A thin conductive plate forming mold and a thin conductive plate strengthening and toughening forming process

Abstract

The present application belongs to the technical field of material forming, and provides a thin conductive plate forming die and a thin conductive plate strengthening and toughening forming process, wherein the thin conductive plate forming die includes a rough forging die, an intermediate die and a fine forging die. Among them, the rough forging die forms a first cavity with a volume greater than the volume of the conductive plate and has a first forming surface for forming the first cavity; the intermediate die forms a second cavity with a volume equal to the volume of the conductive plate and has a second forming surface for forming the second cavity; the fine forging die forms a third cavity with the same shape as the conductive plate; the present technical solution creatively adopts a combination of hot forging and two cold forgings, the plate part adopts regional hardening, and adopts an arc surface structure design, which can achieve the effect of improving the hardness of the conductive plate part and the uniformity of hardness distribution with a smaller equipment tonnage.

Description

Technical Field

[0001] The present application belongs to the technical field of material forming, and in particular relates to a thin conductive plate forming die and a thin conductive plate strengthening and toughening forming process. Background Art

[0002] In the electronics and electrical industry, thin conductive plates made of copper are widely used due to their excellent electrical and thermal conductivity. However, the copper material itself has a low hardness, and this property becomes a key factor limiting its performance in application scenarios that need to withstand certain mechanical stresses or wear. Traditionally, the idea of ​​improving the hardness of metals is to achieve it through heat treatment, but the hardness of copper materials cannot be improved through heat treatment. For parts with simple shapes such as straight strips or cylindrical rods, the hardness can be improved by cold rolling or cold extrusion, but for thin conductive plates with complex shapes such as outward lugs, the above methods cannot be used to increase the local hardness of the plate surface. Therefore, after many experiments and research and development, the applicant has designed a thin conductive plate forming mold and a thin conductive plate toughening forming process to solve the above technical problems. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide a thin conductive plate forming mold to solve the technical problem in the prior art that it is difficult to increase the hardness of the conductive plate surface.

[0004] To achieve the above purpose, the technical solution adopted in the present application is: to provide a thin conductive plate forming mold for forming a conductive plate 100, wherein the conductive plate 100 has a plate portion 101 with uniform thickness and a lug 102 for processing a target connection hole, comprising:

[0005] The rough forging die 200 forms a first cavity 201 with a volume larger than that of the conductive plate 100 and has a first molding surface 202 for forming the first cavity 201. The first molding surface 202 is a concave arc surface. The first molding surface 202 is used to mold the rough blank of the plate portion 101. The target thickness area of ​​the rough blank of the plate portion 101 is a convex arc area formed by the middle depth of the first molding surface 202 being greater than the edge depth of the first molding surface 202.

[0006] The middle die 300 forms a second cavity 301 with a volume equal to that of the conductive plate 100 and has a second molding surface 302 for forming the second cavity 301. The second molding surface 302 is an outwardly convex arc surface. The second molding surface 302 is used to perform secondary molding on the rough blank of the plate portion 101 to form the fine forging blank of the plate portion 101. The target thickness area of ​​the fine forging blank of the plate portion 101 is a concave arc area formed by the middle depth of the second molding surface 302 being less than the edge depth of the second molding surface 302.

[0007] The precision forging die 400 forms a third cavity 401 having the same shape as the conductive plate 100 and is used to flatten the concave arc region of the precision forging blank of the plate portion 101 to form the plate portion 101;

[0008] Assuming that the middle thickness of the rough blank of the plate portion 101 is a1, the edge thickness of the rough blank of the plate portion 101 is b1, the middle thickness of the fine forging blank of the plate portion 101 is a2, the edge thickness of the fine forging blank of the plate portion 101 is b2, and the target thickness of the plate portion 101 is c, then a1-(0.5~0.7)=c=b1-(0.1~0.2), b2-(0.1~0.3)=c=a2+(0.1~0.3).

[0009] Optionally, a first flash groove 203 is formed on the rough forging die 200 and is communicated with the first cavity 201 and is used to accommodate excess material.

[0010] Optionally, the first flash groove 203 is disposed around the first cavity 201 and is spaced apart from the first cavity 201 .

