Efficient heat dissipation module for notebook computer
By designing a detachable heat dissipation fin and an efficient heat dissipation module that adjusts the fan speed in real time, the problem of poor heat dissipation of laptops is solved, achieving more uniform CPU heat dissipation and extending service life.
Patent Information
- Application Number
- CN202411447729.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-16
- Publication Date
- 2025-01-10
AI Technical Summary
The existing laptop cooling mode cannot meet the actual demand for increased dust inside the laptop with increasing service life, resulting in poor heat dissipation and slow operation speed.
An efficient heat dissipation module including detachable heat dissipation fins, fans, elastic locking structures, engaging components and speed control switches was designed. The elastic locking structure enables rapid disassembly and installation of the heat dissipation fins and bases, and engaging them. The component realizes quick connection and disassembly between the fan and the heat dissipation fins, and the follow-up component adjusts the fan speed in real time according to the temperature.
It improves the heat dissipation effect of the CPU, avoids local high temperatures, extends the service life of the laptop, and is easy to replace when the heat dissipation grease deteriorates.
Smart Images

Figure CN119292433A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of radiators, in particular to a high-efficiency heat dissipation module for a notebook computer. Background Art
[0002] Compared with desktop computers, laptops have better portability, and this feature also leads to higher integration of laptops, smaller distances between components, and more stringent heat dissipation performance requirements.
[0003] Good laptop heat dissipation performance can maintain a low-temperature working environment inside the laptop, ensuring that the hardware maintains good heat dissipation performance while running efficiently, thereby extending the service life of the laptop.
[0004] For existing notebook heat dissipation, the heat dissipation modes are mostly preset, such as using office heat dissipation efficiency when working and using entertainment heat dissipation power when entertaining. This is more suitable for newer notebooks, but as the notebook ages, there is more dust inside it, and the preset heat dissipation mode will not be able to meet the actual use needs of the notebook, resulting in poor heat dissipation effect and slow operation speed of the notebook. Summary of the invention
[0005] The object of the present invention is to provide a notebook computer high-efficiency heat dissipation module to solve the problems raised in the above background technology.
[0006] To achieve the above object, the present invention provides the following technical solutions: A notebook computer high-efficiency heat dissipation module, comprising: A base, on which heat dissipation fins are detachably mounted; A fan is arranged on a side of the heat dissipation fin away from the base; A connecting member, arranged on the base; An elastic locking structure is installed on the base, and a first protruding shaft arranged at the end of the heat dissipation fin is adapted to the connecting member and the elastic locking structure; A clamping assembly, connecting the heat dissipation fins and the fan, the clamping assembly comprising an abutting structure and a locking member, the abutting structure cooperates with the locking member to enable the heat dissipation fins to be connected to the fan; A speed regulating switch, arranged on the base and electrically connected to the fan; A follower component is connected to the heat sink fins, and the follower component can control the action of the speed regulating switch in real time according to the temperature of the heat sink fins.
[0007] As a further solution of the present invention: an inclined groove is provided on the connecting member, and the opening of the inclined groove is inclined upward. After the first protruding shaft enters the end of the inclined groove, the heat dissipating fin can make a circular motion with the first protruding shaft.
[0008] As a further solution of the present invention: the elastic locking structure comprises a follower and a bracket arranged on the base, the follower is provided with a guide groove, and the guide groove is slidably connected with a guide portion arranged on the bracket; The elastic locking structure also includes a support kit arranged between the follower and the bracket; The limiting portion arranged at the end of the follower is adapted to the first convex shaft.
[0009] As a further solution of the present invention: the support kit includes a transverse axis connected to the bracket, the transverse axis is slidably connected to the follower, and a first cylindrical spring is sleeved on the transverse axis, one end of the first cylindrical spring is connected to the bracket, and the other end is connected to the follower.
[0010] As a further solution of the present invention: a first inclined guiding surface and a limiting groove are formed on one side of the limiting portion facing the connecting member, and a plane formed by the limiting groove and the end of the inclined groove is parallel to the base.
[0011] As a further solution of the present invention: the abutment structure includes a hysteresis member connected to the end of the fan, a hysteresis chamber is formed in the hysteresis member, a connecting shaft is installed in the hysteresis chamber, a telescopic plate is slidably installed on the connecting shaft, and the telescopic plate is adapted to the locking member; A second cylindrical spring is sleeved on the connecting shaft, one end of the second cylindrical spring is connected to the telescopic plate, and the other end is connected to the inner wall of the hysteresis chamber.
