Cleaning mechanism for a foraminous chip

Abstract

The present application relates to a kind of washing mechanism of perforated chip, and the perforated chip includes hole area and non-hole area located at the periphery of hole area, and the washing mechanism includes: bracket, for carrying perforated chip;Liquid supply component, for adding cleaning reagent to the upper surface of perforated chip;And suction component, for the lower surface of perforated chip is pumped to make the cleaning reagent of the upper surface of perforated chip pass through hole area.The washing mechanism of perforated chip provided by the present application can improve the cleaning effect and cleaning efficiency of perforated chip, solve the technical problems such as that the existing perforated chip is not clean, and cleaning efficiency is low.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip cleaning, and in particular to a cleaning mechanism for a perforated chip. BACKGROUND

[0002] With the development of biological DNA synthesis technology, the existing artificial synthesis technology has been unable to meet the growing market demand, and there is an urgent need for a high-throughput chip synthesizer. The chip synthesizer uses piezoelectric printing method (Piezoelectric printing) for synthesis, specifically, the ink in the ink cartridge is replaced with four kinds of base synthesis reagents, the support is coated, and then the computer controls the inkjet printer to spray a specific type of synthesis reagent onto the chip surface in a predetermined area, and then the synthesis process is completed through steps such as washing, deprotection, and coupling.

[0003] In the chip washing and deprotection steps, the corresponding liquid reagent is generally sprayed on the chip surface by spraying, and after a certain time of reaction, the liquid reagent on the chip surface and in the chip pores needs to be completely removed to avoid affecting the subsequent use of the chip. However, the current chip cleaning method cannot guarantee that the liquid reagent remaining on the chip surface and in the chip pores is completely cleaned, and there is a problem of low cleaning efficiency.

[0004] Therefore, the present application is proposed. SUMMARY

[0005] The present application provides a cleaning mechanism for a perforated chip to solve at least part of the technical problems of existing chip cleaning, such as incomplete cleaning and low cleaning efficiency.

[0006] According to one aspect of the present application, a cleaning mechanism for a perforated chip is provided, the perforated chip comprising a perforated area and a non-perforated area located around the perforated area, the cleaning mechanism comprising: a bracket for carrying the perforated chip; a liquid supply assembly for adding a cleaning reagent to the upper surface of the perforated chip; and a liquid suction assembly for suctioning air from the lower surface of the perforated chip, so that the cleaning reagent on the upper surface of the perforated chip passes through the perforated area.

[0007] The cleaning mechanism of the hole chip provided by the application comprises a bracket, a liquid feeding assembly and a liquid suction assembly. When the hole chip is cleaned, the hole chip is placed on the bracket, the liquid feeding assembly is used to add cleaning reagent to the upper surface of the hole chip, and the liquid suction assembly is used to suck air from the lower surface of the hole chip. Thus, the cleaning reagent on the upper surface of the hole chip can pass through the holes in the hole area under the action of the negative pressure air, so that the upper surface of the hole chip can be cleaned, and the inside of the holes of the hole chip can also be cleaned, thereby realizing efficient cleaning of the hole chip. Moreover, the negative pressure air is applied from the lower surface of the hole chip, so that the cleaning reagent can not be left in the holes when passing through the hole area, and the cleaning effect of the hole chip can be improved, thereby ensuring clean cleaning.

[0008] In a further preferred scheme, the cleaning mechanism further comprises a moving assembly connected with the liquid feeding assembly and the liquid suction assembly and configured to drive the liquid feeding assembly and the liquid suction assembly to move, so as to adjust the relative position between the liquid feeding assembly, the liquid suction assembly and the hole chip. The liquid feeding assembly and the liquid suction assembly are driven to move by the moving assembly, so that the liquid feeding assembly can uniformly feed liquid to the whole surface of the hole chip, so as to clean the hole chip sufficiently, and the liquid suction assembly can suck liquid from the whole surface of the hole chip, so as to improve the cleaning effect.

[0009] In a further preferred scheme, the moving assembly comprises a moving platform, a first moving assembly and a second moving assembly. The first moving assembly is arranged below the moving platform and connected with the moving platform, and is configured to drive the moving platform to move in a first direction. The second moving assembly is arranged below the first moving assembly and connected with the first moving assembly, and is configured to drive the first moving assembly and the moving platform to move in a second direction. The liquid feeding assembly and the liquid suction assembly are arranged on the moving platform.

[0010] In this scheme, the moving platform and the liquid feeding assembly and the liquid suction assembly thereon are driven to move in the first direction by the first moving assembly, and the first moving assembly and the moving platform, the liquid feeding assembly and the liquid suction assembly thereon are driven to move in the second direction by the second moving assembly, so as to flexibly adjust the position of the liquid feeding assembly and the liquid suction assembly, which is conducive to cleaning the hole chip comprehensively, thereby effectively improving the cleaning effect and the cleaning efficiency.

