A baking heating device suitable for semiconductor silicon wafer production and use method

Abstract

The present invention relates to the technical field of semiconductor silicon wafer production, and in particular to a baking and heating device suitable for semiconductor silicon wafer production and a method of using the device, comprising a conveying platform, both side ends of the conveying platform are rotatably mounted with conveying rollers, and the conveying rollers are connected through a conveyor belt transmission on the periphery thereof, and a plurality of fixed components are equidistantly mounted on the conveyor belt, the fixed component comprising a mounting seat mounted on the outer side wall of the conveyor belt, and a baking component is arranged on the mounting seat; the present invention firstly realizes vertical fixation of semiconductor silicon wafers of different sizes through the fixed component, and then continuously transports them through the conveyor belt to realize high processing efficiency; and with the help of the rotation of the conveyor belt, the blast pipe in the baking component is forced to deflect forward and reversely and reciprocate in a straight line, so as to realize the effect of large-area blowing and heating for the semiconductor silicon wafer; and with the help of the blast pipe, the fixed clamp block is driven to move, the clamping area is continuously changed, and part of the hot air is blown into the interior of the clamping seat, so as to realize comprehensive drying and heating treatment without dead angles.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor silicon wafer production, and in particular to a baking and heating device suitable for semiconductor silicon wafer production and a use method thereof. Background Art

[0002] The silicon wafer transfer subsystem is the main subsystem of the lithography machine. It is mainly responsible for transferring the silicon wafers coated with photoresist in the wafer library or the photoresist developer to the worktable for exposure processing, and then transporting the processed silicon wafers to the designated location. Due to the immersion lithography equipment, the surface of the silicon wafer will be covered with immersion liquid when it is in normal production on the worktable. If it is not cleaned before coating, it will affect the quality of subsequent chips. Therefore, the silicon wafer needs to be cleaned after exposure.

[0003] For example, in the prior art, there is a semiconductor silicon wafer surface liquid cleaning device with publication number CN113496927A. Although the cleaning device can bake and evaporate the immersion liquid on the surface of the semiconductor silicon wafer to achieve the effect of immersion liquid cleaning, it can only fix and process a single semiconductor silicon wafer each time, and it is difficult to take and place the semiconductor silicon wafer synchronously during the baking process, thereby causing the problem of low processing efficiency.

[0004] In view of the above technical defects, a solution is now proposed. Summary of the invention

[0005] The purpose of the present invention is to provide a baking and heating device and a method of use suitable for the production of semiconductor silicon wafers to solve the technical defects mentioned above. The present invention first realizes the vertical fixation of semiconductor silicon wafers of different sizes through a fixing component, and then continuously conveys them through a conveyor belt, so as to achieve high processing efficiency; and with the help of the rotation of the conveyor belt, combined with the staggered distribution of the tooth plates to mesh with the gears in sequence, and the wave guide groove to guide the T-shaped connecting pipe, the blast pipe is forced to deflect in both directions and reciprocate in a straight line, so as to achieve a large-area blowing and heating treatment effect on both sides of the semiconductor silicon wafer simultaneously; in addition, with the help of the reciprocating straight line motion of the blast pipe, the fixed clamp is forced to move, the clamping area of ​​the semiconductor silicon wafer is continuously changed, and part of the hot air is blown into the inside of the holder, so as to achieve comprehensive and dead-angle-free double-sided drying and heating treatment, further improving the heating effect.

[0006] The purpose of the present invention can be achieved through the following technical solutions:

[0007] A baking and heating device suitable for semiconductor silicon wafer production, comprising a conveying platform, both ends of the conveying platform are rotatably mounted with conveying rollers, and the conveying rollers are connected by a conveying belt transmission on the periphery thereof, a conveying motor for driving the corresponding conveying rollers to rotate is bolted on the conveying platform, an auxiliary protective cover is mounted on the conveying platform, and a plurality of fixed components are equidistantly mounted on the conveying belt;

[0008] The fixing assembly comprises a mounting seat fixedly mounted on the outer side wall of the conveyor belt through a connecting column, a T-shaped slide rail is fixedly connected to the mounting seat on a side away from the conveyor belt, a clamping seat is symmetrically slidably connected to the T-shaped slide rail, an adjusting bolt that contacts the T-shaped slide rail is threadedly connected to the outer side wall of the clamping seat, and a fixed clamping block is symmetrically arranged inside the clamping seat;

[0009] The mounting seat is provided with a baking assembly, which includes T-shaped connecting pipes located on both sides of the mounting seat, and both ends of the T-shaped connecting pipes are symmetrically rotatably connected with blast pipes, and the blast pipes are provided with a plurality of air outlets equidistantly along the length direction thereof.

[0010] Preferably, a wave guiding groove is provided on the top of the conveying platform and inside the auxiliary protective cover, and a limiting guiding groove is provided between the two ends of the wave guiding groove.

