Camera modules and electronic equipment

Abstract

The present invention relates to a camera module and an electronic device, which can effectively reduce the shoulder height of the module and meet the miniaturization requirements of the camera module. The camera module includes: a photosensitive component, including a supporting substrate, a photosensitive chip, and a molded part injection-molded on the supporting substrate; and a lens component, including an insert base and an optical lens disposed on the insert base and located in the photosensitive path of the photosensitive chip; the insert base includes a base body and an insert body embedded in the base body, the base body is fixed to the supporting substrate and defines a cavity together with the supporting substrate; wherein the molded part includes a molded base located in the cavity and a first protrusion extending outward from the molded base to the outside of the cavity, and the insert body and the first protrusion are staggered with each other in the circumferential direction of the base body.

Description

Technical Field

[0001] The present invention relates to the field of imaging technology, and in particular to a camera module and electronic equipment. Background Art

[0002] With the advancement and development of science and technology, electronic devices with camera functions are increasingly moving towards high performance and lightweight. As one of the core configurations of electronic products, the camera module must be adaptively adjusted in terms of performance and size. In other words, in this round of technological innovation, each component in the camera module needs to make corresponding changes in performance and size.

[0003] As an indispensable component of high-pixel camera modules, motors are used to drive the lens to move in multiple directions during the operation of the camera module to achieve the optical autofocus function (hereinafter referred to as AF function; English AutoFocus; Chinese: auto focus) and optical image stabilization function (hereinafter referred to as OIS function; English: Optical Image Stabilization; Chinese: optical image stabilization) during shooting. As electronic devices such as mobile phones have higher and higher requirements for the imaging quality of camera modules, the size and weight of lenses are getting larger and larger, and the driving force requirements for motors are also getting higher and higher. Not only does the volume occupied by the motor increase accordingly with the increase of the lens, but a larger base is also required to support the motor, resulting in the camera module being unable to meet the miniaturization requirements.

[0004] In order to reduce the overall size of the camera module, existing camera modules usually embed inserts such as steel sheets or conductive sheets inside the base, so as to ensure that the thinner base can still have sufficient strength to stably support the motor when the steel sheet is embedded, or to ensure that the photosensitive component is electrically connected to the motor when the conductive sheet is embedded, so as to achieve compact wiring of the motor. However, existing camera modules usually fix the base above the package of the photosensitive component, resulting in a relatively large shoulder height of the camera module, which is difficult to meet the miniaturization requirements of the camera module. Summary of the invention

[0005] One advantage of the present invention is that it provides a camera module and an electronic device, which can effectively reduce the shoulder height of the module and meet the miniaturization requirements of the camera module.

[0006] Another advantage of the present invention is to provide a camera module and electronic device, wherein in order to achieve the above-mentioned purpose, no expensive materials or complex structures are required in the present invention. Therefore, the present invention successfully and effectively provides a solution, not only providing a simple camera module and electronic device, but also increasing the practicality and reliability of the camera module and electronic device.

[0007] In order to achieve at least one of the above advantages or other advantages and purposes of the present invention, the present invention provides a camera module, including:

[0008] A photosensitive component, comprising a supporting substrate, a photosensitive chip, and a molded part injection-molded on the supporting substrate; and

[0009] A lens assembly, comprising an insert base and an optical lens disposed on the insert base and located in the light sensing path of the light sensing chip; the insert base comprises a base body and an insert body embedded in the base body, the base body is fixed to the support substrate and defines a cavity together with the support substrate;

[0010] The molded part includes a molded base located in the cavity and a first protrusion extending outward from the molded base to outside the cavity, and the insert body and the first protrusion are staggered with each other in the circumferential direction of the base body.

[0011] According to one embodiment of the present application, the supporting substrate includes a photosensitive circuit board electrically connected to the photosensitive chip; the lens assembly also includes a lens circuit board arranged on the side wall of the base body, wherein the lens circuit board is provided with pins electrically connected to the photosensitive circuit board, and the pins and the first protrusion are located on different sides of the base body.

[0012] According to an embodiment of the present application, the first protrusion and the pin are respectively located at the front and rear sides of the base body.

