A wafer carrier with intelligent clamping and adjustment mechanism

Abstract

The present invention discloses a wafer carrier with an intelligent clamping and adjusting mechanism, belonging to the technical field of wafer carriers. The present invention comprises a protective plate frame, a slide rail is arranged on the inner wall of the bottom of the protective plate frame, and a movable frame is arranged on the slide rail, a cover is hinged on the outer side of the bottom of the protective plate frame, a limit frame is arranged inside the cover, an adjusting rubber strip is arranged on the inner wall of the limit frame, and an arc-shaped expansion air bag and a cylindrical expansion air bag are arranged inside the adjusting rubber strip; the present invention can realize the operation process of system and mechanical linkage coordination, which is beneficial to adaptively pneumatically adjustably clamping the wafer through the limit frame and the carrier, effectively reducing the damage and interference of the external handling process to the wafer in the carrier, and can use the cover and the movable frame to form multiple groups of independent structure loading chambers inside the protective plate frame, reduce the chain reaction of the damage of a single group of wafers to the surrounding wafers, and improve the safety and stability of the overall wafer carrier to the wafer transportation process.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer carriers, and in particular to a wafer carrier with an intelligent clamping and adjusting mechanism. Background Art

[0002] In recent years, with the rapid development of the semiconductor industry, the wafer production capacity has been continuously expanded, which has also led to a continuous growth in the market demand for wafer carriers. Wafer carriers are tools used to load wafers during wafer processing. They need to have good mechanical properties, high / low temperature resistance, and good dimensional stability. There are many types of wafer carriers. Common products include wafer boat handles, wafer boat boxes, single wafer boxes, etc. According to different usage links, wafer boxes can be subdivided into wafer transport boxes, wafer storage boxes, wafer transfer boxes, multi-wafer horizontal placement wafer boxes and other types;

[0003] In combination with the above, it should be noted that: during the use of traditional wafer carriers, there is a lack of separate isolation protection between wafers. A defective wafer or the interference of the inertial force of external transportation and movement may cause partial damage to the wafer, causing irreversible damage to the adjacent wafers at the same time. In addition, there is a lack of external interference to the movement state of the wafer carrier and data monitoring of the internal wafer clamping state, which can easily cause the wafers to rub, bend or contact each other when disturbed by external forces, causing damage to the wafer surface.

[0004] In view of the above technical defects, a solution is now proposed. Summary of the invention

[0005] The purpose of the present invention is to provide a wafer carrier with an intelligent clamping and adjustment mechanism, which collects data of the wafer carrier during use, and comprehensively monitors and analyzes the use process of the wafer carrier before and during transportation, compares and analyzes the collected data with the preset stored data, obtains relevant rating signals, and controls relevant components to perform compensatory operations accordingly, which can not only realize the operation process of system and mechanical linkage coordination, but also facilitate adaptive pneumatic adjustment clamping of wafers through limit frames and carriers, effectively reduce the damage and interference of external handling processes to wafers in the carrier, and use covers and movable frames to form multiple groups of separate structure loading chambers inside the protective plate frame, reduce the chain reaction of damage to surrounding wafers caused by the transportation of a single group of wafers, and improve the safety and stability of the overall wafer carrier in the wafer transportation process, so as to solve the problems raised.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solutions: a wafer carrier with an intelligent clamping and adjusting mechanism, comprising a protective plate frame, a slide rail is arranged on the inner wall of the bottom of the protective plate frame, and a movable frame is arranged on the slide rail, a cover is hingedly connected to the outer side of the bottom of the protective plate frame, a limit frame is arranged inside the cover, an adjustment rubber strip is arranged on the inner wall of the limit frame, an arc-shaped expansion airbag and a cylindrical expansion airbag are arranged inside the adjustment rubber strip, and a control panel is arranged on the outer wall of the top of the protective plate frame;

[0007] Multiple groups of carrier plates are arranged inside the movable frame, and lower micro air pumps and abutting air bags are arranged inside the carrier plates. Side frames connected to the protective plate frame are arranged at both ends of the movable frame, and the side frames include sub-frames arranged side by side.

[0008] Furthermore, a limiting plate connected to the control panel is arranged on the top of the protection plate frame, a clamping strip is arranged on the side section of the limiting plate, and a corner plate is arranged at the corner of the inner wall of the bottom of the protection plate frame.

