A power inverter for photovoltaic energy storage

Abstract

The invention discloses a photovoltaic energy storage power inverter in the technical field of inverter equipment, comprising a main box, a substrate integrated box built in the main box, and a plurality of heat dissipation protrusions arranged on the substrate integrated box; the main box is sequentially divided into a fixed-point ventilation layer, a liquid cooling layer, an integrated box plate layer and a liquid storage layer from top to bottom, the heat dissipation protrusions are separated in the liquid cooling layer, a liquid cooling mechanism is distributed along the heat dissipation protrusions in the liquid cooling layer, a plurality of intercooling heat dissipation boxes in communication with the liquid cooling layer are arranged on the outer wall of the main box, a sealing mechanism for sealing the liquid cooling layer and connecting it to the outside is built in the intercooling heat dissipation box, a protrusion port is arranged on the top of each heat dissipation protrusion, an independent exhaust mechanism for the protrusion port is arranged in the fixed-point ventilation layer, and a plurality of pneumatic normally closed air holes are arranged on the top surface of the substrate integrated box; the invention improves the original heat dissipation area and means, greatly improves the heat dissipation efficiency, and improves the service life of the equipment and the stability of operation.

Description

Technical Field

[0001] The present invention relates to the technical field of inverter equipment, in particular to a power inverter for photovoltaic energy storage. Background Art

[0002] The components in the photovoltaic energy storage power inverter have their rated operating temperatures. If the inverter has poor heat dissipation performance, as the inverter continues to work, the heat of the components cannot be transferred to the outside world, and its temperature will become higher and higher. Excessive temperature will reduce the performance and life of the components. In order to keep the operating temperature of the components inside the inverter within the rated temperature range and ensure its efficiency and service life, thermal conductive materials are needed to transfer the heat inside the inverter.

[0003] The main heat generating components in the inverter are: switch tube, magnetic core components (inductor, transformer), etc. The inverter housing is made of aluminum alloy, which has good thermal conductivity. The integral shell structure is adopted, and the heat sink and the shell are directly and tightly connected through a large area. The heat of the components can be directly transferred to the aluminum alloy shell through the heat sink, forming a heat dissipation path of device → heat sink → shell → air. It can be seen from the above that the integral shell structure is adopted, and the heat sink and the shell are directly and tightly connected, allowing the aluminum alloy shell to participate in heat dissipation through two paths. Because it participates more in heat dissipation, the temperature of the inverter shell is relatively high. The advantage of this phenomenon is that the good thermal conductivity of the shell transfers the internal heat of the inverter through the shell faster, thereby reducing the internal temperature of the inverter and the temperature of the components, thereby ensuring a longer service life of the components and the inverter. Therefore, many inverter substrates now have more protrusions on the integrated shell. For example, if the inductor is cylindrical, a cylindrical protrusion is set on the shell, and the inductor is set inside. Then, most of the temperature generated by the inductor will be absorbed by the peripheral protrusions, and the protrusions directly dissipate heat to the outside. Part of the heat generated by the inductor will not diffuse in the integrated shell, thereby improving the heat dissipation efficiency. However, since various components of different heights and sizes are welded on the substrate, the protrusions cannot be used to completely surround the inductor or other major heat-generating devices, and due to the assembly size, the inductor cannot be completely fitted and can only be roughly mounted on the outside. The hot air will still flow from the gap between the inner walls of the protrusions toward the inside of the integrated shell and can only be partially guided. The inside of the integrated shell packaged by the substrate still needs to be mainly ventilated and heat exchanged by a cooling fan. However, since the distribution of heat-generating devices on the substrate is uneven, the unidirectional heat exchange airflow can only flow from one side to the opposite side. Although the heat of many heat-generating devices is taken away by the overall airflow, it will greatly interfere with surrounding devices, resulting in the contradictory problem that local heat cannot be effectively taken away, and the heat taken away will interfere with other substrate devices.

