A wafer fixing device

Abstract

The present invention relates to the field of wafer detection technology, and in particular to a wafer fixing device, comprising a base, the surface of which has an enclosing portion; a fixing assembly, slidably mounted on the base, comprising an insulating base, a first electrode and a second electrode, the first electrode and the second electrode being arranged inside the insulating base and alternately adjacent to each other; a power supply, the output end of which is electrically connected to the first electrode and the second electrode respectively, and the voltage polarities loaded on the first electrode and the second electrode are opposite; the insulating base has an extension end on one side close to the base, the outer edge surface of the extension end has a symmetrically opened first tooth groove, the base has a first mounting groove for accommodating the extension end, an annular plate is slidably mounted in the first mounting groove, the annular plate has a symmetrically arranged vertical pole, the vertical pole has a second tooth groove, and a first gear is mounted in the first mounting groove. The present invention realizes the precise positioning and fixing of the wafer through the combination of electrostatic adsorption technology and electromagnetic plate, and significantly improves the accuracy and efficiency of wafer detection.

Description

Technical Field

[0001] The invention relates to the field of wafer detection, in particular to a wafer fixing device. Background Art

[0002] Wafers play a key role in semiconductor manufacturing and other high-tech fields. They are used as basic materials to manufacture integrated circuits, optical devices and other micro-nano devices. The preparation and processing of wafers are crucial to the performance and quality of the final product.

[0003] In the process of wafer processing and handling, in order to ensure precise process control and efficient production, a reliable fixture is required to stably fix the wafer on the processing equipment. Traditional fixing methods include suction cup adsorption, clamping clamping, etc. At present, most of the fixing devices are to attach and fix the wafer by moving two fixing plates towards each other, which is convenient for fixing the wafer as a whole. However, this fixing method cannot fix the wafer well. The two-end fixing method will apply more force to both ends of the wafer, which is easy to damage the wafer and the performance inside the wafer. It also makes the wafer not fixed firmly enough, and it is very likely that the wafer will fall with a slight shake. This not only delays the time of the experimenter, but may also force the ongoing experiment to be terminated, causing irreparable losses. Summary of the invention

[0004] In view of the above problems existing in the prior art, the present invention is proposed.

[0005] Therefore, the technical problem to be solved by the present invention is that the existing two-end fixing method exerts relatively large force on the two ends of the wafer, which is easy to damage the wafer and the performance inside the wafer, and also makes the wafer not fixed firmly enough, and it is very likely that the wafer will fall with a slight shake.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: a wafer fixing device comprises:

[0007] The base has a surrounding portion on its surface to form a receiving cavity;

[0008] A fixed assembly is slidably mounted in the accommodating cavity, comprising an insulating seat, a first electrode and a second electrode, wherein the first electrode and the second electrode are buried inside the insulating seat and are alternately arranged adjacent to each other;

[0009] A power supply, the output end of which is electrically connected to the first electrode and the second electrode respectively, and the voltage polarities applied to the first electrode and the second electrode are opposite;

[0010] Among them, the insulating seat has an extension end on a side close to the base, and the outer edge surface of the extension end has a first tooth groove symmetrically opened, the base has a first mounting groove to accommodate the extension end, an annular plate is slidably installed in the first mounting groove, the annular plate has symmetrically arranged vertical rods, the vertical rod has a second tooth groove arranged opposite to the first tooth groove, a first gear is installed in the first mounting groove, and the first gear is meshed with the first tooth groove and the second tooth groove.

[0011] As a preferred solution of the wafer fixing device of the present invention, the extension end includes a first cylinder and a second cylinder, the diameter of the second cylinder is smaller than the diameter of the first cylinder, the first electrode and the second electrode are buried in the first cylinder, and the annular plate is slidably mounted on the second cylinder.

[0012] As a preferred solution of the wafer fixing device of the present invention, wherein: magnets are fixedly installed on the insulating seat and the cavity surface of the accommodating cavity, the contact surfaces of the magnets have opposite polarities, and an elastic part is also connected between the insulating seat and the cavity surface of the accommodating cavity, and the magnet is located inside the elastic part.

