Wafer baking apparatus

Abstract

The application relates to the technical field of semiconductors, and particularly discloses a wafer baking device. The wafer baking device comprises a shell, a baking tray arranged in the shell and used for carrying and baking a wafer, and an exhaust structure connected to the shell. The exhaust structure comprises an exhaust cavity arranged in the shell and above the baking tray, and a connecting piece used for connecting the exhaust cavity and the outside of the shell. The exhaust cavity is provided with an exhaust port which is outwardly opened along a horizontal direction. In the wafer baking device, the exhaust port is outwardly opened along the horizontal direction, and the solvent volatilized from the wafer can be effectively exhausted to the outside of the shell, and will not drip downward from the exhaust cavity to contaminate the wafer.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, and particularly relates to a wafer baking device. BACKGROUND

[0002] In the preparation process of semiconductor, photoresist and photoresist are coated on the wafer, and then the wafer is placed in a baking device for baking. In the baking process, the gas in the baking device needs to be pumped out. In the existing wafer baking device, a plurality of small holes penetrating up and down are usually formed on the air exhaust disc to pump air. When the baking device is used, the small holes are easily blocked, affecting the air exhaust effect, causing the solvent volatilized on the wafer to condense in the baking device and cause residue, so that the baking device needs to be cleaned every 1 to 2 weeks, and the solvent volatilized on the wafer condenses on the air exhaust disc and then drops on the wafer, causing pollution to the wafer. SUMMARY

[0003] The purpose of the present application is to provide a wafer baking device which can avoid the condensation of solvent on the wafer.

[0004] To achieve the above purpose, the present application provides a wafer baking device, which comprises a shell, a baking tray arranged in the shell for carrying and baking wafers, and an exhaust structure connected to the shell. The exhaust structure comprises an exhaust cavity arranged in the shell above the baking tray and a communication member for communicating the exhaust cavity and the outside of the shell. The exhaust cavity has an exhaust port arranged outwardly in the horizontal direction.

[0005] As a further improvement of the present application, the exhaust port surrounds the exhaust cavity, and the communication member comprises a first communication part located in the middle of the exhaust cavity and a second communication part extending from the first communication part to the outside of the shell. A first air duct is formed on the first communication part. The first air duct comprises a cavity located in the middle of the first communication part and a plurality of channels located radially around the cavity. The plurality of channels communicate the cavity and the part of the exhaust cavity located outside the communication member. A second air duct is formed on the second communication part, which communicates the cavity and the outside of the shell.

[0006] As a further improvement of the present application, the wafer baking device further comprises a heating element arranged in the exhaust cavity.

[0007] As a further improvement of the present application, the exhaust structure comprises a first disc and a second disc located above the first disc. The exhaust cavity is formed by the first disc and the second disc in the vertical direction. The heating element comprises a heating disc arranged above the first disc and a cover plate arranged above the heating disc.

[0008] As a further improvement of the present application, the shell has an upwardly open opening, the second disc body is connected to the shell and closes the opening, and the wafer baking apparatus further comprises a plurality of connecting members connecting the first disc body and the second disc body.

[0009] As a further improvement of the present application, the first disc body comprises a disc body and a rim extending upwardly from the periphery of the disc body.

[0010] As a further improvement of the present application, the baking disc comprises a baking disc body and an adjusting member connected to the baking disc body for contacting the wafer, and the adjusting member is adjustably arranged along the up-down direction relative to the baking disc body.

[0011] As a further improvement of the present application, the baking disc body is provided with adjusting holes penetrating therethrough in the up-down direction, the adjusting holes comprise a threaded hole section extending upwardly from the lower end surface of the baking disc body and a through hole section extending from the threaded hole section to the upper end surface of the baking disc body, the adjusting member comprises a threaded member screwed to the threaded hole section and a movable member located above the threaded member, the movable member comprises a base section located in the threaded hole section and a contact rod extending upwardly from the base section for contacting the wafer through the through hole section, and the adjusting holes and the adjusting members are arranged in one-to-one correspondence.

[0012] As a further improvement of the present application, the wafer baking apparatus further comprises a heat shield arranged at the periphery of the baking disc.

[0013] As a further improvement of the present application, the wafer baking apparatus further comprises an optical fiber sensor for detecting whether the wafer is loaded on the baking disc, the optical fiber sensor is located at the lower side of the baking disc and comprises an emitting section for emitting detection light rays arranged at an acute angle with the up-down direction toward the wafer and a receiving section for receiving the detection light rays reflected by the wafer, and the baking disc is provided with a detection hole for the detection light rays to pass through, the detection hole is located above the optical fiber sensor and penetrates to the upper end surface of the baking disc.

