A semiconductor detection device with a radiation interference structure

Abstract

The present invention relates to the field of semiconductor detection technology, and in particular to a semiconductor detection device with a radiation interference structure, wherein the semiconductor detection device with a radiation interference structure comprises a column, a radiation interference cavity, a gear ring, a loading component and a detection component, wherein the radiation interference cavity is fixedly connected to the upper end of the column, the gear ring is rotatably connected in the radiation interference cavity, the gear ring is provided with a plurality of grooves arranged in a ring array, and trays are fixedly connected to the inner side walls of the plurality of grooves, respectively. In the present invention, a toggle plate will push a new semiconductor to be loaded onto this group of placement plates again, thereby realizing that the vertical plate uses the placement plate to load the tray, and the toggle plate can load the placement plate, thereby automatically and continuously loading the tray.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor detection, and particularly to a semiconductor detection device with a radiation interference structure. Background Art

[0002] The foundation of modern industry is semiconductor materials and ultra-large-scale semiconductor technology. With the continuous improvement of integration, the internal basic properties of semiconductors are physical effects and phenomena caused by various external factors such as light, heat, magnetism, and electricity acting on semiconductors. These can be collectively referred to as the semiconductor properties of semiconductor materials. Semiconductors need to be subjected to quality inspection before leaving the factory for use.

[0003] Existing detection devices usually detect semiconductor objects one by one, and need to continuously pick up and place semiconductor objects, with complex operations, which are not suitable for mass semiconductor detection. At the same time, when detecting semiconductors, most are detected in an open state such as on a production line, and do not have a radiation interference structure, resulting in poor detection effects. Summary of the Invention

[0004] The purpose of the present invention is to solve the following disadvantages in the prior art: existing detection devices usually detect semiconductor objects one by one, need to continuously pick up and place semiconductor objects, with complex operations, not suitable for mass semiconductor detection, and at the same time, when detecting semiconductors, most are detected in an open state such as on a production line, and do not have a radiation interference structure, resulting in poor detection effects. Thus, a semiconductor detection device with a radiation interference structure is proposed.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solution:

[0006] A semiconductor detection device with a radiation interference structure, the semiconductor detection device with a radiation interference structure includes a column, a radiation interference chamber, a toothed ring, a feeding component, and a detection component. The radiation interference chamber is fixedly connected to the upper end of the column. The toothed ring is rotatably connected in the radiation interference chamber. The toothed ring is provided with a plurality of grooves arranged in a circular array. Tray are respectively fixedly connected to the inner side walls of the plurality of grooves.

[0007] Storage chambers are installed on both sides of the radiation interference chamber, and the loading components include gravity plates, buoyancy plates, vertical plates, placement plates, discharge components and pushing components. Partitions are fixedly connected in the two storage chambers. Two gravity plates are provided and are slidably connected in the storage chambers respectively. The gravity plate is located on one side of the partition. Two buoyancy plates are also provided and are used in conjunction with the gravity plates. The two buoyancy plates are slidably installed in the storage chamber and on the other side corresponding to the position of the gravity plate. The upper ends of the two vertical plates are slidably connected to the gravity plates respectively. Multiple groups of placement plates are installed on the sides of the vertical plates, and the number of placement plates in each group is two. A fourth spring is fixedly connected between the two placement plates in the same group. The loading component is used to place batches of semiconductors on the tray in sequence for testing;

[0008] The discharge assembly includes a gear, a sleeve, a screw rod, a baffle, a square cavity, a water delivery cavity, and a torsion spring, wherein the sleeve is fixedly connected to the side wall of the storage cavity on the left side, the screw rod is rotatably connected to the sleeve, the gear is fixedly connected to the lower end of the screw rod, the gear is meshed with the outer wall of the gear ring, one end of the square cavity is fixedly connected to the storage cavity on the left side, one end of the baffle is slidably connected in the square cavity, one end of the baffle away from the square cavity is threadedly connected to the upper end of the screw rod, the torsion spring is fixedly connected between the upper end of the screw rod and the baffle, one end of the water delivery cavity is connected to the square cavity, and one end of the water delivery cavity away from the square cavity is fixedly connected to the storage cavity on the right side, a connecting rod is fixedly connected between the gravity plate and the buoyancy plate, the connecting rod is slidably connected to the upper wall of the storage cavity, and an external water pump is used to pump water in the storage cavity on the right side into the storage cavity on the left side;