[0011] Preferably, a give-way groove connected to the wave guide groove and the limit guide groove is provided inside the conveying platform, and a sealing rotating belt is arranged in the give-way groove, and a mounting groove slidably connected to the sealing rotating belt is provided on the inner side wall of the give-way groove, and an air inlet groove is provided at the bottom of the give-way groove on one side of the auxiliary protective cover, the end of the T-shaped connecting pipe extends into the give-way groove and is fixedly connected to a connecting hose, and the free end of the connecting hose passes through the sealing rotating belt, and a through groove for the corresponding T-shaped connecting pipe to pass through is provided on the conveying belt.

[0012] Preferably, a blower is bolted onto the outer wall of the auxiliary protective cover, and the air outlet of the blower is fixedly connected to an air inlet pipe connected to the air inlet slot. A heating box connected to the air inlet pipe is fixedly connected to the outer wall of the auxiliary protective cover, and a heating net is fixedly installed inside the heating box.

[0013] Preferably, sliding grooves are symmetrically provided on the inner walls on both sides of the clamping seat, and an I-shaped slider is slidably connected in the sliding groove, a movable groove is provided on one side of the I-shaped slider, a movable column slidably connected to the movable groove is fixedly connected on one side of the fixed clamping block, and a clamping spring is fixedly connected between the movable column and the movable groove, and a guiding inclined surface is provided on the side of the fixed clamping block away from the mounting seat.

[0014] Preferably, an air inlet sleeve slidably connected to the blast pipe is fixedly connected to the I-shaped slider, a plurality of annular adjustment grooves are equidistantly provided on the outer wall of the blast pipe, and fixing bolts matching the annular adjustment grooves are threadedly connected to the air inlet sleeve.

[0015] Preferably, two sets of auxiliary clamping wheels are symmetrically rotatably connected to one side of the fixed clamping block away from the movable column, and the cross-section of the auxiliary clamping wheels is a trapezoidal structure. An air inlet hole connected to the air inlet sleeve is opened through the fixed clamping block.

[0016] Preferably, the free end of the blast pipe is fixedly connected to a gear via a connecting shaft, and a plurality of tooth plates matching the gear are fixedly connected to the inner walls on both sides of the auxiliary protective cover at equal distances along its length direction, and the plurality of tooth plates are staggeredly distributed relative to the top and bottom sides of the blast pipe.

[0017] The present invention also provides a method for using a baking heating device suitable for semiconductor silicon wafer production, comprising the following steps:

[0018] S1: The conveying motor drives the conveying belt to rotate in combination with the corresponding conveying roller, and the sealing rotating belt rotates synchronously with the cooperation of the T-shaped connecting pipe and the connecting hose. The semiconductor silicon wafer is vertically inserted between the two groups of clamps on the corresponding mounting seat in sequence through the external loading manipulator, and the corresponding fixed clamp block is pushed in combination with the auxiliary clamp wheel to fix the placed semiconductor silicon wafer under the compressive elastic force of the clamping spring;

[0019] S2: The conveyor belt drives the fixedly clamped semiconductor silicon wafer to move into the auxiliary protective cover, and the gear at the end of the blast pipe meshes with multiple tooth plates staggered up and down in sequence, and with the rotation of the conveyor belt, the blast pipe is forced to deflect forward and backward;

[0020] S3: After the end of the connecting hose is separated from the side wall of the give way slot, the bottom of the connecting hose is connected to the air inlet slot, the heating network in the heating box is powered on for heating, and the blower draws outside air through the air inlet pipe and injects it into the heating box for heating before injecting it into the air inlet slot, and then enters the blast pipe through the corresponding connecting hose and T-shaped connecting pipe, and finally blows out through multiple air outlets, and in combination with the blast pipe with positive and negative deflection, a large-area blowing and heating treatment is simultaneously performed on both sides of the continuously transported semiconductor silicon wafers;

[0021] S4: While the semiconductor silicon wafer is being heated by blowing, the T-shaped connecting pipe enters the wave guiding groove from the limiting guiding groove. Under the guidance of the wave guiding groove, the blowing pipe is driven to perform linear reciprocating motion while being deflected positively and negatively, thereby further increasing the blowing area of ​​the semiconductor silicon wafer;

[0022] S5: Part of the hot air in the blast pipe enters the air inlet sleeve through the corresponding air outlet, and then enters the inside of the holder through the air inlet, so as to heat and dry the clamping area of ​​the semiconductor silicon wafer. The reciprocating linear motion of the blast pipe, combined with the annular adjustment groove, the fixing bolt and the air inlet sleeve, drives the corresponding I-shaped slider to slide in the slide groove, thereby continuously changing the clamping position of the auxiliary clamping wheel on the semiconductor silicon wafer. Combined with the hot air blown out of the air outlet, the semiconductor silicon wafer is subjected to a comprehensive double-sided drying and heating treatment without dead ends.