[0012] As a further solution of the present invention: the telescopic plate is formed with a hook portion capable of penetrating the inner wall of the hysteresis chamber; The locking member is in a "U"-shaped structure, and a second inclined guide surface is provided at one end of the locking member away from the heat dissipation fins, and the hooking portion is adapted to a locking groove provided on the locking member.
[0013] As a further solution of the present invention: the follower assembly includes a sealed cylinder body mounted on the heat dissipation fins and a copper tube sealed and fitted with the heat dissipation fins, and the copper tube is connected to the sealed cylinder body; A sealing plug is sealingly and slidably installed in the sealing cylinder, and a telescopic shaft perpendicular to the sealing plug is arranged on the sealing plug, and the telescopic shaft penetrates the sealing cylinder and is slidably arranged; A third cylindrical spring is sleeved on the telescopic shaft, one end of the third cylindrical spring is connected to the sealing plug, and the other end is connected to the inner wall of the sealing cylinder body; The follower assembly also includes a connecting structure connecting the telescopic shaft and the speed regulating switch.
[0014] As a further solution of the present invention: the connecting structure includes a second convex shaft rotatably mounted on an end of the telescopic shaft away from the sealing plug and a deflection rod connected to the speed regulating switch, the deflection rod is provided with a retardation groove along its length direction, and the retardation groove is rollingly engaged with the second convex shaft.
[0015] Compared with the prior art, the present invention has the following beneficial effects: By means of the provided connecting piece and the elastic locking structure, the heat sink fin and the base can be quickly disassembled and installed, and the heat sink grease can be quickly replaced after it deteriorates due to long-term use. On the other hand, when the first protruding shaft at one end of the heat sink fin is stuck in the inclined groove and the first protruding shaft at the other end is stuck in the limit groove, the heat sink fin can be kept parallel to the base, and the heat sink fin is ensured to fit the CPU of the notebook computer, so as to achieve more uniform heat exchange between the notebook CPU and the heat sink fin, which can improve the heat dissipation effect of the CPU and make the CPU dissipate heat evenly, avoiding local high temperature of the CPU. By providing a snap-fit assembly, when the hook portion cooperates with the locking groove, the fan and the heat sink fin can be quickly connected and disassembled. At the same time, the second inclined guide surface has a guiding effect on the hook portion, thereby improving the portability of the fan during installation and playing a fool-proof role. By setting up a speed regulating switch and a follow-up component, when the temperature of the CPU of the notebook computer is too high, the heat dissipation fins can transfer the temperature to the copper tube to increase the pressure in the copper tube. At this time, under the action of the pressure, the sealing plug is actuated, and the deflection rod is rotated through the cooperation of the second convex shaft and the retardation groove, thereby increasing the actual gear position of the speed regulating switch, driving the fan to increase the rotation speed, and improving its heat dissipation power, thereby ensuring that when the temperature of the CPU of the notebook computer is too high, the heat can be removed in time to avoid damage to the CPU. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 The present invention is a structural schematic diagram of an embodiment of a high-efficiency heat dissipation module for a notebook computer.
[0017] Figure 2 This is a structural schematic diagram from another angle of an embodiment of a laptop computer high-efficiency heat dissipation module.
[0018] Figure 3 The structural explosion diagram of an embodiment of a high-efficiency heat dissipation module for a notebook computer is shown.
[0019] Figure 4 This is an exploded view of the structure of the elastic locking structure in an embodiment of a high-efficiency heat dissipation module for a notebook computer.
[0020] Figure 5 This is a schematic diagram of the internal structure of a hysteresis component in an embodiment of a high-efficiency heat dissipation module for a notebook computer.
[0021] Figure 6 The present invention is a schematic diagram of the structure of a follow-up component in an embodiment of a high-efficiency heat dissipation module for a notebook computer.
[0022] Figure 7 for Figure 6 A magnified view of the structure at center.