[0004] Based on this, the present invention designs a power inverter for photovoltaic energy storage to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to provide a power inverter for photovoltaic energy storage to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A photovoltaic energy storage power inverter comprises a main box, wherein the main box has a built-in substrate integrated box, and the substrate integrated box is provided with a plurality of heat dissipation protrusions;

[0008] The main chassis is divided into a fixed-point ventilation layer, a liquid cooling layer, an integrated box plate layer and a liquid storage layer from top to bottom. The substrate integrated box is entirely arranged in the integrated box plate layer. The heat dissipation protrusion is separated in the liquid cooling layer. The liquid cooling layer is provided with a liquid cooling mechanism distributed along the heat dissipation protrusion. The outer wall of the main chassis is provided with a plurality of intercooler heat dissipation boxes communicated with the liquid cooling layer. The intercooler heat dissipation box is provided with a sealing mechanism for sealing the liquid cooling layer from the outside. A protrusion port is provided on the top of each heat dissipation protrusion. An independent ventilation mechanism for the protrusion port is provided in the fixed-point ventilation layer. A plurality of pneumatic normally closed air holes are provided on the top surface of the substrate integrated box. The fixed-point ventilation layer and the liquid cooling layer are separated by a sealed sliding top plate. A driving mechanism for driving the top plate to slide and compress the gas in the liquid cooling layer is provided at the four corners of the top of the substrate integrated box. The top surface of the substrate integrated box is provided with a plurality of pneumatic normally closed air holes.

[0009] As a further solution of the present invention: a plurality of plate through holes are provided on the panel of the top plate corresponding to each of the heat dissipation protrusions, each plate through hole is sealed and connected to the corresponding protrusion opening through a sealing flexible cover, the top of the top plate is divided into a plurality of air duct covers according to the area, a plurality of fixed exhaust ports communicated with the air duct covers are provided on the side walls of the main chassis, the air duct covers are connected to the fixed exhaust ports through a sealing hose, and the fixed exhaust ports are equipped with independent cooling fans.

[0010] As a further solution of the present invention: each of the plate through holes is equipped with an electrically controlled valve.

[0011] As a further solution of the present invention: the driving mechanism includes linear telescopic rods arranged at the four corners of the top of the substrate integrated box, the top plate is horizontally supported by the telescopic ends of multiple linear telescopic rods, the outer ring of the substrate integrated box is fixed with an isolation frame plate for sealing, and the outer ring of the top plate is provided with a sealing ring for sliding on the inner wall of the main box.

[0012] As a further solution of the present invention: the pneumatic normally closed air hole adopts a membrane valve structure.

[0013] As a further solution of the present invention: the side wall of the substrate integrated box cooperates with the side wall of the main box to be provided with a plurality of box heat dissipation openings, and each box heat dissipation opening is installed with a heat dissipation fan.

[0014] As a further solution of the present invention: the liquid cooling mechanism includes a plurality of liquid cooling plates arranged in the liquid cooling layer, the liquid cooling plates are arranged along the heat dissipation protrusions, a liquid storage tank assembly is arranged in the liquid storage layer, the liquid storage tank assembly is installed in contact with the back plate of the main case, the liquid storage tank assembly has a built-in liquid storage bag and a water pump assembly, the liquid storage tank assembly is provided with a liquid exchange port on the side wall of the main case, the outer wall of the liquid storage tank assembly is connected to a plurality of circulating water pipes, and each of the liquid cooling plates is circulatedly connected to the liquid storage tank assembly through the circulating water pipe.

