Wafer scheduling sequence determination method for semiconductor process equipment and electronic device

Abstract

The application provides a wafer scheduling sequence determination method and an electronic device for a semiconductor process equipment. The method comprises the following steps: obtaining a current state of a target scheduling model of the semiconductor process equipment, the state of the target scheduling model comprising a token number of each library and a position vector of a multi-station rotary process chamber in each process chamber of the semiconductor process equipment, the position vector comprising a wafer number in each station of the multi-station rotary process chamber; obtaining target data corresponding to each candidate transition when a wafer scheduling sequence is not determined, the target data comprising a successor state of the target scheduling model after the candidate transition is executed in the current state and a return value of the position vector, the return value comprising a value of a target station of the position vector before the target station changes; determining a target transition at a current time based on the target data; and adding the target transition to the wafer scheduling sequence of the semiconductor process equipment, so as to ensure the generation efficiency of the wafer scheduling sequence and the effectiveness of the wafer scheduling sequence.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor process equipment, in particular to the device scheduling technology in the field of semiconductor process equipment, and more particularly to a wafer scheduling sequence determination method for semiconductor process equipment and an electronic device. BACKGROUND

[0002] With the continuous progress of semiconductor technology, the productivity requirement of semiconductor process equipment is also getting higher and higher. The productivity of semiconductor process equipment is related to the number of chambers mounted thereon. However, due to site restrictions, the semiconductor process equipment will also limit the floor area of the equipment while pursuing productivity. The semiconductor process equipment mounted with multi-station rotary process chambers has become a more efficient equipment structure due to its small floor area and higher productivity per unit area.

[0003] However, the multi-station rotary process chamber changes the simple processing logic architecture of the traditional single-station chamber, and puts forward higher requirements and challenges to the scheduling of semiconductor process equipment. How to quickly and effectively determine the wafer scheduling sequence of the semiconductor process equipment mounted with multi-station rotary process chambers has become a problem to be solved at present. SUMMARY

[0004] To solve the above technical problems, the present application provides a wafer scheduling sequence determination method for semiconductor process equipment and an electronic device to quickly and effectively determine the wafer scheduling sequence of the semiconductor process equipment mounted with multi-station rotary process chambers.

[0005] To achieve the above technical purposes, the embodiments of the present application provide the following technical solutions:

[0006] In a first aspect, the embodiments of the present application provide a wafer scheduling sequence determination method for semiconductor process equipment, the semiconductor process equipment comprising a plurality of chambers and a robot for transferring wafers between the chambers, the chambers comprising process chambers and non-process chambers, the process chambers comprising at least one multi-station rotary process chamber, the method comprising:

[0007] obtaining a current state of a target scheduling model of the semiconductor process equipment; the target scheduling model comprising a plurality of places and a plurality of transitions, each of the places respectively representing available resources of the chambers or the robot, a wafer holding state of the robot, and a processing state of the chambers, and the transitions representing actions performed by the robot; the state of the target scheduling model comprising token numbers of each of the places and a position vector of the multi-station rotary process chamber, the position vector comprising wafer numbers in each station of the multi-station rotary process chamber; the token numbers of each of the places respectively representing available resource numbers of the chambers or the robot, wafer holding numbers of the robot, and wafer numbers in the chambers;

[0008] When the current state represents that the wafer scheduling sequence is not determined to be completed, target data corresponding to each candidate transition is obtained, the target data including a subsequent state of the target scheduling model and a return value of the position vector after the candidate transition is executed in the current state; the candidate transition includes at least some of the multiple transitions, the return value is generated when the position vector changes, and the return value includes the value of the target bit of the position vector before the change, the target bit representing the station for wafer retrieval in the multi-station rotary process chamber;

[0009] A target transition at a current moment is determined based on each target data, and the target transition is added to the wafer scheduling sequence, where the target transition includes a preferred execution action of the robot at the current moment.

[0010] Optionally, obtaining target data corresponding to each candidate transition includes:

[0011] Based on the connection direction between the candidate transition and the target place, updating the token count of the target place, the target place including the place connected to the candidate transition; the connection direction between the candidate transition and the target place is used to determine the direction of change of the token count of the target place when the candidate transition is executed;

[0012] When the target location includes the location corresponding to the multi-station rotary process chamber, the position vector of the multi-station rotary process chamber is updated and the return value is generated based on the current state of the target scheduling model and the robot action corresponding to the candidate transition.

[0013] Optionally, updating the number of tokens of the target place based on the connection direction between the candidate transition and the target place includes:

[0014] When the connection direction between the candidate transition and the target place is directed from the candidate transition to the target place, the number of tokens of the target place is increased by a first preset value; the direction from the candidate transition to the target place indicates that when the robot action corresponding to the candidate transition is executed, the number of resources corresponding to the target place released is the first preset value, the number of wafers held by the robot is increased by the first preset value, or the number of wafers processed by the chamber is increased by the first preset value; or

[0015] When the connection direction between the candidate transition and the target library is directed from the target library to the candidate transition, the number of tokens of the target library is reduced by the first preset value; the direction from the target library to the candidate transition indicates that when the robot action corresponding to the candidate transition is executed, the number of resources corresponding to the target library occupied is the first preset value, the number of wafers held by the robot is reduced by the first preset value, or the number of wafers processed by the chamber is reduced by the first preset value.

[0016] Optionally, updating the position vector of the multi-station rotary process chamber and generating the return value based on the current state of the target scheduling model and the robot action corresponding to the candidate transition includes:

[0017] Determining a current working state of the multi-station rotary process chamber based on a current state of the target scheduling model, where the working state of the multi-station rotary process chamber includes an entering state, a stable state, and an exiting state;

[0018] Based on the current working state of the multi-station rotary process chamber, the robot action corresponding to the candidate transition and the current value of the position vector of the multi-station rotary process chamber, the position vector of the multi-station rotary process chamber is updated and the return value is generated.

[0019] Optionally, updating the position vector of the multi-station rotary process chamber and generating the return value based on the current working state of the multi-station rotary process chamber, the robot action corresponding to the candidate transition, and the current value of the position vector of the multi-station rotary process chamber includes:

[0020] When the current working state of the multi-station rotary process chamber is an entering state or a stable state, taking the current value of the target position in the position vector as a return value;

[0021] An updated value of the position vector is determined based on the robot action corresponding to the candidate transition and a current value of the position vector of the multi-station rotary process chamber.

[0022] Optionally, determining the updated value of the position vector based on the robot action corresponding to the candidate transition and the current value of the position vector of the multi-station rotary process chamber includes:

[0023] If the robot action corresponding to the candidate transition includes placing a wafer into the multi-station rotary process chamber, then deleting the current value of the target position, translating the number of wafers in each station other than the target position in the position vector based on the direction of the target position, and setting the number of wafers in the station where the number of wafers in the position vector is empty to a second preset value;

[0024] If the robot action corresponding to the candidate transition includes taking a wafer from the multi-station rotary process chamber, the value of the target bit is updated to 0.

[0025] Optionally, updating the position vector of the multi-station rotary process chamber and generating the return value based on the current working state of the multi-station rotary process chamber, the robot action corresponding to the candidate transition, and the current value of the position vector of the multi-station rotary process chamber includes:

[0026] When the current working state of the multi-station rotary process chamber is an exit state and the robot action corresponding to the candidate transition includes taking a wafer from the multi-station rotary process chamber, obtaining the current value of the target position;

[0027] If the current value of the target bit is greater than 0, the current value of the target bit is used as the return value, and the value of the target bit is updated to 0;

[0028] If the current value of the target bit is 0, the shift operation is repeatedly performed until the current value of the target bit is greater than 0; the shift operation includes deleting the current value of the target bit, and translating the number of chips in each workstation outside the target bit in the position vector based on the direction of the target bit, and setting the number of chips in the workstation where the number of chips in the position vector is empty to 0.

[0029] Optionally, obtaining the current state of the target scheduling model of the semiconductor process equipment includes:

[0030] When the current state is the initial state, the number of tokens in each location and the position vector of the multi-station rotary process chamber are determined based on the current operating state of the semiconductor process equipment and the configuration information of the chamber and the robot.

[0031] Optionally, determining the target transition at the current moment based on each target data includes:

[0032] If the number of tokens in each of the places and the position vector do not contain a value less than 0, and the return value meets the target value corresponding to the candidate transition, then the candidate transition is used as an enabling transition, and the enabling transition represents an executable action of the manipulator at the current moment;

[0033] When there are multiple enabling transitions, the target transition is determined from the enabling transitions based on the current states of the chambers and / or manipulators corresponding to the libraries connected to the enabling transitions.

[0034] In a second aspect, the embodiments of the present specification provide an electronic device comprising at least one processor and at least one memory having a computer program stored therein, wherein the computer program, when executed by the processor, implements the method for determining a wafer scheduling sequence for a semiconductor process apparatus according to any one of the preceding aspects.

[0035] In a third aspect, the embodiments of the present specification provide a computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the method for determining a wafer scheduling sequence for a semiconductor process apparatus according to any one of the preceding aspects.

[0036] In a fourth aspect, the embodiments of the present specification provide a computer program product or a computer program, wherein the computer program product comprises a computer program stored in a computer readable storage medium; and a processor of the computer device reads the computer program from the computer readable storage medium, and the processor executes the computer program to implement the method for determining a wafer scheduling sequence for a semiconductor process apparatus according to any one of the preceding aspects.

