A power board and inverter

Abstract

The application discloses a power board and an inverter. The power board is provided with a boost inductor and a power connector on the outer side, and at least part of the boost inductor and at least part of the power connector are distributed close to the first edge of the power board. The power board comprises a first connecting module. In the first direction, the first connecting module is located at the first edge of the power board and extends inward. The length of the power board extending in the second direction is less than the length of the power board extending in the first direction, and the length of the first connecting module extending in the second direction is greater than the length of the first connecting module extending in the first direction. The first connecting module comprises a first group of boost terminals and a first group of power terminals. The first group of boost terminals is connected to the boost inductor close to the first edge through an external wiring on the board surface. The first group of power terminals is connected to the power connector close to the first edge through an external wiring on the board surface. Thus, the external wiring on the board surface is short, occupies less space, and can improve the electromagnetic compatibility of the circuit board.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of circuit, in particular to a power board and an inverter. BACKGROUND

[0002] Photovoltaic power generation is a technology that directly converts light energy into electrical energy by using the photovoltaic effect of the semiconductor interface. The photovoltaic power generation device mainly consists of a solar panel (component), a controller and an inverter. One of the core components of the inverter is the power board, which can convert the input DC power into AC power. At present, the power board generally has the problems of long path and large space occupation of external wiring, complex internal wiring and the need to introduce additional current return elements, which affects the overall working performance and packaging difficulty of the inverter. SUMMARY

[0003] The present application provides a power board and an inverter, which can make the external wiring simple and short, and the internal wiring clear without introducing additional current return elements, without changing the appearance size of the power board and the type of internal elements, thereby improving the use performance of the power board.

[0004] The first aspect of the present application provides a power board, the outer side of the power board is distributed with a boost inductor and a power connector, and at least part of the boost inductor and at least part of the power connector are distributed close to a first edge of the power board, the first edge extends along a second direction; the power board comprises a first connection module; in a first direction, the first connection module is located at the first edge of the power board and extends inwardly; wherein the length of the power board extending along the second direction is less than the length of the power board extending along the first direction, the length of the first connection module extending along the second direction is greater than the length of the first connection module extending along the first direction, and the first direction and the second direction intersect; the first connection module comprises a first group of boost terminals and a first group of power terminals, the first group of boost terminals is connected to the boost inductor close to the first edge through off-board wiring; the first group of power terminals is connected to the power connector close to the first edge through off-board wiring.

[0005] Therefore, since the boost inductor and the power connector are distributed close to the first edge, and the first group of boost terminals and the first group of power terminals are also distributed close to the first edge, the length of the off-board wiring between the boost terminals and the boost inductor is significantly shortened, and the length of the wiring between the power connection terminals and the power connector is also significantly shortened, the route is simple and does not occupy too much external space, and the electromagnetic compatibility of the overall circuit is also improved.

[0006] In some embodiments, in the second direction, the boost inductor is located between the third edge and the fourth edge of the power board, and the boost inductor is distributed close to the fourth edge of the power board, and the power connector is also located on the side of the fourth edge away from the third edge; the third edge and the fourth edge are opposite in the second direction; in the second direction, the first connection module is located at the fourth edge of the power board and extends inward.

[0007] In this way, the boost inductor and the power connector are both arranged close to the first edge and close to the fourth edge, and the first connection module is also distributed close to the first edge and close to the fourth edge, so that the length of the off-board wiring between the boost terminal and the boost inductor, and the length of the off-board wiring between the power terminal and the power connector, are significantly shortened, not only improving the EMC performance of the circuit but also saving off-board space; in addition, the off-board wiring between the power terminal and the power connector mainly extends in the first direction, so that the space below the fourth edge is saved, allowing additional placement of other devices, allowing more components to be placed in the internal volume of the packaging enclosure, and indirectly increasing the internal volume of the packaging enclosure.

[0008] In some embodiments, the first group of power terminals includes a plurality of positive / negative power terminal pairs; the first group of boost terminals includes a plurality of positive / negative boost terminal pairs, a positive power terminal and a positive boost terminal are distributed in pairs, and are located at the part of the first connection module close to the first edge of the power board; the positive power terminal is connected to the power connector through off-board wiring, and the off-board wiring at least includes a part extending in the second direction; the positive boost terminal is connected to the boost inductor through off-board wiring, and the off-board wiring at least includes a part extending in the first direction; in the first direction, the negative boost terminal is distributed close to the first edge away from the power board, the negative boost terminal is connected to the boost inductor through off-board wiring, and the off-board wiring at least includes a part extending in the first direction.

[0009] In this way, since the positive power terminal and the positive boost terminal are connected to the same Hall sensor, the positive power terminal and the positive boost terminal are distributed in pairs, so that the Hall sensor can be further arranged around them to shorten the wiring of the in-circuit electrical connection; at the same time, the positive power terminal and the positive boost terminal are both distributed close to the first edge, and the off-board wiring is also relatively short.

[0010] In some embodiments, in the first direction, the first connection module is distributed with the center device module away from the outer side of the first edge, the center device module comprising a plurality of bus capacitors, a plurality of boost transistors, a bus, the boost transistors, a boost inductor, a plurality of bus capacitors and the bus for forming a boost circuit; in the second direction, the bus is located on the side of the center device module away from the fourth edge of the power board and extends from the part close to the first connection module in the first direction; in the first direction, the negative electric energy terminals in the first connection module are distributed close to the center device module and away from the first edge of the power board, so that each negative electric energy terminal is directly connected to the bus through the bus layer in the power board and the in-plane wiring on the board surface.

[0011] Thus, the negative electric energy terminals are all distributed close to the center device module, and the negative electric energy terminals and the bus are not blocked by the boost terminals, so the negative electric energy terminals can be respectively connected to the bus layer in the power board and then directly connected to the bus through the in-plane wiring on the board surface, without the need for the plurality of negative electric energy terminals to converge together, that is, in the manner of zoned busbar, the current-carrying capacity of each line is not large, so it is not necessary to additionally introduce busbars.