[0013] As a preferred solution of the wafer fixing device of the present invention, there is a preset distance between the first electrode and the second electrode, and the first electrode and the second electrode are insulated from each other.

[0014] As a preferred solution of the wafer fixing device of the present invention, the fixing component also includes a heating layer, which is installed in the insulating seat and located below the first electrode and the second electrode. The heating layer includes a heater, a thermocouple and a thermal conductive film, which is used to provide the ambient temperature required for wafer detection.

[0015] As a preferred solution of the wafer fixing device of the present invention, a resin layer is filled between the base and the insulating seat.

[0016] As a preferred solution of the wafer fixing device of the present invention, the resin layer has an embedding groove, the opening end of the embedding groove is a slope, and the insulating seat has a protrusion matched with the embedding groove on one side close to the resin layer, and when the protrusion is embedded in the notch of the embedding groove, it abuts against the slope of the notch of the embedding groove.

[0017] As a preferred solution of the wafer fixing device of the present invention, wherein: the insulating seat has a water channel inside, and the water channel includes a medium inlet and a medium outlet.

[0018] As a preferred solution of the wafer fixing device of the present invention, wherein: the side of the surrounding portion away from the base extends inward to form a second mounting groove, a protective plate is slidably connected in the second mounting groove, the inner wall of the surrounding portion is provided with a strip groove that passes through the second mounting groove, a second gear is rotatably installed on the groove wall of the strip groove, and racks meshing with the second gear are fixedly installed on the protective plate and the insulating seat.

[0019] As a preferred solution of the wafer fixing device of the present invention, the surface of the protection plate is sprayed with a black coating for absorbing visible light and near-infrared light.

[0020] The beneficial effects of the present invention are as follows: a wafer is placed in a positioning groove on the surface of an insulating seat for preliminary positioning, and a power supply applies voltages of opposite polarities to a first electrode and a second electrode so that the first electrode and the second electrode are charged, so that the charges of the first electrode and the second electrode form an electrostatic field between the wafer surface and the positioning groove through a dielectric layer, so that the wafer is firmly fixed to the surface of the insulating seat by electrostatic adsorption, and when it is necessary to remove or replace the wafer, the applied voltage is gradually reduced through an external control system until the adsorption force disappears, and the wafer is safely removed, and other operations are performed or a new wafer is replaced. At the same time, the spacing between the first electrode and the second electrode arranged in the extension end becomes smaller, resulting in an enhanced electrostatic field, and the adsorption annular plate moves up, and the first tooth groove on the annular plate drives the insulating seat as a whole to descend through a meshing connection with the first gear, and the wafer to be inspected is moved into the surrounding portion for inspection, which can prevent the wafer from being physically damaged by the outside during the inspection process, especially in temperature-sensitive inspection items, to avoid the impact of environmental changes on the wafer inspection process. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0022] Figure 1 A schematic diagram of the overall structure of a wafer fixing device according to an embodiment of the present invention;

[0023] Figure 2 A schematic diagram of the base structure of a wafer fixing device according to an embodiment of the present invention;

[0024] Figure 3 A schematic diagram of the structure of a fixing component of a wafer fixing device according to an embodiment of the present invention;

[0025] Figure 4A schematic diagram of the connection between an insulating seat and a resin layer of a wafer fixing device according to an embodiment of the present invention;

[0026] Figure 5 A schematic diagram of the interior of a first mounting groove of a wafer fixing device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0027] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0028] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0029] Secondly, the present invention is described in detail with reference to schematic diagrams. When describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0030] Furthermore, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0031] To facilitate understanding of the chip testing fixture provided in the embodiment of the present invention, the application scenario of the chip testing fixture provided in the embodiment of the present invention is first described below. The chip testing fixture is used in the semiconductor manufacturing process to detect the electrical performance, logical functions and interfaces of the chip through high-frequency performance testing. In the embodiment of the present invention, the chip is sensitive and miniature, and any slight movement or vibration will affect the test results. Therefore, it is necessary to provide a chip testing fixture to obtain accurate test data.

