Wafer position calibration device

Abstract

The embodiment of the present disclosure provides a wafer position calibration device, which includes a carrier, a wafer lifting mechanism, calibration pins and a transmission assembly, wherein the carrier is provided with at least three through holes penetrating the carrier in the vertical direction; the wafer lifting mechanism includes a support rod and a lifting plate, the lifting plate is arranged below the carrier, the lifting plate is connected to the first ends of a plurality of support rods, and the second ends of the plurality of support rods are respectively inserted into the through holes; the support rod and the lifting plate can be lifted and lowered in the vertical direction; a plurality of calibration pins are arranged around the carrier, the height of the first side edge of the first end of the calibration pin close to the center of the carrier is less than the height of the second side edge on the opposite side, forming a calibration slope, and the first side edges of the plurality of calibration pins are located at the edge of the target position of the wafer in the horizontal direction; one end of the transmission assembly contacts the lifting plate, and the other end contacts the second end of the calibration pin. The disclosed scheme dynamically positions and calibrates the wafer position through the liftable calibration slope.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor manufacturing technology, and in particular to a wafer position calibration device. Background Art

[0002] When the wafer is being picked up and placed by the robot in the process chamber or transfer chamber, due to the influence of factors such as the pressure of the surrounding environment, airflow or its own temperature, the wafer may deviate from the center position of the carrier when it leaves the robot and is placed on the carrier by the lifting device. When the wafer is lifted by the lifting device again and sent to the wafer picking position of the robot, if the wafer deviates too much, the robot will not be able to pick up the wafer accurately, which may cause the wafer to fall or break. Summary of the invention

[0003] The embodiments of the present disclosure provide a wafer position calibration device to solve or alleviate one or more technical problems in the prior art.

[0004] As one aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a wafer position calibration device, including:

[0005] A carrier platform, wherein the first surface of the carrier platform is used for placing the wafer, and the carrier platform is provided with at least three through holes penetrating the carrier platform in the vertical direction;

[0006] The wafer lifting mechanism comprises a support rod and a lifting plate, wherein the lifting plate is arranged below the carrier, the lifting plate is connected to the first ends of the plurality of support rods, and the second ends of the plurality of support rods are respectively inserted into the through holes; the support rods and the lifting plate can be lifted and lowered in the vertical direction, and the second ends of the plurality of support rods support and move the wafer when they are higher than the first surface;

[0007] Calibration pins, wherein a plurality of calibration pins are arranged around the carrier platform, a first side edge of a first end of the calibration pin close to the center of the carrier platform has a height smaller than a second side edge on the opposite side, forming a calibration slope, and the first side edges of the plurality of calibration pins are located at the edge of the target position of the wafer in the horizontal direction;

[0008] a transmission assembly, one end of the transmission assembly contacts the lifting plate, and the other end of the transmission assembly contacts the second end of the calibration pin;

[0009] When the lifting plate moves in the vertical direction, the calibration pin is driven by the transmission assembly to move the calibration slope between the upper and lower parts of the first surface to calibrate the horizontal position of the wafer.

[0010] In one embodiment, the lifting plate moves in the same direction as the calibration pin through a transmission assembly;

[0011] When the lifting plate rises in the vertical direction, the transmission assembly raises the calibration slope of the calibration pin to a level higher than the first surface, so as to calibrate the horizontal position of the wafer.

[0012] In one embodiment, the transmission assembly includes a slider limited to move in a horizontal direction, the slider having a first inclined surface abutting against an edge of a lifting plate and a second inclined surface abutting against a second end of a calibration pin, the first inclined surface being used to cause the slider to horizontally displace when subjected to force, and the second inclined surface being used to cause the calibration pin to vertically displace when the slider is horizontally displaced.

[0013] In one embodiment, the transmission assembly includes a return spring, one end of which is connected to the slider, and is used to apply a force to the slider in a direction toward the lifting plate.

