A polycrystalline silicon wafer surface magnetic polishing device

Abstract

The present invention belongs to the field of magnetic polishing devices, in particular to a magnetic polishing device for the surface of a polycrystalline silicon wafer. The following scheme is proposed, which includes a magnetic polishing machine; a box body, the box body is fixedly installed on the top of the magnetic polishing machine; a cover plate, the cover plate is at the top of the box body; an outer shell, the outer shell is fixedly installed on the top of the cover plate; a positioning mechanism and a clamping mechanism, the positioning mechanism is respectively matched with the clamping mechanism and the outer shell; an installation mechanism and a disassembly mechanism, the number of the installation mechanism and the disassembly mechanism is two groups. The present invention places the polycrystalline silicon wafer in the middle of two clamps, and then presses the telescopic rod and pushes the control rod to rotate, so that the control rod can control the two clamps to approach each other, thereby clamping the polycrystalline silicon wafer, and then starts the motor, the motor can drive the clamp to rotate, and the clamp drives the polycrystalline silicon wafer to rotate, so that the angle of the polycrystalline silicon wafer can be adjusted, and it is convenient to polish other surfaces of the polycrystalline silicon wafer.

Description

Technical Field

[0001] The invention relates to the technical field of magnetic polishing devices, and in particular to a magnetic polishing device for the surface of a polycrystalline silicon wafer. Background Art

[0002] In the processing technology of integrated circuit polysilicon wafers, polycrystalline rods are cut by multiple wires to form polycrystalline silicon wafers. The microscopic surface of the cut polycrystalline silicon wafers has defects such as edges, burrs, and tiny cracks. In the subsequent processing, such defects will cause microcracks and breakages on the surface of the polycrystalline silicon wafers due to collision and friction with other machines. Therefore, it is often necessary to grind the surface of the polycrystalline silicon wafers to smooth out the burrs, edges and other defects, which can effectively improve the yield of polycrystalline silicon wafer products.

[0003] Magnetic grinding is a process that uses magnetic force to drive magnetic grinding needles. It uses fine magnetic grinding needles to grind and polish the objects to be ground. Compared with other grinding technologies, it causes less loss to the workpiece, so it is suitable for the grinding of polycrystalline silicon wafers.

[0004] At present, the magnetic grinding device needs to grind both sides of the polycrystalline silicon wafer during the grinding process. However, due to the material problem of the polycrystalline silicon wafer itself, a support needs to be placed at the bottom of the polycrystalline silicon wafer during the grinding process. At this time, the polycrystalline silicon wafer can only be polished on one side, and the other side needs to be manually turned over and then polished. Therefore, the present invention proposes a polycrystalline silicon wafer surface magnetic polishing device to solve the above problem. Summary of the invention

[0005] Based on the technical problem that during the polishing process, a support needs to be placed at the bottom of the polycrystalline silicon wafer. At this time, the polycrystalline silicon wafer can only be polished on one side, and the other side needs to be manually turned over and polished, the present invention proposes a magnetic polishing device for the surface of a polycrystalline silicon wafer.

[0006] The present invention provides a multi-crystalline silicon wafer surface magnetic polishing device, comprising:

[0007] Magnetic polishing machine;

[0008] A box body, wherein the box body is fixedly installed on the top of the magnetic polishing machine;

[0009] A cover plate, the cover plate being located on the top of the box body;

[0010] A shell, wherein the shell is fixedly mounted on the top of the cover plate;

[0011] A positioning mechanism and a clamping mechanism, wherein the positioning mechanism cooperates with the clamping mechanism and the housing respectively;

[0012] An installation mechanism and a disassembly mechanism, wherein the installation mechanism and the disassembly mechanism are in two groups, and the installation mechanism is matched with the cover plate, the housing and the disassembly mechanism respectively;

[0013] A rotating mechanism, wherein the number of the rotating mechanisms is two, and the rotating mechanism comprises: a sliding plate, a motor, a pulley, a belt, a rotating shaft and a clamp;

[0014] The sliding plate is slidably connected to the top inner wall of the shell, the pulley is rotatably connected to the sliding plate, the rotation passes through the sliding plate, the rotating shaft is fixedly connected to the pulley at the lower position, the rotating shaft is fixedly connected to the clamp, the belt sleeve is arranged on the two pulleys, the motor is fixedly connected to the sliding plate, the motor output shaft passes through the sliding plate, and the motor output shaft is fixedly connected to the pulley at the top position.

