A method for manufacturing a Teflon high-frequency circuit board

Abstract

The present invention provides a method for manufacturing a Teflon high-frequency circuit board, comprising the following steps: material delivery → pinning → primary drilling → high-pressure washing → primary electroplating → resin plugging / grinding → primary dry film → primary etching → browning → solder mask → ink printing → primary visual inspection → electrosilver plating → ink removal → secondary dry film → secondary etching → secondary drilling → scooping → finished product cleaning → secondary visual inspection → packaging. During the pinning step, the Teflon sheet is clamped with copper-free sleeves at the top and bottom, pinned with a wooden backing plate at the bottom, and then the aluminum sheet is attached to the copper-free sleeve on a subsequent drilling rig for drilling. During pinning, the smooth surface of the copper-free sleeve is in close contact with the surface of the Teflon sheet to prevent damage to the Teflon sheet during drilling. After the primary drilling step, the Teflon sheet is subjected to plasma debonding. After completion, foam is sandwiched between two Teflon sheets and the sheets are arranged vertically. This improves the quality of the Teflon high-frequency circuit.

Description

Technical Field

[0001] The present invention relates to the field of circuit board processing, and in particular to a method for manufacturing a Teflon high-frequency circuit board. Background Art

[0002] The Chinese patent application publication number is CN 103874331 A, and the application publication date is June 18, 2014. It discloses a method for manufacturing a Teflon high-frequency circuit board. The key points of its technical solution are to use a negative film development and etching process after the board is electroplated to directly etch out the circuit part, reducing the graphic electroplating process, saving production time, and effectively saving production costs. At the same time, it can make more sophisticated circuits. In the forming process, a double-edged milling cutter gong plate is used to effectively avoid quality defects such as sharp edges and burrs, and the number of milling cutters used is reduced, saving production costs. At the same time, in the drilling and gong plate processes, phenolic resin pads are placed on the upper and lower sides of the circuit board to reduce quality problems such as board bending. The existing method has the following drawbacks: Teflon is a thermoplastic material and the sheet is relatively soft. During the actual production process, it is easily crushed by dust, which affects signal transmission. In addition, Teflon sheet has a very low surface energy, making it difficult for other materials to adhere to it. The surface of the treated Teflon sheet is easily re-contaminated by pollutants in the air. Over time, a new fluoride layer will form, further reducing the surface adhesion. For high-frequency circuit boards, the circuit diagram itself is also very demanding. These problems cannot be effectively solved by the existing technology. Given this situation, improvement is urgently needed. Summary of the Invention

[0003] In response to the above problems, the present invention provides a method for manufacturing a Teflon high-frequency circuit board, which improves the manufacturing steps and directly improves product quality.

[0004] To achieve the above object, the present invention solves it through the following technical solutions:

[0005] A method for manufacturing a Teflon high-frequency circuit board, comprising the following steps: material delivery → PIN application → primary drilling → high-pressure washing → primary electroplating → resin plugging / grinding → primary dry film → primary etching → browning → solder mask → ink printing → primary visual inspection → electrosilver plating → ink removal → secondary dry film → secondary etching → secondary drilling → molding → finished product cleaning → secondary visual inspection → packaging;

[0006] In the pinning step, the Teflon sheet is clamped with copper-free sleeves at the top and bottom, and pinned with a wooden backing plate at the bottom. The aluminum sheet is then attached to the copper-free sleeve on a subsequent drilling rig and drilled. During the pinning, the smooth surface of the copper-free sleeve is in close contact with the surface of the Teflon sheet to prevent the Teflon sheet from being crushed during drilling.

[0007] After the drilling step, the Teflon sheet needs to be plasma debonded. After the debonding, foam is sandwiched between two Teflon sheets and the sheets are placed vertically. After the plasma debonding, the Teflon sheet needs to be electroplated within 5 hours.

[0008] In the resin plugging / grinding step, the resin plugging uses explosion-proof resin ink and is baked at 170°C for 2 hours before plugging. A belt sander is used for grinding, and a belt equal to or greater than 600 mesh is used for grinding. Pearl cotton is placed upright between the two Teflon sheets after grinding.

[0009] After the etching step, foam is sandwiched between two Teflon sheets and placed upright;

[0010] Before the browning step, two pieces of copper plates are placed in the plate surface to check for scratches. The browning step is started only after confirming that there are no scratches.

[0011] In the ink printing step, the oxide layer on the board surface needs to be cleaned by micro-etching before printing. During printing, a smooth sticky paper needs to be pasted on the printing machine table to prevent the uneven table surface from damaging the board surface. After post-baking, the two boards are placed upright with pearl cotton sandwiched between them.

