transverse plate, the second laser cutter is provided at one end of the lower transverse side of the C-shaped frame, and a second cutting seat is provided at one end of the upper transverse side of the C-shaped frame.

[0014] Furthermore, the clamping mechanism includes an L-shaped plate, an eighth linear mechanism is vertically provided on one side of the vertical side of the L-shaped plate, and a clamping plate matching the horizontal side of the L-shaped plate is provided at the lower end of the output shaft.

[0015] Furthermore, a rotating block is provided at the output end of the rotating motor, and two L-shaped plates are both provided on one side of the rotating block.

[0016] Furthermore, a slide groove is provided below one end of the seventh linear mechanism, and a collection frame is provided below one end of the slide groove.

[0017] A chip carrier frame cutting and leveling method using a chip carrier frame cutting and leveling device comprises the following steps:

[0018] S01: First, the workpiece is sent to the leveling device at the starting end of the conveying, and then the workpiece continues to move;

[0019] S02: When one end of the workpiece is located below the cutting head of the first laser cutter of the stacking unit into which the workpiece enters, the first laser cutter is started, and through the movement of the workpiece, the two first laser cutters respectively cut two cuts on the workpiece, and the distance from each cut to the outer edge in the width direction of the workpiece is equal to 1 / 4 of the width of the workpiece conveying end. After cutting a predetermined length, the movement of the workpiece is paused, and then the first laser cutters are respectively moved outwards by the two first linear mechanisms to cut at least two split panels from the workpiece;

[0020] S03: Raise each of the split plates to a predetermined height through the two second linear mechanisms in the stacking unit described in S02, and then push the side limit plate through the third linear mechanism, so that the two groups of plates on both sides are pushed to the top of the workpiece conveying terminal, and the inner side surfaces of the two groups of plates are in contact with each other;

[0021] S04: If the total number of leveling devices is two, directly execute S06; if the total number of leveling devices is greater than two, execute S05 first and then execute S06;

[0022] S05: one end of the workpiece moves to the next stacking unit, and steps S02 to S03 are repeated until there is no adjacent stacking unit in the conveying direction of the leveling device used. During the movement, the side limit plate keeps the limit position of the split plate, and the inverted T-shaped plate is lowered by the fourth linear mechanism, and the two inverted T-shaped plates are moved synchronously with each split plate by the linear moving mechanism;

[0023] S06: After the workpiece is leveled by the leveling device at the conveying end, it continues to move to the top of the second laser cutter, and stops the workpiece when the distance between the position of the cutting head of the second laser cutter and the end of the workpiece is the same as the length of the chip carrier frame, and then the chip carrier frame is clamped by the clamping mechanism, and the cutting head of the second laser cutter is moved along the width direction of the workpiece by the fifth linear mechanism to cut off a plurality of chip carrier frames, and the chip carrier frame is moved by the seventh linear mechanism, and then the chip carrier frame is rotated by the rotating motor, and then the clamping mechanism is released to collect the chip carrier frame, and then a plurality of chip carrier frames are cut off again along the width direction of the workpiece, and a plurality of chip carrier frames are transferred and collected again by the unloading unit, and the chip carrier frames are cut off and collected multiple times until all chip carrier frames on the sub-plates having the same width as the chip carrier frame have been cut off;

[0024] S07: Move the workpiece in the reverse direction by a predetermined distance so that the end of the workpiece returns to below the stacking unit at the original conveying end, cut out and stack the split boards again, and then repeat S06;

[0025] S08: Continue to move the workpiece forward and repeat S02 to S07 until all chip carriers on the entire roll of workpiece are leveled and cut.

[0026] The beneficial effects of this technical solution are:

[0027] By gradually leveling, reducing the width of the workpiece and stacking the workpiece, leveling and cutting are performed alternately. When it finally reaches the unloading position, a row of chip carrier racks has been stacked into two groups, and leveling has been performed multiple times. Finally, it is completely cut off, so that the chip carrier racks can be easily collected, which can simplify the operation and improve efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 An overall stereoscopic view of the chip carrier frame cutting and leveling device according to an embodiment of the present application is shown.