[0011] Optionally, a second flash groove 303 is formed on the middle mold 300 and is connected to the second cavity 301 and is used to accommodate excess material.

[0012] Optionally, the second flash groove 303 is disposed around the second cavity 301 and is adjacent to the second cavity 301 .

[0013] The present application also provides a thin conductive plate toughening molding process, which uses the above-mentioned thin conductive plate molding mold to toughen the thin conductive plate, comprising the following steps:

[0014] 1) Design the finishing forging die 400 according to the target thickness c of the plate portion 101 of the three-dimensional model of the finished conductive plate 100, design the rough blank and finishing forging blank including at least the thickness parameters of the middle thickness a1 of the rough blank of the plate portion 101, the edge thickness b1 of the rough blank of the plate portion 101, the middle thickness a2 of the finishing forging blank of the plate portion 101, and the edge thickness b2 of the finishing forging blank of the plate portion 101, and calculate the diameter of the copper raw material and the blanking length parameters;

[0015] 2) According to the parameters obtained in step 1), the rough forging die 200 and the intermediate die 300 are designed so that at least the corresponding dimensions of the first cavity 201 and the second cavity 301 in the thickness direction satisfy a1-(0.5-0.7)=c=b1-(0.1-0.2), b2-(0.1-0.3)=c=a2+(0.1-0.3);

[0016] 3) Cut the material according to the material diameter and length parameters obtained in step 2) to obtain the raw material blank;

[0017] 4) The raw material blank is heated to 600-800° C. by induction heating, and is placed in the rough forging die 200 for forming and trimming to obtain the rough blank of the plate portion 101;

[0018] 5) Cooling the rough blank of the plate portion 101 obtained in step 4) and performing surface treatment to remove surface oxides and impurities;

[0019] 6) Put the rough blank of the plate part 101 processed in step 5) into the middle die 300 for cold forming for the first strengthening, and obtain the fine forging blank of the plate part 101 after trimming;

[0020] 7) The plate portion 101 obtained in step 6) is placed in the precision forging die 400 for cold finishing to perform a second strengthening and complete the final forming.

[0021] The thin conductive plate forming die provided by the present application has the beneficial effect that: compared with the prior art, the thin conductive plate forming die provided by the present application includes a rough forging die, an intermediate die and a fine forging die. First, the thin conductive plate is rough-formed by a hot forging process to obtain a suitable shape and thickness, especially to form a convex arc-shaped area with a thick middle and thin sides on the plate portion, and a material with a sufficient amount of compression is formed in the middle area of ​​the plate portion when the intermediate die is used to form the plate portion fine forging blank of the thin conductive plate. After forming with the second forming surface of the intermediate die, the hardness of the plate portion can be greatly improved, and the distribution of the hardness is gradually reduced from the middle of the plate portion to the two edges, that is, in the forming step of the intermediate die, the hardness of the middle part of the plate portion is first improved. This has the advantage that when the intermediate die is formed, the protruding part of the second forming surface first contacts with the protruding part of the rough blank, and the maximum deformation can be obtained under the same pressure. Then, as the deformation deepens, the entire cavity surface finally contacts with the material. Due to the convex arc-shaped characteristics of the second forming surface, the material is easily squeezed to the position of the intermediate die close to the second flash groove, that is, it is easy to squeeze the excess material to the second flash groove. Avoid the material being trapped inside the mold, improve the hardness of the plate, make the plate easier to form, and protect the mold; after forming, the plate of the precision forging blank has an inner arc structure. Since the middle of the plate is thin and hard, and the edge is thick and hard, when the leveling action is performed in the third cavity in the precision forging mold, the bottom surface of the third cavity first contacts the edge of the plate. During the closing process of the mold, this part of the material is squeezed to achieve cold hardening, which improves the hardness of this area of ​​the plate. Since the material is also forced to be squeezed to the middle, the middle part becomes thicker while the edge becomes thinner. Finally, the entire plate plane contacts and becomes flat with the bottom surface of the third cavity, completing the molding of the final product, and making the hardness of the plate uniform at all locations while improving the hardness of the plate. Since the middle of the bottom surface of the third cavity contacts the material at the end of molding, the force in the middle part of the mold is reduced. On the one hand, it protects the mold from cracking and damage, and on the other hand, it avoids the unevenness of the plate caused by elastic deformation of the mold.

