A flexible control method for semiconductor film tearing machine to reduce film breakage and film tearing residue

Abstract

The present invention discloses a flexible control method for a semiconductor film tearing machine that reduces film breakage and film tearing residues, and relates to the field of automated control technology. The method includes: obtaining film layer material information of a target semiconductor material; generating multiple film thickness distribution information of a multilayer film; performing adhesion analysis between the first film layer and the second film layer in the multilayer film, generating a first preset film tearing risk area for the first film layer; performing enhanced processing analysis on the first preset film tearing risk area, generating a first film tearing control parameter and a first enhanced processing decision; and controlling the semiconductor film tearing machine to tear the first film layer. The technical problems of inaccurate identification of film layer characteristics, difficulty in identifying potential film tearing risk areas in advance, and insufficient flexibility in film tearing process control existing in the control of existing semiconductor film tearing machines are solved, and the production losses caused by film breakage and film tearing residues are reduced, achieving the technical effect of improving the film tearing success rate, production efficiency, and product quality.

Description

Technical Field

[0001] The present application relates to the technical field related to automation control, and in particular to a flexible control method for a semiconductor film tearing machine for reducing film breakage and film tearing residue. Background Art

[0002] With the rapid development of semiconductor technology, the sophistication and complexity of material processing in the semiconductor manufacturing process are also increasing. As one of the key processes in the manufacture of semiconductor devices, film technology is widely used in chip packaging, wafer thinning, surface protection and other links. These thin film layers not only carry multiple functions such as circuit connection, insulation protection, and stress buffering, but their quality is directly related to the performance and reliability of semiconductor devices. However, with the miniaturization and multifunctionalization of semiconductor components, the requirements for thin film technology are becoming more and more stringent, especially in the semiconductor production process, the film tearing process requires more precision. In the semiconductor film tearing process, problems such as film breakage or film tearing residue are often encountered. Film breakage refers to the failure to completely tear off the film during the film tearing process due to the fragility of the film layer or improper control of the film tearing machine, and part of the film is broken and remains on the substrate. Film tearing residue is due to the strong adhesion between the film layer and the substrate, and the film cannot be smoothly torn off, leaving residual film material on the surface of the substrate. How to effectively reduce the problems of film breakage and film tearing residue has become a key technical problem that needs to be urgently solved in the current semiconductor film tearing process. Traditional film tearing methods often rely on mechanical force or simple chemical solvent treatment, lack of accurate identification and adaptive control of film properties, resulting in difficulty in effectively avoiding film breakage and residue when processing complex multi-layer thin film structures. As film materials become increasingly diversified, including polymers, metals, oxides, etc., the physical properties such as adhesion, hardness, and elastic modulus between materials are significantly different, further increasing the complexity of the film tearing process.

[0003] At the current stage, there are technical problems in the flexible control related technologies of semiconductor film tearing machines, such as inaccurate identification of film layer characteristics, difficulty in identifying potential film tearing risk areas in advance, and insufficient flexibility in controlling the film tearing process. Summary of the invention

[0004] The present application solves the technical problems of inaccurate film layer characteristic identification, difficulty in early identification of potential film tearing risk areas and insufficient flexibility in film tearing process control in existing semiconductor film tearing machine control by providing a flexible control method for semiconductor film tearing machines that reduces film breakage and film tearing residues, thereby reducing production losses caused by film breakage and film tearing residues and achieving the technical effect of improving film tearing success rate, production efficiency and product quality.

[0005] The present application provides a flexible control method for a semiconductor film tearing machine for reducing film breakage and film tearing residues, comprising: obtaining film layer material information of a target semiconductor material; measuring the film layer thickness of the target semiconductor material by an optical sensor on the semiconductor film tearing machine, and generating a plurality of film thickness distribution information of a multilayer film; performing an adhesion analysis between film layers for a first film layer and a second film layer in the multilayer film according to the film layer material information and the plurality of film thickness distribution information, and generating a first preset film tearing risk area for the first film layer; performing an enhanced processing analysis on the first preset film tearing risk area in combination with the plurality of film thickness distribution information and the film layer material information, and generating a first film tearing control parameter and a first enhanced processing decision; and controlling the semiconductor film tearing machine to tear the first film layer based on the first film tearing control parameter and the first enhanced processing decision.

[0006] In a possible implementation, the flexible control method of a semiconductor film tearing machine for reducing film breakage and tearing residues also performs the following processing: the first film layer and the second film layer are two adjacent films in the multi-layer film, and the first film layer covers the second film layer.

[0007] In a possible implementation, according to the film layer material information and the plurality of film sheet thickness distribution information, an adhesion analysis is performed between the film layers for the first film layer and the second film layer in the multilayer film, and a first preset film tearing risk area for the first film layer is generated, and the following processing is also performed: a plurality of material parameter sets of the multilayer film are extracted according to the film layer material information, wherein any material parameter set includes elastic modulus, roughness, surface energy and interface binding energy; a first material parameter set of the first film layer and a second material parameter set of the second film layer are extracted according to the plurality of material parameter sets; first film thickness distribution information and second film thickness distribution information are extracted according to the plurality of film sheet thickness distribution information; the first material parameter set, the second material parameter set, the first film thickness distribution information and the second film thickness distribution information are input into an adhesion analysis model for identification, and the probability of the presence of broken film and film tearing residues in the plurality of areas corresponding to the first film layer is output; the first preset film tearing risk area is located according to the probability of the presence of broken film and film tearing residues in the plurality of areas; wherein the first preset film tearing risk area is an area in the first film layer where the probability of broken film and film tearing residues is higher than a preset probability.