[0009] Furthermore, a rotating shaft connected to the protective plate frame is provided at the bottom of one side of the cover, an observation window is embedded in the top of the cover, a winding motor is embedded on the inner wall of the top of the limit frame, and an upper micro air pump is arranged side by side on the side of the winding motor, guide rollers connected to the adjusting rubber strip are provided at the top and bottom of the inner wall of the limit frame, and a tension wire connected to the winding motor is provided through the inside of the adjusting rubber strip.

[0010] Furthermore, a buckle is provided at the center of the top of the outer wall of the adjusting rubber strip, and an elastic line connected to the inside of the limit frame is provided at the top of the buckle, the arc-shaped expansion airbag is embedded in the center of the inner wall of the adjusting rubber strip, and the cylindrical expansion airbags are installed side by side on both sides of the arc-shaped expansion airbag, a limiting rubber pad is provided between the cylindrical expansion airbag and the arc-shaped expansion airbag, and a molding tube and an elastic pull line are provided at the center of the inner wall of the cylindrical expansion airbag.

[0011] Furthermore, a plurality of groups of grooves and sliders are provided at the bottom of the movable frame, the abutting airbags are arranged in a semi-arc structure on the inner wall of the carrier plate, and the top of the abutting airbags is connected to the lower micro air pump pipeline, a pressure relief valve is provided at the bottom of the lower micro air pump, side airbag walls connected to the lower micro air pump pipeline are provided on the inner walls on both sides of the carrier plate, and a notch is provided in the center of the arc section at the top of the carrier plate.

[0012] Furthermore, the end face of the side frame is provided with an inner lining plate abutting against the movable frame, and a magnetic arc strip connected to the cover is provided on the arc-shaped section at the top of the inner lining plate, a central groove is provided through the middle of the sub-frame, and a sliding groove penetrating the central groove is provided in the middle of one side of the sub-frame, and a sliding plate is slidably provided inside the sliding groove, and limiting strips are provided on the top and bottom of the side frame and the sub-frame.

[0013] Furthermore, the control panel is internally provided with a processor, a data acquisition module, an operation analysis module and a component control module;

[0014] The data acquisition module is used to collect the shaking amplitude fluctuation value HDz on the plate protection plate frame and the drop pressure fluctuation value ZYz on the carrier during the use of the wafer carrier, and send the shaking amplitude fluctuation value HDz and the drop pressure fluctuation value ZYz to the operation analysis module via the processor;

[0015] After receiving the shaking amplitude fluctuation value HDz and the drop pressure fluctuation value ZYz, the operation analysis module immediately analyzes the transportation risk of the wafer carrier. The specific analysis process is as follows: the shaking amplitude fluctuation value HDz and the drop pressure fluctuation value ZYz of the wafer carrier within the time threshold are obtained, and the transportation risk coefficient Ri is obtained by the formula, and the preset transportation risk coefficient Yi stored and entered is retrieved from the processor for comparison and analysis with the transportation risk coefficient Ri; if the transportation risk coefficient Ri ≥ the preset transportation risk coefficient Yi, it is determined that there is an abnormal risk in the use of the wafer carrier within the time threshold, and an adjustment signal is generated. The generated signal is sent to the component control module via the processor. After receiving the adjustment signal, the component control module immediately controls the lower micromotor to work; if the transportation risk coefficient Ri < the preset transportation risk coefficient Yi, no signal is generated.

[0016] The beneficial effects of the present invention are:

[0017] 1. The present invention collects data during the use of the wafer carrier and comprehensively monitors and analyzes the use process of the wafer carrier before and during transportation, that is, compares and analyzes the collected data with the preset stored data, obtains relevant rating signals, and controls relevant components to perform compensatory operations accordingly, so as to realize the operation process of system and mechanical linkage coordination, facilitate adaptive pneumatic adjustment clamping of wafers through limit frames and carriers, effectively reduce the damage interference of external handling process to wafers in the carrier, and use the cover and movable frame to form multiple groups of independent structure loading chambers inside the protective plate frame, reduce the chain reaction of single group wafer transportation damage to surrounding wafers, and improve the safety and stability of the overall wafer carrier in the wafer transportation process;

