Electronic product packaging structure and method

Abstract

The invention discloses an electronic product packaging structure and method. An electronic product packaging structure includes a packaging platform, a base and a mounting seat. During use of the invention, after a movable slider is unfolded, a sealing plate and a pressure strip can be pushed outward by driving a movable cylinder to ensure that the sealing plate and the pressure strip are attached to the bottom of a wafer substrate, and that pressure is uniform during the wafer substrate buckling process. When a vertical lifting frame descends, a horizontal lifting arm and a bottom clamping arm are driven to descend, and a packaging top shell follows the bottom clamping arm portion to descend. Since the center of the bottom clamping arm is aligned with the center of the middle clamping arm, the packaging top shell will be buckled on the inner surface of the packaging bottom shell during the descent process, thereby ensuring the buckling effect of the wafer substrate. The packaging glue is evenly sprayed on the buckling edge of the packaging top shell and the packaging bottom shell through the electromagnetic nozzle at the end of the oblique guide tube. When the packaging top shell and the packaging bottom shell are buckled, the glue can lock the packaging top shell and the packaging bottom shell.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic product packaging, and in particular to an electronic product packaging structure and method. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its original material is silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, that is, a wafer. Domestic wafer production lines are mainly 8-inch and 12-inch.

[0003] The main processing methods for wafers are sheet processing and batch processing, that is, processing one or more wafers at the same time. As the feature size of semiconductors becomes smaller and smaller, and the processing and measurement equipment becomes more and more advanced, new data characteristics have emerged in wafer processing. At the same time, the reduction in feature size has increased the impact of the number of particles in the air on the quality and reliability of the wafer after processing, and with the improvement of cleanliness, new data characteristics have also emerged in the number of particles.

[0004] Semiconductor packaging refers to the process of processing the tested wafers into independent chips according to the product model and functional requirements. The packaging process is as follows: the wafers from the wafer front-end process are cut into small chips (Die) through the dicing process, and then the cut chips are glued to the corresponding substrate (lead frame) frame island, and then the ultra-fine metal (gold, tin, copper, aluminum) wires or conductive resins are used to connect the bonding pads (Bond Pad) of the chip to the corresponding pins (Lead) of the substrate to form the required circuit; then the independent chips are packaged and protected with plastic shells. After the plastic packaging, a series of operations are required. After the packaging is completed, the finished product is tested, usually after the incoming inspection, test and packaging processes, and finally put into storage for shipment.

[0005] In the prior art, a new type of semiconductor packaging structure and its packaging method and electronic product disclosed in the publication number "CN107910313B" include a lead frame, the lead frame has a first surface and a second surface opposite to the first surface, a chip is arranged on the first surface, and the remaining surfaces of the lead frame except the second surface are arranged with packaging materials, the packaging material encapsulates the chip on the lead frame, and the surface of the lead frame not arranged with the packaging material is arranged with an inductor component, and the inductor component is electrically connected to the lead frame. In the packaging process, this solution exposes a part of the lead frame so that the passive component can be directly placed on the lead frame. Compared with setting the packaging component on the PCB and then setting the passive component at other positions, it can reduce the occupation of the PCB space and achieve the reduction of the area of ​​the PCB. The area occupied by the semiconductor device on the PCB can be reduced by placing the passive component on the packaging component and in direct contact with the lead frame.

[0006] However, the existing technology still has major deficiencies, such as:

[0007] In the above-mentioned device and the prior art, during the packaging process of the wafer substrate, the wafer substrate needs to be pressurized and buckled into the inner cavity of the packaging bottom shell. However, during the packaging process, it is impossible to ensure that the force on the bottom of the wafer substrate is evenly supported and buckled, which can easily cause the wafer substrate to deform during the buckling process, affecting the packaging effect of the wafer substrate. Summary of the invention

[0008] The object of the present invention is to provide an electronic product packaging structure and method to solve the problems raised in the above background technology.