[0009] The detection component includes a detector, a mounting frame, a first spring, a pneumatic assembly and a driving assembly. The mounting frame is fixedly connected to the radiation interference cavity, the detector is slidably connected to one side of the mounting frame, the first spring is fixedly connected between the top of the mounting frame and the detector, and a semicircular block is fixedly connected to the outer side wall of the detector. The detection component is used to detect the semiconductors on the tray in turn.

[0010] Preferably, the pushing assembly includes a horizontal plate, a sliding cavity, a rotating shaft, a toggle plate, a worm gear, and a cam, one end of the horizontal plate is fixedly connected to the column, the rotating shaft is rotatably connected to the horizontal plate, a plurality of toggle plates are installed in a circular array at one end of the rotating shaft, the end of the rotating shaft away from the toggle plate is fixedly connected with a five-pointed star plate, the worm gear is rotatably connected to the horizontal plate, one end of the cam is fixedly connected to the worm gear, and one end of the sliding cavity is fixedly connected to the column.

[0011] Preferably, the air pressure assembly includes an air collecting cavity, an air delivery pipe, an airbag, an arc plate, and a pressing plate. A round hole is formed in the radiation interference cavity. The pressing plate is slidably connected to the side wall of the radiation interference cavity. The airbag is fixedly connected to one side of the pressing plate. The arc plate is fixedly connected to one end of the airbag away from the pressing plate. A third spring is fixedly connected between the arc plate and the pressing plate. The air collecting cavity is fixedly connected to the inner side wall of the round hole. An exhaust port is formed in one side wall of the air collecting cavity. The air delivery pipe is used to connect the air collecting cavity and the airbag.

[0012] Preferably, the driving assembly includes a rotating rod, a sector cavity, a sector plate, a rack plate, a second spring, and a semi-circular block. The sector cavity is a cavity structure formed by protruding from the inner side wall of the water delivery cavity. The rotating rod penetrates through the sector cavity. The sector plate is fixedly connected to the lower end of the rotating rod. Tooth patterns are formed on the arc surface of the sector plate. One end of the rack plate is slidably connected to the upper surface of the radiation interference cavity. The rack plate is meshed with the sector plate. The end of the rack plate away from the radiation interference cavity is slidably connected to the side wall of the detector. Fan blades are annularly and arrayedly installed on the rotating rod. The fan blades are located in the sector cavity.

[0013] Preferably, a worm thread is formed at the lower end of the rotating rod. The lower end of the rotating rod passes through the radiation interference cavity and is meshed with a worm gear.

[0014] Preferably, a sealing cavity is fixedly connected to the lower end of each placing plate. A through hole is formed in one end of the sealing cavity. A piston plate is slidably connected to the end of the sealing cavity away from the through hole. A thrust spring is provided between one end of the piston plate and the inner side wall of the sealing cavity.

[0015] Preferably, two suction cups are provided on the side wall of the radiation interference cavity. The two suction cups are respectively located on one side of the pressing plate.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0017] 1. When the toothed ring rotates, the tray located below the detector moves with the toothed ring and moves away from the round hole on the radiation interference cavity, and then another adjacent tray will move to the lower side of the detector. The detector is used to detect the semiconductor on the tray. As the toothed ring rotates continuously, the detector can quickly detect the semiconductor. Since the semiconductor is in the radiation interference cavity, the radiation interference cavity isolates the semiconductor from the outside world and at the same time plays a role in radiation interference.

[0018] 2. After each downward movement of the vertical plate on the left, the semiconductors on one group of placement plates will fall on one of the trays for subsequent inspection, and the toggle plate will push the new semiconductors to this group of placement plates for re-loading, so that the vertical plate uses the placement plates to load the trays, and the toggle plate can load the placement plates, thereby automatically loading the trays continuously.