[0012] In some embodiments, the first connection module further comprises a plurality of filter capacitors and a plurality of Hall sensors; the Hall sensor is connected between the pair of distributed positive electric energy terminals and positive boost terminals, and the positive electric energy terminals and the positive boost terminals are arranged around the connected Hall sensor; the filter capacitor is connected between the pair of distributed positive electric energy terminals and negative electric energy terminals, and the positive electric energy terminals and the negative electric energy terminals are respectively located on the two sides of the connected filter capacitor; the filter capacitor and the Hall sensor connected to the same positive electric energy terminal are adjacently distributed.

[0013] Thus, the positive electric energy terminals and the positive boost terminals are both distributed close to the connected Hall sensor, and the positive electric energy terminals are also connected close to the connected filter capacitor, and the negative electric energy terminals are distributed on the other side of the connected filter capacitor, so that the internal wiring of the board is short and clear. Here, the internal wiring of the board refers to the electrical connection achieved by the internal wiring layer.

[0014] In some embodiments, the first connection module further comprises a plurality of lightning protection devices, and the lightning protection device is connected in series between the pair of positive electric energy terminals and negative electric energy terminals; wherein the lightning protection device is at least distributed close to the connected positive electric energy terminal.

[0015] Thus, on the one hand, the in-plane wiring between the lightning protection device and the positive electric energy terminal is relatively short; on the other hand, since all lightning protection devices need to be grounded (or a plurality of lightning protection devices can be connected in series and then grounded), all lightning protection devices on the power board are concentratedly distributed close to the first edge, and the connection between the lightning protection devices and the grounding connection are also relatively easy to achieve at this time.

[0016] In some embodiments, the power board is further provided with a main control board above the power board along a third direction, and the main control board is away from the third edge of the power board and close to the fourth edge of the power board, and the third direction is perpendicular to the first direction and the second direction; in the second direction, an auxiliary module is distributed between the center device module and the fourth edge of the power board, and the auxiliary module includes a plug-in port close to the fourth edge of the power board, and the plug-in port is used for plugging the main control board on the power board to monitor and control the power board; wherein the third direction is perpendicular to the first direction and the second direction.

[0017] Thus, the main control board is plugged in the middle part of the power board in the length direction, so that the distance between the main control board and the left and right parts of the power board is approximately equal, the signal delay is shortened, and the control uniformity is obviously improved.

[0018] In some embodiments, the boost inductance of the other part and the power connector of the other part are distributed close to the second edge of the power board; the power board further includes a second connection module; in the first direction, the second connection module is located at the second edge of the power board and extends inward, and the length of the second connection module extending along the second direction is greater than the length of the second connection module extending along the first direction; the second connection module includes a second group of boost terminals and a second group of power terminals, and the second group of boost terminals is connected to the boost inductance close to the second edge through off-board wiring; the second group of power terminals is connected to the power connector close to the second edge through off-board wiring; in the second direction, the second connection module is located at the fourth edge of the power board and extends inward.

[0019] Thus, the boost terminals and the power terminals are divided into two groups, respectively located in the first connection module at the first edge and the second connection module at the second edge; each group of boost terminals is connected to the adjacent boost inductance, thereby significantly shortening the off-board wiring between the boost terminals and the boost inductance, and at the same time shortening the off-board wiring between the power terminals and the power connector. In addition, the space below the fourth edge is saved, and additional components can also be placed, thereby increasing the available space in the shell without changing the packaging shell.

[0020] In some embodiments, the device types and electrical connection methods of the first connection module and the second connection module are the same; the negative power terminals in the first connection module and the second connection module are connected to the same bus, and the bus extends from one side close to the first connection module to the other side close to the second connection module along the first direction, so that the negative power terminals in the second connection module are directly connected to the bus through the in-board wiring using the in-board bus layer.

[0021] Thus, the device types and the electrical connection modes of the first connection module and the second connection module are the same, so they can be symmetrically distributed, which is convenient; in addition, the negative electrical energy terminals in the first connection module and the second connection module are respectively close to the busbar, and there is no need to introduce a busbar.

[0022] In some embodiments, the sum of the length of the first connection module along the first direction and the length of the second connection module along the first direction is less than the total length of the power board along the first direction; the length of the first connection module along the second direction is less than the total length of the power board along the second direction, and the length of the second connection module along the second direction is less than the total length of the power board along the second direction; the electrical energy connector is used to connect an electrical energy output device, and the electrical energy output device is used to output direct-current electrical energy; wherein the electrical energy output device is a photovoltaic panel, and the electrical energy connector is a photovoltaic connector.

[0023] Thus, the first connection module and the second connection module are respectively located on both sides of the power board along the first direction and only occupy a small space, which hardly affects the arrangement of the central device module; in addition, the first connection module and the second connection module are arranged close to the fourth edge and do not extend to the third edge, so they also do not affect the arrangement of the inverter module.

[0024] The second aspect of the present application also provides an inverter, which comprises the power board of the first aspect.

[0025] In this way, since the inverter comprises the aforementioned power board, it at least has the same advantages as the aforementioned power board.

[0026] In some embodiments, the inverter further comprises a boost inductor, an electrical energy connector and a main control board, and the boost inductor, the electrical energy connector and the main control board are all installed inside the housing of the inverter; the boost inductor and the electrical energy connector are both distributed close to the fourth edge of the power board, at least part of the boost inductor and the electrical energy connector are distributed close to the first edge of the power board, and the other part of the boost inductor and the electrical energy connector are distributed close to the second edge of the power board; the first edge and the second edge are opposite along the first direction; the fourth edge intersects the first edge; the main control board and the power board are arranged along the third direction, and the third direction is perpendicular to the first edge and perpendicular to the fourth edge.

[0027] In some embodiments, the inverter further comprises a plurality of magnetic rings, and the magnetic rings are used to improve electromagnetic compatibility; in the second direction, the magnetic rings are located outside the fourth edge of the power board; in the first direction, the magnetic rings are located between the first edge and the second edge of the power board.

[0028] Thus, since the electrical energy terminals and the boost terminals in the power board are both out-of-panel wired from both sides of the power board along the first direction, they do not occupy the space outside the fourth edge of the power board, and additional space is provided for the magnetic rings, and the EMC performance of the circuit is further improved. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 is a surface view of a power board.

