A lead frame, packaging device and packaging method for chip packaging

Abstract

The present invention relates to the technical field of chip packaging, and specifically relates to a lead frame, a packaging device and a packaging method for chip packaging. In the present invention, a plating component is used to perform plating on the glued chip and the lead frame conveyed by the feeding mechanism, and an insulating film and a conductive adhesive are plated on the area outside the connection between the chip and the pins, so as to form a conductive layer and a protective layer for chip packaging, ensuring the connection in the form of vacuum sputtering between the pins and the chip next. And an inspection mechanism is used to perform insulation inspection on the plated chip and lead frame to judge whether the plating area meets the standard, preventing misplating from affecting subsequent vacuum sputtering.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and particularly to a lead frame, a packaging device and a packaging method for chip packaging. Background Art

[0002] An IC chip (Integrated Circuit) is a chip formed by integrating a large number of microelectronic components. With the development of IC chip integration technology, the degree of integration of IC chips is getting higher and higher, and the traditional IC chip packaging technology has restricted the development of IC chip integration.

[0003] A patent document with the patent number CN2022104974021 discloses a wire-free chip packaging device, which includes a chip substrate and a chip disposed on the chip substrate, and also includes a first protective layer formed by vacuum sputtering, a conductive layer formed by vacuum sputtering, and a second protective layer. The first protective layer covers the chip and the chip substrate, the conductive layer covers the first protective layer, the second protective layer covers the conductive layer, the position of the first protective layer covering the pins of the chip is engraved into a first pad by an ultraviolet engraving machine, a second pad engraved by the ultraviolet engraving machine is disposed on the chip substrate, the conductive layer is engraved into a conductive circuit by an infrared engraving machine, and the first pad and the second pad are connected through the conductive circuit. This patent uses the first protective layer, that is, the insulating layer, to cover the position of the lead frame of the chip, and then sputters the conductive layer. The key to packaging lies in how to ensure the integrity of the coverage area of the first protective layer and the coverage area of the insulating layer formed by the first protective layer on the chip and the lead frame.

[0004] Therefore, the present invention provides a packaging method, a chip packaging lead frame and a packaging method that can distinguish the positions of the lead frame and the chip and the sputtering area, and can detect the insulating area. Summary of the Invention

[0005] To solve the above technical problems.

[0006] The present invention provides a packaging device for chip packaging. The packaging device is installed on a workbench. A feeding mechanism for a lead frame and a chip after gluing is installed on the workbench. A plating assembly capable of plating the chip and the lead frame is arranged on one side of the feeding mechanism. A unloading mechanism for unloading the chip after packaging is also arranged on the workbench. An insulating film and a conductive adhesive are plated on the chip and the lead frame through the plating assembly. A vacuum sputtering machine is also included. The lead frame, the chip and the pin are connected through vacuum sputtering. The plating assembly includes a lower film assembly and a cutting assembly. Both the lower film assembly and the cutting assembly are installed on the workbench through a cantilever seat and a moving assembly. The lower film assembly is installed on the moving assembly, and the cutting assembly is located below the lower film assembly. A detection mechanism is arranged above the feeding mechanism. The detection mechanism is fixedly installed on one side of the unloading mechanism. The detection mechanism includes a detection bracket, two groups of detection probes and a movable module. The detection bracket is fixedly installed on one side of the unloading mechanism and faces the feeding mechanism. The two groups of detection probes are installed on the detection bracket through the movable module.

[0007] Furthermore, the lower film assembly includes a film frame and a film feeding roller group for placing an insulating film. The film frame is fixedly mounted on the moving assembly, the film feeding roller group is clamped on the upper end of the film frame, the lower end of the film frame is connected to a roller frame, a driving roller group is installed in the roller frame, the driving roller group delivers the insulating film through a glue coating roller, the glue coating roller is transmission-connected to the driving roller group, the glue coating roller group is hollow inside and can be connected to an external conductive glue supply system, and a number of glue coating ports are evenly arranged on the glue coating roller.

[0008] Furthermore, the cutting assembly includes a tool holder and a cutter head. The tool holder is movably mounted on the roller frame through a lifting guide rail group 2, and the lifting guide rail group 2 is driven by a driving module. The cutter head is mounted on the lower end of the tool holder through a tool head seat. A driving cam group 2 is mounted on the tool head seat, and the driving cam group 2 is transmission-connected to the cutter head. A cutting opening is provided below the tool head seat, and the cutter head is directly opposite to the cutting opening. A film pressing head is provided on the outer side of the cutting opening.

[0009] Furthermore, a spacer assembly is installed at the center of the workbench, and the spacer assembly includes a spacer seat and a spacer plate for spacing two adjacent lead frames. The spacer plate is installed on the spacer seat through a lifting guide rail group 1, and the lifting guide rail group 2 is driven by a driving cam group 4. The spacer seat is slidably installed on the workbench through a guide rod group 2, and the guide rod group 2 is fixedly installed under the workbench. The guide rod group 2 is driven by a motor 2 and a transmission wheel group.