[0011] In a further preferred scheme, the bracket comprises a body and an air channel; the air channel is arranged in the body, and the air channel has a first opening and a second opening; the first opening is used to connect a first negative pressure device; and the second opening is arranged to face the non-hole area of the hole chip and is used for negative pressure adsorption of the non-hole area. In this scheme, the air channel is arranged in the body of the bracket, and the hole chip is adsorbed through the negative pressure wind in the air channel, which can stably fix the hole chip and will not cause damage to the hole chip.

[0012] In a further preferred scheme, the liquid supply assembly comprises a liquid supply module and a driving component; the liquid supply module is provided with a liquid inlet hole and a liquid outlet hole; and the driving component is connected to the liquid supply module and is used to drive the liquid supply module to move so that the liquid outlet hole moves above the hole chip. The relative position between the liquid supply module and the hole chip can be adjusted by driving the liquid supply module to move, so that the liquid supply module can supply liquid to the whole surface of the hole chip, and the liquid supply module can be moved away when the hole chip is placed and taken away, thereby improving the cleaning efficiency of the hole chip.

[0013] In a further preferred scheme, the liquid supply module comprises a liquid inlet plate and a liquid distribution plate; the liquid inlet plate is above the liquid distribution plate and is connected to the liquid distribution plate; the liquid inlet plate is provided with the liquid inlet hole; and the liquid distribution plate is provided with a plurality of liquid outlet holes; each liquid outlet hole is in communication with the liquid inlet hole. A plurality of liquid outlet holes are formed by connecting the liquid inlet plate and the liquid distribution plate, so that the plurality of liquid outlet holes can supply liquid to the surface of the hole chip at the same time, which is beneficial to uniformly clean the surface of the hole chip and improves the cleaning effect.

[0014] In a further preferred scheme, the liquid distribution plate is provided with a liquid inlet groove and a plurality of liquid outlet grooves; each liquid outlet groove is in communication with the liquid inlet groove; the liquid inlet groove is in communication with the liquid inlet hole; and each liquid outlet groove is in communication with a corresponding liquid outlet hole. The plurality of liquid outlet grooves are in communication with the liquid inlet groove, and each liquid outlet groove is in communication with a corresponding liquid outlet hole, so that the cleaning reagent in the liquid inlet groove can be distributed to the plurality of liquid outlet holes, thereby achieving uniform cleaning of the surface of the hole chip.

[0015] In a further preferred scheme, the liquid suction assembly comprises a second negative pressure device and a liquid suction device; the liquid suction device is provided with a liquid inlet channel and a liquid outlet channel; one end of the liquid inlet channel is arranged to face the lower surface of the hole chip; and the liquid outlet channel is in communication with the liquid inlet channel and is in communication with the second negative pressure device. The liquid inlet channel and the liquid outlet channel of the liquid suction device generate negative pressure wind through the suction of the second negative pressure device, so that the cleaning reagent on the upper surface of the hole chip can be sucked into the pores of the hole chip and enter the liquid inlet channel of the liquid suction device through the pores of the hole chip, thereby cleaning the cleaning reagent on the surface of the hole chip and achieving the functions of cleaning and drying the hole chip at the same time.

[0016] In a further preferred embodiment, the liquid suction device comprises a liquid suction plate and a plurality of liquid suction columns, the liquid suction plate is provided with a plurality of liquid outlet channels, each of the liquid suction columns is provided with a liquid inlet channel, and each of the liquid inlet channels is in communication with a corresponding one of the liquid outlet channels. By simultaneously drawing air from the lower surface of the hole chip through the plurality of liquid inlet channels and the plurality of liquid outlet channels, the speed of blowing and drying the cleaning reagent can be improved, thereby improving the cleaning efficiency of the hole chip.

[0017] In a further preferred embodiment, the number of liquid inlet channels of the liquid suction device is the same as the number of liquid outlet holes, and in the state where the liquid supply assembly supplies liquid to the hole chip, the liquid inlet channels of the liquid suction device are distributed one-to-one with the liquid outlet holes. Since the liquid inlet channels are arranged correspondingly with the liquid outlet holes, when the cleaning reagent flows out through the liquid outlet holes and reaches the surface of the hole chip, under the action of the negative pressure wind in the liquid inlet channel, the cleaning reagent can quickly pass through the pores of the hole region on the surface of the hole chip, thereby being sucked into the liquid inlet channel and discharged from the liquid outlet channel, thereby improving the cleaning efficiency.

[0018] In summary, the cleaning mechanism for the hole chip provided by the present application has at least the following advantages: the cleaning mechanism comprises a bracket, a liquid supply assembly and a liquid suction assembly, the bracket is used to fix the hole chip, the liquid supply assembly is used to add cleaning reagent to the hole chip, and the liquid suction assembly is used to suck the cleaning reagent remaining on the hole chip. When the liquid supply assembly adds cleaning reagent to the upper surface of the hole chip, the liquid suction assembly is used to draw air from the lower surface of the hole chip, which can make the cleaning reagent on the upper surface of the hole chip quickly pass through the pores of the hole region of the hole chip, thereby thoroughly and efficiently cleaning the hole chip. On the other hand, the hole chip can be blown dry after cleaning, thereby completely removing the remaining cleaning reagent and avoiding the influence of the remaining reagent on the subsequent use of the hole chip. Therefore, the cleaning mechanism for the hole chip provided by the present application can improve the cleaning effect and efficiency of the hole chip, and solve the technical problems of incomplete cleaning and low cleaning efficiency of the hole chip in the prior art. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the drawings needed in the following specific embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0020] Figure 1 The mounting structure of the cleaning mechanism and the hole chip provided by the embodiments of the present application is shown in the schematic view.