[0022] Since the volume of the first cavity is larger than that of the conductive plate, the rough forging die is used to leave sufficient cold deformation margin for the intermediate die in the present application, and the volume of the second cavity is consistent with the volume of the conductive plate, so as to provide the precise plate forging blank to the fine forging die, thereby improving the hardness of the conductive plate, ensuring the shape and position tolerance of the product, and avoiding film expansion;

[0023] In addition, this technical solution creatively adopts a combination of hot forging and two cold forgings, the plate part is hardened in different areas, and a curved surface structure design is adopted. It can achieve the effect of improving the hardness and uniformity of hardness distribution of the conductive plate part with a smaller equipment tonnage, and also has the technical effect of prolonging the service life of each mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 A schematic diagram of a rough forging die explosion mechanism provided in an embodiment of the present application;

[0026] Figure 2 A schematic diagram of the cross-sectional structure of a rough forging die provided in an embodiment of the present application;

[0027] Figure 3 This is a schematic diagram of the state of the conductive plate formed by the rough forging die in the embodiment of the present application;

[0028] Figure 4 For along Figure 3 The cross-sectional structure diagram along the AA line;

[0029] Figure 5 A schematic diagram of the intermediate mold explosion mechanism provided in an embodiment of the present application;

[0030] Figure 6 A schematic diagram of the cross-sectional structure of the intermediate mold provided in an embodiment of the present application;

[0031] Figure 7 This is a schematic diagram of the state of the conductive plate formed by the intermediate mold in the embodiment of the present application;

[0032] Figure 8 For along Figure 7 The cross-sectional structure diagram of the middle BB line;

[0033] Fig. 9 A schematic diagram of the precision forging die explosion mechanism provided in an embodiment of the present application;

[0034] Fig.10 This is a schematic diagram of the overall structure of the conductive plate finally formed in the embodiment of the present application;

[0035] Fig.11 This is a front view of the overall structure of the conductive plate finally formed in the embodiment of the present application;

[0036] Fig.12 For along Fig.11 Cross-sectional structural diagram along the CC line.

[0037] Among them, the reference numerals in the figure are: 100, conductive plate; 101, plate part; 102, lug; 200, rough forging die; 201, first cavity; 202, first molding surface; 203, first flash groove; 300, intermediate die; 301, second cavity; 302, second molding surface; 303, second flash groove; 400, fine forging die; 401, third cavity. DETAILED DESCRIPTION

[0038] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0039] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0040] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0041] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0042] Please also read Figures 1 to 12 , now the thin conductive plate forming die provided in the embodiment of the present application is used to form a conductive plate 100, and the conductive plate 100 has a plate portion 101 with uniform thickness and a lug 102 for processing a target connection hole. Specifically, the thin conductive plate forming die includes a rough forging die 200, an intermediate die 300 and a fine forging die 400;

[0043] The rough forging die 200 forms a first cavity 201 with a volume larger than that of the conductive plate 100 and has a first molding surface 202 for forming the first cavity 201. The first molding surface 202 is a concave arc surface. The first molding surface 202 is used to mold a rough blank of the plate portion 101. The target thickness area of ​​the rough blank of the plate portion 101 is a convex arc area formed by the middle depth of the first molding surface 202 being greater than the edge depth of the first molding surface 202.

[0044] The middle die 300 forms a second cavity 301 with a volume equal to that of the conductive plate 100 and has a second molding surface 302 for forming the second cavity 301. The second molding surface 302 is an outwardly convex arc surface. The second molding surface 302 is used to perform secondary molding on the rough blank of the plate portion 101 to form a fine forging blank of the plate portion 101. The target thickness area of ​​the fine forging blank of the plate portion 101 is a concave arc area formed by the middle depth of the second molding surface 302 being less than the edge depth of the second molding surface 302.