[0012] During the silver electroplating step, sulfur-free paper needs to be placed between the two electroplated plates.

[0013] During the secondary drilling step, the upper and lower sides of the plate are clamped with copper-free baseboards, and a wooden pad is placed under the lower copper-free baseboard; all copper-free baseboards can only be used once;

[0014] In the shaping step, the boards are placed in a manner of sandwiching a piece of kraft paper between two boards. After multiple layers are stacked, a bare base board is placed on the top and bottom, and a pad is placed under the bare base board at the bottom.

[0015] Preferably, in the PIN step, the thickness of the copper-free sleeve is 0.9 to 1.2 mm.

[0016] Preferably, in the high pressure washing step, 60kg / cm 2 High pressure cleaning is performed with the water pressure of 1000 psi.

[0017] Preferably, the ink printing step needs to be completed within 6 hours after the first etching step.

[0018] Preferably, in the ink printing step, the pre-baking condition is set to 80°C / 30min, and the post-baking condition is set to 150°C / 20min.

[0019] Preferably, in the de-inking step, alkaline etching is used for de-inking, and the de-inking speed is set to 4.0 m / min.

[0020] Preferably, in the secondary film drying step, micro-etching is used as pre-treatment, and the conveying speed is 2.0 m / min; after the pre-treatment, the film is pressed within 2 hours, and the pressing speed is 2.5 m / min.

[0021] Preferably, in the shaping step, the thickness of the bare substrate is set to 0.6 mm.

[0022] The beneficial effects of the present invention are: ensuring the cleanliness of the Teflon sheet during the production process, and being free of burrs, burrs, residual copper and the like, thereby directly improving the quality of the Teflon high-frequency circuit board. DETAILED DESCRIPTION

[0023] The present invention will be further described in detail below with reference to examples, but the embodiments of the present invention are not limited thereto.

[0024] A method for manufacturing a Teflon high-frequency circuit board, comprising the following steps: material delivery → PIN application → primary drilling → high-pressure washing → primary electroplating → resin plugging / grinding → primary dry film → primary etching → browning → solder mask → ink printing → primary visual inspection → electrosilver plating → ink removal → secondary dry film → secondary etching → secondary drilling → molding → finished product cleaning → secondary visual inspection → packaging;

[0025] In the pinning step, the Teflon sheet is clamped with copper-free sleeves at the top and bottom. The thickness of the copper-free sleeve is 0.9 to 1.2 mm. The bottom is pinned with a wooden backing plate. The aluminum sheet is then attached to the copper-free sleeve on a subsequent drilling rig and drilled. During the pinning, the smooth surface of the copper-free sleeve is in close contact with the surface of the Teflon sheet to prevent the Teflon sheet from being crushed during drilling.

[0026] After the drilling step, the Teflon sheet needs to be plasma debonded to increase the roughness of the Teflon sheet surface and increase the contact area between it and other materials, thereby improving the adhesion quality of the hole copper; after completion, foam needs to be sandwiched between two Teflon sheets and placed upright to isolate dust; after plasma debonding, the Teflon sheet needs to be electroplated within 5 hours to prevent the surface of the Teflon sheet from being contaminated again and reducing adhesion;

[0027] In the high pressure washing step, 60kg / cm 2 High pressure cleaning is performed with water pressure to clean the powder chips left after drilling;

[0028] During the resin plugging / grinding step, the resin plugging uses explosion-proof resin ink to avoid explosion, and is baked at 170°C for 2 hours before plugging. During grinding, a belt sander is used, and a belt equal to or greater than 600 mesh is used for grinding to avoid dents. Pearl cotton is placed upright between the two Teflon sheets after grinding to isolate dust.

[0029] After the etching step, foam should be placed between two Teflon sheets to isolate dust and avoid scratches.

[0030] Before the browning step, two pieces of copper plates are placed in the plate surface to check for scratches. The browning step is started only after confirming that there are no scratches.

[0031] The ink printing step must be completed within 6 hours after the first etching step; in the ink printing step, the oxide layer on the board surface must be cleaned by micro-etching before printing, and a smooth sticky paper must be attached to the printing machine table during printing to prevent the uneven table surface from damaging the board surface; after post-baking, the two boards are placed upright with pearl cotton sandwiched between them; the pre-baking conditions are set to 80°C / 30min, and the post-baking conditions are set to 150°C / 20min;

[0032] During the silver electroplating step, sulfur-free paper needs to be placed between the two electroplated plates.

[0033] In the de-inking step, alkaline etching is used for de-inking, and the de-inking speed is set to 4.0 m / min.

