A diamond-like carbon thin film vacuum coating device

Abstract

The invention discloses a diamond-like carbon thin film vacuum coating device, which belongs to the field of coating technology and solves the problems that large particles are easily deposited on a coating substrate during coating operation of existing equipment, thereby affecting the coating quality and uneven wear on the surface of a coating target. The device comprises a device body, a magnetron target mechanism, a synchronous drive mechanism and a gas supply mechanism. The device body comprises a device base, a coating industrial computer, a vacuum coating seat and a substrate pick-and-place seat. The synchronous drive mechanism comprises a drive motor, a synchronous linkage part and an impurity removal drive part. The invention provides a magnetron target mechanism and a synchronous drive mechanism, which are composed of a drive motor, a synchronous linkage part and an impurity removal drive part. The impurity removal drive part can be linked with a charge elimination part to ensure uniform wear on the surface of the coating target and avoid local excessive consumption, thereby improving the utilization rate of the coating target and reducing the generation of large particles, thereby ensuring the coating quality of the substrate.

Description

Technical Field

[0001] The invention belongs to the technical field of film coating, and in particular relates to a diamond-like carbon thin film vacuum coating device. Background Art

[0002] Diamond-like Carbon (DLC) is an amorphous carbon film similar to diamond, with many properties similar to diamond, such as high hardness, low friction coefficient and excellent chemical stability. Due to its unique physical and chemical properties, diamond-like films are widely used in many fields, such as machinery, electronics, optics and biomedicine. At present, there are many methods for preparing diamond-like films, such as magnetron sputtering, ion beam deposition, pulsed laser deposition, etc. These methods can be used to prepare diamond-like films with different properties on different substrates.

[0003] Chinese patent CN217324264U discloses a vacuum arc coating device, including a vacuum chamber, a substrate arranged in the vacuum chamber, a plasma generating mechanism and an anode mechanism, the plasma generating mechanism includes a cathode target and an arc source, the arc source is used to generate an arc on the working surface of the cathode target, so that the arc melts the working surface of the cathode target to generate plasma, the anode mechanism is arranged between the substrate and the cathode target, and is used to absorb electrons in the plasma. However, during the coating operation of the existing equipment, large particles are easily deposited on the coating substrate, thereby affecting the coating quality, and the surface of the coating target is unevenly worn, resulting in local excessive consumption of the target. In view of the above problems, we propose a diamond-like carbon thin film vacuum coating device. Summary of the invention

[0004] The purpose of the present invention is to address the deficiencies of the prior art and provide a diamond-like carbon thin film vacuum coating device, which solves the problem that large particles are easily deposited on the coating substrate during the coating operation of the existing equipment, thereby affecting the coating quality, and the surface of the coating target is unevenly worn, resulting in local excessive consumption of the target material.

[0005] The present invention is implemented as follows: a diamond-like thin film vacuum coating device, the diamond-like thin film vacuum coating device comprising:

[0006] The device body comprises a device base, a coating industrial control computer, a vacuum coating seat, and a substrate pick-and-place seat. The vacuum coating seat is fixedly mounted on the device base, the coating industrial control computer is fixedly mounted on the side wall of the vacuum coating seat, and the substrate pick-and-place seat is detachably mounted on the vacuum coating seat;

[0007] A magnetron target mechanism, which is arranged in the vacuum coating seat, and is used to magnetron sputter the substrate and prevent large particles from being adsorbed on the surface of the substrate. The magnetron target mechanism includes a coating target, a sputtering cathode, a sputtering anode, an anode coil, an auxiliary coil, a cathode cooling unit, and a charge elimination unit. The sputtering anode, the anode coil, and the auxiliary coil are respectively arranged in the vacuum coating seat, and the coating target and the sputtering cathode are fixedly mounted on the charge elimination unit. The cathode cooling unit is used to cool and protect the sputtering cathode.

[0008] A synchronous drive mechanism, wherein the synchronous drive mechanism is mounted on a device base;

[0009] Wherein, the synchronous driving mechanism comprises:

[0010] A driving motor, the driving motor is fixedly mounted on the device base;

[0011] A synchronous linkage part fixedly connected to the output end of the drive motor, and

[0012] An impurity removal driving unit, the impurity removal driving unit is arranged in the vacuum coating seat, and the impurity removal driving unit is used to drive the charge elimination unit to move;

[0013] A gas supply mechanism is used to supply working gas into the vacuum coating seat and to assist in increasing the contact area between the working gas and the coating target. The gas supply mechanism is installed on the device base.

[0014] Preferably, the gas supply mechanism comprises:

[0015] A gas supply pump, the gas supply pump is fixedly mounted on the device base, and the gas supply pump is connected to a working gas source;

[0016] an accelerating discrete part connected to a gas supply pump, the accelerating discrete part being arranged in the device base, and being used for accelerating and discrete working gas;

[0017] A gas guide portion is arranged in the accelerating discrete portion, and is used for performing discrete acceleration processing on the working gas.

[0018] Preferably, the acceleration discrete portion comprises:

[0019] An accelerating discrete seat, which is fixedly mounted on the device base and is hollow inside;

[0020] A variable pressure accelerating chamber, which is fixedly mounted on one side of the accelerating discrete seat and is used to pressurize the working gas by heating;

[0021] A gas release seat is rotatably mounted on one side of the variable pressure accelerating chamber, and the gas release seat is also connected to the synchronous linkage part.

[0022] Preferably, the gas guide portion comprises:

[0023] A spiral guide paddle, wherein the spiral guide paddle is rotatably mounted in the acceleration discrete seat, and one end of the spiral guide paddle is connected to the synchronous linkage part;

[0024] A heat expansion seat, the heat expansion seat is fixedly installed in the voltage transformation acceleration chamber;

[0025] At least one set of auxiliary spoilers, the auxiliary spoilers are fixedly mounted in the gas release seat, and the auxiliary spoilers are used to assist in spoiling the working gas;

[0026] A release discrete groove is provided at the end of the gas release seat, and the release discrete groove is used for assisting in the dispersion of the working gas.

[0027] Preferably, the synchronous linkage unit includes:

[0028] A synchronous linkage rod, the synchronous linkage rod is rotatably mounted on the device base, and one end of the synchronous linkage rod is fixedly connected to the output end of the drive motor;

[0029] A driving wheel, wherein the driving wheel is fixedly sleeved on the synchronous linkage rod, a driven wheel is arranged on one side of the driving wheel, and the driving wheel and the driven wheel are rotationally connected through a conveyor belt, and one side of the driven wheel is fixedly connected to one end of the spiral guide paddle;

[0030] A driving gear is fixedly sleeved on the outside of the synchronous linkage rod, a driven gear ring is arranged on one side of the driving gear, the driven gear ring is meshed with the driving gear for transmission, and the driven gear ring is fixedly sleeved on the outer side wall of the gas release seat.

[0031] Preferably, the impurity removal driving unit comprises:

[0032] A debris removal driving rod, the debris removal driving rod is rotatably mounted on the device base, and one end of the debris removal driving rod is fixedly connected to the end of the synchronous linkage rod;

[0033] At least one set of oscillating cams, wherein the oscillating cams are fixedly sleeved on the outer wall of the impurity removal driving rod, and the tamping cams are used to drive the charge elimination part.