[0014] In one embodiment, the lifting plate moves in the opposite direction to the calibration pin via a transmission assembly;

[0015] When the lifting plate descends in the vertical direction, the calibration slope of the calibration pin is raised and raised above the first surface by the transmission assembly to calibrate the horizontal position of the wafer.

[0016] In one embodiment, the transmission assembly includes a swing rod and an articulated seat, the swing rod is connected to the articulated seat, a first section of the swing rod abuts against a lower edge of the lifting plate, and a second section of the swing rod abuts against a second end of the calibration pin;

[0017] When the lifting plate descends in the vertical direction, the first section of the swing rod is pressed down, so that the second section of the swing rod is tilted and the calibration slope of the calibration pin is raised and higher than the first surface, so as to calibrate the horizontal position of the wafer.

[0018] In one embodiment, after the lifting plate removes the downward pressure on the swing arm, the swing arm is reset to the initial position under the action of the gravity of the second section and / or the gravity of the calibration pin, and the height of the calibration slope is lower than the height of the first surface.

[0019] As another aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a thermal processing chamber, including the wafer position calibration device provided by any embodiment of the present disclosure.

[0020] As another aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a transfer chamber, including the wafer position calibration device provided by any embodiment of the present disclosure.

[0021] The technical solution disclosed in the present invention can dynamically locate and calibrate the position of the wafer through a liftable calibration ramp.

[0022] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present disclosure will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments provided according to the present disclosure and should not be regarded as limiting the scope of the present disclosure.

[0024] Figure 1 A schematic structural diagram of a wafer position calibration device according to an embodiment of the present disclosure is shown;

[0025] Figure 2 A schematic diagram showing a state of a wafer position calibration device according to an embodiment of the present disclosure;

[0026] Figure 3 A schematic diagram showing a state of a wafer position calibration device according to an embodiment of the present disclosure;

[0027] Figure 4 A schematic structural diagram of a wafer position calibration device according to another embodiment of the present disclosure is shown;

[0028] Figure 5 A schematic diagram showing a state of a wafer position calibration device according to another embodiment of the present disclosure;

[0029] Figure 6 A schematic diagram showing the states of a wafer position calibration device according to another embodiment of the present disclosure is shown.

[0030] Explanation of the reference numerals: 1. wafer, 2. carrier platform, 3. lifting plate, 4. support rod, 5. calibration pin, 6. transmission block, 7. reset spring, 8. swing rod, 9. hinge seat. DETAILED DESCRIPTION

[0031] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present disclosure. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0032] In the related art, the process of placing the wafer in the heat treatment chamber or the transfer chamber usually includes: the robot grips the wafer and moves it to the top of the carrier table, the lifting mechanism extends from the bottom of the carrier table to support and lift the wafer, the robot withdraws, the lifting mechanism descends to the bottom of the carrier table, and the wafer falls onto the carrier table. The position deviation phenomenon mentioned above will occur in the process of the wafer falling onto the carrier table. The process of removing the wafer usually includes: the lifting mechanism extends from the bottom of the carrier table to support and lift the wafer, the robot moves between the wafer and the carrier table, the lifting mechanism descends to the bottom of the wafer, the wafer falls onto the robot, and the robot grips the wafer and moves to other positions.

[0033] The embodiment of the present disclosure provides a wafer position calibration device, which can be applied to a process chamber or a transfer chamber, and used in conjunction with a wafer carrying platform mechanism and a wafer pick-up and placement robot structure to reposition the wafer position and solve the problem of wafer position deviation during wafer pick-up or wafer placement by the robot.

[0034] Figure 1 Schematic diagram of the structure of the wafer position calibration device provided by the embodiment of the present disclosure. Figure 1 As shown, the device comprises:

[0035] A carrier platform 2, wherein a first surface of the carrier platform 2 is used for placing a wafer 1, and the carrier platform 2 is provided with at least three through holes penetrating the carrier platform 2 in a vertical direction;

[0036] The wafer lifting mechanism includes a support rod 4 and a lifting plate 3. The lifting plate 3 is arranged below the carrier 2. The lifting plate 3 is connected to the first ends of the plurality of support rods 4. The second ends of the plurality of support rods 4 are respectively inserted into the through holes. The support rods 4 and the lifting plate 3 can be lifted and lowered in the vertical direction. When the second ends of the plurality of support rods 4 are higher than the first surface, the wafer 1 is supported and moved.