[0015] As a further solution of the present invention: the intercooler heat dissipation box includes an intercooler air outlet opened on the side wall, the inner wall of the intercooler heat dissipation box is provided with a connecting port communicating with the bottom space in the liquid cooling layer, the interior of the intercooler heat dissipation box is provided with a closing door plate assembly for opening and closing the connecting port, and an intercooler fan is provided on one side of the intercooler air outlet.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. The main chassis of the present invention sets the original overall box cavity into multiple layers, and places the conventional heat dissipation protrusions in an independent liquid cooling layer for heat dissipation, which can improve the heat dissipation efficiency. In addition, the structure of the heat dissipation protrusions is improved, and a fixed-point ventilation layer is added. For each heat dissipation protrusion, fixed-point extraction heat dissipation can be achieved. Heat is dissipated from the inside to the outside at a fixed point, and the heat dissipation effect is greatly improved. In addition, the large heat dissipation device will not excessively interfere with the peripheral devices of the substrate during the heat dissipation process. With the heat dissipation of the substrate integrated box itself, the heat dissipation effect is improved by an order of magnitude;

[0018] 2. The liquid cooling layer provided in the present invention can cooperate with the sliding top plate to compress the cold air of the entire layer, perform stamping-type multi-point rapid cooling in the integrated box plate layer, and also have the effect of recoil dust removal;

[0019] 3. The fixed-point ventilation layer provided in the present invention also forms a relatively low temperature area, and the external display or control components of the main chassis can be installed on the fixed-point ventilation layer to prevent high-temperature interference during the operation of the substrate integrated box, thereby improving the service life and operation stability of other components;

[0020] 4. The liquid cooling mechanism provided in the present invention is arranged in the liquid cooling layer and the liquid storage layer. Even if it is damaged, it will not interfere with the electrical equipment installed in the integrated box plate layer and the fixed-point ventilation layer. It has higher stability and better safety protection. The heat dissipation of the substrate integrated box itself is carried out in the integrated box plate layer by relying on its own heat dissipation port and fan. The heat dissipation protrusions provided in the substrate integrated box can also quickly cool down in the liquid cooling layer. The intercooler heat dissipation box provided therein can also perform ventilation and heat exchange operations on the liquid cooling layer.

[0021] 5. The membrane flap structure provided in the present invention will open to the surroundings when under pressure, thereby generating a flap hole in the middle for easy communication. When the air pressure decreases, the membrane flap will automatically close elastically. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 This is a schematic diagram of the structure after removing the tail plate of the main chassis;

[0024] Figure 3 This is a structural diagram after removing the main chassis shell;

[0025] Figure 4 It is a schematic diagram of the structure on the back of the top plate;

[0026] Figure 5 for Figure 3 Schematic diagram of the structure after removing the top plate;

[0027] Figure 6 It is a structural schematic diagram of the substrate integrated box;

[0028] Figure 7 for Figure 5 The structural diagram at the bottom;

[0029] Figure 8 Schematic diagram of the internal structure of the intercooler radiator.

[0030] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0031] Main chassis 1, fixed-point ventilation layer 10, liquid cooling layer 11, integrated box plate layer 12, liquid storage layer 13, fixed-point exhaust port 14;

[0032] Top plate 2, plate through hole 20, sealing flexible cover 21, air duct cover 22, sealing ring 23;

[0033] Baseboard integrated box 3, heat dissipation protrusion 30, protrusion opening 31, box heat dissipation opening 32, pneumatic normally closed air hole 33, isolation frame plate 34, linear telescopic rod 35;

[0034] Liquid storage tank assembly 4, circulating water pipe 40, liquid cooling plate 41, liquid exchange port 42;

[0035] Intercooler heat sink 5 , intercooler air outlet 50 , intercooler fan 51 , connecting port 52 , and door closing plate assembly 53 . DETAILED DESCRIPTION

[0036] See also Figure 1-8, the present invention provides a technical solution: a power inverter for photovoltaic energy storage, comprising a main box 1, the main box 1 has a built-in substrate integrated box 3, and the substrate integrated box 3 is provided with a plurality of heat dissipation protrusions 30;