[0019] 3. When the detector detects unqualified semiconductors, the suction cup is energized and has adsorption to the extrusion plate. When the extrusion plate moves, it can squeeze the airbag. The gas in the airbag enters the gas collecting chamber through the gas pipe and is discharged through the exhaust air on the gas collecting chamber. At this time, the gas has a certain gas that can blow the semiconductor on the tray to slide out through the extrusion plate, thereby realizing the automatic removal of unqualified semiconductors, so that the vertical plate on the right can collect good semiconductors. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the front structure of a semiconductor detection device with a radiation interference structure proposed by the present invention;

[0021] Figure 2 for Figure 1 A is a schematic diagram of the partially enlarged structure of the middle part;

[0022] Figure 3 This is a schematic diagram of the extruded plate structure proposed by the present invention;

[0023] Figure 4 This is a schematic diagram of the sliding cavity structure proposed by the present invention;

[0024] Figure 5 This is a schematic diagram of the square cavity structure proposed by the present invention;

[0025] Figure 6 A schematic diagram of the pallet structure proposed by the present invention;

[0026] Figure 7 This is a schematic diagram of the buoyancy plate structure proposed by the present invention;

[0027] Figure 8 This is a schematic diagram of the gear ring structure proposed by the present invention.

[0028] In the figure: 1 column, 2 extrusion plate, 3 radiation interference cavity, 4 semicircular block, 5 detector, 6 first spring, 7 partition, 8 mounting frame, 9 connecting rod, 10 storage cavity, 11 horizontal plate, 12 square cavity, 13 vertical plate, 14 rotating shaft, 15 second spring, 16 water delivery cavity, 17 rotating rod, 18 fan-shaped cavity, 19 fan-shaped plate, 20 rack plate, 21 third spring, 22 arc plate, 23 air collecting cavity, 24 air delivery pipe, 25 air bag, 26 sliding cavity, 27 worm gear, 28 cam, 29 five-pointed star plate, 30 toggle plate, 31 piston plate, 32 sealing cavity, 33 placement plate, 34 fourth spring, 35 baffle, 36 torsion spring, 37 screw rod, 38 sleeve, 39 gear, 40 tray, 41 gear ring, 42 gravity plate, 43 fixed plate, 44 fifth spring, 45 buoyancy plate. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0030] Reference Figures 1-8 A semiconductor detection device with a radiation interference structure, the semiconductor detection device with a radiation interference structure includes a column 1, a radiation interference chamber 3, a gear ring 41, a feeding component and a detection component, the radiation interference chamber 3 is fixedly connected to the upper end of the column 1, the radiation interference chamber 3 is located at the lower side of the storage chamber 10 and has a slide groove, the gear ring 41 is rotatably connected in the radiation interference chamber 3, the semiconductor is in the radiation interference chamber 3, the radiation interference chamber 3 can resist radiation interference, the material of the radiation interference chamber 3 is lead boron polyethylene, the radiation interference chamber 3 can isolate the internal environment of the detection from the external environment, thereby playing a role in radiation protection and protecting the safety of the working environment, the side wall of the radiation interference chamber 3 There are two suction cups on it, which will have a moving suction force after power is turned on, and can absorb the extrusion plate 2 to move. The two suction cups are respectively located on one side of the extrusion plate 2. The gear ring 41 is provided with a plurality of grooves arranged in a ring array, and the inner walls of the plurality of grooves are respectively fixedly connected with the tray 40. The gear 39 is meshingly connected to the outer wall of the gear ring 41, and can drive the gear 39 to rotate when the gear ring 41 rotates. When the gear ring 41 continues to no longer mesh with the rotating gear 39, the screw rod 37 will reset and rotate under the action of the torsion spring 36, driving the baffle plate 35 to move down and seal the square cavity 12 again. Therefore, as the baffle plate 35 moves left and up and down reciprocatingly, the amount of water flowing out is a fixed amount.