[0021] Figure 2The structure schematic diagram of the perforated chip provided by the embodiment of the present application is shown in the figure;

[0022] Figure 3 The overall structure schematic diagram of the cleaning mechanism provided by the embodiment of the present application is shown in the figure;

[0023] Figure 4 The overall structure schematic diagram of the cleaning mechanism provided by the embodiment of the present application is shown in the figure;

[0024] Figure 5 The side view structure schematic diagram of the cleaning mechanism provided by the embodiment of the present application is shown in the figure;

[0025] Figure 6 The top view structure schematic diagram of the cleaning mechanism provided by the embodiment of the present application is shown in the figure;

[0026] Figure 7 The three-dimensional structure schematic diagram of the moving assembly provided by the embodiment of the present application is shown in the figure;

[0027] Figure 8 The three-dimensional structure schematic diagram of the moving assembly provided by the embodiment of the present application is shown in the figure;

[0028] Figure 9 The exploded structure schematic diagram of the moving assembly provided by the embodiment of the present application is shown in the figure;

[0029] Figure 10 The front view structure schematic diagram of the moving assembly provided by the embodiment of the present application is shown in the figure;

[0030] Figure 11 The three-dimensional structure schematic diagram of the bracket provided by the embodiment of the present application is shown in the figure;

[0031] Figure 12 The top view structure schematic diagram of the bracket provided by the embodiment of the present application is shown in the figure;

[0032] Figure 13 The cross-sectional structure schematic diagram of the bracket provided by the embodiment of the present application is shown in the figure; Figure 12

[0033] The three-dimensional structure schematic diagram of the liquid supply module provided by the embodiment of the present application is shown in the figure; Figure 14

[0034] The three-dimensional structure schematic diagram of the liquid distribution plate provided by the embodiment of the present application is shown in the figure; Figure 15

[0035] The top view structure schematic diagram of the liquid distribution plate provided by the embodiment of the present application is shown in the figure; Figure 16

[0036] The three-dimensional structure schematic diagram of the liquid inlet plate provided by the embodiment of the present application is shown in the figure; Figure 17

[0037] ​Figure 18 An installation structure schematic view of the liquid suction assembly provided by the embodiment of the present application is shown in the figure;

[0038] Figure 19 A side view structure schematic view of the liquid suction assembly provided by the embodiment of the present application is shown in the figure;

[0039] Figure 20 An enlarged structure schematic view of the middle B part is shown in the figure. Figure 18 An enlarged structure schematic view of the middle B part is shown in the figure. An enlarged structure schematic view of the middle B part is shown in the figure.

[0040] In the figures, the reference signs are as follows:

[0041] Bracket 100; body 110; airway 120; first opening 121; second opening 122; gasket 130;

[0042] Liquid supply assembly 200; liquid supply module 210; liquid inlet plate 211; liquid inlet hole 2111; liquid distribution plate 212; liquid outlet hole 2121; liquid inlet groove 2122; liquid outlet groove 2123; driving component 220;

[0043] Liquid suction assembly 300; liquid suction device 310; liquid suction plate 311; liquid outlet channel 3111; liquid suction column 312; liquid inlet channel 3121;

[0044] Moving assembly 400; moving platform 410; first moving assembly 420; first support plate 421; first sliding rail 422; first sliding block 423; first driving member 424; first belt 425; first connecting block 426; second moving assembly 430; second support plate 431; second sliding rail 432; second sliding block 433; second driving member 434; second belt 435; second connecting block 436;

[0045] Base 500;

[0046] Hole chip 600; hole area 610; non-hole area 620. DETAILED DESCRIPTION

[0047] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0048] In addition, the terms "first", "second", etc. are used herein only to describe different instances, and do not imply or suggest relative importance or a number of the technical features indicated. Thus, the features defined with "first", "second" can include at least one of the features explicitly or implicitly. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0049] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0050] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can be direct contact between the first and second features, or indirect contact between the first and second features through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0051] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or features of different embodiments or examples described in the present application without contradiction.

[0052] It should be noted that, in order to more clearly show and introduce the working principle of the cleaning mechanism, the length direction of the hole chip is defined as the X direction, i.e. the first direction in the following, and the width direction of the hole chip is defined as the Y direction, i.e. the second direction in the following, and the direction perpendicular to the surface of the hole chip is defined as the Z direction, wherein the X direction, the Y direction and the Z direction constitute a space rectangular coordinate system. Of course, the above definition is only a specific limitation for the convenience of understanding the present application, and any other form of limitation should be within the scope of the present application without departing from the design spirit of the present application.