[0037] The main chassis 1 is divided into a fixed-point ventilation layer 10, a liquid cooling layer 11, an integrated box plate layer 12 and a liquid storage layer 13 from top to bottom. The substrate integrated box 3 is entirely arranged in the integrated box plate layer 12. The heat dissipation protrusion 30 is separated in the liquid cooling layer 11. The liquid cooling layer 11 is provided with a liquid cooling mechanism distributed along the heat dissipation protrusion 30. The outer wall of the main chassis 1 is provided with a plurality of intercooling heat dissipation boxes 5 in communication with the liquid cooling layer 11. The intercooling heat dissipation boxes 5 are built with a sealing member for sealing the liquid cooling layer 11 from being connected to the outside. A closing mechanism, each of the heat dissipation protrusions 30 is provided with a protrusion opening 31 on the top, and an independent ventilation mechanism for the protrusion opening 31 is provided in the fixed-point ventilation layer 10, and a plurality of pneumatic normally closed air holes 33 are provided on the top surface of the substrate integrated box 3, and the fixed-point ventilation layer 10 and the liquid cooling layer 11 are separated by a sealed sliding top plate 2, and a driving mechanism for driving the top plate 2 to slide and compress the gas in the liquid cooling layer 11 is provided at the top four corners of the substrate integrated box 3, and a plurality of pneumatic normally closed air holes 33 are provided on the top surface of the substrate integrated box 3;

[0038] When working, Figure 1As shown, the mainframe 1 is installed in a horizontal installation mode, where the traditional mainframe 1 is divided into multiple layers, where the heat dissipation protrusion 30 is changed to an opening at the top, and each high-heat device can be evacuated from the inside to the outside at a fixed point through the exhaust mechanism, wherein the fixed-point exhaust layer 10 is used to exhaust air from the inside to the outside as a whole, and the liquid cooling layer 11 forms a lower temperature area in the liquid cooling layer 11 through the liquid cooling mechanism, wherein the heat on the top of the substrate integrated box 3 is cooled, and at the same time, the fixed-point exhaust layer 10 also forms a lower temperature area, and the external display or control component of the mainframe 1 can be placed on the fixed-point exhaust layer 1 0 installation, to prevent high temperature interference when the substrate integrated box 3 is working, to improve the service life and operation stability of other components, and the liquid cooling mechanism is arranged in the liquid cooling layer 11 and the liquid storage layer 13, even if it is damaged, it will not interfere with the electrical equipment installed in the integrated box plate layer 12 and the fixed-point ventilation layer 10, with higher stability and better safety protection, wherein the substrate integrated box 3 itself dissipates heat in the integrated box plate layer 12 by relying on its own heat dissipation port and fan, the heat dissipation protrusion 30 arranged in the substrate integrated box 3 can also quickly cool down in the liquid cooling layer 11, wherein the intercooler heat dissipation box 5 arranged can also cool the liquid cooling layer 11 The liquid storage layer 13 is mainly used for the recovery and cooling of the coolant during ventilation and heat exchange operations. During operation, the back of the substrate in the substrate integrated box 3 has low heat, and the liquid storage layer 13 is arranged here to facilitate cooling, and the liquid storage layer 13 is fitted with the back of the main box 1 to provide a greater heat dissipation effect. Among them, the top plate 2 arranged here can be slid by a driving mechanism. The purpose of sliding here is mainly two aspects. First, it is used for stamping heat dissipation for emergency actions. The liquid cooling layer 11 here is less stable than the integrated box plate layer 12. When the device in the integrated box plate layer 12 is abnormally high in temperature, it can be The driving mechanism drives the top plate 2 to descend rapidly as a whole, and the closing mechanism is used to close the intercooler heat dissipation box 5 before the descent, so that the liquid cooling layer 11 is sealed, the top plate 2 is pressed downward, and the air pressure in the liquid cooling layer 11 increases. The cold gas in the liquid cooling layer 11 pushes open the multiple pneumatic normally closed air holes 33 and quickly enters the substrate integrated box 3, so that the substrate integrated box 3 is cooled by multiple points of rapid stamping cold air. Secondly, it is precisely because of this stamping action that the dust removal operation can be performed in the substrate integrated box 3, and the original heat dissipation filter of the substrate integrated box 3 can also be backwashed to remove dust and improve the ventilation efficiency of heat dissipation.