[0013] According to one embodiment of the present application, the lens assembly includes a magnetic part connected to the optical lens and a coil disposed on the lens circuit board and arranged corresponding to the magnetic part, and the coil is located on a side wall of the base body that is different from the side where the first protrusion is located.

[0014] According to an embodiment of the present application, the lens circuit board is provided with the coils on the left and right side walls of the base body, respectively.

[0015] According to one embodiment of the present application, the lens circuit board is located on the inner surface and / or outer surface of the base body, the insert base has an accommodating notch opened on the side wall of the base body for accommodating the coil, and the insert body is partially embedded in the interior of the base body and is located below the accommodating notch.

[0016] According to one embodiment of the present application, an upper surface of the first protrusion is lower than an upper surface of the molding base.

[0017] According to one embodiment of the present application, a step portion is provided on the outer side wall of the base body, and the step surface of the step portion is higher than the insert body; wherein the lens assembly also includes a shell covering the base body, and the lower edge of the shell is located above the step surface of the step portion.

[0018] According to one embodiment of the present application, the molded part further includes a second protrusion extending from the molding base to outside the cavity.

[0019] According to an embodiment of the present application, the first convex portion and the second convex portion are respectively arranged adjacent to diagonals of the insert base.

[0020] According to an embodiment of the present application, the second protrusion and the pin are staggered with each other in the circumferential direction of the base body.

[0021] According to one embodiment of the present application, the molded part further includes a second protrusion extending from the molding base to outside the cavity.

[0022] According to an embodiment of the present application, the support substrate is provided with a groove matching the second convex portion, and the second convex portion is filled in the groove.

[0023] According to one embodiment of the present application, a cross-sectional area of ​​the first protrusion is greater than a cross-sectional area of ​​the second protrusion.

[0024] According to one embodiment of the present application, the insert base further includes a third protrusion protruding inward from the inner surface of the rear side wall of the base body.

[0025] According to one embodiment of the present application, the inner side wall of the lens assembly is provided with an inwardly protruding convex component at at least one corner, and the molded part is provided with an avoidance notch group at at least one corner corresponding to the convex component on the molding base.

[0026] According to one embodiment of the present application, the protrusion assembly includes a fourth protrusion protruding inward from the front corner of the lens assembly and a fifth protrusion protruding inward from the rear corner of the lens assembly; the avoidance notch group includes a first avoidance notch located at the front corner of the molding base and avoiding the fourth protrusion and a second avoidance notch located at the rear corner of the molding base and avoiding the fifth protrusion; the second avoidance notch is larger than the first avoidance notch.

[0027] According to one embodiment of the present application, the insert base has a accommodating area recessed inward from the outer surface of the rear side wall of the base body, wherein the lens assembly also includes a lens circuit board arranged on the side wall of the base body and provided with pins, and the pins on the lens circuit board are located within the accommodating area.

[0028] According to one embodiment of the present application, the lens assembly also includes a buffer installed on the insert body; wherein the buffer is at least partially located within the cavity and below the movable part of the lens assembly, and the buffer is located on the outside of the molding base.

[0029] According to another aspect of the present application, the present application further provides an electronic device, including:

[0030] The device itself; and

[0031] Any of the camera modules described above, wherein the camera module is assembled on the device body. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a three-dimensional schematic diagram of a camera module according to an embodiment of the present invention;

[0033] Figure 2 A schematic top view of a camera module according to the above embodiment of the present invention is shown;

[0034] Figure 3 Shows Figure 2 AA cross-sectional view of the camera module shown;

[0035] Figure 4 Shows Figure 2 The BB cross-sectional view of the camera module shown;

[0036] Figure 5 Shows Figure 2 The CC cross-sectional view of the camera module shown;

[0037] Figure 6 A side view schematic diagram of a camera module according to the above embodiment of the present invention is shown;

[0038] Figure 7 Shows Figure 6 DD cross-sectional view of the camera module shown;

[0039] Figure 8 Shows Figure 6 EE cross-sectional view of the camera module shown;

[0040] Fig. 9 A schematic structural diagram of the camera module according to the above embodiment of the present invention without the yoke is shown;

[0041] Fig.10 A schematic diagram of the matching structure of the photosensitive component and the insert base in the camera module according to the above embodiment of the present invention is shown;

[0042] Fig.11 A three-dimensional schematic diagram of a photosensitive component in a camera module according to the above embodiment of the present invention is shown;

[0043] Fig.12 An exploded schematic diagram of the photosensitive component according to the above embodiment of the present application is shown.