[0014] Advantages:

[0015] In the wafer baking apparatus provided by the present application, the air outlet opens outwardly along the horizontal direction, and the solvent volatilized from the wafer can be effectively discharged to the outside of the shell, and will not drip downwardly from the air outlet cavity to contaminate the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 FIG. 1 is a structural schematic view of a wafer baking apparatus according to an embodiment of the present application;

[0017] Figure 2 FIG. 2 is a top view of the wafer baking apparatus in FIG. 1; and Figure 1 FIG. 3 is a sectional view taken along line A-A in FIG. 2.

[0018] Figure 3 Fig. 1 is a schematic view of a wafer baking apparatus according to the present application; Figure 2 Fig. 2 is a sectional view of the wafer baking apparatus shown in Fig. 1 taken along the line A-A;

[0019] Figure 4 Fig. 3 is an exploded schematic view of the wafer baking apparatus shown in Fig. 1; Figure 1 Fig. 4 is a sectional view of a portion of the wafer baking apparatus shown in Fig. 1;

[0020] Figure 5 Fig. 5 is another exploded schematic view of the wafer baking apparatus shown in Fig. 1; Figure 1 Fig. 6 is a sectional view of a portion of the wafer baking apparatus shown in Fig. 1;

[0021] Figure 6 Fig. 7 is a schematic view of a portion of the wafer baking apparatus shown in Fig. 1; Figure 1 Fig. 8 is a sectional view of a portion of the wafer baking apparatus shown in Fig. 1;

[0022] Figure 7 Fig. 9 is a schematic view of a portion of the wafer baking apparatus shown in Fig. 1; Figure 5 Fig. 10 is a sectional view of a portion of the wafer baking apparatus shown in Fig. 1;

[0023] Figure 8 Fig. 11 is a schematic view of a portion of the wafer baking apparatus shown in Fig. 1; Figure 1 Fig. 12 is a sectional view of a portion of the wafer baking apparatus shown in Fig. 1;

[0024] Figure 9 Fig. 13 is a sectional view of another portion of the wafer baking apparatus shown in Fig. 1. Figure 1 Fig. 14 is a schematic view of a wafer baking apparatus according to another embodiment of the present application;

[0025] Fig. 15 is a sectional view of the wafer baking apparatus shown in Fig. 14 taken along the line A-A;

[0026] 10, wafer baking apparatus;

[0027] 20, wafer;

[0028] 1, housing; 11, opening; 12, window;

[0029] 2, baking tray; 21, baking tray body; 211, adjusting hole; 2111, screw hole section; 2112, through hole section; 22, adjusting member; 221, screw member; 222, movable member; 2221, base portion; 2222, contact rod; 223, spacer; 23, detecting hole;

[0030] 3, exhaust structure; 31, exhaust cavity; 311, exhaust port; 32, communicating member; 321, first communicating portion; 322, second communicating portion; 323, first air duct; 3231, cavity; 3232, passage; 324, second air duct; 33, first disc body; 331, disc body; 332, stopper; 34, second disc body;

[0031] 4, heating element; 41, heating disc; 42, cover plate;

[0032] 5, connecting member;

[0033] 6, heat shield; 61, base plate; 62, first rim; 63, second rim; 64, interlayer;

[0034] 7, vent pipe;

[0035] 8, optical fiber sensor; 81, emitting part; 82, receiving part. DETAILED DESCRIPTION

[0036] The application will be described in detail below with reference to the embodiments shown in the drawings. However, the embodiments do not limit the application, and the changes in mechanism, method, or function made by those skilled in the art based on the embodiments are included in the protection scope of the application.

[0037] The terms for indicating spatial relative positions such as "upper", "lower", "left", "right", "front", "back", and the like used herein are for the purpose of facilitating the description to describe the relationship of one feature relative to another feature as shown in the drawings. It can be understood that the terms for indicating spatial relative positions can be intended to include different orientations other than the orientations shown in the drawings, and should not be construed as limiting the claims. In addition, the description word "horizontal" used herein is not completely equivalent to along the direction perpendicular to the direction of gravity, and a certain angle of inclination is allowed.

[0038] As shown in Figures 1-5 An embodiment of the application provides a wafer baking device 10 for baking a wafer 20. The wafer baking device 10 comprises a housing 1, a baking tray 2 arranged in the housing 1, and an exhaust structure 3 connected to the housing 1. The baking tray 2 is used to carry the wafer 20 and generate heat to bake the wafer 20, and the exhaust structure 3 is used to exhaust air in the housing 1 to the outside of the housing 1 when the baking tray 2 bakes the wafer 20, so as to avoid that the solvent volatilized from the wafer 20 is condensed and remains in the housing 1 when the baking tray 2 bakes the wafer 20.