[0029] Figure 2 A three-dimensional view of a stacking unit of the chip carrier frame cutting and leveling device according to an embodiment of the present application is shown.

[0030] Figure 3 A three-dimensional view of another stacking unit of the chip carrier frame cutting and leveling device according to an embodiment of the present application is shown.

[0031] Figure 4 A three-dimensional view of a lower cutting component of a chip carrier frame cutting and leveling device according to an embodiment of the present application is shown.

[0032] Figure 5 A three-dimensional diagram of a material unloading unit of a chip carrier frame cutting and leveling device according to an embodiment of the present application is shown.

[0033] Figure 6 Schematic diagrams of various states of workpieces in the chip carrier frame cutting and leveling method according to an embodiment of the present application are shown.

[0034] Figure 7 A three-dimensional view of a workpiece according to an embodiment of the present application is shown as viewed from the bottom.

[0035] Figure 8 The present application embodiment is shown Figure 6 Enlarged view of part G.

[0036] Fig. 9 The present application embodiment is shown Figure 6 Enlarged view of part H.

[0037] Markings in the figure: upper cutting component 1, stacking side limit component 2, first linear mechanism 11, first laser cutter 12, first cutting seat 13, second linear mechanism 21, lifting plate 22, extension plate 23, third linear mechanism 24, side limit plate 25, fourth linear mechanism 31, inverted T-plate 32, leveling device 4, lower cutting component 5, fifth linear mechanism 51, sixth linear mechanism 52, cross plate 53, C-frame 54, second laser cutter 55, second cutting seat 56, unloading unit 6, seventh linear mechanism 61, rotating motor 62, rotating block 63, L-plate 64, eighth linear mechanism 65, clamping plate 66, slide 67, collection frame 68, workpiece 7, first stack of plates 71, second stack of plates 72. DETAILED DESCRIPTION

[0038] The present application is further described below in conjunction with the accompanying drawings and embodiments.

[0039] like Figure 1~Figure 5 The chip carrier frame cutting and leveling equipment shown includes n leveling devices 4 arranged at a predetermined distance, n-1 stacking units respectively arranged between two adjacent leveling devices 4, and one end limit unit, one lower cutting component 5, and one unloading unit 6. In this embodiment, the number of leveling devices 4 is three, and the number of stacking units is two.

[0040] Specifically, the leveling device 4 adopts machines in the prior art such as leveling machines, hydraulic presses, rolling rollers, folding machines, etc., which can be used for leveling metal plates.

[0041] like Figure 1~Figure 3As shown, each stacking unit includes an upper cutting component 1 and a stacking side limit component 2. The upper cutting component 1 includes a pair of first linear mechanisms 11 which are relatively arranged and whose output direction is perpendicular to the conveying direction of the workpiece 7. Specifically, the workpiece 7 refers to a copper strip that has been punched and electroplated for making a chip carrier frame. The output end of the first linear mechanism 11 is provided with a first laser cutter 12 with a cutting head facing vertically downward, and a first cutting seat 13 is provided under each first laser cutter 12. The stacking side limit component 2 is located at one end of the upper cutting component 1. Specifically, the upper cutting component 1 and the stacking side limit component 2 in a single stacking unit are sequentially along the conveying direction of the workpiece 7, that is, Figure 1 The stacking side limit assembly 2 is arranged in the direction shown by the arrow A in the figure. The stacking side limit assembly 2 includes a pair of vertically arranged second linear mechanisms 21. A lifting plate 22 is provided at the upper end of the output shaft of the second linear mechanism 21. An extension plate 23 is provided on the outer side of the lifting plate 22. A third linear mechanism 24 whose output direction is perpendicular to the conveying direction of the workpiece 7 is provided on the extension plate 23. The output direction of the third linear mechanism 24 is also perpendicular to the output direction of the second linear mechanism 21. A side limit plate 25 is provided at the output end of the third linear mechanism 24. The lower end surface of the side limit plate 25 is slidably matched with the upper end surface of the lifting plate 22.