[0023] The beneficial effects of the present invention are as follows:

[0024] (1) The present invention first fixes the semiconductor silicon wafer vertically by means of a fixing assembly, and then continuously conveys a plurality of fixed semiconductor silicon wafers by means of a conveyor belt. With the help of the rotation of the conveyor belt, the gears on the corresponding blast pipes are meshed with the tooth plates staggered up and down in sequence, forcing the blast pipes to fully deflect back and forth in both directions. The blower and the heating box are combined to inject hot air into the blast pipes, which can achieve a large-area blowing and heating treatment effect on both sides of the continuously conveyed semiconductor silicon wafers. Then, with the help of the cooperation of the wave guide groove and the T-shaped connecting pipe, the blast pipes that deflect back and forth in both directions are forced to synchronously reciprocate in a straight line, further increasing the blowing area of ​​the semiconductor silicon wafers, thereby improving the heating effect and processing efficiency of the semiconductor silicon wafers.

[0025] (2) The present invention utilizes the reciprocating linear motion of the blast pipe, and combines the annular adjustment groove, the fixing bolt and the air inlet sleeve to drive the corresponding I-shaped slider to slide in the holder, thereby continuously changing the clamping position of the auxiliary clamping wheel on the semiconductor silicon wafer. Combined with the part of the hot air in the blast pipe entering the air inlet sleeve through the corresponding air outlet, and then entering the interior of the holder through the air inlet, the clamping area of ​​the semiconductor silicon wafer can be heated and dried, thereby realizing a comprehensive double-sided drying and heating treatment of the semiconductor silicon wafer without dead angles, further improving the heating effect;

[0026] (3) The present invention adjusts the distance between the two groups of holders by rotating the adjusting bolts and the fixing bolts, combined with the relative sliding between the holder and the T-shaped slide rail and between the air inlet sleeve and the air blast pipe, thereby being able to effectively fix semiconductor silicon wafers of different sizes, further improving the scope of application of the present device. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The present invention will be further described below in conjunction with the accompanying drawings;

[0028] Figure 1 It is a schematic diagram of the structure of the present invention;

[0029] Figure 2 It is a schematic diagram of the cooperation between the fixing assembly and the conveyor belt of the present invention;

[0030] Figure 3 It is a schematic diagram of the cooperation between the fixed component and the sealing rotating belt of the present invention;

[0031] Figure 4 It is a schematic diagram of the cooperation between the fixing assembly and the auxiliary protective cover of the present invention;

[0032] Figure 5 It is a schematic diagram of the cooperation between the fixing assembly and the conveying platform of the present invention;

[0033] Figure 6 It is a structural schematic diagram of the conveying platform of the present invention;

[0034] Figure 7It is a disassembled schematic diagram of the fixing assembly of the present invention;

[0035] Figure 8 It is a structural schematic diagram of the baking assembly of the present invention;

[0036] Fig. 9 It is a structural schematic diagram of the fixed clamp block of the present invention.

[0037] Legend:

[0038] 1. Conveying platform; 11. Conveying roller; 12. Conveying belt; 13. Conveying motor; 14. Wave guide groove; 15. Limiting guide groove; 16. Yielding groove; 17. Sealing rotating belt; 18. Mounting groove; 19. Air inlet groove;

[0039] 2. Auxiliary protective cover; 21. Blower; 22. Air inlet pipe; 23. Heating box; 24. Heating net; 25. Tooth plate;

[0040] 3. Fixing assembly; 31. Mounting seat; 32. T-type slide rail; 33. Clamping seat; 34. Adjusting bolt; 35. Fixing clamp block; 36. Slide groove; 37. I-type slide block; 38. Movable groove; 39. Movable column; 310. Clamping spring; 311. Air inlet sleeve; 312. Fixing bolt; 313. Auxiliary clamping wheel; 314. Air inlet hole;

[0041] 4. Baking assembly; 41. T-shaped connecting pipe; 42. Blower pipe; 43. Air outlet; 44. Connecting hose; 45. Annular adjustment groove; 46. Connecting shaft; 47. Gear. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] Embodiment 1: The problem that only a single semiconductor silicon wafer can be processed in the prior art and it is difficult to simultaneously take and place the semiconductor silicon wafer during the baking process, resulting in low processing efficiency, can be solved by the following solution:

[0044] See also Figure 1-Figure 8As shown, in this embodiment, a baking and heating device suitable for semiconductor silicon wafer production includes a conveying platform 1, and conveying rollers 11 are rotatably installed at both ends of the conveying platform 1. The number of conveying rollers 11 on each side of the conveying platform 1 is two groups, and they are symmetrically arranged on both sides of the give way groove 16 to achieve stable rotation of the conveyor belt 12, and at the same time, it will not cause interference with the setting of the give way groove 16 and the follow-up rotation of the T-shaped connecting pipe 41, and the conveying rollers 11 are connected by the conveying belt 12 on the periphery thereof. A conveying motor 13 for driving the corresponding conveying roller 11 to rotate is bolted to the conveying platform 1. An auxiliary protective cover 2 is installed on the conveying platform 1 to reduce the speed of hot air scattering after being blown out, improve the baking and heating effect of the semiconductor silicon wafer, and cooperate with the baking component 4 for use, and a plurality of fixing components 3 are equidistantly installed on the conveyor belt 12;