[0032] Combine the following Figure 1-Figure 5 A wafer fixing device of the present invention is described.

[0033] Example

[0034] Reference Figure 1-Figure 4 This embodiment provides a wafer fixing device, including a base 100, a fixing component 200 and a power supply 300.

[0035] The surface of the base 100 has a surrounding portion 101, forming a accommodating cavity 101a for providing overall support and protection; the fixed component 200 is slidably mounted on the base 100, and includes an insulating seat 201, a first electrode 202 and a second electrode 203, the first electrode 202 and the second electrode 203 are buried inside the insulating seat 201 and are alternately arranged adjacent to each other. As an option, a positioning groove 201d for placing a wafer is provided on the surface of the insulating seat 201, and a dielectric layer is provided on the surface of the positioning groove 201d, and the dielectric layer can be one or more of polyimide, polytetrafluoroethylene or silicon dioxide, which is used to prevent current from passing directly through the wafer and protect the internal circuit of the wafer from high voltage; the output end of the power supply 300 is electrically connected to the first electrode 202 and the second electrode 203 respectively, and the voltage polarity loaded on the first electrode 202 and the second electrode 203 is opposite.

[0036] Reference Figure 5 Specifically, the insulating seat 201 has an extension end 201a on one side close to the base 100, and the outer edge surface of the extension end 201a has a first tooth groove 201a-1 symmetrically opened, and the base 100 has a first mounting groove 105 for accommodating the extension end 201a, and a ring plate 106 is slidably installed in the first mounting groove 105, and the ring plate 106 has a symmetrically arranged vertical rod 106a, and the vertical rod 106a has a second tooth groove 106a-1 arranged opposite to the first tooth groove 201a-1, and the first mounting groove A first gear 107 is installed in 105, and the first gear 107 is meshed and connected with the first tooth groove 201a-1 and the second tooth groove 106a-1. As an option, the extension end 201a includes a first cylinder 201a-2 and a second cylinder 201a-3, and the diameter of the second cylinder 201a-3 is smaller than the diameter of the first cylinder 201a-2. The first electrode 202 and the second electrode 203 are buried in the first cylinder 201a-2, and the annular plate 106 is slidably installed on the second cylinder 201a-3.

[0037] It should be noted that there are at least two or more first electrodes 202 and second electrodes 203, so that a more uniform electric field distribution can be formed on the surface of the insulating seat 201 to ensure that the wafer is subjected to uniform force in the entire adsorption area, avoiding insufficient or excessive local adsorption force due to uneven electric field.

[0038] A wafer test fixture of the present embodiment places the wafer in a positioning groove 201d on the surface of an insulating seat 201 for preliminary positioning. The power supply 300 applies voltages of opposite polarity to the first electrode 202 and the second electrode 203, so that the first electrode 202 and the second electrode 203 are charged. In this way, the charges of the first electrode 202 and the second electrode 203 form an electrostatic field between the wafer surface and the positioning groove 201d through the dielectric layer. In this way, the wafer is firmly fixed on the surface of the insulating seat 201 by electrostatic adsorption, and the uniform electric field distribution is provided, so that the wafer can be accurately positioned, the positioning error is reduced, the physical contact of the mechanical clamping to the wafer is avoided, and the risk of damage to the wafer is reduced. When it is necessary to remove or replace When the wafer is adsorbed, the applied voltage is gradually reduced through an external control system until the adsorption force disappears, and the wafer is safely removed to perform other operations or replace with a new wafer. It is suitable for automated production lines. At the same time, due to the smaller distance between the first electrode 202 and the second electrode 203 arranged in the extension end 201a, the electrostatic field is enhanced, and the adsorption annular plate 106 moves up. The first tooth groove 201a-1 on the annular plate 106 drives the insulating seat 201 to descend as a whole through the meshing connection with the first gear 107, and the wafer to be inspected is moved into the surrounding part 101 for inspection, which can prevent the wafer from being physically damaged by the outside during the inspection process, especially in temperature-sensitive inspection items, to avoid the impact of environmental changes on the wafer inspection process.