[0009] To achieve the above object, the present invention provides the following technical solutions: an electronic product packaging structure, comprising a packaging platform, a base and a mounting seat, wherein the packaging platform is arranged on the top of the base, an annular guide rail is installed in the inner cavity of the surface of the packaging platform, the mounting seat is installed on the moving end of the annular guide rail, and a central hole is arranged in the central area of ​​the packaging platform;

[0010] A packaging bottom shell center calibration packaging unit, which is arranged at the top area of ​​the mounting seat and is used to calibrate, place and install the packaging bottom shell part, and can drive the packaging bottom shell part to flip and calibrate, so as to buckle and package the wafer substrate;

[0011] A package top shell pressurized covering installation unit, which is arranged on the top of the package bottom shell center calibration package unit, and is used to clamp and install the package top shell part, and can be pressed down to buckle and install the package bottom shell after buckling the wafer substrate;

[0012] The wafer substrate package bottom pressure flattening unit is arranged in the central hole part and is used for placing and installing the wafer substrate. When the wafer substrate is buckled into the package bottom shell, the bottom of the wafer substrate is pressurized and buckled by expanding, so that the bottom of the wafer substrate is evenly pressurized.

[0013] Preferably, the packaging bottom shell center calibration packaging unit includes a movable swing arm, which is rotatably installed in the inner cavity of the mounting seat, a storage groove is provided at one end of the movable swing arm, a stepper motor is installed in the storage groove, a rotating swing arm is installed on the rotating end of the stepper motor, an electric drive shaft is embedded in the rotating swing arm, a rotating block is installed on the rotating end of the electric drive shaft, a fixed frame is installed on the rotating block, a center clamping arm is installed on one side of the fixed frame, a center telescopic arm is installed on the top of the center clamping arm, a center fixed arm is installed on the movable end of the center telescopic arm, and a bottom shell support plate is installed on one end of the center fixed arm.

[0014] Preferably, the packaging top shell pressurized covering installation unit includes a vertical lifting frame, a horizontal lifting arm is installed on the movable end of the vertical lifting frame, a locking frame is installed at one end of the horizontal lifting arm, a bottom clamping arm is installed on the locking frame, a bottom telescopic arm is installed on the top of the bottom clamping arm, a bottom fixed arm is installed on the movable end of the bottom telescopic arm, and a top shell support plate is installed between adjacent bottom fixed arms.

[0015] Preferably, magnetic plates are installed on the surfaces of the bottom shell support plate and the top shell support plate.

[0016] Preferably, the pressure flattening unit at the bottom of the wafer substrate package includes a movable part, and the movable part includes a supporting chassis. A partition groove is provided on the surface of the supporting chassis, and a movable slider is slidably installed in the partition groove. An air replenishing chamber is installed on the inner wall of the partition groove, and one side of the air replenishing chamber is connected to an expansion airbag, and one side of the expansion airbag is fixed to one side of the movable slider.

[0017] Preferably, the pressure flattening unit at the bottom of the wafer substrate package also includes a bulging portion, the bulging portion includes an anti-slip base, the anti-slip base is installed in the top center area of ​​the supporting base, the surface of the movable slider is movably fitted with the bottom of the anti-slip base, the surface of the movable slider is provided with a storage cavity, a movable cylinder is installed in the inner cavity of the storage cavity, a sealing plate is installed on the movable end of the movable cylinder, and a pressure strip is provided on the surface of the sealing plate.

[0018] Preferably, a vertical extension cylinder is installed in the central area of ​​the top of the base, and the movable end of the vertical extension cylinder passes through the central hole and is fixed to the bottom of the supporting chassis.

[0019] Preferably, a lateral stabilizing frame is installed on the top of the base platform, and the lateral stabilizing frames are arranged in a plurality of groups at intervals, and the top of the lateral stabilizing frame is fixed to the bottom of the packaging platform.

[0020] Preferably, wafer shell sealing units are provided on both sides of the horizontal lifting arm, and the wafer shell sealing units include external half rings, which are installed on both sides of the horizontal lifting arm, and an arc guide rail is embedded in the bottom of the external half ring, and a glue tank is installed on the movable end of the arc guide rail, and an inclined conduit is installed at the bottom of the glue tank, and an electromagnetic nozzle is installed at one end of the inclined conduit.

