A non-contact wafer chuck applicable to thin wafers

Abstract

The present invention relates to the technical field of wafer jigs, and particularly relates to a non-contact wafer jig suitable for thin wafers, including a base. A channel three is rotatably connected to the outer wall of the top of the base. A circular mounting plate is fixedly connected to the outer wall of the bottom of the main suction plate. Two limit protection rods are slidably connected to the inner wall of the circular mounting plate. Four air ports three are formed in the outer wall of the circular mounting plate. An annular channel one is rotatably connected to the outer wall of the circular mounting plate. Two symmetrically distributed air pipes one are fixedly connected to the outer wall of the annular channel one. Two dual-purpose mechanisms are arranged on the outer wall of the mounting ring one in a circumferential array distribution. In summary, the present invention realizes the replacement of the gas channel by the support rod hindering the displacement of the float, so that the auxiliary suction plate can not only assist in the fitting of the blue film and the wafer, but also turn over the wafer with the blue film attached, facilitating subsequent cutting.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer fixtures, and particularly to a non-contact wafer fixture suitable for thin wafers. Background Art

[0002] In the manufacturing and processing of wafers, a series of processes such as grinding, etching, cleaning, and polishing are often involved to process the wafer surface into a specific integrated circuit structure. To implement various processes, it is necessary to transfer the wafer between different processing devices and place the wafer on various processing platforms.

[0003] In the prior art, the form of a robotic arm cooperating with a wafer fixture is usually adopted to implement the clamping process of the wafer. This type of technical solution is equipped with different wafer fixtures according to the different sizes and thicknesses of the processed wafers, and can grab the wafer from above or support it from below from the side of the wafer to implement the grabbing process of the wafer, so that the robotic arm can transfer the wafer between different processing areas.

[0004] The wafer fixtures in the prior art usually select several clamping positions at the edge of the wafer and fix the wafer by applying pressure at the clamping positions, which may cause the problem of edge cracking of the wafer under pressure during the transfer process, reducing the product yield. During the semiconductor material processing, the wafer will present two forms before and after cutting. Before cutting, it is a whole, and after cutting, it will form several small monomers. To keep the wafer in its original shape after cutting, the wafer needs to be attached to a sticky blue film before cutting, and then the wafer needs to be flipped to cut the non-filmed surface, so that the several small monomers formed after wafer cutting can remain in their original positions. However, processes such as filming, flipping, and cutting require the wafer to pass through one operating table after another, resulting in low production efficiency. Therefore, a non-contact wafer fixture suitable for thin wafers is proposed to solve the above-mentioned problems. Summary of the Invention

[0005] The purpose of the present invention is to solve the problems in the background art and propose a non-contact wafer fixture suitable for thin wafers.

[0006] To achieve the above purpose, the present invention adopts the following technical solutions:

[0007] A non-contact wafer fixture applicable to thin wafers, comprising a base, the outer wall of the top of the base is rotatably connected to a third channel, the outer wall of the top of the third channel is rotatably connected to a fourth channel, the outer wall of the top of the fourth channel is fixedly connected to an air vent cylinder, the inner wall of the air vent cylinder is slidably connected to a first sealing slide plate, the inner wall of the first sealing slide plate is slidably connected to a fixed ring plate, the fixed ring plate is fixedly connected to the inner wall of the air vent cylinder through a set link, the outer wall of the top of the fixed ring plate is fixedly connected to a main suction plate, the outer wall of the main suction plate is slidably connected to a first mounting ring, the outer wall of the bottom of the first mounting ring is fixedly connected to a transmission gear ring, the outer wall of the transmission gear ring is engaged with a fifth gear, the outer wall of the fifth gear is fixedly connected to a second motor, the outer wall of the second motor is fixedly connected to a fifth fixing plate, the outer wall of the fifth fixing plate is fixedly connected to the bottom of the main suction plate, a fifth channel is arranged inside the fixed ring plate, the fifth channel is fixedly connected to the outer wall of the bottom of the main suction plate, a float is slidably connected to the inner wall of the fifth channel, a number of uniformly distributed first air ports are arranged on the inner wall of the float, three uniformly distributed second air ports are arranged below the float, two symmetrically distributed sixth channels are communicated with the outer wall of the fifth channel, one end of each of the two sixth channels far away from the fifth channel is fixedly connected to a second connection port, a second mounting ring is rotatably connected to the outer wall of the first sealing slide plate, a first rotating ring is arranged below the two sixth channels, the first rotating ring is rotatably connected to the outer wall of the air vent cylinder, a circular mounting plate is fixedly connected to the outer wall of the bottom of the main suction plate, two limit protection rods are slidably connected to the inner wall of the circular mounting plate, four air ports are arranged on the outer wall of the circular mounting plate, a first annular channel is rotatably connected to the outer wall of the circular mounting plate, two symmetrically distributed first air pipes are fixedly connected to the outer wall of the first annular channel, and two dual-purpose mechanisms are arranged on the outer wall of the first mounting ring in a circumferential array distribution.