[0010] Further, the loading mechanism includes two sets of conveying components and a pressing component. The two sets of conveying components are symmetrically installed on the workbench through a connecting plate. The two sets of pressing components are respectively opposite to one set of conveying components and are installed on the workbench through a driving component. The conveying component includes a first conveying table group, and the first conveying table group is installed on the connecting plate through a conveying guide rail group. The connecting plate is installed on the workbench through a first translation guide rail group. The connecting plate is connected to a second guide rod group. The first conveying table group and the pressing component cooperate to form a loading channel after the lead frame and the chip are glued together.

[0011] Further, the pressing component includes a pressing plate and a second conveying table group. The second conveying table group is installed on the workbench through a second translation guide rail group and a fixing plate. The fixing plate is fixedly installed on the workbench. The second translation guide rail group is installed at both ends of the fixing plate. The second conveying table group is slidably connected to the second translation guide rail group. The pressing plate is installed on the second conveying table group through a first driving cam group. The pressing plate is in transmission connection with the first driving cam group. The second conveying table group is in transmission connection with the driving component.

[0012] Further, the unloading mechanism includes a cutting component and a hopper. The hopper is installed on the workbench and is opposite to the lower part of the loading mechanism. The cutting component includes a cutting knife and a lower knife plate. The cutting knife is installed on both sides of the cantilever seat through a cutting table and a third lifting guide rail group. The cutting table is fixedly installed on both sides of the cantilever seat. The third lifting guide rail group is fixedly installed on the cutting table. The cutting knife is slidably connected to the third lifting guide rail group. The cutting knife is driven by a third driving cam group. The lower knife plate is located below the cutting knife and is connected to the connecting plate through a linear moving module. The linear moving module is installed on the connecting plate.

[0013] Further, the movable module includes two sets of movable rods, two sets of wedge plates, a movable guide rail group and a push rod component. The movable rods are inserted into the lower end plate of the detection bracket. Two sets of detection probes are respectively installed at the lower ends of one set of movable rods. The upper ends of the movable rods are abutted against the corresponding wedge plates through abutting wheels. The abutting wheels are installed on the tops of the movable rods through wheel seats. Springs are sleeved on the movable rods. The two ends of the springs respectively abut against the wheel seats and the lower end plate of the detection bracket. The two sets of wedge plates are connected to the push rod component through a connecting guide seat and are centrosymmetric on the connecting guide seat. The push rod component is installed on the upper end plate of the detection bracket. The connecting guide seat is slidably connected to the movable guide rail group. The movable guide rail group is fixedly connected to the upper end plate of the detection bracket.

[0014] Further, a packaging method for a wire-free chip packaging structure includes the following steps:

[0015] Step 1: First, glue the lead frame and the chip into a set, and then place it at the loading channel formed by the first conveying table group and the second conveying table group. The set of lead frame and chip are gradually transported to the plating component through the combined action of the driving component and the conveying component;

[0016] Step 2: Then, the spacer plate of the material separating component holds the lead frame to be plated at the connecting rib groove, preventing the lead frame from shifting laterally. The moving component drives the lower film component to move, aligning the lower film component with the lead frame to be plated. The driving roller group operates to drive the film feeding roller group and the glue coating roller to rotate. Meanwhile, the glue coating roller coats the conductive glue on the insulating film, and then the insulating film and the conductive glue are plated on the chip and the lead frame, plating the insulating film and the conductive glue on the area outside the connection between the chip and the pins to form the conductive layer and the protective layer of the chip package.

[0017] Step 3: After the plating is completed, a separate chip frame is formed at the position of the chip and the corresponding lead frame. The insulating film is cut by the cutting component. Subsequently, the feeding mechanism transfers the plated chip frame to the lower part of the detection mechanism for detecting the insulating area.

[0018] Step 4: During the detection, the push rod component pushes the connecting guide seat to slide on the movable guide rail group, thereby realizing the movement of the two wedge plates. The corresponding wedge plate abuts against the abutting wheel, causing the corresponding movable rod to reciprocate under the action of the spring, so that the two groups of detection probes alternately detect the insulating area of the chip frame. After the detection is completed, the feeding mechanism transfers the plated chip frame to the plating area again. The adjacent chip frames and the chip frames are cut and unloaded by the material cutting component. While cutting, the alternately arranged detection probes detect the chip frame to be plated and the detection probes alternately press against the chip frame to be plated to prevent the chip and the lead frame from warping and deforming during the material cutting process. Subsequently, the plated lead frame and the unplated lead frame are cut and unloaded by the material cutting component.

[0019] Step 5: The plated single lead frame and the chip are placed in a vacuum sputtering machine to connect the pins and the chip in a vacuum sputtering manner. The plated insulating film and the edge of the pins form a plating weld line, thereby realizing a chip package structure without welding wires.

[0020] Further, a plurality of packaging grooves are provided on the lead frame, and pins connected to the chip are provided in each packaging groove. The adjacent two packaging grooves are connected by a connecting rib.