[0034] Preferably, the charge eliminating unit comprises:

[0035] An elimination motor, wherein the output end of the elimination motor is fixedly connected to the sputtering cathode, and a coating target is fixedly installed on the upper part of the sputtering cathode;

[0036] A motor vibration seat for supporting the elimination motor, the motor vibration seat being fixedly connected to the elimination motor;

[0037] At least one group of oscillating elastic seats, one end of which is fixedly connected to the motor vibration seat, the bottom of which is embedded in the oscillating base, and the oscillating base is fixedly mounted on the device base.

[0038] Preferably, the cathode cooling unit comprises:

[0039] A coolant injection pipe, one end of which is connected to a coolant source;

[0040] A cathode cooling disk, which is fixedly mounted on the device base and is used to assist in cooling the sputtering cathode, and one end of the cathode cooling disk is connected to the coolant injection pipe;

[0041] A cooling return pipe, wherein the cooling return pipe is fixedly connected to the cathode cooling plate;

[0042] A spiral heating tube sealed and connected to one end of the cooling reflux tube, wherein the spiral heating tube is sleeved outside the heat expansion seat and is used for auxiliary heating of the heat expansion seat;

[0043] A coolant circulation end is installed at the end of the spiral heating tube, and the coolant circulation end is used to assist in releasing the coolant.

[0044] Preferably, it also includes:

[0045] A substrate adjustment mechanism, which is disposed on a substrate pick-up and placement seat and is used to support the substrate to be coated and to assist in adjusting the position of the substrate;

[0046] Wherein, the substrate adjustment mechanism comprises:

[0047] An adjustment positioning seat, wherein the adjustment positioning seat is fixedly mounted on the substrate picking and placing seat;

[0048] A linkage adjustment seat rotatably sleeved on the adjustment positioning seat;

[0049] A particle guide seat fixedly connected to the linkage adjustment seat, the particle guide seat is used to assist in guiding the sputtered particles;

[0050] at least one set of substrate holders, the substrate holders being used to fix the substrate to be coated, and

[0051] An adjustment drive unit is disposed in the adjustment positioning seat, and the adjustment drive unit is connected to the substrate holder.

[0052] Preferably, the adjustment drive unit comprises:

[0053] An adjusting motor, wherein the adjusting motor is fixedly installed in the adjusting positioning seat, and an output end of the adjusting motor is fixedly connected to the linkage adjusting seat;

[0054] At least one set of adjustment positioning grooves, wherein the adjustment positioning grooves are arranged on the side wall of the adjustment positioning seat;

[0055] At least one set of adjustment and positioning shafts, wherein the adjustment and positioning shafts are slidably mounted in the adjustment and positioning grooves, one end of the adjustment and positioning shafts is detachably connected to an adjustment drive seat, and one end of the adjustment drive seat away from the adjustment and positioning shafts is fixedly connected to an adjustment flip shaft;

[0056] An adjusting flip shaft, wherein the adjusting flip shaft is rotatably arranged on the linkage adjusting seat, and one end of the adjusting flip shaft away from the adjusting driving seat is fixedly connected to a substrate clamping seat;

[0057] A positioning friction disc is fixedly embedded in the linkage adjustment seat, and the positioning friction disc is rotationally connected to the adjustment flip shaft.

[0058] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0059] In the embodiment of the present invention, a magnetron target mechanism and a synchronous drive mechanism are provided. The synchronous drive mechanism is composed of a drive motor, a synchronous linkage part, and an impurity removal drive part. The impurity removal drive part can cooperate with the charge elimination part to ensure uniform wear on the surface of the coating target material and avoid local excessive consumption, thereby improving the utilization rate of the coating target material and reducing the generation of large particles, ensuring the coating quality of the substrate, and effectively overcoming the problems of large particles being deposited on the coating substrate during the coating operation in the prior art, affecting the coating quality, and uneven wear on the surface of the coating target material, resulting in local excessive consumption of the target material.

[0060] In an embodiment of the present invention, a gas supply mechanism is provided, and the gas supply mechanism consists of an acceleration discrete part and a gas guide part. The acceleration discrete part and the gas guide part can be driven by the synchronous linkage part respectively, so as to fully discretize, pressurize and accelerate the working gas guided in the acceleration discrete part. Compared with the prior art, it helps the discharged working gas to contact the coating target material evenly, on the one hand, improving the coating deposition efficiency, and on the other hand, driven by the synchronous linkage part, it can play an auxiliary effect of enhancing the sputtering particles of the magnetron target mechanism. Compared with the prior art, it is also easy to control and avoids the increase of energy consumption.

[0061] In the embodiment of the present invention, a charge elimination unit is provided. The setting of the charge elimination unit can drive the sputtering cathode and the coating target to rotate, and distribute the distribution of sputtering particles through high-frequency vibration, thereby reducing the generation of large particles, avoiding doping of the coating layer, and effectively improving the sputtering rate of the target material. At the same time, due to the dispersing effect of the vibration, the deposition of large particles is reduced, and the uniformity and quality of the thin film are improved.

[0062] In the embodiment of the present invention, a heated expansion seat and a cathode cooling part are provided. The cathode cooling part can assist in heating the heated expansion seat in the heated expansion seat with the cooling liquid after absorbing the heat of the sputtering cathode, thereby reducing the gap between the heated expansion seat and the inner wall of the variable pressure acceleration chamber, thereby pressurizing and accelerating the working gas, which is beneficial to the accelerated collision contact between the working gas and the coating target material.

[0063] In the embodiment of the present invention, a substrate adjustment mechanism is provided, which realizes the synchronous coating operation of multiple groups of substrates by cooperating with the adjustment drive part, the adjustment positioning seat, and the linkage adjustment seat. At the same time, it can also automatically flip the substrate to realize rapid double-sided coating of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0064] Figure 1 It is a schematic structural diagram of the diamond-like carbon thin film vacuum coating device provided by the present invention.

[0065] Figure 2 It is a schematic diagram of the three-dimensional structure of the diamond-like carbon thin film vacuum coating device provided by the present invention.

[0066] Figure 3 It is a top view of the diamond-like carbon thin film vacuum coating device provided by the present invention.

[0067] Figure 4 yes Figure 3 AA section view.

[0068] Figure 5 It is a structural schematic diagram of the magnetron target mechanism provided by the present invention.

[0069] Figure 6 It is a schematic structural diagram of the charge elimination unit provided by the present invention.

[0070] Figure 7 It is a schematic structural diagram of the cathode cooling unit provided by the present invention.

[0071] Figure 8 It is a structural schematic diagram of the gas supply mechanism provided by the present invention.

[0072] Fig. 9 It is a side view of the gas supply mechanism provided by the present invention.

[0073] Fig.10 yes Fig. 9 BB section view.

[0074] Fig.11 It is a structural schematic diagram of the gas release seat provided by the present invention.

[0075] Fig.12It is an axonometric view of the gas release seat provided by the present invention.

[0076] Fig.13 It is a schematic diagram of the internal structure of the vacuum coating seat provided by the present invention.