[0042] like Figure 1 The end limit unit shown in the figure is arranged above the stacking unit, and includes two linear moving mechanisms that can move bidirectionally in a direction parallel to the conveying direction of the workpiece 7. Specifically, the linear moving mechanism is fixed to the ceiling of the processing workshop, and adopts linear guides, linear motors, etc. in the prior art. For the sake of convenience, it is not shown in the accompanying drawings. A fourth linear mechanism 31 is vertically provided under the sliding end of the linear moving mechanism, and an inverted T-shaped plate 32 is provided at the lower end of the output shaft of the fourth linear mechanism 31.

[0043] like Figure 1 , Figure 4 As shown, the lower cutting assembly 5 is arranged on one side of the conveying end of the workpiece 7, including a fifth linear mechanism 51 whose sliding direction is parallel to the output direction of the third linear mechanism 24, a sixth linear mechanism 52 parallel to the conveying direction of the workpiece 7 is provided on the sliding end of the fifth linear mechanism 51, a horizontal plate 53 is provided at one end of the output shaft of the sixth linear mechanism 52, a C-frame 54 is provided at one end of the horizontal plate 53, a second laser cutter 55 with a cutting head facing vertically upward is provided at one end of the lower horizontal side of the C-frame 54, and a second cutting seat 56 is provided at one end of the upper horizontal side of the C-frame 54.

[0044] like Figure 1 , Figure 5As shown, the unloading unit 6 is arranged on the other side of the conveying end of the workpiece 7, including a seventh linear mechanism 61 parallel to the fifth linear mechanism 51, a rotating motor 62 is provided at the sliding end of the seventh linear mechanism 61, a rotating block 63 is provided at the output end of the rotating motor 62, a pair of L-shaped plates 64 are provided on one side of the rotating block 63, an eighth linear mechanism 65 is vertically provided on one side of the vertical side of the L-shaped plate 64, a clamping plate 66 matching the horizontal side of the L-shaped plate 64 is provided at the lower end of the output shaft of the eighth linear mechanism 65, a slide groove 67 is also provided below one end of the seventh linear mechanism 61, and a collection frame 68 is placed below one end of the slide groove 67.

[0045] In this embodiment, the first linear mechanism 11, the second linear mechanism 21, the third linear mechanism 24, the fourth linear mechanism 31, the sixth linear mechanism 52, and the eighth linear mechanism 65 all use single-axis linear cylinders, the fifth linear mechanism 51 and the seventh linear mechanism 61 all use rodless linear cylinders, the first linear mechanism 11, the first cutting seat 13, the second linear mechanism 21, the fifth linear mechanism 51, the seventh linear mechanism 61, and the slide groove 67 are all respectively arranged on the bracket, and the first cutting seat 13 and the second cutting seat 56 are made of high melting point materials, including tungsten, molybdenum, etc.

[0046] Combined with the above figures, and Figure 6~Figure 9 By using the chip carrier frame cutting and leveling method of the chip carrier frame cutting and leveling device, the workpiece 7 having 2 positive integer chip carrier frames in the width direction can be cut, leveled and collected, and the positive integer is greater than or equal to 2, and the following steps are performed:

[0047] S01: First, the workpiece 7 is fed into the leveling device 4 at the starting end of the conveying, and then the workpiece 7 continues to move. At the beginning, the workpiece 7 is in the following state: Figure 6 In the B state, specifically, the workpiece 7 can be moved at a uniform speed by a plurality of groups of conveying rollers relatively arranged above and below the workpiece 7 in the manner as in the prior art;