[0008] In the above-mentioned non-contact wafer fixture applicable to thin wafers, the dual-purpose mechanism includes a secondary suction plate, a first slide rod, a first shaft rod, a first mounting block, a first motor, a first connection port, a first shaft rod and a tooth column, the first slide rod is slidably connected to the inner wall of the first mounting ring, the outer wall of the bottom of the first slide rod is fixedly connected to the first mounting block, the top end of the first shaft rod is rotatably connected to the inner wall of the first mounting block, the bottom end of the first shaft rod is rotatably connected to the inner wall of the first slide rod, the tooth column is fixedly connected to the outer wall of the first shaft rod, the first motor is fixedly connected to the outer wall of the first mounting block, the output shaft of the first motor is fixedly connected to the secondary suction plate, the first connection port is fixedly connected to the secondary suction plate, and a number of uniformly distributed air suction ports are arranged on the outer wall of the bottom of the secondary suction plate.

[0009] In the above-mentioned non-contact wafer fixture applicable to thin wafers, rotating mechanisms are provided on the outer walls of both of the two tooth columns. The two rotating mechanisms are distributed in a circumferential array. The rotating mechanism includes a third gear, a second bevel gear, a first bevel gear, a second mounting plate, a third mounting plate, a sixth gear, a second rack, and a second connecting rod. The outer wall of the third gear meshes with the tooth column. The second bevel gear is fixedly connected to the third gear. The third gear is rotatably connected to the second mounting plate. The outer wall of the second bevel gear meshes with the first bevel gear. The outer wall of the first bevel gear is fixedly connected to the sixth gear. The sixth gear is rotatably connected to the third mounting plate. The third mounting plate is fixedly connected to the second mounting plate. The second rack meshes with the sixth gear. The second connecting rod is fixedly connected to the second rack. The second rack is slidably connected to the third mounting plate.

[0010] In the above-mentioned non-contact wafer fixture applicable to thin wafers, both of the two second mounting plates are fixedly connected to a first rotating ring. Both of the two second connecting rods are fixedly connected to the first rotating ring. Y-shaped sliding rods are slidably connected to the bottom outer walls of both of the two first sliding rods. Channel two is slidably connected to the outer walls of both of the two Y-shaped sliding rods. Both of the two channel twos communicate with a channel three. The channel three communicates with a channel four. The channel four communicates with a blower. The blower communicates with an air vent tube. Two sealing rings are fixedly connected to the outer wall of the channel four.

[0011] In the above-mentioned non-contact wafer fixture applicable to thin wafers, two switching mechanisms distributed symmetrically are fixedly connected to the outer wall of the air vent tube. The switching mechanism includes a first mounting plate, a first gear, a support rod, a first connecting rod, a first sealing plate, and a second sealing plate. The first mounting plate is fixedly connected to the outer wall of the air vent tube. The first gear is rotatably connected to the first mounting plate. The support rod is slidably connected to the first mounting plate. The support rod meshes with the outer wall of the first gear.

[0012] In the above-mentioned non-contact wafer fixture applicable to thin wafers, the outer wall of the support rod is fixedly connected to the first connecting rod. The first sealing plate is fixedly connected to the first connecting rod. The second sealing plate is fixedly connected to the first sealing plate.

[0013] In the above-mentioned non-contact wafer fixture applicable to thin wafers, the end of the first ventilation pipe away from the circular mounting plate communicates with the channel three. A tension spring is fixedly connected between the two Y-shaped sliding rods.

[0014] In the above-mentioned non-contact wafer fixture applicable to thin wafers, two drive racks one distributed in a circumferential array are fixedly connected to the outer wall of the first mounting ring. Two connecting rods four distributed symmetrically are fixedly connected to the bottom outer wall of the float. The end of the connecting rod four away from the float is fixedly connected to a first sealing sliding plate.