[0037] It can be seen from the above technical solution that the embodiment of the present application provides a method and electronic device for determining a wafer scheduling sequence for semiconductor process equipment. The semiconductor process equipment includes multiple chambers and a robot for transferring wafers between chambers. The chambers include process chambers and non-process chambers. The process chambers include at least one multi-station rotary process chamber. The method for determining a wafer scheduling sequence for semiconductor process equipment obtains the current state of a target scheduling model of the semiconductor process equipment. The target scheduling model includes multiple places and multiple transitions. Each place represents the available resources of the chamber or robot, the wafer holding state of the robot, and the processing state of the chamber. The transition represents the action performed by the robot. The state of the target scheduling model includes the number of tokens of each place and the position vector of the multi-station rotary process chamber. The position vector includes the number of wafers in each station of the multi-station rotary process chamber. The number of tokens of each place represents the number of available resources of the chamber or robot, the number of wafers held by the robot, and the number of wafers in the chamber. Therefore, the state of the target scheduling model can fully describe the state of the multi-station rotary process chamber. The invention relates to a method for determining the processing steps and processing states of semiconductor process equipment in a process chamber; when the current state of a target scheduling model indicates that a wafer scheduling sequence has not been determined to be completed, obtaining target data corresponding to each candidate transition, wherein the candidate transition includes at least part of a plurality of transitions, and the target data includes the subsequent state of the target scheduling model after executing the candidate transition in the current state and the return value of the position vector. The return value is generated when the position vector changes, and the return value includes the value of the target bit of the position vector before the change. The target bit represents the station for taking wafers in a multi-station rotary process chamber, and determining the target transition at the current moment based on each target data, wherein the target transition includes the preferred execution action of the robot at the current moment, and adding the target transition to the wafer scheduling sequence, thereby realizing the automatic generation of the wafer scheduling sequence, thereby ensuring the generation efficiency of the wafer scheduling sequence. At the same time, in the process of determining the wafer scheduling sequence of the semiconductor process equipment, whether the candidate transition meets the execution condition can be determined according to the value of the target bit of the position vector and the state change of the target scheduling model after executing the candidate transition, thereby ensuring the validity of the wafer scheduling sequence. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without any creative work.

[0039] Figure 1 A schematic structural diagram of a semiconductor process equipment provided in accordance with one embodiment of this specification;

[0040] Figure 2 A flowchart of a method for determining a wafer scheduling sequence for semiconductor process equipment provided in accordance with one embodiment of the present specification;

[0041] Figure 3 A schematic diagram of wafer distribution at each station in a multi-station rotary process chamber provided in accordance with one embodiment of the present specification when the working state of the multi-station rotary process chamber is an entry state;

[0042] Figure 4 A schematic diagram of wafer distribution at each station in a multi-station rotary process chamber provided in accordance with one embodiment of the present specification when the multi-station rotary process chamber is in a stable working state;

[0043] Figure 5 A schematic diagram of wafer distribution at each station in a multi-station rotary process chamber provided in accordance with one embodiment of the present specification when the working state of the multi-station rotary process chamber is an exit state;

[0044] Figure 6 A schematic diagram of a process path provided for one embodiment of this specification;

[0045] Figure 7 A schematic diagram of another process path provided for one embodiment of this specification;

[0046] Figure 8 A schematic diagram of the connection between a transition and movement place and a processing place is provided for one embodiment of this specification;

[0047] Figure 9 A schematic diagram of the structure of a target scheduling model provided for one embodiment of this specification. DETAILED DESCRIPTION

[0048] Unless otherwise defined, technical or scientific terms used in the embodiments of this specification should have the same ordinary meaning as those understood by persons of ordinary skill in the art to which this specification pertains. The terms "first," "second," and similar terms used in the embodiments of this specification do not denote any order, quantity, or importance, but are provided solely to avoid confusion between constituent elements.

[0049] Unless the context requires otherwise, throughout this specification, the term "plurality" means "at least two," and "including" is to be interpreted as open and inclusive, meaning "including, but not limited to." Throughout this specification, the terms "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of this specification. The schematic representations of these terms do not necessarily refer to the same embodiment or example.

[0050] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the embodiments described are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this specification.

[0051] Overview

[0052] As described in the background technology, with the continuous advancement of semiconductor technology, the production capacity requirements of semiconductor process equipment are becoming increasingly higher. The production capacity of semiconductor process equipment is related to the number of chambers mounted on it. However, due to site limitations, semiconductor process equipment will also limit the equipment's footprint while pursuing production capacity.

[0053] Semiconductor processing equipment equipped with a multi-station rotary process chamber can achieve simultaneous processing at multiple stations, occupy a small area, and have high production capacity per unit area. By rotating the turntable inside the chamber, the wafer undergoes a process at each processing station, which can ensure the consistency of the process and process results of different wafers, thereby becoming a more efficient equipment structure. Taking a rotary process chamber with four stations as an example, a wafer is placed in the chamber of the first station. After completing a process, it rotates clockwise to the second station. At the same time, a second wafer can be placed in the chamber of the first station. After completing a process, the first wafer rotates to the third station, and the second wafer rotates to the second station. At this time, a third wafer can be placed in the chamber of the first station. After completing a process, the first wafer rotates to the fourth station, the second wafer rotates to the third station, and the third wafer rotates to the second station. At this time, a fourth wafer can be placed in the chamber of the first station. After completing a process, the first wafer is removed, rotated once, and the fifth wafer can be placed in the chamber of the first station.

[0054] At the same time, semiconductor processing and manufacturing is one of the more complex manufacturing industries. In order to adapt to the complexity and precision requirements of semiconductor processing, semiconductor process equipment is often composed of a variety of modules. For example, commonly used semiconductor process equipment is called cluster equipment, such as Figure 1 As shown, it generally includes modules such as a processing chamber (101, 102), a vacuum transfer robotic arm (VTR) 103, a vacuum lock (LL, Loadlock) (104, 105) and an equipment front end module (EFEM, Equipment Front End Module) 106. The equipment front end module 106 can be further disassembled into an atmospheric transfer robotic arm (ATR) 1061, a load port (LP, LoadPort) 1062 and an aligner 1063. The process chamber may include a single-station chamber 101 and a rotary process chamber 102. The vacuum lock may include a first vacuum lock 104 and a second vacuum lock 105. Through the scheduling of semiconductor process equipment, the processing sequence of wafers in various modules in the semiconductor process equipment can be reasonably arranged, so that a certain number of wafers can be completed in a shorter time or the equipment production capacity can be increased under the premise of meeting the process requirements.

[0055] However, the multi-station rotary process chamber has changed the simple processing logic architecture of the traditional single-station chamber, and has put forward higher requirements and challenges for the scheduling of semiconductor process equipment. How to quickly and effectively determine the wafer scheduling sequence of semiconductor process equipment equipped with a multi-station rotary process chamber has become a problem that needs to be solved urgently.

[0056] In order to solve the problem that traditional methods cannot quickly and effectively determine the wafer scheduling sequence of semiconductor process equipment mounted with a multi-station rotary process chamber, in the technical solution of the present application, the semiconductor process equipment includes multiple chambers and a robot for transferring wafers between chambers, the chambers include process chambers and non-process chambers, and the process chambers include at least one multi-station rotary process chamber. The wafer scheduling sequence determination method for semiconductor process equipment obtains the current state of a target scheduling model of the semiconductor process equipment. The target scheduling model includes multiple places and multiple transitions. Each place represents the available resources of the chamber or robot, the wafer holding state of the robot, and the processing state of the chamber. The transition represents the action performed by the robot. The state of the target scheduling model includes the number of tokens in each place and the position vector of the multi-station rotary process chamber. The position vector includes the number of wafers in each station of the multi-station rotary process chamber. The number of tokens in each place represents the number of available resources of the chamber or robot, the number of wafers held by the robot, and the number of wafers in the chamber. Therefore, the state of the target scheduling model can fully describe the multi-station mounted semiconductor process chamber. The invention relates to a method for determining a target transition of a semiconductor process equipment in a rotary process chamber and a method for determining a target transition of a semiconductor process equipment in a rotary process chamber. The method comprises: obtaining target data corresponding to each candidate transition when the current state of the target scheduling model indicates that the wafer scheduling sequence has not been determined to be completed; obtaining target data corresponding to each candidate transition; the candidate transition includes at least part of a plurality of transitions; the target data includes the subsequent state of the target scheduling model after executing the candidate transition in the current state and the return value of the position vector; the return value is generated when the position vector changes; the return value includes the value of the target bit of the position vector before the change; the target bit represents the station for taking wafers in the multi-station rotary process chamber; determining the target transition at the current moment based on each target data; the target transition includes the preferred execution action of the robot at the current moment; and adding the target transition to the wafer scheduling sequence, thereby realizing the automatic generation of the wafer scheduling sequence, thereby ensuring the generation efficiency of the wafer scheduling sequence; and at the same time, in the process of determining the wafer scheduling sequence of the semiconductor process equipment, determining whether the candidate transition meets the execution condition according to the value of the target bit of the position vector and the state change of the target scheduling model after executing the candidate transition, thereby ensuring the validity of the wafer scheduling sequence.

[0057] Based on the above-mentioned inventive concept, the wafer scheduling sequence determination method for semiconductor process equipment provided in the embodiment of this specification is exemplarily described below.

[0058] Exemplary Methods

[0059] refer to Figure 2An embodiment of this specification provides a method for determining a wafer scheduling sequence for semiconductor process equipment, wherein the semiconductor process equipment includes multiple chambers and a robot for transferring wafers between chambers, wherein the chambers include process chambers and non-process chambers, and wherein the process chambers include at least one multi-station rotary process chamber. The method includes:

[0060] S201. Obtain the current state of the target scheduling model of the semiconductor process equipment; the target scheduling model includes multiple places and multiple transitions, each of the places represents the available resources of the chamber or the robot, the wafer holding state of the robot, and the processing state of the chamber, and the transition represents the action performed by the robot; the state of the target scheduling model includes the number of tokens of each place and the position vector of the multi-station rotary process chamber, and the position vector includes the number of wafers in each station of the multi-station rotary process chamber; the number of tokens of each place represents the number of available resources of the chamber or the robot, the number of wafers held by the robot, and the number of wafers in the chamber.