[0018] 2. The present invention forms a closed chamber with multi-axis linkage locking through a protective cover, a sealing cover and a side frame, which effectively prevents the wafers on the movable frame from being disturbed by the outside during transportation, and ensures the closed protection of the wafers on the carrier. The limit frame and the carrier form a separate compartment in a one-to-one correspondence, so as to realize the separate loading and clamping of each group of wafers, and utilizes the pneumatic adaptive adjustment between multiple groups of expansion airbags to form a pneumatic buffering fine-tuning protection for the clamped wafers, thereby reducing the interference of the external transportation on the internal wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to facilitate understanding by those skilled in the art, the present invention is further described below in conjunction with the accompanying drawings;

[0020] Figure 1 It is a three-dimensional diagram of the overall structure of the present invention;

[0021] Figure 2 It is a schematic diagram of the three-dimensional structure of the protective plate frame of the present invention;

[0022] Figure 3 It is a schematic diagram of the structure of the side frame and the auxiliary frame of the present invention;

[0023] Figure 4 It is a schematic diagram of the three-dimensional structure of the cover of the present invention;

[0024] Figure 5 It is a structural schematic diagram of the cover cross section of the present invention;

[0025] Figure 6 This is a schematic diagram of the cross-sectional structure of the regulating rubber strip of the present invention;

[0026] Figure 7 It is a schematic diagram of the connection structure between the movable frame and the protective plate frame of the present invention;

[0027] Figure 8 It is a schematic diagram of the cross-sectional structure of the carrier board of the present invention;

[0028] Fig. 9 It is a flow chart of the system of the present invention.

[0029] Reference numerals: 1, protective plate frame; 101, limit plate; 102, corner plate; 103, slide rail; 104, card strip; 2, cover; 201, rotating shaft; 202, observation window; 203, limit frame; 204, winding motor; 205, tension wire; 206, adjustment strip; 207, elastic line; 208, guide roller; 209, buckle; 210, arc expansion airbag; 2 11. Column expansion airbag; 212. Limiting rubber pad; 3. Side frame; 301. Sub-frame; 302. Inner lining plate; 303. Magnetic arc strip; 304. Sliding plate; 305. Slide groove; 306. Limiting strip; 4. Control panel; 5. Movable frame; 501. Carrier plate; 502. Lower micro air pump; 503. Pressure relief valve; 504. Abutting airbag; 505. Side bag wall; 506. Notch. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] Example 1: Please refer to Figure 1 - Figure 5 As shown, this embodiment is a wafer carrier with an intelligent clamping and adjustment mechanism, including a protective plate frame 1, a slide rail 103 is arranged on the inner wall of the bottom of the protective plate frame 1, and a movable frame 5 is arranged on the slide rail 103, a cover 2 is hinged on the outer side of the bottom of the protective plate frame 1, a limit frame 203 is arranged inside the cover 2, an adjustment rubber strip 206 is arranged on the inner wall of the limit frame 203, an arc expansion airbag 210 and a cylindrical expansion airbag 211 are arranged inside the adjustment rubber strip 206, and a control panel 4 is arranged on the outer wall of the top of the protective plate frame 1; multiple groups of carrier plates 501 are arranged inside the movable frame 5, and a lower micro air pump 502 and an abutment airbag 504 are arranged inside the carrier plate 501, and side frames 3 connected to the protective plate frame 1 are arranged at both ends of the movable frame 5, and the side frames 3 include sub-frames 301 arranged side by side;

[0032] The control panel 4 is internally provided with a processor, a data acquisition module, an operation analysis module and a component control module; the data acquisition module is used to collect the shaking amplitude fluctuation value HDz on the plate protection plate frame 1 and the pressure fluctuation value ZYz on the carrier 501 during the use of the wafer carrier, and send the shaking amplitude fluctuation value HDz and the pressure fluctuation value ZYz to the operation analysis module via the processor; 2h during the use of the wafer carrier is set as the time threshold;

[0033] It should be noted that: the shaking amplitude fluctuation value HDz is expressed as the average value of the maximum and minimum shaking forces generated by the external interference during the wafer state transfer of the protection plate frame 1 obtained within the time threshold, and the value of the shaking amplitude fluctuation value HDz reflects the influence of the external interference on the internal wafer of the wafer carrier within the time threshold, and the larger the shaking amplitude fluctuation value HDz is, the greater the influence on the wafer inside the wafer carrier is, and the easier it is to cause wafer damage, and the drop pressure fluctuation value ZYz is expressed as the up and down fluctuation parameters generated by the external force interference on the wafer inside the carrier 501 obtained within the time threshold. In addition, the shaking amplitude fluctuation value HDz is collected by the gyroscope sensor and the vibration sensor installed on the outside of the protection plate frame 1, and the drop pressure fluctuation value ZYz is collected by the pressure sensor installed inside the abutting airbag 504;

