A substrate heating device

Abstract

A substrate heating device comprises a base, a heating plate and a heating assembly; the heating plate is laid on the base and fixed to the base by at least two fixings; projected in a direction perpendicular to the surface of the heating plate, the at least two fixings are arranged along the center line of the heating plate; the heating assembly comprises a heating rod for heating at least a portion of the heating plate, the heating rod is close to the at least two fixings and the extension direction is parallel to the arrangement direction of the at least two fixings. Compared with the prior art, the substrate heating device of the present invention improves the flatness of the heating plate after thermal expansion and reduces the situation where the substrate is heated unevenly.

Description

Technical Field

[0001] The invention relates to the field of chip processing, and in particular to a substrate heating device. Background Art

[0002] A die bonder is a device used in semiconductor chip manufacturing. Its main function is to fix transistors and other components on the chip to the substrate.

[0003] In the prior art, semiconductor chip processing generally includes the following steps: 1. Loading the substrate; 2. Preparing the wafer: Selecting a suitable wafer and processing it to make it have good adhesion; 3. Applying glue: Applying a certain amount of meltable fixing agent on the substrate and wafer respectively; 4. Installing the substrate and the wafer together, heating the substrate to melt the fixing agent, so that the wafer and the substrate are stuck together.

[0004] However, after existing semiconductor chips are processed in a die bonder, die bond failure and wafer cracks often occur, which affects the defective rate of the semiconductor chips. Summary of the invention

[0005] Based on this, the purpose of the present invention is to overcome the defects or shortcomings of the prior art and provide a substrate heating device.

[0006] The technical solution adopted by the present invention is as follows:

[0007] A substrate heating device, comprising:

[0008] Pedestal;

[0009] A heating plate, the heating plate is laid on the base and fixed to the base by at least two fixing members; when projected in a direction perpendicular to the surface of the heating plate, the at least two fixing members are arranged along the center line of the heating plate;

[0010] The heating assembly comprises a heating rod for heating at least a portion of the heating plate, wherein the heating rod is close to the at least two fixing members and an extending direction thereof is parallel to an arrangement direction of the at least two fixing members.

[0011] Compared with the prior art, the substrate heating device of the present invention sets the fixing parts connecting the base and the heating plate in the middle of the heating plate, so that the heating plate can evenly extend to the surroundings when expanded, thereby improving the flatness of the heating plate after thermal expansion and reducing uneven heating of the substrate.

[0012] Furthermore, the heating assembly also includes a plurality of thermocouples, each thermocouple detects the temperature at a different position of the heating plate, and then adjusts the power of the heating rod according to the measured value of each thermocouple.

[0013] Furthermore, it also includes a positioning component, which is installed on the base and located on one side of the heating plate, and includes a blocking block at least part of which can be higher than the heating plate; in the heating plate, the side close to the blocking block is the positioning side, and the other side opposite to the positioning side is the entry side, and the arrangement direction of the at least two fixing parts points from the entry side to the positioning side, and the blocking block facilitates the positioning of the substrate on the heating plate.

[0014] Furthermore, there are several heating rods which are inserted into the heating plate; projected in a direction perpendicular to the heating plate, the heating rods are symmetrically arranged on both sides of the at least two fixing members to improve the heating efficiency and evenly heat the heating plate, and the heating rods at different positions can quickly heat the local temperature distribution area of ​​the heating plate or the entire heating plate at the same time.

[0015] Furthermore, the positioning assembly also includes a pushing block and a driver; the pushing block abuts against the blocking block, and the driver drives the pushing block to move away from or close to the heating plate; when the pushing block is close to the heating plate, the blocking block is higher than the heating plate; when the pushing block is away from the heating plate, the blocking block is lower than the heating plate, thereby realizing the lifting and lowering of the blocking block relative to the heating plate to store the blocking block when not in use.

[0016] Furthermore, the positioning assembly also includes a guide rod, which is arranged on the base and inserted into the blocking block in a direction perpendicular to the surface of the heating plate to guide the lifting and lowering of the blocking block, making the lifting and lowering more stable.