[0031] Storage chambers 10 are installed on both sides of the radiation interference chamber 3. The radiation interference chamber is made of special radiation-resistant material. The semiconductor can be isolated from the outside when being detected in the radiation interference chamber 3, reducing the impact of the radiation generated during the semiconductor detection on the surrounding area. The loading components include a gravity plate 42, a buoyancy plate 45, a vertical plate 13, a placement plate 33, a discharge assembly and a pushing assembly. The two storage chambers 10 are fixedly connected with a partition 7. Two gravity plates 42 are provided, and are respectively slidably connected in the storage chamber 10. The gravity plate 42 is located on one side of the partition 7. Two gravity plates 42 are provided, and are respectively slidably connected in the storage chamber 10. The gravity plate 42 Located on one side of the partition 7, there are also two buoyancy plates 45, and they are used in conjunction with the gravity plate 42. The two buoyancy plates 45 are respectively slidably installed on the other side of the storage chamber 10 corresponding to the position of the gravity plate 42. The upper ends of the two vertical plates 13 are respectively slidably connected to the gravity plate 42. A plurality of groups of placement plates 33 are installed on the side of the vertical plates 13, and each group of placement plates 33 has two. A fourth spring 34 is fixedly connected between the two placement plates 33 of the same group. The lower end of each group of placement plates 33 is respectively fixedly connected to a sealing chamber 32, and a through hole is opened at one end of the sealing chamber 32. The end of the sealing chamber 32 away from the through hole is slidably connected to a piston plate 31. The piston A thrust spring is provided between one end of the plate 31 and the inner wall of the sealing cavity 32. When the two placement plates 33 move away from each other, the piston plate 31 will be limited by the inner wall of the groove and squeeze the gas in the sealing cavity 32 to discharge the gas onto the semiconductor. This can blow off the dust attached to the surface of the semiconductor before detection, clean the outer surface of the semiconductor, and facilitate subsequent detection. The loading assembly is used to place batches of semiconductors on the tray 40 in sequence for detection. When the toggle plate 30 pushes the semiconductors to the left placement plate 33 respectively, an external water pump is used to pump water in the right storage cavity 10 to the left storage cavity 10. In the storage cavity 10, the two vertical plates 13 move in the direction away from the radiation interference cavity 3 under the pulling force of the fixed plate 43. The horizontal pulling force of the fixed plate 43 on the vertical plates 13 is smaller than the vertical upward buoyancy of the buoyancy plate 45 in the water in the water storage cavity 10. At this time, the rising water level in the left storage cavity 10 can push the buoyancy plate 45 upward again, thereby driving the connecting rod 9 and the vertical plates 13 upward. The water level in the right storage cavity 10 drops, and the vertical plate 13 on the right will move downward, which is convenient for taking out and collecting the semiconductors on the right vertical plate 13. At the same time, the buoyancy of the buoyancy plate 45 on the left is greater than that of the buoyancy plate 45 on the right.

[0032] The discharge assembly includes a gear 39, a sleeve 38, a screw rod 37, a baffle 35, a square cavity 12, a water delivery cavity 16, and a torsion spring 36. The sleeve 38 is fixedly connected to the side wall of the left storage cavity 10. The screw rod 37 is rotatably connected to the sleeve 38. The gear 39 is fixedly connected to the lower end of the screw rod 37. The gear 39 is meshed with the outer wall of the gear ring 41. When the gear ring 41 rotates until the groove is located on one side of the gear 39, the gear 39 is no longer meshed. One end of the square cavity 12 is fixedly connected to the left storage cavity 10. One end of the baffle 35 is slidably connected to the square cavity 12. The downward movement of the baffle 35 can prevent the water in the left storage cavity 10 from flowing out, and the baffle When the gear 35 moves upward, it no longer blocks the outflow of water. The end of the baffle 35 away from the square cavity 12 is threadedly connected to the upper end of the screw rod 37. The torsion spring 36 is fixedly connected between the upper end of the screw rod 37 and the baffle 35. The torsion spring 36 is used to reset the screw rod 37. When the gear ring 41 no longer meshes with the gear 39, the screw rod 37 is reset and rotated under the reset of the torsion spring 36, and drives the baffle 35 to move downward. One end of the water delivery cavity 16 is connected to the square cavity 12, and the end of the water delivery cavity 16 away from the square cavity 12 is connected to the storage cavity 10 located on the right side. A connecting rod 9 is fixedly connected between the gravity plate 42 and the buoyancy plate 45, and the connecting rod 9 is slidably connected to the upper wall of the storage cavity 10.

