A three-dimensional packaging device and packaging method for chip manufacturing

Abstract

The present invention relates to the field of chip packaging technology, and in particular to a three-dimensional packaging device for chip manufacturing and a packaging method thereof. It comprises a packaging platform, the top of which is provided with a support seat; and the support seat is provided with a mounting ring. The present invention fixes the packaging substrate between two groups of substrate fixing mechanisms, and then controls the chip adsorption mechanism to adsorb the chip, and then controls the tinning head to apply solder paste on the corresponding position on the substrate, and then controls the mechanism to drive the chip adsorption mechanism to place the corresponding chip on the solder paste, and then controls the substrate fixing mechanism to spray hot air to heat the solder paste to connect the chip with the substrate, and at the same time controls the rotating ring to drive the chip adsorption mechanism and the tinning head to transfer to the bottom of the substrate to perform chip packaging on the other side, avoiding the need to wait for the solder paste to cool and fix before packaging the other side of the substrate, thereby improving the packaging efficiency of the packaging device.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip packaging, and in particular relates to a three-dimensional packaging device for chip manufacturing and a packaging method thereof. Background Art

[0002] Chip packaging is the bridge between the internal world of the chip and the external circuit. It is the process of assembling integrated circuits into the final chip product. Simply put, it is to place the produced integrated circuit die on an external circuit substrate that serves as a carrier, lead out the pins, and then fix the package into a whole.

[0003] After searching, in the prior art, the Chinese patent announcement number: CN117650085B, announcement date: 2024-04-16, discloses a semiconductor chip packaging device, including a transfer tray, a loading manipulator, a packaging preparation mechanism, a patch mechanism and a unloading manipulator, the loading manipulator is used to place the packaging shell on the fixing mechanism, the packaging preparation mechanism is used to fill glue into the packaging shell, the patch mechanism is used to put the chip into the packaging shell, and the unloading manipulator is used to remove the packaging shell in the fixing mechanism; the packaging preparation mechanism includes a dispensing head, a glue storage cylinder, a downward pressure cylinder, a glue cylinder seat and a cleaning head, the cleaning head is installed below the dispensing head, and the cleaning head can move from the middle of the packaging shell to both sides to clean the inside of the packaging shell. The invention drives the glue cylinder seat to move downward by the downward pressure cylinder, and the cleaning head moves from the middle of the packaging shell to both sides to clean the inside of the packaging shell. After cleaning, the glue in the glue storage cylinder is filled into the cleaned packaging shell through the dispensing head, so that the patch mechanism can paste the chip into the packaging shell.

[0004] However, the packaging device still has the following defects:

[0005] When performing packaging work, it is necessary to apply solder paste at the corresponding position on the substrate, then place the corresponding chip on the solder paste, and then heat the solder paste to connect the chip to the substrate. However, when using a double-sided substrate for packaging work, in order to ensure that the chip does not move, it is necessary to wait for the solder paste to cool and fix before turning the substrate over to perform packaging work on the other side, thereby reducing the packaging efficiency. Summary of the invention

[0006] In view of the above problems, the present invention provides a three-dimensional packaging device for chip manufacturing, comprising a packaging platform, a support seat is provided on the top of the packaging platform; a mounting ring is provided on the support seat; a rotating ring is movably sleeved on the inner wall of the mounting ring;

[0007] Two groups of mounting plates are connected to the inner wall of the rotating ring; the central axes of the two groups of mounting plates are perpendicular; a control mechanism is provided on one group of mounting plates; a chip adsorption mechanism is connected to the output of the control mechanism; a mechanical arm is provided on one group of mounting plates; a tinning head is connected to the output end of the mechanical arm;

[0008] Two sets of second electric turntables are symmetrically arranged at the edges of both sides of the top of the packaging platform; two sets of support rods are symmetrically connected to the output ends of the two sets of second electric turntables; two sets of substrate fixing mechanisms are symmetrically connected to the opposite ends of the two sets of support rods;

[0009] The control rotating ring drives the packaging structure to rotate around the packaging substrate to perform three-dimensional packaging work.