[0015] Compared with the existing technology, the advantages of the non-contact wafer fixture applicable to thin wafers are as follows:

[0016] 1. The first bevel gear drives the third gear to rotate clockwise by 90 degrees through the second bevel gear. The third gear drives the auxiliary suction plate to rotate by 90 degrees through the tooth column and the first shaft rod, so that the two auxiliary suction plates are in a straight line. Then, the second motor starts to rotate. The second motor drives the transmission gear ring to rotate through the fifth gear. The transmission gear ring drives the first mounting ring to rotate, so that the two auxiliary suction plates assist the blue film to fit with the wafer, making the fitting effect better.

[0017] 2. The first gear drives the two supporting rods to move away from each other, so that the two supporting rods no longer obstruct the float. Since the float is under the negative pressure of the blower and will continue to move downward, the first air port is no longer connected to the main suction plate, but is connected to the two side channels six. There is a ventilation hose connecting the second connection port and the first connection port. Then, the two auxiliary suction plates will adsorb the wafer with the blue film attached. At the same time, the two supporting rods moving away from each other will cause the two connecting rods one to drive the two sealing plates one to move, so that the two sealing plates one seal the channel four. At the same time, the sealing plate one will drive the two sealing plates two to open, so that the air generated by the negative pressure is blown into the channel three and the channel two. As the gas gradually increases, the two Y-shaped sliding rods will also be pushed out, so that the two sliding rods one gradually rise along the Y-shaped sliding rods. When reaching the topmost point, the two first motors start to rotate 180 degrees to turn the wafer over, facilitating subsequent cutting.

[0018] 3. The tension spring between the two Y-shaped sliding rods will reset the two Y-shaped sliding rods. The internal gas will enter the third air port along the first ventilation pipe. When the first ventilation pipe is not connected to the third air port, the first ventilation pipe is in a closed state, so that the limit protection rod inside the circular mounting plate extends out. After the limit protection rod completely extends out, the upper surface of the limit protection rod is higher than the auxiliary suction plate. At this time, the limit protection rod plays a limiting role for the wafer. Then, the second motor rotates in the reverse direction, so that the auxiliary suction plate is located between the first gear and the third air port. The blower inhales air in the reverse direction, and the remaining gas blows the float up, so that the two auxiliary suction plates are reset. At the same time, the blown-up gas flows out through the main suction plate, playing a role in supporting the descent of the wafer. Then, the limit protection rod slowly drops.

[0019] In summary, the present invention realizes the replacement of the gas channel by the supporting rod obstructing the displacement of the float, so that the auxiliary suction plate can not only assist the blue film to fit with the wafer, but also turn over the wafer with the blue film attached, facilitating subsequent cutting. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is the overall three-dimensional structural schematic diagram of the present invention Figure 1 ;

[0021] Figure 2 is the Figure 1 partial enlarged structural schematic diagram of part A in the present invention;

[0022] Figure 3 is a schematic diagram of the overall three-dimensional structure of the present invention Figure 2 ;

[0023] Figure 4 is of the present invention Figure 3 schematic diagram of the locally enlarged structure at position B in

[0024] Figure 5 is of the present invention Figure 3 schematic diagram of the locally enlarged structure at position C in

[0025] Figure 6 is a schematic diagram of the internal structure of the present invention

[0026] Figure 7 is of the present invention Figure 6 schematic diagram of the locally enlarged structure at position D in

[0027] Figure 8 is of the present invention Figure 6 schematic diagram of the locally enlarged structure at position E in

[0028] Figure 9 is of the present invention Figure 6 schematic diagram of the locally enlarged structure at position F in

[0029] Figure 10 is of the present invention Figure 6 schematic diagram of the locally enlarged structure at position G in

[0030] Figure 11 is a schematic diagram of the internal structure of Channel 3 of the present invention

[0031] Figure 12 is of the present invention Figure 11 schematic diagram of the locally enlarged structure at position H in

[0032] Figure 13 is of the present invention Figure 11 schematic diagram of the locally enlarged structure at position J in