[0044] Main component symbol description: 1. Camera module; 10. Photosensitive component; 11. Support substrate; 110. Groove; 111. Photosensitive circuit board; 112. Reinforcement plate; 1121. First support portion; 1122. Second support portion; 12. Photosensitive chip; 13. Molding; 130. Avoidance gap group; 1301. First avoidance gap; 1302. Second avoidance gap; 131. Molding base; 132. First convex portion; 133. Second convex portion; 14. Color filter; 20. Insert base; 201. Accommodating gap; 202. Step portion; 21. Base body; 210, first half groove; 22, insert body; 221, rear embedding arm; 222, left embedding arm; 223, right embedding arm; 224, support arm; 225, partial embedding arm; 23, third protrusion; 24, accommodating area; 25, buffer; 30, optical lens; 40, motor assembly; 41, lens circuit board; 42, pin; 43, magnetic part; 44, coil; 45, focus bracket; 450, second half groove; 46, anti-shake bracket; 47, ball; 50, shell; 60, protrusion assembly; 61, fourth protrusion; 62, fifth protrusion.

[0045] The above description of the main component symbols is combined with the accompanying drawings and specific implementation methods to further illustrate the present invention in detail. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] It should be noted that when a component is referred to as being "mounted on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "set on" another component, it may be directly set on the other component or there may be a central component at the same time. When a component is considered to be "fixed to" another component, it may be directly fixed on the other component or there may be a central component at the same time.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "or / and" used herein includes any and all combinations of one or more of the related listed items.

[0049] Considering that the existing camera module fixes the base above the molded part of the photosensitive component, the shoulder height of the camera module is still relatively large, which makes it difficult to meet the miniaturization requirements of the camera module. Therefore, the present application proposes a camera module and an electronic device, which can effectively reduce the module shoulder height to meet the miniaturization requirements of the camera module.

[0050] Specifically, refer to the attached Figure 1 As shown, an embodiment of the present application provides an electronic device, which may include a device body and a camera module 1 mounted on the device body, so as to collect image information for the device body through the camera module 1. It is understandable that the electronic device mentioned in the present application may be implemented as, but not limited to, a smart phone, a smart watch, a tablet or a notebook, etc.

[0051] More specifically, if Figures 1 to 12 As shown, the camera module 1 may include a photosensitive component 10 and a lens component. The photosensitive component 10 includes a supporting substrate 11, a photosensitive chip 12, and a molded part 13 injection-molded on the supporting substrate 11. The lens component includes an insert base 20 and an optical lens 30 disposed on the insert base 20 and located in the photosensitive path of the photosensitive chip 12; the insert base 20 includes a base body 21 and an insert body 22 embedded in the base body 21, and the base body 21 is fixed to the supporting substrate 11 and defines a cavity together with the supporting substrate 11. In particular, the molded part 13 includes a molded base 131 located in the cavity and a first protrusion 132 extending outward from the molded base 131 to the outside of the cavity, and the insert body 22 and the first protrusion 132 are staggered with each other in the circumferential direction of the base body 21.

[0052] It is worth noting that in actual production, the molded part 13 is usually first batch-formed into panels and then cut into single panels; at the same time, since the molded base 131 of the molded part 13 is usually located inside the periphery of the support substrate 11, and the cutting must be done along the periphery of the support substrate 11, the molded part 13 must have an extended first convex portion 132, so that the cutting can be done at the edge of the first convex portion 132. However, on the one hand, if Figures 3 to 5As shown, the base body 21 of the insert base 20 in the camera module 1 of the present application is located at the periphery of the molding base 131 of the molding 13 and is directly fixed to the support substrate 11, that is, the lens assembly is installed on the support substrate 11 which is lower than the molding 13, so that the shoulder height of the camera module 1 of the present application can be reduced; on the other hand, as Figure 4 and Figure 8 As shown, the first protrusion 132 of the molded part 13 and the insert body 22 of the insert base 20 are staggered in the circumferential direction, which can avoid the interference between the first protrusion 132 and the insert body 22 while reducing the restriction on the height of the first protrusion 132 caused by the embedding of the insert body 22, allowing the insert body 22 and the first protrusion 132 to overlap with each other in the height direction of the camera module 1, so as to further reduce the module shoulder height.