[0053] Please refer to Figures 1-2 The embodiment of the present application provides a cleaning mechanism for hole chip, the hole chip 600 comprises a hole area 610 and a non-hole area 620 located at the periphery of the hole area 610, and the cleaning mechanism comprises: a bracket 100 for carrying the hole chip 600; a liquid supply assembly 200 for adding cleaning reagent to the upper surface of the hole chip 600; and a liquid suction assembly 300 for sucking air to the lower surface of the hole chip 600, so that the cleaning reagent on the upper surface of the hole chip 600 passes through the hole area 610. Through the above structural design, the hole chip 600 is horizontally placed on the bracket 100 between the liquid supply assembly 200 and the liquid suction assembly 300, and the liquid suction assembly 300 and the liquid supply assembly 200 are used in cooperation, so that the cleaning efficiency of the hole chip 600 can be improved, and the residual cleaning reagent on the hole chip 600 can be effectively removed, so as to ensure that the hole chip 600 is cleaned.

[0054] Please refer to Figures 3-6 The bracket 100 is arranged between the liquid supply assembly 200 and the liquid suction assembly 300, and the liquid supply assembly 200 is located above the liquid suction assembly 300. When the hole chip 600 is placed on the bracket 100, the liquid supply assembly 200 is located above the hole chip 600, so as to add cleaning reagent to the upper surface of the hole chip 600, and at the same time, the liquid suction assembly 300 is located below the hole chip 600, so as to suck air to the lower surface of the hole chip 600.

[0055] Thus, the liquid feeding assembly 200 in the embodiment of the present application can add cleaning reagents such as ACN (acetonitrile reagent), TCA (trichloroacetic acid) and the like to the upper surface of the hole chip 600, and the added cleaning reagents can clean the impurities on the surface of the hole chip 600. Moreover, the cleaning reagents will enter the pores in the hole region 610 on the hole chip 600 under the action of their own gravity after reaching the hole region 610, thereby cleaning the pores. Further, under the action of the suction of the liquid suction assembly 300, the cleaning reagents on the upper surface of the hole chip 600 will pass through the pores in the hole region 610 more quickly, thereby cleaning the internal pores of the hole chip 600 comprehensively, and by applying negative pressure wind to the lower surface of the hole chip 600 through the liquid suction assembly 300, the hole chip 600 can be blown dry on the surface and in the internal pores, which is conducive to improving the cleaning effect and cleaning efficiency of the hole chip 600. Moreover, when the liquid suction assembly 300 suctions the hole chip 600, the cleaning reagents passing through the hole chip 600 will be sucked and collected by the liquid suction assembly 300, thereby avoiding the pollution of the cleaning environment caused by the splashing of the cleaning reagents.

[0056] As a further preferred embodiment, on the basis of the above-mentioned scheme, the specific embodiment of the present application can further include one or more of the following additions or combinations.

[0057] In some optional embodiments, the cleaning mechanism further includes a base 500, and the bracket 100, the liquid feeding assembly 200 and the liquid suction assembly 300 are all arranged on the base 500. The integrated arrangement of the bracket 100, the liquid feeding assembly 200 and the liquid suction assembly 300 makes the cleaning mechanism occupy less space, is simple to install and debug, and is convenient to use, which is conducive to the cleaning and drying operation of the hole chip 600.

[0058] In some optional embodiments, the cleaning mechanism further includes a moving assembly 400, which is connected with the liquid feeding assembly 200 and the liquid suction assembly 300 and is arranged to drive the liquid feeding assembly 200 and the liquid suction assembly 300 to move, so as to adjust the relative position between the liquid feeding assembly 200 and the liquid suction assembly 300 and the hole chip 600.

[0059] Reference Figures 7-10As shown, the moving assembly 400 and the bracket 100 are integrated on the base 500, and the liquid supply assembly 200 and the liquid suction assembly 300 are arranged on the moving assembly 400, so as to facilitate the control of the movement of the liquid supply assembly 200 relative to the bracket 100. Specifically, under the driving of the moving assembly 400, the liquid supply assembly 200 and the liquid suction assembly 300 can move relative to the bracket 100, so as to change the relative positions of the liquid supply assembly 200 and the liquid suction assembly 300 and the bracket 100, i.e., change the relative positions of the liquid supply assembly 200 and the liquid suction assembly 300 and the hole chip 600. Thus, on the one hand, the moving assembly 400 can drive the liquid supply assembly 200 to move above the bracket 100 and the hole chip 600 thereon, so that the liquid supply assembly 200 can uniformly and orderly spray the cleaning reagent on the upper surface of the hole chip 600, so as to facilitate the full cleaning of the hole chip 600; on the other hand, the moving assembly 400 can drive the liquid suction assembly 300 to move below the hole chip 600, so that the liquid suction assembly 300 can uniformly suck the air below the hole region 610 of the hole chip 600, so as to improve the cleaning effect and avoid the residual of the cleaning reagent on the surface or the pores of the hole chip 600.