[0021] A method of use, based on the above-mentioned electronic product packaging structure, comprises the following steps:

[0022] S1: After the package bottom shell and the package top shell are installed in place, the wafer substrate to be packaged is then calibrated and placed in the central area of ​​the surface of the non-slip chassis to ensure that the center of the wafer substrate is calibrated and buckled into the inner cavity of the package bottom shell, thereby ensuring the package buckling effect of the wafer substrate;

[0023] S2: The movable slider will increase the pressure area at the bottom of the wafer substrate during the unfolding process. After the movable slider is unfolded, the sealing plate and the pressure strip can be pushed outward by driving the movable cylinder to ensure that the sealing plate and the pressure strip are attached to the bottom of the wafer substrate, ensuring uniform pressure during the wafer substrate fastening process, and further ensuring the packaging fastening effect of the wafer substrate;

[0024] S3: After the bottom shell of the package is flipped, the vertical lifting frame can be driven to perform a lifting action. When the vertical lifting frame descends, the horizontal lifting arm and the bottom clamping arm will be driven to descend, and the top shell of the package will descend along with the bottom clamping arm. Since the center of the bottom clamping arm is aligned with the center of the middle clamping arm, the top shell of the package will be buckled on the inner surface of the bottom shell of the package during the descending process, thereby ensuring the buckling effect of the wafer substrate;

[0025] S4: The glue tank injects packaging glue into the oblique conduit, and then the packaging glue is evenly sprayed on the buckled edges of the packaging top shell and the packaging bottom shell through the electromagnetic nozzle at the end of the oblique conduit. When the packaging top shell and the packaging bottom shell are buckled, the glue can lock the packaging top shell and the packaging bottom shell to further strengthen the packaging fixing effect of the wafer substrate.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] 1. When in use, after the movable slider is unfolded, the sealing plate and the pressure strip can be pushed outward by driving the movable cylinder to ensure that the sealing plate and the pressure strip are attached to the bottom of the wafer substrate, ensuring uniform pressure during the wafer substrate fastening process, and further ensuring the packaging fastening effect of the wafer substrate;

[0028] 2. When in use, when the vertical lifting frame descends, it will drive the horizontal lifting arm and the bottom clamping arm to descend, and the package top shell will descend along with the bottom clamping arm. Since the center of the bottom clamping arm is aligned with the center clamping arm, the package top shell will be buckled on the inner surface of the package bottom shell during the descending process, thereby ensuring the buckling effect of the wafer substrate;

[0029] 3. When in use, the packaging glue is evenly sprayed on the buckled edges of the packaging top shell and the packaging bottom shell through the electromagnetic nozzle at the end of the oblique conduit. When the packaging top shell and the packaging bottom shell are buckled, the glue can lock the packaging top shell and the packaging bottom shell, further strengthening the packaging fixing effect of the wafer substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is an overall schematic diagram of the device of the present invention;

[0031] Figure 2 It is a partial schematic diagram of the vertical lifting frame in the present invention;

[0032] Figure 3 It is a schematic diagram of the external semi-ring part in the present invention;

[0033] Figure 4 It is a schematic diagram of the mounting seat part of the present invention;

[0034] Figure 5 It is a schematic diagram of the bottom clamp arm part of the present invention;

[0035] Figure 6 It is a partial schematic diagram of the placement area in the present invention;

[0036] Figure 7 It is a schematic diagram of the central hole part in the present invention;

[0037] Figure 8 It is a schematic diagram of the anti-skid chassis part of the present invention;

[0038] Fig. 9 It is a partial schematic diagram of the storage chamber and the movable cylinder in the present invention.

[0039] In the figure: 1. Packaging platform; 11. Partition table; 12. Annular guide rail; 13. Placement area; 14. Center hole; 2. Bottom platform; 21. Lateral stabilizing frame; 22. Vertical extension cylinder; 3. Mounting seat; 31. Movable swing arm; 32. Storage slot; 33. Stepper motor; 34. Rotating swing arm; 35. Electric drive shaft; 36. Rotating block; 361. Fixed frame; 37. Central telescopic arm; 38. Central fixed arm; 39. Central clamping arm; 4. Bottom shell support plate; 5. Vertical lifting frame; 51. Horizontal lifting arm; 52. Locking frame; 53. Bottom clamping arm; 55. Bottom telescopic arm; 56. Bottom fixed arm; 6. Top shell support plate; 7. External semi-ring; 71. Arc guide rail; 72. Glue tank; 73. Oblique guide tube; 74. Electromagnetic nozzle; 8. Anti-slip chassis; 81. Support chassis; 82. Partition slot; 83. Air replenishing tank; 831. Inflatable airbag; 84. Movable slider; 841. Storage chamber; 842. Movable cylinder; 86. Sealing plate; 87. Pressure strip. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] See also Figure 1-9 , the present invention provides a technical solution:

[0042] Embodiment 1: An electronic product packaging structure: comprising a packaging platform 1, a base 2 and a mounting seat 3, wherein the packaging platform 1 is arranged on the top of the base 2, an annular guide rail 12 is installed in the inner cavity of the surface of the packaging platform 1, the mounting seat 3 is installed on the moving end of the annular guide rail 12, and a central area of ​​the packaging platform 1 is provided with a central hole 14;

[0043] A vertical extension cylinder 22 is installed in the central area of ​​the top of the base 2 , and the movable end of the vertical extension cylinder 22 passes through the central hole 14 and is fixed to the bottom of the supporting chassis 81 .

[0044] A lateral stabilizing frame 21 is installed on the top of the base 2 . The lateral stabilizing frames 21 are arranged in a plurality of groups at intervals. The top of the lateral stabilizing frame 21 is fixed to the bottom of the packaging platform 1 .

[0045] The packaging bottom shell center calibration packaging unit is arranged in the top area of ​​the mounting seat 3, and is used to calibrate and place the packaging bottom shell part, and can also drive the packaging bottom shell part to flip and calibrate, so as to buckle and package the wafer substrate;

[0046] The packaging bottom shell center calibration packaging unit includes a movable swing arm 31, which is rotatably installed in the inner cavity of the mounting seat 3, and a storage groove 32 is arranged at one end of the movable swing arm 31, in which a stepper motor 33 is installed, and a rotating swing arm 34 is installed on the rotating end of the stepper motor 33, and an electric drive shaft 35 is embedded in the rotating swing arm 34, and a rotating block 36 is installed on the rotating end of the electric drive shaft 35, and a fixed frame 361 is installed on the rotating block 36, and a middle clamping arm 39 is installed on one side of the fixed frame 361, and a middle telescopic arm 37 is installed on the top of the middle clamping arm 39, and a middle fixed arm 38 is installed on the moving end of the middle telescopic arm 37, and a bottom shell support plate 4 is installed at one end of the middle fixed arm 38.

[0047] In this embodiment, the packaging bottom shell and the packaging top shell are respectively installed on the surface of the bottom shell support plate 4 and the top shell support plate 6, and the packaging bottom shell and the packaging top shell are magnetically installed by the magnetic suction plates on the surface of the bottom shell support plate 4 and the top shell support plate 6. The outer side of the bottom shell support plate 4 is fitted and supported by the middle clamp arm 39, and the outer side of the top shell support plate 6 is fitted and supported by the bottom clamp arm 53. When the packaging bottom shell and the packaging top shell are respectively installed in place, the wafer substrate to be packaged is then calibrated and placed in the central area of ​​the surface of the anti-slip chassis 8 to ensure that the center of the wafer substrate is calibrated and fitted in the inner cavity of the packaging bottom shell, thereby ensuring the packaging and fitting effect of the wafer substrate.

[0048] The package top shell pressurized encapsulation installation unit is arranged on the top of the package bottom shell center calibration package unit, and is used to clamp and install the package top shell part, and can be pressed down to buckle and install the package bottom shell after it is buckled with the wafer substrate;

[0049] The packaging top shell pressurized covering installation unit includes a vertical lifting frame 5, a horizontal lifting arm 51 is installed on the moving end of the vertical lifting frame 5, a locking frame 52 is installed at one end of the horizontal lifting arm 51, a bottom clamping arm 53 is installed on the locking frame 52, a bottom telescopic arm 55 is installed on the top of the bottom clamping arm 53, a bottom fixed arm 56 is installed on the moving end of the bottom telescopic arm 55, and a top shell support plate 6 is installed between adjacent bottom fixed arms 56.

[0050] Magnetic plates are installed on the surfaces of the bottom shell support plate 4 and the top shell support plate 6.