[0015] By means of the above mechanism: by placing the polycrystalline silicon wafer in the middle of the two clamps, and then pressing the telescopic rod and pushing the control rod to rotate, the control rod can control the two clamps to approach each other, so as to clamp the polycrystalline silicon wafer, and then start the motor, the motor can drive the clamp to rotate, and the clamp then drives the polycrystalline silicon wafer to rotate, so as to realize the angle adjustment of the polycrystalline silicon wafer, and facilitate the grinding of other surfaces of the polycrystalline silicon wafer.

[0016] As a preferred solution of the present invention, the top of the cover plate is provided with symmetrically arranged rectangular through holes, and the outer sides of the two sliding plates and the two protective covers are slidably connected to the inner walls of the two rectangular through holes respectively.

[0017] As a preferred solution of the present invention, a protective pad is fixedly installed on one side of the two clamps close to each other.

[0018] As a preferred solution of the present invention, a protective cover is fixedly mounted on the sides of the two sliding plates that are away from each other.

[0019] As a preferred solution of the present invention, the clamping mechanism includes: a fixing rod, a connecting rod, an intermediate rod, a pushing rod and a control rod;

[0020] The two fixed rods are respectively fixedly connected to the two sliding plates, the fixed rod is rotatably connected to the connecting rod, the connecting rod is rotatably connected to the intermediate rod, the intermediate rod passes through the top of the shell, the intermediate rod is rotatably connected to the pushing rod, the pushing rod is rotatably connected to the control rod, the control rod is rotatably connected to the rotating frame, and the rotating frame is fixedly installed on the top of the shell.

[0021] As a preferred solution of the present invention, the positioning mechanism includes: a telescopic rod, a sliding block, a pulling rod, a positioning frame, a positioning plate, a positioning spring, and a fixing plate;

[0022] The telescopic rod is rotatably connected to the front side of the control rod, the telescopic rod is rotatably connected to the sliding block, the sliding block is slidably connected to the fixed plate, the sliding block is rotatably connected to the pulling rod, the pulling rod is rotatably connected to the positioning frame, the positioning frame is fixedly connected to the positioning spring, the positioning spring is fixedly connected to the fixed plate, the fixed plate is fixedly connected to the control rod, the positioning plate is fixedly installed on the top of the shell, and the positioning plate cooperates with the positioning frame.

[0023] As a preferred solution of the present invention, the mounting mechanism comprises: an insertion frame, a docking shell, a mounting frame and a mounting spring;

[0024] The insertion frame is fixedly connected to the cover plate, the docking shell is fixedly connected to the box body, the outer side of the insertion frame is in sliding contact with the inner wall of the docking shell, the mounting frame is slidably connected to the inner wall of the docking shell, the mounting frame cooperates with the insertion frame, the mounting frame is fixedly connected to the mounting spring, and the mounting spring is fixedly connected to the inner wall of the docking shell.

[0025] As a preferred solution of the present invention, the disassembly mechanism includes: a driving frame, a round block, a rotating rod, an auxiliary rod, a connecting frame, a matching rod, a fitting block, an unlocking frame and a mounting block;

[0026] The driving frame is fixedly connected to the mounting frame, the round block is fixedly installed on the front side of the driving frame, the mounting block is fixedly connected to the inner wall of the docking shell, the mounting block is rotatably connected to the rotating rod, the rotating rod is rotatably connected to the auxiliary rod, the auxiliary rod is rotatably connected to the connecting frame, the connecting frame is rotatably connected to the matching rod, the matching rod is rotatably connected to the fitting block, the fitting block is slidably connected to the top of the shell, and the fitting block is in sliding contact with the unlocking frame.

[0027] As a preferred solution of the present invention, a plurality of positioning grooves arranged at equal intervals are provided on the top of the positioning plate, a positioning block is fixedly installed on the right side of the positioning frame, and the outer side of the positioning block is detachably engaged with the inner wall of the positioning groove.

[0028] As a preferred solution of the present invention, mounting grooves are provided on the sides of the two insertion racks that are away from each other, and insertion blocks are fixedly installed on the sides of the two installation racks that are close to each other, and the outer sides of the insertion blocks are detachably connected to the inner walls of the mounting grooves.