[0037] Calibration pins 5, multiple calibration pins 5 are arranged around the carrier 2, the height of the first side of the first end of the calibration pin 5 close to the center of the carrier 2 is less than the height of the second side on the opposite side, forming a calibration slope, and the first side of the multiple calibration pins 5 is located at the edge of the target position of the wafer in the horizontal direction;

[0038] A transmission assembly, one end of which contacts the lifting plate 3, and the other end of which contacts the second end of the calibration pin 5;

[0039] When the lifting plate 3 moves in the vertical direction, the calibration pin 5 is driven by the transmission assembly to move the calibration slope between the upper and lower sides of the first surface to calibrate the horizontal position of the wafer.

[0040] In the embodiment of the present disclosure, Figure 1 For reference, define Figure 1 The wafer position calibration device is in a vertical direction from top to bottom, and the first surface of the carrier 2 is the upper surface of the carrier 2 .

[0041] The carrier 2 is used to place the wafer 1. The carrier 2 can be a structure in any wafer 1 processing equipment for placing the wafer 1, such as a rotating disk in a heat treatment chamber or a cold water disk in a transfer chamber. The first surface of the carrier 2 includes a theoretical position of the wafer 1 when it is correctly placed, that is, a target position.

[0042] The wafer lifting mechanism is used to lift or lower the height of the wafer 1 in the vertical direction to cooperate with the robot structure for taking and placing the wafer 1. The lifting plate 3 is connected to the power device and can move in the vertical direction. A plurality of support rods 4 are connected to the lifting plate 3, and the plurality of support rods 4 are lifted and lowered synchronously. Each support rod 4 can be inserted into a corresponding through hole of the carrier 2, thereby passing through the carrier 2 and contacting the wafer 1. The support rod 4 contacts the wafer 1 when the height of the wafer 1 needs to be adjusted, and supports the wafer 1 from the bottom surface of the wafer 1, and is separated from the wafer 1 when the height of the wafer 1 does not need to be adjusted. After being separated from the wafer 1, the support rod 4 can be partially retained in the through hole, or it can be completely withdrawn from the through hole.

[0043] In order to adjust the horizontal position of the wafer from multiple angles, at least four calibration pins 5 can be set on the edge of the carrier 2. The top end of the calibration pin 5, that is, the first end, is provided with a calibration slope, and the height of the first side of each calibration slope close to the center of the carrier 2 is less than the height of the second side on the opposite side, which is equivalent to forming multiple slopes with low inside and high outside around the target position of the wafer. When any part of the wafer 1 exceeds the target position, the exceeding part will contact the calibration slope, and the calibration slope can apply a force toward the center of the carrier 2 to it, pushing it back to the target position or making it slide back to the target position, thereby realizing the calibration of the wafer position.

[0044] The angle of the calibration slope is not limited, and the horizontal distance between the first side edge and the second side edge is not limited either, and can be set according to the possible offset of the wafer 1 .

[0045] It should be noted that the first surface of the carrier 2 can be circular. When the diameter of the carrier 2 is comparable to the diameter of the wafer 1, the calibration pin 5 can be directly set on the circumferential surface of the carrier 2. When the diameter of the carrier 2 is larger than the diameter of the wafer 1, a groove can be opened on the side of the carrier 2, and the calibration pin 5 can be set in the groove, and the groove is at the edge of the target position of the wafer. The first surface of the carrier 2 can also be other shapes. For example, the target position is circumscribed in a square or a hexagon, and the calibration pin 5 can be set at the intersection. If the target position is completely contained within the first surface, the first end of the calibration pin 5 can still be set at the edge of the target position by means of a groove or a through hole.