[0010] Furthermore, the control mechanism includes a first electric turntable; the first electric turntable is installed on one of the mounting plates; the output end of the first electric turntable is transmission-connected to a first electric slide; the output end of the first electric slide is transmission-connected to a first electric push rod; the output end of the first electric push rod is transmission-connected to a chip adsorption mechanism.

[0011] Furthermore, the chip adsorption mechanism includes a first shell; a rotating plate is provided at the bottom of the first shell; a vacuum adsorption component is transmission-connected to the bottom of the rotating plate; and an annular closing plate is provided at the bottom of the first shell.

[0012] Furthermore,

[0013] A sealing bottom plate is arranged at the bottom of the annular sealing plate; the vacuum adsorption component is movably inserted into the sealing bottom plate; and a cleaning cushion is arranged on the top of the sealing bottom plate.

[0014] Furthermore, the vacuum adsorption assembly includes a vacuum ring; the bottom of the vacuum ring is provided with a plurality of groups of expansion grooves distributed in a circular array; a group of vacuum adsorption blocks is movably penetrated in each group of the expansion grooves; and a group of vacuum suction cups is provided at the bottom of each group of the vacuum adsorption blocks.

[0015] Furthermore, a plurality of groups of second electric push rods are arranged in a circular array on the top of the vacuum ring; each group of the second electric push rods is transmission-connected to a corresponding group of vacuum adsorption blocks; two groups of first ventilation grooves are symmetrically provided on the inner walls on both sides of each group of telescopic grooves; two groups of second ventilation grooves are symmetrically provided on the walls on both sides of each group of vacuum adsorption blocks; each group of the second ventilation grooves is movably connected to a corresponding group of first ventilation grooves.

[0016] Furthermore, the substrate fixing mechanism comprises a substrate clamp; two groups of clamping plates are symmetrically connected to the output end of the substrate clamp; and a plurality of groups of air injection holes are evenly spaced on a side wall of each group of clamping plates away from the substrate clamp.

[0017] Furthermore, a plurality of gas springs are provided in a rectangular array on one side wall opposite to the two groups of clamping plates; a plurality of gas springs on the same side are provided with a group of flexible limit plates at one end away from the corresponding group of clamping plates; and two groups of anti-static soft plates are symmetrically provided on one side wall opposite to the two groups of flexible limit plates.

[0018] Furthermore, two groups of folding columns are symmetrically provided at both ends of each group of the clamping plates; two groups of limiting grooves are symmetrically opened on the opposite side walls of the two groups of folding columns on the same side; a group of sealing baffles are movably penetrated in each group of the limiting grooves; a number of groups of compression springs are evenly spaced in each group of the limiting grooves; and the two ends of each group of the compression springs are respectively attached to the inner wall of the corresponding group of limiting grooves and the sealing baffle.

[0019] A packaging method for a three-dimensional packaging device for chip manufacturing, the packaging method comprising:

[0020] Controlling two sets of substrate fixing mechanisms to fix the packaging substrate;

[0021] Control the chip adsorption mechanism to adsorb a plurality of groups of chips;

[0022] Control the tin spray head to apply solder paste on the package substrate;

[0023] Control the chip adsorption mechanism to press the chip onto the solder paste;

[0024] Control the substrate fixing mechanism to blow out hot air flow to heat the solder paste and fix the chip;

[0025] The control rotating ring drives the chip adsorption mechanism and the tin spray head to rotate to the bottom of the substrate fixing mechanism;

[0026] Control the chip adsorption mechanism and the tin spray head to fix the chip on the bottom of the packaging substrate;

[0027] Complete the three-dimensional chip packaging work on the double-sided substrate.