[0039] Therefore, the main chassis 1 set up in the present invention sets the original overall box cavity into multiple layers, and places the conventional heat dissipation protrusions 30 in an independent liquid cooling layer 11 for heat dissipation, which can improve the heat dissipation efficiency, and improves the structure of the heat dissipation protrusions 30, and adds a fixed-point exhaust layer 10. For each heat dissipation protrusion 30, fixed-point extraction type heat dissipation can be achieved, and heat is dissipated from the inside to the outside at a fixed point, and the heat dissipation effect is greatly improved. Moreover, large heat devices will not excessively interfere with the peripheral devices of the substrate during the heat dissipation process. With the heat dissipation of the substrate integrated box 3 itself, the heat dissipation effect is improved by an order of magnitude, and the set liquid cooling layer 11 can cooperate with the sliding top plate 2 to compress the cold air of the entire layer, and perform stamping-type multi-point rapid cooling in the integrated box plate layer 12, and also has the effect of recoil dust removal. Therefore, the main chassis 1 set up in the present invention improves the original heat dissipation area and means, greatly improves the heat dissipation efficiency, and improves the service life of the equipment and the stability of operation.

[0040] The panel of the top plate 2 is provided with a plurality of plate through holes 20 corresponding to each of the heat dissipation protrusions 30, and each plate through hole 20 is sealed and connected to the corresponding protrusion opening 31 through a sealing flexible cover 21. The top of the top plate 2 is divided into a plurality of air duct covers 22 according to the area, and the side wall of the main chassis 1 is provided with a plurality of fixed-point exhaust ports 14 communicating with the air duct covers 22. The air duct covers 22 are connected to the fixed-point exhaust ports 14 through a sealing hose, and the fixed-point exhaust ports 14 are built with independent heat dissipation fans;

[0041] Wherein, each of the plate through holes 20 is equipped with an electrically controlled valve;

[0042] During operation, when the temperature in the substrate integrated box 3 does not exceed the preset range, the internal heat is dissipated by relying on the heat dissipation of the substrate integrated box 3 itself, and the heat dissipation protrusion 30 cooperates with the liquid cooling mechanism in the liquid cooling layer 11 to assist in heat dissipation. When the temperature is too high, the heat dissipation fan in the fixed-point exhaust port 14 is turned on to draw air outward, and the valve of each plate through hole 20 is also opened. The valve provided here is to close the heat dissipation protrusion 30 when the temperature is relatively low to improve the flow of heat dissipation airflow inside the substrate integrated box 3. After the valve is opened, multiple heat dissipation fans generate negative pressure on the heat dissipation protrusion 30, and the heat at the position of the heat dissipation protrusion 30 on the substrate is discharged from the fixed-point exhaust port 14 by the heat dissipation protrusion 30, the sealing flexible cover 21, and the air duct cover 22. The heat is directly extracted outward from the hot spot, and the heat will not be directly discharged without excessive diffusion to other parts of the substrate in the substrate integrated box 3, which greatly improves the heat dissipation efficiency and greatly reduces the interference of heat on other components of the substrate.

[0043] The driving mechanism includes linear telescopic rods 35 arranged at the four corners of the top of the substrate integrated box 3, the top plate 2 is horizontally supported by the telescopic ends of the plurality of linear telescopic rods 35, an outer ring of the substrate integrated box 3 is fixed with an isolation frame plate 34 for sealing, and the outer ring of the top plate 2 is provided with a sealing ring 23 for sliding on the inner wall of the main box 1;

[0044] During operation, the linear telescopic rod 35 drives the top plate 2 to rise and fall as a whole. In order to improve the stamping effect, the linear telescopic rod 35 can be pneumatically driven. The top plate 2 drops as a whole, the height of the liquid cooling layer 11 becomes smaller, the internal air pressure increases, and the cold air in the liquid cooling layer 11 opens the pneumatic normally closed air holes 33 and enters the integrated box plate layer 12 for cooling. The sealed flexible cover 21 and the hose connecting the fixed exhaust port 14 and the air duct cover 22 arranged here can ensure the sealed connection of various components when the top plate 2 moves.