[0008] In a possible implementation, the first material parameter set, the second material parameter set, the first film thickness distribution information and the second film thickness distribution information are input into the adhesion analysis model for identification, and the following processing is performed: a film tearing risk database is established, wherein the film tearing risk database includes multiple groups of probability samples, wherein any group of probability samples includes a material parameter sample combination and a film thickness distribution sample combination of two adjacent layers of film, and area identification information indicating the probability of broken film and torn film residues in the upper layer of two adjacent layers of film; the film tearing risk database is connected to the adhesion analysis model, and the film tearing risk database is traversed through the adhesion analysis model for sample matching to obtain the probability of broken film and torn film residues in the multiple regions corresponding to the first layer of film.

[0009] In a possible implementation, the flexible control method for a semiconductor film tearing machine for reducing broken film and tearing film residues also performs the following processing: identifying the mechanical coupling effects between the multiple layers of thin films based on the film layer material information, and generating a set of mechanical coupling effect indicators; wherein the set of mechanical coupling effect indicators includes the coupling effect influence indicators of any layer of thin film on the non-adjacent thin film above it; extracting the target coupling effect influence indicators associated with the first thin film based on the set of mechanical coupling effect indicators; and optimizing the probability of broken film and tearing film residues in the multiple regions using the target coupling effect influence indicators.

[0010] In a possible implementation, in combination with the multiple film thickness distribution information and the film layer material information, an enhanced processing analysis is performed on the first preset film tearing risk area to generate a first film tearing control parameter and a first enhanced processing decision, and the following processing is also performed: taking the multiple film thickness distribution information and the film layer material information as constraints, a historical film tearing control parameter set is collected; based on the historical film tearing control parameter set, a film tearing control stability analysis is performed to generate a first film tearing control parameter for the first layer of film, wherein the first film tearing control parameter includes a film tearing force and a film tearing speed at multiple film tearing positions; based on the first film tearing control parameter, an enhanced processing simulation is performed in combination with an enhanced processing device to generate the first enhanced processing decision.

[0011] In a possible implementation, based on the first film tearing control parameter, an enhanced processing simulation is performed in combination with an enhanced processing device, and the following processing is also performed: based on the first film tearing control parameter, the film tearing control parameter corresponding to the first preset film tearing risk area is extracted; based on the film tearing control parameter and the enhanced processing equipment, a film tearing simulation is built, and a film tearing fitting module is established, wherein the enhanced processing equipment is a heating device; the film tearing fitting under different heating parameters is fitted by the film tearing fitting module to obtain the optimal softening temperature and generate the first enhanced processing decision.

[0012] In a possible implementation, based on the first film tearing control parameter and the first enhanced processing decision, the semiconductor film tearing machine is controlled to tear the first layer of film, and the following processing is also performed: according to the first film tearing control parameter, a parameter change node whose parameter change range is greater than a preset threshold is identified; and a step change control of the film tearing control parameter is performed at the parameter change node.

[0013] The flexible control method of a semiconductor film tearing machine proposed in this application to reduce film breakage and film tearing residue is proposed to obtain the film material information of the target semiconductor material; the film thickness of the target semiconductor material is measured by the optical sensor on the semiconductor film tearing machine to generate multiple film thickness distribution information of the multilayer film; according to the film material information and the multiple film thickness distribution information, the adhesion between the first and second layers of the multilayer film is analyzed to generate the first preset film tearing risk area of ​​the first layer of film; combined with the multiple film thickness distribution information and the film material information, the enhanced processing analysis is performed on the first preset film tearing risk area to generate the first film tearing control parameter and the first enhanced processing decision; based on the first film tearing control parameter and the first enhanced processing decision, the semiconductor film tearing machine is controlled to tear the first layer of film. The technical problems of inaccurate film layer characteristic identification, difficulty in identifying potential film tearing risk areas in advance, and insufficient flexibility in film tearing process control existing in the existing semiconductor film tearing machine control are solved, the production losses caused by film breakage and film tearing residue are reduced, and the technical effect of improving the film tearing success rate, production efficiency and product quality is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the accompanying drawings of the embodiment of the present invention will be briefly introduced below. A flow chart is used in the present application to illustrate the operations performed by the system according to the embodiment of the present application. It should be understood that the preceding or following operations are not necessarily performed accurately in order. On the contrary, various steps can be processed in reverse order or simultaneously as needed. At the same time, other operations can also be added to these processes, or one or more operations can be removed from these processes.

[0015] Figure 1 A schematic flow chart of a flexible control method for a semiconductor film tearing machine for reducing film breakage and film tearing residue provided in an embodiment of the present application;

[0016] Figure 2 A schematic flow chart of generating a first preset film tearing risk area in a flexible control method for a semiconductor film tearing machine for reducing film breakage and film tearing residue provided in an embodiment of the present application. DETAILED DESCRIPTION

[0017] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below.

[0018] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings. The described embodiments should not be regarded as limiting the present application. All other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of this application.

[0019] In the following description, reference is made to "some embodiments", which describe a subset of all possible embodiments, but it is understood that "some embodiments" may be the same subset or different subsets of all possible embodiments, and may be combined with each other without conflict, and the terms "first\second" involved are merely to distinguish similar objects and do not represent a specific ordering of objects. The terms "including" and "having" and any variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product, or server that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or modules that are not clearly listed or inherent to these processes, methods, products, or devices. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by technicians in the technical field of this application. The terms used herein are for the purpose of describing the embodiments of the present application only.

[0020] The embodiment of the present application provides a flexible control method for a semiconductor film tearing machine to reduce film breakage and film tearing residue, such as Figure 1 As shown, the method includes:

[0021] Step S100, obtaining film material information of a target semiconductor material.