[0053] In addition, in some embodiments of the present application, Figures 1 to 12 As shown, the supporting substrate 11 may include a photosensitive circuit board 111 electrically connected to the photosensitive chip 12. Specifically, the front side of the photosensitive chip 12 has a photosensitive area and a non-photosensitive area located outside the photosensitive area, and the non-photosensitive area of ​​the photosensitive chip 12 is electrically connected to the photosensitive circuit board 111. The manner in which the non-photosensitive area of ​​the photosensitive chip 12 is electrically connected to the photosensitive circuit board 111 may be any of the following: the photosensitive chip 12 is located above the photosensitive circuit board 111, and the non-photosensitive area of ​​the photosensitive chip 12 is electrically connected to the front side of the photosensitive circuit board 111 (such as by gold wire), which is similar to a traditional COB packaging structure; or, Figure 4 As shown, the photosensitive circuit board 111 is provided with a through hole, the photosensitive chip 12 is accommodated in the through hole of the photosensitive circuit board 111, and the non-photosensitive area of ​​the photosensitive chip 12 is electrically connected to the front side of the photosensitive circuit board 111 (such as by gold wire), which is similar to a chip-sinking packaging structure; the photosensitive chip 12 is located below the photosensitive circuit board 111, and the non-photosensitive area of ​​the photosensitive chip 12 is electrically connected to the back side of the photosensitive circuit board 111 (such as by welding or conductive adhesive bonding), which is similar to a chip flip-chip structure.

[0054] In one embodiment, the installation base of the photosensitive chip 12 is the photosensitive circuit board 111, such as the photosensitive chip 12 is mounted on the front side of the photosensitive circuit board 111, or the photosensitive chip 12 is flipped on the back side of the photosensitive circuit board 111; in another embodiment, the installation base of the photosensitive chip 12 is the molding 13, such as the molding 13 is arranged on the front side of the photosensitive circuit board 111, the photosensitive chip 12 is mounted on the front side of the molding 13, or the molding 13 is arranged in the through hole of the photosensitive circuit board 111, the photosensitive chip 12 is mounted on the front side of the molding 13, or the photosensitive chip 12 is accommodated in the through hole of the photosensitive circuit board 111, the molding 13 is arranged on the back side of the photosensitive circuit board 111, and the photosensitive chip 12 is mounted on the front side of the molding 13. In other embodiments, the supporting substrate 11 may include a reinforcing plate 112, which may be disposed on the front or back side of the photosensitive circuit board 111, and the photosensitive chip 12 is mounted on the reinforcing plate 112. Alternatively, the reinforcing plate 112 may also be disposed on the surface of the molded part 13 (such as assembled by mounting or embedding), and the photosensitive chip 12 is mounted on the reinforcing plate 112.

[0055] Exemplarily, the molding base 131 of the molding 13 may be frame-shaped and encapsulated at the electrical connection between the photosensitive circuit board 111 and the photosensitive chip 12, so as to protect the electrical connection between the photosensitive circuit board 111 and the photosensitive chip 12. Generally, in order to reduce the circumferential size of the photosensitive chip 12, the electrical connection structure electrically connected to the photosensitive circuit board 111 in the non-photosensitive area of ​​the photosensitive chip 12 is distributed on part of the side of the photosensitive chip 12, such as one side or both sides in the length direction of the photosensitive area, so that the geometric center of the non-photosensitive area of ​​the photosensitive chip 12 deviates from the geometric center of the photosensitive chip 12, and the first convex portion 132 of the molding 13 can adjust the geometric center of the molding 13, so as to improve the stress distribution of the molding 13 on the photosensitive chip 12 during solidification shrinkage, so as to reduce the warping of the photosensitive chip 12. It can be understood that the molding base 131 of the molding part 13 mentioned in the present application can be but not limited to a frame-like structure surrounding the photosensitive chip 12, and can also be a strip-like structure, such as there are two groups of molding bases 131, which are arranged at intervals along the length direction or width direction of the photosensitive chip 12.