[0028] The beneficial effects of the present invention are:

[0029] 1. Fix the packaging substrate between two sets of substrate fixing mechanisms, then control the chip adsorption mechanism to adsorb the chip, then control the tinning head to apply solder paste on the corresponding position on the substrate, then control the mechanism to drive the chip adsorption mechanism to place the corresponding chip on the solder paste, then control the substrate fixing mechanism to spray hot air to heat the solder paste to connect the chip to the substrate, and at the same time control the rotating ring to drive the chip adsorption mechanism and the tinning head to move to the bottom of the substrate to perform chip packaging on the other side, avoiding the need to wait for the solder paste to cool and fix before packaging the other side of the substrate, thereby improving the packaging efficiency of the packaging device.

[0030] 2. By controlling the corresponding second electric push rod to drive the vacuum adsorption block to descend, the corresponding two groups of first ventilation grooves are connected with the two groups of second ventilation grooves, so that the corresponding vacuum suction cup generates adsorption force to adsorb the chip. When the chip is packaged, the vacuum adsorption block can be controlled to continue to descend to release the connection between the two groups of first ventilation grooves and the two groups of second ventilation grooves, and the two groups of second ventilation grooves are directly connected to the outside, so that the air pressure in the vacuum adsorption block is increased to release the adsorption of the chip. In the process of vacuum adsorption, it is only necessary to control the vacuum equipment to work to reduce the air pressure in the vacuum ring when the air pressure in the vacuum ring is higher than the limit value. There is no need for the vacuum equipment to work continuously, thereby achieving energy saving.

[0031] 3. The vacuum adsorption assembly is driven by controlling the rotating plate to cyclically adsorb several groups of chips, and then several groups of chips are stored in the annular closed plate and pressed against the clean pad on the top of the sealing bottom plate, so that when the packaging work is performed, the chips can be in a closed space to avoid dust adhesion during the packaging process. When the vacuum adsorption assembly drives several groups of chips for packaging, the chips can be cleaned by the clean pad during the movement to avoid impurities adhering to the chips and being packaged and fixed, thereby improving the packaging quality of the packaging device.

[0032] 4. When the two groups of substrate fixing mechanisms are fixing the packaging substrate, the eight groups of folding columns can automatically adapt and fold according to the size of the packaging substrate, and at the same time cooperate with the eight groups of sealing baffles to contact each other in pairs, so that the substrate fixing area forms a sealed space. When the chip is not packaged, several groups of air jets spray air to form a positive pressure in the substrate fixing area to prevent dust from adhering to the substrate. When the chip is packaged, the air jets can also spray hot air to melt the solder paste to fix the chip on the packaging substrate.

[0033] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0035] Figure 1 A schematic structural diagram of a packaging device according to an embodiment of the present invention is shown;

[0036] Figure 2 A schematic cross-sectional view of a packaging device according to an embodiment of the present invention is shown;

[0037] Figure 3 A schematic structural diagram of a chip adsorption mechanism according to an embodiment of the present invention is shown;

[0038] Figure 4 A schematic cross-sectional view of a chip adsorption mechanism according to an embodiment of the present invention is shown;

[0039] Figure 5 A schematic structural diagram of a vacuum adsorption assembly according to an embodiment of the present invention is shown;

[0040] Figure 6 A partial cross-sectional schematic diagram of a vacuum adsorption assembly according to an embodiment of the present invention is shown;

[0041] Figure 7 The embodiment of the present invention is shown Figure 6 An enlarged schematic diagram of point A;

[0042] Figure 8 A schematic structural diagram of a substrate fixing mechanism according to an embodiment of the present invention is shown;

[0043] Fig. 9 A schematic structural diagram of a folding column according to an embodiment of the present invention is shown.