[0045] The precision forging die 400 forms a third cavity 401 having the same shape as the conductive plate 100, and is used to flatten the concave arc region of the precision forging blank of the plate portion 101 into the plate portion 101;

[0046] Assuming that the middle thickness of the rough blank of plate portion 101 is a1, the edge thickness of the rough blank of plate portion 101 is b1, the middle thickness of the fine forging blank of plate portion 101 is a2, the edge thickness of the fine forging blank of plate portion 101 is b2, and the target thickness of plate portion 101 is c, then a1-(0.5~0.7)=c=b1-(0.1~0.2), b2-(0.1~0.3)=c=a2+(0.1~0.3), as a preferred embodiment a1-0.6=c=b1-0.15, b2-2=c=a2+0.2, it can be understood that the units of 0.6, 0.15, and 0.2 are millimeters.

[0047] According to the above structure provided in this embodiment, please refer to Figures 1 to 12 , a first flash groove 203 is formed on the rough forging die 200, which is connected to the first cavity 201 and is used to accommodate excess material; according to the above structure provided in this embodiment, the first flash groove 203 can allow the blank of the conductive plate 100 to fully fill the first cavity 201, which is conducive to forming the conductive plate 100 with better molding quality and obtaining the rough blank with set accuracy required by the intermediate die. It should be noted that after the conductive plate 100 is formed in the first cavity 201, the flash entering the first flash groove 203 needs to be cut off.

[0048] According to the above structure provided in this embodiment, please refer to Figures 1 to 12The first flash groove 203 is arranged around the first cavity 201 and is spaced apart from the first cavity 201. According to the above structure provided in this embodiment, the first flash groove 203 and the first cavity 201 are spaced apart from each other to avoid mutual interference between the two, and the volume size of the first flash groove 203 can also be flexibly set.

[0049] According to the above structure provided in this embodiment, please refer to Figures 1 to 12 , a second flash groove 303 is formed on the middle mold 300, which is connected to the second cavity 301 and is used to accommodate excess material. According to the above structure provided in this embodiment, the second flash groove 303 can allow the rough blank of the plate portion 101 of the conductive plate 100 to fully fill the second cavity 301, which is conducive to forming the conductive plate 100 with better molding quality and higher surface hardness, and reduces the molding pressure of the middle mold 300. It should be noted that after the conductive plate 100 is formed in the second cavity 301, the flash entering the second flash groove 303 needs to be cut off.

[0050] According to the above structure provided in this embodiment, please refer to Figures 1 to 12 The second flash groove 303 is arranged around the second cavity 301 and is adjacent to the second cavity 301. According to the above structure provided in this embodiment, since the plate portion 101 of the conductive plate 100 has been cut off from the flash portion entering the first flash groove 203, the second flash groove 303 can be processed in a simpler manner, which is beneficial to reducing the production cost of the conductive plate 100.

[0051] The present application also provides a thin conductive plate toughening molding process, which uses the above-mentioned thin conductive plate molding mold to toughen the thin conductive plate, including the following steps:

[0052] 1) Design the fine forging die 400 according to the target thickness c of the plate portion 101 of the three-dimensional model of the finished conductive plate 100, design the rough blank and fine forging blank including at least the thickness parameters of the middle thickness a1 of the rough blank of the plate portion 101, the edge thickness b1 of the rough blank of the plate portion 101, the middle thickness a2 of the fine forging blank of the plate portion 101, and the edge thickness b2 of the fine forging blank of the plate portion 101, and calculate the diameter and cutting length parameters of the copper raw material;

[0053] 2) According to the parameters obtained in step 1), the rough forging die 200 and the intermediate die 300 are designed so that at least the corresponding dimensions of the first cavity 201 and the second cavity 301 in the thickness direction satisfy a1-(0.5-0.7)=c=b1-(0.1-0.2), b2-(0.1-0.3)=c=a2+(0.1-0.3);

[0054] 3) Cut the material according to the material diameter and length parameters obtained in step 2) to obtain the raw material blank;

[0055] 4) The raw material blank is heated to 600-800°C by induction heating, and is placed in a rough forging die 200 for forming and trimming to obtain a rough blank of the plate portion 101. Here, the trimming process and die of the prior art can be used for the trimming process;

[0056] 5) Cooling the rough blank of the plate 101 obtained in step 4) and performing surface treatment to remove surface oxides and impurities;

[0057] 6) Place the rough blank of the plate 101 processed in step 5) into the middle die 300 for cold forming for the first strengthening, and obtain the fine forging blank of the plate 101 after trimming. Here, the trimming process and die of the prior art can be used for the trimming;

[0058] 7) Place the plate 101 obtained in step 6) into the precision forging die 400 for cold finishing to perform the second strengthening and complete the final forming.