[0017] Furthermore, it also includes a heat dissipation component, which includes a heat dissipation cavity, an air duct and an air guide tube; the heat dissipation cavity is arranged below the base; the air duct extends on a side wall of one side of the heat dissipation cavity, and the air guide tube is located on the other side of the heat dissipation cavity opposite to the air duct, and connects the inside and outside of the heat dissipation cavity; a plurality of exhaust ports are opened on the air duct, and the exhaust ports are arranged along the extension direction of the air duct and face the side where the air guide tube is located. After external air is introduced into the air duct, the airflow can take away the heat from under the base, thereby reducing the impact of high temperature on other components.

[0018] Furthermore, the hole depth of the exhaust port is 4 to 5 times the hole diameter to form a high-pressure airflow to quickly take away the heat.

[0019] Furthermore, it also includes an adsorption component, which includes a vacuum suction pipe and a vacuum pump; the heating plate is provided with an adsorption hole connected to its lower part; one end of the vacuum suction pipe is connected to the adsorption hole, and the other end is connected to the vacuum pump to fix the substrate to the heating plate.

[0020] Furthermore, along the projection direction perpendicular to the surface of the heating plate, a plurality of adsorption holes are symmetrically arranged on both sides of the at least two fixing members, and the same vacuum suction pipe is respectively connected to more than two adsorption holes to make the adsorption force on the substrate uniform.

[0021] For better understanding and implementation, the present invention is described in detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the substrate heating device of the present invention;

[0023] Figure 2 It is a partial top view of the substrate heating device of the present invention;

[0024] Figure 3 for Figure 2 Sectional projection after cutting along line ZZ in the figure;

[0025] Figure 4 for Figure 3 A partial enlarged view of the middle area A;

[0026] Figure 5 for Figure 2 Sectional projection after cutting along line YY in;

[0027] Figure 6 for Figure 5 A partial enlarged view of the middle area B;

[0028] Figure 7 for Figure 3 Sectional projection after cutting along line XX.

[0029] Explanation of the reference numerals: 10, base; 11, fixing member; 20, heating plate; 21, entry side; 22, positioning side; 23, adsorption hole; 30, heating component; 31, heating rod; 32, thermocouple; 40, adsorption component; 41, vacuum suction tube; 50, positioning component; 51, blocking block; 511, stop surface; 512, inclined surface; 52, push block; 521, push surface; 53, guide rod; 531, push rod; 54, driver; 60, heat dissipation component; 61, heat dissipation cavity; 62, air duct; 621, exhaust port; 63, air duct; 70, sensor; 80, heat insulation board. DETAILED DESCRIPTION

[0030] After analyzing and studying the defective conditions of chips in the prior art, it was found that the defects often occur after the substrate and the wafer are heated, and the main reason is that the substrate is heated unevenly. The substrate that is heated unevenly will have local temperature anomalies, resulting in the lack of the die-bonding agent or the loose bonding of the die-bonding agent in some areas due to low temperature, or the excessive thermal stress of the wafer in some areas due to high temperature, causing cracks, etc. These defects will affect multiple subsequent processes and eventually make the chip unusable.

[0031] Further analysis and research also revealed that the existing substrate heating device of the crystal bonding machine mainly uses a heating rod to heat the heating plate, and then heats the substrate through heat transfer from the heating plate to the substrate. In this process, the heating plate will also expand due to the heat. However, the existing substrate heating device tightens the heating plate on all sides, resulting in the heating plate being unable to expand to the surroundings due to heat expansion, resulting in different local expansion degrees, and ultimately resulting in an uneven surface of the heating plate with low flatness. The substrate placed on the heating plate is heated by contact with the convex part of the heating plate, and cannot be heated without contact with the concave part of the heating plate, resulting in uneven heating of the substrate.

[0032] Based on the above findings, this case proposes a substrate heating device, whose heating plate can expand from the middle to the surrounding areas without restraint during the heating process. The uniformly extended heating plate can improve the flatness of the heating plate, thereby making the substrate heated more evenly. In addition, the substrate heating device is also provided with a retractable positioning component to position the substrate, reducing the space occupied when not working. At the same time, the substrate heating device also has the advantage of high heat dissipation capacity, which can reduce the impact of the high temperature of the heating plate on other equipment.

[0033] For details, please refer to Figure 1 and Figure 2 The substrate heating device of the present invention includes a base 10, a heating plate 20, a heating assembly 30, an adsorption assembly 40, a positioning assembly 50, a heat dissipation assembly 60 and a controller (not shown).