[0033] In the figure: 1. auxiliary suction plate; 2. first mounting ring; 3. main suction plate; 4. limit protection rod; 5. first annular channel; 6. ventilation cylinder; 7. first slide rod; 8. Y-shaped slide rod; 9. second channel; 10. base; 11. third channel; 12. fourth channel; 13. first ventilation pipe; 14. first connecting rod; 15. first mounting plate; 16. first gear; 17. supporting rod; 18. first mounting block; 19. first shaft rod; 20. first connection port; 21. first motor; 22. first driving rack; 23. suction port; 24. first rotating ring; 25. circular mounting plate; 26. first sealing slide plate; 27. driving gear ring; 28. second connecting rod; 29. second rack; 30. second mounting plate; 31. third mounting plate; 32. first bevel gear; 33. tooth column; 34. second bevel gear; 35. third gear; 36. first sealing plate; 37. sealing ring; 38. fan; 39. fifth channel; 40. float; 41. first air port; 42. second mounting ring; 43. sixth channel; 44. fourth connecting rod; 45. second air port; 46. fixed ring plate; 47. fifth fixing plate; 48. fifth gear; 49. second motor; 50. third air port; 51. second connection port; 52. second sealing plate; 53. tension spring; 54. sixth gear. Specific implementation manner

[0034] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0035] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0036] Refer to Figures 1 - 13, a non-contact wafer fixture applicable to thin wafers, comprising a base 10. The outer wall of the top of the base 10 is rotatably connected to a third channel 11. The outer wall of the top of the third channel 11 is rotatably connected to a fourth channel 12. The outer wall of the top of the fourth channel 12 is fixedly connected to an air vent cylinder 6. A sealing slide plate one 26 is slidably connected to the inner wall of the air vent cylinder 6. A fixed ring plate 46 is slidably connected to the inner wall of the sealing slide plate one 26. The fixed ring plate 46 is fixedly connected to the inner wall of the air vent cylinder 6 through a set link. The outer wall of the top of the fixed ring plate 46 is fixedly connected to a main suction plate 3. An installation ring one 2 is slidably connected to the outer wall of the main suction plate 3. The outer wall of the bottom of the installation ring one 2 is fixedly connected to a transmission gear ring 27. A gear five 48 is meshed with the outer wall of the transmission gear ring 27. The outer wall of the gear five 48 is fixedly connected to a motor two 49. The outer wall of the motor two 49 is fixedly connected to a fixing plate five 47. The outer wall of the fixing plate five 47 is fixedly connected to the bottom of the main suction plate 3. A fifth channel 39 is arranged inside the fixed ring plate 46. The fifth channel 39 is fixedly connected to the outer wall of the bottom of the main suction plate 3. A float 40 is slidably connected to the inner wall of the fifth channel 39. A plurality of uniformly distributed first air ports 41 are arranged on the inner wall of the float 40. Three uniformly distributed second air ports 45 are arranged below the float 40. Two symmetrically distributed sixth channels 43 are communicated with the outer wall of the fifth channel 39. One end of each of the two sixth channels 43 far from the fifth channel 39 is fixedly connected to a second connection port 51. An installation ring two 42 is rotatably connected to the outer wall of the sealing slide plate one 26. A first rotating ring 24 is arranged below the two sixth channels 43. The first rotating ring 24 is rotatably connected to the outer wall of the air vent cylinder 6. The outer wall of the bottom of the main suction plate 3 is fixedly connected to a circular installation plate 25. Two limit protection rods 4 are slidably connected to the inner wall of the circular installation plate 25. Four air ports three 50 are arranged on the outer wall of the circular installation plate 25. An annular channel one 5 is rotatably connected to the outer wall of the circular installation plate 25. Two symmetrically distributed first ventilation pipes 13 are fixedly connected to the outer wall of the annular channel one 5. Two dual-purpose mechanisms are arranged on the outer wall of the installation ring one 2 in a circumferential array distribution.