[0022] Preferably, there are generally multiple layers of protective film on the surface of the semiconductor material, which usually need to be torn off layer by layer. The adhesion between different film layers will affect the film tearing effect. Identify areas with greater adhesion. These areas are prone to film breakage and residue. Strengthen these areas before tearing the film. Obtaining the film layer material information of the target semiconductor material specifically refers to collecting and analyzing key parameters and characteristics related to the film layer of the target semiconductor material, usually including the physical properties, chemical properties and film layer process information of the film layer material.

[0023] Preferably, the physical properties of the film material include material type (clarify the type of film material, such as silicon oxide, silicon nitride, metal film, etc. Different materials have different physical properties, which directly affect the control parameters of the film tearing process), thickness (the thickness of each film layer is very critical, and the thickness of the film determines the tearing force that needs to be applied and the stability of the film layer), hardness (the hardness of the film material affects its vulnerability during the film tearing process. Materials with high hardness may require stronger tearing force, while materials with low hardness are prone to film breakage) and elasticity and toughness (some film materials may have higher toughness or elasticity, which will affect their deformation behavior during film tearing. The film tearing machine needs to adjust the tearing force or tearing speed according to these characteristics); the chemical properties of the film material include adhesion (the adhesion between different film materials or between the film and the substrate is different, which directly affects the difficulty of film tearing. Obtaining adhesion information can more accurately analyze which areas There is a risk of film tearing residue or film breakage), chemical composition (affects its interaction with other materials during processing. For example, some film layers may react with oxygen in the air to form an oxide layer, affecting the film tearing effect) and surface energy (the free energy of the film surface also affects the separation behavior of materials during film tearing. Film materials with high surface energy are often more difficult to separate); the process information of the film layer includes the deposition process (the manufacturing process of the thin film, such as physical vapor deposition, chemical vapor deposition, electroplating, etc., also affects its physical and chemical properties) and the thickness uniformity of the film layer (the thickness of some thin films may be locally uneven. Obtaining this data can help the film tearing machine apply different film tearing forces in different areas to avoid film breakage or residue problems caused by uneven thickness). By obtaining and analyzing this film material information, the film tearing machine can adjust the control parameters in the film tearing process according to the specific characteristics of the film, thereby improving the accuracy and success rate of film tearing.

[0024] Step S200, measuring the film thickness of the target semiconductor material by using an optical sensor on the semiconductor film tearing machine to generate a plurality of film thickness distribution information of the multi-layer film.

[0025] Preferably, an optical sensor is a device that uses optical principles to measure the surface and internal properties of a material. In a semiconductor film tearing machine, an optical sensor is used to perform non-contact thickness measurement of multilayer thin films deposited on a target semiconductor material. Usually, a variety of measurement methods can be used to accurately detect the thickness of the film layer, such as reflected light measurement, in which the optical sensor emits light to the target film. When the light is reflected back to the sensor from the surface of the film layer, the sensor calculates the thickness of the film layer based on the time difference or interference pattern of the reflected light; interference measurement, in which light is reflected at different layers in a multilayer film, and the sensor captures the interference phenomenon between different reflected lights and calculates the thickness of each layer of the film; ellipsometry measurement, in which the changes in polarized light after passing through different film layers are used to analyze the thickness and optical properties of the film layer.

[0026] Preferably, since the thickness of the film may fluctuate and be unevenly distributed over the entire semiconductor substrate, when measuring the thickness of a multilayer film on a semiconductor material, multi-point measurements are usually performed in different areas of the film to generate comprehensive thickness distribution data, that is, to generate thickness distribution information for multiple films. For example, the thickness of a film may be thicker at the edge of the substrate and thinner in the center. These thickness distribution information are precise thickness data describing the multilayer film at different positions. The thickness distribution information of each film (film) usually includes the spatial distribution of film thickness (showing the film thickness distribution in different areas), the average film thickness (the overall thickness of the film), the thickness change rate (describing the trend of thickness change on the film surface) and local thickness anomaly information (marking thickness anomaly areas that may affect the film tearing process).

[0027] Step S300 , performing adhesion analysis between the first and second film layers in the multi-layer film according to the film layer material information and the thickness distribution information of the plurality of film sheets, and generating a first preset film tearing risk area of ​​the first film layer.

[0028] Furthermore, step S300 also includes that the first film layer and the second film layer are two adjacent film layers in the multi-layer film, and the first film layer covers the second film layer.

[0029] Preferably, during the semiconductor film tearing process, the film material information and the thickness distribution information of multiple films are comprehensively analyzed to analyze the adhesion between the multilayer films, especially focusing on the interaction between the first layer and the second layer of the film. The adhesion between the film layers determines the difficulty of the film tearing process and the success rate of the film tearing. Among them, the first layer of film and the second layer of film refer to two layers that are in contact with each other and directly superimposed in the multilayer film structure, which are the outer film (first layer of film) and the film immediately below it (second layer of film) in the multilayer film structure. For example, imagine that in the process of manufacturing semiconductor devices, multiple layers of films are deposited on the substrate. Assume that there are three layers of film: A, B, and C, where A is the outermost layer, B is the middle layer, and C is the innermost layer. During the film tearing process, firstly, layer A needs to be torn off from layer B, that is, A is the first layer of film, and B is the second layer of film. They are two adjacent layers, and layer A covers layer B. The difficulty in the film tearing process is how to adjust the film tearing force according to the adhesion and thickness of layer A and layer B, so that layer A can be smoothly torn off without damaging layer B or causing layer A to remain on layer B.