[0034] The base 10 is placed on a workbench, and the heating plate 20 is laid on at least a portion of the side of the base 10 facing upward. The base 10 and the heating plate 20 are connected together by at least two fixing members 11. Figure 2 , Figure 3 and Figure 7, projected along the direction perpendicular to the surface of the heating plate 20, one side of the heating plate 20 is the entry side 21, and the other side is the positioning side 22, the substrate enters the heating plate 20 from the entry side 21 and moves toward the positioning side 22, and the at least two fixing members 11 are close to the center line of the heating plate 20 and arranged from the entry side 21 to the positioning side 22. In this embodiment, the fixing member 11 is a bolt screwed into the heating plate 20 from the base 10, the axis of which is perpendicular to the surface of the heating plate 20, and the end is located in the heating plate 20. In other embodiments, the fixing member 11 can also be a welding point, a magnet, or other parts that fix two parts together in the prior art. The at least two fixing members 11 are arranged near the center line of the heating plate 20, so that the heating plate 20 is fixed near the middle, while the surroundings are not fixed. After being heated, the heating plate 20 can expand and extend uniformly to the surroundings, thereby ensuring the flatness of the heating plate 20.

[0035] Please refer to Figure 2 and Figure 5 The heating assembly 30 is used to heat the heating plate 20, and includes a heating rod 31 and a thermocouple 32. The heating rod 31 and the thermocouple 32 are electrically connected to the controller respectively. The heating rod 31 is inserted into the heating plate 20 to heat the heating plate 20. The extending direction of the heating rod 31 is parallel to the arrangement direction of the at least two fixing members 11. When the number of the heating rod 31 is single, the heating rod 31 is close to the at least two fixing members 11; when the number of the heating rod 31 is several, each heating rod 31 is symmetrically arranged on both sides of the at least two fixing members 11; preferably, the spacing between two adjacent heating rods 31 is equal. The thermocouple 32 is installed on the base 10 and is located on one side of the heating plate 20. Its probe is connected to the heating plate 20 to detect the temperature of the heating plate 20, and the temperature value is fed back to the controller. The controller controls the power of the heating rod 31 according to the temperature value, thereby controlling the temperature of the heating plate 20. Preferably, the number of the thermocouples 32 is more than two, so as to detect the temperature at different positions of the heating plate 20, and adjust the power of the nearby heating rods 31 according to the temperature values ​​detected by different thermocouples 32, so that the temperature of the entire heating plate 20 tends to be uniform. In this embodiment, two thermocouples 32 are symmetrically arranged on both sides of the at least two fixing members 11. The controller controls a single or multiple heating rods 31 located at different positions to generate heat at the same time, so as to realize the rapid heating of different temperature distribution areas or the whole of the heating plate 20, and the thermocouples 32 detect the temperature of the temperature distribution areas or the whole of different positions of the heating plate 20, and control the temperature of the heating plate 20 locally or as a whole.

[0036] See also Figure 5, the adsorption assembly 40 includes a vacuum suction pipe 41 and a vacuum pump (not shown). The vacuum suction pipe 41 is inserted into the base 10. The heating plate 20 is provided with a plurality of adsorption holes 23 leading to the base 10. One end of the vacuum suction pipe 41 is connected to the adsorption hole 23, and the other end is connected to the vacuum pump. The vacuum pump is electrically connected to the controller. When working, the vacuum pump draws air through the vacuum suction pipe 41, thereby adsorbing the substrate above the heating plate 20. Preferably, the number of the adsorption holes 23 is several, and they are projected in a direction perpendicular to the surface of the heating plate 20. The adsorption holes 23 are symmetrically arranged on both sides of the at least two fixing members 11, and the same vacuum suction pipe 41 is respectively connected to more than two adsorption holes 23.