[0045] The fixing assembly 3 includes a mounting seat 31 fixedly mounted on the outer wall of the conveyor belt 12 through a connecting column, a plurality of connecting columns are equidistantly arranged along the length direction of the mounting seat 31, and the connecting column is connected to the conveyor belt 12 by screws, a T-shaped slide rail 32 is fixedly connected to the side of the mounting seat 31 away from the conveyor belt 12, and a clamping seat 33 is symmetrically slidably connected to the T-shaped slide rail 32, and the position of the clamping seat 33 can be adjusted by sliding the clamping seat 33 and the T-shaped slide rail 32, so as to effectively fix semiconductor silicon wafers of different sizes, further improving the scope of application of the device, an adjusting bolt 34 is threadedly connected to the outer wall of the clamping seat 33, and the adjusting bolt 34 is used to fix the clamping seat 33 after the position is adjusted, and a fixing clamping block 35 is symmetrically arranged inside the clamping seat 33, and the vertical fixation of semiconductor silicon wafers of different sizes is first realized by the fixing assembly 3, and then continuous transportation is carried out through the conveyor belt 12, so as to achieve high processing efficiency;

[0046] A baking assembly 4 is arranged on the mounting seat 31, and the baking assembly 4 includes T-shaped connecting pipes 41 located on both sides of the mounting seat 31, and the two ends of the T-shaped connecting pipe 41 are symmetrically connected with the blast pipe 42, and the blast pipe 42 is provided with a plurality of air outlet holes 43 equidistantly along its length direction. By injecting hot air into the T-shaped connecting pipe 41, the hot air then flows to the blast pipes 42 on both sides and is discharged from the plurality of air outlet holes 43, so as to increase the area where the hot air is blown out.

[0047] A wave guide groove 14 is provided at the top of the conveying platform 1 and inside the auxiliary protective cover 2, and a limit guide groove 15 is provided between the two ends of the wave guide groove 14. The conveyor belt 12 drives the fixedly clamped semiconductor silicon wafer to move to the inside of the auxiliary protective cover 2. While blowing and heating the semiconductor silicon wafer, the T-shaped connecting pipe 41 enters the wave guide groove 14 from the limit guide groove 15. Under the guidance of the wave guide groove 14, the T-shaped connecting pipe 41 drives the blast pipes 42 on both sides to perform linear reciprocating motion, thereby eliminating the problem that the semiconductor silicon wafer is not easily exposed to hot air between two adjacent groups of air outlet holes 43. By setting the limit guide groove 15, the fixed component 3 can be stably located in the middle of the conveyor belt 12 before entering the auxiliary protective cover 2, thereby improving the accuracy of semiconductor silicon wafer loading.

[0048] A clearance groove 16 connected to the wave guide groove 14 and the limit guide groove 15 is provided inside the conveying platform 1, which is used for the T-shaped connecting pipe 41 to follow the rotation of the conveyor belt 12, to provide clearance space, and to avoid motion interference, and a sealing rotating belt 17 is provided in the clearance groove 16, and a mounting groove 18 slidably connected to the sealing rotating belt 17 is provided on the inner side wall of the clearance groove 16, and an air inlet cavity is constructed inside the conveying platform 1 through the sealing rotating belt 17 and the mounting groove 18, and the inner wall of the sealing rotating belt 17 is in sliding contact with the side wall of the mounting groove 18, and cooperates with the air inlet groove 19 to control the hot air to enter the corresponding T-shaped connecting pipe 41, so as to avoid the problem of hot air being discharged everywhere and reducing the energy utilization effect, and an air inlet groove 19 is provided at the bottom of the clearance groove 16 on one side of the auxiliary protective cover 2;

[0049] The end of the T-shaped connecting tube 41 extends into the clearance groove 16 and is fixedly connected with a connecting hose 44. The end of the connecting hose 44 slides against the side wall of the mounting groove 18. When the end of the connecting hose 44 is separated from the side wall of the clearance groove 16, the bottom of the connecting hose 44 is connected to the air inlet groove 19. The hot air in the air inlet groove 19 enters the inside of the connecting hose 44 and is then blown out through the corresponding blast pipe 42. The setting of the connecting hose 44 can avoid interference with the reciprocating motion of the T-shaped connecting tube 41, and through the cooperation of the connecting hose 44, a certain pulling force is exerted on the free end of the T-shaped connecting tube 41, thereby effectively avoiding the T-shaped The end of the connecting pipe 41 is separated from the limiting guide groove 15 or the wave guide groove 14, which makes it difficult to achieve the reciprocating linear motion of the blast pipe 42, and the sealing rotating belt 17 is pulled to rotate synchronously, so that the blast pipe 42 enters the auxiliary protective cover 2 and then blows out hot air. The two sides of the yield groove 16 are symmetrically connected to the auxiliary rollers that are transmission-connected to the sealing rotating belt 17 to increase the follow-up rotation effect of the sealing rotating belt 17, and the free end of the connecting hose 44 passes through the sealing rotating belt 17, and a through groove is opened on the conveyor belt 12 for the corresponding T-shaped connecting pipe 41 to pass through, so as to avoid interference with the reciprocating motion of the T-shaped connecting pipe 41.