[0077] Fig.14 It is a structural schematic diagram of the substrate adjustment mechanism provided by the present invention.

[0078] Fig.15 It is a structural schematic diagram of the regulating drive unit provided by the present invention.

[0079] Fig.16 It is an axonometric diagram of the adjustment drive unit provided by the present invention.

[0080] In the figure: 1-device body, 11-device base, 12-vacuum coating seat, 13-substrate pick-up and placement seat, 14-coating industrial computer, 2-synchronous drive mechanism, 21-drive motor, 22-synchronous linkage part, 221-synchronous linkage rod, 222-driving wheel, 223-driven wheel, 224-driving gear, 225-driven gear ring, 23-impurity removal drive part, 231-impurity removal drive rod, 232-oscillation cam, 3-gas supply mechanism, 31-gas supply pump, 32-acceleration discrete part, 321-acceleration discrete seat, 322-variable pressure acceleration chamber, 323-gas release seat, 33-gas guide part, 331-spiral guide paddle, 332-heat expansion seat, 333-auxiliary spoiler, 334-release discrete groove, 4-magnetic control target mechanism, 41-coating target, 42-sputtering anode, 43-anode coil, 44-auxiliary coil, 45-charge elimination unit, 451-elimination motor, 452-motor vibration seat, 453-oscillation elastic seat, 454-oscillation base, 46-cathode cooling unit, 461-cooling liquid injection pipe, 462-cathode cooling plate, 463-cooling reflux pipe, 464-spiral heating pipe, 465-cooling liquid circulation end, 47-sputtering cathode, 5-substrate adjustment mechanism, 51-adjustment positioning seat, 52-linkage adjustment seat, 53-substrate holder, 54-adjustment drive unit, 541-adjustment motor, 542-adjustment positioning groove, 543-adjustment positioning shaft, 544-adjustment drive seat, 545-adjustment flip shaft, 546-positioning friction disk, 55-particle guide seat. DETAILED DESCRIPTION

[0081] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of this application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0082] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0083] During the coating operation of the existing equipment, large particles are easily deposited on the coating substrate, thereby affecting the coating quality, and the surface of the coating target 41 is unevenly worn, resulting in local excessive consumption of the target. In view of the above problems, we propose a diamond-like thin film vacuum coating device. In short, the diamond-like thin film vacuum coating device includes a device body 1, a magnetron target mechanism 4, a synchronous drive mechanism 2, and a gas supply mechanism 3. The device body 1 includes a device base 11, a coating industrial computer 14, a vacuum coating seat 12, and a substrate placement seat 13. The magnetron target mechanism 4 includes a coating target 41, a sputtering cathode 47, a sputtering anode 42, an anode coil 43, an auxiliary coil 44, a cathode cooling part 46 and a charge elimination part 45. The synchronous drive mechanism 2 includes a drive motor 21, a synchronous linkage part 22, and an impurity removal drive part 23. When magnetron sputtering is performed on a substrate, the substrate to be coated is placed in the vacuum coating seat 12, and the coating industrial control computer 14 controls the vacuum coating seat 12 to evacuate the substrate to ensure that the vacuum degree of the vacuum coating seat 12 is 0.01-0.05 Pa. Then the coating industrial control computer 14 starts the gas supply mechanism 3, the sputtering cathode 47, the sputtering anode 42, the anode coil 43, the auxiliary coil 44, the cathode cooling unit 46 and the charge elimination unit 45, and at the same time starts the drive motor 21. The drive motor 21 starts to be able to The synchronous linkage part 22 and the impurity removal driving part 23 are driven to move, so that the synchronous linkage part 22 drives the gas supply mechanism 3 to move, thereby realizing the accelerated dispersion of the working gas, thereby increasing the contact area with the coating target 41, and the movement of the impurity removal driving part 23 can drive the sputtering cathode 47 and the coating target 41 to move. At the same time, the start-up of the charge elimination part 45 can drive the sputtering cathode 47 and the coating target 41 to further move, thereby improving the utilization rate of the coating target 41 and reducing the generation of large particles, thereby ensuring the coating quality of the substrate. In the embodiment of the present invention, a magnetron target mechanism 4 and a synchronous drive mechanism 2 are provided. The synchronous drive mechanism 2 is composed of a drive motor 21, a synchronous linkage part 22, and an impurity removal drive part 23. The impurity removal drive part 23 can cooperate with the charge elimination part 45 to ensure that the surface of the coating target material 41 is evenly worn and local excessive consumption is avoided, thereby improving the utilization rate of the coating target material 41 and reducing the generation of large particles, ensuring the coating quality of the substrate, and effectively overcoming the problems of large particles being deposited on the coating substrate during the coating operation in the prior art, affecting the coating quality, and uneven wear on the surface of the coating target material 41, resulting in local excessive consumption of the target material.

[0084] The embodiment of the present invention provides a diamond-like carbon thin film vacuum coating device, such as Figure 1-Figure 4 As shown, the diamond-like carbon thin film vacuum coating device comprises:

[0085] The device body 1 includes a device base 11, a coating industrial control computer 14, a vacuum coating seat 12, and a substrate pick-up and placement seat 13. The vacuum coating seat 12 is fixedly mounted on the device base 11, the coating industrial control computer 14 is fixedly mounted on the side wall of the vacuum coating seat 12, and the substrate pick-up and placement seat 13 is detachably mounted on the vacuum coating seat 12;

[0086] It should be noted that the coating industrial computer 14 can be a PLC controller, and the coating industrial computer 14 is fixedly installed on the inner wall of the vacuum coating seat 12 by fastening bolts or riveting. At the same time, the device base 11 can be a rectangular seat, a round seat, a "T"-shaped seat or a combination of the above. The vacuum coating seat 12 is fixedly installed on the device base 11 by means of snaps or bolts. The vacuum coating seat 12 can be a round seat or a round can with a hollow interior. In order to avoid the accumulation of particles, the inner wall of the vacuum coating seat 12 is polished. The substrate picking and placing seat 13 can be a rectangular seat or a round seat, and the substrate picking and placing seat 13 can be installed on the top of the vacuum coating seat 12 by means of threads or snaps.

[0087] The magnetron target mechanism 4 is arranged in the vacuum coating seat 12, and the magnetron target mechanism 4 is used to perform magnetron sputtering on the substrate and prevent large particles from being adsorbed on the surface of the substrate. Figure 5 As shown, the magnetron target mechanism 4 includes a coating target 41, a sputtering cathode 47, a sputtering anode 42, an anode coil 43, an auxiliary coil 44, a cathode cooling unit 46 and a charge elimination unit 45. The sputtering anode 42, the anode coil 43 and the auxiliary coil 44 are respectively arranged in the vacuum coating seat 12, the coating target 41 and the sputtering cathode 47 are fixedly mounted on the charge elimination unit 45, and the cathode cooling unit 46 is used to cool and protect the sputtering cathode 47;

[0088] It should be noted that in this embodiment, the coating target material 41 can be a carbon target material or a doped target material, the substrate to be coated can be a metal, ceramic, plastic, or glass substrate, and the substrate to be coated needs to be pretreated before coating, and the working gas in this embodiment can be argon.