[0048] S02: Starting from when one end of the workpiece 7 is located below the cutting head of the first laser cutter 12 of the stacking unit into which the workpiece 7 enters, the first laser cutter 12 is started, and through the movement of the workpiece 7, the two first laser cutters 12 respectively cut two incisions on the workpiece 7, and the distance from each incision to the outer edge of the workpiece 7 in the width direction is equal to 1 / 4 of the width of the conveying end of the workpiece 7. After cutting a predetermined length, the movement of the workpiece 7 is paused, and then the first laser cutters 12 are respectively moved outward by the two first linear mechanisms 11 to cut at least two split panels from the workpiece 7. In this embodiment, specifically, taking the first cutting as an example, two first stacked panels 71 are cut, that is, Figure 6 As shown in the C state;

[0049] S03: The two second linear mechanisms 21 in the stacking unit described in S02 are used to raise each of the split boards to a predetermined height, and then the side limit plates 25 are pushed by the third linear mechanism 24, so that the two groups of boards on both sides are pushed to the top of the conveying end of the workpiece 7, and the inner side surfaces of the two groups of boards are abutted, that is, Figure 6 For a clearer picture, refer to Figure 8 , that is, taking the first operation as an example, two first stacked plates 71 are each stacked on top of the cut section of the workpiece 7;

[0050] S04: if the total number of the leveling devices 4 is two, that is, the number of the stacking units is one, then directly execute S06; if the total number of the leveling devices 4 is greater than two, that is, the number of the stacking units is greater than one, then execute S05 first and then execute S06;

[0051] S05: the workpiece 7 resumes moving. Specifically, one end of the workpiece 7 moves to the next stacking unit, and steps S02 to S03 are repeated until there is no adjacent stacking unit in the conveying direction of the used leveling device 4. During the movement, the side limit plate 25 keeps limiting the split plate, and at the same time, the inverted T-shaped plate 32 is lowered by the fourth linear mechanism 31, and the two inverted T-shaped plates 32 are moved synchronously with each split plate by the linear moving mechanism, so that multiple plates can be limited from four directions when being leveled by the leveling device, thereby improving stability. Specifically, in this embodiment, there are two stacking units in total, so taking the operation of the second stacking unit as an example, Figure 6 As shown in the E state in FIG. 1 , two pairs, i.e., four second stacks 72 are cut out, two of which are from the workpiece 7 itself, and two are from the first stack 71. After cutting, the two sets of second stacks 72 are stacked in the middle, as shown in FIG. Figure 6 For a clearer view, see the F state in Fig. 9 , two groups of four second stacks 72 are stacked on the top of the workpiece 7 and the first stack 71 that have just been cut. Preferably, the length of the cut second stack 72 is half the length of the first stack 71, which is convenient for subsequent operations. By analogy, if the workpiece 7 is made with 8, 16, 32 or more chip carriers in the width direction, a longer process, that is, more leveling devices 4 and stacking units are used to repeat the operation. Of course, if Figure 2 , Figure 3 As shown, it can be seen that in order to cut out different sub-boards, the distance between the two stacking side limit components 2 of each stacking unit, the size of the lifting plate 22, and the distance between the two first cutting seats 13 are all different;

[0052] S06: After being leveled by the leveling device 4 at the conveying end, the workpiece 7 continues to move to the top of the second laser cutter 55, and stops when the distance between the cutting head of the second laser cutter 55 and the end of the workpiece 7 is the same as the length of the chip carrier frame. Figure 7 As shown, there is still no cut at the bottom of the workpiece 7, so it is necessary to first cut the bottom of the workpiece 7 along the length of the chip carrier frame by the sixth linear mechanism 52. Preferably, the length of the second stack 72 is equal to the length of multiple chip carrier frames, for example, three in this embodiment, and then the chip carrier frame is clamped by the clamping mechanism, and the cutting head of the second laser cutter 55 is moved along the width direction of the workpiece 7 by the fifth linear mechanism 51 to cut out multiple chip carrier frames, and the chip carrier frame is moved by the seventh linear mechanism 61, and then the chip carrier frame is rotated by the rotating motor 62, and then the clamping mechanism is released to collect the chip carrier frame, and then multiple chip carrier frames are cut out along the width direction of the workpiece 7 again, and multiple chip carrier frames are transferred and collected by the unloading unit 6 again, and the chip carrier frames are cut and collected multiple times until all chip carrier frames on the sub-plates with the same width as the chip carrier frame have been cut off. Specifically, these chip carrier frames are made to fall into the collection frame 68 through the slide slot 67. In this embodiment, combined with the above steps, it can be seen that two groups of eight chip carrier frames can be cut out at one time, and 24 chip carrier frames can be cut out three times;