[0034] In the secondary dry film step, micro-etching is used as pre-treatment, and the conveying speed is 2.0 m / min; after the pre-treatment, the film is pressed within 2 hours, and the pressing speed is 2.5 m / min.

[0035] During the secondary drilling step, the upper and lower sides of the plate are clamped with copper-free baseboards, and a wooden pad is placed under the lower copper-free baseboard; all copper-free baseboards can only be used once;

[0036] During the molding process, the sheets are placed with a layer of kraft paper between each other. After stacking the sheets, a plain base plate is placed at the top and bottom, and a backing plate is placed under the bottom base plate. The base plate is set to 0.6mm thick. This stacking ensures that burrs are not formed during molding.

[0037] This embodiment ensures the cleanliness of the Teflon sheet during the production process and eliminates burrs, rough edges, residual copper, etc., thereby directly improving the quality of the Teflon high-frequency circuit board.

[0038] The above embodiment merely represents one embodiment of the present invention, and while the description is relatively specific and detailed, it should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the scope of the present invention, and these modifications and improvements fall within the scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A method for manufacturing a Teflon high-frequency circuit board, comprising the following steps: material delivery → PIN application → primary drilling → high-pressure washing → primary electroplating → resin plugging / grinding → primary dry film → primary etching → browning → solder mask → ink printing → primary visual inspection → electrosilver plating → ink removal → secondary dry film → secondary etching → secondary drilling → molding → finished product cleaning → secondary visual inspection → packaging; characterized in that: In the pinning step, the Teflon sheet is clamped with copper-free sleeves at the top and bottom, and pinned with a wooden backing plate at the bottom. The aluminum sheet is then attached to the copper-free sleeve on a subsequent drilling rig and drilled. During the pinning, the smooth surface of the copper-free sleeve is in close contact with the surface of the Teflon sheet to prevent the Teflon sheet from being crushed during drilling. After the drilling step, the Teflon sheet needs to be plasma debonded. After the debonding, foam is sandwiched between two Teflon sheets and the sheets are placed vertically. After the plasma debonding, the Teflon sheet needs to be electroplated within 5 hours. In the resin plugging / grinding step, the resin plugging uses explosion-proof resin ink and is baked at 170°C for 2 hours before plugging. A belt sander is used for grinding, and a belt equal to or greater than 600 mesh is used for grinding. Pearl cotton is placed upright between the two Teflon sheets after grinding. After the etching step, foam is sandwiched between two Teflon sheets and placed upright; Before the browning step, two pieces of copper plates are placed in the plate surface to check for scratches. The browning step is started only after confirming that there are no scratches. In the ink printing step, the oxide layer on the board surface needs to be cleaned by micro-etching before printing. During printing, a smooth sticky paper needs to be pasted on the printing machine table to prevent the uneven table surface from damaging the board surface. After post-baking, the two boards are placed upright with pearl cotton sandwiched between them. During the silver electroplating step, sulfur-free paper needs to be placed between the two electroplated plates. During the secondary drilling step, the upper and lower sides of the plate are clamped with copper-free baseboards, and a wooden pad is placed under the lower copper-free baseboard; all copper-free baseboards can only be used once; In the shaping step, the boards are placed in a manner of sandwiching a piece of kraft paper between two boards. After multiple layers are stacked, a bare base board is placed on the top and bottom, and a pad is placed under the bare base board at the bottom.

2. The method for manufacturing a Teflon high-frequency circuit board according to claim 1, characterized in that: In the PIN step, the thickness of the copper-free plate is 0.9 to 1.2 mm.

3. The method for manufacturing a Teflon high-frequency circuit board according to claim 1, characterized in that: The ink printing step needs to be completed within 6 hours after the first etching step.

4. The method for manufacturing a Teflon high-frequency circuit board according to claim 1, characterized in that: In the ink printing step, the pre-bake condition is set to 80°C / 30min, and the post-bake condition is set to 150°C / 20min.

5. The method for manufacturing a Teflon high-frequency circuit board according to claim 1, characterized in that: In the de-inking step, alkaline etching is used for de-inking, and the de-inking speed is set to 4.0 m / min.

6. The method for manufacturing a Teflon high-frequency circuit board according to claim 1, characterized in that: In the secondary dry film step, micro-etching is used as pre-treatment, and the conveying speed is 2.0 m / min; after the pre-treatment, the film is pressed within 2 hours, and the pressing speed is 2.5 m / min.

7. The method for manufacturing a Teflon high-frequency circuit board according to claim 1, characterized in that: In the shaping step, the thickness of the bare substrate is set to 0.6 mm.