[0056] In order to further reduce the overall height of the camera module 1, the photosensitive chip 12 is arranged to be sunken relative to the support substrate 11, so that the back of the photosensitive chip 12 is lower than the top surface of the support substrate 11, so as to utilize the overlap of the support substrate 11 and the photosensitive chip 12 in the optical axis direction to thin the photosensitive component 10. It can be understood that the front of the photosensitive chip 12 has a photosensitive area and a non-photosensitive area located outside the photosensitive area; the molding base 131 of the molding 13 covers the non-photosensitive area of ​​the photosensitive chip 12 and a part of the support substrate 11, and fills the gap between the support substrate 11 and the photosensitive chip 12, thereby encapsulating the electrical connection structure between the photosensitive chip 12 and the support substrate 11.

[0057] Furthermore, if Figure 3 , Figure 4 , Fig.11 as well as Fig.12 As shown, the reinforcing plate 112 includes a first supporting portion 1121 for mounting the photosensitive chip 12 and a second supporting portion 1122 located around the first supporting portion 1121 and mounted on the photosensitive circuit board 111, so as to strengthen the overall structural strength of the photosensitive component 10 through the reinforcing plate 112, so that the photosensitive circuit board 111 is not easy to warp, and the photosensitive chip 12 is prevented from breaking. It can be understood that the reinforcing plate 112 mentioned in the present application can be implemented as a steel plate but is not limited to it.

[0058] Furthermore, if Figure 4 and Fig.12 As shown, the first support portion 1121 protrudes upward from the second support portion 1122, that is, the upper surface of the second support portion 1122 is lower than the upper surface of the first support portion 1121, so as to ensure that the camera module 1 has the characteristics of low shoulder height while supporting the photosensitive chip 12 to partially protrude from the top surface of the photosensitive circuit board 111 to avoid blocking the photosensitive field of view of the photosensitive chip 12.

[0059] Furthermore, if Figure 3 , Figure 4 , Fig.11 as well as Fig.12 As shown, the photosensitive component 10 may further include a color filter 14, which is bonded and fixed to the molding base 131 of the molding 13 to form a sealed space for accommodating the photosensitive chip 12, which is beneficial to protecting the photosensitive area of ​​the photosensitive chip 12 and avoiding contamination.

[0060] In addition, in other examples of the present application, the supporting substrate 11 may not include a circuit board electrically connected to the photosensitive chip 12, but only include a steel plate for support. In this case, the photosensitive chip 12 can be designed with a BGA (Ball Grid Array) to connect to an external power supply board.

[0061] Alternatively, if Figure 1 and Figure 8 As shown, the lens assembly also includes a lens circuit board 41 disposed on the side wall of the base body 21 and provided with a pin 42, and the pin 42 and the first protrusion 132 are located on different sides of the base body 21. In this way, the first protrusion 132 in the camera module 1 of the present application can avoid the side where the pin 42 is located, so that without increasing the external dimensions of the base body 21, more space is reserved to install the lens circuit board 41 with a larger size, so as to adapt to the requirements of the lens assembly for complex circuits. It is understandable that the pin 42 mentioned in the present application can be used to electrically connect the lens circuit board 41 with the photosensitive circuit board 111. The lens circuit board 41 is a power supply circuit board of the lens assembly. When the lens assembly includes an actuator, the actuator is electrically connected to the lens circuit board 41. Among them, the actuator can be an actuator for moving and / or rotating the optical lens 30, or an actuator for a variable aperture or an adjustable lens.