[0030] Figure 2 is a device connection view of a boost circuit.

[0031] Figure 3 is a surface view of a power board provided by an embodiment of the present application Figure 1 .

[0032] Figure 4 is a surface view of a power board provided by an embodiment of the present application Figure 2 .

[0033] Figure 5 is a surface view of a power board provided by an embodiment of the present application Figure 3 .

[0034] Figure 6 is a side view of a power board and a main control board provided by an embodiment of the present application.

[0035] Figure 7 is a package structure view of an inverter provided by an embodiment of the present application. DETAILED DESCRIPTION

[0036] Hereinafter, a power board and an inverter according to an embodiment of the present application are specifically disclosed with appropriate reference to the accompanying drawings. However, there can be cases where unnecessary detailed description is omitted. For example, there can be cases where detailed description of matters well known, repeated description of substantially the same structure, etc. are omitted. This is to avoid the following description from becoming unnecessarily lengthy and to facilitate understanding by those skilled in the art. Furthermore, the accompanying drawings and the following description are provided so that those skilled in the art can fully understand the present application, and are not intended to limit the subject matter recited in the claims.

[0037] The ranges disclosed herein are intended to be "open" ranges, i.e., the upper and lower limits of the range are not included. The ranges are also intended to include any and all sub-ranges of the same, wherein each sub-range is inclusive of the end values. For example, if a range is from 1 to 10, then the range includes any and all sub-ranges between (and including) the minimum of 1 and the maximum of 10, that is, any of 1 to 3, 4 to 6, 7 to 9, etc. In other words, unless context dictates otherwise, each numerical range is intended to indicate the range including both endpoints and any integers including sub-ranges between the two endpoints. For example, the range of "1 to 10" is intended to indicate any number from 1 to 10 including 1 and 10 and any integer in between (e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, 10). If specifically indicated, the range "1 to 10" is intended to exclude the integer values of 1 and 10. In other words, unless context dictates otherwise, each numerical range is intended to indicate the range including both endpoints and any integers including sub-ranges between the two endpoints.

[0038] Unless otherwise specified, all embodiments and optional embodiments of the present application can be combined with each other to form new technical solutions.

[0039] Unless otherwise specified, all technical features and optional technical features of the present application can be combined with each other to form new technical solutions.

[0040] Unless otherwise specified, the terms used in the present application have the commonly understood meanings understood by those skilled in the art.

[0041] Unless otherwise specified, the values of the parameters mentioned in the present application can be measured by various test methods commonly used in the art, for example, can be measured according to the test methods given in the present application.

[0042] It should be noted that the terms "first", "second", "third" involved in the embodiments of the present disclosure are only to distinguish similar objects, and do not represent a specific order of the objects. Understandably, "first", "second", "third" can be interchanged in a specific order or sequence as allowed, so that the embodiments of the present disclosure described herein can be implemented in an order other than that illustrated or described herein.

[0043] Before introducing the embodiments of the present disclosure, the three directions for describing the three-dimensional structure that the plane involved in the embodiments can use are defined. Taking the Cartesian coordinate system as an example, the three directions can include a first direction, a second direction and a third direction.

[0044] Please refer toFigure 1 The diagram provides a schematic representation of a power board 10. This power board 10 (also referred to as a power amplifier board) can be applied to at least string photovoltaic inverters. As shown in Figure 1, the power board 10 may include a top surface on the front side and a bottom surface on the back side opposite the front side. Figure 1 The main focus is on the bottom surface; neglecting the flatness of the top and bottom surfaces, the direction perpendicular to the top and bottom surfaces of the power board 10 is defined as the third direction. On the surface of the power board 10, two intersecting (e.g., perpendicular) directions are defined, namely the first direction and the second direction. The two opposite edges of the power board 10 along the first direction are the first edge and the second edge, respectively, and the two opposite edges of the power board 10 along the second direction are the third edge and the fourth edge, respectively.

[0045] like Figure 1 As shown, along the second direction, the power board 10 can be sequentially divided into a first module, a second module, and a third module. The first module includes at least multiple positive / negative power terminals 111, multiple positive / negative boost terminals 112, a filter capacitor 113, a surge protection device 114, and a Hall sensor 115. The second module includes at least a busbar 121 (…). Figure 1 (Partially shown), bus capacitor 122, and multiple power transistor modules for boost circuits (not shown). Boost inductors and power connectors are also distributed outside the power board 10. The power board 10 receives external DC power through the power connectors. Then, the power transistor modules and boost inductors in the first and second modules together form a boost circuit to boost the received DC power. The third module is mainly an inverter circuit, used to convert the boosted DC power into AC power. Here, the boost circuit and inverter circuit share the bus and bus capacitor.

[0046] Please refer to the circuit connection diagram of the boost circuit. Figure 2 Combining Figure 1 and Figure 2 As can be seen, part of the working principle of the power board 10 is as follows: the positive power terminal 111 receives external DC power from an external power connector (e.g., a photovoltaic connector). The DC power is transmitted sequentially through the Hall sensor 115, the positive boost terminal 112, the external boost inductor, the negative boost terminal 112, and the power transistor module to the bus capacitor 122. At the same time, the negative power terminal 111 is also connected to the bus capacitor 122 through the bus 121, thereby boosting the external DC power. The filter capacitor 113 and the surge protection device 114 are both connected between the positive and negative power terminals 111, and the surge protection device 114 also needs to be grounded.

[0047] Please see Figure 1 The first module also includes a main control interface 116, a power board 10, and a main control board (the main control board and the power board 10 are arranged along a third direction).Figure 1 The main control interface 116 is not shown and is plugged through the main control interface 116, and the plug-in port is close to the fourth edge of the power board 10, and the main control board monitors and controls the power board 10.