[0050] A blower 21 is bolted to the outer wall of the auxiliary protective cover 2, and the air outlet of the blower 21 is fixedly connected to an air inlet pipe 22 connected to the air inlet slot 19. A heating box 23 connected to the air inlet pipe 22 is fixedly connected to the outer wall of the auxiliary protective cover 2, and a heating network 24 is fixedly installed inside the heating box 23. The heating network 24 in the heating box 23 is powered on for heating. The blower 21 draws external air and injects it into the heating box 23 through the air inlet pipe 22 for heating and then injects it into the air inlet slot 19. The air enters the blower pipe 42 through the corresponding connecting hose 44 and the T-shaped connecting pipe 41, and is finally blown out through a plurality of air outlet holes 43, so that both sides of the continuously transported semiconductor silicon wafers are simultaneously blown and heated.

[0051] The inner walls of both sides of the holder 33 are symmetrically provided with sliding grooves 36, and an I-shaped slider 37 is slidably connected in the sliding grooves 36. A movable groove 38 is provided on one side of the I-shaped slider 37. A movable column 39 slidably connected to the movable groove 38 is fixedly connected to one side of the fixed clamping block 35, and a clamping spring 310 is fixedly connected between the movable column 39 and the movable groove 38. The movable groove 38, the movable column 39 and the clamping spring 310 cooperate with the fixed clamping block 35 to effectively clamp and fix the semiconductor silicon wafer placed between the two groups of holders 33, thereby improving the stability during the transportation process and being able to simultaneously clamp semiconductor silicon wafers of different thicknesses, thereby increasing the clamping range. A guiding inclined surface is provided on the side of the fixed clamping block 35 away from the mounting seat 31. Through the provided guiding inclined surface, when the semiconductor silicon wafer is vertically inserted between the two groups of holders 33 by an external loading robot, it can automatically extend between the two groups of fixed clamping blocks 35, thereby improving the convenience of clamping.

[0052] An air inlet sleeve 311 slidably connected to the blast pipe 42 is fixedly connected to the I-shaped slider 37. The air inlet sleeve 311 arranged on the I-shaped slider 37 is used for the movable installation of the blast pipe 42 to ensure the composite movement of the blast pipe 42 in rotation and linearity. A plurality of annular adjustment grooves 45 are equidistantly provided on the outer wall of the blast pipe 42. A fixing bolt 312 matched with the annular adjustment groove 45 is threadedly connected to the air inlet sleeve 311. The fixing bolt 312 cooperates with the corresponding annular adjustment groove 45 on the blast pipe 42 to achieve position adjustment of the air inlet sleeve 311 on the blast pipe 42. Combined with the sliding of the clamping seat 33 and the T-shaped slide rail 32, interference with the position adjustment of the two groups of clamping seats 33 is avoided. The annular setting of the annular adjustment groove 45 avoids interference with the rotation of the blast pipe 42.

[0053] The free end of the blast pipe 42 is fixedly connected to a gear 47 via a connecting shaft 46. A number of tooth plates 25 matching the gear 47 are fixedly connected to the inner walls of both sides of the auxiliary protective cover 2 at equal distances along its length direction. The conveyor belt 12 drives the fixedly clamped semiconductor silicon wafer to move to the inside of the auxiliary protective cover 2. The gear 47 at the end of the blast pipe 42 engages with the multiple tooth plates 25 in sequence, and as the conveyor belt 12 rotates, the blast pipe 42 is forced to rotate. The multiple tooth plates 25 are staggered relative to the top and bottom sides of the blast pipe 42. By staggering the multiple tooth plates 25 up and down, the blast pipe 42 moves with the conveyor belt 12 while simultaneously performing forward and reverse deflection. Combined with the reciprocating linear motion of the blast pipe 42, large-area blowing and heating treatment is simultaneously performed on both sides of the continuously transported semiconductor silicon wafers.

[0054] Embodiment 2: The problem that the semiconductor silicon wafer is held inside the holder, resulting in a baking dead angle and thus reducing the cleaning quality can be solved by the following solution:

[0055] See also Figure 6-Figure 9 As shown, in this embodiment, a wave guide groove 14 is opened at the top of the conveying platform 1 and located inside the auxiliary protective cover 2, and a limiting guide groove 15 is opened between the two ends of the wave guide groove 14. The T-shaped connecting pipe 41 enters the wave guide groove 14 from the limiting guide groove 15. Under the guidance of the wave guide groove 14, the T-shaped connecting pipe 41 drives the blast pipes 42 on both sides to perform linear reciprocating motion.