[0059] According to the above structure and forming process provided in this embodiment, the thin conductive plate forming die provided in this application includes a rough forging die, an intermediate die and a fine forging die. First, the thin conductive plate is rough-formed by a hot forging process to obtain a suitable shape and thickness, especially to form a convex arc-shaped area with a thick middle and thin sides on the plate portion, so that the intermediate die forms a material with sufficient compression in the middle area of ​​the plate portion when the thin conductive plate is finely forged by the plate portion 101;

[0060] After the rough plate 101 is placed in the middle mold 300, the plate 101 can reduce the thickness of its middle part under the action of the second molding surface 302 and squeeze the excess material to the edge part. In this way, after the rough plate 101 is formed with the second molding surface of the middle mold, the hardness of the plate can be greatly improved, and the distribution of the hardness is gradually reduced from the middle of the plate to the two edges, that is, in the molding step of the middle mold, the hardness of the middle part of the plate is first improved. The advantage of this is that when the middle mold is molded, the protrusion of the second molding surface first contacts the protrusion of the rough plate 101, and the maximum deformation can be obtained under the same pressure. Then, as the deformation deepens, the entire cavity surface contacts the material. Due to the convex arc feature of the second molding surface, the material is easily squeezed to the position of the middle mold close to the second flash groove, that is, it is easy to squeeze the excess material to the second flash groove, so as to avoid the material being suffocated inside the mold. While improving the hardness and strength of the plate, the molding of the plate 101 is easy, and the mold is also protected.

[0061] After forming, the plate portion 101 of the precision forging blank presents an inner arc structure. Since the plate portion 101 is thin in the middle and has high hardness, and thick at the edge and has low hardness, when the leveling action is performed in the third cavity 401 in the precision forging die 400, the bottom surface of the third cavity 401 first contacts the edge of the plate portion 101. During the closing process of the mold, this part of the material is extruded to achieve cold hardening, thereby improving the hardness of this area of ​​the plate portion 101. Since the material is also forced to be squeezed to the middle, and since the middle part itself has been pre-hardened once in the middle die 300, it has a strong hindering effect on the material flowing to the middle. Therefore, while the edge becomes thinner, it is flush with the middle part, and the hardness is also greatly improved. At this time, the degree of hardness improvement shows a trend of being high at the edge and gradually decreasing toward the middle (in the third cavity 401, the plate portion The edge cold deformation of the 101 precision forging billet is the largest), and the hardness distribution is superimposed with the hardness distribution obtained in the middle die 300 to achieve the uniformity of the hardness of the entire plate 101. Finally, the plane of the entire plate 101 contacts and flattens with the bottom surface of the third cavity 401, completing the molding of the final product, and improving the hardness strength of the plate while making the hardness uniform everywhere. After testing, the surface hardness of the plate can reach more than 65HB, so that the strength and toughness of the conductive plate 100 are optimally matched, and the toughening molding of the conductive plate 100 is achieved; here, since the middle of the bottom surface of the third cavity 401 contacts the material of the middle part of the plate 101 at the end of molding, the force on the middle part of the mold is reduced, which protects the mold from cracking and damage on the one hand, and avoids the unevenness of the plate caused by elastic deformation of the mold on the other hand;

[0062] Since the volume of the first cavity 201 is larger than the volume of the conductive plate 100, in the present application, the preforming action of the rough forging die 200 leaves sufficient cold deformation margin for the forming of the conductive plate 100 in the intermediate die 300, and the volume of the second cavity 301 is consistent with the volume of the conductive plate 100, so as to provide the precise forging blank of the plate portion 101 to the fine forging die 400, thereby improving the hardness and strength of the conductive plate 100, ensuring the shape and position tolerance of the product, and avoiding film expansion;

[0063] In addition, this technical solution creatively adopts a combination of hot forging and two cold forgings, the plate part is hardened in different areas, and a curved surface structure design is adopted. It can achieve the effect of improving the hardness and uniformity of hardness distribution of the conductive plate part with a smaller equipment tonnage, and also has the technical effect of long service life of each mold.