[0029] The beneficial effects of the present invention are:

[0030] 1. After the control rod is pushed and rotated, the control rod can push the push rod, and the push rod pushes the middle rod to slide upward, so that the middle rod can pull the two connecting rods, and the two connecting rods can pull the two fixed rods and the two sliding plates closer to each other, and the two sliding plates then drive the two clamps closer to each other to fit with the left and right sides of the polycrystalline silicon wafer, so as to clamp the polycrystalline silicon wafer;

[0031] 2. After the positioning frame is engaged with the positioning plate, the positioning frame can connect the positioning plate with the control rod to position the control rod on the positioning plate so that the control rod cannot rotate backward. The control rod can position the intermediate rod, the pulling device and the sliding plate so that the clamp at the bottom of the sliding plate can stably fit with the polycrystalline silicon wafer and stably clamp the polycrystalline silicon wafer. After the telescopic rod is pressed and rotated, the telescopic rod can drive the sliding block to move, and the sliding block can pull the pulling rod, and the pulling rod then pulls the positioning frame and the positioning plate to disengage to unlock the control rod, so that the control rod can freely control the distance between the two clamps, so that the two clamps can clamp polycrystalline silicon wafers of various sizes.

[0032] 3. After the insertion frame is engaged with the mounting frame, the insertion frame can connect the insertion frame with the docking shell to block the insertion frame from moving on the inner side of the docking shell, and the insertion frame is installed on the inner side of the docking shell. The insertion frame is fixedly connected with the cover plate, and the docking shell is fixedly connected with the box body. The insertion frame and the docking shell can install the cover plate and the outer shell on the box body, thereby increasing the stability of the fixture on the inner side of the box body, stably clamping the polycrystalline silicon wafer, and facilitating the polishing of the polycrystalline silicon wafer.

[0033] 4. After the unlocking frame is pushed, the unlocking frame can push the fitting block, and the fitting block pushes the matching rod, and the matching rod can push the connecting frame to rise. At this time, the connecting frame can straighten the rotating rod and the auxiliary rod, so that the rotating rod can push the round block, the driving frame and the mounting frame to separate from the insertion frame, so as to unlock the insertion frame, and then the cover plate and the shell can be unlocked on the box body, which is convenient for removing the cover plate and the shell, and then removing the polysilicon wafer at the bottom of the cover plate, which is also convenient for opening the box body;

[0034] The present invention places a polycrystalline silicon wafer between two clamps, and then presses a telescopic rod and pushes a control rod to rotate, so that the control rod can control the two clamps to approach each other, thereby clamping the polycrystalline silicon wafer. Then, the motor is started, the motor can drive the clamp to rotate, and the clamp drives the polycrystalline silicon wafer to rotate, so that the angle of the polycrystalline silicon wafer can be adjusted, and it is convenient to grind other surfaces of the polycrystalline silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A three-dimensional schematic diagram of the structure of a multi-crystalline silicon wafer surface magnetic polishing device proposed by the present invention;

[0036] Figure 2 A schematic diagram of the structure of a multi-crystalline silicon wafer surface magnetic polishing device proposed by the present invention;

[0037] Figure 3 A schematic diagram of a front and cross-sectional view of the structure of a multi-crystalline silicon wafer surface magnetic polishing device proposed by the present invention;

[0038] Figure 4The present invention provides a structure of a multi-crystalline silicon wafer surface magnetic polishing device. Figure 3 Middle A is an enlarged schematic diagram;

[0039] Figure 5 The present invention provides a structure of a multi-crystalline silicon wafer surface magnetic polishing device. Figure 3 Middle B is an enlarged schematic diagram;

[0040] Figure 6 The present invention provides a structure of a multi-crystalline silicon wafer surface magnetic polishing device. Figure 3 Middle C is an enlarged schematic diagram;

[0041] Figure 7 A three-dimensional schematic diagram of a structural fixture of a multi-crystalline silicon wafer surface magnetic polishing device proposed by the present invention;

[0042] Figure 8 A three-dimensional schematic diagram of a structural positioning frame of a multi-crystalline silicon wafer surface magnetic polishing device proposed by the present invention;

[0043] Fig. 9 A three-dimensional schematic diagram of a structural mounting frame of a multi-crystalline silicon wafer surface magnetic polishing device proposed by the present invention;

[0044] Fig.10 A three-dimensional schematic diagram of the structural disassembly mechanism of a polycrystalline silicon wafer surface magnetic polishing device proposed in the present invention.