[0021] Advantages of the present invention:

[0022] 1. The present invention plates the glued chip and the lead frame conveyed by the feeding mechanism through the plating component, plating the insulating film and the conductive glue on the area outside the connection between the chip and the pins to form the conductive layer and the protective layer of the chip package, ensuring the subsequent connection between the pins and the chip in a vacuum sputtering manner. And the detection mechanism detects the insulation of the plated chip and the lead frame to judge whether the plating area meets the standard, preventing plating misalignment from affecting the subsequent vacuum sputtering.

[0023] 2. The detection mechanism of the present invention can not only detect the chips and lead frames before and after processing, but also cooperate with the blanking mechanism to stagger and press the unplated chips and lead frames during blanking, preventing the warping of the chips and lead frames due to the shearing force on the lead frames during blanking. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 Schematic perspective structure of the present invention Figure 1 ;

[0025] Figure 2 Schematic perspective structure of the present invention Figure 2 ;

[0026] Figure 3 Schematic perspective structure of the present invention Figure 3 ;

[0027] Figure 4 Side view of the present invention;

[0028] Figure 5 Schematic partial perspective structure of the present invention Figure 1 ;

[0029] Figure 6 Schematic partial perspective structure of the present invention Figure 2 ;

[0030] Figure 7 Schematic partial perspective structure of the present invention Figure 3 ;

[0031] Figure 8 Schematic partial perspective structure of the present invention Figure 4 ;

[0032] Figure 9 Schematic partial perspective structure of the present invention Figure 5 ;

[0033] Figure 10 Schematic partial perspective structure of the present invention Figure 6 ;

[0034] Figure 11 Schematic partial perspective structure of the present invention Figure 7 ;

[0035] Figure 12 Schematic partial perspective structure of the present invention Figure 8 ;

[0036] Figure 13 Schematic partial perspective structure of the present invention Figure 9 ;

[0037] Figure 14 Schematic partial perspective structure of the present inventionFigure 10 。

[0038] The reference numerals in the figure are: 1 - workbench; 2 - loading mechanism; 2a - conveying component; 2a1 - connecting plate; 2a2 - conveying guide rail group; 2a3 - first conveying table group; 2a4 - first translation guide rail group;

[0039] 2b - material pressing component; 2b1 - material pressing plate; 2b2 - second conveying table group; 2b3 - first driving cam group; 2b4 - fixing plate; 2b5 - second translation guide rail group; 2c - driving component;

[0040] 3 - plating pasting component; 3a - cantilever seat; 3b - moving component; 3c - lower film component; 3c1 - film rack; 3c2 - roller rack; 3c3 - film feeding roller group; 3c4 - driving roller group; 3c5 - glue coating roller; 3c6 - glue coating port; 3d - material separating component; 3d1 - second motor; 3d2 - second transmission wheel group; 3d3 - second guide rod group; 3d4 - material separating seat; 3d5 - first lifting guide rail group; 3d6 - material separating plate; 3d7 - fourth driving cam group; 3e - cutting component; 3e1 - tool holder; 3e2 - second lifting guide rail group; 3e3 - driving module; 3e4 - cutting tool head; 3e5 - tool head seat; 3e6 - second driving cam group; 3e7 - film pressing head; 3e8 - cutting outlet;

[0041] 4 - unloading mechanism; 4a - material cutting component; 4a1 - third driving cam group; 4a2 - third lifting guide rail group; 4a3 - material cutting knife; 4a4 - linear movement module; 4a5 - lower tool plate; 4a6 - material cutting table; 4b - blanking hopper; 5 - lead frame; 5a - encapsulation groove; 5b - connecting rib; 6 - chip; 7 - pin;

[0042] 8 - detection mechanism; 8a - detection bracket; 8b - detection probe; 8c - moving module; 8c1 - moving rod; 8c2 - wedge plate; 8c3 - moving guide rail group; 8c4 - push rod component; 8c5 - abutting wheel; 8c6 - connecting guide seat; 8c7 - wheel seat; 8c8 - spring. Detailed implementation manners

[0043] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments in the following description are only examples, and those skilled in the art can think of other obvious variations.

[0044] As Figures 1 to 4As shown, a packaging device for chip packaging is installed on a workbench 1, including a feeding mechanism 2 installed on the workbench 1 for the lead frame 5 and the chip 6 after gluing, a plating component 3 capable of plating the chip 6 and the lead frame 5 is arranged on one side of the feeding mechanism 2, and a unloading mechanism 4 for unloading the chip 6 after packaging is also arranged on the workbench 1, and an insulating film and a conductive adhesive are plated on the chip 6 and the lead frame 5 through the plating component 3, and a vacuum sputtering machine is also included to connect the lead frame 5, the chip 6 and the pin 7 by vacuum sputtering; the plating component 3 includes a lower film component 3c and a cutting component 3c. The cutting component 3e, the lower membrane component 3c and the cutting component 3e are all installed on the workbench 1 through the cantilever seat 3a and the moving component 3b, the lower membrane component 3c is installed on the moving component 3b, and the cutting component 3e is located below the lower membrane component 3c; a detection mechanism 8 is arranged above the feeding mechanism 2, and the detection mechanism 8 is fixedly installed on one side of the unloading mechanism. The detection mechanism 8 includes a detection bracket 8a, two groups of detection probes 8b and a movable module 8c. The detection bracket 8a is fixedly installed on one side of the unloading mechanism 4 and faces the feeding mechanism 2, and the two groups of detection probes 8b are installed on the detection bracket 8a through the movable module 8c.