[0061] Specifically, the semiconductor process equipment may include multiple chambers and at least one robot for transferring wafers between chambers. The chambers may include process chambers and non-process chambers, wherein the process chambers may include at least one multi-station rotary process chamber and may also include single-station chambers. The non-process chambers may include vacuum locks and calibration positions, etc. The robots may include vacuum robots, atmospheric robots, etc.

[0062] The target scheduling model of semiconductor process equipment can be constructed based on the target process path of the semiconductor process equipment. The target scheduling model can be a Petri net model, including a place set P and a transition set T. The place set P can include multiple places, and the transition set T can include multiple transitions. The transitions and places can be connected alternately, and the places and transitions can be connected through directed edges. Each directed edge can constitute a directed edge set F, that is, the target scheduling model N can be expressed as N = (P, T, F).

[0063] For any place, the place can represent one of the available resources of the chamber or robot, the film holding state of the robot, and the processing state of the chamber; for any transition, the transition can represent the action performed by the robot, and the action performed by the robot can include taking and placing the film.

[0064] The place set P can include the resource place set S, the mobile place set A and the processing place set H, that is, P = A∪H∪S, and The resource location set S may include multiple resource locations, each used to represent the available resources of a chamber or robot. The mobile location set A may include multiple mobile locations, each used to represent the wafer holding status of the robot. The processing location set H may include multiple processing locations, each used to represent the processing status of the chamber. For example, the processing location corresponding to a process chamber represents the process status of the process chamber. The processing location corresponding to a vacuum lock represents the switching status between the vacuum environment and the atmospheric environment of the vacuum lock. The processing location corresponding to a calibration position represents the wafer calibration status of the calibration position.

[0065] During implementation, a resource library and a processing library can be constructed for each chamber according to the target process path of the semiconductor process equipment, and a resource library and a moving library can be constructed for each robot.

[0066] The state of the target scheduling model refers to the current state of the target scheduling model. The state of the target scheduling model can include the number of tokens in each location. The number of tokens in the resource location can represent the available resources in the chamber or robot, that is, the number of wafers that can be accommodated in the remaining space. The number of tokens in the mobile location can represent the number of wafers held by the robot, that is, the occupied space. The number of tokens in the processing location can represent the number of wafers in the chamber, that is, the occupied space. It is understood that the total number of tokens in all locations remains unchanged and changes only with the flow of wafer processing status.

[0067] The state of the target scheduling model may also include a position vector of each multi-station rotary process chamber. The position vector of the multi-station rotary process chamber may include multiple data bits, each of which represents a plurality of stations in the multi-station rotary process chamber. For any data bit in the position vector, the value of the data bit represents the number of wafers in the corresponding station in the multi-station rotary process chamber. It is understandable that a chamber for a station can hold one wafer or multiple wafers. In addition, the number of tokens of the resource library corresponding to the multi-station rotary process chamber may include the sum of the number of wafers that can be accommodated by each station, and the number of tokens of the processing library corresponding to the multi-station rotary process chamber may include the sum of the number of wafers in each station.

[0068] Therefore, the state of the target scheduling model can completely describe the processing steps and changes in the processing state of the semiconductor process equipment equipped with a multi-station rotary process chamber.

[0069] S202. When the current state represents that the wafer scheduling sequence is not determined to be completed, the target data corresponding to each candidate transition is obtained, the target data including the subsequent state of the target scheduling model and the return value of the position vector after the candidate transition is executed in the current state; the candidate transition includes at least part of the multiple transitions, the return value is generated when the position vector changes, and the return value includes the value of the target bit of the position vector before the change, and the target bit represents the station for taking wafers in the multi-station rotary process chamber.

[0070] Specifically, the chip scheduling sequence of the semiconductor process equipment may include a transition sequence, that is, the transitions may be executed in a sequential order to realize the scheduling of the semiconductor process equipment. In the process of determining the chip scheduling sequence of the semiconductor process equipment, before determining a new transition, it may be first detected whether the chip scheduling sequence is determined to be completed. For example, the termination state of the target scheduling model may be set, and when the current state of the target scheduling model is the termination state, it indicates that the chip scheduling sequence is determined to be completed. The termination state may include that the number of tokens of each resource library is the maximum number of tokens of the resource library, the number of tokens of each mobile library and the number of tokens of each processing library are all 0, and at the same time, there are no new chips to be placed in the loading port. It is understandable that the library corresponding to the loading port may not be set.

[0071] When the wafer scheduling sequence characterized by the current state is determined to be complete, the current wafer scheduling sequence may be used as the final wafer scheduling sequence and output.

[0072] When the current state characterizes the wafer scheduling sequence and is not yet complete, a new transition can be determined based on the current state of the target scheduling model. During the process of determining the new transition, the target data corresponding to each candidate transition can be obtained. Candidate transitions can include all transitions in the transition set T or some of the transitions in the transition set T. For example, candidate transitions can be determined based on the current state of the target scheduling model and the historical scheduling sequence, or they can be randomly selected from the transition set T.

[0073] For any candidate transition, the target data for the candidate transition may include the subsequent state of the target scheduling model after executing the candidate transition in the current state. The subsequent state is the state of the target scheduling model after executing the candidate transition in the current state. In implementation, the number of tokens in each target place can be updated based on the robot action corresponding to the candidate transition, or based on the connection direction between the candidate transition and each target place. The target place is the place connected to the candidate transition. Furthermore, when the target place includes a place corresponding to a multi-station rotary process chamber, that is, the robot action corresponding to the candidate transition is used to place or remove a wafer from the multi-station rotary process chamber, the position vector of the multi-station rotary process chamber can also be updated based on the robot action corresponding to the candidate transition. Simultaneously, a return value of the position vector of the multi-station rotary process chamber is obtained. The return value may include the value of the target position of the multi-station rotary process chamber before the position vector of the multi-station rotary process chamber was updated. This return value can be used to determine whether the robot action corresponding to the candidate transition can be executed. For example, the target position can represent the station in the multi-station rotary process chamber used for removing wafers.

[0074] S203 , determining a target transition at a current moment based on each target data, and adding the target transition to the wafer scheduling sequence, wherein the target transition includes a preferred execution action of the robot at the current moment.

[0075] Specifically, when there are multiple candidate transitions, it is possible to determine whether each candidate transition meets the execution condition based on the target data corresponding to each candidate transition, and then determine one candidate transition from the candidate transitions that meet the execution condition as the target transition. When there is only one candidate transition, it is possible to determine whether the candidate transition meets the execution condition based on the target data corresponding to the candidate transition, and if the candidate transition meets the execution condition, the candidate transition is used as the target transition. That is, the target transition includes the preferred execution action of the robot at the current moment.

[0076] For any candidate transition, when determining whether the candidate transition meets the execution conditions based on the target data corresponding to the candidate transition, when there is no value less than 0 in the number of tokens and the position vector of each library, and the return value of the position vector meets the target value corresponding to the candidate transition, it is determined that the candidate transition meets the execution conditions; when there is a value less than 0 in the number of tokens or the position vector of each library, or the return value of the position vector does not meet the target value corresponding to the candidate transition, it is determined that the candidate transition does not meet the execution conditions. By comprehensively considering the number of tokens in each library, the number of chips in each workstation in the position vector and the return value of the position vector, the reliability of the determination result of whether the candidate transition meets the execution conditions can be effectively guaranteed, thereby ensuring the effectiveness of the chip scheduling sequence.

[0077] It is understandable that if there is no candidate transition that meets the execution condition, steps S202 and S203 may be repeatedly executed until the target transition is obtained.

[0078] After obtaining the target transition, the target transition can be added to the chip scheduling sequence of the semiconductor process equipment, and step S201 is repeated until the chip scheduling sequence is determined and completed, thereby realizing the automatic generation of the chip scheduling sequence and ensuring the generation efficiency of the chip scheduling sequence.

[0079] In order to quickly and effectively obtain the target data corresponding to each candidate transition, in one embodiment of the present specification, obtaining the target data corresponding to each candidate transition includes:

[0080] Based on the connection direction between the candidate transition and the target place, updating the token count of the target place, the target place including the place connected to the candidate transition; the connection direction between the candidate transition and the target place is used to determine the direction of change of the token count of the target place when the candidate transition is executed;

[0081] When the target location includes the location corresponding to the multi-station rotary process chamber, the position vector of the multi-station rotary process chamber is updated and the return value is generated based on the current state of the target scheduling model and the robot action corresponding to the candidate transition.

[0082] Specifically, in the process of constructing a target scheduling model, after determining multiple places and multiple transitions, the connection direction between the places and the transitions can be further determined, that is, the direction of the directed edge between the places and the transitions. For any transition, the target place corresponding to the transition may include the place connected to the transition. When the transition is executed, the number of tokens of the corresponding target place will change. A corresponding relationship can be set between the transition, the target place, the connection direction, and the direction of change in the number of tokens. In implementation, based on the connection direction between the transition and the corresponding target place and the corresponding relationship, the direction of change in the number of tokens of the corresponding target place when the transition is executed can be determined. The direction of change in the number of tokens can be either increase or decrease.

[0083] At the same time, the number of pieces taken or put when the transition is executed can be determined based on the configuration information of the manipulator corresponding to the transition, and the number of pieces taken or put can be used as the change in the number of tokens of each target library. Therefore, the number of tokens of each target library can be updated quickly and accurately based on the change direction and change amount of the number of tokens of the target library.

[0084] It can be understood that, for each place other than the target place in the place set P, the number of tokens thereof may remain unchanged when the candidate transition is executed.

[0085] At the same time, it can be determined whether the target location corresponding to the candidate transition includes the location corresponding to the multi-station rotary process chamber. If not, the position vector of the multi-station rotary process chamber may not be updated, and the return value of the position vector is empty. If included, the position vector of the multi-station rotary process chamber may be updated based on the current state of the target scheduling model and the action of the robot corresponding to the candidate transition, and the return value of the position vector is generated. For example, the current working state of the multi-station rotary process chamber may be determined based on the current state of the target scheduling model, and the position vector of the multi-station rotary process chamber may be updated and the return value of the position vector is generated based on the current working state of the multi-station rotary process chamber, the action of the robot corresponding to the candidate transition, and the current value of the position vector of the multi-station rotary process chamber.