[0089] In this embodiment, the sputtering anode 42, the anode coil 43, and the auxiliary coil 44 are electrically connected to the coating industrial computer 14 respectively. The sputtering anode 42 can be set at an angle. The sputtering anode 42 is fixedly installed in the vacuum coating seat 12 by means of snaps or bolts, and the anode coil 43 and the auxiliary coil 44 are installed on the inner wall of the vacuum coating seat 12 by means of embedding. The anode coil 43 and the auxiliary coil 44 are energized to form an auxiliary electromagnetic source, thereby enhancing the auxiliary effect of magnetron sputtering coating. The auxiliary coil 44 can be a cathode coil.

[0090] Synchronous drive mechanism 2, such as Figure 5As shown, the synchronous drive mechanism 2 is mounted on the device base 11;

[0091] Wherein, the synchronous driving mechanism 2 comprises:

[0092] A driving motor 21, wherein the driving motor 21 is fixedly mounted on the device base 11, the driving motor 21 may be a single-phase asynchronous motor, and the driving motor 21 is electrically connected to the coating industrial computer 14;

[0093] A synchronous linkage part 22 fixedly connected to the output end of the drive motor 21, and

[0094] The impurity removal driving unit 23 is disposed in the vacuum coating seat 12 and is used to drive the charge elimination unit 45 to move;

[0095] The gas supply mechanism 3 is used to supply working gas into the vacuum coating seat 12 and to assist in increasing the contact area between the working gas and the coating target 41 . The gas supply mechanism 3 is installed on the device base 11 .

[0096] In this embodiment, when magnetron sputtering is performed on a substrate, the substrate to be coated is placed in the vacuum coating seat 12, and the coating industrial control computer 14 controls the vacuum coating seat 12 to evacuate the substrate to ensure that the vacuum degree of the vacuum coating seat 12 is 0.01-0.05 Pa. Then, the coating industrial control computer 14 starts the gas supply mechanism 3, the sputtering cathode 47, the sputtering anode 42, the anode coil 43, the auxiliary coil 44, the cathode cooling unit 46 and the charge elimination unit 45, and at the same time starts the drive motor 21. The drive motor 21 starts The movement can drive the synchronous linkage part 22 and the impurity removal driving part 23 to move, so that the synchronous linkage part 22 drives the gas supply mechanism 3 to move, realizes the accelerated dispersion of the working gas, and thereby increases the contact area with the coating target 41, and the movement of the impurity removal driving part 23 can drive the sputtering cathode 47 and the coating target 41 to move. At the same time, the start-up of the charge elimination part 45 can drive the sputtering cathode 47 and the coating target 41 to further move, thereby improving the utilization rate of the coating target 41 and reducing the generation of large particles, thereby ensuring the coating quality of the substrate.

[0097] In the embodiment of the present invention, a magnetron target mechanism 4 and a synchronous drive mechanism 2 are provided. The synchronous drive mechanism 2 is composed of a drive motor 21, a synchronous linkage part 22, and an impurity removal drive part 23. The impurity removal drive part 23 can cooperate with the charge elimination part 45 to ensure that the surface of the coating target material 41 is evenly worn and local excessive consumption is avoided, thereby improving the utilization rate of the coating target material 41 and reducing the generation of large particles, ensuring the coating quality of the substrate, and effectively overcoming the problems of large particles being deposited on the coating substrate during the coating operation in the prior art, affecting the coating quality, and uneven wear on the surface of the coating target material 41, resulting in local excessive consumption of the target material.

[0098] In a further preferred embodiment of the present invention, Figure 8-Figure 10 As shown, the gas supply mechanism 3 includes:

[0099] A gas supply pump 31, the gas supply pump 31 is fixedly mounted on the device base 11, and the gas supply pump 31 is communicated with a working gas source, the gas supply pump 31 may be a vacuum gas pump, the gas supply pump 31 is fixedly mounted on the device base 11 by a clamp or a fastening bolt, and the gas inlet end of the gas supply pump 31 is communicated with an argon gas tank through a conduit;

[0100] an accelerating discrete portion 32 connected to the gas supply pump 31, the accelerating discrete portion 32 being disposed in the device base 11, and the accelerating discrete portion 32 being used to accelerate and discrete the working gas;

[0101] The gas guide portion 33 is disposed in the accelerating discrete portion 32 and is used for performing discrete acceleration processing on the working gas.

[0102] In the embodiment of the present invention, a gas supply mechanism 3 is provided, and the gas supply mechanism 3 is composed of an acceleration discrete part 32 and a gas guide part 33. The acceleration discrete part 32 and the gas guide part 33 can be driven by the synchronous linkage part 22 respectively, so as to fully discretize, pressurize and accelerate the working gas guided in the acceleration discrete part 32. Compared with the prior art, it helps to uniformly contact the discharged working gas with the coating target material 41, on the one hand, improves the coating deposition efficiency, and on the other hand, driven by the synchronous linkage part 22, it can assist and enhance the efficiency of the sputtering particles of the magnetron target mechanism 4. Compared with the prior art, it is also easy to control and avoids an increase in energy consumption.

[0103] In this embodiment, the acceleration discrete portion 32 includes:

[0104] An accelerating discrete seat 321, wherein the accelerating discrete seat 321 is fixedly mounted on the device base 11, and the interior of the accelerating discrete seat 321 is hollow, and the upper side of the accelerating discrete seat 321 is connected to the gas supply pump 31;

[0105] A variable pressure accelerating chamber 322, wherein the variable pressure accelerating chamber 322 is fixedly mounted on one side of the accelerating discrete seat 321, and the variable pressure accelerating chamber 322 is used for pressurizing the working gas by heating;

[0106] The gas release seat 323 is rotatably mounted on one side of the variable pressure accelerating chamber 322 , and the gas release seat 323 is also connected to the synchronous linkage part 22 .

[0107] It should be noted that the acceleration discrete seat 321 can be fixedly installed on the device base 11 by a clamp or a clamp ring, the acceleration discrete seat 321 can be a round seat with a hollow interior, the variable pressure acceleration chamber 322 can be a round seat or a round cavity with a hollow interior, and the gas release seat 323 is rotatably connected to the variable pressure acceleration chamber 322 through bearings or rollers, and the gas release seat 323 can be a pointed cone seat structure.

[0108] In a further preferred embodiment of the present invention, Figure 8 , Figure 11-Figure 12 As shown, the gas guide portion 33 includes:

[0109] A spiral guide paddle 331, wherein the spiral guide paddle 331 is rotatably mounted in the acceleration discrete seat 321, one end of the spiral guide paddle 331 is connected to the synchronous linkage part 22, the spiral guide paddle 331 may be a spiral structure, and the outer wall of the spiral guide paddle 331 is polished;

[0110] A heat expansion seat 332, wherein the heat expansion seat 332 is fixedly installed in the voltage changing acceleration chamber 322;

[0111] The heat expansion seat 332 can be made of polypropylene (PP), polyvinyl chloride (PVC) or a combination of the two. The heat expansion seat 332 can be a conical or truncated cone structure. The heat expansion seat 332 is fixedly installed in the variable pressure acceleration chamber 322 by means of a snap or a fastening bolt. When the heat expansion seat 332 is heated, it will expand rapidly, thereby reducing the gap between the heat expansion seat 332 and the inner wall of the variable pressure acceleration chamber 322, thereby pressurizing and accelerating the working gas, which is beneficial to the accelerated collision contact between the working gas and the coating target 41.