[0060] In the actual cleaning process, the liquid supply assembly 200 and the liquid suction assembly 300 can be moved by the moving assembly 400, and the liquid supply and the liquid suction can be performed on the hole chip 600, so as to further improve the cleaning efficiency.

[0061] In some optional embodiments, the moving assembly 400 comprises a moving platform 410, a first moving assembly 420 and a second moving assembly 430; the first moving assembly 420 is arranged below the moving platform 410 and connected to the moving platform 410, and is used to drive the moving platform 410 to move in a first direction; the second moving assembly 430 is arranged below the first moving assembly 420 and connected to the first moving assembly 420, and is used to drive the first moving assembly 420 and the moving platform 410 to move in a second direction; the liquid supply assembly 200 and the liquid suction assembly 300 are arranged on the moving platform 410.

[0062] In the embodiment, the second moving assembly 430 is arranged on the base 500, and the first moving assembly 420 is arranged on the second moving assembly 430. Under the driving of the second moving assembly 430, the first moving assembly 420 and the base 500 and the carrier 100 thereon can be relatively moved, and specifically, the first moving assembly 420 can be moved in the second direction, i.e., the Y direction. The moving platform 410 is arranged on the first moving assembly 420, and under the driving of the first moving assembly 420, the moving platform 410 and the base 500 and the carrier 100 thereon can be relatively moved, and specifically, the moving platform 410 can be moved in the first direction, i.e., the X direction, and meanwhile, the moving platform 410 can be moved in the Y direction by the second moving assembly 430. The moving platform 410 is in a plate structure, and the liquid supply assembly 200 and the liquid suction assembly 300 are arranged on the moving platform 410. Thus, under the driving of the first moving assembly 420 and the second moving assembly 430, the liquid supply assembly 200 and the liquid suction assembly 300 can be moved in the X direction and the Y direction along with the moving platform 410.

[0063] Thus, the first moving assembly 420 and the second moving assembly 430 can drive the moving platform 410 and the liquid supply assembly 200 and the liquid suction assembly 300 thereon to move in the X direction and the Y direction, so as to flexibly adjust the relative positions of the liquid supply assembly 200 and the liquid suction assembly 300 and the carrier 100 and the hole chip 600 thereon, which is beneficial to the comprehensive cleaning of the hole chip 600. Moreover, the liquid supply assembly 200 and the liquid suction assembly 300 are arranged on the moving platform 410, so that the moving platform 410 can drive the liquid supply assembly 200 and the liquid suction assembly 300 to move at the same time, which can improve the moving efficiency of the liquid supply assembly 200 and the liquid suction assembly 300, and is also beneficial to reducing the parts of the cleaning mechanism, so as to make the installation and debugging of the cleaning mechanism more convenient.

[0064] It can be understood that in other optional embodiments, the moving assembly 400 can be arranged to drive the liquid supply assembly 200 and the liquid suction assembly 300 to move respectively. For example, on the basis of the above-mentioned embodiment, a third moving assembly is separately arranged on the base 500, and the liquid supply assembly 200 is arranged on the third moving assembly, so that the first moving assembly 420 and the second moving assembly 430 drive the liquid suction assembly 300 to move, and then the third moving assembly drives the liquid supply assembly 200 to move, thereby making the movement of the liquid supply assembly 200 and the liquid suction assembly 300 more flexible, so as to facilitate the efficient liquid supply and drying of the hole chip 600.

[0065] Optionally, referring to Figures 8-10As shown, the first moving assembly 420 comprises a first support plate 421, a first sliding rail 422, a first sliding block 423 and a first driving member 424. The first support plate 421 is connected to the second moving assembly 430, the first sliding rail 422 is arranged on the first support plate 421 and extends along the X direction, the first sliding block 423 is connected with the first sliding rail 422 and can slide along the first sliding rail 422, and the first driving member 424 is connected to the first support plate 421 and the moving platform 410. The moving platform 410 is connected to the first sliding block 423, and under the driving action of the first driving member 424, the moving platform 410 and the first sliding block 423 below it can move along the first sliding rail 422, so as to drive the moving platform 410, the liquid supply assembly 200 and the liquid suction assembly 300 thereon to move along the X direction.

[0066] Further, the first moving assembly 420 further comprises a first belt 425 and a first connecting block 426. The first belt 425 is connected with the output end of the first driving member 424, for example, a motor, and the first belt 425 can be driven to rotate by the first driving member 424. The first connecting block 426 is connected to the first belt 425 and the moving platform 410. When the first belt 425 is driven to rotate by the first driving member 424, the first connecting block 426 moves accordingly, that is, the moving platform 410 and the first sliding block 423 can be driven to move along the first sliding rail 422. In the above manner, the moving platform 410 and the liquid supply assembly 200 and the liquid suction assembly 300 thereon can be strictly moved along the X direction, so as to fully clean and dry the hole area 610 in the length direction of the hole chip 600.