[0045] Wherein, the pneumatic normally closed air hole 33 adopts a membrane valve structure;

[0046] When working, the membrane flap structure will open to the surroundings when under pressure, thereby forming a flap hole in the middle for easy communication. When the air pressure decreases, the membrane flap will automatically close elastically.

[0047] The side wall of the substrate integrated box 3 cooperates with the side wall of the main box 1 to be provided with a plurality of box heat dissipation openings 32, and each box heat dissipation opening 32 is equipped with a heat dissipation fan;

[0048] During operation, the box heat dissipation port 32 cooperates with the heat dissipation fan to perform traditional air intake and exhaust heat dissipation on the inside of the substrate integrated box 3 .

[0049] The liquid cooling mechanism includes a plurality of liquid cooling plates 41 arranged in the liquid cooling layer 11, the liquid cooling plates 41 are arranged along the heat dissipation protrusions 30, a liquid storage tank assembly 4 is arranged in the liquid storage layer 13, the liquid storage tank assembly 4 is installed in contact with the back plate of the main chassis 1, a liquid storage bag and a water pump assembly are built in the liquid storage tank assembly 4, the liquid storage tank assembly 4 is provided with a liquid replacement port 42 on the side wall of the main chassis 1, and a plurality of circulating water pipes 40 are connected to the outer wall of the liquid storage tank assembly 4, and each of the liquid cooling plates 41 is circulated and connected to the liquid storage tank assembly 4 through the circulating water pipe 40;

[0050] During operation, the coolant in the liquid storage bag is pumped out by the water pump assembly in the liquid storage tank assembly 4 and then transported to the corresponding liquid cooling plates 41 through the circulating water pipe 40. The coolant passes through the liquid cooling plate 41 on the side adjacent to the heat dissipation protrusion 30 in the liquid cooling layer 11, which can quickly cool the heat dissipation protrusion 30. The coolant finally flows back into the liquid storage bag through the circulating water pipe 40 for cooling and then is pumped out, thereby circulating.

[0051] The intercooling heat dissipation box 5 includes an intercooling air outlet 50 opened on the side wall, the inner wall of the intercooling heat dissipation box 5 is provided with a connecting port 52 communicating with the bottom space in the liquid cooling layer 11, the interior of the intercooling heat dissipation box 5 is provided with a closing door plate assembly 53 for opening and closing the connecting port 52, and an intercooling fan 51 is provided on one side of the intercooling air outlet 50;

[0052] During operation, under normal working conditions, the door closing plate assembly 53 is in an open connecting port 52 state, and the multiple intercooler heat sinks 5 on the outer wall of the main chassis 1 can cooperate with each other to perform air extraction and exhaust operations, allowing external cold air to enter the liquid cooling layer 11 from the intercooler air outlet 50 on one side and be discharged from the intercooler air outlet 50 on the opposite side, thereby completing the gas flow in the liquid cooling layer 11 and further assisting in cooling. When stamping cooling is required, the door closing plate assembly 53 closes the connecting port 52 to form the liquid cooling layer 11 into a closed cavity.