[0051] In this embodiment, the bottom shell support plate 4 rotates with the middle clamping arm 39, thereby completing the flipping calibration of the package bottom shell. When the package bottom shell is flipped, it can be lifted and lowered by driving the vertical lifting frame 5. When the vertical lifting frame 5 descends, it will drive the horizontal lifting arm 51 and the bottom clamping arm 53 to descend, and the package top shell will descend along with the bottom clamping arm 53. Since the bottom clamping arm 53 is aligned with the center of the middle clamping arm 39, the package top shell will be buckled on the inner surface of the package bottom shell during the descent process, thereby ensuring the buckling effect of the wafer substrate.

[0052] The wafer substrate package bottom pressure flattening unit is arranged at the center hole 14 and is used to place and install the wafer substrate. When the wafer substrate is buckled into the package bottom shell, the bottom of the wafer substrate is pressurized and buckled by unfolding, so that the bottom of the wafer substrate is evenly pressurized;

[0053] The pressure flattening unit at the bottom of the wafer substrate package includes a movable part, which includes a supporting chassis 81. A partition groove 82 is arranged on the surface of the supporting chassis 81. A movable slider 84 is slidably installed in the partition groove 82. An air replenishing chamber 83 is installed on the inner wall of the partition groove 82. One side of the air replenishing chamber 83 is connected to an expansion air bag 831, and one side of the expansion air bag 831 is fixed to one side of the movable slider 84.

[0054] The pressure flattening unit at the bottom of the wafer substrate package also includes a bulging portion, which includes an anti-slip chassis 8, which is installed in the top center area of ​​the supporting chassis 81. The surface of the movable slider 84 is movably fitted with the bottom of the anti-slip chassis 8. A storage cavity 841 is provided on the surface of the movable slider 84, and a movable cylinder 842 is installed in the inner cavity of the storage cavity 841. A sealing plate 86 is installed on the movable end of the movable cylinder 842, and a pressure strip 87 is provided on the surface of the sealing plate 86.

[0055] In this embodiment, the expansion airbag 831 continuously expands outward during the continuous inflation process. During the expansion process, the expansion airbag 831 will push the movable slider 84 to expand outward along the partition groove 82. During the expansion process, the movable slider 84 will increase the pressure area at the bottom of the wafer substrate. After the movable slider 84 is fully expanded, the sealing plate 86 and the pressure strip 87 can be pushed outward by driving the movable cylinder 842 to ensure that the sealing plate 86 and the pressure strip 87 are attached to the bottom of the wafer substrate, ensuring uniform pressure during the wafer substrate fastening process, and further ensuring the packaging fastening effect of the wafer substrate.

[0056] Embodiment 2:

[0057] Based on the first embodiment, in this embodiment, it is considered that if the wafer substrate can be assembled by mechanically fastening the package bottom shell and the package top shell, but the package of the fastening gap between the package bottom shell and the package top shell cannot be encapsulated, it is easy to cause dust and impurities to enter through the fastening gap between the package bottom shell and the package top shell, affecting the heat dissipation effect of the wafer substrate. Therefore, a wafer shell sealing unit is provided in this embodiment to avoid the occurrence of the above problem;

[0058] Wafer shell sealing units are arranged on both sides of the horizontal lifting arm 51, and the wafer shell sealing units include external half rings 7, which are installed on both sides of the horizontal lifting arm 51, and an arc guide rail 71 is embedded in the bottom of the external half ring 7, and a glue tank 72 is installed on the moving end of the arc guide rail 71, and an oblique conduit 73 is installed at the bottom of the glue tank 72, and an electromagnetic nozzle 74 is installed at one end of the oblique conduit 73.

[0059] In this embodiment, when the packaging top shell and the packaging bottom shell on the bottom clamp arm 53 and the middle clamp arm 39 are buckled together, the arc guide rail 71 installed at the bottom of the external semi-ring 7 can be used to drive the inclined conduit 73 to rotate. During the rotation of the inclined conduit 73, the glue tank 72 injects packaging glue into the inclined conduit 73, and then the packaging glue is evenly sprayed on the buckling edge of the packaging top shell and the packaging bottom shell through the electromagnetic nozzle 74 at the end of the inclined conduit 73. When the packaging top shell and the packaging bottom shell are buckled together, the glue can lock the packaging top shell and the packaging bottom shell, thereby further strengthening the packaging fixing effect of the wafer substrate.