[0067] Alternatively, referring back to Figures 8-10 As shown, the second moving assembly 430 comprises a second support plate 431, a second sliding rail 432, a second sliding block 433 and a second driving member 434. The second support plate 431 is connected to the base 500, the second sliding rail 432 is arranged on the second support plate 431 and extends along the Y direction, the second sliding block 433 is connected with the second sliding rail 432 and can slide along the second sliding rail 432, and the second driving member 434 is connected to the second support plate 431 and the first support plate 421. The first support plate 421 is connected to the second sliding block 433, and under the driving action of the second driving member 434, the first support plate 421 and the second sliding block 433 below it can move along the second sliding rail 432, so as to drive the moving platform 410, the liquid supply assembly 200 and the liquid suction assembly 300 thereon to move along the Y direction.

[0068] Further, the second moving assembly 430 further comprises a second belt 435 and a second connecting block 436, the second belt 435 is connected with an output end of the second driving member 434 such as a motor, and the second driving member 434 can drive the second belt 435 to rotate. The second connecting block 436 is connected with the second belt 435 and the first supporting plate 421, when the second driving member 434 drives the second belt 435 to rotate, the second connecting block 436 moves accordingly, i.e. the first supporting plate 421 and the second sliding block 433 can be driven to move along the second sliding rail 432. In this way, the moving platform 410 and the liquid supply assembly 200 and the liquid suction assembly 300 thereon can strictly move along the Y direction, so that the perforated area 610 of the perforated chip 600 can be fully washed and dried in the width direction of the perforated chip 600.

[0069] In some optional embodiments, the bracket 100 comprises a body 110 and air channels 120; the air channels 120 are arranged in the body 110, and the air channels 120 have first openings 121 and second openings 122, the first openings 121 are used to be connected with a first negative pressure device (not shown in the figure), and the second openings 122 are arranged to face the non-perforated area 620 of the perforated chip 600 for negative pressure adsorption of the non-perforated area 620.

[0070] Referring to Figures 11-13 As shown, the body 110 of the bracket 100 comprises a structure of two opposite parts, and a gap for accommodating the perforated chip 600 is formed between the two parts. A total of four air channels 120 are arranged on the body 110, the first openings 121 of all the air channels 120 are connected with a first negative pressure device such as a vacuum pump, and the second openings 122 of all the air channels 120 are arranged to face the non-perforated area 620 of the perforated chip 600 for connection with four corners of the perforated chip 600, so that the square perforated chip 600 is adsorbed and fixed on the body 110.

[0071] Since the material of the perforated chip 600 is very fragile, for example, the size of the perforated chip 600 in the embodiment is 41.31 mm in length, 55.74 mm in width, and 0.45 mm in thickness, and the general extrusion fixing method is extremely easy to cause damage to the perforated chip 600. In the embodiment, the perforated chip 600 is fixed by air pressure adsorption, which can ensure firm installation of the perforated chip 600 and will not cause damage to the perforated chip 600.

[0072] In other optional embodiments, the number of air channels 120 can also be two, three, five, six, etc., and the first openings 121 of all the air channels 120 can also be connected with different negative pressure devices, as long as the perforated chip 600 can be stably installed.

[0073] Further, the bracket 100 further comprises a gasket 130, which is arranged at the second opening 122 of the air channel 120 and used to contact the hole chip 600. For example, the gasket 130 can be an O-shaped ring made of acid and alkali corrosion resistant material. The gasket 130 is used to realize soft contact with the hole chip 600, so as to further protect the hole chip 600 from damage.

[0074] In some optional embodiments, the liquid supply assembly 200 comprises a liquid supply module 210 and a driving component 220. The liquid supply module 210 is provided with an inlet hole 2111 and an outlet hole 2121. The driving component 220 is connected to the liquid supply module 210 and used to drive the liquid supply module 210 to move, so that the outlet hole 2121 moves above the hole chip 600.

[0075] Referring to Figures 1-6 As shown in the figure, one end of the liquid supply module 210 is provided with the inlet hole 2111 and the outlet hole 2121, and the other end of the liquid supply module 210 is connected to the driving component 220. The driving component 220 can be a rotary air cylinder, which can drive the liquid supply module 210 to rotate around the Z direction by any angle. Specifically, when liquid supply is needed, the liquid supply module 210 can be driven to rotate by the driving component 220, so that the outlet hole 2121 moves above the hole chip 600, so as to add cleaning reagent to the upper surface of the hole chip 600. When the liquid supply is completed, the outlet hole 2121 of the liquid supply module 210 can be moved away from above the hole chip 600 by the driving component 220, so as to take and place the hole chip 600 on the bracket 100.

[0076] In some optional embodiments, the liquid supply module 210 comprises an inlet plate 211 and a distribution plate 212. The inlet plate 211 is located above the distribution plate 212 and connected to the distribution plate 212. The inlet plate 211 is provided with the inlet hole 2111 penetrating therethrough. The distribution plate 212 is provided with a plurality of outlet holes 2121 penetrating therethrough, and each outlet hole 2121 is in communication with the inlet hole 2111.