[0048] However, the above power board 10 at least has the following problems:

[0049] Firstly, the boost inductors are located outside the first edge and outside the second edge, which causes the positive / negative boost terminals in the middle part to be connected to the external boost inductors through a very long wire, occupying a large space, the line setting is complex, and the too long wire also affects the Electro Magnetic Compatibility (EMC) performance of the overall circuit;

[0050] Secondly, although the power connectors are located below the fourth edge, they are relatively close to the first edge and the second edge. In other scenarios, part of the power connectors are located outside the first edge, and part of the power connectors are located outside the second edge, which causes the positive / negative power terminals 111 to have a long out-of-board surface wire path. This part of the out-of-board surface wire occupies a large part of the space outside the fourth edge, and it is almost impossible to place other devices below the fourth edge;

[0051] Thirdly, since the bus bar 121, the positive / negative boost terminals 112, and the positive / negative power terminals 111 are arranged in the second direction in turn, when part of the negative power terminals 111 are connected upward to the bus bar 121, they will be blocked by the boost terminals 112. Therefore, multiple negative power terminals 111 can first be connected to the bus bar 117 through in-board surface wiring, and then the bus bar 117 is connected upward to the bus bar 121. The bus bar 117 can be specifically connected to the in-board bus bar layer, and then connected to the bus bar 121 through the in-board bus bar layer. Therefore, the in-board surface wiring is complex, and an additional bus bar 117 is required to connect the negative power terminals 111 and the bus bar 121, which increases the cost.

[0052] Finally, the devices and circuit connections of the left and right parts of the power board 20 are approximately symmetrical, but the main control interface 116 is located at the second edge, so that the part of the power board close to the second edge has a shorter connection with the main control board, but the part of the power board close to the first edge has a longer connection with the main control board. The area in the main control board also has a similar problem, which causes the overall control uniformity to be poor, the signal delay of different areas is large, and the working performance of the power board is affected.

[0053] In an embodiment of the present application, please refer to Figure 3 which shows a device distribution diagram of a power board 20 provided by an embodiment of the present application. As shown in Figure 3As shown, the outer side of the power board 20 is distributed with the boost inductors 30 and the power connectors 40, and at least part of the boost inductors 30 and at least part of the power connectors 40 are distributed close to the first edge of the power board 20, the first edge extending along the second direction. The power board 20 comprises a first connection module 21; in the first direction, the first connection module 21 is located at the first edge of the power board 20 and extends inwardly; wherein the length of the power board 20 extending along the second direction is less than the length of the power board 20 extending along the first direction, the length of the first connection module 21 extending along the second direction is greater than the length of the first connection module 21 extending along the first direction, and the first direction and the second direction intersect.

[0054] The first connection module 21 comprises a first group of boost terminals, Figure 1 Only one of the boost terminals 212 is labeled, the first group of boost terminals is in Figure 1 embodied as L1+ / -, L2+ / -, L3+ / -; the first connection module 21 further comprises a first group of power terminals, Figure 3 Only one of the power terminals 211 is labeled, the first group of power terminals 211 is in Figure 1 embodied as PV1+ / -, PV2+ / -, PV3+ / -; the first group of boost terminals 212 is connected to the boost inductors 30 close to the first edge through off-board wiring; the first group of power terminals 211 is connected to the power connectors 40 close to the first edge through off-board wiring.

[0055] It should be understood that, in Figure 3 , the first group of boost terminals 212 comprises 3 pairs of boost terminals 212, and the second group of power terminals 211 comprises 3 pairs of power terminals 211, and the above numbers are only examples and do not constitute specific limitations. The boost inductors 30 are specifically high-frequency inductors.

[0056] That is, in the former embodiment, please refer to Figure 1 , the boost inductors are arranged on both sides of the power board 10 along the first direction, but the boost terminals 112 are arranged along the length direction of the power board 10 (i.e. the first direction), which results in that the boost terminals 112 in the middle part need to pass through very long off-board wiring to be connected to the corresponding boost inductors. On the one hand, the very long off-board wiring will occupy a large part of the off-board space, and the route is complex; on the other hand, the long off-board wiring between the boost terminals 112 and the noise end of the boost inductors will also affect the EMC performance of the circuit. The off-board wiring between the power terminals and the power connectors also has this problem.

[0057] In contrast, please refer to Figure 3, the first group of boost terminals and the first group of power terminals are moved to the first connection module 21 at the first edge, and the first connection module 21 is mainly arranged along the width direction (i.e. the second direction) of the power plate 20. Since the boost inductor 30 and the power connector 40 are both distributed close to the first edge, the length of the out-of-plate wiring between the boost terminal 112 and the boost inductor 30 is significantly shortened, the route is simple and does not occupy too much out-of-plate space, and the EMC performance of the overall circuit is also improved. In addition, the wiring between the power connection terminal 211 and the power connector 40 is also significantly shortened and concentrated on one side close to the first edge, thereby saving the space below the fourth edge and allowing other devices to be placed, allowing more components to be placed under the premise of unchanged internal volume of the packaging shell, and indirectly increasing the internal volume of the packaging shell.

[0058] As shown in Figure 3 , in the second direction, the boost inductor 30 is located between the third edge and the fourth edge of the power plate 20, and the boost inductor 30 is distributed close to the fourth edge of the power plate 20, and the power connector 40 is also located on the side of the fourth edge away from the third edge; the third edge and the fourth edge are opposite along the second direction.

[0059] It should be understood that Figure 3 only the positions of the boost inductor 30 and the power connector 40 are shown and are not limited, for example, the boost inductor 30 can be moved upward by a certain distance, the power connector 40 can be moved to the right by a certain distance (for reference Figure 5 ), etc., and the specific size and specific shape of the boost inductor 30, the power connector 40 and the power plate 20 are not strictly limited, and these can be adjusted according to actual packaging needs, but the boost inductor 30 and the power connector 40 need to be arranged as close to the first edge as possible and as close to the fourth edge as possible. At the same time, the power plate 20, the boost inductor 30 and the power connector 40 do not necessarily have a rectangular shape, and the drawings are only for easy display.

[0060] On this basis, please refer to Figure 3 , in the second direction, the first connection module 21 is located at the fourth edge of the power plate 20 and extends inward.