[0034] After receiving the shaking amplitude fluctuation value HDz and the drop pressure fluctuation value ZYz, the operation analysis module immediately analyzes the transportation risk of the wafer carrier. The specific analysis process is as follows:

[0035] Obtain the shaking amplitude fluctuation value HDz and the pressure fluctuation value ZYz of the wafer carrier within the time threshold, and use the formula The migration risk coefficient Ri is obtained, wherein a and b are respectively the proportional coefficients of the sloshing amplitude fluctuation value HDz and the fall pressure fluctuation value ZYz, a>b>0, and Ri is represented as the migration risk coefficient. The preset migration risk coefficient Yi stored in the processor is retrieved for comparison and analysis with the migration risk coefficient Ri;

[0036] If the transport risk coefficient Ri ≥ the preset transport risk coefficient Yi, it is determined that there is an abnormal risk in the use of the wafer carrier within the time threshold, and an adjustment signal is generated. The generated signal is sent to the component control module via the processor. When the processor receives the adjustment signal, it immediately generates a "carrier sequence n / loading abnormality" style text and sends it to the mobile phone APP of the transportation supervisor for real-time reminder to the transportation supervisor. After receiving the adjustment signal, the component control module immediately controls the lower micro motor 502 to work;

[0037] After receiving the adjustment signal, the lower micro air pump 502 is connected to the abutting airbag 504 and the side bag wall 505 through a pipeline, and the internal air pressure of the abutting airbag 504 and the side bag wall 505 is adjusted to realize the adjustment of the adaptive clamping force of the wafer according to the amplitude of the transportation bump. The upper micro air pump and the winding motor 204 are synchronously operated again, and the upper micro air pump adjusts the internal air pressure of the arc expansion airbag 210 through the pipeline, so that the arc expansion airbag 210 is expanded and deflated, and then the outer peripheral wall of the wafer is expanded and locked according to the amplitude of the transportation bump, and the shaking amplitude of the wafer in the separate chamber is reduced. The air pressure adjustment of the cylindrical expansion airbag 211 forms an expansion and contraction, and then squeezes the limiting rubber pad 212 and the double-sided outer ring edge of the wafer to clamp it, so that it is synchronously clamped up and down.

[0038] If the migration risk coefficient Ri is less than the preset migration risk coefficient Yi, no signal is generated.

[0039] Embodiment 2: This embodiment is a wafer carrier with an intelligent clamping adjustment mechanism, including a limit plate 101 connected to a control panel 4 is arranged on the top of the protection plate frame 1, a clamping strip 104 is arranged on the side section of the limit plate 101, and a corner plate 102 is arranged at the corner of the inner wall of the bottom of the protection plate frame 1. By opening the lock buckle outside the slide groove 305, the sliding plate 304 is pulled out of the slide groove 305, and then the movable frame 5 is pulled to the outside, and the bottom of the pulled-out end of the movable frame 5 is padded by an external pad to keep the pulled-out state of the movable frame 5 horizontal;

[0040] A rotating shaft 201 connected to the protective plate frame 1 is arranged at the bottom of one side of the cover 2, an observation window 202 is embedded in the top of the cover 2, a winding motor 204 is embedded on the inner wall of the top of the limit frame 203, and an upper micro air pump is arranged side by side on the side of the winding motor 204, and guide rollers 208 connected to the regulating rubber strip 206 are arranged at the top and bottom of the inner wall of the limit frame 203, and a tension wire 205 connected to the winding motor 204 is arranged inside the regulating rubber strip 206;