[0037] Among them, the dual-purpose mechanism includes a secondary suction plate 1, a first slide bar 7, a first shaft rod 19, a first mounting block 18, a first motor 21, a first connection port 20, the first shaft rod 19 and a tooth column 33. The first slide bar 7 is slidably connected to the inner wall of the first mounting ring 2. The outer wall of the bottom of the first slide bar 7 is fixedly connected to the first mounting block 18. The top end of the first shaft rod 19 is rotatably connected to the inner wall of the first mounting block 18. The bottom end of the first shaft rod 19 is rotatably connected to the inner wall of the first slide bar 7. The tooth column 33 is fixedly connected to the outer wall of the first shaft rod 19. The first motor 21 is fixedly connected to the outer wall of the first mounting block 18. The output shaft of the first motor 21 is fixedly connected to the secondary suction plate 1. The first connection port 20 is fixedly connected to the secondary suction plate 1. A plurality of uniformly distributed air suction ports 23 are formed in the outer wall of the bottom of the secondary suction plate 1. Rotating mechanisms are arranged on the outer walls of the two tooth columns 33. The two rotating mechanisms are distributed in a circumferential array. The rotating mechanism includes a third gear 35, a second bevel gear 34, a first bevel gear 32, a second mounting plate 30, a third mounting plate 31, a sixth gear 54, a second rack 29 and a second connecting rod 28. The outer wall of the third gear 35 is meshed with the tooth column 33. The second bevel gear 34 is fixedly connected to the third gear 35. The third gear 35 is rotatably connected to the second mounting plate 30. The outer wall of the second bevel gear 34 is meshed with the first bevel gear 32. The outer wall of the first bevel gear 32 is fixedly connected to the sixth gear 54. The sixth gear 54 is rotatably connected to the third mounting plate 31. The third mounting plate 31 is fixedly connected to the second mounting plate 30. The second rack 29 is meshed with the sixth gear 54. The second connecting rod 28 is fixedly connected to the second rack 29. The second rack 29 is slidably connected to the third mounting plate 31.

[0038] In this embodiment, during use, the wafer is placed on the main suction plate 3 with the side of the wafer that needs to be pasted with the blue film facing upwards. Then, the blue film ring loaded with the blue film is placed on the wafer. Subsequently, the blower 38 starts to suck air, so that the negative pressure sucks the float 40 onto the support rod 17. At the same time, through the second air port 45 and the first air port 41, the main suction plate 3 forms an adsorption force on the wafer. As the float 40 moves downward, the fourth connecting rod 44 will drive the sealing slide plate 1 downward, so that the second mounting ring 42 on the sealing slide plate 1 drives the two second connecting rods 28 downward. The two second connecting rods 28 drive the sixth gear 54 and the first bevel gear 32 to rotate counterclockwise by ninety degrees as Figure 4As shown in the direction, the first bevel gear 32 drives the third gear 35 to rotate 90 degrees clockwise through the second bevel gear 34. The third gear 35 drives the auxiliary suction plate 1 to rotate 90 degrees through the tooth column 33 and the first shaft rod 19, so that the two auxiliary suction plates 1 are in a straight line. Subsequently, the second motor 49 starts to rotate. The second motor 49 drives the transmission gear ring 27 to rotate through the fifth gear 48. The transmission gear ring 27 drives the first mounting ring 2 to rotate, so that the two auxiliary suction plates 1 assist in the fitting of the blue film and the wafer, making the fitting effect better. During the rotation, the first transmission rack 22 will drive the first gear 16 to rotate. The first gear 16 drives the two support rods 17 to move away from each other, so that the two support rods 17 no longer block the float 40. Since the float 40 is subjected to the negative pressure of the blower 38, it will continue to move downward, so that the first air port 41 is no longer connected to the main suction plate 3, but is connected to the two side channels 43. There is a ventilation hose (not shown in the figure) connected between the second connection port 51 and the first connection port 20. Subsequently, the two auxiliary suction plates 1 will adsorb the wafer with the blue film attached. At the same time, the two support rods 17 moving away from each other will cause the two first connecting rods 14 to drive the two first sealing plates 36 to move, so that the two first sealing plates 36 seal the fourth channel 12. At the same time, the first sealing plate 36 will drive the two second sealing plates 52 to open, so that the air generated by the negative pressure is blown into the third channel 11 and the second channel 9. As the gas gradually increases, the two Y-shaped slide rods 8 will also be pushed out, so that the two first slide rods 7 gradually rise along the Y-shaped slide rods 8. When reaching the topmost point, the two first motors 21 start to rotate 180 degrees to turn the wafer over for subsequent cutting.