[0061] In this way, the boost inductor 30 and the power connector 40 are arranged close to the first edge and close to the fourth edge, and the first connection module 21 is also distributed near the first edge and near the fourth edge, so that the length of the out-of-plate wiring between the boost terminal 212 and the boost inductor 30 and the length of the out-of-plate wiring between the power terminal 211 and the power connector 40 are significantly shortened, not only improving the EMC performance of the circuit but also saving the out-of-plate space.

[0062] In some embodiments, referring to Figure 3 , the first group of power terminals comprises a plurality of positive / negative power terminal pairs, for example, PV1 + / - is a pair of positive / negative power terminals; the first group of boost terminals comprises a plurality of positive / negative boost terminal pairs, for example, L1 + / - is a pair of positive / negative boost terminals.

[0063] Referring to Figure 2 , from the perspective of circuit connection, a positive power terminal and a positive boost terminal are connected to a corresponding Hall sensor, so the corresponding positive power terminal 211 and positive boost terminal 212 can be distributed adjacently. Therefore, referring to Figure 3 , a positive power terminal 211 and a positive boost terminal 212 are distributed in pairs, that is, PV1 + and L1 + are distributed adjacently in pairs, PV2 + and L2 + are distributed adjacently in pairs, and PV3 + and L3 + are distributed adjacently in pairs, and are located in the part of the first connection module 21 close to the first edge of the power board 20; the positive power terminal 211 is connected to the power connector 40 through the off-board wiring, and the off-board wiring at least comprises a part extending along the second direction; the positive boost terminal 212 is connected to the boost inductor 30 through the off-board wiring, and the off-board wiring at least comprises a part extending along the first direction.

[0064] In this way, since the positive power terminal 211 and the positive boost terminal 212 are connected to the same component, the positive power terminal 211 and the positive boost terminal 212 are distributed in pairs, so that the Hall sensor arranged around them can further shorten the in-board wiring; at the same time, the positive power terminal 211 and the positive boost terminal 212 are both distributed close to the first edge, and the off-board wiring is also relatively short.

[0065] In addition, in the first direction, the negative boost terminal 212 is distributed away from the first edge of the power board, and the negative boost terminal 212 is connected to the boost inductor 30 through the off-board wiring, and the off-board wiring at least comprises a part extending along the first direction.

[0066] In a specific embodiment, referring to Figure 4 , the first connection module 21 further comprises a plurality of filter capacitors 213 and a plurality of Hall sensors 215; the Hall sensor 215 is connected between the positive power terminal 211 and the positive boost terminal 212 distributed in pairs, and the positive power terminal 211 and the positive boost terminal 212 are arranged around the connected Hall sensor 215. Please refer to Figure 3 , PV1 +, L1 + surround a Hall sensor, PV2 +, L2 + surround a Hall sensor, and PV3 +, L3 + surround a Hall sensor.

[0067] Referring to Figure 4The filter capacitor 213 is connected between the pair of positive and negative power terminals 211, and the positive and negative power terminals are located on two sides of the connected filter capacitor 213 respectively. The filter capacitor 213 connected to the same positive power terminal is adjacent to the Hall sensor 215. Please refer to Figure 3 There is a filter capacitor 213 between PV1+ and PV1-, a filter capacitor 213 between PV2+ and PV2-, and a filter capacitor 213 between PV3+ and PV3-.

[0068] In this way, the positive power terminals 211 are distributed close to the connected Hall sensors 215, and the positive boost terminals 212 are distributed close to the connected Hall sensors 215. At the same time, the positive power terminals 211 are also connected close to the connected filter capacitors 213, and the negative power terminals 211 are distributed on the other side of the connected filter capacitors 213, so that the internal wiring of the board is short and clear. Here, the internal wiring refers to the electrical connection realized by the internal wiring layer of the board.

[0069] In some embodiments, the first connection module 21 further includes a plurality of lightning protection devices 214. Please refer to Figure 2 From the perspective of circuit connection, the lightning protection device 214 is connected between the pair of positive and negative power terminals. Please refer to Figure 4 The lightning protection device 214 is at least distributed close to the connected positive power terminal, and the lightning protection device 214 is located between the first edge and the connected positive power terminal.

[0070] In this way, on the one hand, the internal wiring between the lightning protection device 214 and the positive power terminal 211 is relatively short; on the other hand, since all lightning protection devices need to be grounded (or a plurality of lightning protection devices can be connected in series and then grounded), all lightning protection devices on the power board 20 are distributed close to the first edge, and the connection between the lightning protection devices and the ground connection are also relatively easy to realize.

[0071] Please refer to Figure 2 From the perspective of circuit connection, all negative power terminals also need to be connected to the negative end of the bus. As shown in Figure 4 There are 5 terminals (identified as bus-) in the first connection module 21 connected to the negative end of the bus, of which 3 terminals serve as negative power terminals (PV1- / PV2- / PV3-), and the remaining 2 terminals serve as aggregation or transfer functions and need to be connected to the negative end of the bus bus-.

[0072] In some embodiments, please refer to Figure 4In the first direction, the first connection module 21 is distributed with the central device module 23 away from the outer side of the first edge, the central device module 23 includes a plurality of bus capacitors 232, a plurality of boost transistors 233 and a bus 231 (only part of the bus is shown in the figure); the boost transistors 233, the boost inductor 30, the bus capacitors 232 and the bus 231 are used to form a boost circuit.

[0073] In the second direction, the bus 231 is located on the side of the central device module 23 away from the fourth edge of the power board 20, and extends from the part close to the first connection module 21 in the first direction; in the first direction, the negative power terminals 211 in the first connection module 21 are distributed close to the central device module 23 and away from the first edge of the power board 20, so that each negative power terminal 211 is directly connected to the bus through the in-plane wiring of the bus layer in the board.