[0033] The pushing assembly includes a transverse plate 11, a sliding cavity 26, a rotating shaft 14, a toggle plate 30, a worm gear 27, and a cam 28. One end of the transverse plate 11 is fixedly connected to the column 1, and the rotating shaft 14 is rotatably connected to the transverse plate 11. Multiple toggle plates 30 are installed in a circular array at one end of the rotating shaft 14. The end of the rotating shaft 14 away from the toggle plate 30 is fixedly connected to a five-pointed star plate 29. The worm gear 27 is rotatably connected to the transverse plate 11. One end of the cam 28 is fixedly connected to the worm gear 27. When the worm gear 27 rotates, the cam 28 can push the five-pointed star plate 29 to rotate and drive the rotating shaft 14 to rotate. One end of the sliding cavity 26 is fixedly connected to the column 1.

[0034] The detection component includes a detector 5, a mounting frame 8, a first spring 6, a pneumatic assembly and a driving assembly. The mounting frame 8 is fixedly connected to the radiation interference chamber 3. The detector 5 (the detector 5 is an optical detection instrument for semiconductors in the prior art, which is the prior art and will not be explained in detail here) is slidably connected to one side of the mounting frame 8. The first spring 6 is fixedly connected between the top of the mounting frame 8 and the detector 5. A semicircular block 4 is fixedly connected to the outer wall of the detector 5. The detection component is used to detect the semiconductors on the tray 40 in turn.

[0035] The air pressure component includes an air collecting cavity 23, an air delivery pipe 24, an airbag 25, an arc-shaped plate 22, and a pressing plate 2. A round hole is formed in the radiation interference cavity 3. The pressing plate 2 is slidably connected to the side wall of the radiation interference cavity 3. The airbag 25 is fixedly connected to one side of the pressing plate 2. The arc-shaped plate 22 is fixedly connected to the end of the airbag 25 away from the pressing plate 2. A third spring 21 is fixedly connected between the arc-shaped plate 22 and the pressing plate 2. The air collecting cavity 23 is fixedly connected to the inner side wall of the round hole. An exhaust port is formed in one side wall of the air collecting cavity 23. The air delivery pipe 24 is used to connect the air collecting cavity 23 and the airbag 25. The upper surfaces of the airbag 25, the arc-shaped plate 22, and the pressing plate 2 are all on the same horizontal plane.

[0036] The driving component includes a rotating rod 17, a sector cavity 18, a sector plate 19, a rack plate 20, a second spring 15, and a semi-circular block 4. The sector cavity 18 is a cavity structure formed by the convexity of the inner side wall of the water delivery cavity 16. The rotating rod 17 passes through the sector cavity 18. The sector plate 19 is fixedly connected to the lower end of the rotating rod 17. Tooth patterns are formed on the arc surface of the sector plate 19. One end of the rack plate 20 is slidably connected to the upper surface of the radiation interference cavity 3. The rack plate 20 is slidably connected to the upper surface of the radiation interference cavity 3 and will not break away. The rack plate 20 is meshed with the sector plate 19. The end of the rack plate 20 away from the radiation interference cavity 3 is slidably connected to the side wall of the detector 5. Fan blades are annularly arrayed on the rotating rod 17. The fan blades are located in the sector cavity 18. When the water in the water delivery cavity 16 flows, it can push the fan blades and drive the rotating rod 17 to rotate. A worm thread is formed at the lower end of the rotating rod 17. The lower end of the rotating rod 17 passes through the radiation interference cavity 3 and is meshed with a worm gear 27.

[0037] In the present invention, during use, first, the toothed ring 41 is connected to an external servo motor. Driven by the external servo motor, the toothed ring 41 rotates intermittently. When the toothed ring 41 rotates, the tray 40 located below the detector 5 moves with the toothed ring 41 and moves away from the round hole on the upper surface of the radiation interference cavity 3. Then, another adjacent tray 40 will move to the lower side of the detector 5. The detector 5 is used to detect the semiconductor on the tray 40. As the toothed ring 41 rotates continuously, the detector 5 is used to quickly detect the semiconductor.