[0077] Referring to Figures 14-17 As shown in the figure, the inlet plate 211 is provided with the inlet hole 2111, which is used to connect a liquid storage device for storing cleaning reagent. The distribution plate 212 is provided with the outlet hole 2121 below. The side wall of the outlet hole 2121 can be arranged in a structure protruding below the distribution plate 212, so as to reduce the distance between the outlet hole 2121 and the hole chip 600, thereby realizing accurate liquid supply to the hole chip 600. In addition, by arranging a plurality of outlet holes 2121, the upper surface of the hole chip 600 can be uniformly supplied with liquid, so as to improve the cleaning effect.

[0078] Optionally, the liquid distribution plate 212 is provided with an inlet tank 2122 and multiple outlet tanks 2123. Each outlet tank 2123 is connected to the inlet tank 2122, and the inlet tank 2122 is connected to the inlet hole 2111. Each outlet tank 2123 is connected to a corresponding outlet hole 2121. When the cleaning reagent enters the inlet plate 211 through the inlet hole 2111, it flows into the inlet tank 2122 on the liquid distribution plate 212, and is then divided into four streams through the four outlet tanks 2123 connected to the inlet tank 2122, and finally discharged from the outlet hole 2121. This achieves uniform cleaning of the surface of the porous chip 600, effectively improving work efficiency.

[0079] It should be noted that in other alternative embodiments, the number of liquid outlet holes 2121 is not limited to four. For example, in Figure 16 Based on this, each liquid outlet tank 2123 can be divided into two liquid outlets, with eight liquid outlet holes 2121 correspondingly provided. Liquid is supplied to the surface of the porous chip 600 through the eight liquid outlet holes 2121, which can clean the porous chip 600 more evenly. Similarly, in other cases, each liquid outlet tank 2123 can be divided into four liquid outlets, with sixteen liquid outlet holes 2121 correspondingly provided, or further divided into eight liquid outlets, with thirty-two liquid outlet holes 2121 correspondingly provided, or the number of liquid outlet holes 2121 can be set according to the actual cleaning requirements.

[0080] In some optional embodiments, the liquid aspiration assembly 300 includes a second negative pressure device (not shown) and a liquid aspirator 310. The liquid aspirator 310 is provided with an inlet channel 3121 and an outlet channel 3111. One end of the inlet channel 3121 is disposed facing the lower surface of the perforated chip 600, and the outlet channel 3111 is connected to the inlet channel 3121 and is connected to the second negative pressure device.

[0081] Reference Figures 18-20 As shown, the liquid suction device 310 is mounted on the moving assembly 400, which allows the liquid suction device 310 and the liquid dispensing assembly 200 to move. When cleaning the porous chip 600, the porous chip 600 is first placed on the bracket 100. Then, the moving assembly 400 moves the liquid suction device 310 and the liquid dispensing assembly 200 to positions below and above the porous chip 600, respectively. Liquid is dispensed onto the upper surface of the porous chip 600 using the liquid dispensing assembly 200, and the second negative pressure device is activated, causing the liquid suction device 310 to draw air towards the lower surface of the porous chip 600, thereby achieving the functions of cleaning and drying the porous chip 600.

[0082] Optionally, the second negative pressure device can include a negative pressure pump, such as a vacuum pump, and a waste liquid bag, and the waste liquid bag is in turn communicated with the vacuum pump and the liquid outlet channel 3111 of the liquid suction device 310. A negative pressure wind can be generated by the vacuum pump, so that the lower surface of the porous chip 600 is subjected to air suction, and the cleaning reagent on the porous chip 600 is sucked into the liquid inlet channel 3121 of the liquid suction device 310. The cleaning reagent in the liquid suction device 310 is eventually sucked into the waste liquid bag for subsequent treatment of the waste liquid.

[0083] In some optional embodiments, the liquid suction device 310 includes a liquid suction plate 311 and a plurality of liquid suction columns 312. The liquid suction plate 311 is provided with a plurality of liquid outlet channels 3111. Each liquid suction column 312 is provided with a liquid inlet channel 3121, and each liquid inlet channel 3121 is communicated with a corresponding liquid outlet channel 3111.

[0084] Referring to Figure 20 The liquid suction plate 311 is connected to the moving assembly 400, and a hole is formed in the interior of the liquid suction plate 311 to form the liquid outlet channel 3111. The liquid suction column 312 is in a hollow column shape, and a liquid inlet channel 3121 is formed in the interior of each liquid suction column 312. The lower end of the liquid suction column 312 is communicated with the liquid outlet channel 3111 in the liquid suction plate 311, and the upper end of the liquid suction column 312 is arranged towards the lower surface of the porous chip 600. In this embodiment, the plurality of liquid suction columns 312 and the plurality of liquid outlet channels 3111 cooperate to uniformly suck the lower surface of the porous chip 600, thereby improving the liquid suction efficiency.

[0085] In some optional embodiments, the number of liquid inlet channels 3121 of the liquid suction device 310 is the same as the number of liquid outlet holes 2121, and under the condition that the liquid supply assembly 200 supplies liquid to the porous chip 600, the liquid inlet channels 3121 of the liquid suction device 310 are distributed one-to-one with the liquid outlet holes 2121.