Claims

1. A power inverter for photovoltaic energy storage, comprising a main box (1), the main box (1) having a built-in substrate integrated box (3), the substrate integrated box (3) being provided with a plurality of heat dissipation protrusions (30), characterized in that: The main chassis (1) is divided into a fixed-point ventilation layer (10), a liquid cooling layer (11), an integrated box plate layer (12) and a liquid storage layer (13) from top to bottom, the substrate integrated box (3) is arranged as a whole in the integrated box plate layer (12), the heat dissipation protrusion (30) is separated in the liquid cooling layer (11), the liquid cooling layer (11) is provided with a liquid cooling mechanism distributed along the heat dissipation protrusion (30), the outer side wall of the main chassis (1) is provided with a plurality of intercooling heat dissipation boxes (5) in communication with the liquid cooling layer (11), and the intercooling heat dissipation boxes (5) are built with a device for sealing the liquid cooling layer (11) and connecting it to the outside. The invention relates to a closed sealing mechanism, each of the heat dissipation protrusions (30) is provided with a protrusion opening (31) at the top, the fixed-point ventilation layer (10) is provided with an independent ventilation mechanism for the protrusion opening (31), the top surface of the substrate integrated box (3) is provided with a plurality of pneumatic normally closed air holes (33), the fixed-point ventilation layer (10) and the liquid cooling layer (11) are separated by a sealed sliding top plate (2), the top four corners of the substrate integrated box (3) are provided with a driving mechanism for driving the top plate (2) to slide and compress the gas in the liquid cooling layer (11), and the top surface of the substrate integrated box (3) is provided with a plurality of pneumatic normally closed air holes (33).

2. A photovoltaic energy storage power inverter according to claim 1, characterized in that: A plurality of plate through holes (20) are provided on the panel of the top plate (2) corresponding to each of the heat dissipation protrusions (30); each plate through hole (20) is sealedly connected to the corresponding protrusion opening (31) via a sealing flexible cover (21); a plurality of air duct covers (22) are divided into regions on the top of the top plate (2); a plurality of fixed exhaust ports (14) in communication with the air duct covers (22) are provided on the side wall of the main chassis (1); the air duct covers (22) are connected to the fixed exhaust ports (14) via a sealing hose; and an independent heat dissipation fan is built into the fixed exhaust ports (14).

3. A photovoltaic energy storage power inverter according to claim 2, characterized in that: Each of the plate through holes (20) is equipped with an electrically controlled valve.

4. A photovoltaic energy storage power inverter according to claim 1, characterized in that: The driving mechanism comprises linear telescopic rods (35) arranged at the four corners of the top of the baseboard integrated box (3); the top plate (2) is horizontally supported by the telescopic ends of a plurality of linear telescopic rods (35); an insulating frame plate (34) for sealing is fixed to the outer ring of the baseboard integrated box (3); and a sealing ring (23) for sliding on the inner wall of the main box (1) is arranged on the outer ring of the top plate (2).

5. A photovoltaic energy storage power inverter according to claim 1, characterized in that: The pneumatic normally closed air hole (33) adopts a membrane valve structure.

6. A photovoltaic energy storage power inverter according to claim 1, characterized in that: The side wall of the substrate integrated box (3) cooperates with the side wall of the main box (1) to be provided with a plurality of box heat dissipation openings (32), and each box heat dissipation opening (32) is installed with a heat dissipation fan.

7. A photovoltaic energy storage power inverter according to claim 1, characterized in that: The liquid cooling mechanism comprises a plurality of liquid cooling plates (41) arranged in the liquid cooling layer (11), the liquid cooling plates (41) being arranged along the heat dissipation protrusion (30), a liquid storage tank assembly (4) being arranged in the liquid storage layer (13), the liquid storage tank assembly (4) being installed in contact with the back plate of the main case (1), the liquid storage tank assembly (4) having a liquid storage bag and a water pump assembly built therein, the liquid storage tank assembly (4) being provided with a liquid replacement port (42) on the side wall of the main case (1), the outer wall of the liquid storage tank assembly (4) being connected to a plurality of circulating water pipes (40), and each of the liquid cooling plates (41) being circulatedly connected to the liquid storage tank assembly (4) through the circulating water pipe (40).

8. A photovoltaic energy storage power inverter according to claim 1, characterized in that: The sealing mechanism comprises a door closing plate assembly (53), the intercooler heat dissipation box (5) comprises an intercooler air outlet (50) opened on the side wall, the inner wall of the intercooler heat dissipation box (5) is provided with a connecting port (52) communicating with the bottom space inside the liquid cooling layer (11), the interior of the intercooler heat dissipation box (5) is provided with a door closing plate assembly (53) for opening and closing the connecting port (52), and an intercooler fan (51) is provided on one side of the intercooler air outlet (50).

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