[0038] Since the partition plate 7 divides the storage cavity 10 into two chambers, one chamber is used for the sliding of the vertical plate 13 and the placement plate 33, and the other chamber stores water for the sliding of the buoyancy plate 45. When the toothed ring 41 rotates counterclockwise, it can drive the gear 39 and the lead screw 37 to rotate. When the lead screw 37 rotates, it can drive the baffle 35 to move upward. As the baffle 35 moves upward in the square cavity 12, the square cavity 12 is no longer sealed. At this time, the water in the storage cavity 10 on the left side can push the buoyancy plate 45 under the gravity of the gravity plate 42 to squeeze the water in the storage cavity 10 and transmit it to the storage cavity 10 on the right side through the square cavity 12 and the water delivery cavity 16. The water level in the storage cavity 10 on the left side drops, and the buoyancy plate 45, the connecting rod 9, and the vertical plate 13 all move downward. As the vertical plate 13 moves downward, the two placement plates 33 are limited by the tray 40 and move away from each other, stretching the fourth spring 34. After the two placement plates 33 move away from each other, the semiconductor originally between the two placement plates 33 will fall on the lower tray 40, realizing the function of automatically loading the semiconductor on the tray 40.

[0039] After the water in the storage cavity 10 on the left side flows into the storage cavity 10 on the right side, the water level in the storage cavity 10 on the right side rises and pushes the buoyancy plate 45 in the storage cavity 10 on the right side to move upward. Along with it, the connecting rod 9 and the vertical plate 13 are driven to move upward. The tray 40 is conical. When the vertical plate 13 moves upward, the two placement plates 33 on the right vertical plate 13 are limited by the lower end of the tray 40 and move away from each other, and lift the semiconductor on the upper end of the tray 40, realizing the function of automatically unloading the semiconductor on the tray 40 after detection.

[0040] Since the gear ring 41 rotates faster, after the gear ring 41 rotates once and stops, the water in the left storage chamber 10 slowly flows into the right storage chamber 10. When the water in the left storage chamber 10 is transmitted to the right water delivery chamber 16 through the water delivery chamber 16, it will push the fan blades in the fan-shaped chamber 18 and drive the rotating rod 17 to rotate. When the rotating rod 17 rotates, it can drive the worm gear 27 to rotate. When the worm gear 27 rotates clockwise, it can drive the cam 28 to rotate and push the five-pointed star plate 29 to rotate. The five-pointed star plate 29 drives the rotating shaft 14 to rotate counterclockwise and drives the toggle plate 30 to rotate. The toggle plate 30 can push the semiconductor located on the slide chamber 26 to one of the two placement plates 33 on one side. Since one end of the slide cavity 26 is connected to the external conveyor belt, the external conveyor belt continuously transfers the semiconductor to the slide cavity 26, and each time the vertical plate 13 descends, the toggle plate 30 will push the semiconductor on the slide cavity 26 to move between the two placement plates 33. After each descent of the vertical plate 13 on the left side, the semiconductor on one group of placement plates 33 will fall on one of the trays 40 for subsequent inspection, and the toggle plate 30 will push the new semiconductor to re-load this group of placement plates 33, thereby realizing that the vertical plate 13 uses the placement plates 33 to load the tray 40, and the toggle plate 30 can load the placement plates 33, thereby automatically and continuously loading the tray 40.

[0041] When the rotating rod 17 rotates, it can drive the fan plate 19 to rotate clockwise. At this time, the fan plate 19 can drive the rack plate 20 to slide to the left. The end of the rack plate 20 away from the fan plate 19 slides on the upper surface of the semicircular block 4. Therefore, when the rack plate 20 moves to the left, it can push the semicircular block 4 and the detector 5 to move downward. At this time, the detection head at the lower end of the detector 5 can be extended into the circular hole on the radiation interference cavity 3 to detect the semiconductor on the tray 40 in the circular hole. It can tighten the distance between the detection head and the semiconductor, which plays a better role in semiconductor detection. When the fan plate 19 continues to rotate away and no longer engages with the rack plate 20, the rack plate 20 will reset and move under the elastic force of the second spring 15. At this time, the rack plate 20 no longer has a limiting effect on the semicircular block 4, and the detector 5 will move up and reset under the pulling force of the first spring 6.