[0086] Referring again to Figure 20 The liquid suction device 310 is provided with four liquid inlet channels 3121, and the distribution plate 212 is provided with four liquid outlet holes 2121. The four liquid inlet channels 3121 and the four liquid outlet holes 2121 are arranged one-to-one and coaxially. That is, the center line of the liquid inlet channel 3121 along the Z direction coincides with the center line of the liquid outlet hole 2121 along the Z direction. When the cleaning reagent flows out of the liquid outlet hole 2121 and reaches the surface of the porous chip 600, the cleaning reagent can be quickly sucked into the liquid inlet channel 3121, thereby accelerating the speed of the cleaning reagent passing through the porous area 610 on the porous chip 600 and improving the cleaning efficiency.

[0087] It can be understood that in other optional embodiments, the number of liquid inlet channels 3121 and liquid outlet holes 2121 is not limited to four. For example, when the number of liquid outlet holes 2121 is eight, eight liquid inlet channels 3121 can be correspondingly provided, and the eight liquid inlet channels 3121 cooperate with the eight liquid outlet holes 2121 to further improve the cleaning efficiency. Similarly, the number of liquid inlet channels 3121 and liquid outlet holes 2121 can also be sixteen, thirty-two, etc. Moreover, without greatly reducing the cleaning efficiency, the liquid inlet channels 3121 and the liquid outlet holes 2121 are not necessarily coaxially arranged, as long as liquid cleaning and liquid suction and drying can be achieved.

[0088] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present application, and those of ordinary skill in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

Claims

1. A cleaning mechanism for a perforated chip including a perforated area and a non-perforated area located at a periphery of the perforated area, characterized by, The cleaning mechanism comprises: a bracket for carrying the holey chip; a liquid feeding assembly for adding cleaning reagent to the upper surface of the holey chip; and a liquid suction assembly for suctioning the lower surface of the holey chip so that the cleaning reagent on the upper surface of the holey chip passes through the holey area; The cleaning mechanism further comprises a moving assembly connected with the liquid feeding assembly and the liquid suction assembly and configured to drive the liquid feeding assembly and the liquid suction assembly to move so as to adjust the relative position between the liquid feeding assembly, the liquid suction assembly and the holey chip; The liquid feeding assembly comprises a liquid feeding module and a driving component; The liquid feeding module is provided with an inlet hole and an outlet hole; The driving component is connected with the liquid feeding module and configured to drive the liquid feeding module to move so that the outlet hole moves above the holey chip; The liquid feeding module comprises an inlet plate and a distribution plate, the inlet plate is above the distribution plate and connected with the distribution plate; The inlet plate is provided with the inlet hole, the distribution plate is provided with a plurality of outlet holes, each of which is in communication with the inlet hole; the side wall of the outlet hole is configured to protrude below the distribution plate so as to reduce the distance between the outlet hole and the holey chip; The distribution plate is provided with an inlet groove and a plurality of outlet grooves, each of which is in communication with the inlet groove, the inlet groove is in communication with the inlet hole, and each of the outlet grooves is in communication with a corresponding outlet hole; The liquid suction assembly comprises a liquid suction device, the liquid suction device is provided with an inlet channel and an outlet channel, one end of the inlet channel is arranged towards the lower surface of the holey chip, and the outlet channel is in communication with the inlet channel; The liquid suction device comprises a liquid suction plate and a plurality of liquid suction columns, the liquid suction plate is provided with a plurality of outlet channels, each of the liquid suction columns is provided with an inlet channel, and each of the inlet channels is in communication with a corresponding outlet channel.

2. The cleaning mechanism for holey chip according to claim 1, wherein: The moving assembly comprises a moving platform, a first moving assembly and a second moving assembly; The first moving assembly is arranged below the moving platform and connected with the moving platform, and configured to drive the moving platform to move in a first direction; The second moving assembly is arranged below the first moving assembly and connected with the first moving assembly, and configured to drive the first moving assembly and the moving platform to move in a second direction; The liquid feeding assembly and the liquid suction assembly are arranged on the moving platform.

3. The cleaning mechanism for holey chip according to claim 1, wherein: The bracket comprises a body and an air duct; The air duct is arranged in the body, the air duct has a first opening and a second opening, the first opening is used to connect with a first negative pressure device, and the second opening is arranged towards the non-holey area of the holey chip for negative pressure adsorption of the non-holey area.

4. The cleaning mechanism for holey chip according to claim 1, wherein: The liquid suction assembly comprises a second negative pressure device, the outlet channel is in communication with the inlet channel and the second negative pressure device.

5. The mechanism according to claim 1, wherein the number of the liquid inlet channels of the liquid suction device is the same as the number of the liquid outlet holes, and the liquid inlet channels of the liquid suction device are distributed one-to-one with the liquid outlet holes in a state where the liquid supply assembly supplies liquid to the hole chip. ​

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