[0039] Among them, both of the two mounting plates II 30 are fixedly connected to the first rotating ring 24, both of the two connecting rods II 28 are fixedly connected to the first rotating ring 24, the bottom outer walls of both of the two first sliding rods 7 are slidably connected with Y-shaped sliding rods 8, the outer walls of both of the two Y-shaped sliding rods 8 are slidably connected with second channels 9, both of the two second channels 9 are communicated with a third channel 11, the third channel 11 is communicated with a fourth channel 12, the fourth channel 12 is communicated with a blower 38, the blower 38 is communicated with an air vent cylinder 6, two sealing rings 37 are fixedly connected to the outer wall of the fourth channel 12, two switching mechanisms distributed symmetrically are fixedly connected to the outer wall of the air vent cylinder 6, the switching mechanism includes a first mounting plate 15, a first gear 16, a support rod 17, a first connecting rod 14, a first sealing plate 36 and a second sealing plate 52, the first mounting plate 15 is fixedly connected to the outer wall of the air vent cylinder 6, the first gear 16 is rotatably connected to the first mounting plate 15, the support rod 17 is slidably connected to the first mounting plate 15, the support rod 17 is meshed with the outer wall of the first gear 16, the outer wall of the support rod 17 is fixedly connected to the first connecting rod 14, the first sealing plate 36 is fixedly connected to the first connecting rod 14, the second sealing plate 52 is fixedly connected to the first sealing plate 36, one end of the first ventilation pipe 13 far from the circular mounting plate 25 is communicated with the third channel 11, a tension spring 53 is fixedly connected between both of the two Y-shaped sliding rods 8, two drive racks I 22 distributed in a circumferential array are fixedly connected to the outer wall of the first mounting ring 2, two symmetrically distributed fourth connecting rods 44 are fixedly connected to the bottom outer wall of the float 40, and one end of the fourth connecting rod 44 far from the float 40 is fixedly connected to the first sealing slide plate 26.

[0040] In this embodiment, after the turning over is completed, the blower 38 stops operating, and the second motor 49 continues to rotate so that the first ventilation pipe 13 is communicated with the third air port 50 near the first gear 16. Since the tension spring 53 between both of the two Y-shaped sliding rods 8 will reset both of the two Y-shaped sliding rods 8 directly, the internal gas will enter the third air port 50 along the first ventilation pipe 13. When the first ventilation pipe 13 is not docked with the third air port 50, the first ventilation pipe 13 is in a closed state, so that the limiting and protecting rod 4 inside the circular mounting plate 25 extends out. After the limiting and protecting rod 4 completely extends out, the upper surface of the limiting and protecting rod 4 will be higher than the auxiliary suction plate 1. At this time, the limiting and protecting rod 4 plays a role in limiting the wafer. Subsequently, the second motor 49 rotates in the reverse direction so that the auxiliary suction plate 1 is located between the first gear 16 and the third air port 50, and the blower 38 sucks air in the reverse direction. The remaining gas blows the float 40 up, so that both of the two auxiliary suction plates 1 are reset. At the same time, the blown-up gas flows out through the main suction plate 3, playing a role in supporting the descent of the wafer. Subsequently, the limiting and protecting rod 4 slowly descends, and the second motor 49 rotates to reset the first mounting ring 2, and the first motor 21 flips to facilitate the next clamping.

[0041] The following is a detailed explanation of the specific working principle and usage method of the present invention: When in use, place the wafer on the main suction plate 3 with the side of the wafer that needs to be pasted with the blue film facing upwards. Then place the blue film ring loaded with the blue film on the wafer. Subsequently, the blower 38 starts to inhale air, so that the negative pressure sucks the float 40 onto the support rod 17. At the same time, through the second air port 45 and the first air port 41, the main suction plate 3 forms an adsorption force on the wafer. As the float 40 moves downward, the fourth connecting rod 44 will drive the first sealing slide plate 26 to move downward, so that the second mounting ring 42 on the first sealing slide plate 26 drives the two second connecting rods 28 to move downward. The two second connecting rods 28 drive the sixth gear 54 and the first bevel gear 32 to rotate counterclockwise by ninety degrees (as shown in the Figure 4 direction), the first bevel gear 32 drives the third gear 35 to rotate clockwise by ninety degrees through the second bevel gear 34. The third gear 35 drives the auxiliary suction plate 1 to rotate by ninety degrees through the tooth column 33 and the first shaft rod 19, so that the two auxiliary suction plates 1 are in a straight line. Subsequently, the second motor 49 starts to rotate. The second motor 49 drives the transmission gear ring 27 to rotate through the fifth gear 48. The transmission gear ring 27 drives the first mounting ring 2 to rotate, so that the two auxiliary suction plates 1 assist in the fitting of the blue film and the wafer, making the fitting effect better.