[0056] Slide grooves 36 are symmetrically provided on the inner walls on both sides of the holder 33, and an I-shaped slider 37 is slidably connected in the slide groove 36. Through the cooperation between the I-shaped slider 37 and the slide groove 36, the fixed clamp 35 is changed in position inside the holder 33, so that the clamping area of ​​the semiconductor silicon wafer can be changed. A movable groove 38 is provided on one side of the I-shaped slider 37, and a movable column 39 slidably connected to the movable groove 38 is fixedly connected to one side of the fixed clamp 35, and a clamping spring 310 is fixedly connected between the movable column 39 and the movable groove 38. A guiding inclined surface is provided on the side of the fixed clamp 35 away from the mounting seat 31.

[0057] An air inlet sleeve 311 slidably connected to the air blast pipe 42 is fixedly connected to the I-shaped slider 37, and a plurality of annular adjustment grooves 45 are equidistantly provided on the outer wall of the air blast pipe 42. A fixing bolt 312 matching the annular adjustment groove 45 is threadedly connected to the air inlet sleeve 311. Through the cooperation of the air inlet sleeve 311, the fixing bolt 312 and the annular adjustment groove 45, the I-shaped sliders 37 on both sides can be synchronously driven to slide inside the clamping seat 33 with the help of the reciprocating linear motion of the air blast pipe 42, thereby automatically achieving the effect of changing the clamping area.

[0058] Two sets of auxiliary clamping wheels 313 are symmetrically rotatably connected to one side of the fixed clamping block 35 away from the movable column 39. The auxiliary clamping wheels 313 can effectively prevent the semiconductor silicon wafer from being damaged by friction during the reciprocating motion of the fixed clamping block 35, and improve the smoothness of the reciprocating motion of the blast pipe 42. The cross section of the auxiliary clamping wheel 313 is a trapezoidal structure. By setting the cross section of the auxiliary clamping wheel 313 to a trapezoidal structure, when the semiconductor silicon wafer is vertically inserted between the two sets of fixed clamping blocks 35 by an external loading manipulator, it can automatically extend between the corresponding auxiliary clamping wheels 313, further improving the convenience of clamping;

[0059] An air inlet hole 314 connected to the air inlet sleeve 311 is formed through the fixed clamp block 35. Part of the hot air in the blast pipe 42 enters the air inlet sleeve 311 through the corresponding air outlet hole 43, and then enters the interior of the holder 33 through the air inlet hole 314. Combined with the reciprocating motion of the fixed clamp block 35, the clamping area of ​​the semiconductor silicon wafer can be heated and dried, thereby achieving comprehensive double-sided drying and heating treatment of the semiconductor silicon wafer without dead ends, further improving the heating effect.

[0060] Example 3: Please refer to Figure 1-Figure 9 As shown, the present invention also provides a method for using a baking heating device suitable for semiconductor silicon wafer production, comprising the following steps:

[0061] S1: Rotate the adjusting bolt 34 to separate its end from the T-shaped slide rail 32, and then rotate the fixing bolt 312 to separate it from the corresponding annular adjusting groove 45 on the blast pipe 42, so as to adjust the distance between the two groups of clamping seats 33 on the mounting seat 31, and then rotate the adjusting bolt 34 and the fixing bolt 312 in the opposite direction to complete the fixation between the clamping seat 33 and the T-shaped slide rail 32 and the air inlet sleeve 311 and the blast pipe 42, so as to effectively fix semiconductor silicon wafers of different sizes;

[0062] S2: The conveying motor 13 and the corresponding conveying roller 11 drive the conveying belt 12 to rotate, and the sealing rotating belt 17 rotates synchronously with the cooperation of the T-shaped connecting tube 41 and the connecting hose 44. The semiconductor silicon wafers are vertically inserted between the two groups of clamping seats 33 on the corresponding mounting seat 31 in sequence through the external loading manipulator, and under the compressive elastic force of the clamping spring 310, the corresponding fixed clamping block 35 is pushed in combination with the auxiliary clamping wheel 313 to fix the placed semiconductor silicon wafers;

[0063] S3: The conveyor belt 12 drives the fixedly clamped semiconductor silicon wafer to move to the inside of the auxiliary protective cover 2, and the gear 47 at the end of the blast pipe 42 is meshed with a plurality of tooth plates 25 staggered up and down in sequence, and with the rotation of the conveyor belt 12, the blast pipe 42 is forced to deflect forward and reverse;

[0064] S4: After the end of the connecting hose 44 is separated from the side wall of the give way slot 16, the bottom of the connecting hose 44 is connected to the air inlet slot 19, the heating net 24 in the heating box 23 is powered on for heating, and the blower 21 draws outside air through the air inlet pipe 22, first injects it into the heating box 23 for heating, and then injects it into the air inlet slot 19, and then enters the blast pipe 42 through the corresponding connecting hose 44 and the T-shaped connecting pipe 41, and then blows out through multiple air outlets 43, and in combination with the blast pipe 42 with positive and negative deflection, a large-area blowing and heating treatment is simultaneously performed on both sides of the continuously transported semiconductor silicon wafers;