[0046] The transmission assembly is used to transmit the driving force of the lifting plate 3 to the calibration pin 5, so that the calibration pin 5 moves in the vertical direction. The calibration slope can be under the first surface of the supporting platform 2, or it can be lifted up to the first surface. The switching between the two positions can dynamically adjust the wafer position to prevent the wafer 1 from being tilted between the calibration slope and the supporting platform 2 due to friction and other reasons.

[0047] According to the solution of the embodiment of the present disclosure, the position of the wafer is dynamically repositioned by means of a liftable calibration ramp.

[0048] In one embodiment, the lifting plate 3 moves in the same direction as the calibration pin 5 via a transmission assembly.

[0049] In the process of the lifting plate 3 rising in the vertical direction, the transmission assembly is used to raise the calibration slope of the calibration pin 5 to be higher than the first surface, so as to calibrate the horizontal position of the wafer.

[0050] In the disclosed embodiment, the calibration pin 5 is lifted by the transmission assembly during the lifting process of the lifting plate 3. It can also be understood that the calibration pin 5 is lifted to calibrate the position of the wafer 1 before the wafer 1 leaves the carrier 2. The calibration pin 5 usually needs to adjust the horizontal position of the wafer before the support rod 4 contacts the wafer 1, that is, the stroke required for the calibration bevel to contact the wafer 1 should be less than the distance between the top of the support rod 4 and the wafer 1.

[0051] The transmission assembly is used to make the calibration pin 5 and the lifting plate 3 move in the same direction. For example, the transmission assembly can be a connecting rod directly connecting the calibration pin 5 and the lifting plate 3. The transmission assembly can also be a gear set, and the side of the lifting plate 3 and the lower part of the calibration pin 5 are both provided with linear racks, and the two ends of the gear set are respectively connected to the linear racks of the two to achieve the same direction movement.

[0052] According to the solution of the embodiment of the present disclosure, the calibration pin 5 rises or falls along with the lifting plate 3 , and touches and pushes the portion of the wafer 1 that deviates from the target position through the calibration slope, thereby calibrating the horizontal position of the wafer.

[0053] In one embodiment, the transmission assembly includes a slider limited to move in a horizontal direction, the slider having a first inclined surface abutting against an edge of the lifting plate 3 and a second inclined surface abutting against the second end of the calibration pin 5, the first inclined surface is used to cause the slider to horizontally displace when subjected to force, and the second inclined surface is used to cause the calibration pin 5 to vertically displace when the slider is horizontally displaced.

[0054] In the disclosed embodiment, the slider can be limited to move in the horizontal direction by means of a track or a limit block. During the rising process, the lifting plate 3 pushes the slider outward through the contact of the first inclined surface, and the slider pushes the calibration pin 5 upward through the second inclined surface. After the edge of the lifting plate 3 passes over the first inclined surface, the lifting plate 3 can continue to rise, lifting the wafer 1 to a higher height, while keeping the position of the slider unchanged, so that the height of the calibration inclined surface no longer changes. When the top edge of the lifting plate 3 drops to the height of the slider, the slider can slide inward as the height of the lifting plate 3 continues to drop, and the calibration pin 5 is also lowered. That is, the lifting plate 3 interacts with the slider in part of the stroke, thereby controlling the lifting and lowering of the calibration pin 5.

[0055] According to the solution of the embodiment of the present disclosure, the lifting plate 3 drives the calibration pin 5 to move up and down during the lifting process through the slider, and the structure is simple and exquisite.

[0056] In one embodiment, the transmission assembly includes a return spring 7 , one end of which is connected to the slider, and is used to apply a force to the slider in a direction toward the lifting plate 3 .

[0057] In the disclosed embodiment, the return spring 7 helps the slider to return to the position before being pushed by the lifting plate 3, and also makes the calibration slope return to below the first surface.