[0060] A method of use, based on the above-mentioned electronic product packaging structure, comprises the following steps:

[0061] S1: After the package bottom shell and the package top shell are installed in place, the wafer substrate to be packaged is then calibrated and placed in the center area of ​​the surface of the anti-slip chassis 8 to ensure that the center of the wafer substrate is calibrated and buckled into the inner cavity of the package bottom shell, thereby ensuring the package buckling effect of the wafer substrate;

[0062] S2: The movable slider 84 will increase the pressure area at the bottom of the wafer substrate during the unfolding process. After the movable slider 84 is unfolded, the movable cylinder 842 can be driven to push the sealing plate 86 and the pressure strip 87 outward to ensure that the sealing plate 86 and the pressure strip 87 are attached to the bottom of the wafer substrate, ensuring that the pressure is uniform during the wafer substrate fastening process, and further ensuring the packaging fastening effect of the wafer substrate;

[0063] S3: After the bottom shell of the package is turned over, the vertical lifting frame 5 can be driven to perform a lifting action. When the vertical lifting frame 5 descends, the horizontal lifting arm 51 and the bottom clamping arm 53 will be driven to descend, and the top shell of the package will descend along with the bottom clamping arm 53. Since the bottom clamping arm 53 is aligned with the center of the middle clamping arm 39, the top shell of the package will be buckled on the inner surface of the bottom shell of the package during the descending process, thereby ensuring the buckling effect of the wafer substrate;

[0064] S4: The glue tank 72 injects packaging glue into the oblique conduit 73, and then the packaging glue is evenly sprayed on the buckled edges of the packaging top shell and the packaging bottom shell through the electromagnetic nozzle 74 at the end of the oblique conduit 73. When the packaging top shell and the packaging bottom shell are buckled, the glue can lock the packaging top shell and the packaging bottom shell to further strengthen the packaging fixing effect of the wafer substrate.

[0065] Working principle: During the use of the device, the packaging bottom shell and the packaging top shell used for wafer substrate packaging are installed, and the packaging bottom shell and the packaging top shell are installed on the surface of the bottom shell support plate 4 and the top shell support plate 6 respectively. The magnetic suction plates on the surface of the bottom shell support plate 4 and the top shell support plate 6 magnetically install the packaging bottom shell and the packaging top shell. The outer side of the bottom shell support plate 4 is fitted and supported by the middle clamp arm 39, and the outer side of the top shell support plate 6 is fitted and supported by the bottom clamp arm 53. When the packaging bottom shell and the packaging top shell are installed in place respectively, the wafer substrate to be packaged is then calibrated and placed in the central area of ​​the surface of the anti-slip chassis 8 to ensure that the center of the wafer substrate is calibrated and fastened to the inner cavity of the packaging bottom shell, thereby ensuring the packaging fastening effect of the wafer substrate;

[0066] When the wafer substrate is placed in place, the bottom of the supporting chassis 81 is then pushed upward by driving the vertical extension cylinder 22. When the supporting chassis 81 moves upward, it will drive the anti-skid chassis 8 and the wafer substrate to move upward. The wafer substrate will gradually be inserted into the inner cavity of the packaging bottom shell as it continues to move upward. During the wafer substrate buckling process, in order to ensure that the bottom of the wafer substrate is evenly stressed, gas can be gradually injected into the expansion airbag 831 through the air replenishing chamber 83. The expansion airbag 831 continues to expand outward during the continuous inflation process. During the expansion process, the expansion airbag 831 will push the movable slider 84 to expand outward along the partition groove 82. During the expansion process, the movable slider 84 will increase the pressure area at the bottom of the wafer substrate. After the movable slider 84 is fully expanded, the sealing plate 86 and the pressure strip 87 can be pushed outward by driving the movable cylinder 842 to ensure that the sealing plate 86 and the pressure strip 87 are attached to the bottom of the wafer substrate, ensuring that the pressure is uniform during the wafer substrate buckling process, and further ensuring the packaging buckling effect of the wafer substrate.