[0039] Each structure is described in detail below with reference to the accompanying drawings.

[0040] Reference Figure 4 To further increase the stability of the insulating seat 201 during detection, magnets 108 are fixedly installed on the insulating seat 201 and the cavity surface of the accommodating cavity 101a. The contact surfaces of the magnets 108 have opposite polarities. An elastic member is also connected between the insulating seat 201 and the cavity surface of the accommodating cavity 101a. The magnets 108 are located inside the elastic member. Optionally, the elastic member is a spring 109.

[0041] Through the arrangement of the above structure, when the insulating seat 201 gradually approaches the cavity surface of the accommodating cavity 101a under the pull of the first gear 107 and enters the magnetic field distance of the two magnets 108, the two magnets 108 attract and fit each other to fix the insulating seat 201 and the base 100 together. After the electrostatic field disappears, the restoring force of the first spring 109 bounces the insulating seat 201, making it convenient to replace or transfer the wafer.

[0042] In order to prevent a short circuit between the first electrode 202 and the second electrode 203, the stability and safety of the electric field are ensured. Figure 3 and Figure 4 There is a preset distance between the first electrode 202 and the second electrode 203, and the first electrode 202 and the second electrode 203 are insulated from each other.

[0043] Through the setting of the above structure, a uniform electric field distribution can be formed between the first electrode 202 and the second electrode 203 through a preset distance, which is very important for ensuring that the wafer is uniformly stressed and preventing the local adsorption force from being too strong or insufficient. The design of the preset distance can be optimized according to the size and shape of different wafers to ensure the best adsorption effect.

[0044] It should be noted that the first electrode 202 and the second electrode 203 can be arranged alternately to form a uniform electric field; the distance between the first electrode 202 and the second electrode 203 can be adjusted according to specific needs, and is usually designed to range from a few millimeters to a few centimeters. A layer of insulating material can be coated on the surface of or between the first electrode 202 and the second electrode 203 to ensure the insulation effect between each other, or an insulating partition can be used to separate the electrodes.

[0045] In various functional and performance tests, controlling the wafer temperature, simulating the actual working environment, and improving the accuracy of the test results are the first elements. Figure 1 and Figure 3 and Figure 4 The fixing component 200 also includes a heating layer 204, which is installed in the insulating seat 201 and is located below the first electrode 202 and the second electrode 203. The heating layer 204 includes a PTC heater, a thermocouple and a thermal conductive film, which is used to provide the ambient temperature required for wafer detection.

[0046] Through the setting of the above structure, during the wafer inspection process, the PTC heater and thermocouple combination with a positive temperature coefficient can provide precise temperature control, ensuring that the temperature of the wafer is stable during the inspection process and transmitted to the thermal conductive film. The thermal conductive film ensures uniform heat distribution and avoids the wafer from being affected by local overheating or overcooling and affecting the inspection results.

[0047] Reference Figure 4 As an option, a resin layer 400 is filled between the base 100 and the insulating seat 201 .

[0048] The resin layer 400 can reduce the heat transferred from the heating layer 204 to the base 100, and the resin layer 400 has a certain elasticity, which can reduce the impact of external vibrations on the insulating seat 201 and the wafer, improve the detection accuracy and stability, and during operation, the resin layer 400 can absorb part of the mechanical impact and protect the insulating seat 201 and the wafer from damage; at the same time, the resin material usually has good electrical insulation properties, which can effectively prevent electrical short circuits between the insulating seat 201 and the base 100, and isolate the interference of the electric field, ensuring that a stable electrostatic field is generated on the insulating seat 201, thereby improving the adsorption effect.