[0042] When the detector 5 detects an unqualified semiconductor, the detector 5 will be connected to the suction cup through the controller, so that the suction cup is energized and has adsorption properties to the extrusion plate 2. As the extrusion plate 2 moves, the arc plate 22 fits against the outer wall of the tray 40. When the extrusion plate 2 continues to move, it can squeeze the airbag 25, and the gas in the airbag 25 enters the gas collecting chamber 23 through the gas pipe 24 and is discharged through the exhaust air on the gas collecting chamber 23. At this time, the gas has a certain amount of gas that can blow the semiconductor on the tray 40 to slide out through the extrusion plate 2, thereby achieving the effect of automatically removing unqualified semiconductors, so that the vertical plate 13 on the right side can collect qualified semiconductors.

[0043] As described above, it is only the preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, making equivalent substitutions or changes, shall be covered by the protection scope of the present invention.

Claims

1. A semiconductor detection device having a radiation interference structure, characterized in that: The semiconductor detection device with a radiation interference structure comprises a column (1), a radiation interference chamber (3), a gear ring (41), a loading component and a detection component, wherein the radiation interference chamber (3) is fixedly connected to the upper end of the column (1), the gear ring (41) is rotatably connected in the radiation interference chamber (3), and the gear ring (41) is provided with a plurality of grooves arranged in an annular array, and trays (40) are respectively fixedly connected to the inner side walls of the plurality of grooves; Storage chambers (10) are installed on both sides of the radiation interference chamber (3); the loading components include a gravity plate (42), a buoyancy plate (45), a vertical plate (13), a placement plate (33), a discharge assembly and a pushing assembly; a partition plate (7) is fixedly connected to each of the two storage chambers (10); two gravity plates (42) are provided and are slidably connected to the storage chambers (10); the gravity plate (42) is located on one side of the partition plate (7); two buoyancy plates (45) are also provided and are used in conjunction with the gravity plate (42); The two buoyancy plates (45) are respectively slidably mounted in the storage cavity (10) on the other side of the position corresponding to the gravity plate (42); the upper ends of the two vertical plates (13) are respectively slidably connected to the gravity plate (42); a plurality of groups of placement plates (33) are mounted on the side surfaces of the vertical plates (13); each group of placement plates (33) has two placement plates; a fourth spring (34) is fixedly connected between the two placement plates (33) in the same group; and the loading assembly is used to sequentially place batches of semiconductors on the tray (40) for testing; The discharge assembly comprises a gear (39), a sleeve (38), a screw rod (37), a baffle (35), a square cavity (12), a water delivery cavity (16), and a torsion spring (36). The sleeve (38) is fixedly connected to the side wall of the storage cavity (10) on the left side. The screw rod (37) is rotatably connected to the sleeve (38). The gear (39) is fixedly connected to the lower end of the screw rod (37). The gear (39) is meshingly connected to the outer wall of the gear ring (41). One end of the square cavity (12) is fixedly connected to the storage cavity (10) on the left side. One end of the baffle (35) is slidably connected to the inside of the square cavity (12). The baffle (35) ) one end of the water transfer chamber (16) away from the square chamber (12) is threadedly connected to the upper end of the screw rod (37), the torsion spring (36) is fixedly connected between the upper end of the screw rod (37) and the baffle (35), one end of the water transfer chamber (16) is connected to the square chamber (12), and the end of the water transfer chamber (16) away from the square chamber (12) is connected to the storage chamber (10) located on the right side, a connecting rod (9) is fixedly connected between the gravity plate (42) and the buoyancy plate (45), the connecting rod (9) is slidably connected to the upper wall of the storage chamber (10), and water in the storage chamber (10) located on the right side is pumped into the storage chamber (10) located on the left side by using an external water pump; The detection component comprises a detector (5), a mounting frame (8), a first spring (6), a pneumatic assembly and a driving assembly, wherein the mounting frame (8) is fixedly connected to the radiation interference chamber (3), the detector (5) is slidably connected to one side of the mounting frame (8), the first spring (6) is fixedly connected between the top of the mounting frame (8) and the detector (5), and a semicircular block (4) is fixedly connected to the outer side wall of the detector (5), and the detection component is used to detect the semiconductors on the tray (40) in sequence.