[0062] Preferably, if Figure 1 and Figure 8 As shown, the first protrusion 132 and the pin 42 are respectively located on the front and rear sides of the photosensitive chip 12, so as to reserve a larger space for installing the lens circuit board 41 with a complex circuit. It is understandable that the photosensitive circuit board 111 may include a hard board electrically connected to the photosensitive chip 12 and bonded and fixed to the insert base 20, a soft board electrically connected to the hard board, and a connector fixed to the soft board and used to be electrically connected to the power supply structure. In this way, the first protrusion 132 can extend integrally from the front side surface of the molded base 131 to the front side edge of the hard board; the soft board extends backward from the rear side edge of the hard board, and the pin 42 is located on the rear side of the lens circuit board 41.

[0063] Alternatively, if Fig. 9 As shown, the lens assembly further includes a magnetic member 43 connected to the optical lens 30 and a coil 44 disposed on the lens circuit board 41 and arranged corresponding to the magnetic member 43, and the coil 44 is located on a side wall of the base body 21 that is different from the side where the first protrusion 132 is located. Preferably, the lens circuit board 41 is provided with the coil 44 on the left and right side walls of the base body 21, respectively, so as to better drive the optical lens 30 to move relative to the photosensitive chip 12.

[0064] It is worth noting that Figure 1 and Fig. 9As shown, the lens circuit board 41, pins 42, magnetic parts 43 and coils 44 mentioned in the present application together constitute a motor assembly 40 to drive the optical lens 30 to move relative to the photosensitive chip 12 to achieve the autofocus function and / or optical image stabilization function of the camera module 1. It is understandable that in other examples of the present application, the lens assembly may not include the motor assembly 40, and the optical lens 30 may be directly fixed to the insert base 20, so that the camera module 1 is implemented as a fixed focus module.

[0065] In addition, in order to realize the auto focus function and optical image stabilization function of the camera module 1 at the same time, Fig. 9 As shown, the motor assembly 40 of the lens assembly of the present application can also include a focus bracket 45 movably arranged in the base body 21 and an anti-shake bracket 46 movably arranged in the focus bracket 45 and fixedly connected to the optical lens 30; at the same time, a coil 44 located on the left side wall of the base body 21 and electrically connected to the lens circuit board 41 serves as a focus coil; a magnetic part 43 fixedly arranged on the focus bracket 45 and corresponding to the focus coil serves as a focus magnetic part; a pair of coils 44 respectively located on the rear side wall and the right side wall of the base body 21 and electrically connected to the lens circuit board 41 serve as anti-shake coils; a pair of magnetic parts 43 fixedly arranged on the anti-shake bracket 46 and respectively corresponding to the two anti-shake coils serve as anti-shake magnetic parts. In this way, when the focus coil is energized, a Lorentz force is generated between the focus coil and the focus magnetic part to drive the focus bracket 45 to move along the optical axis, and drive the anti-shake bracket 46 together with the optical lens 30 to move along the optical axis (i.e., the Z-axis direction), thereby realizing the automatic focusing function of the camera module 1; when the anti-shake coil located on the right side wall is energized, the anti-shake coil located on the right side wall will generate a Lorentz force with the corresponding anti-shake magnetic part to drive the anti-shake bracket 46 to move in the left and right direction, and drive the optical lens 30 to move in the left and right direction (i.e., the X-axis direction), thereby realizing the X-axis anti-shake function of the camera module 1; when the anti-shake coil located on the rear side wall is energized, the anti-shake coil located on the rear side wall will generate a Lorentz force with the corresponding anti-shake magnetic part to drive the anti-shake bracket 46 to move in the front-to-back direction, and drive the optical lens 30 to move in the front-to-back direction (i.e., the Y-axis direction), thereby realizing the Y-axis anti-shake function of the camera module 1.

[0066] It is understandable that the magnetic members mentioned in the present application can be implemented as magnets or magnets but are not limited to them. In addition, a ball bearing can be arranged between the focus bracket 45 and the anti-shake bracket 46 to movably support the anti-shake bracket 46 on the focus bracket 45, so as to meet the movable space required for optical image stabilization.

[0067] Alternatively, if Figures 7 to 9As shown, the lens circuit board 41 is located on the outer surface of the base body 21, and the insert base 20 has an accommodating notch 201 opened on the side wall of the base body 21 for accommodating the coil 44, so as to make full use of the side wall space of the base body 21 to install the coil, which helps to further reduce the circumferential size of the camera module 1. It can be understood that in other examples of the present application, the lens circuit board 41 can also be located on the inner surface of the base body 21, and this application will not repeat it.