[0045] The present invention plates the glued chip 6 and the base island 5 conveyed by the feeding mechanism 2 through the plating component 3, and plates the insulating film and the conductive adhesive on the area other than the connection between the chip 6 and the pin 7 to form a conductive layer and a protective layer for the chip 6 package, thereby ensuring the subsequent connection between the pin 7 and the chip 6 by vacuum sputtering. The plated chip 6 and the lead frame 5 are subjected to insulation detection by the detection mechanism 8 to determine whether the plating area meets the standards, thereby preventing the plating misalignment from affecting the subsequent vacuum sputtering.

[0046] like Figures 2 to 5 as well as Figures 10 to 13 The lower film assembly 3c shown includes a film frame 3c1 and a film feeding roller group 3c3 for placing an insulating film. The film frame 3c1 is fixedly mounted on the moving assembly 3b, and the film feeding roller group 3c3 is clamped on the upper end of the film frame 3c1. The lower end of the film frame 3c1 is connected to a roller frame 3c2. A driving roller group 3c4 is installed in the roller frame 3c2. The driving roller group 3c4 delivers the insulating film through a glue coating roller 3c5. The glue coating roller 3c5 is transmission-connected to the driving roller group 3c4. The glue coating roller 3c5 group is hollow inside and can be connected to an external conductive glue supply system. A number of glue coating ports 3c6 are evenly arranged on the glue coating roller 3c5.

[0047] The present invention moves the lower film component 3c to the top of the corresponding chip 6 and lead frame 5 through the moving component 3b, drives the film feeding roller group 3c3 and the glue coating roller 3c5 to rotate through the driving roller group 3c4, and coats the insulating film delivered from the glue coating roller 3c5 with a conductive glue layer, and utilizes an external conductive glue supply system to evenly coat the conductive glue from the glue coating port 3c6 of the glue coating roller 3c5 on the insulating film.

[0048] The cutting component 3e includes a tool rest 3e1 and a cutting tool head 3e4. The tool rest 3e1 is movably installed on the roller frame 3c2 through the second lifting guide rail group 3e2. The second lifting guide rail group 3e2 is driven by a driving module 3e3. The cutting tool head 3e4 is installed at the lower end of the tool rest 3e1 through a tool head seat 3e5. A second driving cam group 3e6 is installed on the tool head seat 3e5. The second driving cam group 3e6 is in transmission connection with the cutting tool head 3e4. A cutting opening 3e8 is formed below the tool head seat 3e5. The cutting tool head 3e4 faces the cutting opening 3e8. A film pressing head 3e7 is arranged outside the cutting opening 3e8.

[0049] In the present invention, the insulating film that has been plated on the chip 6 and the lead frame 5 and the unplated insulating film are cut by the cutting component 3e. The driving module 3e3 drives the second lifting guide rail group 3e2 to move, and then drives the tool rest 3e1 to move, pressing down the tool head seat 3e5 and the cutting tool head 3e4 on the tool rest 3e1 close to the insulating film, so that the film pressing head 3e7 presses the insulating film that has been plated on the surface of the chip 6. Then, the second driving cam group 3e6 drives the cutting tool head 3e4 to move so that it extends out from the cutting opening 3e8 to cut the insulating film.

[0050] As Figures 5 to 9 shown, a material separating component 3d is installed on the workbench 1. The material separating component 3d includes a material separating seat 3d4 and a material separating plate 3d6 for separating two adjacent lead frames 5. The material separating plate 3d6 is installed on the material separating seat 3d4 through the first lifting guide rail group 3d5. The second lifting guide rail group 3e2 is driven by a fourth driving cam group 3d7. The material separating seat 3d4 is slidably installed on the workbench 1 through a second guide rod group 3d3. The second guide rod group 3d3 is fixedly installed below the workbench 1. The second guide rod group 3d3 is driven by a second motor 3d1 and a transmission wheel group.

[0051] The second motor 3d1 and the second transmission wheel group 3d2 drive the second guide rod group 3d3 to rotate, and then the material separating seat 3d4 moves along the second guide rod group 3d3, so that the material separating plate 3d6 can be inserted into the connecting rib groove between two adjacent lead frames 5, and the fourth driving cam group 3d7 drives the material separating plate 3d6 to move up and down on the first lifting guide rail group 3d5, so that the lead frame 5 can be conveyed above the material separating plate 3d6.