[0023] In the figure: 1, base; 2, heat sink fins; 3, fan; 4, connecting member; 401, inclined groove; 5, follower; 501, guide groove; 6, bracket; 601, guide part; 7, horizontal axis; 8, first cylindrical spring; 9, limiting part; 901, first inclined guide surface; 902, limiting groove; 10, first convex shaft; 11, hysteresis member; 12, connecting shaft; 13, second cylindrical spring; 14, telescopic plate; 15, hooking part; 16, connecting plate; 17, locking member; 1701, locking groove; 1702, second inclined guide surface; 18, sealing cylinder; 19, sealing plug; 20, telescopic shaft; 21, third cylindrical spring; 22, copper tube; 23, speed control switch; 24, second convex shaft; 25, deflection rod; 2501, hysteresis groove. DETAILED DESCRIPTION
[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0025] In addition, when an element in the present invention is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only embodiment.
[0026] See also Figure 1 to Figure 7In an embodiment of the present invention, a notebook computer high-efficiency heat dissipation module includes: a base 1, a fan 3, a connector 4, an elastic locking structure, a clamping assembly, a speed regulating switch 23 and a follower assembly, so that when the CPU temperature of the notebook computer is too high, the heat dissipation fins 2 can transfer the temperature to the copper tube 22 to increase the pressure in the copper tube 22. At this time, under the action of the pressure, the sealing plug 19 is actuated, and the deflection rod 25 is rotated through the cooperation of the second convex shaft 24 and the retardation groove 2501, thereby increasing the actual gear position of the speed regulating switch 23, and driving the fan 3 to increase the rotation speed, improve its heat dissipation power, and ensure that when the CPU temperature of the notebook computer is too high, the heat can be removed in time to avoid CPU damage, as follows: The base 1 is detachably provided with a heat dissipation fin 2; The fan 3 is arranged on a side of the heat dissipation fin 2 away from the base 1; The connecting member 4 is disposed on the base 1, and an inclined groove 401 is disposed on the connecting member 4. The opening of the inclined groove 401 is inclined upward. After the first convex shaft 10 enters the end of the inclined groove 401, the heat dissipation fin 2 can make a circular motion with the first convex shaft 10. The elastic locking structure is installed on the base 1, and the first protruding shaft 10 arranged at the end of the heat dissipation fin 2 is adapted to the connecting member 4 and the elastic locking structure; The elastic locking structure comprises a follower 5 and a bracket 6 arranged on the base 1, the follower 5 is provided with a guide groove 501, and the guide groove 501 is slidably connected with a guide portion 601 arranged on the bracket 6; The elastic locking structure further includes a support kit disposed between the follower 5 and the bracket 6, the support kit including a transverse shaft 7 connected to the bracket 6, the transverse shaft 7 is slidably connected to the follower 5, and a first cylindrical spring 8 is sleeved on the transverse shaft 7, one end of the first cylindrical spring 8 is connected to the bracket 6, and the other end is connected to the follower 5; The limiting portion 9 arranged at the end of the follower 5 is adapted to the first convex shaft 10, and the limiting portion 9 is formed with a first inclined guiding surface 901 and a limiting groove 902 on the side facing the connecting member 4, and the plane formed by the limiting groove 902 and the end of the inclined groove 401 is parallel to the base 1.
[0027] When in use, the base 1 is fixed to the motherboard of the laptop computer by bolts. At this time, it is necessary to first apply heat dissipation silicone grease to the bottom of the heat dissipation fin 2, and then make the first protrusion 10 at one end of the heat dissipation fin 2 move along the inclined groove 401, until the first protrusion 10 moves to the end of the inclined groove 401, and then drive the other end of the heat dissipation fin 2 to move. At this time, the heat dissipation fin 2 can make a circular motion with the end of the inclined groove 401 as the center of the circle, until the other end of the heat dissipation fin 2 abuts against the first inclined guide surface 901 on the limiting portion 9, and then press and heat dissipation. At this end of the fin 2, the first protrusion 10 can cooperate with the first inclined guide surface 901 to drive the limiting portion 9 to move. At this time, the follower 5 will move along the length direction of the guide portion 601 and compress the first cylindrical spring 8 until the first protrusion 10 moves into the limiting groove 902, thereby realizing the connection between the base 1 and the heat dissipation fin 2, so that after the base 1 is fixed to the motherboard of the laptop computer, the heat dissipation fin 2 can be quickly installed and disassembled, and it is convenient to quickly replace the heat dissipation silicone grease after it deteriorates due to long-term use.
[0028] Among them, a protrusion is formed between the first inclined guide surface 901 and the limiting groove 902, and the protrusion is located at the end of the limiting groove 902 away from the connecting member 4, so that after the first protruding shaft 10 enters the limiting groove 902, the first protruding shaft 10 can be separated from the limiting groove 902 by pulling the heat sink fin 2 upward, thereby realizing the disassembly of the heat sink fin 2.