[0058] In one example, if Figure 1 As shown, the carrier 2 is responsible for holding the wafer 1. There are 3 or more through holes on the carrier 2, and the wafer 1 support rod 4 can shuttle and lift inside it. The lifting plate 3 is located below the carrier 2, and the lifting plate 3 is fixedly connected to the support rod 4 and has no contact with the carrier 2. The lifting plate 3 support rod 4 lifting plate 3 is connected to the motion mechanism outside the vacuum chamber and can move up and down in the vertical direction. The calibration pin 5 is a wafer position calibration pin 5, which is located around the carrier 2. The present invention has 2 or more calibration pins 5. The upper surface of the calibration pin 5 is an inclined surface. In the process of contacting the edge of the wafer 1 and moving upward, the wafer 1 will slide along the inclined surface. All calibration pins 5 around the carrier 2 are in contact with the wafer 1 at the same time, so that the deviated wafer 1 can return to the center of the carrier 2. The calibration pin 5 and the lifting plate 3 are connected by a wedge-shaped slider (transmission block 6). When the lifting plate 3 moves from bottom to top, the edge of the lifting plate 3 contacts the wedge surface of the slider to push the slider.

[0059] The wedge-shaped surface at the other end of the slider slides relative to the lower surface of the calibration pin 5, raising the calibration pin 5 vertically and making it higher than the upper surface of the carrier 2, thereby achieving the function of wafer position calibration. At this time, the support rod 4 is still below the upper surface of the carrier 2 and has not yet come into contact with the wafer 1. Figure 2 shown.

[0060] The lifting plate 3 continues to move upward, and the support rod 4 begins to contact the wafer 1 and lifts the wafer 1. Figure 3 As shown. Then the wafer 1 is taken away by the robot. The lifting plate 3 starts to fall to the initial position with the support rod 4. At this time, the return spring 7 starts to work and pulls the slider back to the initial position. The calibration pin 5 is also affected by gravity and returns to the initial position.

[0061] In one embodiment, the lifting plate 3 moves in opposite directions to the calibration pin 5 via a transmission assembly.

[0062] When the lifting plate 3 descends in the vertical direction, the calibrating inclined surface of the calibrating pin 5 is raised to be higher than the first surface through the transmission assembly to calibrate the horizontal position of the wafer.

[0063] In the disclosed embodiment, the calibration pins 5 are raised by the transmission assembly during the descending process of the lifting plate 3. That is, after the wafer 1 is placed on the carrier 2, the calibration pins 5 are immediately raised to calibrate the position of the wafer 1.

[0064] The transmission assembly is used to make the calibration pin 5 and the lifting plate 3 move in opposite directions. For example, the transmission assembly can be a gear set. The side of the lifting plate 3 and the bottom of the calibration pin 5 both have linear racks, and the two ends of the gear set are respectively connected to the linear racks of the two to achieve reverse movement.

[0065] According to the solution of the embodiment of the present disclosure, after the wafer 1 is placed on the carrier 2, the position of the wafer is immediately calibrated.

[0066] In one embodiment, the transmission assembly includes a swing rod 8 and an articulated seat 9, the swing rod 8 is connected to the articulated seat 9, the first section of the swing rod 8 abuts against the lower edge of the lifting plate 3, and the second section of the swing rod 8 abuts against the second end of the calibration pin 5;

[0067] When the lifting plate 3 descends in the vertical direction, the first section of the swing rod 8 is pressed down, so that the second section of the swing rod 8 is tilted up and the calibration slope of the calibration pin 5 is raised to be higher than the first surface, so as to calibrate the horizontal position of the wafer.

[0068] In the disclosed embodiment, the middle portion of the swing rod 8 is hingedly connected to the hinge seat 9, the portion of the swing rod 8 close to the lifting plate 3 is the first section, and the portion close to the calibration pin 5 is the second section. After the lifting plate 3 is separated from the wafer 1, it continues to descend and contacts the first section of the swing rod 8. As the lifting plate 3 continues to descend, the first section of the swing rod 8 rotates downward, and the second section rotates upward in the opposite direction, driving the calibration pin 5 to rise, so that the calibration bevel adjusts the horizontal position of the wafer. After the calibration is completed, the lifting plate 3 rises again for a distance, so that the calibration bevel drops below the first surface.