[0067] When the wafer substrate is fastened, the stepper motor 33 can be driven to drive the rotating swing arm 34 to rotate. After the rotating swing arm 34 rotates, the rotating block 36 and the middle clamping arm 39 are driven to rotate, and the bottom shell support plate 4 rotates with the middle clamping arm 39, thereby completing the flipping calibration of the package bottom shell. When the package bottom shell is flipped, the vertical lifting frame 5 can be driven to perform a lifting action. When the vertical lifting frame 5 descends, it will drive the horizontal lifting arm 51 and the bottom clamping arm 53 to descend, and the package top shell will descend with the bottom clamping arm 53. Since the bottom clamping arm 53 is aligned with the center of the middle clamping arm 39, the package top shell will be fastened to the inner surface of the package bottom shell during the descent process, thereby ensuring the fastening effect of the wafer substrate.

[0068] When the packaging top shell and the packaging bottom shell on the bottom clamp arm 53 and the middle clamp arm 39 are buckled together, the inclined conduit 73 can be driven to rotate partially through the arc guide rail 71 installed at the bottom of the external semi-ring 7. During the rotation of the inclined conduit 73, the glue tank 72 injects packaging glue into the inclined conduit 73, and then the packaging glue is evenly sprayed on the buckling edge of the packaging top shell and the packaging bottom shell through the electromagnetic nozzle 74 at the end of the inclined conduit 73. When the packaging top shell and the packaging bottom shell are buckled together, the glue can lock the packaging top shell and the packaging bottom shell to further strengthen the packaging fixing effect of the wafer substrate.

[0069] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An electronic product packaging structure, characterized in that: The packaging platform (1) comprises a packaging platform (1), a base (2) and a mounting seat (3), wherein the packaging platform (1) is arranged on the top of the base (2), an annular guide rail (12) is installed in the inner cavity of the surface of the packaging platform (1), the mounting seat (3) is installed on the movable end of the annular guide rail (12), and a central area of ​​the packaging platform (1) is provided with a central hole (14); A packaging bottom shell center calibration packaging unit, the packaging bottom shell center calibration packaging unit is arranged in the top area of ​​the mounting seat (3), and is used to calibrate, place and install the packaging bottom shell part, and can also drive the packaging bottom shell part to flip and calibrate, so as to buckle and package the wafer substrate; A package top shell pressurized covering installation unit, which is arranged on the top of the package bottom shell center calibration package unit, and is used to clamp and install the package top shell part, and can be pressed down to buckle and install the package bottom shell after buckling the wafer substrate; A wafer substrate package bottom pressure flattening unit, the wafer substrate package bottom pressure flattening unit is arranged at the center hole (14) and is used to place and install the wafer substrate. When the wafer substrate is buckled into the package bottom shell, the bottom of the wafer substrate is pressurized and buckled by unfolding, so that the bottom of the wafer substrate is evenly pressurized; The packaging bottom shell center calibration packaging unit comprises a movable swing arm (31), the movable swing arm (31) is rotatably mounted in the inner cavity of the mounting seat (3), one end of the movable swing arm (31) is provided with a storage groove (32), a stepper motor (33) is mounted in the storage groove (32), a rotating swing arm (34) is mounted on the rotating end of the stepper motor (33), an electric drive shaft (35) is embedded in the rotating swing arm (34), a rotating block (36) is mounted on the rotating end of the electric drive shaft (35), a fixed frame (361) is mounted on the rotating block (36), a central clamping arm (39) is mounted on one side of the fixed frame (361), a central telescopic arm (37) is mounted on the top of the central clamping arm (39), a central fixed arm (38) is mounted on the movable end of the central telescopic arm (37), and a bottom shell support plate (4) is mounted on one end of the central fixed arm (38); The packaging top shell pressurized covering installation unit comprises a vertical lifting frame (5), a horizontal lifting arm (51) is installed on the moving end of the vertical lifting frame (5), a locking frame (52) is installed on one end of the horizontal lifting arm (51), a bottom clamping arm (53) is installed on the locking frame (52), a bottom telescopic arm (55) is installed on the top of the bottom clamping arm (53), a bottom fixed arm (56) is installed on the moving end of the bottom telescopic arm (55), and a top shell support plate (6) is installed between adjacent bottom fixed arms (56); The wafer substrate package bottom pressure flattening unit comprises a movable part, the movable part comprises a supporting chassis (81), a partition groove (82) is provided on the surface of the supporting chassis (81), a movable slider (84) is slidably installed in the partition groove (82), an air replenishing bin (83) is installed on the inner wall of the partition groove (82), one side of the air replenishing bin (83) is connected to an expansion air bag (831), and one side of the expansion air bag (831) is fixed to one side of the movable slider (84); The wafer substrate package bottom pressure flattening unit also includes a bulging portion, the bulging portion includes an anti-skid chassis (8), the anti-skid chassis (8) is installed in the top center area of ​​the supporting chassis (81), the surface of the movable slider (84) is movably fitted with the bottom of the anti-skid chassis (8), the surface of the movable slider (84) is provided with a storage cavity (841), the inner cavity of the storage cavity (841) is provided with a movable cylinder (842), the movable end of the movable cylinder (842) is provided with a sealing plate (86), and the surface of the sealing plate (86) is provided with a pressure strip (87).