[0044] In the figure: 1. packaging platform; 2. support seat; 3. mounting ring; 4. rotating ring; 5. mounting plate; 6. first electric turntable; 7. electric slide; 8. first electric push rod; 9. chip adsorption mechanism; 10. mechanical arm; 11. tinning head; 12. second electric turntable; 13. support rod; 14. substrate fixing mechanism; 15. chip placement groove; 16. first motor; 17. second motor; 18. transmission cavity; 19. gear ring; 20. gear; 21. adjustment cavity; 22. screw rod; 23. slider; 24. limit column; 901. first shell; 902. rotating Plate; 903, vacuum adsorption component; 904, annular closing plate; 905, sealing bottom plate; 9031, vacuum ring; 9032, vacuum adsorption block; 9033, vacuum suction cup; 9034, second electric push rod; 9035, first ventilation slot; 9036, second ventilation slot; 1401, substrate clamp; 1402, clamping plate; 1403, air jet hole; 1404, gas spring; 1405, flexible limit plate; 1406, anti-static soft board; 1407, folding column; 1408, sealing baffle; 1409, limit slot; 1410, compression spring. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] The embodiment of the present invention provides a three-dimensional packaging device for chip manufacturing, including a packaging platform 1. For example, Figure 1 and Figure 2 As shown, a support seat 2 is provided on the top of the packaging platform 1; a mounting ring 3 is provided on the support seat 2; a rotating ring 4 is movably sleeved on the inner wall of the mounting ring 3; two groups of mounting plates 5 are transmission-connected on the inner wall of the rotating ring 4; the central axes of the two groups of mounting plates 5 are perpendicular; a first electric turntable 6 is provided on one group of the mounting plates 5; a first electric slide 7 is transmission-connected on the output end of the first electric turntable 6; a first electric push rod 8 is transmission-connected on the output end of the first electric slide 7; a Chip adsorption mechanism 9; the first electric turntable 6, the first electric slide 7 and the first electric push rod 8 are combined to form a control mechanism; a mechanical arm 10 is provided on the other group of mounting plates 5; a tinning head 11 is connected to the output end of the mechanical arm 10; a gear ring 19 is sleeved on the outer wall of the mounting ring 3; a transmission cavity 18 is provided in the support seat 2; a first motor 16 is provided on one side wall of the support seat 2; the output end of the first motor 16 extends into the transmission cavity 18, and is connected to the gear 20; the gear 20 is meshed and connected with the gear ring 19 ; Two sets of second electric turntables 12 are symmetrically arranged at the edges of both sides of the top of the packaging platform 1; two sets of support rods 13 are symmetrically connected to the output ends of the two sets of the second electric turntables 12; two sets of substrate fixing mechanisms 14 are symmetrically connected to the opposite ends of the two sets of support rods 13; a set of chip placement grooves 15 are opened on the top of each set of support rods 13; an adjustment cavity 21 is arranged in the packaging platform 1; two sets of screw rods 22 are arranged in the adjustment cavity 21; one end of the two sets of screw rods 22 is fixedly connected, and the other end is rotatably connected to the adjusting cavity 21 On the inner walls on both sides; the thread directions of the two groups of screw rods 22 are opposite, and the central axes are on the same straight line; a second motor 17 is provided on one side wall of the packaging platform 1; the second motor 17 is transmission connected to one group of screw rods 22; four groups of sliders 23 are slidably connected to the bottom inner wall of the adjusting chamber 21; each group of screw rods 22 is threadedly connected to the corresponding two groups of sliders 23; the top of each group of sliders 23 is transmission connected to a group of limit columns 24; each group of limit columns 24 is movable through a corresponding group of second electric turntables 12 and support base 2.