2. A semiconductor detection device with a radiation interference structure according to claim 1, characterized in that: The pushing assembly comprises a transverse plate (11), a sliding cavity (26), a rotating shaft (14), a toggle plate (30), a worm gear (27), and a cam (28); one end of the transverse plate (11) is fixedly connected to the upright column (1); the rotating shaft (14) is rotatably connected to the transverse plate (11); a plurality of toggle plates (30) are mounted in a ring array on one end of the rotating shaft (14); one end of the rotating shaft (14) away from the toggle plate (30) is fixedly connected to a five-pointed star plate (29); the worm gear (27) is rotatably connected to the transverse plate (11); one end of the cam (28) is fixedly connected to the worm gear (27); and one end of the sliding cavity (26) is fixedly connected to the upright column (1).

3. The semiconductor detection device with a radiation interference structure according to claim 1, characterized in that: The pneumatic assembly comprises an air collecting chamber (23), an air delivery pipe (24), an air bag (25), an arc plate (22), and an extrusion plate (2); a circular hole is provided on the radiation interference chamber (3); the extrusion plate (2) is slidably connected to the side wall of the radiation interference chamber (3); the air bag (25) is fixedly connected to one side of the extrusion plate (2); the arc plate (22) is fixedly connected to one end of the air bag (25) away from the extrusion plate (2); a third spring (21) is fixedly connected between the arc plate (22) and the extrusion plate (2); the air collecting chamber (23) is fixedly connected to the inner side wall of the circular hole; one side wall of the air collecting chamber (23) is provided with an exhaust port; the air delivery pipe (24) is used to connect the air collecting chamber (23) and the air bag (25).

4. The semiconductor detection device with a radiation interference structure according to claim 2, characterized in that: The driving assembly comprises a rotating rod (17), a fan-shaped cavity (18), a fan-shaped plate (19), a rack plate (20), a second spring (15), and a semicircular block (4); the fan-shaped cavity (18) is a cavity structure formed by protruding from the inner wall of the water delivery cavity (16); the rotating rod (17) passes through the fan-shaped cavity (18); the fan-shaped plate (19) is fixedly connected to the lower end of the rotating rod (17); a tooth pattern is provided on the arc surface of the fan-shaped plate (19); one end of the rack plate (20) is slidably connected to the upper surface of the radiation interference cavity (3); the rack plate (20) is meshedly connected to the fan-shaped plate (19); one end of the rack plate (20) away from the radiation interference cavity (3) is slidably connected to the side wall of the detector (5); and fan blades are installed in a ring array on the rotating rod (17); the fan blades are located in the fan-shaped cavity (18).

5. The semiconductor detection device with a radiation interference structure according to claim 4, characterized in that: The lower end of the rotating rod (17) is provided with a worm gear pattern, and the lower end of the rotating rod (17) passes through the radiation interference cavity (3) and is meshedly connected with the worm wheel (27).

6. The semiconductor detection device with a radiation interference structure according to claim 1, characterized in that: The lower end of each group of the placement plates (33) is fixedly connected to a sealing cavity (32), one end of the sealing cavity (32) is provided with a through hole, the end of the sealing cavity (32) away from the through hole is slidably connected to a piston plate (31), and a thrust spring is provided between one end of the piston plate (31) and the inner wall of the sealing cavity (32).

7. The semiconductor detection device with a radiation interference structure according to claim 1, characterized in that: Two suction cups are provided on the side wall of the radiation interference cavity (3), and the two suction cups are respectively located on one side of the extrusion plate (2).

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