[0029] Furthermore, since the plane formed by the limiting groove 902 and the end of the inclined groove 401 is parallel to the base 1, when the first protrusion 10 at one end of the heat sink fin 2 is stuck in the inclined groove 401 and the first protrusion 10 at the other end is stuck in the limiting groove 902, the heat sink fin 2 can remain parallel to the base 1, and ensure that the heat sink fin 2 is in contact with the CPU of the notebook computer, thereby achieving a more uniform heat exchange between the notebook CPU and the heat sink fin 2. On the one hand, it can improve the heat dissipation effect on the CPU, and on the other hand, it can make the CPU dissipate heat evenly and avoid local high temperature of the CPU.
[0030] Through the above-mentioned arrangement, the heat sink 2 and the base 1 can be quickly disassembled and installed, and the heat sink grease can be quickly replaced after it deteriorates due to long-term use. On the other hand, when the first protrusion 10 at one end of the heat sink fin 2 is stuck in the inclined groove 401 and the first protrusion 10 at the other end is stuck in the limit groove 902, the heat sink fin 2 can remain parallel to the base 1, and ensure that the heat sink fin 2 is in contact with the CPU of the notebook computer, thereby achieving a more uniform heat exchange between the notebook CPU and the heat sink fin 2, which can improve the heat dissipation effect of the CPU while making the CPU dissipate heat evenly, avoiding local high temperature of the CPU.
[0031] See also Figure 3 , Figure 5 The clamping assembly connects the heat sink fins 2 and the fan 3, and the clamping assembly includes an abutment structure and a locking member 17. The abutment structure cooperates with the locking member 17 to connect the heat sink fins 2 and the fan 3; The abutment structure includes a hysteresis member 11 connected to the end of the fan 3, a hysteresis chamber is formed in the hysteresis member 11, a connecting shaft 12 is installed in the hysteresis chamber, a telescopic plate 14 is slidably installed on the connecting shaft 12, and the telescopic plate 14 is adapted to the locking member 17; The connecting shaft 12 is sleeved with a second cylindrical spring 13, one end of the second cylindrical spring 13 is connected to the telescopic plate 14, and the other end is connected to the inner wall of the hysteresis chamber; The telescopic plate 14 is formed with a hook portion 15 capable of penetrating the inner wall of the hysteresis chamber, and a connecting plate 16 is provided at one end of the telescopic plate 14 away from the second cylindrical spring 13; The locking member 17 is in a “U”-shaped structure, and a second inclined guide surface 1702 is provided at one end of the locking member 17 away from the heat dissipation fins 2 . The hooking portion 15 is adapted to a locking groove 1701 provided on the locking member 17 .
[0032] When the heat sink fins 2 are installed in place, the fan 3 is made parallel to the heat sink fins 2, and the telescopic plate 14 is aligned with the locking member 17. At this time, the fan 3 is pressed downward to move, and the hook portion 15 at the end of the telescopic plate 14 can be retracted into the hysteresis member 11 and compress the second cylindrical spring 13 under the drive of the locking member 17. Subsequently, when the fan 3 abuts against the upper end of the heat sink fin 2, the hook portion 15 can enter the locking groove 1701 when the second cylindrical spring 13 releases its elastic potential energy, thereby fixing the fan 3 and the heat sink fin 2. When the connecting plate 16 is pressed, the telescopic plate 14 and the hook portion 15 can be retracted into the hysteresis member 11 again, and when the fan 3 is pulled upward, the fan 3 can be separated from the heat sink fin 2. Based on the above principle, the fan 3 and the heat sink fin 2 can be quickly replaced and connected.
[0033] Among them, since a second inclined guide surface 1702 is provided on the upper part of the locking member 17, the second inclined guide surface 1702 can guide the hooking portion 15 and facilitate the hooking portion 15 to enter the locking member 17, which has a certain anti-mistake effect and improves the portability of the fan 3 during installation.
[0034] Through the above arrangement, when the hook portion 15 cooperates with the locking groove 1701, the fan 3 and the heat dissipation fin 2 can be quickly connected and disassembled. At the same time, the second inclined guide surface 1702 has a guiding effect on the hook portion 15, thereby improving the portability of the fan 3 during installation and playing a fool-proof role.