[0112] At least one set of auxiliary spoilers 333, wherein the auxiliary spoilers 333 are fixedly mounted in the gas release seat 323, and the auxiliary spoilers 333 are used to assist in spoiling the working gas;

[0113] In this embodiment, the auxiliary spoiler 333 can be a diamond plate, a spiral plate or a fan-shaped plate structure that is arranged circumferentially and tilted. The auxiliary spoiler 333 is fixedly installed in the gas release seat 323 by mortise and tenon or plug-in. The setting of the auxiliary spoiler 333 can accelerate the cutting spoiler of the working gas when the gas release seat 323 rotates, thereby facilitating the discrete distribution of the gas.

[0114] The release discrete groove 334 is opened at the end of the gas release seat 323, and the release discrete groove 334 is used for assisting the dispersion of the working gas.

[0115] In this embodiment, the release discrete groove 334 is circumferentially arranged counterclockwise at the end of the gas release seat 323, and the release discrete groove 334 can be a rectangular groove or a "V"-shaped groove structure.

[0116] In a further preferred embodiment of the present invention, Figure 5-Figure 6 As shown, the synchronous linkage unit 22 includes:

[0117] A synchronous linkage rod 221, wherein the synchronous linkage rod 221 is rotatably mounted on the device base 11, and one end of the synchronous linkage rod 221 is fixedly connected to the output end of the drive motor 21. The synchronous linkage rod 221 can be fixedly connected to the device base 11 by means of a bearing or a roller, and one end of the synchronous linkage rod 221 is fixedly connected to the output end of the drive motor 21 by means of a plug-in or interference fit;

[0118] A driving wheel 222, the driving wheel 222 is fixedly sleeved on the synchronous linkage rod 221, a driven wheel 223 is provided on one side of the driving wheel 222, and the driving wheel 222 and the driven wheel 223 are rotationally connected through a conveyor belt, and one side of the driven wheel 223 is fixedly connected to one end of the spiral guide paddle 331;

[0119] In this embodiment, the driving wheel 222 is fixedly mounted on the synchronous linkage rod 221 by welding or riveting, and the driven wheel 223 is fixedly connected to the end of the spiral guide paddle 331 by plugging or riveting.

[0120] A driving gear 224 is fixedly sleeved on the outside of the synchronous linkage rod 221 , and a driven ring gear 225 is provided on one side of the driving gear 224 . The driven ring gear 225 is meshed with the driving gear 224 for transmission, and the driven ring gear 225 is fixedly sleeved on the outer wall of the gas release seat 323 .

[0121] In this embodiment, the driving gear 224 can be fixedly mounted on the outer wall of the synchronous linkage rod 221 by welding or riveting, and the driven gear ring 225 is fixedly sleeved on the outer wall of the gas release seat 323 by mortise and tenon joint or riveting.

[0122] When the working gas enters the acceleration discrete seat 321, the driving motor 21 is started to drive the synchronous linkage rod 221 to rotate. The rotation of the synchronous linkage rod 221 can synchronously drive the active wheel 222 and the active gear 224 to rotate, so that the active wheel 222 and the active gear 224 respectively drive the driven wheel 223 and the driven gear ring 225 to rotate. When the driven wheel 223 rotates, it can drive the spiral guide paddle 331 to rotate, so that the spiral guide paddle 331 accelerates and guides the working gas in the acceleration discrete seat 321, and the rotation of the driven gear ring 225 can drive the gas release seat 323 to rotate. It should be noted that at this time, the direction of the gas release seat 323 is opposite to that of the spiral guide paddle 331. At the same time, the auxiliary spoiler 333 and the release discrete groove 334 further accelerate and disperse the working gas, so that the working gas entering the vacuum coating seat 12 is fully in contact with the coating target 41.

[0123] In a further preferred embodiment of the present invention, Figure 5-Figure 6 As shown, the impurity removal driving unit 23 includes:

[0124] A debris removal driving rod 231, wherein the debris removal driving rod 231 is rotatably mounted on the device base 11, and one end of the debris removal driving rod 231 is fixedly connected to the end of the synchronous linkage rod 221;

[0125] At least one set of oscillating cams 232 , wherein the oscillating cams 232 are fixedly sleeved on the outer wall of the impurity removal driving rod 231 , and the oscillating cams are used to drive the charge eliminating unit 45 .

[0126] In this embodiment, one end of the impurity removal driving rod 231 is fixedly connected to the end of the synchronous linkage rod 221 by riveting or clamping. The number of oscillation cams 232 can be 2-4 groups, and the oscillation cams 232 can be made of elastic material.

[0127] In a further preferred embodiment of the present invention, Figure 6 As shown, the charge eliminating unit 45 includes:

[0128] An elimination motor 451, wherein the output end of the elimination motor 451 is fixedly connected to the sputtering cathode 47, and a coating target 41 is fixedly installed on the upper part of the sputtering cathode 47. The elimination motor 451 may be a servo motor, and the elimination motor 451 is communicatively connected to the coating industrial computer 14. The output end of the elimination motor 451 may be fixedly connected to one side of the sputtering cathode 47 by a buckle, and the coating target 41 may also be fixedly arranged on the upper surface of the sputtering cathode 47 by a bolt or a buckle;

[0129] A motor vibration seat 452 for supporting the elimination motor 451, the motor vibration seat 452 being fixedly connected to the elimination motor 451;

[0130] At least one set of oscillation elastic seats 453 , one end of which is fixedly connected to the motor vibration seat 452 , the bottom of which is embedded in the oscillation base 454 , and the oscillation base 454 is fixedly mounted on the device base 11 .

[0131] In this embodiment, the motor vibration seat 452 can be a rectangular seat or a round seat with a hollow interior, and the motor vibration seat 452 can be made of elastic material, eliminating the motor 451 being fixedly mounted on the upper surface of the motor vibration seat 452 by means of a clamp or a hoop, and the oscillation elastic seat 453 can be a rectangular elastic sheet or a rectangular elastic plate, the upper end of the oscillation elastic seat 453 is fixedly connected to the lower surface of the vibration elastic seat through an elastic column, and the lower end of the oscillation elastic seat 453 can be fixedly connected to the upper surface of the oscillation base 454 through a torsion spring or a retaining spring.

[0132] During operation, the rotation of the synchronous linkage rod 221 can drive the impurity removal drive rod 231 to rotate, so that the impurity removal drive rod 231 drives the oscillation cam 232 to rotate, and the oscillation cam 232 intermittently squeezes the motor vibration seat 452, and the motor vibration seat 452 acts on the oscillation elastic seat 453, so that the motor vibration seat 452 drives the elimination motor 451, the sputtering cathode 47, and the coating target 41 to swing. At the same time, the start of the elimination motor 451 can drive the sputtering cathode 47 and the coating target 41 to rotate. The distribution of sputtered particles is distributed through high-frequency vibration, thereby reducing the generation of large particles, avoiding doping of the coating layer, and effectively improving the sputtering rate of the target material. At the same time, due to the dispersion effect of vibration, the deposition of large particles is reduced, and the uniformity and quality of the film are improved.