[0041] A buckle 209 is provided at the top center of the outer wall of the adjusting rubber strip 206, and an elastic line 207 connected to the inside of the limiting frame 203 is provided at the top of the buckle 209, and the arc expansion airbag 210 is embedded in the center of the inner wall of the adjusting rubber strip 206, and the cylindrical expansion airbag 211 is installed side by side on both sides of the arc expansion airbag 210, and a limiting rubber pad 212 is provided between the cylindrical expansion airbag 211 and the arc expansion airbag 210, and a shaping tube and an elastic pull line are provided at the center of the inner wall of the cylindrical expansion airbag 211, waiting for all the wafers to be loaded. After that, push the movable frame 5 to reset, the bottom of the movable frame 5 is connected to the slide rail 103 through the groove, and the slider is movably connected to the corner plate 102, thereby driving the movable frame 5 to move into the protective plate frame 1 within a limited position. At this time, the cover plate is hinged to the protective plate frame 1 through the rotating shaft 201, and the arc-shaped cross-section at the top of the cover 2 is clamped by the clamping strip 104, and the magnetic arc strip 303 is energized to generate magnetic force to magnetically lock the end face of the cover 2, so that the limit frame 203 on the inner wall of the cover 2 is abutted against the limit plate 101, and a semi-partitioned frame structure is formed;

[0042] A plurality of grooves and sliders are arranged at the bottom of the movable frame 5. The abutting airbag 504 is arranged in a semi-arc structure in the inner wall of the carrier plate 501. The top of the abutting airbag 504 is connected to the pipeline of the lower micro air pump 502. A pressure relief valve 503 is arranged at the bottom of the lower micro air pump 502. Side bag walls 505 connected to the pipeline of the lower micro air pump 502 are arranged on the inner walls on both sides of the carrier plate 501. A notch 506 is arranged in the center of the arc section at the top of the carrier plate 501. According to the size of the wafer, the air pressure in the abutting airbag 504 and the side bag wall 505 is adjusted in advance by the lower micro air pump 502, so that the abutting airbag 504 and the side bag wall 505 can fit the wafer in the carrier plate 501, and the wafer is placed between the side bag walls 505 from top to bottom until the bottom of the wafer is stuck in the abutting airbag 504. The position of the wafer in the carrier plate 501 is adjusted in the notch 506 area by a fixture.

[0043] The end surface of the side frame 3 is provided with an inner lining plate 302 that abuts against the movable frame 5, and a magnetic arc strip 303 connected to the cover 2 is provided on the arc-shaped section at the top of the inner lining plate 302. A central groove is provided in the middle of the sub-frame 301, and a slide groove 305 that penetrates the central groove is provided in the middle of one side of the sub-frame 301, and a sliding plate 304 is slidably provided inside the slide groove 305. Limiting strips 306 are provided on the top and bottom of the side frame 3 and the sub-frame 301. When the movable frame 5 slides into the gap between the protective plate frame 1 and the cover 2, During this time, the carrier plate 501 and the limiting frame 203 are alternately offset one by one to form a one-to-one corresponding state, thereby covering the top of each group of carrier plates 501, and the winding motor 204 pulls the adjusting rubber strip 206 through multiple groups of tension wires 205. The adjusting rubber strip 206 is forced to drag the elastic line 207, thereby causing the adjusting rubber strip 206 to press down and cover the top of the wafer, limiting the top of the wafer, causing the wafer to be in a separate chamber formed between the carrier plate 501 and the cover 2 during the transportation process.

[0044] Combining Example 1 and Example 2, it can be seen that it can not only realize the operation process of the system and mechanical linkage coordination, which is beneficial to the adaptive pneumatic adjustment clamping of the wafer through the limit frame 203 and the carrier 501, effectively reducing the damage and interference of the external transportation process to the wafer in the carrier, but also can use the cover 2 and the movable frame 5 to form multiple groups of independent structure loading chambers inside the protective plate frame 1, reduce the chain reaction of the damage of a single group of wafers on the surrounding wafers, and improve the safety and stability of the overall wafer carrier in the wafer transportation process.

[0045] The above contents are merely examples and explanations of the structure of the present invention. The technicians in this technical field may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the structure of the invention or exceed the scope defined by the claims, they should all fall within the protection scope of the present invention.