[0049] The resin layer 400 has an embedding groove 401, the opening end of which is an inclined surface. The insulating seat 201 has a protrusion 201b adapted to the embedding groove 401 on one side close to the resin layer 400. When the protrusion 201b is embedded in the notch of the embedding groove 401, it abuts against the notch inclined surface of the embedding groove 401.

[0050] Through the arrangement of the above-mentioned structure, when the insulating seat 201 descends, the embedded groove 401 abuts against the inclined surface of the raised portion 201b on the insulating seat 201, and can then better abut against the resin layer 400 for secondary positioning, thereby ensuring that the detection equipment (such as a microscope, a probe card, etc.) is completely aligned with the target area on the wafer, thereby avoiding detection errors caused by position offset, and precise positioning can add marks on the wafer, which is convenient for alignment and operation in subsequent processes (such as packaging and testing), helping to ensure the consistency of each step of the operation and improve the overall quality of the product.

[0051] Reference Figure 4 The insulating seat 201 has a water channel 201c therein, and the water channel 201c includes a medium inlet 201c-1 and a medium outlet 201c-2.

[0052] Through the setting of the above structure, the water channel 201c is externally connected to a cooling medium control system, and the cooling medium control system introduces the refrigerant through the medium inlet 201c-1 and discharges it through the medium outlet 201c-2. The refrigerant circulates in the water channel 201c to quickly take away the heat inside the insulating seat 201.

[0053] Reference Figure 1 and Figure 2 A second mounting groove 101b is extended inwardly from one side of the surrounding portion 101 away from the base 100, and a protection plate 102 is slidably connected to the second mounting groove 10b. A strip groove 101c penetrating the second mounting groove 10b is formed on the inner wall of the surrounding portion 101, and a second gear 103 is rotatably mounted on the groove wall of the strip groove 101b. A rack 104 meshingly connected to the second gear 103 is fixedly mounted on both the protection plate 102 and the insulating seat 201.

[0054] As an option, the surface of the protection plate 102 is sprayed with a black coating to absorb visible light and near-infrared light.

[0055] Through the arrangement of the above structure, when the insulating seat 201 approaches one side of the base 100 under the action of the magnetic pulling force, the rack 104 on the insulating seat 201 drives the meshing second gear 103 to rotate, and the second gear 103 drives the protective plate 102 to move in the opposite direction of the insulating seat 201 in the second mounting groove 101a and expose it, so as to protect the wafer under inspection and ensure the safety of the inspection process; at the same time, the black coating can block external light interference, ensure that the optical inspection equipment is only affected by the light source required for inspection, improve the accuracy and stability of optical inspection, and reduce reflection interference. The inner surface of the protective plate 102 can be designed as matte or light-absorbing material to reduce reflection interference and improve the clarity of optical imaging.

[0056] Importantly, it should be noted that the construction and arrangement of the present application shown in a plurality of different exemplary embodiments are only exemplary. Although only a few embodiments are described in detail in this disclosure, it should be readily understood by those who refer to this disclosure that many modifications are possible (e.g., the size, scale, structure, shape and proportion of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, directional changes, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in the application. For example, the element shown as integrally formed can be composed of multiple parts or elements, the position of the element can be inverted or otherwise changed, and the nature or number or position of the discrete element can be changed or changed. Therefore, all such modifications are intended to be included in the scope of the present invention. The order or sequence of any process or method steps can be changed or reordered according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure of performing the function described herein, and is not only structurally equivalent but also equivalent structure. Without departing from the scope of the present invention, other replacements, modifications, changes and omissions can be made in the design, operating conditions and arrangement of the exemplary embodiments. Therefore, the invention is not limited to a specific embodiment, but extends to numerous modifications still falling within the scope of the appended claims.

[0057] Additionally, in order to provide a concise description of exemplary embodiments, all features of an actual embodiment (ie, those features that are not relevant to the best mode presently contemplated for carrying out the invention or those that are not relevant to implementing the invention) may not be described.