[0052] The loading mechanism 2 includes two sets of conveying components 2a and a material pressing component 2b. The two sets of conveying components 2a are symmetrically installed on the workbench 1 through a connecting plate 2a1. The two sets of material pressing components 2b are respectively opposite to one set of conveying components 2a and are installed on the workbench 1 through a driving component 2c. The conveying component 2a includes a first conveying table group 2a3, and the first conveying table group 2a3 is installed on the connecting plate 2a1 through a conveying guide rail group 2a2. The connecting plate 2a1 is installed on the workbench 1 through a first translation guide rail group 2a4. The connecting plate 2a1 is connected to a second guide rod group 3d3. The first conveying table group 2a3 and the material pressing component 2b cooperate to form a loading channel after the lead frame 5 and the chip 6 are glued.

[0053] In the present invention, the cooperation of the second guide rod group 3d3 and the first translation guide rail group 2a4 realizes the movement of the connecting plate 2a1 along the length direction of the first translation guide rail group 2a4. The driving component 2c drives the material pressing component 2b and the first conveying table group 2a3 to move along the guide rail direction of the conveying guide rail group 2a2, so that the loading channel formed by the cooperation of the first conveying table group 2a3 and the material pressing component 2b can move and be adjusted, and it can ensure that the lead frame 5 and the chip 6 can move to the lower part of the plating component 3.

[0054] The material pressing component 2b includes a material pressing plate 2b1 and a second conveying table group 2b2. The second conveying table group 2b2 is installed on the workbench 1 through a translation guide rail group and a fixing plate 2b4. The fixing plate 2b4 is fixedly installed on the workbench 1. The second translation guide rail group 2b5 is installed at both ends of the fixing plate 2b4. The second conveying table group 2b2 is slidably connected to the second translation guide rail group 2b5. The material pressing plate 2b1 is installed on the second conveying table group 2b2 through a first driving cam group 2b3. The material pressing plate 2b1 is in transmission connection with the first driving cam group 2b3. The second conveying table group 2b2 is in transmission connection with the driving component 2c.

[0055] In the present invention, the driving component 2c drives the second conveying table group 2b2 to move along the second translation guide rail group 2b5, so that the corresponding first conveying table group 2a3 and the second conveying table group 2b2 move synchronously to form a loading channel. In order to ensure the stability of loading and prevent the lead frame 5 and the chip 6 from being displaced during the plating process and affecting the plating effect, the present invention drives the material pressing plate 2b1 to press both ends of the lead frame 5 through the first driving cam group 2b3.

[0056] The blanking mechanism 4 includes a blanking component 4a and a blanking hopper 4b. The blanking hopper 4b is installed on the workbench 1 and is directly below the feeding mechanism 2. The blanking component 4a includes a blanking knife 4a3 and a lower knife plate 4a5. The blanking knife 4a3 is installed on both sides of the cantilever seat 3a through a blanking table 4a6 and a lifting guide rail group three 4a2. The blanking table 4a6 is fixedly installed on both sides of the cantilever seat 3a, and the lifting guide rail group three 4a2 is fixedly installed on the blanking table 4a6. The blanking knife 4a3 is slidably connected to the lifting guide rail group three 4a2. The blanking knife 4a3 is driven by a driving cam group three 4a1. The lower knife plate 4a5 is located below the blanking knife 4a3 and is connected to the connecting plate 2a1 through a linear movement module 4a4. The linear movement module 4a4 is installed on the connecting plate 2a1.

[0057] The movable module 8c includes two groups of movable rods 8c1, two groups of wedge plates 8c2, a movable guide rail group 8c3, and a push rod assembly 8c4. The movable rods 8c1 are inserted into the lower end plate of the detection bracket 8a. Two groups of detection probes 8b are respectively installed at the lower ends of a group of movable rods 8c1. The upper ends of the movable rods 8c1 are abutted against the corresponding wedge plates 8c2 through abutting wheels 8c5. The abutting wheels 8c5 are installed on the tops of the movable rods 8c1 through wheel seats 8c7. Springs 8c8 are sleeved on the movable rods 8c1. The two ends of the springs 8c8 respectively abut against the wheel seats 8c7 and the lower end plate of the detection bracket 8a. The two groups of wedge plates 8c2 are connected to the push rod assembly 8c4 through a connecting guide seat 8c6 and are centrosymmetric on the connecting guide seat 8c6. The push rod assembly 8c4 is installed on the upper end plate of the detection bracket 8a. The connecting guide seat 8c6 is slidably connected to the movable guide rail group 8c3. The movable guide rail group 8c3 is fixedly connected to the upper end plate of the detection bracket 8a.

[0058] The push rod assembly 8c4 pushes the connecting guide seat 8c6 to slide on the movable guide rail group 8c3, thereby realizing the movement of the two wedge plates 8c2. The corresponding wedge plates 8c2 abut against the abutting wheels 8c5, causing the corresponding movable rods 8c1 to reciprocate under the action of the springs 8c8. Thus, the two groups of detection probes 8b alternately detect the insulating regions of the chip frame. After the detection is completed, the feeding mechanism 2 transfers the chip frame with plating to the plating area again. The blanking component (4a) cuts and blanks between adjacent chip frames and chip frames. While cutting, the alternating detection probes 8b detect the chip frame to be plated and alternately press the chip frame to be plated through the detection probes 8b, preventing the chips 6 and the lead frames 5 from warping and deforming during the blanking process.