[0030] Preferably, the adhesion analysis between film layers is to evaluate the difficulty of film separation during film tearing by combining the chemical properties of the film material (such as adhesion) and film thickness and other factors. Specifically, the adhesion between different materials may be different. For example, some film materials (such as metal films or organic films) have strong adhesion, while other materials (such as oxide films) have weak adhesion. The adhesion between them is estimated by analyzing the chemical bonds and intermolecular forces of the two film materials. The thickness of the film affects its performance during film tearing. Thicker film layers usually require greater tearing force, while thinner film layers are prone to breakage or residue when the adhesion force is large. The thickness information combined with the adhesion analysis can further identify which areas may have the risk of film tearing. Based on the differences in film material and thickness, the difficulty of film tearing in different areas is predicted. For example, The first layer of film and the second layer of film have strong adhesion in certain local areas. These areas may be more difficult to separate or easily break during the film tearing process, and become high-risk areas for film tearing; based on the results of the adhesion analysis, preset film tearing risk areas are generated, that is, high-risk areas that are most likely to have film breakage, residue or other problems during the film tearing process. Specifically, areas with greater adhesion are marked as areas with higher film tearing risks. These areas may be more difficult to tear the film smoothly and require more precise control; if the film in certain areas is thinner or the thickness varies greatly, these areas may be easy to break or cannot be torn off smoothly during film tearing, and are also marked as high-risk areas; for different materials, the evaluation criteria for risk areas may be different. For example, for materials with greater adhesion, a larger risk area is set; for films with drastic thickness changes, these areas are marked as points where problems may occur.

[0031] In one possible implementation, Figure 2 As shown, step S300 further includes step S310, extracting multiple material parameter sets of the multilayer film according to the film layer material information, wherein any material parameter set includes elastic modulus, roughness, surface energy and interface binding energy; step S320, extracting the first material parameter set of the first layer of film and the second material parameter set of the second layer of film according to the multiple material parameter sets; step S330, extracting the first film thickness distribution information and the second film thickness distribution information according to the multiple film thickness distribution information; step S340, inputting the first material parameter set, the second material parameter set, the first film thickness distribution information and the second film thickness distribution information into the adhesion analysis model for identification, and outputting the probability of the presence of broken film and tearing film residues in multiple areas corresponding to the first layer of film; step S350, locating the first preset tearing film risk area according to the probability of the presence of broken film and tearing film residues in the multiple areas; step S360, wherein the first preset tearing film risk area is an area in the first layer of film where the probability of broken film and tearing film residues is higher than the preset probability.

[0032] Preferably, through the collected physical and chemical property information related to the film layer material, for each layer of the film, its material parameter set is extracted, which includes key indicators describing the physical and chemical properties of the film material, characterizing the mechanical and adhesion properties of the film, including elastic modulus (describing the ability of the material to produce elastic deformation under stress. A film with a high elastic modulus will be more rigid and less likely to deform during the film tearing process), roughness (describing the microscopic morphology of the film surface. A film with a large surface roughness may cause increased friction during the film tearing process, thereby increasing the possibility of film breakage and residue), surface energy (referring to the free energy of the film surface, which affects the adhesion between the material and other materials, such as the substrate or the lower film. Materials with higher surface energy usually have stronger adhesion and may be more difficult to separate during the film tearing process) and interface binding energy (describing the adhesion strength between two layers of film. The larger the interface binding energy, the more difficult it is to separate the two layers of film during the film tearing process). Then, for the first layer of film (outer film) and the second layer of film (the film immediately below it), their material parameter sets are extracted respectively; the thickness distribution information of the film obtained by measuring the optical sensor is used to extract the thickness distribution data of the first layer of film and the second layer of film.

[0033] Preferably, key material parameters such as the physical, chemical and mechanical properties of the film material are collected, and these properties will be used as input parameters in the model to establish an adhesion model, including analyzing how the force applied during the film tearing process (film tearing force) causes stress and strain changes inside the film, and calculating the stress-strain relationship based on the elastic modulus and thickness of the film. By analyzing the thickness distribution and material properties of the first layer of film and combining the adhesion of the second layer of film, a stress distribution model can be established to analyze the stress concentration in different areas. Combined with the surface roughness of the film, a friction model is established to simulate the friction between the film and the lower film during the film tearing process; then, a model for calculating adhesion is established through surface energy and interface binding energy, namely, an adhesion analysis model, and according to the magnitude of the adhesion, when interface destruction (i.e., separation between film layers) will occur during the film tearing process is predicted.

[0034] Preferably, the material parameter set and film thickness distribution information of the first and second film layers are input into the constructed adhesion analysis model for analysis to identify and evaluate the risks that may occur during the film tearing process. The stress, strain, shear force and other behaviors of the multi-layer film structure during the film tearing process are usually simulated to determine whether the adhesion characteristics of each area will lead to film tearing failure. Specifically, the model analyzes the risk of the first film layer breaking when the film tearing force or stress is too large, and the possibility that part of the film cannot be completely torn off and remains on the lower film or substrate when the adhesion between the first film and the second film or the substrate is strong. The elasticity of the material, the film The model takes into account factors such as surface roughness, adhesion (surface energy, binding energy), and film thickness, and simulates the interaction of these factors in different areas, and identifies which areas are most likely to have film breakage or film tearing residue problems. The model will calculate based on the input data and output the probability of film breakage and film tearing residue in each area. Specifically, the model determines the possibility of problems in the film tearing process in each area by calculating the adhesion force and stress distribution in each area, including calculating the stress concentration in a certain area, especially in areas where the film is thinner and the stress is greater, where the possibility of film breakage is higher; for areas with strong adhesion and high binding energy, the model will calculate the possibility of film tearing residue.