[0042] During the rotation process, the first transmission rack 22 will drive the first gear 16 to rotate. The first gear 16 drives the two support rods 17 to move away from each other, so that the two support rods 17 no longer obstruct the float 40. Since the float 40 is affected by the negative pressure of the blower 38, it will continue to move downward, so that the first air port 41 is no longer connected to the main suction plate 3, but is connected to the two side channels 43. There is a ventilation hose (not shown in the figure) connected between the second connection port 51 and the first connection port 20. Subsequently, the two auxiliary suction plates 1 will adsorb the wafer pasted with the blue film. At the same time, the two support rods 17 moving away from each other will drive the two first connecting rods 14 to drive the two first sealing plates 36 to move, so that the two first sealing plates 36 seal the fourth channel 12. At the same time, the first sealing plate 36 will drive the two second sealing plates 52 to open, so that the air generated by the negative pressure is blown into the third channel 11 and the second channel 9. As the gas gradually increases, the two Y-shaped slide rods 8 will also be pushed out, so that the two first slide rods 7 gradually rise along the Y-shaped slide rods 8. When reaching the highest point, the two first motors 21 start to rotate by one hundred and eighty degrees to turn the wafer over for subsequent cutting.

[0043] After the turning over is completed, the fan 38 stops running, and the second motor 49 continues to rotate so that the first ventilation pipe 13 communicates with the third air port 50 near the first gear 16. Since the tension spring 53 between the two Y-shaped sliding rods 8 will reset the two Y-shaped sliding rods 8 immediately, the internal gas will enter the third air port 50 along the first ventilation pipe 13. When the first ventilation pipe 13 is not docked with the third air port 50, the first ventilation pipe 13 is in a closed state, so that the limit protection rod 4 inside the circular mounting plate 25 extends out. After the limit protection rod 4 completely extends out, the upper surface of the limit protection rod 4 will be higher than the auxiliary suction plate 1. At this time, the limit protection rod 4 plays a role in limiting the wafer. Subsequently, the second motor 49 rotates in the reverse direction so that the auxiliary suction plate 1 is located between the first gear 16 and the third air port 50, and the fan 38 sucks air in the reverse direction. The remaining gas blows the float 40 up, so that the two auxiliary suction plates 1 are reset. At the same time, the blown-up gas flows out through the main suction plate 3, playing a role in supporting the descent of the wafer. Subsequently, the limit protection rod 4 slowly drops, and the second motor 49 rotates to reset the first mounting ring 2, and the first motor 21 flips to facilitate the next clamping.

[0044] Further explanation, the above fixed connection, unless otherwise clearly specified and limited, should be understood in a broad sense. For example, it can be welding, gluing, or integrally formed setting, etc., which are common means well-known to those skilled in the art.

[0045] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. A non-contact wafer clamp suitable for thin wafers, comprising a base, characterized in that: The top outer wall of the base is rotatably connected with channel three, the top outer wall of channel three is rotatably connected with channel four, the top outer wall of channel four is fixedly connected with a ventilator, the inner wall of the ventilator is slidably connected with a sealing slide plate one, the inner wall of the sealing slide plate one is slidably connected with a fixed ring plate, the fixed ring plate is fixedly connected to the inner wall of the ventilator through a set connecting rod, the top outer wall of the fixed ring plate is fixedly connected with the main suction plate, the outer wall of the main suction plate is slidably connected with a mounting ring one, the bottom outer wall of the mounting ring one is fixedly connected with a transmission gear ring, the outer wall of the transmission gear ring is meshed with a gear five, the outer wall of the gear five is fixedly connected with a motor two, the outer wall of the motor two is fixedly connected with a fixed plate five, the outer wall of the fixed plate five is fixedly connected to the bottom of the main suction plate, a channel five is arranged inside the fixed ring plate, the channel five is fixedly connected to the bottom outer wall of the main suction plate, the inner wall of the channel five is slidably connected with a float, and the inner wall of the float is provided with a number of evenly distributed air ports 1. Three evenly distributed air ports 2 are provided below the float, the outer wall of channel 5 is connected with two symmetrically distributed channels 6, the two channels 6 are fixedly connected with a connecting port 2 at one end away from channel 5, the outer wall of the sealing slide plate 1 is rotatably connected with a mounting ring 2, the same rotating ring 1 is provided below the two channels 6, the rotating ring 1 is rotatably connected to the outer wall of the ventilator, a circular mounting plate is fixedly connected to the outer wall of the bottom of the main suction plate, the inner wall of the circular mounting plate is slidably connected with two limit protection rods, four air ports 3 are provided on the outer wall of the circular mounting plate, the outer wall of the circular mounting plate is rotatably connected with an annular channel 1, the outer wall of the annular channel 1 is fixedly connected with two symmetrically distributed ventilation pipes 1, the outer wall of the mounting ring 1 is provided with two dual-purpose mechanisms distributed in a circular array, the dual-purpose mechanism includes an auxiliary suction plate, a sliding rod 1, a first shaft rod, a mounting block 1, a motor 1, a connecting port 1, a first shaft rod and a gear column.