[0045] In the figure: 1. magnetic polishing machine; 2. box body; 3. cover plate; 4. shell; 5. sliding plate; 6. protective cover; 7. motor; 8. pulley; 9. belt; 10. rotating shaft; 11. clamp; 12. pad; 13. fixed rod; 14. connecting rod; 15. intermediate rod; 16. pushing rod; 17. control rod; 18. telescopic rod; 19. sliding block; 20. pulling rod; 21. positioning frame; 22. positioning block; 23. positioning disk; 24. rotating frame; 25. positioning spring; 26. fixed plate; 27. insertion frame; 28. docking shell; 29. ​​mounting frame; 30. mounting block; 31. mounting spring; 32. driving frame; 33. round block; 34. rotating rod; 35. auxiliary rod; 36. connecting frame; 37. matching rod; 38. fitting block; 39. unlocking frame; 40. insertion block. DETAILED DESCRIPTION

[0046] The present invention will be further explained below in conjunction with specific embodiments.

[0047] refer to Figure 1-10 In this embodiment, a multi-crystalline silicon wafer surface magnetic polishing device is proposed, comprising:

[0048] Magnetic polishing machine 1;

[0049] Box body 2, box body 2 is fixedly installed on the top of magnetic polishing machine 1;

[0050] A cover plate 3, the cover plate 3 is located on the top of the box body 2;

[0051] The housing 4 is fixedly mounted on the top of the cover plate 3;

[0052] A positioning mechanism and a clamping mechanism, wherein the positioning mechanism cooperates with the clamping mechanism and the housing 4 respectively;

[0053] The installation mechanism and the disassembly mechanism are two groups, and the installation mechanism is matched with the cover plate 3, the shell 4 and the disassembly mechanism respectively;

[0054] Rotating mechanism, the number of the rotating mechanism is two, and the rotating mechanism includes: a sliding plate 5, a motor 7, a pulley 8, a belt 9, a rotating shaft 10 and a clamp 11;

[0055] The sliding plate 5 is slidably connected to the top inner wall of the outer shell 4, the pulley 8 is rotatably connected to the sliding plate 5 and rotates through the sliding plate 5, the rotating shaft 10 is fixedly connected to the pulley 8 at the lower position, the rotating shaft 10 is fixedly connected to the clamp 11, the belt 9 is sleeved on the two pulleys 8, the motor 7 is fixedly connected to the sliding plate 5, the output shaft of the motor 7 penetrates the sliding plate 5, and the output shaft of the motor 7 is fixedly connected to the pulley 8 at the top position.

[0056] By means of the above mechanism: by placing the polycrystalline silicon wafer in the middle of the two clamps 11, and then pressing the telescopic rod 18 and pushing the control rod 17 to rotate, the control rod 17 can control the two clamps 11 to approach each other, so as to clamp the polycrystalline silicon wafer, and then start the motor 7, the motor 7 can drive the clamp 11 to rotate, and the clamp 11 can drive the polycrystalline silicon wafer to rotate, so as to realize the angle adjustment of the polycrystalline silicon wafer, and facilitate the grinding of other surfaces of the polycrystalline silicon wafer.

[0057] As a preferred solution of the present invention, symmetrically arranged rectangular through holes are opened on the top of the cover plate 3, and the outer sides of the two sliding plates 5 and the two protective covers 6 are respectively slidably connected to the inner walls of the two rectangular through holes, and the rectangular through holes are used for the sliding plates 5 and the clamps 11 to be inserted into the inner side of the box body 2 to clamp the polycrystalline silicon wafers on the inner side of the box body 2.

[0058] As a preferred solution of the present invention, a protective pad 12 is fixedly installed on the side of the two clamps 11 close to each other. The protective pad 12 is used to protect the polycrystalline silicon wafer when the clamps 11 clamp the polycrystalline silicon wafer to prevent the clamps 11 from damaging the polycrystalline silicon wafer.

[0059] As a preferred solution of the present invention, a protective cover 6 is fixedly installed on the side of the two sliding plates 5 away from each other, and the protective cover 6 is used to protect the belt 9 and the pulley 8 to prevent the belt 9 and the pulley 8 from being polished by the magnetic polishing machine 1.