[0035] Preferably, based on the results output by the adhesion analysis model, that is, the probability of film breakage and tearing residues in each area, the areas with a probability higher than a preset value are defined as preset film tearing risk areas. The preset film tearing risk areas refer to those areas where problems are more likely to occur during the film tearing process, usually areas where the probability of film breakage and tearing residues is higher than a set probability threshold. For example, if the probability of film breakage in a certain thin film area is greater than 50%, the area is marked as a film tearing risk area. The occurrence of film breakage and residues can be reduced by adjusting the tearing force and speed or applying pretreatment (such as heating or weakening adhesion). Through this analysis method, the success rate of film tearing can be improved, thereby improving the accuracy and efficiency of the semiconductor manufacturing process.

[0036] In a possible implementation, step S340 further includes step S341, establishing a film tearing risk database, wherein the film tearing risk database includes multiple groups of probability samples, any group of probability samples includes a material parameter sample combination and a film thickness distribution sample combination of two adjacent thin films, and area identification information indicating the probability of broken film and torn film residues in the upper film of two adjacent thin films; step S342, connecting the film tearing risk database with the adhesion analysis model, traversing the film tearing risk database through the adhesion analysis model to perform sample matching, and obtaining the probability of broken film and torn film residues in the multiple areas corresponding to the first layer of the film.

[0037] Preferably, the film tearing risk database is a database for storing the risk of film breakage or film tearing residue that may occur during the film tearing process, and includes multiple groups of probability samples, each group of samples describes the specific behavior and risk of different adjacent film layers during the film tearing process. Specifically, the multiple groups of probability samples are based on film tearing experiments or simulation results of different film layer combinations, providing data on material properties, thickness distribution and film tearing behavior. Each group of probability samples includes a material parameter sample combination and a film thickness distribution sample combination of two adjacent film layers, as well as area identification information indicating the probability of film breakage and film tearing residue in the upper film of the two adjacent film layers. The material parameter sample combination describes the material properties of the two adjacent film layers, such as elastic modulus, surface roughness, surface energy, interface binding energy, etc., which determine the adhesion and separation difficulty of the two film layers during the film tearing process; the film thickness distribution sample combination records the thickness distribution of the two film layers in different areas. The thickness distribution directly affects the distribution of stress during the film tearing process. Thinner areas or areas with significant thickness changes may increase the risk of film breakage and residue; the probability area identification information is an identification of the risk area. Each area is annotated with its probability of film breakage and film tearing residue based on analysis or experiment, which can help the model locate which areas may have problems.

[0038] Preferably, the film tearing risk database is connected to the adhesion analysis model. The adhesion analysis model is a tool for predicting film tearing behavior based on real-time film tearing data (including material parameters and thickness distribution information). It uses historical data in the film tearing risk database to perform risk assessment by comparing and matching the current situation with the sample data in the database. Specifically, the adhesion analysis model traverses the entire film tearing risk database to find samples that match the material parameters and thickness distribution of the current first and second layers of film, thereby estimating the risk in the film tearing process. Among them, sample matching refers to the model comparing the material parameters and thickness distribution of the film to be torn off with each group of samples in the database to find the closest combination, that is, comprehensive calculations are performed based on multiple dimensions such as material properties and thickness distribution to determine which group of historical samples has the most similar film tearing behavior to the current situation; after finding the most matching sample combination, the adhesion analysis model uses the risk data in the combination to estimate the probability of film breakage and tearing residue in different areas of the current first layer of film.

[0039] In a possible implementation, step S340 further includes step S343, identifying the mechanical coupling effect between the multilayer films according to the film layer material information to generate a set of mechanical coupling effect indicators; step S344, wherein the set of mechanical coupling effect indicators includes the coupling effect influence indicators of any layer of film on the non-adjacent film above it; step S345, extracting the target coupling effect influence indicators associated with the first film based on the set of mechanical coupling effect indicators; step S346, optimizing the probability of broken film and torn film residues in the multiple regions using the target coupling effect influence indicators.

[0040] Preferably, during the film tearing process, a mechanical coupling effect may occur between multiple film layers, that is, the mechanical behaviors (such as stretching, bending, and tearing) of each layer of the film affect each other, and the mechanical behaviors of subsequent film layers may affect the adhesion between the first layer and the second layer through the coupling effect. For example, when a film tearing machine applies external force to a layer of film, the force not only acts on this layer, but also is transmitted to other film layers through this layer of film. Among them, the film layer coupling rigidity means that if the third layer and subsequent film layers have higher rigidity or thickness, certain constraints are imposed on the first layer of film, increasing the force required in the film tearing process. This coupling rigidity may cause uneven film tearing force, causing the adhesion in certain local areas to be weakened or enhanced; stress relief means that if the subsequent film layer is relatively soft or elastic, it can relieve the stress of the first layer during the film tearing process, reduce the change in adhesion, and make the film tearing smoother. On the contrary, the harder subsequent layer will increase the film tearing force of the first layer, resulting in stress concentration and affecting adhesion.