[0133] In the embodiment of the present invention, a charge elimination unit 45 is provided. The setting of the charge elimination unit 45 can drive the sputtering cathode 47 and the coating target 41 to rotate, and distribute the distribution of sputtering particles through high-frequency vibration, thereby reducing the generation of large particles, avoiding doping of the coating layer, and effectively improving the sputtering rate of the target material. At the same time, due to the dispersing effect of the vibration, the deposition of large particles is reduced, and the uniformity and quality of the thin film are improved.

[0134] In a further preferred embodiment of the present invention, Figure 7 As shown, the cathode cooling unit 46 includes:

[0135] A cooling liquid injection pipe 461, one end of which is connected to a cooling liquid source;

[0136] It should be noted that the coolant may be water, glycerin or other liquid that is easy to conduct heat, and the coolant source stores the coolant.

[0137] A cathode cooling disk 462, which is fixedly mounted on the device base 11 and is used to assist in cooling the sputtering cathode 47, and one end of the cathode cooling disk 462 is connected to the coolant injection pipe 461;

[0138] In this embodiment, the cathode cooling disk 462 can be a planar spiral disk structure, and one end of the cathode cooling disk 462 is fixedly connected to one end of the coolant injection pipe 461 through a sealing flange. The cathode cooling disk 462 can absorb the heat generated by the sputtering cathode 47 during operation, thereby protecting the sputtering cathode 47.

[0139] A cooling return pipe 463, wherein the cooling return pipe 463 is fixedly connected to the cathode cooling plate 462;

[0140] A spiral heating tube 464 sealed and connected to one end of the cooling reflux tube 463, wherein the spiral heating tube 464 is sleeved on the outside of the heat expansion seat 332, and the spiral heating tube 464 is used for auxiliary heating of the heat expansion seat 332;

[0141] It should be noted that the cooling reflux pipe 463, the cathode cooling plate 462, and the spiral heating pipe 464 can all be corrugated pipes or telescopic pipes made of PVC or stainless steel. The spiral heating pipe 464 is spirally sleeved on the outside of the heated expansion seat 332, so that the coolant after absorbing the heat of the sputtering cathode 47 can assist in heating the heated expansion seat 332 inside the heated expansion seat 332. When the heated expansion seat 332 is heated, it will expand rapidly, thereby reducing the gap between the heated expansion seat 332 and the inner wall of the variable pressure acceleration chamber 322, thereby pressurizing and accelerating the working gas, which is beneficial to the accelerated collision contact between the working gas and the coating target 41.

[0142] A coolant circulation end 465 is installed at the end of the spiral heating tube 464, and the coolant circulation end 465 is used to assist in releasing coolant.

[0143] In the embodiment of the present invention, a heat expansion seat 332 and a cathode cooling part 46 are provided. The cathode cooling part 46 can use the cooling liquid after absorbing the heat of the sputtering cathode 47 to assist in heating the heat expansion seat 332 inside the heat expansion seat 332, thereby reducing the gap between the heat expansion seat 332 and the inner wall of the variable pressure acceleration chamber 322, thereby pressurizing and accelerating the working gas, which is beneficial to the accelerated collision contact between the working gas and the coating target 41.

[0144] In a further preferred embodiment of the present invention, Figure 13-14 As shown, the embodiment of the present invention also includes:

[0145] A substrate adjustment mechanism 5, which is disposed on the substrate placement seat 13, and is used to support the substrate to be coated and to assist in adjusting the position of the substrate;

[0146] Wherein, the substrate adjustment mechanism 5 comprises:

[0147] An adjustment positioning seat 51, wherein the adjustment positioning seat 51 is fixedly mounted on the substrate placing and taking seat 13;

[0148] A linkage adjustment seat 52 rotatably sleeved on the adjustment positioning seat 51;

[0149] It should be noted that the adjustment and positioning seat 51 and the linkage adjustment seat 52 can both be round seats or discs with hollow interiors, and the adjustment and positioning seat 51 is fixedly connected to the lower wall of the substrate placement seat 13 by snaps or bolts, and the linkage adjustment seat 52 is rotatably connected to the adjustment and positioning seat 51 by bearings or rollers.

[0150] A particle guide seat 55 is fixedly connected to the linkage adjustment seat 52, and is used to assist in guiding the sputtered particles. The outer wall of the particle guide seat 55 is polished, and the particle guide seat 55 is fixedly connected to the end of the linkage adjustment seat 52 by means of bolts or snaps. In order to prevent the sputtered particles from being adsorbed on the surface of the particle guide seat 55, the auxiliary coil 44 can be sleeved on the outside of the particle guide seat 55.

[0151] at least one set of substrate holders 53, wherein the substrate holders 53 are used to fix the substrate to be coated, and

[0152] An adjustment driving unit 54 is disposed in the adjustment positioning seat 51 , and the adjustment driving unit 54 is connected to the substrate clamping seat 53 .

[0153] In this embodiment, the substrate holders 53 are fixedly connected to the surface of the substrate by buckles or bolts, and the number of the substrate holders 53 can be 3-6 groups.

[0154] In the embodiment of the present invention, a substrate adjustment mechanism 5 is provided. The substrate adjustment mechanism 5 cooperates with the adjustment drive part 54, the adjustment positioning seat 51, and the linkage adjustment seat 52 to achieve synchronous coating operation of multiple groups of substrates. At the same time, it can also automatically flip the substrate to achieve rapid double-sided coating of the substrate.

[0155] In a further preferred embodiment of the present invention, Figure 15-16 As shown, the adjustment drive unit 54 includes:

[0156] An adjusting motor 541, wherein the adjusting motor 541 is fixedly installed in the adjusting positioning seat 51, and the output end of the adjusting motor 541 is fixedly connected to the linkage adjusting seat 52, and the adjusting motor 541 is electrically connected to the coating industrial computer 14, and the output end of the adjusting motor 541 is fixedly connected to the inner wall of the linkage adjusting seat 52 by means of interference fit;

[0157] At least one set of adjustment positioning grooves 542, wherein the adjustment positioning grooves 542 are provided on the side wall of the adjustment positioning seat 51;

[0158] The adjustment positioning grooves 542 are circumferentially arranged on the outer wall of the adjustment positioning seat 51 , the number of the adjustment positioning grooves 542 can be 3-6 groups, and the adjustment positioning grooves 542 can be a "V"-shaped or "Y"-shaped groove structure, and the inner wall of the adjustment positioning groove 542 is polished.

[0159] At least one set of adjustment and positioning shafts 543, wherein the adjustment and positioning shafts 543 are slidably mounted in the adjustment and positioning slots 542, one end of the adjustment and positioning shafts 543 is detachably connected to an adjustment drive seat 544, and one end of the adjustment drive seat 544 away from the adjustment and positioning shafts 543 is fixedly connected to an adjustment flip shaft 545;

[0160] In this embodiment, the adjustment drive seat 544 can be an arc-shaped seat or an arc-shaped plate, and each group of the adjustment drive seat 544 is symmetrically threaded with two groups of adjustment positioning shafts 543, and the adjustment drive seat 544 and the adjustment flip shaft 545 are fixedly connected by snapping or plugging.