[0047] When the packaging mechanism is working, first fix the packaging substrate between two groups of substrate fixing mechanisms 14, then the control mechanism drives the chip adsorption mechanism 9 to adsorb the chip in the chip placement groove 15, and adsorb multiple groups of chips at one time, and then control the mechanical arm 10 to drive the tinning head 11 to apply solder paste on the corresponding position on the substrate, and then the control mechanism drives the chip adsorption mechanism 9 to place the corresponding chip on the solder paste, and then control the substrate fixing mechanism 14 to spray hot air to heat the solder paste to connect the chip to the substrate. When the chip packaging on one side is completed, control the first motor 16 to drive the gear 20 to rotate. Under the meshing connection relationship between the gear 20 and the gear ring 19, the rotating ring 4 drives the chip adsorption mechanism 9 and the tinning head 11 to transfer to the bottom of the substrate to perform chip packaging on the other side, avoiding the need to wait for the solder paste to cool and fix before packaging the other side of the substrate, thereby improving the packaging efficiency of the packaging device. When the packaging device needs maintenance, the second motor 17 can be controlled to drive the two groups of screw rods 22 to rotate. Under the threaded connection relationship between the two groups of screw rods 22 and the four groups of sliders 23, the four groups of sliders 23 are moved to both sides respectively, thereby releasing the limiting effect of the four groups of limiting columns 24 on the two groups of second electric turntables 12 and the support seat 2. Then, the two groups of second electric turntables 12 and the support seat 2 can be directly disassembled. The process is simple and quick, which improves the maintenance convenience of the packaging device.

[0048] For example, Figure 3 and Figure 4 As shown, the chip adsorption mechanism 9 includes a first shell 901; a rotating plate 902 is provided at the bottom of the first shell 901; a vacuum adsorption assembly 903 is transmission-connected to the bottom of the rotating plate 902; an annular closing plate 904 is provided at the bottom of the first shell 901; a sealing bottom plate 905 is provided at the bottom of the annular closing plate 904; the vacuum adsorption assembly 903 is movable through the sealing bottom plate 905; a cleaning pad is provided on the top of the sealing bottom plate 905.

[0049] When the packaging mechanism is working, the control rotating plate 902 drives the vacuum adsorption component 903 to cyclically adsorb several groups of chips, and then drives several groups of chips to be stored in the annular sealing plate 904 and press against the clean pad on the top of the sealing bottom plate 905, so that when the packaging work is performed, the chips can be in a closed space to avoid dust adhesion during the packaging process, and when the vacuum adsorption component 903 drives several groups of chips to perform packaging work, the chips can be cleaned by the clean pad during the movement, so as to avoid impurities adhering to the chips and being packaged and fixed, thereby improving the packaging quality of the packaging device.

[0050] For example, Figure 5 , Figure 6 and Figure 7As shown, the vacuum adsorption component 903 includes a vacuum ring 9031; a plurality of groups of telescopic grooves are arranged in a circular array at the bottom of the vacuum ring 9031; a group of vacuum adsorption blocks 9032 are movably penetrated in each group of the telescopic grooves; a group of vacuum adsorption blocks 9032 are provided at the bottom of each group of the vacuum adsorption blocks 9032; a plurality of groups of second electric push rods 9034 are arranged in a circular array at the top of the vacuum ring 9031; each group of the second electric push rods 9034 are transmission-connected with a corresponding group of vacuum adsorption blocks 9032; two groups of first ventilation grooves 9035 are symmetrically arranged on the inner walls on both sides of each group of the telescopic grooves; two groups of second ventilation grooves 9036 are symmetrically arranged on the walls on both sides of each group of the vacuum adsorption blocks 9032; each group of the second ventilation grooves 9036 are movably connected with a corresponding group of first ventilation grooves 9035.

[0051] When the chip adsorption mechanism 9 is working, the vacuum equipment is first controlled to evacuate the vacuum ring 9031 to a vacuum state. Then, when the chip adsorption work is performed, the corresponding second electric push rod 9034 is controlled to drive the vacuum adsorption block 9032 to descend, so that the corresponding two groups of first ventilation grooves 9035 are connected with the two groups of second ventilation grooves 9036, so that the corresponding vacuum suction cup 9033 generates an adsorption force to adsorb the chip. After the chip is placed on the solder paste, the second electric push rod 9034 can be controlled to drive the vacuum adsorption block 9032 to continue to descend, and the connection state between the two groups of first ventilation grooves 9035 and the two groups of second ventilation grooves 9036 is released, and the two groups of second ventilation grooves 9036 are directly connected to the outside, so that the air pressure in the vacuum adsorption block 9032 is increased to release the adsorption of the chip. In the process of vacuum adsorption, it is only necessary to control the vacuum equipment to work to reduce the air pressure in the vacuum ring 9031 when the air pressure in the vacuum ring 9031 is higher than the limit value, and there is no need for the vacuum equipment to work continuously, thereby achieving energy saving effect.