[0039] The exhaust structure 3 comprises an exhaust cavity 31 arranged in the housing 1 and above the baking tray 2, and a communication member 32 for communicating the exhaust cavity 31 and the outside of the housing 1. The exhaust cavity 31 has an exhaust port 311 arranged and opened outwardly along the horizontal direction. It should be noted that the upward and downward directions herein are the upward and downward directions when the wafer baking device 10 is in the Figure 3 The upward and downward directions herein are the upward and downward directions when the wafer baking device 10 is in the

[0040] The communication member 32 is used to communicate with the air exhaust device. When the wafer baking device 10 is in use, the air exhaust device is working, and the negative pressure is generated in the exhaust cavity 31. The air in the housing 1 is drawn into the exhaust cavity 31 through the exhaust port 311, and then is exhausted to the outside of the housing 1 through the communication member 32. Since the exhaust port 311 is opened outward along the horizontal direction, the condensed solvent in the exhaust cavity 31 will not drop downward on the wafer 20. The communication member 32 can be a ventilation pipe 7. The housing 1 is provided with a window 12, and the wafer 20 can be placed on the baking tray 2 through the window 12.

[0041] The exhaust port 311 is arranged around the exhaust cavity 31, and the air in the housing 1 can enter the exhaust cavity 31 from the periphery of the exhaust cavity 31. The exhaust structure 3 has a good exhaust effect.

[0042] The communication member 32 includes a first communication part 321 located in the middle of the exhaust cavity 31, and a second communication part 322 extending from the first communication part 321 to the outside of the housing 1. The first communication part 321 is formed with a first air duct 323, and the second communication part 322 is formed with a second air duct 324. The first air duct 323 includes a cavity 3231 located in the middle of the first communication part 321, and a plurality of channels 3232 located radially around the cavity 3231. The plurality of channels 3232 communicate the cavity 3231 and the part of the exhaust cavity 31 outside the communication member 32. The second air duct 324 communicates the cavity 3231 and the outside of the housing 1.

[0043] The second air duct 324 is used to communicate with the air exhaust device. When the air exhaust device is working, the air in the housing 1 enters the exhaust cavity 31 through the exhaust port 311. The air entering the exhaust cavity 31 is concentrated into the cavity 3231 through the plurality of channels 3232, and then is exhausted to the outside of the housing 1 through the second air duct 324.

[0044] In this embodiment, the wafer baking device 10 further includes a heating element 4 arranged in the exhaust cavity 31. When the heating element 4 is working, the exhaust cavity 31 can be kept at a suitable temperature (for example, 60°), so as to prevent the solvent volatilized from the wafer 20 from being condensed in the exhaust cavity 31.

[0045] The exhaust structure 3 includes a first disc body 33 and a second disc body 34 located above the first disc body 33. The exhaust cavity 31 is formed by the first disc body 33 and the second disc body 34 in the up-down direction. The first disc body 33 is not provided with ventilation holes, and its surface is continuous. The heating element 4 includes a heating disc 41 arranged above the first disc body 33, and a cover plate 42 arranged above the heating disc 41. The cover plate 42 can prevent the solvent volatilized from the wafer 20 from directly contacting the heating disc 41, so as to prevent the heating disc 41 from being contaminated.

[0046] It is conceivable that, in other embodiments, the heating element 4 can also be a heating wire in contact with the first disc body 33.

[0047] In the present embodiment, the shell 1 has an opening 11 open upwardly, the second disc body 34 is connected to the shell 1 and closes the opening 11, i.e. the second disc body 34 serves as a side wall of the shell 1, and the wafer baking device 10 further comprises a plurality of connecting members 5 connecting the first disc body 33 and the second disc body 34, the plurality of connecting members 5 are arranged along the circumferential direction of the second disc body 34 to reliably connect the first disc body 33 and the second disc body 34 together. The connecting member 5 can be a fastener such as a screw.

[0048] In other embodiments, the first disc body 33 and the second disc body 34 can also be connected to the shell 1 respectively.

[0049] In the present embodiment, the first disc body 33 comprises a disc body 331 and a baffle 332 extending upwardly from the periphery of the disc body 331, the baffle 332 can prevent the condensed solvent in the exhaust cavity 31 from dripping downwardly at the edge of the disc body 331.