[0060] As a preferred solution of the present invention, the clamping mechanism includes: a fixing rod 13, a connecting rod 14, an intermediate rod 15, a pushing rod 16 and a control rod 17;

[0061] The two fixed rods 13 are respectively fixedly connected to the two sliding plates 5, the fixed rod 13 is rotatably connected to the connecting rod 14, the connecting rod 14 is rotatably connected to the middle rod 15, the middle rod 15 passes through the top of the shell 4, the middle rod 15 is rotatably connected to the pushing rod 16, the pushing rod 16 is rotatably connected to the control rod 17, the control rod 17 is rotatably connected to the rotating frame 24, and the rotating frame 24 is fixedly installed on the top of the shell 4. After the control rod 17 is pushed and rotated, the control rod 17 can push the pushing rod 16, and the pushing rod 16 pushes the middle rod 15 to slide upward, so that the middle rod 15 can pull the two connecting rods 14, and the two connecting rods 14 can pull the two fixed rods 13 and the two sliding plates 5 closer to each other, and the two sliding plates 5 then drive the two clamps 11 closer to each other to fit with the left and right sides of the polycrystalline silicon wafer, so as to clamp the polycrystalline silicon wafer.

[0062] As a preferred solution of the present invention, the positioning mechanism includes: a telescopic rod 18, a sliding block 19, a pulling rod 20, a positioning frame 21, a positioning plate 23, a positioning spring 25, and a fixing plate 26;

[0063] The telescopic rod 18 is rotatably connected to the front side of the control rod 17, the telescopic rod 18 is rotatably connected to the sliding block 19, the sliding block 19 is slidably connected to the fixed plate 26, the sliding block 19 is rotatably connected to the pull rod 20, the pull rod 20 is rotatably connected to the positioning frame 21, the positioning frame 21 is fixedly connected to the positioning spring 25, the positioning spring 25 is fixedly connected to the fixed plate 26, the fixed plate 26 is fixedly connected to the control rod 17, the positioning plate 23 is fixedly installed on the top of the housing 4, the positioning plate 23 cooperates with the positioning frame 21, after the positioning frame 21 is engaged with the positioning plate 23, the positioning frame 21 can connect the positioning plate 23 with the control rod 17 to control the positioning plate 23 on the positioning plate 23. The rod 17 is positioned so that the control rod 17 cannot rotate backward. The control rod 17 can position the position of the middle rod 15, the pulling device and the sliding plate 5, so that the clamp 11 at the bottom of the sliding plate 5 can stably fit with the polycrystalline silicon wafer and stably clamp the polycrystalline silicon wafer. After the telescopic rod 18 is pressed and rotated, the telescopic rod 18 can drive the sliding block 19 to move, and the sliding block 19 can pull the pulling rod 20, and the pulling rod 20 then pulls the positioning frame 21 to disengage from the positioning plate 23 to unlock the control rod 17, so that the control rod 17 can freely control the distance between the two clamps 11, so that the two clamps 11 can clamp polycrystalline silicon wafers of various sizes.

[0064] As a preferred solution of the present invention, the mounting mechanism includes: an insertion frame 27, a docking shell 28, a mounting frame 29 and a mounting spring 31;

[0065] The insertion frame 27 is fixedly connected to the cover plate 3, and the docking shell 28 is fixedly connected to the box body 2. The outer side of the insertion frame 27 is in sliding contact with the inner wall of the docking shell 28, and the mounting frame 29 is slidably connected to the inner wall of the docking shell 28. The mounting frame 29 cooperates with the insertion frame 27, and the mounting frame 29 is fixedly connected to the mounting spring 31, and the mounting spring 31 is fixedly connected to the inner wall of the docking shell 28. After the insertion frame 27 is engaged with the mounting frame 29, the insertion frame 27 can connect the insertion frame 27 with the docking shell 28 to block the movement of the insertion frame 27 on the inner side of the docking shell 28 to install the insertion frame 27 on the inner side of the docking shell 28. The insertion frame 27 is fixedly connected to the cover plate 3, and the docking shell 28 is fixedly connected to the box body 2. The insertion frame 27 and the docking shell 28 can install the cover plate 3 and the outer shell 4 on the box body 2, increase the stability of the clamp 11 on the inner side of the box body 2, stably clamp the polycrystalline silicon wafers, and facilitate polishing of the polycrystalline silicon wafers.