[0037] See also Figure 4The positioning assembly 50 is mounted on the base 10 and close to the positioning side 22, and includes a blocking block 51, a pushing block 52, a guide rod 53 and a driver 54. Projected in a direction parallel to the plate surface of the heating plate 20 and perpendicular to the arrangement direction of the at least two fixing members 11, the thickness of the blocking block 51 is less than the thickness of the heating plate 20, and includes a stop surface 511 and an inclined surface 512. The stop surface 511 faces the heating plate 20 and is perpendicular to the heating plate 20; the inclined surface 512 faces the base 10, and the angle between the inclined surface 512 and the stop surface 511 is less than 90°, and in the direction away from the heating plate 20, the vertical distance from the inclined surface 512 to the base 10 becomes larger and larger. The pushing block 52 includes a lifting surface 521, and the lifting surface 521 is opposite to and abuts against the inclined surface 512. The driver 54 is mounted on the base 10, electrically connected to the controller, and drives the push block 52 away from or close to the heating plate 20, so that the lifting surface 521 slides relative to the inclined surface 512, thereby pushing the blocking block 51 up or down. In this embodiment, the driver 54 is a cylinder provided with a push rod 531, the axis of the push rod 531 is parallel to the surface of the heating plate 20, and the end of the push rod 531 is fixedly connected to the push block 52, thereby driving the push block 52 to move. In other embodiments, the driver 54 can also be a motor provided with a screw, the screw is threadedly connected to the push block 52, and the push block 52 is driven to move by the rotation of the motor. The guide rod 53 is inserted on the base 10 and extends toward the blocking block 51 in a direction perpendicular to the surface of the heating plate 20, and is inserted into the blocking block 51. Under the control of the controller, when the driver 54 pushes the push block 52 to move toward the heating plate 20, the blocking block 51 is lifted along the guide rod 53 away from the base 10 under the push of the lifting surface 521, and at least a part of the blocking block 51 is higher than the heating plate 20 to abut against the substrate to position it. When the push block 52 moves away from the heating plate 20, the blocking block 51 is lowered along the guide rod 53 to be flush with the heating plate 20 or lower than the heating plate 20 for storage, thereby reducing space occupation.

[0038] Please refer to Figures 2 to 6The heat dissipation assembly 60 includes a heat dissipation cavity 61, an air duct 62 and an air guide tube 63. The heat dissipation cavity 61 is formed by a shell having an opening on one side facing the base 10 and covering the bottom of the base 10. The air duct 62 extends along the side wall of the heat dissipation cavity 61 on one side in the heat dissipation cavity 61 and is connected to an external air source. A plurality of exhaust ports 621 are arranged in sequence along the extension direction of the air duct 62 on the side wall of the air duct 62, and the spacing between two adjacent exhaust ports 621 is equal. The exhaust ports 621 face the inner side of the heat dissipation cavity 61 and are connected to the heat dissipation cavity 61. Preferably, the hole depth of the exhaust ports 621 is 4 to 5 times the hole diameter to enhance the air pressure. The air guide tube 63 is connected to the heat dissipation cavity 61 and is located on the other side opposite to the air duct 62. The exhaust ports 621 face the side where the air guide tube 63 is located, and the heat dissipation cavity 61 is connected to the outside through the air guide tube 63. High-pressure gas is blown out from the exhaust port 621 to form a high-speed airflow sheet, which will guide thirty to forty times the ambient air to form a high-intensity, large-airflow impact air curtain to blow toward the air duct 63, thereby evenly distributing and taking away the heat of the base 10, thereby protecting the equipment under the heating plate 20. In this embodiment, along the projection perpendicular to the plate surface of the heating plate 20, the air duct 62 is arranged on a side close to the positioning assembly 50, and its extension direction is perpendicular to the arrangement direction of the at least two fixing members 11, and the air duct 63 is located on a side away from the positioning assembly 50.

[0039] Furthermore, a sensor 70 is provided on one side of the base 10 where the positioning assembly 50 is located. The sensor 70 is electrically connected to the controller to sense whether the substrate is placed on the heating plate 20 and the distance from the substrate to the positioning assembly 50. The sensor 70 can be a conventional sensing device in the prior art, such as an infrared sensor, an ultrasonic rangefinder, etc.

[0040] Furthermore, along the projection perpendicular to the plate surface direction of the heating plate 20, two insulation plates 80 are provided on both sides of the at least two fixing members 11, and the extension direction is parallel to the arrangement direction of the at least two fixing members 11. The insulation plates 80 are respectively installed on both sides of the base 10 and close to the side surfaces of the heating plate 20 for heat insulation.

[0041] During operation, the substrate enters the heating plate 20 from the entry side 21 and moves toward the positioning side 22. The sensor 70 detects that the substrate is close to the positioning assembly 50 and transmits a signal to the controller. The controller starts the driver 54 so that the blocking block 51 rises and abuts against the substrate. Then the controller controls the vacuum pump to start and adsorb the substrate onto the heating plate 20. The controller starts the heating rod 31 to heat the heating plate 20, and the substrate is heated accordingly. The thermocouple 32 detects the temperature of the heating plate 20 to control the temperature of the heating plate 20. In this process, an external air source introduces airflow into the air duct 62, and high-pressure hot air flows out of the heat dissipation cavity 61 from the air duct 63, thereby taking away heat.