[0064] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A thin conductive plate forming die for forming a conductive plate (100), wherein the conductive plate (100) has a plate portion (101) with uniform thickness and a lug (102) for processing a target connection hole, characterized in that: include: A rough forging die (200) is formed with a first cavity (201) having a volume greater than that of the conductive plate (100) and having a first molding surface (202) for forming the first cavity (201), the first molding surface (202) being a concave arc surface, the first molding surface (202) being used for molding the rough blank of the plate portion (101), and the target thickness region of the rough blank of the plate portion (101) being a convex arc region enclosed by the first molding surface (202) having a middle depth greater than an edge depth of the first molding surface (202); an intermediate die (300), forming a second cavity (301) having a volume equal to that of the conductive plate (100) and having a second molding surface (302) for forming the second cavity (301), the second molding surface (302) being an outwardly convex arc surface, the second molding surface (302) being used for secondary molding the rough blank of the plate portion (101) to form a fine forging blank of the plate portion (101), the target thickness region of the fine forging blank of the plate portion (101) being a concave arc region enclosed by a middle depth of the second molding surface (302) being less than an edge depth of the second molding surface (302); A precision forging die (400) is formed with a third cavity (401) having a shape identical to that of the conductive plate (100), and is used to flatten the concave arc-shaped region of the precision forging blank of the plate portion (101) to form the plate portion (101); Assuming that the middle thickness of the rough blank of the plate portion (101) is a1, the edge thickness of the rough blank of the plate portion (101) is b1, the middle thickness of the fine forging blank of the plate portion (101) is a2, the edge thickness of the fine forging blank of the plate portion (101) is b2, and the target thickness of the plate portion (101) is c, then a1-(0.5~0.7)=c=b1-(0.1~0.2), b2-(0.1~0.3)=c=a2+(0.1~0.3).

2. The thin conductive plate forming mold according to claim 1, characterized in that: The rough forging die (200) is formed with a first flash groove (203) which is in communication with the first cavity (201) and is used to accommodate excess material.

3. The thin conductive plate forming mold according to claim 2, characterized in that: The first flash groove (203) is arranged around the first cavity (201) and is spaced apart from the first cavity (201).

4. The thin conductive plate forming mold according to claim 1, characterized in that: A second flash groove (303) is formed on the middle mold (300) and is communicated with the second mold cavity (301) and is used to accommodate excess material.

5. The thin conductive plate forming mold according to claim 4, characterized in that: The second flash groove (303) is arranged around the second cavity (301) and is adjacent to the second cavity (301).

6. A process for strengthening and toughening a thin conductive plate, wherein the thin conductive plate is strengthened and toughened by using the thin conductive plate forming mold as claimed in any one of claims 1 to 5, characterized in that The steps include: 1) designing the finishing forging die (400) according to the target thickness c of the plate portion (101) of the finished three-dimensional model of the conductive plate (100), designing a rough blank and a finishing forging blank including at least thickness parameters of the middle thickness a1 of the rough blank of the plate portion (101), the edge thickness b1 of the rough blank of the plate portion (101), the middle thickness a2 of the finishing forging blank of the plate portion (101), and the edge thickness b2 of the finishing forging blank of the plate portion (101), and calculating the diameter and cutting length parameters of the copper raw material; 2) Designing the rough forging die (200) and the intermediate die (300) according to the parameters obtained in step 1) so that at least the corresponding dimensions of the first cavity (201) and the second cavity (301) in the thickness direction satisfy a1-(0.5-0.7)=c=b1-(0.1-0.2), b2-(0.1-0.3)=c=a2+(0.1-0.3); 3) Cut the material according to the material diameter and length parameters obtained in step 1) to obtain the raw material blank; 4) heating the raw material blank to 600-800° C. by induction heating, and placing it in the rough forging die (200) for forming and trimming to obtain the rough blank of the plate portion (101); 5) cooling the rough blank of the plate portion (101) obtained in step 4) and performing surface treatment to remove surface oxides and impurities; 6) placing the rough blank of the plate portion (101) processed in step 5) into the intermediate die (300) for cold forming for first strengthening, and trimming to obtain the fine forging blank of the plate portion (101); 7) The plate portion (101) obtained in step 6) is placed in the fine forging die (400) for cold finishing to perform a second strengthening and complete the final forming.

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