[0069] According to the solution of the embodiment of the present disclosure, the lifting plate 3 and the calibration pin 5 are linked by a swing rod 8 with opposite rotations at both ends, so that the horizontal position of the wafer 1 can be calibrated immediately after it is placed on the carrier 2.

[0070] In one embodiment, after the lifting plate 3 removes the downward pressure on the swing rod 8, the swing rod 8 is reset to the initial position under the action of the gravity of the second section and / or the gravity of the calibration pin 5, and the height of the calibration slope is lower than the height of the first surface.

[0071] In the disclosed embodiment, by adjusting the lengths of the first section and the second section of the swing rod 8, the center of gravity of the swing rod 8 can be changed, for example, the center of gravity is placed on the second section, so that after the lifting plate 3 removes the downward pressure on the swing rod 8, the swing rod 8 can be reset by gravity by itself, so that the end of the second section descends. Considering that the weight of the calibration pin 5 is also applied to the swing rod 8, the swing rod 8 can be reset to the initial position under the action of the gravity of the second section, the gravity of the calibration pin 5, or the combined gravity of the second section and the calibration pin 5.

[0072] According to the solution of the embodiment of the present disclosure, the swing rod 8 can reset itself by gravity after the lifting plate 3 removes the downward force.

[0073] In one example, if Figure 4 As shown, the functions of the wafer 1, the carrier 2, the lifting plate 3, the support rod 4, and the calibration pin 5 are exactly the same as the examples above. The difference is that the transmission assembly includes a swing rod 8 and a hinge seat 9. The swing rod 8 can swing left and right with the hinge shaft connected to the hinge seat 9 as the rotation axis. The two ends of the swing rod 8 are in contact with the calibration pin 5 and the lifting plate 3 respectively, but there is no fixed connection. When the lifting plate 3 moves vertically downward, the end of the swing rod 8 that contacts the calibration pin 5 flips toward the center of the carrier 2, driving the calibration pin 5 to move vertically upward and higher than the upper surface of the carrier 2, so that the inclined surface at the top of the calibration pin 5 is used to push the wafer 1 that deviates from the target position, thereby realizing the function of wafer position calibration, as shown in FIG. Figures 4 to 5 Then, when the wafer 1 needs to be taken away, the lifting plate 3 moves vertically upward, the support rod 4 contacts the wafer 1, and the wafer 1 is lifted, as shown in FIG. Figure 6 As shown, the calibration pin 5 and the swing rod 8 return to their initial positions under the action of gravity.

[0074] As another aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a thermal processing chamber, including the wafer position calibration device provided by any embodiment of the present disclosure.

[0075] The transmission assembly can be arranged on one inner wall of the chamber, for example, the slider and the hinge seat 9 can be connected to the inner wall of the chamber on the side of the lifting plate 3, one end of the return spring 7 is connected to the slider, and the other end can also be connected to an inner wall of the chamber. In one example, a limit block can be arranged on one side of the second end of the swing rod 8 to limit the downward rotation angle of the second end of the swing rod 8.

[0076] Other structures of the heat treatment chamber in the above embodiment may adopt various technical solutions known to ordinary technicians in this field now and in the future, and will not be described in detail here.

[0077] As another aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a transfer chamber, including the wafer position calibration device provided by any embodiment of the present disclosure.

[0078] The other structures of the transmission chamber in the above-mentioned embodiment can adopt various technical solutions known to ordinary technicians in this field now and in the future, and will not be described in detail here.