[0053] S07: Move the workpiece 7 in the reverse direction by a predetermined distance, so that the end of the workpiece 7 returns to the bottom of the stacking unit at the original conveying end, cut and stack the split boards again, and then repeat S06. In this embodiment, as described in S05, the length of the cut second stack 72 is half the length of the first stack 71, so S07 only needs to be executed once;

[0054] S08: Continue to move the workpiece 7 forward, and repeat S02 to S07 until all chip carrier frames on the entire roll of workpiece 7 are leveled and cut.

[0055] The above are only some of the embodiments listed in this application and are not intended to limit this application.

Claims

1. A chip carrier frame cutting and leveling device, characterized in that: include: n leveling devices (4) arranged at predetermined intervals; n-1 stacking units are respectively arranged between two adjacent leveling devices (4), each stacking unit comprising an upper cutting assembly (1) and a stacking side limit assembly (2); the upper cutting assembly (1) comprises a pair of first linear mechanisms (11), and a first laser cutter (12) with a cutting head facing vertically downward is provided at the output end of the first linear mechanism (11); the stacking side limit assembly (2) comprises a pair of vertically arranged second linear mechanisms (21), a lifting plate (22) is provided at the upper end of the output shaft thereof, a third linear mechanism (24) is provided on the outer side of the lifting plate (22), and a side limit plate (25) is provided at the output end of the third linear mechanism (24); The end limit unit is arranged above the stacking unit, and comprises two linear moving mechanisms that move bidirectionally in a direction parallel to the conveying direction of the workpiece (7), and a fourth linear mechanism (31) is vertically arranged at the sliding end thereof, and an inverted T-shaped plate (32) is arranged at the lower end of the output shaft of the fourth linear mechanism (31); A cutting assembly (5) provided at one side of the conveying end of the workpiece (7), comprising a fifth linear mechanism (51), a sixth linear mechanism (52) being provided at a sliding end thereof, and a second laser cutter (55) being provided at one side of an output end of the sixth linear mechanism (52), a cutting head of which is vertically facing upwards; The unloading unit (6) provided on the other side of the conveying end of the workpiece (7) comprises a seventh linear mechanism (61), a sliding end of which is provided with a rotary motor (62), and an output end of the rotary motor (62) is provided with two clamping mechanisms arranged along the axial direction thereof.

2. The chip carrier frame cutting and leveling device according to claim 1, characterized in that: A first cutting seat (13) is provided below each first laser cutter (12).

3. The chip carrier frame cutting and leveling device according to claim 1, characterized in that: An extension plate (23) is provided on the outer side surface of the lifting plate (22), and the third linear mechanism (24) is provided on the extension plate (23).

4. The chip carrier frame cutting and leveling device according to claim 1, characterized in that: The lower end surface of the side limit plate (25) is slidably matched with the upper end surface of the lifting plate (22).

5. The chip carrier frame cutting and leveling device according to claim 1, characterized in that: A transverse plate (53) is provided at one end of the output shaft of the sixth linear mechanism (52), a C-shaped frame (54) is provided at one end of the transverse plate (53), a second laser cutter (55) is provided at one end of the lower transverse side of the C-shaped frame (54), and a second cutting seat (56) is provided at one end of the upper transverse side of the C-shaped frame (54).