[0052] For example, Figure 8 and Fig. 9As shown, the substrate fixing mechanism 14 includes a substrate clamp 1401; two groups of clamping plates 1402 are symmetrically connected to the output end of the substrate clamp 1401; a plurality of groups of air injection holes 1403 are evenly spaced on a side wall of each group of the clamping plates 1402 away from the substrate clamp 1401; a plurality of groups of gas springs 1404 are distributed in a rectangular array on the opposite side walls of the two groups of the clamping plates 1402; a group of flexible limiting plates 1405 are provided on the ends of the plurality of groups of the gas springs 1404 on the same side away from the corresponding group of clamping plates 1402; the two groups of the flexible limiting plates Two groups of antistatic soft plates 1406 are symmetrically arranged on the side wall opposite to 1405; two groups of folding columns 1407 are symmetrically arranged at both ends of each group of the clamping plates 1402; two groups of limiting grooves 1409 are symmetrically opened on the side wall opposite to the two groups of folding columns 1407 on the same side; a group of sealing baffles 1408 are movably penetrated in each group of the limiting grooves 1409; a number of groups of compression springs 1410 are evenly spaced in each group of the limiting grooves 1409; the two ends of each group of the compression springs 1410 are respectively on the inner wall of the corresponding group of limiting grooves 1409 and the sealing baffle 1408.

[0053] When the package substrate is fixed, the substrate clamp 1401 is first controlled to drive the two groups of clamping plates 1402 to perform clamping work, so that the flexible limit plate 1405 wraps the antistatic soft board 1406 at the edge of the package substrate under the action of the several groups of gas springs 1404, and the antistatic soft board 1406 will fit on the pins or electronic components of different heights of the package substrate under the action of the flexible limit plate 1405, avoiding the damage to the package substrate caused by rigid clamping. When the two groups of substrate fixing mechanisms 14 are fixing the package substrate, the eight groups of folding columns 1407 can automatically adapt to fold according to the size of the package substrate, and cooperate with the eight groups of sealing baffles 1408 to contact each other, so that the substrate fixing area forms a sealed space. When the chip is not packaged, the several groups of air jets 1403 spray airflow, so that the substrate fixing area forms a positive pressure to prevent dust from adhering to the substrate. When the chip is packaged, the air jet 1403 can also spray hot airflow to melt the solder paste to fix the chip on the package substrate.

[0054] By fixing the packaging substrate between two groups of substrate fixing mechanisms 14, then controlling the chip adsorption mechanism 9 to adsorb the chip, then controlling the tinning head 11 to apply solder paste on the corresponding position on the substrate, and then controlling the mechanism to drive the chip adsorption mechanism 9 to place the corresponding chip on the solder paste, and then controlling the substrate fixing mechanism 14 to spray hot air to heat the solder paste to connect the chip to the substrate, and at the same time controlling the rotating ring 4 to drive the chip adsorption mechanism 9 and the tinning head 11 to move to the bottom of the substrate to perform chip packaging on the other side, it is avoided that the solder paste needs to be cooled and fixed before packaging the other side of the substrate, thereby improving the packaging efficiency of the packaging device.

[0055] By controlling the corresponding second electric push rod 9034 to drive the vacuum adsorption block 9032 to descend, the corresponding two groups of first ventilation grooves 9035 are connected with the two groups of second ventilation grooves 9036, so that the corresponding vacuum suction cup 9033 generates adsorption force to adsorb the chip. When the chip is packaged, the vacuum adsorption block 9032 can be controlled to continue to descend to release the connection between the two groups of first ventilation grooves 9035 and the two groups of second ventilation grooves 9036, and the two groups of second ventilation grooves 9036 are directly connected to the outside, so that the air pressure in the vacuum adsorption block 9032 is increased to release the adsorption of the chip. In the process of vacuum adsorption, it is only necessary to control the vacuum equipment to work to reduce the air pressure in the vacuum ring 9031 when the air pressure in the vacuum ring 9031 is higher than the limit value. There is no need for the vacuum equipment to work continuously, thereby achieving energy saving.