[0050] Continuing to refer to Figures 6-9 As shown, the baking tray 2 comprises a baking tray body 21 and an adjusting member 22 connected to the baking tray body 21 for contacting the wafer 20, the adjusting member 22 is adjustably arranged relative to the baking tray body 21 along the up-down direction. When the baking tray 2 carries the wafer 20, the wafer 20 specifically contacts the adjusting member 22, adjusting the position of the adjusting member 22 relative to the baking tray body 21 along the up-down direction can adjust the gap between the wafer 20 and the disc body 331. Adjusting the gap between the wafer 20 and the disc body 331 can ensure that the wafer 20 can be kept at a suitable temperature while the baking tray 2 does not contact the disc body in a large area, so that the temperature uniformity on the wafer 20 can be ensured and the baking tray 2 can prevent the wafer 20 from being contaminated.

[0051] Specifically, the baking tray body 21 is provided with adjusting holes 211 penetrating therethrough along the up-down direction, the adjusting holes 211 comprise screw hole sections 2111 extending upwardly from the lower end face of the baking tray body 21 and penetrating hole sections 2112 extending from the screw hole sections 2111 to the upper end face of the baking tray body 21, the adjusting member 22 comprises a threaded member 221 screwed to the screw hole sections 2111 and a movable member 222 located above the threaded member 221, the movable member 222 comprises a base portion 2221 located in the screw hole section 2111 and a contact rod 2222 extending upwardly from the base portion 2221 for penetrating through the penetrating hole section 2112 to contact the wafer 20. The adjusting holes 211 and the adjusting members 22 are provided in plurality and correspond to each other. In the present embodiment, the adjusting holes 211 and the adjusting members 22 are provided in three.

[0052] When the wafer 20 is placed on the baking tray 2, the contact rod 2222 specifically contacts the wafer 20. When it is required to increase the gap between the baking tray body 21 and the wafer 20, the threaded part 221 is rotated to move upward, and the threaded part 221 moves upward to drive the movable part 222 to move upward. In this way, the size of the contact rod 2222 beyond the upper end surface of the baking tray body 21 is increased, and the gap between the wafer 20 and the baking tray body 21 is increased. It is conceivable that when it is required to decrease the gap between the baking tray body 21 and the wafer 20, the threaded part 221 is rotated to move downward.

[0053] In the embodiment, the diameter of the base part 2221 is not greater than the diameter of the threaded hole section 2111 but greater than the diameter of the through hole section 2112, and the diameter of the contact rod 2222 is not greater than the diameter of the through hole section 2112. In this way, the movable part 222 cannot move upward out of the baking tray body 21. The gaskets 223 can be arranged between the base part 2221 and the threaded part 221 and between the base part 2221 and the upper end wall of the threaded hole section 2111. The upper end of the contact rod 2222 can be spherical, and the contact rod 2222 is in point contact with the wafer 20 to minimize the contact area between the wafer 20 and the contact rod 2222. The threaded part 221 can be provided with a slot in a hexagonal shape, a cross shape or the like to facilitate the rotation of the threaded part 221 by a wrench, a screwdriver or the like.

[0054] The wafer baking apparatus 10 further comprises a heat shield 6 arranged at the periphery of the baking tray 2. The heat shield 6 can slow down the heat loss of the baking tray 2 to reduce the energy required by the baking tray 2.

[0055] Specifically, the heat shield 6 comprises a bottom disc 61 arranged below the baking tray 2, a first surrounding ring 62 extending upward from the periphery of the bottom disc 61, and a second surrounding ring 63 arranged at the periphery of the first surrounding ring 62. A gap 64 is formed between the second surrounding ring 63 and the first surrounding ring 62. The bottom disc 61, the first surrounding ring 62, the second surrounding ring 63 and the gap 64 can all avoid the heat loss of the baking tray 2.

[0056] The wafer baking apparatus 10 further comprises an optical fiber sensor 8 arranged below the baking tray 2 to detect whether the wafer 20 is loaded on the baking tray 2. The optical fiber sensor 8 comprises an emitting part 81 arranged to emit a detection light beam at an acute angle with respect to the vertical direction and a receiving part 82 arranged to receive the detection light beam reflected by the wafer 20. A detection hole 23 is arranged on the baking tray 2 to allow the detection light beam to pass through. The detection hole 23 is arranged above the optical fiber sensor 8 and penetrates through the upper end surface of the baking tray 2.