[0074] In this way, the negative power terminals 211 are all distributed close to the central device module 23, and the negative power terminals 211 and the bus 231 are not blocked by the boost terminals 212, so that the negative power terminals 211 can be respectively connected to the bus layer in the board and then directly connected to the bus through the in-plane wiring of the board, without the need for the plurality of negative power terminals 211 to converge together. In short, the power board 20 adopts a zoning busbar connection mode, and the current carrying capacity of each line is not large, so that an additional busbar does not need to be introduced; in addition, at least one negative power terminal 211 is also close to the first connection module 21 and away from the upper side of the fourth edge, that is, the distance between the negative power terminal 211 in the upper right corner of the first connection module 21 and the bus 231 is very short, which further shortens the distance of the in-plane wiring of the board and does not introduce additional path resistance, capacitance and inductance, thereby improving the performance of the power board.

[0075] In some embodiments, referring to Figure 5 , another part of the boost inductor and another part of the power connector are distributed close to the second edge of the power board; the power board 20 further includes a second connection module 22; in the first direction, the second connection module 22 is located at the second edge of the power board 20 and extends inwardly, and the length of the second connection module 22 extending in the second direction is greater than the length of the second connection module 22 extending in the first direction. The second connection module includes a second group of boost terminals and a second group of power terminals, the second group of boost terminals is connected to the boost inductor 30 close to the second edge through the off-board wiring; the second group of power terminals is connected to the power connector 40 close to the second edge through the off-board wiring; in the second direction, the second connection module 22 is located at the fourth edge of the power board and extends inwardly.

[0076] In brief, the boost terminals 212 are divided into two groups, the first connection module 21 at the first edge and the second connection module 22 at the second edge; similarly, the power terminals 211 are divided into two groups, the first connection module 21 at the first edge and the second connection module 22 at the second edge; so that each group of power terminals 211 is connected to the adjacent power connector 40, and each group of boost terminals 212 is connected to the adjacent boost inductor 30, thereby significantly shortening the off-board wiring between the boost terminals 212 and the boost inductor 30, and shortening the off-board wiring between the power terminals 211 and the power connector 40. In addition, the space below the fourth edge is saved, and additional components can be placed, thereby increasing the available internal space without changing the package shell.

[0077] In some embodiments, the device types and electrical connection methods of the first connection module 21 and the second connection module 22 are the same.

[0078] It should be noted that the number of devices in the first connection module 21 and the second connection module 22 can be the same, for example, the first connection module 21 and the second connection module 22 each place 3 pairs of power terminals and 3 pairs of boost terminals; or the number of devices in the first connection module 21 and the second connection module 22 can be different, for example, the first connection module 21 and the second connection module 22 each place 2 pairs of power terminals and 4 pairs of boost terminals, depending on the application scenario.

[0079] In addition, if the number of devices in the first connection module 21 and the second connection module 22 corresponds to the same, the first connection module 21 and the second connection module 22 as much as possible to present mirror image distribution. But limited by the specific shape of the power board 20 and the specific distribution of other components, the first connection module 21 and the second connection module 22 cannot accurately present mirror image distribution, but the specific device distribution rules in both are the same to make both generally present mirror image distribution.

[0080] Specifically, please refer to Figure 5 , the device distribution rule of the second connection module 22 is as follows:

[0081] (1) The second group of electrical energy terminals includes a plurality of positive / negative electrical energy terminal pairs; the second group of boost terminals includes a plurality of positive / negative boost terminal pairs, a positive electrical energy terminal and a positive boost terminal are distributed in pairs, and are located at a portion of the second connection module 22 close to the second edge of the power panel 20; the positive electrical energy terminal is connected to the electrical energy connector through an out-of-panel wiring, and the out-of-panel wiring at least includes a portion extending in the second direction; the positive boost terminal is connected to the boost inductor through an out-of-panel wiring, and the out-of-panel wiring at least includes a portion extending in the first direction; in the first direction, the negative boost terminal is distributed close to the second edge away from the power panel 20, the negative boost terminal is connected to the boost inductor through an out-of-panel wiring, and the out-of-panel wiring at least includes a portion extending in the first direction.

[0082] (2) The negative electrical energy terminals in the first connection module 21 and the second connection module 22 are connected to the same bus, and the bus extends from one side close to the first connection module 21 to one side close to the second connection module 22 in the first direction, so that the negative electrical energy terminals in the second connection module 22 are directly connected to the bus through the in-panel bus layer and the in-panel wiring.

[0083] (3) The second connection module 22 further includes a plurality of filter capacitors and a plurality of Hall sensors; the Hall sensor is connected between the positive electrical energy terminal and the positive boost terminal distributed in pairs, and the positive electrical energy terminal and the positive boost terminal are arranged around the connected Hall sensor; the filter capacitor is connected between the positive electrical energy terminal and the negative electrical energy terminal distributed in pairs, and the positive electrical energy terminal and the negative electrical energy terminal are respectively located on both sides of the connected filter capacitor; the filter capacitor and the Hall sensor connected to the same positive electrical energy terminal are distributed adjacent to each other.

[0084] (4) The second connection module 22 further includes a plurality of lightning protection devices, and the lightning protection devices are connected in series between the positive electrical energy terminal and the negative electrical energy terminal distributed in pairs; wherein the lightning protection device is at least distributed close to the connected positive electrical energy terminal.

[0085] In a specific implementation, the electrical energy connector 40 is used to connect an electrical energy output device, and the electrical energy output device is used to output direct current electrical energy; wherein the electrical energy output device is a photovoltaic panel, and the electrical energy connector is a photovoltaic connector.

[0086] In some embodiments, please refer to Figure 4 or Figure 5 Since the boost terminals / electrical energy terminals / Hall sensors / filter capacitors / lightning protection devices of the power panel 20 are moved to the first edge and the second edge of the power panel 20, a portion of space (referred to as an auxiliary module) will be left in the middle of the fourth edge of the power panel 20 at this time. The plug-in port between the main control panel 50 and the power panel 20 can be placed here.

[0087] Please refer to Figure 6The power board 20 is also provided with a main control board 60 along the third direction, which is perpendicular to the first direction and the second direction. Please refer to Figure 4 or Figure 5 In the second direction, the center device module 23 and the fourth edge of the power board 20 are distributed with an auxiliary module 24, which includes a plug-in port 241 close to the fourth edge of the power board 20. The plug-in port 241 is used to plug the main control board 60 on the power board 20, so that the main control board 60 monitors and controls the power board 20, mainly realizing sampling and driving functions. The third direction is perpendicular to the first direction and the second direction.