[0059] In the present invention, the driving cam group III 4a1 drives the corresponding blanking knife 4a3 to reciprocate up and down on the lifting guide rail group III 4a2. At the same time, the linear movement module 4a4 drives the lower knife plate 4a5 to move below the blanking plate, so that the blanking knife 4a3 cooperates with the lower knife plate 4a5 to cut the lead frame 5 that has been plated and the unplated lead frame 5, so that the plated lead frame 5 falls into the blanking hopper 4b and is then sent into a vacuum sputtering machine for processing to package the pins 7 and the chip 6.

[0060] As Figures 1 to 14 shown, a packaging method for a wire-free chip packaging structure includes the following steps:

[0061] Step 1: First, the lead frame 5 and the chip 6 are glued together into a set, and then placed at the feeding channel formed by the conveying table group I 2a3 and the conveying table group II 2b2. The driving assembly 2c and the conveying assembly 2a jointly transport the assembled lead frame 5 and chip 6 step by step to the plating assembly 3.

[0062] Step 2: Then, the partition plate 3d6 of the partition component 3d holds the lead frame 5 to be plated from the connecting rib groove to prevent the lead frame 5 from shifting sideways. The moving component 3b drives the lower film component 3c to move, so that the lower film component 3c is aligned with the lead frame 5 to be plated. The driving roller group 3c4 works to drive the film feeding roller group 3c3 and the glue coating roller 3c5 to rotate. At the same time, the glue coating roller 3c5 coats the conductive glue on the insulating film, and then the insulating film and the conductive glue are plated on the chip 6 and the lead frame 5, and the insulating film and the conductive glue are plated on the area other than the connection between the chip 6 and the pins 7 to form the conductive layer and the protective layer for the chip 6 packaging.

[0063] Step 3: After the plating is completed, a separate chip frame is formed at the position of the chip 6 and the corresponding lead frame 5. The insulating film is cut by the cutting component 3e. Subsequently, the feeding mechanism 2 transfers the plated chip frame to the lower part of the detection mechanism 8 for detecting the insulating area.

[0064] Step 4: During detection, the push rod assembly 8c4 pushes the connecting guide base 8c6 to slide on the movable guide rail group 8c3, thereby realizing the movement of the two wedge plates 8c2. The corresponding wedge plate 8c2 abuts against the abutting wheel 8c5, causing the corresponding movable rod 8c1 to reciprocate under the action of the spring 8c8, so that the two groups of detection probes 8b alternately detect the insulating area of the chip frame. After the detection is completed, the loading mechanism 2 transfers the chip frame with plating to the plating area again. The blanking assembly (4a) cuts and discharges the adjacent chip frames and chip frames. While cutting, the alternately arranged detection probes 8b detect the chip frame to be plated and press the chip frame to be plated alternately through the detection probes 8b to prevent the chip 6 and the lead frame 5 from warping and deforming during the blanking process; then the blanking assembly 4a cuts and discharges the plated lead frame 5 and the unplated lead frame 5.

[0065] Step 5: Place the plated single lead frame 5 and chip 6 into a vacuum sputtering machine to connect the pins 7 and the chip 6 in a vacuum sputtering manner, and use the plated insulating film to form a plating weld line with the edge of the pins 7, thereby realizing a chip 6 packaging structure without welding wires.

[0066] As Figure 2 shown, a plurality of packaging grooves 5a are provided on the lead frame 5, the pins 7 are arranged in the corresponding packaging grooves 5a, and adjacent two packaging grooves 5a are connected by connecting ribs 5b. The rib grooves formed by the connecting ribs 5b and the packaging grooves 5a can cooperate with the partition plate 3d6 to support the lead frame for stability during plating and blanking.

[0067] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification is only the principle of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A packaging device for chip packaging, the packaging device is installed on a workbench (1), characterized in that: The invention comprises a feeding mechanism (2) installed on a workbench (1) for gluing a lead frame (5) and a chip (6), one side of which is provided with a plating assembly (3) capable of plating the chip (6) and the lead frame (5), and a discharging mechanism (4) for discharging the chip (6) after packaging is also provided on the workbench (1). An insulating film and a conductive adhesive are plated on the chip (6) and the lead frame (5) by the plating assembly (3). The invention also comprises a vacuum sputtering machine for connecting the lead frame (5), the chip (6) and the pin (7) by vacuum sputtering. The plating assembly (3) comprises a lower film assembly (3c) and a cutting assembly (3e), and the lower film assembly (3c) and the cutting assembly (3e) are connected to each other. The components (3e) are all installed on the workbench (1) through a cantilever seat (3a) and a moving component (3b), the lower membrane component (3c) is installed on the moving component (3b), and the cutting component (3e) is located below the lower membrane component (3c); a detection mechanism (8) is arranged above the feeding mechanism (2), the detection mechanism (8) is fixedly installed on one side of the unloading mechanism, the detection mechanism (8) comprises a detection bracket (8a), two groups of detection probes (8b) and a movable module (8c), the detection bracket (8a) is fixedly installed on one side of the unloading mechanism (4) and facing the feeding mechanism (2), and the two groups of detection probes (8b) are installed on the detection bracket (8a) through the movable module (8c).