[0056] By controlling the rotating plate 902 to drive the vacuum adsorption component 903 to cyclically adsorb several groups of chips, and then drive the several groups of chips to be stored in the annular sealing plate 904 and press against the clean pad on the top of the sealing bottom plate 905, so that when the packaging work is carried out, the chips can be in a closed space to avoid dust adhesion during the packaging process, and when the vacuum adsorption component 903 drives several groups of chips to carry out the packaging work, the chips can be cleaned by the clean pad during the movement, so as to avoid impurities adhering to the chips and being packaged and fixed, thereby improving the packaging quality of the packaging device.

[0057] When the two groups of substrate fixing mechanisms 14 are fixing the packaging substrate, the eight groups of folding columns 1407 can automatically adapt to folding according to the size of the packaging substrate, and at the same time cooperate with the eight groups of sealing baffles 1408 to contact each other in pairs, so that the substrate fixing area forms a sealed space. When the chip is not packaged, several groups of jet holes 1403 spray airflow to form a positive pressure in the substrate fixing area to prevent dust from adhering to the substrate. When the chip is packaged, the jet hole 1403 can also spray hot air flow to melt the solder paste to fix the chip on the packaging substrate.

[0058] Based on the above-mentioned three-dimensional packaging device for chip manufacturing, an embodiment of the present invention further proposes a packaging method for the three-dimensional packaging device for chip manufacturing. Exemplarily, the packaging method includes:

[0059] Controlling two sets of substrate fixing mechanisms to fix the packaging substrate;

[0060] Control the chip adsorption mechanism to adsorb a plurality of groups of chips;

[0061] Control the tin spray head to apply solder paste on the package substrate;

[0062] Control the chip adsorption mechanism to press the chip onto the solder paste;

[0063] Control the substrate fixing mechanism to blow out hot air flow to heat the solder paste and fix the chip;

[0064] The control rotating ring drives the chip adsorption mechanism and the tin spray head to rotate to the bottom of the substrate fixing mechanism;

[0065] Control the chip adsorption mechanism and the tin spray head to fix the chip on the bottom of the packaging substrate;

[0066] Complete the three-dimensional chip packaging work on the double-sided substrate.