[0088] Here, in the first direction, the distance between the plug-in port 241 and the first edge and the distance between the plug-in port 241 and the second edge are less than a preset threshold, that is, within the allowable error range, it can be considered that the distance between the plug-in port 241 and the first edge and the distance between the plug-in port 241 and the second edge are the same.

[0089] In this way, since the lightning protection device / filter capacitor / Hall sensor is moved to the left and right sides of the power board 20, the plug-in port 241 can be moved to the middle position of the lower side of the power board 20, that is, the main control board 60 is plugged in the middle part of the power board 20 in the length direction, so that the distance between the main control board 60 and the left and right parts of the power board 20 is approximately equal, the signal delay is shortened, and the control uniformity is obviously improved. It should be understood that the devices in the two parts (i.e. left and right parts) of the power board 20 along the first direction are approximately symmetrical.

[0090] It should be further pointed out that, please refer to Figure 5 In the second direction, the center device module 24 and the third edge of the power board 20 are distributed with an inverter module 25, which is used to form an inverter circuit, and the inverter circuit and the boost circuit share the bus capacitor 232 and the bus 231.

[0091] In a specific embodiment, please refer to Figure 5 The sum of the length of the first connection module 21 along the first direction and the length of the second connection module 22 along the first direction is less than the total length of the power board 20 along the first direction; the length of the first connection module 21 along the second direction is less than the total length of the power board 20 along the second direction, and the length of the second connection module 22 along the second direction is less than the total length of the power board along the second direction. Therefore, the first connection module 21 and the second connection module 22 are respectively located on the two sides of the power board 20 along the first direction and only occupy a small space, almost without affecting the arrangement of the center device module 23; in addition, the first connection module 21 and the second connection module 22 are arranged close to the fourth edge and do not extend to the third edge, so they also do not affect the arrangement of the inverter module 25.

[0092] In summary, the application provides a power board 20 which, compared with Figure 1 the power board 10 shown in the drawings, Figure 5 the power board 20 shown in the drawings can optimize the positions of the power terminals / boost terminals / filter capacitors / lightning protection devices / Hall sensors / master control interfaces without changing the appearance size, the number and scale of internal devices, so that the external wiring on the board is short, the internal wiring on the board is clear and does not need to introduce bus bars, and the EMC performance of the circuit and the control uniformity of the master control board can be improved. The specific description is as follows:

[0093] (1) The noise terminal lead of the boost terminal and the boost inductor (high-frequency inductor) is shorter, and the EMC performance is better;

[0094] (2) In terms of bus connection, the negative power terminals need to be connected to the bus. Figure 1 In the middle power board 10, an additional bus bar is needed to realize bus connection, and the cost is increased. In the application, for example Figure 5 In the middle power board 20, due to the use of partition bus connection (the first connection module 21 and the second connection module 22 are connected respectively), the current-carrying capacity of each line is not large, and a bus bar is not needed; in addition, after partitioning, at least two negative power terminals are closer to the bus.

[0095] (3) In terms of the connection between the master control board and the power board, the master control board and the power amplifier board are connected to each other through the plug-in port, mainly realizing the functions of sampling and driving. Figure 1 In the middle power board 10, the lightning protection device occupies the lower side of the power board 10, so that the plug-in port can only be located on the right side of the power board 10. In the application, for example Figure 5 In the middle power board 20, the lightning protection device is moved to both sides synchronously, so that the plug-in port can be moved to the lower side in the power board 20, so that the lead length of the plug-in port to the left and right modules is consistent, more symmetrical, and the delay is less. In this way, the power board 20 provided by the application embodiment has great improvement in EMC; the cost of using bus members is reduced; in addition, the device connection length of the left and right parts of the master control board and the power board is more consistent.

[0096] In another embodiment of the application, please refer to Figure 7 which shows a structure schematic diagram of an inverter 70. As Figure 7 shown, the inverter 70 includes the aforementioned power board 20, and at least has the same advantages as the power board 20.

[0097] In some embodiments, the inverter 70 further includes a boost inductor 30, a power connector 40, and a main control board, all of which are installed inside the housing of the inverter 70; the boost inductor 30 and the power connector 40 are distributed near the fourth edge of the power board 20, at least a portion of the boost inductor 30 and the power connector 40 are distributed near the first edge of the power board 20, and another portion of the boost inductor 30 and the power connector 40 are distributed near the second edge of the power board 20; the first edge and the second edge are opposite to each other along a first direction; the fourth edge intersects the first edge; the main control board ( Figure 7 (Not shown) and power board 20 are arranged along a third direction, which is perpendicular to the first edge and perpendicular to the fourth edge.

[0098] In some implementations, please refer to Figure 7 The inverter 70 also includes multiple magnetic rings, which are used to improve electromagnetic compatibility; in the second direction, the magnetic rings are located outside the fourth edge of the power board 20; in the first direction, the magnetic rings are located between the first edge and the second edge of the power board 20.

[0099] Please see below. Figure 5 Since the power terminals and boost terminals in the power board 20 are both routed outside the board surface along both sides of the power board 20 in the first direction, they do not occupy the space outside the fourth edge of the power board 20, and provide additional space for adding a magnetic ring, thus further improving the EMC performance of the circuit.

[0100] It should be noted that this application is not limited to the above-described embodiments. The above embodiments are merely examples, and any embodiments with the same structure and effect as the technical concept within the scope of this application are included in the technical scope of this application. Furthermore, various modifications that can be conceived by those skilled in the art to the embodiments, and other ways of constructing by combining some of the constituent elements of the embodiments, without departing from the spirit of this application, are also included in the scope of this application.