[0042] Compared with the prior art, the substrate heating device of the present invention has the following advantages:

[0043] 1. During the heating process, the heating plate can be evenly extended to all sides with high flatness, thus reducing the uneven heating of the substrate and reducing the defective rate of the chip;

[0044] 2. The power of different heating rods can be adjusted according to the temperature values ​​at various positions of the heating plate to further evenly heat the substrate;

[0045] 3. The substrate can be positioned on the heating plate and adsorbed and fixed so that the substrate remains in contact with the heating plate;

[0046] 4. The positioning component can be stored under the heating plate when not working, saving space;

[0047] 5. It has heat dissipation components and heat insulation boards, which can reduce the impact of high temperature on other components and dissipate heat quickly.

[0048] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the embodiments of the present application. The singular forms of "a", "said" and "the" used in the embodiments of the present application and the claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that, unless otherwise specified, "multiple" refers to two or more; the terms "first", "second", "third", etc. are only used to distinguish, rather than to describe a specific order or sequence, and cannot be understood as indicating or implying relative importance. The term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items. When the above description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. In the description of the present application, for those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0049] The above-mentioned embodiments only express several implementation methods of the present invention, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A substrate heating device, characterized in that: include: Pedestal; A heating plate, the heating plate is laid on the base and fixed to the base by at least two fixing members; Projected in a direction perpendicular to the surface of the heating plate, the at least two fixing members are arranged along the center line of the heating plate; A heating assembly, comprising a heating rod for heating at least a portion of the heating plate, wherein the heating rod is close to the at least two fixing members and extends in a direction parallel to an arrangement direction of the at least two fixing members; A positioning assembly, wherein the positioning assembly is installed on the base and is located on one side of the heating plate, and comprises a blocking block, a pushing block and a driver, at least a portion of which can be higher than the heating plate; in the heating plate, a side close to the blocking block is a positioning side, and the other side opposite to the positioning side is an entry side, and an arrangement direction of the at least two fixing members points from the entry side to the positioning side; the pushing block abuts against the blocking block, and the driver drives the pushing block to move away from or toward the heating plate; when the pushing block approaches the heating plate, the blocking block is higher than the heating plate; when the pushing block is away from the heating plate, the blocking block is lower than the heating plate.

2. The substrate heating device according to claim 1, characterized in that: The heating assembly also includes a plurality of thermocouples, each thermocouple detecting the temperature at a different position of the heating plate.

3. The substrate heating device according to claim 1, characterized in that: There are several heating rods which are inserted into the heating plate. When projected along a direction perpendicular to the heating plate, each heating rod is symmetrically arranged on both sides of the at least two fixing members.

4. The substrate heating device according to claim 1, characterized in that: The positioning assembly also includes a guide rod, which is arranged on the base and inserted into the blocking block along a direction perpendicular to the surface of the heating plate.

5. The substrate heating device according to claim 1, characterized in that: Also includes: A heat dissipation component, the heat dissipation component includes a heat dissipation cavity, an air duct and an air guide tube; the heat dissipation cavity is arranged below the base; the air duct extends on a side wall of the heat dissipation cavity, the air guide tube is located on the other side of the heat dissipation cavity opposite to the air duct, and connects the inside and outside of the heat dissipation cavity; a plurality of exhaust ports are opened on the air duct, and the exhaust ports are arranged along the extension direction of the air duct and face the side where the air guide tube is located.

6. The substrate heating device according to claim 5, characterized in that: The hole depth of the exhaust port is 4 to 5 times the hole diameter.

7. The substrate heating device according to claim 1, characterized in that: Also includes: A suction component, the suction component comprising a vacuum pipe and a vacuum pump; The heating plate is provided with an adsorption hole communicating with the lower part thereof; one end of the vacuum suction pipe is connected to the adsorption hole, and the other end is connected to the vacuum pump.

8. The substrate heating device according to claim 7, characterized in that: Along the projection direction perpendicular to the surface of the heating plate, a plurality of adsorption holes are symmetrically arranged on both sides of the at least two fixing members, and the same vacuum suction pipe is respectively connected to more than two adsorption holes.

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