[0079] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0080] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0081] In the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0082] In the present disclosure, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being “above”, “above”, and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0083] The disclosure above provides many different embodiments or examples to realize different structures of the present disclosure. In order to simplify the disclosure of the present disclosure, the components and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present disclosure. In addition, the present disclosure can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0084] The above is only a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A wafer position calibration device, comprising: A carrier platform (2), wherein a first surface of the carrier platform (2) is used for placing a wafer (1), and the carrier platform (2) is provided with at least three through holes penetrating the carrier platform (2) in a vertical direction; A wafer lifting mechanism, comprising a support rod (4) and a lifting plate (3), wherein the lifting plate (3) is arranged below the carrier platform (2), the lifting plate (3) is connected to the first ends of a plurality of support rods (4), and the second ends of the plurality of support rods (4) are respectively inserted into the through holes; the support rods (4) and the lifting plate (3) can be lifted and lowered in a vertical direction, and the second ends of the plurality of support rods (4) support and move the wafer (1) when they are higher than the first surface; Calibration pins (5), wherein a plurality of calibration pins (5) are arranged around the carrier platform (2), the height of a first side edge of a first end of the calibration pin (5) close to the center of the carrier platform (2) is less than the height of a second side edge on the opposite side, forming a calibration slope, and the first side edges of the plurality of calibration pins (5) are located at the edge of the target position of the wafer in the horizontal direction; a transmission assembly, the transmission assembly being arranged on the inner wall of the chamber, one end of the transmission assembly being in contact with the lifting plate (3), and the other end being in contact with the second end of the calibration pin (5); the transmission assembly being used to transmit the driving force of the lifting plate (3) to the calibration pin (5), so that the calibration pin (5) moves in a vertical direction; When the lifting plate (3) moves in the vertical direction, the transmission assembly drives the calibration pin (5) so that the calibration slope moves between above and below the first surface to calibrate the horizontal position of the wafer.

2. The wafer position calibration device according to claim 1, wherein: The lifting plate (3) moves in the same direction as the calibration pin (5) through the transmission assembly; Wherein, during the process of the lifting plate (3) rising in the vertical direction, the transmission assembly raises the calibration slope of the calibration pin (5) to a level higher than the first surface, so as to calibrate the horizontal position of the wafer.

3. The wafer position calibration device according to claim 2, wherein: The transmission assembly comprises a slider limited to move in a horizontal direction, the slider having a first inclined surface abutting against an edge of the lifting plate (3) and a second inclined surface abutting against a second end of the calibration pin (5), the first inclined surface being used to cause the slider to undergo horizontal displacement when a force is applied, and the second inclined surface being used to cause the calibration pin (5) to undergo vertical displacement when the slider undergoes horizontal displacement.

4. The wafer position calibration device according to claim 3, wherein: The transmission assembly comprises a return spring (7), one end of the return spring (7) being connected to the slider and used for applying a force to the slider in a direction towards the lifting plate (3).

5. The wafer position calibration device according to claim 1, wherein: The lifting plate (3) moves in opposite directions to the calibration pin (5) through the transmission assembly; Wherein, when the lifting plate (3) descends in the vertical direction, the transmission assembly raises the calibration slope of the calibration pin (5) to a level higher than the first surface, so as to calibrate the horizontal position of the wafer.

6. The wafer position calibration device according to claim 5, wherein: The transmission assembly comprises a swing rod (8) and an articulated seat (9), the swing rod (8) being connected to the articulated seat (9), the first section of the swing rod (8) abutting against the lower edge of the lifting plate (3), and the second section of the swing rod (8) abutting against the second end of the calibration pin (5); When the lifting plate (3) descends in the vertical direction, the first section of the swing rod (8) is pressed down, so that the second section of the swing rod (8) is tilted up and the calibration slope of the calibration pin (5) is raised to be higher than the first surface, so as to calibrate the horizontal position of the wafer.

7. The wafer position calibration device according to claim 6, wherein: After the lifting plate (3) removes the downward pressure on the swing rod (8), the swing rod (8) is reset to the initial position under the action of the gravity of the second section and / or the gravity of the calibration pin (5), and the height of the calibration slope is lower than the height of the first surface.

8. A thermal processing chamber, comprising the wafer position calibration device according to any one of claims 1 to 7.

9. A transfer chamber, comprising the wafer position calibration device according to any one of claims 1 to 7.

Images