[0066] As a preferred solution of the present invention, the disassembly mechanism includes: a driving frame 32, a round block 33, a rotating rod 34, an auxiliary rod 35, a connecting frame 36, a matching rod 37, a fitting block 38, an unlocking frame 39 and a mounting block 30;

[0067] The driving frame 32 is fixedly connected to the mounting frame 29, the round block 33 is fixedly installed on the front side of the driving frame 32, the mounting block 30 is fixedly connected to the inner wall of the docking shell 28, the mounting block 30 is rotatably connected to the rotating rod 34, the rotating rod 34 is rotatably connected to the auxiliary rod 35, the auxiliary rod 35 is rotatably connected to the connecting frame 36, the connecting frame 36 is rotatably connected to the matching rod 37, the matching rod 37 is rotatably connected to the fitting block 38, the fitting block 38 is slidably connected to the top of the shell 4, the fitting block 38 is in sliding contact with the unlocking frame 39, and when the unlocking frame 39 is After being pushed, the unlocking frame 39 can push the fitting block 38, and the fitting block 38 pushes the matching rod 37, and the matching rod 37 can push the connecting frame 36 to rise. At this time, the connecting frame 36 can straighten the rotating rod 34 and the auxiliary rod 35, so that the rotating rod 34 can push the round block 33, the driving frame 32 and the mounting frame 29 to disengage from the insertion frame 27 to unlock the insertion frame 27, so that the cover plate 3 and the outer shell 4 can be unlocked on the box body 2, which is convenient for removing the cover plate 3 and the outer shell 4, and then removing the polysilicon wafer at the bottom of the cover plate 3, which is also convenient for opening the box body 2.

[0068] As a preferred solution of the present invention, a plurality of positioning grooves arranged at equal intervals are provided on the top of the positioning plate 23, and a positioning block 22 is fixedly installed on the right side of the positioning frame 21. The outer side of the positioning block 22 is detachably engaged with the inner wall of the positioning groove. After the positioning block 22 is inserted into the inner side of the positioning groove, the positioning block 22 can prevent the control rod 17 from rotating, thereby realizing the positioning of the pair of control rods 17.

[0069] As a preferred solution of the present invention, installation grooves are provided on the sides of the two insertion frames 27 that are away from each other, and insertion blocks 40 are fixedly installed on the sides of the two installation frames 29 that are close to each other. The outer side of the insertion block 40 is detachably snap-connected with the inner wall of the installation groove. After the insertion block 40 is inserted into the inner side of the insertion frame 27, the insertion block 40 can prevent the insertion frame 27 from detaching from the docking shell 28, thereby realizing the installation of the insertion frame 27 and the cover plate 3.