2. A packaging device for chip packaging as claimed in claim 1, characterized in that: The lower film assembly (3c) comprises a film frame (3c1) and a film delivery roller group (3c3) for placing an insulating film. The film frame (3c1) is fixedly mounted on the moving assembly (3b). The film delivery roller group (3c3) is clamped on the upper end of the film frame (3c1). The lower end of the film frame (3c1) is connected to a roller frame (3c2). A driving roller group (3c4) is installed in the roller frame (3c2). The driving roller group (3c4) delivers the insulating film through a glue coating roller (3c5). The glue coating roller (3c5) is connected to the driving roller group (3c4) by transmission. The glue coating roller (3c5) is hollow inside and can be connected to an external conductive glue supply system. A plurality of glue coating ports (3c6) are evenly arranged on the glue coating roller (3c5). The conductive glue is coated on the surface of the insulating film through the glue coating ports (3c6).

3. A packaging device for chip packaging as claimed in claim 2, characterized in that: The cutting assembly (3e) comprises a knife frame (3e1) and a cutter head (3e4); the knife frame (3e1) is movably mounted on a roller frame (3c2) via a lifting guide rail group (3e2); the lifting guide rail group (3e2) is driven by a driving module (3e3); the cutter head (3e4) is mounted on the lower end of the knife frame (3e1) via a knife head seat (3e5); a driving cam group (3e6) is mounted on the knife head seat (3e5); the driving cam group (3e6) is transmission-connected to the cutter head (3e4); a knife outlet (3e8) is provided below the knife head seat (3e5); the cutter head (3e4) is directly opposite to the knife outlet (3e8); and a film pressing head (3e7) is provided on the outer side of the knife outlet (3e8).

4. A packaging device for chip packaging as claimed in claim 3, characterized in that: A spacer assembly (3d) is installed at the center of the workbench (1), and the spacer assembly (3d) includes a spacer seat (3d4) and a spacer plate (3d6) for spacing two adjacent lead frames (5); the spacer plate (3d6) is installed on the spacer seat (3d4) through a lifting guide rail group 1 (3d5); the lifting guide rail group 2 (3e2) is driven by a driving cam group 4 (3d7); the spacer seat (3d4) is slidably installed on the workbench (1) through a guide rod group 2 (3d3); the guide rod group 2 (3d3) is fixedly installed below the workbench (1); and the guide rod group 2 (3d3) is driven by a motor 2 (3d1) and a transmission wheel group.

5. A packaging device for chip packaging as claimed in claim 4, characterized in that: The feeding mechanism (2) comprises two groups of conveying components (2a) and a pressing component (2b), the two groups of conveying components (2a) are symmetrically mounted on the workbench (1) through a connecting plate (2a1), the two groups of pressing components (2b) are respectively opposite to one group of conveying components (2a) and are mounted on the workbench (1) through a driving component (2c), the conveying components (2a) comprise a conveying platform group 1 (2a3), the conveying platform group 1 (2a3) is mounted on the connecting plate (2a1) through a conveying guide rail group (2a2), the connecting plate (2a1) is mounted on the workbench (1) through a translation guide rail group 1 (2a4), the connecting plate (2a1) is connected to a guide rod group 2 (3d3), and the conveying platform group 1 (2a3) cooperates with the pressing component (2b) to form a feeding channel for the lead frame (5) and the chip (6) after gluing.

6. A packaging device for chip packaging as claimed in claim 5, characterized in that: The material pressing assembly (2b) comprises a material pressing plate (2b1) and a second conveying platform group (2b2); the second conveying platform group (2b2) ​​is mounted on the workbench (1) via a translation guide rail group and a fixed plate (2b4); the fixed plate (2b4) is fixedly mounted on the workbench (1); the second translation guide rail group (2b5) is mounted at both ends of the fixed plate (2b4); the second conveying platform group (2b2) ​​and the second translation guide rail group (2b5) are slidably connected; the material pressing plate (2b1) is mounted on the second conveying platform group (2b2) ​​via a driving cam group (2b3); the material pressing plate (2b1) is transmission-connected to the driving cam group (2b3); and the second conveying platform group (2b2) ​​is transmission-connected to the driving assembly (2c).