[0065] S5: While the semiconductor silicon wafer is being heated by blowing, the T-shaped connecting pipe 41 enters the wave guiding groove 14 from the limiting guiding groove 15. Under the guidance of the wave guiding groove 14, the blowing pipe 42 is driven to perform linear reciprocating motion while being deflected forward and backward, thereby further increasing the blowing area for the semiconductor silicon wafer;

[0066] S6: Part of the hot air in the blast tube 42 enters the air inlet sleeve 311 through the corresponding air outlet hole 43, and then enters the interior of the holder 33 through the air inlet hole 314 to heat and dry the clamping area of ​​the semiconductor silicon wafer. The reciprocating linear motion of the blast tube 42, combined with the annular adjustment groove 45, the fixing bolt 312 and the air inlet sleeve 311, drives the corresponding I-shaped slider 37 to slide in the slide groove 36, thereby continuously changing the clamping position of the auxiliary clamping wheel 313 on the semiconductor silicon wafer. Combined with the hot air blown out of the air outlet hole 43, the semiconductor silicon wafer is subjected to a comprehensive double-sided drying and heating treatment without dead ends.

[0067] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A baking and heating device suitable for semiconductor silicon wafer production, comprising a conveying platform (1), characterized in that: Conveying rollers (11) are rotatably mounted on both side ends of the conveying platform (1), and the conveying rollers (11) are connected to the conveying belt (12) through their outer peripheries; a conveying motor (13) for driving the corresponding conveying rollers (11) to rotate is bolted to the conveying platform (1); an auxiliary protective cover (2) is mounted on the conveying platform (1); and a plurality of fixed components (3) are equidistantly mounted on the conveying belt (12); The fixing assembly (3) comprises a mounting seat (31) fixedly mounted on the outer side wall of the conveyor belt (12) via a connecting column, a T-shaped slide rail (32) being fixedly connected to the mounting seat (31) on a side away from the conveyor belt (12), a clamping seat (33) being symmetrically slidably connected to the T-shaped slide rail (32), an adjusting bolt (34) being threadedly connected to the outer side wall of the clamping seat (33) and abutting against the T-shaped slide rail (32), and a fixing clamping block (35) being symmetrically arranged inside the clamping seat (33); A baking assembly (4) is arranged on the mounting seat (31), the baking assembly (4) comprising T-shaped connecting pipes (41) located on both sides of the mounting seat (31), and the two ends of the T-shaped connecting pipe (41) are symmetrically connected to the blast pipe (42), and the blast pipe (42) is provided with a plurality of air outlet holes (43) at equal intervals along its length direction; A wave guiding groove (14) is provided on the top of the conveying platform (1) and inside the auxiliary protective cover (2), and a limiting guiding groove (15) is provided between the two ends of the wave guiding groove (14); The T-shaped connecting pipe (41) enters the wave guiding groove (14) from the limiting guiding groove (15). Under the guidance of the wave guiding groove (14), the T-shaped connecting pipe (41) drives the blast pipes (42) on both sides to perform linear reciprocating motion.

2. A baking and heating device suitable for semiconductor silicon wafer production according to claim 1, characterized in that: The conveying platform (1) is provided with a clearance groove (16) in communication with the wave guide groove (14) and the limit guide groove (15), and a sealing rotating belt (17) is arranged in the clearance groove (16). A mounting groove (18) slidably connected to the sealing rotating belt (17) is provided on the inner side wall of the clearance groove (16), and an air inlet groove (19) is provided at the bottom of the clearance groove (16) on one side of the auxiliary protective cover (2). The end of the T-shaped connecting pipe (41) extends into the clearance groove (16) and is fixedly connected to a connecting hose (44), and the free end of the connecting hose (44) passes through the sealing rotating belt (17), and a through groove for the corresponding T-shaped connecting pipe (41) to pass through is provided on the conveying belt (12).

3. A baking and heating device suitable for semiconductor silicon wafer production according to claim 2, characterized in that: A blower (21) is bolted onto the outer wall of the auxiliary protective cover (2), and an air outlet of the blower (21) is fixedly connected to an air inlet pipe (22) that is in communication with the air inlet slot (19). A heating box (23) that is in communication with the air inlet pipe (22) is fixedly connected to the outer wall of the auxiliary protective cover (2), and a heating net (24) is fixedly installed inside the heating box (23).

4. The baking and heating device suitable for semiconductor silicon wafer production according to claim 1, characterized in that: Slide grooves (36) are symmetrically provided on the inner walls of both sides of the clamping seat (33), and an I-shaped slider (37) is slidably connected in the slide groove (36), a movable groove (38) is provided on one side of the I-shaped slider (37), a movable column (39) slidably connected to the movable groove (38) is fixedly connected to one side of the fixed clamping block (35), and a clamping spring (310) is fixedly connected between the movable column (39) and the movable groove (38), and a guiding inclined surface is provided on the side of the fixed clamping block (35) away from the mounting seat (31).