[0035] See also Figure 3 , Figure 5~Figure 6 , the speed regulating switch 23 is arranged on the base 1 and is electrically connected to the fan 3; The follower assembly is connected to the heat sink fins 2, and the follower assembly can control the speed regulating switch 23 in real time according to the temperature of the heat sink fins 2. The follower assembly includes a sealed cylinder 18 mounted on the heat sink fins 2 and a copper tube 22 sealed with the heat sink fins 2, and the copper tube 22 is connected to the sealed cylinder 18; A sealing plug 19 is sealingly and slidably installed in the sealing cylinder 18, and a telescopic shaft 20 perpendicular to the sealing plug 19 is provided on the sealing plug 19, and the telescopic shaft 20 penetrates the sealing cylinder 18 and is slidably arranged; The telescopic shaft 20 is sleeved with a third cylindrical spring 21, one end of the third cylindrical spring 21 is connected to the sealing plug 19, and the other end is connected to the inner wall of the sealing cylinder 18; The follower assembly also includes a connecting structure connecting the telescopic shaft 20 and the speed control switch 23, and the connecting structure includes a second convex shaft 24 rotatably installed at one end of the telescopic shaft 20 away from the sealing plug 19 and a deflection rod 25 connected to the speed control switch 23, and the deflection rod 25 is provided with a retardation groove 2501 along its length direction, and the retardation groove 2501 is rollingly matched with the second convex shaft 24.
[0036] The copper tube 22, the sealed cylinder body 18 and the sealing plug 19 can form a closed chamber. At this time, when the CPU temperature of the laptop computer is too high, the temperature of the heat sink 2 will also rise, and the heat sink fin 2 will exchange heat with the copper tube 22, resulting in the temperature inside the copper tube 22 rising, thereby increasing the pressure in the copper tube 22, and then increasing the pressure of the closed chamber formed between the copper tube 22, the sealed cylinder body 18 and the sealing plug 19, and pushing the sealing plug 19 to move. When the sealing plug 19 moves, it can drive the second cam 24 to move away from the sealed cylinder body 18 along the length direction of the telescopic shaft 20, and the second cam 24 cooperates with the retardation groove 2501 to drive the deflection rod 25 to move, thereby changing the position of the deflection rod 25 relative to the speed control switch 23, so that the actual gear position of the speed control switch 23 increases, and drives the fan 3 to increase the rotation speed, improve its heat dissipation power, and ensure that when the CPU temperature of the laptop computer is too high, the heat can be removed in time to avoid CPU damage.
[0037] Through the above arrangement, when the CPU temperature of the laptop computer is too high, the heat sink fins 2 can transfer the temperature to the copper tube 22 to increase the pressure in the copper tube 22. At this time, under the action of the pressure, the sealing plug 19 is actuated, and through the cooperation of the second convex shaft 24 and the retardation groove 2501, the deflection rod 25 is rotated, thereby increasing the actual gear position of the speed control switch 23, and driving the fan 3 to increase the rotation speed, thereby improving its heat dissipation power, ensuring that when the CPU temperature of the laptop computer is too high, the heat can be removed in time to avoid CPU damage.
[0038] As an embodiment of the present invention, a method for using the laptop computer high-efficiency heat dissipation module is also proposed, comprising the following steps: Step 1: Fix the base 1 to the mainboard of the laptop computer with bolts; Step 2: Make the first protruding shaft 10 at one end of the heat sink fin 2 enter the inclined groove 401 in the connecting member 4, and then press the other end of the heat sink fin 2, at which time the other first protruding shaft 10 will cooperate with the elastic locking structure to fix the heat sink fin 2; Step 3: Connect the fan 3 and the heat sink fin 2 through the snap-fit assembly; Step 4: When the CPU temperature of the notebook computer rises while the notebook computer is running, the follow-up component will be activated, thereby changing the actual gear position of the speed control switch 23 and adjusting the heat dissipation power of the fan 3.
[0039] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.
[0040] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.
Claims
1. A notebook computer high-efficiency heat dissipation module, comprising: A base (1), wherein heat dissipation fins (2) are detachably mounted on the base (1); A fan (3) is arranged on a side of the heat dissipation fins (2) away from the base (1); The invention is characterized by comprising: A connecting member (4) is arranged on the base (1); An elastic locking structure is mounted on the base (1), and a first protruding shaft (10) arranged at the end of the heat dissipation fin (2) is adapted to the connecting member (4) and the elastic locking structure; A snap-fit assembly, connecting the heat dissipation fins (2) and the fan (3), the snap-fit assembly comprising an abutment structure and a locking member (17), the abutment structure cooperating with the locking member (17) to enable the heat dissipation fins (2) and the fan (3) to be connected; A speed regulating switch (23), arranged on the base (1) and electrically connected to the fan (3); A follower component is connected to the heat sink fins (2), and the follower component can control the action of the speed regulating switch (23) in real time according to the temperature of the heat sink fins (2).