[0086] Among them, the working state of the multi-station rotary process chamber may include an entry state, a steady state and an exit state. The entry state may include the state when a wafer enters the multi-station rotary process chamber and no wafer is taken out after processing, that is, the state before the multi-station rotary process chamber is fully loaded; the steady state may include the state when a wafer enters the multi-station rotary process chamber and a wafer is taken out after processing, that is, the state when the multi-station rotary process chamber is fully loaded; the exit state may include the state when no wafer enters the multi-station rotary process chamber and there are wafers being processed, that is, the state when the multi-station rotary process chamber is about to end its work. Taking a multi-station rotary process chamber with four stations as an example, when the working states of the multi-station rotary process chamber are the entry state, the steady state and the exit state, the wafer distribution of each station in the multi-station rotary process chamber can be as follows: Figures 3 to 5 As shown, Figure 3 In the embodiment, wafer a and wafer b have entered the multi-station rotary process chamber and are undergoing process processing, and no wafer has been taken out after processing. At this time, the working state of the multi-station rotary process chamber is the entry state; Figure 4 In the example, wafer a, wafer b, wafer c, and wafer d are processed 4 / 3 / 2 / 1 times respectively. That is, wafer a can be taken out after processing. At the same time, wafer e can be put in after wafer a is taken out. At this time, the working state of the multi-station rotary process chamber is stable. Figure 5 In the figure, wafer d and wafer e are in the processing state, and no new wafer enters. At this time, the working state of the multi-station rotary process chamber is the exit state.

[0087] In a feasible implementation, updating the number of tokens of the target place based on the connection direction between the candidate transition and the target place includes:

[0088] When the connection direction between the candidate transition and the target place is directed from the candidate transition to the target place, the number of tokens of the target place is increased by a first preset value; the direction from the candidate transition to the target place indicates that when the robot action corresponding to the candidate transition is executed, the number of resources corresponding to the target place released is the first preset value, the number of wafers held by the robot is increased by the first preset value, or the number of wafers processed by the chamber is increased by the first preset value; or

[0089] When the connection direction between the candidate transition and the target library is directed from the target library to the candidate transition, the number of tokens of the target library is reduced by the first preset value; the direction from the target library to the candidate transition indicates that when the robot action corresponding to the candidate transition is executed, the number of resources corresponding to the target library occupied is the first preset value, the number of wafers held by the robot is reduced by the first preset value, or the number of wafers processed by the chamber is reduced by the first preset value.

[0090] Specifically, when constructing a target scheduling model, a transition pointing to a location may indicate that the robot action corresponding to the transition releases the resources corresponding to the target location, increases the number of wafers held by the robot, or increases the number of wafers processed by the chamber when the transition is executed. A location-pointing transition may indicate that the robot action corresponding to the transition occupies the resources corresponding to the target location, reduces the number of wafers held by the robot, or reduces the number of wafers processed by the chamber when the transition is executed.

[0091] In implementation, when constructing a target scheduling model, after determining multiple locations and multiple transitions, the transitions, mobile locations, and processing locations can be connected based on the target process path of the semiconductor process equipment. For example, the transitions can be divided into wafer pickup transitions and wafer placement transitions according to the robot actions corresponding to the transitions, and the transitions, mobile locations, and processing locations can be connected in sequence in the order and direction of "wafer pickup transition → mobile location → wafer placement transition → processing location → wafer pickup transition", that is, the wafer pickup transition points to the mobile location, the wafer placement transition points to the processing location, and the wafer pickup transition can increase the mechanical The number of wafers held by the hand, the wafer placement transition can increase the number of wafers processed by the chamber. Therefore, for any transition, the robot action corresponding to the transition can increase the number of tokens pointing to the mobile library or processing library when it is executed; at the same time, the mobile library points to the wafer placement transition, and the processing library points to the wafer retrieval transition. Since the wafer placement transition can reduce the number of wafers held by the robot, the wafer retrieval transition can reduce the number of wafers processed by the chamber. Therefore, for any transition, the robot action corresponding to the transition can reduce the number of tokens pointing to the mobile library or processing library when it is executed.

[0092] In addition, for any transition, the resource library connected by the transition can be obtained, which can include the resource library corresponding to the chamber and the resource library corresponding to the robot; at the same time, the connection direction of the transition and the resource library connected therewith can be determined according to the robot action corresponding to the transition. When the robot action corresponding to the transition is picking, the connection direction is from the transition to the resource library corresponding to the chamber, and from the resource library corresponding to the robot to the transition; when the robot action corresponding to the transition is placing, the connection direction is from the transition to the resource library corresponding to the robot, and from the resource library corresponding to the chamber to the transition; that is, the picking transition points to the resource library corresponding to the chamber, and the placing transition points to the resource library corresponding to the robot, since the picking transition releases the resource corresponding to the chamber, and the placing transition releases the resource corresponding to the robot, therefore, for any transition, the robot action corresponding to the transition can increase the token number of the pointed resource library when executed; at the same time, the resource library corresponding to the robot points to the picking transition, and the resource library corresponding to the chamber points to the placing transition, since the picking transition occupies the resource corresponding to the robot, and the placing transition occupies the resource corresponding to the chamber, therefore, for any transition, the robot action corresponding to the transition can reduce the token number of the resource library pointed to the transition when executed, so as to improve the updating efficiency of the state of the target state model while realizing the automatic construction of the target scheduling model.

[0093] In the process of determining the wafer scheduling sequence of the semiconductor process equipment, for any candidate transition, the token number of each target library pointed to by the candidate transition is increased by a first preset value, and the token number of each target library pointed to the candidate transition is reduced by the first preset value, the first preset value can be determined according to the configuration information of the robot corresponding to the candidate transition, for example, the first preset value can be the number of picking or placing of the robot corresponding to the candidate transition each time, so as to quickly and effectively update the token number of each target library.

[0094] In a feasible implementation, the updating the position vector of the multi-station rotary process chamber and generating the return value based on the current state of the target scheduling model and the robot action corresponding to the candidate transition comprises:

[0095] determining the current working state of the multi-station rotary process chamber based on the current state of the target scheduling model, the working state of the multi-station rotary process chamber including an entering state, a stable state and an exiting state;

[0096] updating the position vector of the multi-station rotary process chamber and generating the return value based on the current working state of the multi-station rotary process chamber, the robot action corresponding to the candidate transition and the current value of the position vector of the multi-station rotary process chamber.

[0097] Specifically, based on the number of tokens of each library in the current state of the target scheduling model, it can be determined whether there are chips being processed before the multi-station rotary process chamber. For example, if the number of tokens of the processing library and / or the mobile library before the library corresponding to the multi-station rotary process chamber is greater than 0, it means that there are chips being processed before the multi-station rotary process chamber. If the number of tokens of the processing library and the mobile library before the library corresponding to the multi-station rotary process chamber are both 0, it means that there are no chips being processed before the multi-station rotary process chamber.

[0098] If there were wafers being processed in the multi-station rotary process chamber before, and the number of wafers in each station in the position vector of the multi-station rotary process chamber has a value greater than 0, it means that the current working state of the multi-station rotary process chamber is the entering state or the stable state.

[0099] If the multi-station rotary process chamber has not previously processed any wafers, and the number of wafers in each station in the position vector of the multi-station rotary process chamber has a value greater than 0, it indicates that the current working state of the multi-station rotary process chamber is the exit state.

[0100] During implementation, the position vector of the multi-station rotary process chamber can be updated and the return value of the position vector can be generated based on the current working status of the multi-station rotary process chamber, the robot action corresponding to the candidate transition and the current value of the position vector of the multi-station rotary process chamber, thereby effectively ensuring that the position vector update result and the return value are consistent with the actual working of the multi-station rotary process chamber, thereby improving the effectiveness of the position vector update result and the return value.

[0101] In a feasible embodiment, updating the position vector of the multi-station rotary process chamber and generating the return value based on the current working state of the multi-station rotary process chamber, the robot action corresponding to the candidate transition, and the current value of the position vector of the multi-station rotary process chamber includes:

[0102] When the current working state of the multi-station rotary process chamber is an entering state or a stable state, taking the current value of the target position in the position vector as a return value;

[0103] An updated value of the position vector is determined based on the robot action corresponding to the candidate transition and a current value of the position vector of the multi-station rotary process chamber.

[0104] Specifically, when the current operating state of the multi-station rotary process chamber is the entry state or the steady state, a target position can be determined based on the target rotation direction of the multi-station rotary process chamber. The target position represents the position in the multi-station rotary process chamber used for wafer removal, that is, the position in the multi-station rotary process chamber where the last wafer processing is performed. The current value of the target position in the position vector of the multi-station rotary process chamber can be used as the return value. Therefore, based on the current value of the target position, it is possible to effectively determine whether the multi-station rotary process chamber meets the wafer placement or removal conditions, and further determine whether the execution conditions of the candidate transition are met.

[0105] In addition, the updated value of the position vector can be determined based on the robot action corresponding to the candidate transition and the current value of the position vector of the multi-station rotary process chamber. For example, the change state of the wafers in the multi-station rotary process chamber when the candidate transition is executed can be determined based on the robot action corresponding to the candidate transition. The updated value of the position vector can also be determined based on the change state of the wafers in the multi-station rotary process chamber when the candidate transition is executed and the current value of the position vector of the multi-station rotary process chamber, thereby effectively ensuring the reliability of the determination result of the updated value of the position vector.