2. A non-contact wafer clamp suitable for thin wafers according to claim 1, characterized in that: The slide rod 1 is slidably connected to the inner wall of the mounting ring 1, the bottom outer wall of the slide rod 1 is fixedly connected to the mounting block 1, the top of the first shaft rod is rotatably connected to the inner wall of the mounting block 1, the bottom end of the first shaft rod is rotatably connected to the inner wall of the slide rod 1, the gear column is fixedly connected to the outer wall of the first shaft rod, the motor 1 is fixedly connected to the outer wall of the mounting block 1, the output shaft of the motor 1 is fixedly connected to the auxiliary suction plate, the connecting port 1 is fixedly connected to the auxiliary suction plate, and a plurality of evenly distributed suction ports are provided on the bottom outer wall of the auxiliary suction plate.

3. A non-contact wafer clamp suitable for thin wafers according to claim 2, characterized in that: The outer walls of the two gear columns are provided with a rotating mechanism, and the two rotating mechanisms are distributed in a circular array. The rotating mechanism includes gear three, a second bevel gear, a first bevel gear, a mounting plate two, a mounting plate three, a gear six, a second rack and a connecting rod two. The outer wall of gear three is meshed with the gear column, the second bevel gear is fixedly connected to gear three, gear three is rotatably connected to mounting plate two, the outer wall of the second bevel gear is meshed with the first bevel gear, the outer wall of the first bevel gear is fixedly connected to gear six, gear six is ​​rotatably connected to mounting plate three, mounting plate three is fixedly connected to mounting plate two, the second rack is meshed with gear six, connecting rod two is fixedly connected to the second rack, and the second rack is slidably connected to mounting plate three.

4. The non-contact wafer clamp suitable for thin wafers according to claim 3, characterized in that: The two mounting plates 2 are fixedly connected to the rotating ring 1, the two connecting rods 2 are fixedly connected to the rotating ring 1, the bottom outer walls of the two sliding rods 1 are slidably connected with Y-shaped sliding rods, the outer walls of the two Y-shaped sliding rods are slidably connected with channel 2, the two channels 2 are connected with channel 3, channel 3 is connected with channel 4, channel 4 is connected with the fan, the fan is connected with the ventilator, and the outer wall of channel 4 is fixedly connected with two sealing rings.

5. The non-contact wafer clamp suitable for thin wafers according to claim 4, characterized in that: The outer wall of the vent cylinder is fixedly connected to two symmetrically distributed switching mechanisms, which include a mounting plate 1, a gear 1, a support rod, a connecting rod 1, a sealing plate 1 and a sealing plate 2. The mounting plate 1 is fixedly connected to the outer wall of the vent cylinder, the gear 1 is rotatably connected to the mounting plate 1, the support rod is slidably connected to the mounting plate 1, and the support rod is meshed with the outer wall of the gear 1.

6. The non-contact wafer clamp suitable for thin wafers according to claim 5, characterized in that: The outer wall of the supporting rod is fixedly connected to the connecting rod 1, the sealing plate 1 is fixedly connected to the connecting rod 1, and the sealing plate 2 is fixedly connected to the sealing plate 1.

7. The non-contact wafer clamp suitable for thin wafers according to claim 4, characterized in that: One end of the ventilation pipe 1 away from the circular mounting plate is communicated with the channel 3, and a tension spring is fixedly connected between the two Y-shaped sliding rods.

8. The non-contact wafer clamp suitable for thin wafers according to claim 1, characterized in that: The outer wall of the mounting ring 1 is fixedly connected to two transmission racks 1 distributed in a circumferential array, and the bottom outer wall of the float is fixedly connected to two symmetrically distributed connecting rods 4, and one end of the connecting rod 4 away from the float is fixedly connected to the sealing slide 1.

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