[0041] Preferably, the set of mechanical coupling effect indicators is used to describe the mechanical interaction between multilayer films, and each indicator is used to quantify the influence of a certain film layer on other layers (especially non-adjacent film layers). In a multilayer film structure, the force will not only affect the adjacent films, but also be transmitted through the middle layer to affect the deeper or shallower films. For example, the third film may affect the tearing quality of the first film when tearing the film. This cross-layer influence is the so-called coupling effect between non-adjacent films; then, from the set of mechanical coupling effect indicators, the coupling effect influence indicators related to the first film (i.e., the outer film) in the current tearing process are selected to extract the coupling effect information that directly or indirectly affects the tearing process of the first film, to help understand how the first film is affected by other films during the tearing process. Mechanical influence of the film (especially non-adjacent films), for example, whether the deformation of the third film will affect the stress distribution of the first film, thereby increasing the risk of breakage of the first film when tearing off the film; by incorporating the coupling effect influencing indicators into the analysis of the film tearing process, the film breakage and residual problems that may occur in the film tearing process can be predicted more accurately. According to the coupling effect analysis, those areas where stress concentration occurs due to the cross-layer coupling effect are identified. These areas are more likely to have film breakage problems during the film tearing process. By optimizing the film tearing force and speed, the stress concentration in these areas can be reduced, and the probability of film breakage can be reduced. Under the influence of the coupling effect, some film layers may not be completely separated from the substrate or the lower film due to stress transfer. By adjusting the mechanical parameters in the film tearing process, the film tearing effect can be optimized and the residual problem can be reduced.

[0042] Step S400: combining the plurality of film sheet thickness distribution information and the film layer material information, performing enhanced processing analysis on the first preset film tearing risk area, and generating a first film tearing control parameter and a first enhanced processing decision.

[0043] Preferably, the film tearing characteristics of each film area are fully understood by combining multiple film thickness distribution information and film layer material information. For example, a thinner and more adhesive area may require special treatment to avoid film breakage or residue. According to the characteristics of the first preset film tearing risk area, an enhanced treatment strategy is formulated to reduce the risk of film breakage and residue, ensuring that no problems occur when tearing the film in these high-risk areas. Specifically, the enhanced treatment analysis may include optimization of the film tearing force. The film tearing force is adjusted according to the thickness and material characteristics of different areas. For example, a higher film tearing force may be required in areas with stronger adhesion, while the film tearing force needs to be reduced in thinner areas to avoid breakage; adjustment of the film tearing speed. Some areas may require a slower film tearing speed to ensure a smoother film tearing process and reduce stress concentration; pretreatment measures. Before film tearing, pretreatment measures may be taken for high-risk areas, such as heating, ultraviolet irradiation or chemical treatment, to reduce the adhesion of the film or enhance its strength, thereby ensuring a smooth film tearing process.

[0044] Preferably, a first film tearing control parameter is generated, which is a key operating parameter in the film tearing process, and determines how the film tearing machine performs the film tearing operation, including film tearing force (determines the size of the external force applied to the film during the film tearing process), film tearing speed (the speed of the film tearing machine when peeling the film, a higher speed may accelerate the film tearing, but increase the risk of film breakage) and film tearing path (for different risk areas, the film tearing machine may need to adjust the film tearing path to peel in the best way to avoid excessive stress on high-risk areas); finally, a first enhanced processing decision is generated, that is, special operating measures formulated for high-risk areas, the purpose of which is to reduce the risk of film tearing through additional processing methods. The enhanced processing decision may include preheating, local heating of high-risk areas before film tearing to reduce the adhesion of the film material, thereby making it easier to tear the film; laser assistance, using laser or other energy sources to assist high-risk areas when tearing the film to increase the peeling effect; chemical treatment, before tearing the film, using specific chemicals to treat high-adhesion areas to reduce the adhesion between the film and the substrate or the underlying film. Through these analyses and decisions, the film tearing process can be optimized, the risks of film breakage and residue can be reduced, and the success rate and efficiency of the film tearing operation can be improved.

[0045] In a possible implementation, step S400 further includes step S410, collecting a set of historical film tearing control parameters based on the plurality of film thickness distribution information and the film layer material information as constraints; step S420, performing a film tearing control stability analysis based on the historical film tearing control parameter set, and generating a first film tearing control parameter for the first layer of film, wherein the first film tearing control parameter includes a film tearing force and a film tearing speed at a plurality of film tearing positions; and step S430, performing an enhanced processing simulation based on the first film tearing control parameter in combination with an enhanced processing device, and generating the first enhanced processing decision.

[0046] Preferably, using multiple film thickness distribution information and film layer material information as constraints refers to collecting the optimal film tearing control parameters required under different conditions (such as different thickness distributions or material properties) to form a historical film tearing control parameter set, which is the film tearing data accumulated in actual operation or simulation, including film tearing operation parameters for different film materials and thickness distributions, such as film tearing force, the magnitude of the external force applied during the film tearing process, film tearing speed, the speed of the film tearing machine when peeling off the film, the film tearing path, the motion trajectory and position distribution during the film tearing process; then analyzing the control parameters in the historical film tearing data, evaluating the stability of different parameter combinations in the actual film tearing operation, finding out which film tearing force and film tearing speed can maintain a high success rate under various conditions, and reduce the occurrence of film breakage and residue, thereby generating the first film tearing control parameter set for the first layer of film. The first film tearing control parameter is used to simulate the film tearing process in combination with the strengthening treatment equipment. Specifically, the strengthening treatment equipment is an auxiliary equipment used to improve the film tearing quality, such as heating equipment, laser equipment or chemical treatment equipment. The strengthening treatment simulation is to evaluate the changes in the film tearing results under different strengthening treatment strategies, including heating simulation, laser-assisted simulation and chemical treatment simulation. Through the strengthening treatment simulation, the effects of various strengthening treatment methods on the film tearing process are evaluated, and the best strengthening treatment scheme, i.e., the first strengthening treatment decision, is determined based on the simulation results. Finally, the film tearing control parameters and the strengthening treatment decision jointly optimize the film tearing process to ensure the reduction of film breakage and residue and improve the success rate of the process.