[0070] Working principle: when it is necessary to clamp the polysilicon wafer, first open the box body 2, disassemble the cover plate 3, first push the two unlocking frames 39 on the left and right sides of the top of the cover plate 3 close to each other, after the unlocking frames 39 are pushed, the unlocking frames 39 can push the fitting block 38, the fitting block 38 then pushes the matching rod 37, the matching rod 37 can push the connecting frame 36 to rise, at this time the connecting frame 36 can straighten the rotating rod 34 and the auxiliary rod 35, so that the rotating rod 34 can push the round block 33, the driving frame 32 and the mounting frame 29 to disengage from the insertion frame 27, to unlock the insertion frame 27, and the cover plate 3 and the shell 4 can be unlocked on the box body 2, so that the cover plate 3 and the shell 4 can be removed conveniently, and then the polysilicon wafer is placed between the two clamps 11, at this time, the start is first in front of the control rod 17 The telescopic rod 18 is pushed by the side to rotate the control rod 17. After the telescopic rod 18 is pressed and rotated, the telescopic rod 18 can drive the sliding block 19 to move, and the sliding block 19 can pull the pulling rod 20, and the pulling rod 20 then pulls the positioning frame 21 to disengage from the positioning plate 23 to unlock the control rod 17, so that the control rod 17 can freely control the distance between the two clamps 11. After the control rod 17 is pushed and rotated, the control rod 17 can push the pushing rod 16, and the pushing rod 16 pushes the middle rod 15 to slide upward, so that the middle rod 15 can pull the two connecting rods 14, and the two connecting rods 14 can pull the two fixed rods 13 and the two sliding plates 5 closer to each other, and the two sliding plates 5 then drive the two clamps 11 closer to each other to fit the left and right sides of the polysilicon wafer. , the polycrystalline silicon wafer can be clamped, and then the telescopic rod 18 is released first, so that the telescopic rod 18 releases the positioning frame 21, and the positioning frame 21 can engage with the positioning disk 23. After the positioning frame 21 engages with the positioning disk 23, the positioning frame 21 can connect the positioning disk 23 with the control rod 17 to position the control rod 17 on the positioning disk 23, so that the control rod 17 cannot rotate backward. The control rod 17 can position the position of the intermediate rod 15, the pulling and sliding plates 5, so that the clamp 11 at the bottom of the sliding plate 5 can be stably fitted with the polycrystalline silicon wafer, and the polycrystalline silicon wafer is stably clamped, and then magnetic powder and water are added to the inner side of the box body 2, and finally the cover plate 3 is placed on the top of the box body 2, and the insertion frame 27 is inserted into the inner side of the mounting frame 29, and the polycrystalline silicon wafer is in On the inner side of the box body 2, the insertion frame 27 can automatically engage with the mounting frame 29. After the insertion frame 27 engages with the mounting frame 29, the insertion frame 27 can connect the insertion frame 27 with the docking shell 28 to block the movement of the insertion frame 27 on the inner side of the docking shell 28 to install the insertion frame 27 on the inner side of the docking shell 28. The insertion frame 27 is fixedly connected to the cover plate 3, and the docking shell 28 is fixedly connected to the box body 2. The insertion frame 27 and the docking shell 28 can install the cover plate 3 and the outer shell 4 on the box body 2, increase the stability of the clamp 11 on the inner side of the box body 2, stably clamp the polycrystalline silicon wafers, and facilitate polishing of the polycrystalline silicon wafers. At this time, the magnetic polishing machine 1 can be started to polish the polycrystalline silicon wafers on the inner side of the box body 2. If the angle of the polycrystalline silicon wafers needs to be adjusted,It is only necessary to start the two motors 7, the two motors 7 drive the two pulleys 8 at the upper position to rotate, the two pulleys 8 at the upper position drive the two pulleys 8 at the lower position to rotate through the belt 9, the two pulleys 8 at the lower position can drive the two clamps 11 to rotate, the two clamps 11 then drive the polycrystalline silicon wafer to rotate, and the angle of the polycrystalline silicon wafer can be adjusted, which is convenient for grinding the polycrystalline silicon wafer, which is quick and convenient.