[0046] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0047] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A wafer carrier with an intelligent clamping and adjustment mechanism, comprising a protective plate frame (1), characterized in that: A slide rail (103) is arranged on the inner wall of the bottom of the protection plate frame (1), and a movable frame (5) is arranged on the slide rail (103); a cover (2) is hingedly connected to the outer side of the bottom of the protection plate frame (1); a limit frame (203) is arranged inside the cover (2); an adjustment rubber strip (206) is arranged on the inner wall of the limit frame (203); an arc-shaped expansion air bag (210) and a cylindrical expansion air bag (211) are arranged inside the adjustment rubber strip (206); and a control panel (4) is arranged on the outer wall of the top of the protection plate frame (1); The movable frame (5) is provided with a plurality of groups of carrier plates (501) inside, and the carrier plates (501) are provided with a lower micro air pump (502) and an abutting air bag (504) inside, and side frames (3) connected to the protective plate frame (1) are provided at both ends of the movable frame (5), and the side frames (3) include sub-frames (301) arranged side by side; A rotating shaft (201) connected to the protective plate frame (1) is arranged at the bottom of one side of the cover (2), an observation window (202) is embedded in the top of the cover (2), a winding motor (204) is embedded on the inner wall of the top of the limit frame (203), and an upper micro air pump is arranged side by side on the side of the winding motor (204), guide rollers (208) connected to the regulating rubber strip (206) are arranged at the top and bottom of the inner wall of the limit frame (203), and a tension wire (205) connected to the winding motor (204) is arranged inside the regulating rubber strip (206); A buckle (209) is provided at the center of the top of the outer wall of the adjusting rubber strip (206), and an elastic line (207) connected to the inside of the limiting frame (203) is provided at the top of the buckle (209); the arc-shaped expansion airbag (210) is embedded in the center of the inner wall of the adjusting rubber strip (206), and the cylindrical expansion airbag (211) is installed side by side on both sides of the arc-shaped expansion airbag (210); a limiting rubber pad (212) is provided between the cylindrical expansion airbag (211) and the arc-shaped expansion airbag (210), and a shaping tube and an elastic pull line are provided at the center of the inner wall of the cylindrical expansion airbag (211); The control panel (4) is internally provided with a processor, a data acquisition module, an operation analysis module and a component control module; The data acquisition module is used to collect a shaking amplitude fluctuation value HDz on the plate protection plate frame (1) and a drop pressure fluctuation value ZYz on the carrier plate (501) during use of the wafer carrier, and send the shaking amplitude fluctuation value HDz and the drop pressure fluctuation value ZYz to the operation analysis module via the processor; After receiving the shaking amplitude fluctuation value HDz and the pressure fluctuation value ZYz, the operation analysis module immediately analyzes the transportation risk of the wafer carrier. The specific analysis process is as follows: the shaking amplitude fluctuation value HDz and the pressure fluctuation value ZYz of the wafer carrier within the time threshold are obtained, and the transportation risk coefficient Ri is obtained by formula, and the preset transportation risk coefficient Yi stored and entered is retrieved from the processor for comparison and analysis with the transportation risk coefficient Ri; if the transportation risk coefficient Ri is greater than or equal to the preset transportation risk coefficient Yi, it is determined that there is an abnormal risk in the use of the wafer carrier within the time threshold, and an adjustment signal is generated, and the generated signal is sent to the component control module via the processor. After receiving the adjustment signal, the component control module immediately controls the lower micro air pump (502) to work; If the migration risk coefficient Ri is less than the preset migration risk coefficient Yi, no signal is generated.

2. A wafer carrier with an intelligent clamping and adjustment mechanism according to claim 1, characterized in that: A limiting plate (101) connected to the control panel (4) is arranged on the top of the protection plate frame (1), a clamping strip (104) is arranged on the side section of the limiting plate (101), and a corner plate (102) is arranged at the inner wall corner of the bottom of the protection plate frame (1).

3. The wafer carrier with an intelligent clamping and adjustment mechanism according to claim 1, characterized in that: The bottom of the movable frame (5) is provided with a plurality of grooves and sliders, the abutting airbags (504) are arranged in a semi-arc structure in the inner wall of the carrier plate (501), a pressure relief valve (503) is provided at the bottom of the lower micro air pump (502), side bag walls (505) connected to the pipeline of the lower micro air pump (502) are provided on the inner walls on both sides of the carrier plate (501), and a notch (506) is provided in the center of the arc section at the top of the carrier plate (501).

4. The wafer carrier with an intelligent clamping and adjustment mechanism according to claim 1, characterized in that: The end surface of the side frame (3) is provided with an inner lining plate (302) that abuts against the movable frame (5), and a magnetic arc strip (303) connected to the cover (2) is provided on the arc-shaped cross section at the top of the inner lining plate (302), a central groove is provided through the middle of the sub-frame (301), and a slide groove (305) that passes through the central groove is provided in the middle of one side of the sub-frame (301), and a sliding plate (304) is slidably provided inside the slide groove (305), and limit strips (306) are provided at the top and bottom of the side frame (3) and the sub-frame (301).

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