[0058] It will be appreciated that in the development of any actual implementation, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort may be complex and time-consuming, but will be a routine task of design, fabrication, and production for those of ordinary skill having the benefit of this disclosure without undue experimentation.

[0059] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A wafer fixing device, characterized in that: include, A base (100) having a surrounding portion (101) on its surface, forming a receiving cavity (101a); A fixed assembly (200) is slidably mounted in the accommodating cavity (101a), comprising an insulating seat (201), a first electrode (202) and a second electrode (203), wherein the first electrode (202) and the second electrode (203) are buried inside the insulating seat (201) and are alternately arranged adjacent to each other; A power supply (300), the output end of which is electrically connected to the first electrode (202) and the second electrode (203), respectively, and the voltage polarities loaded on the first electrode (202) and the second electrode (203) are opposite; The insulating seat (201) has an extension end (201a) on one side close to the base (100), and the outer edge surface of the extension end (201a) has a first tooth groove (201a-1) symmetrically arranged, and the base (100) has a first installation groove (105) for accommodating the extension end (201a), and an annular plate (106) is slidably installed in the first installation groove (105), and the annular plate (106) has a symmetrically arranged vertical rod (106a), and the vertical rod (106a) has a first tooth groove (201a-1) and a first tooth groove (201a-1) arranged on the first tooth groove (201a-1). ), a second tooth groove (106a-1) arranged opposite to the first tooth groove (201a-1), a first gear (107) being installed in the first installation groove (105), the first gear (107) being meshingly connected with the first tooth groove (201a-1) and the second tooth groove (106a-1), a magnet (108) being fixedly installed on the cavity surface of the insulating seat (201) and the accommodating cavity (101a), the contact surface of the magnet (108) having opposite polarities, and an elastic member being connected between the cavity surface of the accommodating cavity (101a), the magnet (108) being located in the elastic member, and the The fixing assembly (200) further comprises a heating layer (204), the heating layer (204) being installed in the insulating seat (201) and being located below the first electrode (202) and the second electrode (203), the heating layer (204) comprising a PTC heater, a thermocouple and a thermally conductive film, and being used to provide the ambient temperature required for wafer detection, a resin layer (400) being filled between the base (100) and the insulating seat (201), and a second mounting groove extending inwardly from a side of the surrounding portion (101) away from the base (100) (101b), a protective plate (102) is slidably connected in the second installation groove (101b), the inner wall of the surrounding portion (101) is provided with a strip groove (101c) penetrating the second installation groove (101b), a second gear (103) is rotatably mounted on the groove wall of the strip groove (101c), a rack (104) meshingly connected with the second gear (103) is fixedly mounted on the protective plate (102) and the insulating seat (201), and a black coating is sprayed on the surface of the protective plate (102) for absorbing visible light and near-infrared light.

2. The wafer fixing device according to claim 1, characterized in that: The extension end (201a) comprises a first cylinder (201a-2) and a second cylinder (201a-3), the diameter of the second cylinder (201a-3) is smaller than the diameter of the first cylinder (201a-2), the first electrode (202) and the second electrode (203) are buried in the first cylinder (201a-2), and the annular plate (106) is slidably mounted on the second cylinder (201a-3).

3. The wafer fixing device according to claim 2, characterized in that: There is a preset distance between the first electrode (202) and the second electrode (203), and the first electrode (202) and the second electrode (203) are insulated from each other.

4. The wafer fixing device according to claim 3, characterized in that: The resin layer (400) has an embedding groove (401), the opening end of the embedding groove (401) is an inclined surface, and the insulating seat (201) has a protrusion (201b) adapted to the embedding groove (401) on one side close to the resin layer (400), and when the protrusion (201b) is embedded in the notch of the embedding groove (401), it abuts against the notch inclined surface of the embedding groove (401).

5. The wafer fixing device according to claim 4, characterized in that: The insulating seat (201) has a water channel (201c) therein, and the water channel (201c) comprises a medium inlet (201c-1) and a medium outlet (201c-2).

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