6. The chip carrier frame cutting and leveling device according to claim 1, characterized in that: The clamping mechanism comprises an L-shaped plate (64), one side of the vertical side of the L-shaped plate (64) is vertically provided with an eighth linear mechanism (65), and the lower end of the output shaft thereof is provided with a clamping plate (66) matching the horizontal side of the L-shaped plate (64).

7. The chip carrier frame cutting and leveling device according to claim 6, characterized in that: A rotating block (63) is provided at the output end of the rotating motor (62), and two L-shaped plates (64) are both provided on one side of the rotating block (63).

8. The chip carrier frame cutting and leveling device according to claim 1, characterized in that: A slide groove (67) is further provided below one end of the seventh linear mechanism (61), and a collection frame (68) is provided below one end of the slide groove (67).

9. A chip carrier frame cutting and leveling method, characterized in that: The chip carrier frame cutting and leveling device according to any one of claims 1 to 8 comprises the following steps: S01: firstly, the workpiece (7) is fed into the leveling device (4) at the starting end of the conveying, and then the workpiece (7) is allowed to continue to move; S02: starting from when one end of the workpiece (7) is located below the cutting head of the first laser cutter (12) of the stacking unit into which the workpiece (7) enters, the first laser cutter (12) is started, and through the movement of the workpiece (7), the two first laser cutters (12) respectively cut two cuts on the workpiece (7), and the distance from each cut to the outer edge of the workpiece (7) in the width direction is equal to 1 / 4 of the width of the conveying end of the workpiece (7). After cutting a predetermined length, the movement of the workpiece (7) is paused, and then the first laser cutters (12) are respectively moved outward by the two first linear mechanisms (11) to cut at least two split panels from the workpiece (7); S03: Raise each of the split plates to a predetermined height through the two second linear mechanisms (21) in the stacking unit described in S02, and then push the side limit plate (25) through the third linear mechanism (24), so that the two groups of plates on both sides are pushed to the top of the conveying end of the workpiece (7), and the inner side surfaces of the two groups of plates are in contact with each other; S04: if the total number of the leveling devices (4) is two, then directly execute S06; if the total number of the leveling devices (4) is greater than two, then execute S05 first and then execute S06; S05: one end of the workpiece (7) moves to the next stacking unit, and steps S02 to S03 are repeated until the leveling device (4) in use has no adjacent stacking unit in the conveying direction. During the movement, the side limit plate (25) keeps the limit on the split plate, and at the same time, the inverted T-shaped plate (32) is lowered through the fourth linear mechanism (31), and the two inverted T-shaped plates (32) are moved synchronously with each split plate through the linear moving mechanism; S06: After the workpiece (7) is leveled by the leveling device (4) at the conveying end, it continues to move to the top of the second laser cutter (55), and stops the workpiece (7) when the distance between the position of the cutting head of the second laser cutter (55) and the end of the workpiece (7) is the same as the length of the chip carrier frame, and then the chip carrier frame is clamped by the clamping mechanism, and the cutting head of the second laser cutter (55) is moved along the width direction of the workpiece (7) by the fifth linear mechanism (51) to cut off a plurality of chip carrier frames, and the chip carrier frame is moved by the seventh linear mechanism (61), and then the chip carrier frame is rotated by the rotating motor (62), and then the clamping mechanism is released to collect the chip carrier frame, and then a plurality of chip carrier frames are cut off again along the width direction of the workpiece (7), and a plurality of chip carrier frames are transferred and collected again by the unloading unit (6), and the chip carrier frames are cut off and collected multiple times until all chip carrier frames on the sub-plates having the same width as the chip carrier frame have been cut off; S07: Move the workpiece (7) in the reverse direction by a predetermined distance so that the end of the workpiece (7) returns to below the stacking unit at the original conveying end, cuts out and stacks the split panels again, and then repeats S06; S08: Continue to move the workpiece (7) forward, and repeat S02 to S07 until all chip carriers on the entire roll of workpiece (7) are leveled and cut.

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