[0047] In a possible implementation, step S430 further includes step S431, extracting the film tearing control parameters corresponding to the first preset film tearing risk area based on the first film tearing control parameters; step S432, building a film tearing simulation based on the film tearing control parameters and the enhanced processing equipment, and establishing a film tearing fitting module, wherein the enhanced processing equipment is a heating equipment; step S433, fitting the film tearing fitting under different heating parameters through the film tearing fitting module, obtaining the optimal softening temperature, and generating the first enhanced processing decision.

[0048] Preferably, according to the first film tearing control parameter, the film tearing control parameter corresponding to the first preset film tearing risk area is extracted from the historical film tearing control parameter set, and then a film tearing simulation is established based on the film tearing control parameter and the heating equipment. Specifically, the influence of various parameters (such as film tearing force, film tearing speed, heating temperature, etc.) on the film tearing effect in the actual film tearing process is simulated by computer simulation, so as to help predict the film tearing effect under different control parameter combinations in the actual film tearing process, wherein the role of the heating equipment is to soften the film by preheating it, reduce adhesion and film tearing force requirements, thereby reducing the risk of film tearing breakage and residue, and then a film tearing fitting module is established to fit the influence of different heating parameters (such as heating temperature, heating time, etc.) on the film tearing effect based on the simulation results. The fitting module helps to find the optimal heating conditions by analyzing the relationship between these parameters and the film tearing effect (such as film breakage rate or residue rate).

[0049] Preferably, the film tearing simulation and fitting module is used to analyze the effects of different heating conditions, especially different heating temperatures, on the film tearing process. The core is to find the best relationship between heating temperature and film tearing effect (such as reduced adhesion, reduced film breakage, and reduced residue). Specifically, different heating temperatures are set in the film tearing simulation for simulation to observe the effects of these temperatures on film softening and film tearing behavior, where the heating parameters may include heating temperature and heating time. By fitting the effects of different heating temperatures on the film tearing effect, the optimal softening temperature is found. At this temperature, the adhesion of the film is greatly reduced, the film tearing force is minimized, and the risk of film breakage and residue is minimized. Finally, the first enhanced treatment decision is generated. The optimal softening temperature and other heating parameters (such as heating time) will be used as enhanced treatment measures for high-risk areas during the film tearing process. The setting of the softening temperature means that in high-risk areas, the film tearing machine or heating equipment will automatically heat to the optimal softening temperature obtained by fitting to reduce the adhesion of the film and facilitate smooth film tearing; the control of the heating time means setting a suitable heating time to ensure that the film softening treatment is completed within an appropriate time range. Through the film tearing simulation and film tearing fitting modules, combined with the historical film tearing control parameters and the application of heating equipment, the optimal film tearing operation conditions under different heating parameters (especially softening temperature) are finally found, and accurate enhanced processing decisions are generated to ensure that appropriate heating is used to reduce film adhesion during the film tearing process, reduce film breakage and residue problems, and make the film tearing process more stable and effective, especially in complex or high-risk areas.

[0050] Step S500: Based on the first film tearing control parameter and the first enhanced processing decision, control the semiconductor film tearing machine to tear the first layer of film.

[0051] Further, step S500 also includes step S510, identifying a parameter change node whose parameter change range is greater than a preset threshold according to the first film tearing control parameter; and step S520, performing step change control of the film tearing control parameter at the parameter change node.

[0052] Preferably, during the film tearing process, the semiconductor film tearing machine operates on the first layer of film according to the first film tearing control parameter and the first enhanced processing decision, that is, the semiconductor film tearing machine automatically adjusts the film tearing force, speed, etc. to ensure that the film tearing process proceeds smoothly, and applies enhanced processing decisions (such as heating) in risk areas. Specifically, the film thickness, material properties, and adhesion of different areas in the film tearing process may be different, and the film tearing control parameters (such as film tearing force and speed) may need to be adaptively adjusted in different areas. The point where the control parameters are adjusted is called a parameter change node, that is, when the semiconductor film tearing machine enters a new film tearing area, the film tearing control parameters are adjusted according to the characteristics of the area, and the changes in the film tearing control parameters (such as film tearing force and film tearing speed) are continuously monitored. If the amplitude of the parameter change exceeds the preset threshold, it indicates that the conditions in the current film tearing area have changed significantly, and a larger parameter adjustment may be required, and then this is identified. Some nodes whose changes exceed the preset threshold are the points where the control parameters need to be significantly adjusted during the film tearing process. For example, when the film tearing machine enters an area where the thickness is significantly reduced or the adhesion is enhanced, the adjustment demand for the film tearing force or speed exceeds the normal range, and the parameter change node at this time is marked; finally, the film tearing control parameters are controlled by step changes at the parameter change node, where the step change control means that at the parameter change node, the film tearing control parameters (such as film tearing force, speed, etc.) will not change suddenly at one time, but will be gradually adjusted in stages to form a step-by-step change, which helps to avoid instability caused by sudden parameter changes during the film tearing process and ensure a smoother film tearing process. For example, if the film tearing machine recognizes that the film tearing force needs to be increased at a certain parameter change node, it will not directly jump from the original force value to the new force value, but will gradually increase the film tearing force in several stages until the requirement is met, thereby avoiding the risk of film breakage due to a sudden increase in the film tearing force. By gradually adjusting the tearing force and speed, the actual situation of the film can be matched more accurately, reducing the possibility of sudden failures during operation, ensuring that the tearing operation is smoother and more accurate, effectively reducing the risk of film breakage and residue during the tearing process, and improving the tearing quality and efficiency.