[0161] An adjusting flip shaft 545, wherein the adjusting flip shaft 545 is rotatably disposed on the linkage adjusting seat 52, and one end of the adjusting flip shaft 545 away from the adjusting driving seat 544 is fixedly connected to the substrate clamping seat 53, and the middle portion of the adjusting flip shaft 545 is rotatably connected to the linkage adjusting seat 52 via a bearing or a roller, and the adjusting flip shaft 545 and the substrate clamping seat 53 are riveted or clamped;

[0162] The positioning friction disk 546 is fixedly embedded in the linkage adjustment seat 52 , and the positioning friction disk 546 is rotationally connected to the adjustment flip shaft 545 .

[0163] In this embodiment, the positioning friction disk 546 is circumferentially arranged in the linkage adjustment seat 52. The positioning friction disk 546 is made of wear-resistant and anti-slip material. The adjustment flip shaft 545 passes through the center position of the positioning friction disk 546. The setting of the positioning friction disk 546 can remain fixed when the adjustment flip shaft 545 does not rotate, which is beneficial to the coating operation on the surface of the substrate.

[0164] During operation, the adjusting motor 541 is turned on, and the starting of the adjusting motor 541 can drive the linkage adjusting seat 52 to rotate, so that the linkage adjusting seat 52 drives the adjusting flip shaft 545 and the substrate clamping seat 53 to rotate, and the positioning friction disk 546 can remain fixed when the adjusting flip shaft 545 does not rotate, which is beneficial to the coating operation on the surface of the substrate. When the adjusting flip shaft 545 drives the adjusting driving seat 544 and the adjusting positioning shaft 543 to rotate into the adjusting positioning groove 542, the adjusting positioning groove 542 guides the adjusting driving seat 544 and the adjusting positioning shaft 543, so that the adjusting driving seat 544 and the adjusting positioning shaft 543 drive the adjusting flip shaft 545 and the substrate clamping seat 53 to flip, thereby realizing the double-sided coating operation on the substrate.

[0165] In summary, the present invention provides a diamond-like carbon thin film vacuum coating device. When magnetron sputtering coating is performed on a substrate, the substrate to be coated is placed in a vacuum coating seat 12, and the coating industrial control computer 14 controls the vacuum coating seat 12 to evacuate the vacuum coating seat 12 to ensure that the vacuum degree of the vacuum coating seat 12 is 0.01-0.05Pa. Then, the coating industrial control computer 14 starts the gas supply mechanism 3, the sputtering cathode 47, the sputtering anode 42, the anode coil 43, the auxiliary coil 44, the cathode cooling unit 46 and the charge elimination unit 45, and starts the drive motor at the same time. 21. The start of the driving motor 21 can drive the synchronous linkage part 22 and the impurity removal driving part 23 to move, so that the synchronous linkage part 22 drives the gas supply mechanism 3 to move, realizes the accelerated dispersion of the working gas, and further increases the contact area with the coating target 41. The movement of the impurity removal driving part 23 can drive the sputtering cathode 47 and the coating target 41 to move. At the same time, the start of the charge elimination part 45 can drive the sputtering cathode 47 and the coating target 41 to move further, thereby improving the utilization rate of the coating target 41 and reducing the generation of large particles, thereby ensuring the coating quality of the substrate.

[0166] In the embodiment of the present invention, a magnetron target mechanism 4 and a synchronous drive mechanism 2 are provided. The synchronous drive mechanism 2 is composed of a drive motor 21, a synchronous linkage part 22, and an impurity removal drive part 23. The impurity removal drive part 23 can cooperate with the charge elimination part 45 to ensure that the surface of the coating target material 41 is evenly worn and local excessive consumption is avoided, thereby improving the utilization rate of the coating target material 41 and reducing the generation of large particles, ensuring the coating quality of the substrate, and effectively overcoming the problems of large particles being deposited on the coating substrate during the coating operation in the prior art, affecting the coating quality, and uneven wear on the surface of the coating target material 41, resulting in local excessive consumption of the target material.

[0167] It should be noted that, for the above-mentioned embodiments, for the sake of simplicity, they are all described as a series of action combinations, but those skilled in the art should know that the present invention is not limited by the described order of actions, because according to the present invention, some steps may be performed in other orders or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present invention.

[0168] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the scope of protection of the invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on these embodiments, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in this field can still combine, add, delete or make other adjustments to the features in the various embodiments of the present invention according to the circumstances without conflict, without making creative work, so as to obtain different other technical solutions that do not deviate from the concept of the present invention in essence, and these technical solutions also belong to the scope of protection of the present invention.

Claims

1. A diamond-like thin film vacuum coating device, the diamond-like thin film vacuum coating device comprising: A device body (1), the device body (1) comprising a device base (11), a coating industrial control computer (14), a vacuum coating seat (12), and a substrate pick-up and placement seat (13), the vacuum coating seat (12) being fixedly mounted on the device base (11), the coating industrial control computer (14) being fixedly mounted on a side wall of the vacuum coating seat (12), and the substrate pick-up and placement seat (13) being detachably mounted on the vacuum coating seat (12); A magnetron target mechanism (4), wherein the magnetron target mechanism (4) is arranged in the vacuum coating seat (12), and is used for magnetron sputtering a substrate and preventing large particles from being adsorbed on the surface of the substrate, and is characterized in that the magnetron target mechanism (4) comprises a coating target material (41), a sputtering cathode (47), a sputtering anode (42), an anode coil (43), an auxiliary coil (44), a cathode cooling part (46) and a charge elimination part (45), wherein the sputtering anode (42), the anode coil (43) and the auxiliary coil (44) are respectively arranged in the vacuum coating seat (12), the coating target material (41) and the sputtering cathode (47) are fixedly mounted on the charge elimination part (45), and the cathode cooling part (46) is used for cooling and protecting the sputtering cathode (47); A synchronous drive mechanism (2), wherein the synchronous drive mechanism (2) is mounted on a device base (11); Wherein, the synchronous drive mechanism (2) comprises: A driving motor (21), wherein the driving motor (21) is fixedly mounted on the device base (11); a synchronous linkage part (22) fixedly connected to the output end of the driving motor (21), and An impurity removal driving unit (23), the impurity removal driving unit (23) being arranged in the vacuum coating seat (12), and the impurity removal driving unit (23) being used to drive the charge elimination unit (45) to move; A gas supply mechanism (3) is used to supply working gas into the vacuum coating seat (12) and to assist in increasing the contact area between the working gas and the coating target material (41). The gas supply mechanism (3) is installed on the device base (11).

2. The diamond-like carbon thin film vacuum coating device according to claim 1, characterized in that: The gas supply mechanism (3) comprises: A gas supply pump (31), wherein the gas supply pump (31) is fixedly mounted on the device base (11), and the gas supply pump (31) is connected to a working gas source; an accelerating discrete portion (32) connected to the gas supply pump (31), the accelerating discrete portion (32) being arranged in the device base (11), and being used to accelerate and discrete the working gas; A gas guide portion (33), wherein the gas guide portion (33) is arranged in the accelerating discrete portion (32), and the gas guide portion (33) is used to perform discrete acceleration processing on the working gas.