[0071] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A multi-crystalline silicon wafer surface magnetic polishing device, characterized in that: include Magnetic polishing machine (1); A box body (2), wherein the box body (2) is fixedly mounted on the top of the magnetic polishing machine (1); A cover plate (3), the cover plate (3) being located on the top of the box body (2); A shell (4), wherein the shell (4) is fixedly mounted on the top of the cover plate (3); A positioning mechanism and a clamping mechanism, the positioning mechanism being matched with the clamping mechanism and the housing (4) respectively; An installation mechanism and a disassembly mechanism, wherein the number of the installation mechanism and the disassembly mechanism is two sets, and the installation mechanism cooperates with the cover plate (3), the housing (4) and the disassembly mechanism respectively; A rotating mechanism, wherein the number of the rotating mechanisms is two, and the rotating mechanism comprises: a sliding plate (5), a motor (7), a pulley (8), a belt (9), a rotating shaft (10), and a clamp (11); The sliding plate (5) is slidably connected to the top inner wall of the housing (4); the pulley (8) is rotatably connected to the sliding plate (5) and rotatably penetrates the sliding plate (5); the rotating shaft (10) is fixedly connected to the pulley (8) at the lower position; the rotating shaft (10) is fixedly connected to the clamp (11); the belt (9) is sleeved on the two pulleys (8); the motor (7) is fixedly connected to the sliding plate (5); the output shaft of the motor (7) penetrates the sliding plate (5); and the output shaft of the motor (7) is fixedly connected to the pulley (8) at the top position; The clamping mechanism comprises: a fixing rod (13), a connecting rod (14), an intermediate rod (15), a pushing rod (16) and a control rod (17); The two fixed rods (13) are respectively fixedly connected to the two sliding plates (5); the fixed rod (13) is rotatably connected to the connecting rod (14); the connecting rod (14) is rotatably connected to the intermediate rod (15); the intermediate rod (15) passes through the top of the housing (4); the intermediate rod (15) is rotatably connected to the push rod (16); the push rod (16) is rotatably connected to the control rod (17); the control rod (17) is rotatably connected to the rotating frame (24); and the rotating frame (24) is fixedly mounted on the top of the housing (4); The positioning mechanism comprises: a telescopic rod (18), a sliding block (19), a pulling rod (20), a positioning frame (21), a positioning plate (23), a positioning spring (25), and a fixing plate (26); The telescopic rod (18) is rotatably connected to the front side of the control rod (17), the telescopic rod (18) is rotatably connected to the sliding block (19), the sliding block (19) is slidably connected to the fixed plate (26), the sliding block (19) is rotatably connected to the pulling rod (20), the pulling rod (20) is rotatably connected to the positioning frame (21), the positioning frame (21) is fixedly connected to the positioning spring (25), the positioning spring (25) is fixedly connected to the fixed plate (26), the fixed plate (26) is fixedly connected to the control rod (17), the positioning plate (23) is fixedly installed on the top of the housing (4), and the positioning plate (23) cooperates with the positioning frame (21); The mounting mechanism comprises: an insertion frame (27), a docking shell (28), a mounting frame (29) and a mounting spring (31); The insertion frame (27) is fixedly connected to the cover plate (3), the docking shell (28) is fixedly connected to the box body (2), the outer side of the insertion frame (27) is in sliding contact with the inner wall of the docking shell (28), the mounting frame (29) is slidably connected to the inner wall of the docking shell (28), the mounting frame (29) is matched with the insertion frame (27), the mounting frame (29) is fixedly connected to the mounting spring (31), and the mounting spring (31) is fixedly connected to the inner wall of the docking shell (28); The disassembly mechanism comprises: a driving frame (32), a round block (33), a rotating rod (34), an auxiliary rod (35), a connecting frame (36), a matching rod (37), a fitting block (38), an unlocking frame (39) and a mounting block (30); The driving frame (32) is fixedly connected to the mounting frame (29), the round block (33) is fixedly mounted on the front side of the driving frame (32), the mounting block (30) is fixedly connected to the inner wall of the docking shell (28), the mounting block (30) is rotatably connected to the rotating rod (34), the rotating rod (34) is rotatably connected to the auxiliary rod (35), the auxiliary rod (35) is rotatably connected to the connecting frame (36), the connecting frame (36) is rotatably connected to the matching rod (37), the matching rod (37) is rotatably connected to the fitting block (38), the fitting block (38) is slidably connected to the top of the shell (4), and the fitting block (38) is in slidable contact with the unlocking frame (39).

2. A multi-crystalline silicon wafer surface magnetic polishing device according to claim 1, characterized in that: The top of the cover plate (3) is provided with symmetrically arranged rectangular through holes, and the outer sides of the two sliding plates (5) and the two protective covers (6) are respectively slidably connected to the inner walls of the two rectangular through holes.

3. The device for magnetic polishing of a polycrystalline silicon wafer surface according to claim 1, characterized in that: A protective pad (12) is fixedly mounted on one side of the two clamps (11) that is close to each other.

4. The device for magnetic polishing of a polycrystalline silicon wafer surface according to claim 1, characterized in that: A protective cover (6) is fixedly mounted on the sides of the two sliding plates (5) that are away from each other.

5. The device for magnetic polishing of a polycrystalline silicon wafer surface according to claim 1, characterized in that: The top of the positioning plate (23) is provided with a plurality of positioning grooves arranged at equal intervals, and a positioning block (22) is fixedly mounted on the right side of the positioning frame (21), and the outer side of the positioning block (22) is detachably engaged with the inner wall of the positioning groove.

6. The device for magnetic polishing of a polycrystalline silicon wafer surface according to claim 1, characterized in that: The two insertion frames (27) have mounting grooves on their sides away from each other, and the two mounting frames (29) have insertion blocks (40) fixedly mounted on their sides close to each other. The outer sides of the insertion blocks (40) are detachably engaged with the inner walls of the mounting grooves.

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