[0106] In a feasible embodiment, determining the updated value of the position vector based on the robot action corresponding to the candidate transition and the current value of the position vector of the multi-station rotary process chamber includes:

[0107] If the robot action corresponding to the candidate transition includes placing a wafer into the multi-station rotary process chamber, then deleting the current value of the target position, translating the number of wafers in each station other than the target position in the position vector based on the direction of the target position, and setting the number of wafers in the station where the number of wafers in the position vector is empty to a second preset value;

[0108] If the robot action corresponding to the candidate transition includes taking a wafer from the multi-station rotary process chamber, the value of the target bit is updated to 0.

[0109] Specifically, if the robot action corresponding to the candidate transition includes placing a wafer into a multi-station rotary process chamber, the multi-station rotary process chamber needs to be triggered to rotate once. Through the rotation, the chambers of each station except the station for taking the wafer rotate to the next station. At the same time, the chamber of the station for taking the wafer rotates to the station for placing the wafer. At this time, a wafer that has not been processed by the multi-station rotary process chamber can be placed in the chamber of the station for placing the wafer. The station for taking the wafer can be physically adjacent to the station for placing the wafer. For example, taking a multi-station rotary process chamber containing four stations as an example, the first station can be the station for placing the wafer, and the fourth station can be the station for taking the wafer. The first to fourth stations are arranged in sequence, and the fourth station is adjacent to the first station. In the process of updating the position vector, the current value of the target position in the position vector can be deleted, and the number of chips in each station other than the target position in the position vector can be translated one station toward the target position. At this time, the number of chips in the station for placing chips is empty, and the number of chips in the station with an empty number of chips is set to a second preset value. The second preset value can be the number of chips that can be placed by the robot corresponding to the candidate transition each time, so as to simulate the state change of the chips in the multi-station rotary process chamber when the robot places chips into the multi-station rotary process chamber.

[0110] If the robot action corresponding to the candidate transition includes taking wafers from a multi-station rotary process chamber, the value of the target bit can be directly updated to 0, and the number of wafers in the remaining stations remains unchanged to simulate the state change of the wafers in the multi-station rotary process chamber when the robot takes wafers from the multi-station rotary process chamber in the entering state or stable state.

[0111] Therefore, the position vector of the multi-station rotary process chamber can be updated according to the state change of the chip in the multi-station rotary process chamber when the chip is placed in or taken out of the multi-station rotary process chamber, ensuring that the update result of the position vector conforms to the actual working of the multi-station rotary process chamber, and further ensuring the effectiveness of the update result of the position vector, providing technical support for improving the effectiveness of the determination result of the chip scheduling sequence.

[0112] In a feasible embodiment, updating the position vector of the multi-station rotary process chamber and generating the return value based on the current working state of the multi-station rotary process chamber, the robot action corresponding to the candidate transition, and the current value of the position vector of the multi-station rotary process chamber includes:

[0113] When the current working state of the multi-station rotary process chamber is an exit state and the robot action corresponding to the candidate transition includes taking a wafer from the multi-station rotary process chamber, obtaining the current value of the target position;

[0114] If the current value of the target bit is greater than 0, the current value of the target bit is used as the return value, and the value of the target bit is updated to 0;

[0115] If the current value of the target bit is 0, the shift operation is repeatedly performed until the current value of the target bit is greater than 0; the shift operation includes deleting the current value of the target bit, and translating the number of chips in each workstation outside the target bit in the position vector based on the direction of the target bit, and setting the number of chips in the workstation where the number of chips in the position vector is empty to 0.

[0116] Specifically, when the current working state of the multi-station rotary process chamber is the exit state, it indicates that the multi-station rotary process chamber has not previously processed any wafers. At this time, if the robot action corresponding to the candidate transition includes placing a wafer into the multi-station rotary process chamber, the updated value of the position vector can be determined according to the position vector update method when the current working state of the multi-station rotary process chamber is a non-exit state (i.e., an entry state or a stable state) and the robot action corresponding to the candidate transition includes placing a wafer into the multi-station rotary process chamber. It can be understood that since the multi-station rotary process chamber has not previously processed any wafers, i.e., there are no wafers that can be placed into the multi-station rotary process chamber, the candidate transition cannot meet the execution conditions. When determining the candidate transition, the transition can be omitted as a candidate transition.

[0117] If the robot action corresponding to the candidate transition includes removing a wafer from a multi-station rotary process chamber, the current value of the target bit in the position vector of the multi-station rotary process chamber can be obtained. If the current value of the target bit is greater than 0, it indicates that a wafer is present at the station in the multi-station rotary process chamber used for removing wafers, and the wafer removal operation can be performed. In this case, the current value of the target bit can be directly used as the return value, and the value of the target bit can be updated to 0.

[0118] If the current value of the target position is 0, it indicates that there is no chip at the station used for taking chips in the multi-station rotary process chamber, and chip taking cannot be performed. At this time, a shift operation can be performed. The shift operation can include deleting the current value of the target position in the position vector, and translating the number of chips in each station other than the target position in the position vector by one station in the direction of the target position, so as to rotate the chips in the multi-station rotary process chamber to the next station for process processing. At this time, the number of chips at the station used for placing chips is empty. Since no new chips enter the multi-station rotary process chamber, the number of chips at the station with an empty number of chips can be set to 0 to simulate the state change of the chips in the multi-station rotary process chamber when the robot takes chips to the multi-station rotary process chamber in the exit state.

[0119] After performing a shift operation once, the current value of the target bit can be further obtained, if the current value of the target bit is greater than 0, the current value of the target bit can be directly taken as the return value, and the value of the target bit is updated to 0, if the current value of the target bit is 0, a shift operation can be continued once, until the value of the target bit is greater than 0, so that the position vector of the multi-station rotary process chamber and the return value of the position vector can be updated according to the state change of the wafer in the multi-station rotary process chamber when the wafer is taken out from the multi-station rotary process chamber in the exit state, which ensures that the return value and the updated value of the position vector conform to the actual work of the multi-station rotary process chamber, and further ensures the effectiveness of the updated result of the return value and the position vector, thereby providing technical support for improving the effectiveness of the determination result of the wafer scheduling sequence.

[0120] In order to further improve the effectiveness of the determination result of the wafer scheduling sequence, in an embodiment of the present specification, the current state of the target scheduling model of the semiconductor process equipment is obtained, including:

[0121] When the current state is an initial state, based on the current running state of the semiconductor process equipment and the configuration information of the chamber and the robot, the token number of each library and the position vector of the multi-station rotary process chamber are determined.

[0122] Specifically, the initial state can be the state of the target scheduling model when starting to determine the wafer scheduling sequence. When the current state of the target scheduling model is the initial state, it indicates that the wafer scheduling sequence is empty, at this time, the current running state of the semiconductor process equipment can be obtained, the current running state can include a process processing state and an idle state, the process processing state indicates that there is a wafer being processed in the semiconductor process equipment, and the idle state indicates that there is no wafer being processed in the semiconductor process equipment.

[0123] Among them, when the current running state of the semiconductor process equipment is an idle state, the token number of each library and the position vector of the multi-station rotary process chamber can be determined based on the configuration information of the chamber and the robot, for example, the token number of the resource library can be the capacity of the chamber or the robot corresponding to the resource library, that is, the maximum number of wafers that can be put in or held, the token number of the moving library and the processing library can be 0, and at the same time, the number of wafers in each station of the position vector of the multi-station rotary process chamber is 0.

[0124] When the current running state of the semiconductor process equipment is the process processing state, the token number of each library and the position vector of the multi-station rotary process chamber can be determined based on the current position of the wafer in the semiconductor process equipment and the configuration information of the chamber and the robot, for example, the token number of the resource library can be the difference between the capacity of the chamber or the robot corresponding to the resource library and the number of wafers in the chamber or the robot corresponding to the resource library, the token number of the moving library can be the number of wafers in the robot corresponding to the moving library, and the token number of the processing library can be the number of wafers in the chamber corresponding to the processing library; at the same time, the number of wafers in each station of the position vector of the multi-station rotary process chamber can be the number of wafers in each station of the multi-station rotary process chamber.

[0125] It can be understood that when the current state of the target scheduling model is a non-initial state, that is, the current state is a state after the target transition is performed in the last state of the target scheduling model, the current state can include a successor state after the target transition is performed in the last state of the target scheduling model.

[0126] Therefore, the accuracy of the determination result of the current state of the target scheduling model can be effectively ensured, and the effectiveness of the determination result of the wafer scheduling sequence can be further improved in the process of determining the wafer scheduling sequence according to the current state of the target scheduling model.

[0127] In order to further improve the effectiveness of the determination result of the wafer scheduling sequence, in an embodiment of the present specification, the target transition at the current time is determined based on each target data, comprising:

[0128] If there is no value less than 0 in each token number of the library and the position vector, and the return value meets the target value corresponding to the candidate transition, the candidate transition is taken as an enabling transition, and the enabling transition represents an executable action of the robot at the current time;

[0129] When the number of the enabling transitions is more than one, the target transition is determined from each of the enabling transitions based on the current state of the chamber and / or the robot corresponding to the library connected by each of the enabling transitions.

[0130] Specifically, for any candidate transition, when the number of tokens of each library in the successor state corresponding to the candidate transition is not less than 0, and there is no value less than 0 in the position vector, it can be further determined whether there is a library corresponding to the multi-station rotary process chamber in the library connected by the candidate transition. If there is, it can be further determined whether the return value of the position vector of the multi-station rotary process chamber meets the target value corresponding to the candidate transition, for example, the return value of the position vector of the multi-station rotary process chamber can be determined to meet the target value corresponding to the candidate transition when the return value of the position vector of the multi-station rotary process chamber is the same as the target value corresponding to the candidate transition, otherwise, the return value of the position vector of the multi-station rotary process chamber is determined to not meet the target value corresponding to the candidate transition. Wherein, if it meets, it indicates that the candidate transition meets the execution condition and can be an enabled transition, if it does not meet, it indicates that the candidate transition does not meet the execution condition and cannot be an enabled transition. Wherein, the enabled transition represents the executable action of the robot at the current time, that is, the enabled transition includes the transition that meets the execution condition under the current state of the target scheduling model.