2. The electronic product packaging structure according to claim 1, characterized in that: Magnetic attraction plates are installed on the surfaces of the bottom shell support plate (4) and the top shell support plate (6).

3. The electronic product packaging structure according to claim 2, characterized in that: A vertical extension cylinder (22) is installed in the top center area of ​​the base (2), and the movable end of the vertical extension cylinder (22) passes through the center hole (14) and is fixed to the bottom of the supporting chassis (81).

4. The electronic product packaging structure according to claim 3, characterized in that: A lateral stabilizing frame (21) is installed on the top of the base platform (2), the lateral stabilizing frames (21) are arranged in a plurality of groups at intervals, and the top of the lateral stabilizing frame (21) is fixed to the bottom of the packaging platform (1).

5. The electronic product packaging structure according to claim 4, characterized in that: Wafer shell sealing units are arranged on both sides of the horizontal lifting arm (51), and the wafer shell sealing units include external half rings (7), the external half rings (7) are installed on both sides of the horizontal lifting arm (51), an arc guide rail (71) is embedded in the bottom of the external half ring (7), a glue tank (72) is installed on the movable end of the arc guide rail (71), the bottom of the glue tank (72) is connected to an inclined conduit (73), and one end of the inclined conduit (73) is connected to an electromagnetic nozzle (74).

6. A method of use, based on the electronic product packaging structure of claim 5, characterized in that: The steps include: S1: After the packaging bottom shell and the packaging top shell are installed in place, the wafer substrate to be packaged is then calibrated and placed in the center area of ​​the surface of the anti-slip bottom plate (8), ensuring that the center of the wafer substrate is calibrated and buckled into the inner cavity of the packaging bottom shell, thereby ensuring the packaging buckling effect of the wafer substrate; S2: The movable slider (84) will increase the pressure area at the bottom of the wafer substrate during the unfolding process. After the movable slider (84) is unfolded, the sealing plate (86) and the pressure strip (87) can be pushed outward by driving the movable cylinder (842), thereby ensuring that the sealing plate (86) and the pressure strip (87) are attached to the bottom of the wafer substrate, ensuring that the pressure is uniform during the wafer substrate fastening process, and further ensuring the packaging fastening effect of the wafer substrate; S3: After the bottom shell of the package is flipped, the vertical lifting frame (5) can be driven to perform a lifting action. When the vertical lifting frame (5) descends, it will drive the horizontal lifting arm (51) and the bottom clamping arm (53) to descend, and the top shell of the package will descend along with the bottom clamping arm (53). Since the center of the bottom clamping arm (53) is aligned with the center of the middle clamping arm (39), the top shell of the package will be buckled on the inner surface of the bottom shell of the package during the descending process, thereby ensuring the buckling effect of the wafer substrate; S4: The glue tank (72) injects packaging glue into the oblique conduit (73), and then the packaging glue is evenly sprayed on the buckled edges of the packaging top shell and the packaging bottom shell through the electromagnetic nozzle (74) at the end of the oblique conduit (73). When the packaging top shell and the packaging bottom shell are buckled, the glue can lock the packaging top shell and the packaging bottom shell, further strengthening the packaging fixing effect of the wafer substrate.

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