[0057] When the wafer 20 is carried on the baking tray 2, the emitting part 81 emits the detection light to the wafer 20, and the wafer 20 reflects the detection light to the receiving part 82. If the receiving part 82 can receive the detection light emitted by the emitting part 81 after the emitting part 81 emits the detection light, it can be determined that the wafer 20 is carried on the baking tray 2. Since the back surface of the wafer 20 (i.e. the surface facing the baking tray 2) is coated, compared with emitting the detection light in the up-down direction, emitting the detection light in the direction forming an acute angle with the up-down direction in the embodiment can significantly improve the false detection problem of the optical fiber sensor 8.

[0058] In summary, the wafer 20 baking device provided by the present application has the following advantages:

[0059] 1. The air outlet 311 is opened outward in the horizontal direction, and the solvent volatilized on the wafer 20 can be effectively discharged to the outside of the shell 1, and will not drip downward from the air outlet cavity 31 to contaminate the wafer 20.

[0060] 2. The air outlet cavity 31 is provided with a heating element 4, and the solvent volatilized on the wafer 20 cannot be condensed in the air outlet cavity 31.

[0061] 3. The detection light emitted by the optical fiber sensor 8 forms an acute angle with the up-down direction, which can significantly improve the false detection problem.

[0062] It can be seen that the wafer 20 baking device provided by the present application can continuously bake the wafer 20, effectively improving the production efficiency of the wafer 20.

[0063] It should be understood that although the present application is described in the form of embodiments, each embodiment does not contain only one independent technical solution, and the description manner of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0064] The above embodiments are only used to illustrate the technical solutions of the present application and not to limit it. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced equivalently without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A wafer baking apparatus, comprising a housing, a baking tray disposed within the housing for supporting and baking wafers, and an exhaust structure connected to the housing, characterized in that, The exhaust structure includes an exhaust cavity located inside the housing and above the baking tray, and a connecting member for connecting the exhaust cavity and the outside of the housing. The exhaust cavity has an exhaust port that opens outward in a horizontal direction. The exhaust vent is arranged around the exhaust cavity. The connecting member includes a first connecting portion located in the middle of the exhaust cavity and a second connecting portion extending from the first connecting portion to the outside of the housing. A first air duct is formed on the first connecting portion. The first air duct includes a cavity located in the middle of the first connecting portion and a plurality of channels radially located around the cavity. The plurality of channels connect the cavity and a portion of the exhaust cavity located outside the connecting member. A second air duct is formed on the second connecting portion, connecting the cavity and the outside of the housing. The exhaust structure includes a first disc and a second disc located above the first disc. The exhaust cavity is formed by the first disc and the second disc spaced apart in the vertical direction. The first disc includes a disc body and a baffle extending upward from the periphery of the disc body.

2. The wafer baking equipment according to claim 1, characterized in that, The wafer baking equipment also includes a heating element disposed in the exhaust cavity.

3. The wafer baking apparatus according to claim 2, wherein the heating element comprises a heating plate disposed above the first plate body and a cover plate disposed above the heating plate.

4. The wafer baking equipment according to claim 3, characterized in that, The housing has an upward-opening opening, the second disk is connected to the housing and closes the opening, and the wafer baking equipment also includes a plurality of connectors connecting the first disk and the second disk.

5. The wafer baking equipment according to claim 1, characterized in that, The baking tray includes a baking tray body and an adjustment member connected to the baking tray body for contacting the wafer. The adjustment member is adjustable relative to the baking tray body in the vertical direction.

6. The wafer baking equipment according to claim 5, characterized in that, The baking pan body has an adjustment hole that runs vertically through it. The adjustment hole includes a screw hole section extending upward from the lower end face of the baking pan body and a through hole section extending from the screw hole section to the upper end face of the baking pan body. The adjustment component includes a threaded component threaded to the screw hole section and a movable component located above the threaded component. The movable component includes a base portion located within the screw hole section and a contact rod extending upward from the base portion to pass through the through hole section and contact the wafer. Multiple adjustment holes and multiple adjustment components are provided, and multiple adjustment holes and multiple adjustment components are provided in a one-to-one correspondence.

7. The wafer baking equipment according to claim 1, characterized in that, The wafer baking equipment also includes a heat insulation cover disposed around the baking tray.

8. The wafer baking equipment according to claim 1, characterized in that, The wafer baking equipment further includes an optical fiber sensor for detecting whether a wafer is mounted on the baking tray. The optical fiber sensor is located on the lower side of the baking tray and includes an emitting part for emitting detection light at an acute angle to the vertical direction toward the wafer and a receiving part for receiving the detection light reflected by the wafer. The baking tray has a detection hole for the detection light to pass through. The detection hole is located above the optical fiber sensor and extends to the upper surface of the baking tray.

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