[0131] Wherein, when the robot action corresponding to the candidate transition is to place a wafer to the multi-station rotary process chamber, the target value corresponding to the candidate transition can be 0, indicating that there is no wafer in the station for taking wafer in the multi-station rotary process chamber, at this time, the chamber in the station for taking wafer can be rotated to the station for placing wafer and a new wafer is placed; when the robot action corresponding to the candidate transition is to take a wafer from the multi-station rotary process chamber, the target value corresponding to the candidate transition can be a specified value, which can be the number of wafers taken by the robot each time, indicating that there is a wafer in the station for taking wafer in the multi-station rotary process chamber, and the taking action can be performed.

[0132] It can be understood that when any of the following conditions is met: there is a value less than 0 in the number of tokens of each library in the successor state corresponding to the candidate transition, there is a value less than 0 in the position vector, and the return value of the position vector of the multi-station rotary process chamber does not meet the target value corresponding to the candidate transition, it indicates that the candidate transition does not meet the execution condition and cannot be an enabled transition.

[0133] In implementation, when the number of enabling transitions is one, the candidate transition can be directly used as the target transition and updated to the chip scheduling sequence. When the number of enabling transitions is multiple, the target transition can be determined from each enabling transition based on the current state of the chamber and / or robot corresponding to the library connected to each enabling transition. The current state of the chamber can include the operating state of the chamber at the current moment, for example, idle state, processing state, etc.; the current state of the robot can include the operating state of the robot at the current moment, such as wafer taking state, wafer placing state, wafer transfer state, etc. In implementation, for any enabling transition, the delay corresponding to the enabling transition can be determined based on the current state of the chamber and / or robot corresponding to the library connected to the enabling transition, that is, the length of time that needs to be waited when the enabling transition is executed, and the target transition can be determined from each enabling transition based on the delay corresponding to each enabling transition, thereby effectively ensuring the validity of the determination result of the target transition.

[0134] The following uses two different process paths as examples to illustrate how to determine the wafer scheduling sequence:

[0135] Path L1 may be a process path that does not include a multi-station rotary process chamber, such as Figure 6 As shown, it includes: loading port 1062 → atmospheric manipulator 1061 → calibration position 1063 → atmospheric manipulator 1061 → first vacuum lock 104 → vacuum manipulator 103 → single-station chamber 101 → vacuum manipulator 103 → second vacuum lock 105 → atmospheric manipulator 1061 → loading port 1062 .

[0136] Path L2 may be a process path including a multi-station rotary process chamber, such as Figure 7 As shown, it includes: loading port 1062 → atmospheric robot 1061 → calibration position 1063 → atmospheric robot 1061 → first vacuum lock 104 → vacuum robot 103 → multi-station rotary process chamber 102 → vacuum robot 103 → second vacuum lock 105 → atmospheric robot 1061 → loading port 1062.

[0137] That is, the path L1 and the path L2 differ only in the process chambers, and the same target scheduling model can be constructed for the two paths. The process of constructing the target scheduling model may include:

[0138] Construct a transition set T = {t1,t2,t3,t4,t5,t6,t7,t8,t9,t 10}, where t1 represents taking a wafer from the loading port 1062 to the atmospheric robot 1061, t2 represents placing a wafer from the atmospheric robot 1061 to the calibration position 1063, t3 represents taking a wafer from the calibration position 1063 to the atmospheric robot 1061, t4 represents placing a wafer from the atmospheric robot 1061 to the first vacuum lock 104, t5 represents taking a wafer from the first vacuum lock 104 to the vacuum robot 103, t6 represents placing a wafer from the vacuum robot 103 to the process chamber, t7 represents taking a wafer from the process chamber to the vacuum robot 103, t8 represents placing a wafer from the vacuum robot 103 to the second vacuum lock 105, t9 represents taking a wafer from the second vacuum lock 105 to the atmospheric robot 1061, t 10 It indicates that the atmospheric manipulator 1061 places the wafer into the loading port 1062 .

[0139] Construct a mobile library set A = {m1, m3, m5, m7, m9}, where m1 represents the wafer holding state from the loading port 1062 to the calibration position 1063, m3 represents the wafer holding state from the calibration position 1063 to the first vacuum lock 104, m5 represents the wafer holding state from the first vacuum lock 104 to the process chamber, m7 represents the wafer holding state from the process chamber to the second vacuum lock 105, and m9 represents the wafer holding state from the second vacuum lock 105 to the loading port 1062.

[0140] Construct a processing library set H = {p2, p4, p6, p8}, where p2 represents the calibration processing of the calibration position 1063 on the wafer, p4 represents the processing of the first vacuum lock 104 switching from the atmospheric state to the vacuum state, p6 represents the process processing state of the process chamber, and p8 represents the processing of the second vacuum lock 105 switching from the vacuum state to the atmospheric state.

[0141] Construct a resource library set S = {rp0, rp1, rp2, rp3, rob0, rob1}, where rp0 represents the available resources of the calibration position 1063, rp1 represents the available resources of the first vacuum lock 104, rp2 represents the available resources of the process chamber, rp3 represents the available resources of the second vacuum lock 105, rob0 represents the available resources of the atmospheric manipulator 1061, and rob1 represents the available resources of the vacuum manipulator 103. The library corresponding to the load port 1062 may not be set.

[0142] Therefore, the place set P can be expressed as:

[0143] P=A∪H∪S={m1,p2,m3,p4,m5,p6,m7,p8,m9,rp0,rp1,rp2,rp3,rob0,rob1}.

[0144] Construct a directed edge set F = (F1, F2), where F1 includes the directed edges between the transition and movement places and the processing places, i.e., F1 = ((H∪A)×T)∪(T×(H∪A)). Based on the paths L1 and L2, the connection diagram of the transition and movement places and the processing places can be as follows: Figure 8 As shown. F2 includes directed edges between transitions and resource locations, i.e., F2 = (S×T)∪(T×S), where the resource location corresponding to the manipulator points to the fetch transition, the resource location corresponding to the chamber points to the put transition, the fetch transition points to the resource location corresponding to the chamber, and the put transition points to the resource location corresponding to the manipulator. The chamber includes the calibration position 1063, the first vacuum lock 104, the process chamber, and the second vacuum lock 105. Thus, Figure 8 The connection between each transition in the resource library can be obtained as follows Figure 9 The target scheduling model shown is N=(P, T, F).

[0145] Construct a mapping L between the mobile and processing places and the resource places to find the available resources of the corresponding resource places according to the current status of the wafer, L = {m1:rob0,p2:rp0,m3:rob0,p4:rp1,m5:rob1,p6:rp2,m7:rob1,p8:rp3,m9:rob0}.

[0146] Before generating a wafer scheduling sequence, the state of the target scheduling model is initialized according to the current task state of the semiconductor process equipment.

[0147] For path L1, when no wafers enter the semiconductor processing equipment, the number of tokens in each resource location, M(S), is {rp0:1, rp1:1, rp2:1, rp3:1, rob0:1, rob1:2}. This means that the maximum capacity of calibration station 1063, first vacuum lock 104, single-station chamber 101, second vacuum lock 105, and atmospheric robot 1061 is 1. Vacuum robot 103 is a dual-arm robot with a maximum capacity of 2. The number of tokens in each mobile location, M(A), is {m1:0, m3:0, m5:0, m7:0, m9:0}, indicating that none of the mobile locations have tokens. The number of tokens in each processing location, M(H), is {p2:0, p4:0, p6:0, p8:0}, indicating that none of the processing locations have tokens. The total number of tokens in each location is |M(S)| = 7.

[0148] When a wafer enters a semiconductor processing facility, the number of tokens in the corresponding place is updated based on the wafer's position within the facility. A wafer's state g corresponds to any place in the mobile place set A or the processing place set H, i.e., g∈(H∪A). If the wafer's state g corresponds to a place in the mobile place set A, the number of tokens M(S) in the resource place set S and M(A) in the mobile place set A need to be updated. The update rule is to subtract 1 from the number of tokens in the resource place M(L(g)) and add 1 to the number of tokens in the mobile place M(g). For example, if the chip status is m5 and L(m5) is rob1, the number of tokens of the updated resource library rob1 is M(rob1) = 2-1 = 1, and the number of tokens of the updated mobile library m5 is M(m5) = 0+1 = 1; if the chip status is p6 and L(p6) is rp2, the number of tokens of the updated resource library rp2 is M(rp2) = 1-1 = 0, and the number of tokens of the updated processing library p6 is M(p6) = 0+1 = 1.

[0149] For path L2, when no wafers enter the semiconductor processing equipment, the number of tokens in each resource location, M(S), is {rp0:1, rp1:1, rp2:4, rp3:1, rob0:1, rob1:2}. This means that the maximum capacities of calibration station 1063, first vacuum lock 104, second vacuum lock 105, and atmospheric robot 1061 are all 1. Vacuum robot 103 is a dual-arm robot with a maximum capacity of 2. The rotary multi-station process chamber 102 includes four stations, each of which can accommodate one wafer. Therefore, the maximum capacity of the rotary multi-station process chamber 102 is 4. The number of tokens in each mobile location, M(A), is {m1:0, m3:0, m5:0, m7:0, m9:0}, indicating that none of the mobile locations have tokens. The number of tokens in each processing location, M(H), is {p2:0, p4:0, p6:0, p8:0}, indicating that each processing location has no tokens. The total number of tokens in each location is |M(S)| = 10. Meanwhile, the position vector W of the rotary multi-station process chamber 102 is [0, 0, 0, 0], indicating that no wafers are present at any of the processing locations in the rotary multi-station process chamber 102.