3. The diamond-like carbon thin film vacuum coating device according to claim 2, characterized in that: The acceleration discrete portion (32) comprises: An accelerating discrete seat (321), wherein the accelerating discrete seat (321) is fixedly mounted on the device base (11), and the interior of the accelerating discrete seat (321) is hollow; A variable pressure accelerating chamber (322), wherein the variable pressure accelerating chamber (322) is fixedly mounted on one side of the accelerating discrete seat (321), and the variable pressure accelerating chamber (322) is used to pressurize the working gas by heating; A gas release seat (323) is rotatably mounted on one side of the variable pressure accelerating chamber (322), and the gas release seat (323) is also connected to the synchronous linkage part (22).

4. The diamond-like carbon thin film vacuum coating device according to claim 3, characterized in that: The gas guide portion (33) comprises: A spiral guide paddle (331), wherein the spiral guide paddle (331) is rotatably mounted in the accelerating discrete seat (321), and one end of the spiral guide paddle (331) is connected to the synchronous linkage part (22); A heat expansion seat (332), wherein the heat expansion seat (332) is fixedly installed in the voltage changing acceleration chamber (322); at least one set of auxiliary spoilers (333), wherein the auxiliary spoilers (333) are fixedly mounted in the gas release seat (323), and the auxiliary spoilers (333) are used to perform auxiliary spoilering on the working gas; A release discrete groove (334), wherein the release discrete groove (334) is opened at the end of the gas release seat (323), and the release discrete groove (334) is used to assist in the dispersion of the working gas.

5. The diamond-like carbon thin film vacuum coating device according to claim 4, characterized in that: The synchronous linkage unit (22) comprises: A synchronous linkage rod (221), wherein the synchronous linkage rod (221) is rotatably mounted on the device base (11), and one end of the synchronous linkage rod (221) is fixedly connected to the output end of the drive motor (21); A driving rotating wheel (222), the driving rotating wheel (222) is fixedly sleeved on the synchronous linkage rod (221), a driven rotating wheel (223) is arranged on one side of the driving rotating wheel (222), and the driving rotating wheel (222) and the driven rotating wheel (223) are rotationally connected via a conveyor belt, and one side of the driven rotating wheel (223) is fixedly connected to one end of a spiral guide paddle (331); A driving gear (224) is fixedly sleeved on the outside of the synchronous linkage rod (221), and a driven ring gear (225) is provided on one side of the driving gear (224). The driven ring gear (225) and the driving gear (224) are meshed and transmitted with each other, and the driven ring gear (225) is fixedly sleeved on the outer side wall of the gas release seat (323).

6. The diamond-like carbon thin film vacuum coating device according to claim 5, characterized in that: The impurity removal driving unit (23) comprises: A debris removal driving rod (231), the debris removal driving rod (231) is rotatably mounted on the device base (11), and one end of the debris removal driving rod (231) is fixedly connected to the end of the synchronous linkage rod (221); At least one set of oscillating cams (232), wherein the oscillating cams (232) are fixedly sleeved on the outer wall of the impurity removal driving rod (231), and the oscillating cams are used to drive the charge elimination unit (45).

7. The diamond-like carbon thin film vacuum coating device according to claim 1, characterized in that: The charge eliminating unit (45) comprises: An elimination motor (451), wherein an output end of the elimination motor (451) is fixedly connected to a sputtering cathode (47), and a coating target (41) is fixedly mounted on the upper portion of the sputtering cathode (47); A motor vibration seat (452) for supporting the elimination motor (451), the motor vibration seat (452) being fixedly connected to the elimination motor (451); At least one group of oscillating elastic seats (453), one end of the oscillating elastic seat (453) is fixedly connected to the motor vibration seat (452), the bottom of the oscillating elastic seat (453) is embedded in the oscillating base (454), and the oscillating base (454) is fixedly mounted on the device base (11).

8. The diamond-like carbon thin film vacuum coating device according to claim 7, characterized in that: The cathode cooling unit (46) comprises: A cooling liquid injection pipe (461), one end of which is connected to a cooling liquid source; a cathode cooling disk (462), the cathode cooling disk (462) being fixedly mounted on the device base (11), and the cathode cooling disk (462) being used for auxiliary cooling of the sputtering cathode (47), and one end of the cathode cooling disk (462) being connected to the cooling liquid injection pipe (461); A cooling return pipe (463), wherein the cooling return pipe (463) is fixedly connected to the cathode cooling plate (462); a spiral heating tube (464) sealed and connected to one end of the cooling reflux tube (463), wherein the spiral heating tube (464) is sleeved on the outside of the heat expansion seat (332), and the spiral heating tube (464) is used to assist in heating the heat expansion seat (332); A coolant circulation end (465) is installed at the end of the spiral heating tube (464), and the coolant circulation end (465) is used to assist in releasing coolant.

9. The diamond-like carbon thin film vacuum coating device according to any one of claims 2 to 8, characterized in that: Also includes: A substrate adjustment mechanism (5), the substrate adjustment mechanism (5) being arranged on a substrate pick-up and placement seat (13), the substrate adjustment mechanism (5) being used to support the substrate to be coated and to assist in adjusting the position of the substrate; Wherein, the substrate adjustment mechanism (5) comprises: An adjusting and positioning seat (51), wherein the adjusting and positioning seat (51) is fixedly mounted on the substrate taking and placing seat (13); A linkage adjustment seat (52) rotatably sleeved on the adjustment positioning seat (51); a particle guide seat (55) fixedly connected to the linkage adjustment seat (52), wherein the particle guide seat (55) is used to assist in guiding the sputtered particles; at least one set of substrate holders (53), wherein the substrate holders (53) are used to fix the substrate to be coated, and An adjustment drive unit (54) is arranged in the adjustment positioning seat (51), and the adjustment drive unit (54) is connected to the substrate holder (53).

10. The diamond-like carbon thin film vacuum coating device according to claim 9, characterized in that: The adjustment drive unit (54) comprises: An adjusting motor (541), wherein the adjusting motor (541) is fixedly installed in the adjusting positioning seat (51), and an output end of the adjusting motor (541) is fixedly connected to a linkage adjusting seat (52); At least one set of adjustment positioning grooves (542), wherein the adjustment positioning grooves (542) are arranged on the side wall of the adjustment positioning seat (51); At least one set of adjustment positioning shafts (543), wherein the adjustment positioning shafts (543) are slidably mounted in the adjustment positioning grooves (542), one end of the adjustment positioning shafts (543) is detachably connected to an adjustment drive seat (544), and one end of the adjustment drive seat (544) away from the adjustment positioning shafts (543) is fixedly connected to an adjustment flip shaft (545); An adjusting flip shaft (545), wherein the adjusting flip shaft (545) is rotatably disposed on the linkage adjusting seat (52), and one end of the adjusting flip shaft (545) away from the adjusting driving seat (544) is fixedly connected to a substrate holder (53); A positioning friction disk (546) is fixedly embedded in the linkage adjustment seat (52), and the positioning friction disk (546) is rotationally connected to the adjustment flip shaft (545).

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