2. The notebook computer high-efficiency heat dissipation module according to claim 1, characterized in that: The connecting member (4) is provided with an inclined groove (401), the opening of the inclined groove (401) being arranged to be inclined upward, and after the first protruding shaft (10) enters the end of the inclined groove (401), the heat dissipating fin (2) can perform a circular motion with the first protruding shaft (10).
3. The notebook computer high-efficiency heat dissipation module according to claim 2, characterized in that: The elastic locking structure comprises a follower (5) and a bracket (6) arranged on the base (1); the follower (5) is provided with a guide groove (501), and the guide groove (501) is slidably connected to a guide portion (601) arranged on the bracket (6); The elastic locking structure further comprises a support kit arranged between the follower (5) and the bracket (6); A limiting portion (9) arranged at the end of the follower (5) is adapted to fit the first convex shaft (10).
4. The notebook computer high-efficiency heat dissipation module according to claim 3, characterized in that: The support kit comprises a transverse shaft (7) connected to the bracket (6), the transverse shaft (7) being slidably connected to the follower (5), and a first cylindrical spring (8) being sleeved on the transverse shaft (7), one end of the first cylindrical spring (8) being connected to the bracket (6), and the other end of the first cylindrical spring (8) being connected to the follower (5).
5. The notebook computer high-efficiency heat dissipation module according to claim 3, characterized in that: A first inclined guiding surface (901) and a limiting groove (902) are formed on one side of the limiting portion (9) facing the connecting member (4), and a plane formed by the limiting groove (902) and the end of the inclined groove (401) is parallel to the base (1).
6. The notebook computer high-efficiency heat dissipation module according to claim 5, characterized in that: The abutment structure comprises a hysteresis member (11) connected to the end of the fan (3), a hysteresis chamber being formed in the hysteresis member (11), a connecting shaft (12) being installed in the hysteresis chamber, a telescopic plate (14) being slidably installed on the connecting shaft (12), and the telescopic plate (14) being adapted to fit the locking member (17); A second cylindrical spring (13) is sleeved on the connecting shaft (12); one end of the second cylindrical spring (13) is connected to the telescopic plate (14), and the other end is connected to the inner wall of the hysteresis chamber.
7. The notebook computer high-efficiency heat dissipation module according to claim 6, characterized in that: The telescopic plate (14) is formed with a hook portion (15) capable of penetrating the inner wall of the hysteresis chamber; The locking member (17) has a "U"-shaped structure, and a second inclined guide surface (1702) is provided at one end of the locking member (17) away from the heat dissipation fin (2), and the hooking portion (15) is adapted to a locking groove (1701) provided on the locking member (17).
8. The notebook computer high-efficiency heat dissipation module according to claim 1, characterized in that: The follower assembly comprises a sealed cylinder body (18) mounted on the heat dissipation fin (2) and a copper tube (22) sealed and fitted with the heat dissipation fin (2), wherein the copper tube (22) is in communication with the sealed cylinder body (18); A sealing plug (19) is sealingly and slidably mounted in the sealing cylinder (18); a telescopic shaft (20) perpendicular to the sealing plug (19) is disposed on the sealing plug (19); the telescopic shaft (20) penetrates the sealing cylinder (18) and is slidably disposed; A third cylindrical spring (21) is sleeved on the telescopic shaft (20), one end of the third cylindrical spring (21) is connected to the sealing plug (19), and the other end is connected to the inner wall of the sealing cylinder (18); The follower assembly also includes a connection structure connecting the telescopic shaft (20) and the speed regulating switch (23).
9. The notebook computer high-efficiency heat dissipation module according to claim 8, characterized in that: The connection structure comprises a second convex shaft (24) rotatably mounted on an end of the telescopic shaft (20) away from the sealing plug (19), and a deflection rod (25) connected to the speed regulating switch (23); the deflection rod (25) is provided with a retardation groove (2501) along its length direction; the retardation groove (2501) is in rolling engagement with the second convex shaft (24).
Citation Information
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