[0150] When a wafer enters a semiconductor processing facility, the number of tokens in the corresponding place is updated based on the wafer's position within the facility. A wafer's state g corresponds to any place in the mobile place set A or the processing place set H, i.e., g∈(H∪A). If the wafer's state g corresponds to a place in the mobile place set A, the number of tokens M(S) in the resource place set S and M(A) in the mobile place set A need to be updated. The update rule is to subtract 1 from the number of tokens in the resource place M(L(g)) and add 1 to the number of tokens in the mobile place M(g). For example, if the wafer state is m5 and L(m5) is rob1, the number of tokens in resource place rob1 is updated to M(rob1) = 2-1 = 1, and the number of tokens in mobile place m5 is updated to M(m5) = 0 + 1 = 1. If the wafer state is p6 and L(p6) is rp2, the number of tokens in resource place rp2 is updated to M(rp2) = 4-1 = 3, and the number of tokens in processing place p6 is updated to M(p6) = 0 + 1 = 1. In addition, when there is a wafer in the multi-station rotary process chamber 102, the position vector of the multi-station rotary process chamber 102 needs to be updated, that is, the number of wafers in the position vector of the station where the wafer is located is updated to 1. For example, if there are two wafers in the multi-station rotary process chamber 102, and are located at the first station and the second station respectively, then M(rp2)=4-2=2, M(p6)=0+2=2, and W=[1,1,0,0].

[0151] In the process of generating the chip scheduling sequence, the target data corresponding to the candidate transition is obtained. The target data includes the number of tokens in each library in the target scheduling model after the candidate transition is executed, the position vector of the multi-station rotary process chamber 102, and the return value of the position vector. Based on the target data, it is determined whether the candidate transition is an enabled transition.

[0152] In the process of determining the number of tokens of each place in the target scheduling model after the candidate transition is executed, the number of tokens of each place pointing to the candidate transition is reduced by 1, which can be specifically shown as formula (1):

[0153] M(P∩(P×t i ))=M(P∩(P×t i ))-1,i=1,2,…,I (1)

[0154] Where, P×t i Represents all the candidate transitions t in the target scheduling model i Directed edges, P∩(P×t i ) represents all the candidate transitions t in the target scheduling model i The starting vertex of the directed edge, that is, pointing to the candidate transition t iFor example, when the candidate transition is t3, the number of tokens in places p2 and rob0 pointing to candidate transition t3 is reduced by 1.

[0155] At the same time, the number of tokens of each place pointed to by the candidate transition is increased by 1, which can be specifically shown as formula (2):

[0156] M(P∩(t i ×P))=M(P∩(t i ×P))+1,i=1,2,…,I (2)

[0157] Where, t i ×P represents all candidate transitions t in the target scheduling model i The outgoing directed edge, P∩(t i ×P) represents all candidate transitions t in the target scheduling model i The end vertex of the outgoing directed edge, that is, the candidate transition t i The library location pointed to.

[0158] For path L2, it is necessary to further determine whether the library connected by the candidate transition includes the library corresponding to the multi-station rotary process chamber 102, and update the position vector of the multi-station rotary process chamber 102 if it is included. For example, it can be determined or Is it established? R is the resource library corresponding to the multi-station rotary process chamber 102. If established, it indicates that the candidate transition t i The connected libraries include resource libraries corresponding to the multi-station rotary process chamber 102 .

[0159] At this time, when the working state of the multi-station rotary process chamber 102 is the entering state or the stable state, if the library R points to the candidate transition t i , that is, when the wafer is placed into the multi-station rotary process chamber 102, the number of wafers in the last station in the position vector of the multi-station rotary process chamber 102 is used as the return value f1, that is, f1=W(R∩(R×t i ))[-1],R×t i Indicates the candidate transition t pointed to by the resource library corresponding to all multi-station rotary process chambers 102 i Directed edges, R∩(R×t i ) represents the candidate transition t pointed to by the resource library corresponding to all multi-station rotary process chambers 102 i The starting vertex of the directed edge, that is, the resource library corresponding to all multi-station rotary process chambers 102, points to the candidate transition t iIn the resource library, [-1] represents the number of wafers in the last station. In addition, the number of wafers in the last station in the position vector of the multi-station rotary process chamber 102 can be deleted, and the number of wafers in the first three stations can be shifted backward by one position, and the number of wafers in the first station can be set to 1, that is, W(R∩(R×t i ))=[1]∪W(R∩(R×t i ))[1:-1], [1:-1] represents the number of wafers in the previous station from the first station to the last station.

[0160] If the candidate transition t i Pointing to the library R, ​​that is, taking a wafer from the multi-station rotary process chamber 102, the number of wafers in the last station in the position vector of the multi-station rotary process chamber 102 is used as the return value f2, that is, f2 = W(R∩(t i ×R))[-1],t i ×R represents the candidate transition t i The directed edge pointing to the resource library corresponding to each multi-station rotary process chamber 102, R∩(t i ×R) represents the candidate transition t i The end vertex of the directed edge pointing to the resource repository corresponding to each multi-station rotary process chamber 102, that is, among all the resource repository corresponding to the multi-station rotary process chamber 102, the candidate transition t i In addition, the number of wafers in the last station in the position vector of the multi-station rotary process chamber 102 can be updated to 0, that is, W(R∩(t i ×R))[-1]=0.

[0161] In addition, when the working state of the multi-station rotary process chamber 102 is exit, if the candidate transition t i Pointing to the library R, ​​that is, taking a wafer from the multi-station rotary process chamber 102, and there is no wafer to be processed later, in the process of updating the position vector, if the number of wafers in the last station is 0, the number of wafers in the last station in the position vector is deleted, and the number of wafers in the first three stations is shifted backward by one position, and the number of wafers in the first station is set to 0, until the number of wafers in the last station is 1, that is, W(R∩(t i ×R))=[0]∪W(R∩(t i ×R))[1:-1]. When the number of wafers in the last station is 1, the number of wafers in the last station in the position vector can be used as the return value f2, and the number of wafers in the last station in the position vector of the multi-station rotary process chamber 102 can be updated to 0.

[0162] For example, when the working state of the multi-station rotary process chamber 102 is the entry state and a wafer is placed into the multi-station rotary process chamber 102, if W = [1, 0, 0, 0], the number of wafers in the last station 0 can be used as the return value, first shifted and then added by 1 to obtain the updated position vector W = [1, 1, 0, 0]. When the working state of the multi-station rotary process chamber 102 is the stable state and a wafer is taken from the multi-station rotary process chamber 102, if W = [1, 1, 1, 1], the number of wafers in the last station 1 can be used as the return value, and the number of wafers in the last station is set to 0 to obtain the updated position vector W = [1, 1, 1, 0]. At this time, if a wafer is placed into the multi-station rotary process chamber 102, the number of wafers in the last station 0 can be used as the return value, first shifted and then added by 1 to obtain the updated position vector W = [1, 1, 1, 1]. When the working state of the multi-station rotary process chamber 102 is the exit state, no subsequent wafers enter the multi-station rotary process chamber 102, so only wafers can be taken out. If W = [1,1,0,0], the position vector can be changed to W = [0,1,1,0] and W = [0,0,1,1] in sequence. At this time, the number of wafers in the last station is 1, and wafers can be taken out. The number of wafers in the last station, 1, is used as the return value, and the number of wafers in the last station is set to 0.

[0163] For any candidate transition, when determining whether the candidate transition is an enabling transition, it is possible to first determine whether the number of tokens in each location in the target scheduling model after the candidate transition is executed and whether there is a value less than 0 in the position vector of the multi-station rotary process chamber 102. If so, it indicates that the candidate transition does not meet the execution conditions. If not and the location connected to the candidate transition includes the location corresponding to the multi-station rotary process chamber 102, then continue to judge the return value of the position vector of the multi-station rotary process chamber 102. If the candidate transition is a wafer placement transition and the return value is greater than or equal to 1, or the candidate transition is a wafer retrieval transition and the return value is 0, it indicates that the candidate transition does not meet the execution conditions; if the candidate transition is a wafer placement transition and the return value is 0, or the candidate transition is a wafer retrieval transition and the return value is greater than or equal to 1, it indicates that the candidate transition meets the execution conditions, that is, the candidate transition is an enabling transition.

[0164] For example, for path L1, the number of tokens in each place is M(P) = {rp0:1, rp1:1, rp2:1, rp3:1, rob0:1, rob1:2, m1:0, m3:0, m5:0, m7:0, m9:0, p2:0, p4:0, p6:0, p8:0}. After executing candidate transition t1, the number of tokens in rob0 is reduced by 1, and the number of tokens in m1 is increased by 1. That is, the number of tokens in each place is changed to M(P)' = {rp0:1, rp1:1, rp2:1, rp3:1, rob0:0, rob1:2, m1:1, m3:0, m5:0, m7:0, m9:0, p2:0, p4:0, p6:0, p8:0}. 0,m7:0,m9:0,p2:0,p4:0,p6:0,p8:0}, there is no place with a token number less than 0, that is, candidate transition t1 is an enabling transition; if candidate transition t1 is executed again on this basis, the token number of each place is changed to M(P)" = {rp0:1,rp1:1,rp2:1,rp3:1,rob0:-1,rob1:2,m1:2,m3:0,m5:0,m7:0,m9:0,p2:0,p4:0,p6:0,p8:0}, there is a place with a token number less than 0, that is, candidate transition t1 does not meet the execution conditions.