Claims

1. A power strip, comprising: The power board has a boost inductor and a power connector distributed on the outer side of the power board, and at least part of the boost inductor and at least part of the power connector are distributed close to the first edge of the power board, the first edge extending in the second direction; The power board comprises a first connection module; in the first direction, the first connection module is located at the first edge of the power board and extends inwardly; wherein the length of the power board extending in the second direction is less than the length of the power board extending in the first direction, and the length of the first connection module extending in the second direction is greater than the length of the first connection module extending in the first direction, and the first direction and the second direction intersect; The first connection module comprises a first group of boost terminals and a first group of power terminals, the first group of boost terminals being connected to the boost inductor close to the first edge through an off-board wiring, and the first group of power terminals being connected to the power connector close to the first edge through an off-board wiring; In the second direction, the boost inductor is located between the third edge and the fourth edge of the power board, and the boost inductor is distributed close to the fourth edge of the power board, and the power connector is also located on the side of the fourth edge away from the third edge; the third edge and the fourth edge are opposite in the second direction; In the second direction, the first connection module is located at the fourth edge of the power board and extends inwardly.

2. The power panel of claim 1, wherein, The first group of power terminals comprises a plurality of positive / negative power terminal pairs; the first group of boost terminals comprises a plurality of positive / negative boost terminal pairs, A positive power terminal and a positive boost terminal are distributed in pairs and located in the part of the first connection module close to the first edge of the power board; the positive power terminal is connected to the power connector through an off-board wiring, and the off-board wiring at least comprises a part extending in the second direction; The positive boost terminal is connected to the boost inductor through an off-board wiring, and the off-board wiring at least comprises a part extending in the first direction; In the first direction, the negative boost terminal is distributed close to the side away from the first edge of the power board, the negative boost terminal is connected to the boost inductor through an off-board wiring, and the off-board wiring at least comprises a part extending in the first direction.

3. The power board of claim 2, wherein, In the first direction, the first connection module has a central device module distributed on the outer side away from the first edge, the central device module comprising a plurality of bus capacitors, a plurality of boost transistors, a bus, the boost transistors, the boost inductor, the plurality of bus capacitors, and the bus being used to form a boost circuit; In the second direction, the bus is located on the side of the central device module away from the fourth edge of the power board, and extends in the first direction from the part close to the first connection module; In the first direction, the negative power terminal in the first connection module is distributed close to the central device module and away from the first edge of the power board, so that each negative power terminal is directly connected to the bus through an in-board bus layer via an in-board wiring.

4. The power panel of claim 2, wherein, The first connection module further comprises a plurality of filter capacitors and a plurality of Hall sensors; The Hall sensors are connected between a pair of positive power terminals and a positive boost terminal, and the positive power terminals and the positive boost terminal are arranged around the connected Hall sensors; The filter capacitors are connected between a pair of positive power terminals and a negative power terminal, and the positive power terminal and the negative power terminal are respectively located on both sides of the connected filter capacitors; The filter capacitors and the Hall sensors connected to the same positive power terminal are arranged adjacent to each other.

5. The power panel according to claim 2, wherein, The first connection module further comprises a plurality of lightning protection devices, and the lightning protection devices are connected in series between a pair of positive power terminals and a negative power terminal; Among them, the lightning protection devices are at least distributed close to the connected positive power terminal.

6. The power panel according to claim 3, wherein, The power panel further comprises a master control panel arranged above the power panel along a third direction, and the master control panel is away from the third edge of the power panel and close to the fourth edge of the power panel, and the third direction is perpendicular to the first direction and the second direction; In the second direction, an auxiliary module is arranged between the center device module and the fourth edge of the power panel, and the auxiliary module comprises a plug-in port, and the plug-in port is close to the fourth edge of the power panel, and the plug-in port is used for plug-in of the master control panel on the power panel, so that the master control panel monitors and controls the power panel; Among them, the third direction is perpendicular to the first direction and the second direction.

7. The power panel of any of claims 2-6, wherein, Another part of the boost inductor and another part of the power connector are arranged close to the second edge of the power panel; The power panel further comprises a second connection module; In the first direction, the second connection module is located at the second edge of the power panel and extends inward, and the length of the second connection module extending along the second direction is greater than the length of the second connection module extending along the first direction; The second connection module comprises a second group of boost terminals and a second group of power terminals, and the second group of boost terminals are connected to the boost inductor close to the second edge through off-board wiring; the second group of power terminals are connected to the power connector close to the second edge through off-board wiring; In the second direction, the second connection module is located at the fourth edge of the power panel and extends inward.

8. The power panel according to claim 7, wherein, The device types and electrical connection modes of the first connection module and the second connection module are the same; The negative power terminals in the first connection module and the second connection module are connected to the same bus, and the bus extends from one side close to the first connection module to one side close to the second connection module along the first direction, so that the negative power terminals in the second connection module are directly connected to the bus through the in-board bus layer and in-board wiring.

9. The power panel according to claim 7, wherein, The sum of the length of the first connecting module along the first direction and the length of the second connecting module along the first direction is less than the total length of the power board along the first direction; The length of the first connecting module along the second direction is less than the total length of the power board along the second direction, and the length of the second connecting module along the second direction is less than the total length of the power board along the second direction; The power connector is used for connecting a power output device, and the power output device is used for outputting direct-current power; wherein the power output device is a photovoltaic panel, and the power connector is a photovoltaic connector.

10. An inverter, characterized by comprising: The inverter comprises the power board according to any one of claims 1-9.

11. The inverter of claim 10, wherein, The inverter further comprises a boost inductor, a power connector and a main control board, and the boost inductor, the power connector and the main control board are all installed inside the housing of the inverter; The boost inductor and the power connector are both distributed close to the fourth edge of the power board, at least part of the boost inductor and the power connector are distributed close to the first edge of the power board, and another part of the boost inductor and the power connector are distributed close to the second edge of the power board; the first edge and the second edge are opposite along the first direction; the fourth edge intersects with the first edge; The main control board and the power board are arranged along a third direction, and the third direction is perpendicular to the first edge and perpendicular to the fourth edge.

12. The inverter of claim 10, wherein, The inverter further comprises a plurality of magnetic rings, and the magnetic rings are used for improving electromagnetic compatibility; In the second direction, the magnetic rings are located outside the fourth edge of the power board; in the first direction, the magnetic rings are located between the first edge and the second edge of the power board.

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