5. The baking and heating device suitable for semiconductor silicon wafer production according to claim 4, characterized in that: An air inlet sleeve (311) slidably connected to the air blast pipe (42) is fixedly connected to the I-shaped sliding block (37); a plurality of annular adjustment grooves (45) are equidistantly formed on the outer wall of the air blast pipe (42); and fixing bolts (312) matching the annular adjustment grooves (45) are threadedly connected to the air inlet sleeve (311).

6. The baking and heating device suitable for semiconductor silicon wafer production according to claim 5, characterized in that: Two sets of auxiliary clamping wheels (313) are symmetrically rotatably connected to one side of the fixed clamping block (35) away from the movable column (39), and the cross-section of the auxiliary clamping wheels (313) is a trapezoidal structure. An air inlet hole (314) connected to the air inlet sleeve (311) is formed through the fixed clamping block (35).

7. The baking and heating device suitable for semiconductor silicon wafer production according to claim 1, characterized in that: The free end of the blast pipe (42) is fixedly connected to a gear (47) via a connecting shaft (46), and a plurality of tooth plates (25) adapted to the gear (47) are fixedly connected to the inner walls on both sides of the auxiliary protective cover (2) at equal intervals along its length direction, and the plurality of tooth plates (25) are staggeredly distributed on both sides of the top and bottom of the blast pipe (42).

8. A method for using a baking and heating device suitable for semiconductor silicon wafer production, used for a baking and heating device suitable for semiconductor silicon wafer production as claimed in any one of claims 1 to 7, characterized in that: The following steps are involved: S1: A clearance groove (16) connected to the wave guide groove (14) and the limit guide groove (15) is provided inside the conveying platform (1), and a sealing rotating belt (17) is provided inside the clearance groove (16). A mounting groove (18) slidably connected to the sealing rotating belt (17) is provided on the inner side wall of the clearance groove (16), and an end of a T-shaped connecting pipe (41) extends into the clearance groove (16) and is fixedly connected to a connecting hose (44), and a free end of the connecting hose (44) passes through the sealing rotating belt (17); The conveying motor (13) is combined with the corresponding conveying roller (11) to drive the conveying belt (12) to rotate, and the sealing rotating belt (17) is synchronously rotated under the cooperation of the T-shaped connecting tube (41) and the connecting hose (44). The semiconductor silicon wafers are vertically inserted between the two groups of clamping seats (33) on the corresponding mounting seat (31) in sequence through the external loading robot, and under the compressive elastic force of the clamping spring (310), the corresponding fixing clamp block (35) is pushed in combination with the auxiliary clamping wheel (313) to fix the placed semiconductor silicon wafers; S2: The conveyor belt (12) drives the fixedly clamped semiconductor silicon wafer to move into the auxiliary protective cover (2), and the gear (47) at the end of the blast pipe (42) is meshed with a plurality of tooth plates (25) arranged in an alternating manner up and down, and as the conveyor belt (12) rotates, the blast pipe (42) is forced to deflect forward and backward; S3: After the end of the connecting hose (44) is separated from the side wall of the clearance groove (16), the bottom of the connecting hose (44) is connected to the air inlet groove (19), the heating net (24) in the heating box (23) is powered on for heating, the blower (21) draws outside air through the air inlet pipe (22) and first injects it into the heating box (23) for heating, and then injects it into the air inlet groove (19), and then enters the blast pipe (42) through the corresponding connecting hose (44) and the T-shaped connecting pipe (41), and then blows out through the multiple air outlet holes (43), and in combination with the blast pipe (42) with positive and negative deflection, a large-area blowing and heating treatment is simultaneously performed on both sides of the continuously transported semiconductor silicon wafers; S4: while the semiconductor silicon wafer is being heated by blowing air, the T-shaped connecting tube (41) enters the wave guiding groove (14) from the limiting guiding groove (15), and under the guidance of the wave guiding groove (14), the blowing tube (42) is driven to perform linear reciprocating motion while being deflected forward and backward, thereby further increasing the blowing area for the semiconductor silicon wafer; S5: Part of the hot air in the blast pipe (42) enters the air inlet sleeve (311) through the corresponding air outlet hole (43), and then enters the interior of the holder (33) through the air inlet hole (314), thereby heating and drying the clamping area of ​​the semiconductor silicon wafer. The reciprocating linear motion of the blast pipe (42), in combination with the annular adjustment groove (45), the fixing bolt (312) and the air inlet sleeve (311), drives the corresponding I-shaped slide block (37) to slide in the slide groove (36), thereby continuously changing the clamping position of the auxiliary clamping wheel (313) on the semiconductor silicon wafer. Combined with the hot air blown out of the air outlet hole (43), the semiconductor silicon wafer is subjected to a comprehensive double-sided drying and heating treatment without dead angles.

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