[0165] For path L2, the number of tokens in each place M(P) = {rp0:1, rp1:1, rp2:4, rp3:1, rob0:1, rob1:1, m1:0, m3:0, m5:1, m7:0, m9:0, p2:0, p4:0, p6:0, p8:0}, and the position vector W of the multi-station rotary process chamber 102 = [0, 0, 0, 0], that is, the vacuum robot 103 holds a wafer, and the next step The multi-station rotary process chamber 102 is placed. At this time, after executing candidate transition t6, the number of tokens of rob1 and p6 is increased by 1, and the number of tokens of m5 and rp2 is reduced by 1. That is, the number of tokens in each library is changed to M(P)'={rp0:1,rp1:1,rp2:3,rp3:1,rob0:1,rob1:2,m1:0,m3:0,m5:0,m7:0,m9:0,p2:0,p4:0,p6: 1, p8:0}, the position vector of the multi-station rotary process chamber 102 is updated to W'=[1,0,0,0], the return value of the position vector of the multi-station rotary process chamber 102 is 0, the number of tokens in each library and the position vector of the multi-station rotary process chamber 102 do not have a value less than 0, and the return value of the position vector is 0, and the candidate transition t6 is an enabled transition; if the candidate transition t6 is executed again on this basis, the number of tokens in each library is changed to M(P)”={rp0:1,rp1:1,rp2:2,rp3:1,rob0:1,rob1:3,m1:0,m3:0,m5:-1,m7:0,m9:0,p2:0,p4:0,p6:2,p8:0}, the position vector of the multi-station rotary process chamber 102 is updated to W”=[1,1,0,0], and there is a library with a token number less than 0, that is, the candidate transition t6 does not meet the execution conditions.

[0166] Exemplary devices

[0167] An embodiment of this specification also provides an electronic device, including at least one processor and at least one memory, wherein the memory stores a computer program, and when the computer program is executed by the processor, it implements the chip scheduling sequence determination method for semiconductor process equipment as described in any of the above embodiments.

[0168] Exemplary computer program products and storage media

[0169] In addition to the above-mentioned methods and devices, the chip scheduling sequence determination method for semiconductor process equipment provided in the embodiments of this specification can also be a computer program product, which includes computer program instructions, which, when executed by a processor, enable the processor to execute the steps of the chip scheduling sequence determination method for semiconductor process equipment according to various embodiments of this specification described in the above "Exemplary Method" section of this specification.

[0170] The computer program product can be written in any combination of one or more programming languages, including an object oriented programming language such as Java, C++, etc., and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code can execute entirely on the user's computing device, partly on the user's device, as a stand-alone software package, partly on the user's computing device and partly on a remote computing device or entirely on the remote computing device or server.

[0171] Furthermore, the embodiments of the present specification also provide a computer readable storage medium, having stored thereon a computer program, the computer program being executed by a processor to perform the steps of the wafer scheduling sequence determination method for semiconductor process equipment according to various embodiments of the present specification described in the above "Exemplary Method" section of the present specification.

[0172] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiments can be completed by a computer program instructing related hardware, and the computer program can be stored in a non-volatile computer readable storage medium, and when the computer program is executed, the processes of the above-mentioned embodiments can be included. Wherein, any reference to memory, storage, database or other medium used in each embodiment provided by the present specification can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration but not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0173] Each technical feature of the above embodiments can be combined arbitrarily, and in order to make the description simple, not all possible combinations of each technical feature in the above embodiments are described, however, as long as the combination of these technical features does not exist contradictory, it should be considered as the scope of the present specification.

[0174] The above embodiments only express several implementation manners of the present specification, which are described in a more specific and detailed manner, but cannot be understood as a limitation on the scope of the solutions provided by the embodiments of the present specification. It should be noted that, for those skilled in the art, without departing from the concept of the present specification, a number of modifications and improvements can be made, which all belong to the protection scope of the present specification. Therefore, the protection scope of the patent of the present specification should be subject to the appended claims.

Claims

1. A method for determining a wafer scheduling sequence for semiconductor process equipment, wherein the semiconductor process equipment includes a plurality of chambers and a robot for transferring wafers between chambers, wherein the chambers include process chambers and non-process chambers, and wherein the process chambers include at least one multi-station rotary process chamber, wherein: include: Obtaining a current state of a target scheduling model of the semiconductor process equipment; The target scheduling model includes multiple places and multiple transitions, each of the places represents the available resources of the chamber or the robot, the wafer holding state of the robot, and the processing state of the chamber, and the transition represents the action performed by the robot; the state of the target scheduling model includes the number of tokens of each place and the position vector of the multi-station rotary process chamber, and the position vector includes the number of wafers in each station of the multi-station rotary process chamber; the number of tokens of each place represents the number of available resources of the chamber or the robot, the number of wafers held by the robot, and the number of wafers in the chamber; When the current state represents that the wafer scheduling sequence is not determined to be completed, target data corresponding to each candidate transition is obtained, the target data including a subsequent state of the target scheduling model and a return value of the position vector after the candidate transition is executed in the current state; the candidate transition includes at least some of the multiple transitions, the return value is generated when the position vector changes, and the return value includes the value of the target bit of the position vector before the change, the target bit representing the station for wafer retrieval in the multi-station rotary process chamber; A target transition at a current moment is determined based on each target data, and the target transition is added to the wafer scheduling sequence, where the target transition includes a preferred execution action of the robot at the current moment.

2. The method according to claim 1, characterized in that The obtaining of target data corresponding to each candidate transition includes: Based on the connection direction between the candidate transition and the target place, updating the token count of the target place, the target place including the place connected to the candidate transition; the connection direction between the candidate transition and the target place is used to determine the direction of change of the token count of the target place when the candidate transition is executed; When the target location includes the location corresponding to the multi-station rotary process chamber, the position vector of the multi-station rotary process chamber is updated and the return value is generated based on the current state of the target scheduling model and the robot action corresponding to the candidate transition.

3. The method according to claim 2, characterized in that The updating of the number of tokens of the target place based on the connection direction between the candidate transition and the target place includes: When the connection direction between the candidate transition and the target place is directed from the candidate transition to the target place, the number of tokens of the target place is increased by a first preset value; the direction from the candidate transition to the target place indicates that when the robot action corresponding to the candidate transition is executed, the number of resources corresponding to the target place released is the first preset value, the number of wafers held by the robot is increased by the first preset value, or the number of wafers processed by the chamber is increased by the first preset value; or When the connection direction between the candidate transition and the target library is directed from the target library to the candidate transition, the number of tokens of the target library is reduced by the first preset value; the direction from the target library to the candidate transition indicates that when the robot action corresponding to the candidate transition is executed, the number of resources corresponding to the target library occupied is the first preset value, the number of wafers held by the robot is reduced by the first preset value, or the number of wafers processed by the chamber is reduced by the first preset value.

4. The method according to claim 2, characterized in that The updating of the position vector of the multi-station rotary process chamber and generating the return value based on the current state of the target scheduling model and the robot action corresponding to the candidate transition include: Determining a current working state of the multi-station rotary process chamber based on a current state of the target scheduling model, where the working state of the multi-station rotary process chamber includes an entering state, a stable state, and an exiting state; Based on the current working state of the multi-station rotary process chamber, the robot action corresponding to the candidate transition and the current value of the position vector of the multi-station rotary process chamber, the position vector of the multi-station rotary process chamber is updated and the return value is generated.

5. The method according to claim 4, characterized in that The updating of the position vector of the multi-station rotary process chamber and generating the return value based on the current working state of the multi-station rotary process chamber, the robot action corresponding to the candidate transition, and the current value of the position vector of the multi-station rotary process chamber includes: When the current working state of the multi-station rotary process chamber is an entering state or a stable state, taking the current value of the target position in the position vector as a return value; An updated value of the position vector is determined based on the robot action corresponding to the candidate transition and a current value of the position vector of the multi-station rotary process chamber.

6. The method according to claim 5, characterized in that The determining an updated value of the position vector based on the robot action corresponding to the candidate transition and the current value of the position vector of the multi-station rotary process chamber includes: If the robot action corresponding to the candidate transition includes placing a wafer into the multi-station rotary process chamber, then deleting the current value of the target position, translating the number of wafers in each station other than the target position in the position vector based on the direction of the target position, and setting the number of wafers in the station where the number of wafers in the position vector is empty to a second preset value; If the robot action corresponding to the candidate transition includes taking a wafer from the multi-station rotary process chamber, the value of the target bit is updated to 0.

7. The method according to claim 4, characterized in that The updating of the position vector of the multi-station rotary process chamber and generating the return value based on the current working state of the multi-station rotary process chamber, the robot action corresponding to the candidate transition, and the current value of the position vector of the multi-station rotary process chamber includes: When the current working state of the multi-station rotary process chamber is an exit state and the robot action corresponding to the candidate transition includes taking a wafer from the multi-station rotary process chamber, obtaining the current value of the target position; If the current value of the target bit is greater than 0, the current value of the target bit is used as the return value, and the value of the target bit is updated to 0; If the current value of the target bit is 0, the shift operation is repeatedly performed until the current value of the target bit is greater than 0; the shift operation includes deleting the current value of the target bit, and translating the number of chips in each workstation outside the target bit in the position vector based on the direction of the target bit, and setting the number of chips in the workstation where the number of chips in the position vector is empty to 0.

8. The method according to claim 1, characterized in that The obtaining of the current state of the target scheduling model of the semiconductor process equipment includes: When the current state is the initial state, the number of tokens in each location and the position vector of the multi-station rotary process chamber are determined based on the current operating state of the semiconductor process equipment and the configuration information of the chamber and the robot.

9. The method according to any one of claims 1 to 8, characterized in that The determining of the target change at the current moment based on each target data includes: If the number of tokens in each of the places and the position vector do not contain a value less than 0, and the return value meets the target value corresponding to the candidate transition, then the candidate transition is used as an enabling transition, and the enabling transition represents an executable action of the manipulator at the current moment; When there are multiple enabling transitions, the target transition is determined from the enabling transitions based on the current states of the chambers and / or manipulators corresponding to the libraries connected to the enabling transitions.

10. An electronic device, characterized in that: The method comprises at least one processor and at least one memory, wherein a computer program is stored in the memory, and when the computer program is executed by the processor, the method for determining a wafer scheduling sequence for semiconductor process equipment according to any one of claims 1 to 9 is implemented.

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