[0053] The above specific implementation manner does not constitute a limitation to the protection scope of the present application. It should be understood by those skilled in the art that various modifications, combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application. In some cases, the actions or steps recorded in the present application can be performed in an order different from that in the embodiment and can still achieve the desired results. In addition, the process depicted in the accompanying drawings does not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

Claims

1. A flexible control method for a semiconductor film tearing machine to reduce film breakage and film tearing residue, characterized in that: include: Acquire film material information of target semiconductor material; The film thickness of the target semiconductor material is measured by the optical sensor on the semiconductor film peeling machine to generate the thickness distribution information of multiple film sheets of the multi-layer film; According to the film material information and the thickness distribution information of the plurality of film sheets, an adhesion analysis is performed between the first film layer and the second film layer in the multi-layer film to generate a first preset film tearing risk area of ​​the first film layer; In combination with the plurality of film sheet thickness distribution information and the film layer material information, an enhanced processing analysis is performed on the first preset film tearing risk area to generate a first film tearing control parameter and a first enhanced processing decision; Based on the first film tearing control parameter and the first enhanced processing decision, controlling the semiconductor film tearing machine to tear the first layer of film; According to the film material information and the thickness distribution information of the plurality of film sheets, an adhesion analysis is performed between the film layers for the first film layer and the second film layer in the multi-layer film to generate a first preset film tearing risk area for the first film layer, including: Extracting a plurality of material parameter sets of the multilayer film according to the film layer material information, wherein any material parameter set includes elastic modulus, roughness, surface energy and interface binding energy; Extracting a first material parameter set for the first layer of film and a second material parameter set for the second layer of film according to a plurality of material parameter sets; extracting first film thickness distribution information and second film thickness distribution information according to the plurality of film thickness distribution information; Inputting the first material parameter set, the second material parameter set, the first film thickness distribution information, and the second film thickness distribution information into an adhesion analysis model for identification, and outputting the probability that broken films and torn film residues exist in multiple regions corresponding to the first film layer; Locating the first preset film tearing risk area according to the probability of film breakage and film tearing residues existing in the multiple areas; The first preset film tearing risk area is an area in which the probability of film interruption and film tearing residue in the first layer of film is higher than a preset probability.

2. A flexible control method for a semiconductor film tearing machine for reducing film breakage and film tearing residue as claimed in claim 1, characterized in that: The first film layer and the second film layer are two adjacent films in the multi-layer film, and the first film layer covers the second film layer.

3. A flexible control method for a semiconductor film tearing machine for reducing film breakage and film tearing residue as claimed in claim 1, characterized in that: Inputting the first material parameter set, the second material parameter set, the first film thickness distribution information, and the second film thickness distribution information into an adhesion analysis model for identification, comprising: Establishing a film tearing risk database, wherein the film tearing risk database includes multiple groups of probability samples, and any group of probability samples includes a material parameter sample combination and a film thickness distribution sample combination of two adjacent layers of film, and region identification information indicating the probability of film breakage and film tearing residue in the upper film of the two adjacent layers of film; The film tearing risk database is connected to the adhesion analysis model, and the film tearing risk database is traversed through the adhesion analysis model to perform sample matching to obtain the probability of film breakage and film tearing residues existing in the multiple regions corresponding to the first layer of film.

4. A flexible control method for a semiconductor film tearing machine for reducing film breakage and film tearing residue as claimed in claim 3, characterized in that: Also includes: Identify the mechanical coupling effect between the multilayer films according to the film material information and generate a set of mechanical coupling effect indicators; Wherein, the mechanical coupling effect index set includes the coupling effect influence index of any layer of film on the non-adjacent film above it; Extracting a target coupling effect influencing index associated with the first film based on the mechanical coupling effect index set; The probability of broken film and torn film residues existing in the plurality of regions is optimized based on the target coupling effect influencing index.

5. A flexible control method for a semiconductor film tearing machine for reducing film breakage and film tearing residue as claimed in claim 1, characterized in that: Combining the plurality of film sheet thickness distribution information and the film layer material information, performing enhanced processing analysis on the first preset film tearing risk area, and generating a first film tearing control parameter and a first enhanced processing decision, including: Collecting a historical film tearing control parameter set based on the plurality of film sheet thickness distribution information and the film layer material information as constraints; Performing a tearing control stability analysis based on the historical tearing control parameter set to generate a first tearing control parameter for the first film layer, wherein the first tearing control parameter includes a tearing force and a tearing speed at a plurality of tearing positions; Based on the first film tearing control parameter, the strengthening treatment simulation is performed in combination with the strengthening treatment equipment to generate the first strengthening treatment decision.

6. A flexible control method for a semiconductor film tearing machine for reducing film breakage and film tearing residue as claimed in claim 5, characterized in that: Based on the first film tearing control parameter, a strengthening treatment simulation is performed in combination with a strengthening treatment device, including: Based on the first film tearing control parameter, extracting the film tearing control parameter corresponding to the first preset film tearing risk area; Building a film tearing simulation based on the film tearing control parameters and the strengthening treatment equipment, and establishing a film tearing fitting module, wherein the strengthening treatment equipment is a heating equipment; The film tearing fitting module is used to fit the film tearing fitting under different heating parameters to obtain the optimal softening temperature and generate the first strengthening treatment decision.

7. A flexible control method for a semiconductor film tearing machine for reducing film breakage and film tearing residue as claimed in claim 6, characterized in that: Based on the first film tearing control parameter and the first enhanced processing decision, controlling the semiconductor film tearing machine to tear the first film layer includes: Identifying a parameter change node whose parameter change range is greater than a preset threshold according to the first film tearing control parameter; At the parameter change node, step-change control of the film tearing control parameter is performed.

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