[0067] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A three-dimensional packaging device for chip manufacturing, comprising a packaging platform (1), characterized in that: A support seat (2) is provided on the top of the packaging platform (1); a mounting ring (3) is provided on the support seat (2); a rotating ring (4) is movably sleeved on the inner wall of the mounting ring (3); Two groups of mounting plates (5) are transmission-connected on the inner wall of the rotating ring (4); the central axes of the two groups of mounting plates (5) are perpendicular; a control mechanism is provided on one group of mounting plates (5); a chip adsorption mechanism (9) is transmission-connected on the output end of the control mechanism; a mechanical arm (10) is transmission-connected on the output end of the mechanical arm (10); a tinning head (11) is transmission-connected; The control mechanism comprises a first electric turntable (6); the first electric turntable (6) is mounted on one of the mounting plates (5); the output end of the first electric turntable (6) is transmission-connected to a first electric slide (7); the output end of the first electric slide (7) is transmission-connected to a first electric push rod (8); the output end of the first electric push rod (8) is transmission-connected to a chip adsorption mechanism (9); Two sets of second electric turntables (12) are symmetrically arranged at the edges of both sides of the top of the packaging platform (1); the output ends of the two sets of the second electric turntables (12) are both drivingly connected to support rods (13); and the opposite ends of the two sets of the support rods (13) are both drivingly connected to substrate fixing mechanisms (14); The chip adsorption mechanism (9) comprises a first shell (901); a rotating plate (902) is provided at the bottom of the first shell (901); a vacuum adsorption assembly (903) is transmission-connected to the bottom of the rotating plate (902); an annular sealing plate (904) is provided at the bottom of the first shell (901); a sealing bottom plate (905) is provided at the bottom of the annular sealing plate (904); the vacuum adsorption assembly (903) is movably inserted into the sealing bottom plate (905); and a cleaning pad is provided at the top of the sealing bottom plate (905); The vacuum adsorption assembly (903) comprises a vacuum ring (9031); a plurality of groups of telescopic grooves are arranged in a circular array at the bottom of the vacuum ring (9031); a group of vacuum adsorption blocks (9032) are movably penetrated in each group of telescopic grooves; a group of vacuum suction cups (9033) are arranged at the bottom of each group of vacuum adsorption blocks (9032); a plurality of groups of second electric push rods (9034) are arranged in a circular array at the top of the vacuum ring (9031); each group of the second electric push rods (9034) is provided with a plurality of second electric push rods (9034); ) are transmission-connected to a corresponding group of vacuum adsorption blocks (9032); first ventilation grooves (9035) are provided on the inner walls on both sides of each group of telescopic grooves; the two groups of the first ventilation grooves (9035) are symmetrically arranged; second ventilation grooves (9036) are provided on the inner walls on both sides of each group of vacuum adsorption blocks (9032); the two groups of the second ventilation grooves (9036) are symmetrically arranged; each group of the second ventilation grooves (9036) is movably connected to a corresponding group of the first ventilation grooves (9035); The control rotating ring drives the chip adsorption mechanism (9) and the tin coating head (11) to rotate around the substrate to be packaged to perform three-dimensional packaging.

2. The three-dimensional packaging device for chip manufacturing according to claim 1, characterized in that: The substrate fixing mechanism (14) comprises a substrate clamp (1401); two groups of clamping plates (1402) are symmetrically connected to the output end of the substrate clamp (1401); and a plurality of groups of air injection holes (1403) are evenly spaced on a side wall of each group of clamping plates (1402) away from the substrate clamp (1401).

3. The three-dimensional packaging device for chip manufacturing according to claim 2, characterized in that: A plurality of gas springs (1404) are arranged in a rectangular array on one side wall opposite to the two groups of clamping plates (1402); a flexible limit plate (1405) is arranged at one end of the plurality of gas springs (1404) on the same side away from the corresponding group of clamping plates (1402); and an antistatic soft plate (1406) is arranged on one side wall opposite to the two groups of flexible limit plates (1405).

4. The three-dimensional packaging device for chip manufacturing according to claim 3, characterized in that: Both ends of each group of the clamping plates (1402) are provided with folding columns (1407); limiting grooves (1409) are provided on the opposite side walls of the two groups of the folding columns (1407) on the same side; a group of sealing baffles (1408) is movably penetrated in each group of the limiting grooves (1409); a plurality of groups of compression springs (1410) are evenly spaced in each group of the limiting grooves (1409); and both ends of each group of the compression springs (1410) are respectively connected to the inner wall of the corresponding group of limiting grooves (1409) and the sealing baffle (1408).

5. A packaging method based on the three-dimensional packaging device for chip manufacturing according to any one of claims 1 to 4, characterized in that: The packaging method comprises: Controlling two sets of substrate fixing mechanisms to fix the packaging substrate; Control the chip adsorption mechanism to adsorb a plurality of groups of chips; Control the tinning head to apply solder paste on the package substrate; Control the chip adsorption mechanism to press the chip onto the solder paste; Control the substrate fixing mechanism to blow out hot air flow to heat the solder paste and fix the chip; The control rotating ring drives the chip adsorption mechanism and the tin coating head to rotate to the bottom of the substrate fixing mechanism; Control the chip adsorption mechanism and the tinning head to fix the chip on the bottom of the packaging substrate; Complete the three-dimensional chip packaging work on the double-sided substrate.

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