7. A packaging device for chip packaging as claimed in claim 6, characterized in that: The material discharge mechanism (4) comprises a material cutting assembly (4a) and a material dropping hopper (4b), wherein the material dropping hopper (4b) is mounted on the workbench (1) and directly opposite to the lower side of the material feeding mechanism (2), the material cutting assembly (4a) comprises a material cutting knife (4a3) and a lower knife plate (4a5), the material cutting knife (4a3) is mounted on both sides of the cantilever seat (3a) through a material cutting platform (4a6) and a lifting guide rail group three (4a2), and the material cutting platform (4a6) is fixedly mounted on the cantilever seat (3a ), the lifting guide rail group three (4a2) is fixedly installed on the cutting platform (4a6), the cutting knife (4a3) is slidably connected to the lifting guide rail group three (4a2), the cutting knife (4a3) is driven by the driving cam group three (4a1), the lower knife plate (4a5) is located below the cutting knife (4a3) and is connected to the connecting plate (2a1) through the linear moving module (4a4), and the linear moving module (4a4) is installed on the connecting plate (2a1).

8. A packaging device for chip packaging as claimed in claim 7, characterized in that: The movable module (8c) comprises two groups of movable rods (8c1), two groups of wedge-shaped plates (8c2), a movable guide rail group (8c3) and a push rod assembly (8c4); the movable rod (8c1) is plugged into the lower end plate of the detection bracket (8a); the two groups of detection probes (8b) are respectively mounted on the lower end of a group of movable rods (8c1); the upper end of the movable rod (8c1) is abutted against the corresponding wedge-shaped plate (8c2) via an abutment wheel (8c5); the abutment wheel (8c5) is mounted on the top of the movable rod (8c1) via a wheel seat (8c7); A spring (8c8) is sleeved on the rod (8c1), and two ends of the spring (8c8) respectively abut against the wheel seat (8c7) and the lower end plate of the detection bracket (8a). The two groups of wedge plates (8c2) are connected to the push rod assembly (8c4) through the connecting guide seat (8c6) and are centrally symmetrical on the connecting guide seat (8c6). The push rod assembly (8c4) is mounted on the upper end plate of the detection bracket (8a). The connecting guide seat (8c6) is slidably connected to the movable guide rail group (8c3), and the movable guide rail group (8c3) is fixedly connected to the upper end plate of the detection bracket (8a).

9. A packaging method for a packaging device for chip packaging as claimed in any one of claims 1 to 8, characterized in that: The steps include: Step 1: firstly, the lead frame (5) and the chip (6) are glued together to form a set, and then placed in a loading channel formed by the conveyor group 1 (2a3) and the conveyor group 2 (2b2), and the set of lead frame (5) and chip (6) are gradually transported to the plating assembly (3) by the driving assembly (2c) and the conveying assembly (2a); Step 2: The spacer plate (3d6) of the spacer assembly (3d) then supports the lead frame (5) to be plated from the connecting rib groove to prevent the lead frame (5) from moving sideways, and the lower film assembly (3c) is driven to move by the moving assembly (3b) so that the lower film assembly (3c) is aligned with the lead frame (5) to be plated, and the driving roller assembly (3c4) drives the film feeding roller assembly (3c3) and the glue coating roller (3c5) to rotate, and at the same time, the glue coating roller (3c5) coats the conductive glue on the insulating film, and then the insulating film and the conductive glue are plated on the chip (6) and the lead frame (5), and the insulating film and the conductive glue are plated on the area other than the connection between the chip (6) and the pin (7) to form a conductive layer and a protective layer for the chip (6) package; Step 3: After the plating is completed, the chip (6) and the corresponding lead frame (5) position form a separate chip frame, and the insulating film is cut off by the cutting component (3e). Then, the loading mechanism (2) moves the plated chip frame to the bottom of the detection mechanism (8) for detection of the insulating area; Step 4: During the inspection, the push rod assembly (8c4) pushes the connecting guide seat (8c6) to slide on the movable guide rail assembly (8c3), thereby realizing the movement of the two wedge plates (8c2). The corresponding wedge plates (8c2) abut against the abutment wheels (8c5), so that the corresponding movable rods (8c1) reciprocate under the action of the spring (8c8), so that the two groups of detection probes (8b) staggeredly detect the insulating area of ​​the chip frame. After the inspection is completed, the feeding mechanism (2) again puts the plated core The chip frame is transferred to the plating area, and the cutting component (4a) cuts the adjacent chip frames and cuts off the chips. While cutting, the chip frame to be plated is tested by staggered detection probes (8b) and the chip frame to be plated is staggered and pressed by the detection probes (8b) to prevent the chip (6) and the lead frame (5) from warping and deformation during the cutting process. Subsequently, the plated lead frame (5) and the unplated lead frame (5) are cut off and cut off by the cutting component (4a); Step 5: Place the plated single lead frame (5) and chip (6) into a vacuum sputtering machine to connect the lead (7) and the chip (6) by vacuum sputtering, and use the plated insulating film and the edge of the lead (7) to form a plated welding line, thereby realizing a chip (6) packaging structure without welding wires.

10. The packaging device for chip packaging according to claim 8, characterized in that: The lead frame (5) is provided with a plurality of packaging grooves (5a), the pins (7) are arranged in corresponding packaging grooves (5a), and two adjacent packaging grooves (5a) are connected via connecting ribs (5b).

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