[0068] For example, the accommodating notch 201 opened on the left side wall of the base body 21 can accommodate the focus coil; the accommodating notch 201 opened on the right side wall of the base body 21 can accommodate the anti-shake coil; at the same time, the first protrusion 132 located on the front side of the photosensitive chip 12 passes through the front side wall of the base body 21, which can avoid the focus coil and the anti-shake coil, so as to reserve more installation space for the coils on the left and right sides of the base body 21.

[0069] Alternatively, if Figure 7 and Fig. 9 As shown, the lens circuit board 41 is covered on the left side wall, rear side wall and right side wall of the base body 21 , and the pin 42 is located on the rear side of the lens circuit board 41 so as to be electrically connected to the hard board to realize power supply to the motor assembly 40 .

[0070] It is worth noting that although the openings for accommodating the coils on the left and right walls of the base body 21 can realize the miniaturization of the motor, the structures of the left and right walls of the base body 21 will become relatively weak. Figures 6 to 8 As shown, the insert body 22 of the insert base 20 is partially embedded in the interior of the base body 21 and is located below the accommodating notch 201, so that the insert body 22 is located below the coil 44, so as to enhance the structural strength of the left and right walls of the base body 21. It can be understood that since the insert body 22 needs to reserve as much installation space as possible for the coil, the embedded height of the insert body 22 on the base body 21 is designed to be relatively low. If the first protrusion 132 is set below the insert body 22, the module shoulder height will increase, making it difficult to achieve a low shoulder height module; therefore, the camera module 1 of the present application sets the first protrusion 132 on the front side of the base body 21 to avoid the insert body 22 and the coil, which helps to reserve more installation space for the insert body 22 and the coil on the left and right walls of the base body 21.

[0071] In addition, the insert body 22 can be implemented as a conductive sheet such as a copper sheet, but is not limited to it. It can be understood that in other embodiments of the present application, the insert body 22 can be used as a conductive member in addition to being a reinforcement member of the base body 21, such as a conductive member of a moving coil motor, that is, the positions of the coil and the magnetic member are interchanged, and a spring sheet is provided between the bracket and the base, so that the lens circuit board 41 and the coil are connected together through the spring sheet and the insert body 22 embedded in the base body 21.

[0072] It should be noted that in the above embodiments of the present application, Figure 4 As shown, the upper surface of the first protrusion 132 is lower than the upper surface of the molding base 131, so that the base body 21 reserves more space above the first protrusion 132 to design other structures. For example, the outer wall of the base body 21 is usually provided with a step portion for the yoke to rest on or a buckle for the yoke to be clamped, and the distance between the structure such as the step portion or the buckle and the lower edge of the base body 21 needs to meet certain injection molding requirements; therefore, the lower the first protrusion 132 is designed, the larger the size of the base body 21 above the first protrusion 132, and the more space there is for designing other structures.

[0073] Alternatively, if Figure 4 As shown, a step portion 202 is provided on the outer wall of the base body 21, and the step surface of the step portion 202 is higher than the insert body 22; at this time, the lens assembly can further include a shell 50 covered on the base body 21, and the lower edge of the shell 50 is located above the step surface of the step portion 202. In this way, the design of the step portion 202 can not only form a recessed space for accommodating the shell 50 on the outer wall of the base body 21 to maintain a good appearance of the module, but also if the lower edge of the shell 50 contacts the step surface of the step portion 202, the step surface can also play a role in limiting or supporting the shell 50. It can be understood that the shell 50 mentioned in the present application can be, but is not limited to, implemented as a yoke.

[0074] It is worth noting that in the camera module 1 of the above embodiment of the present application, Figure 2 , Figure 5 , Fig.11 as well as Fig.12 As shown, the molded part 13 of the photosensitive component 10 further includes a second protrusion 133 extending from the molded base 131 to the outside of the cavity, so as to form an inlet and outlet injection flow channel when processing the molded part 13, which is convenient for exhaust during injection molding.

[0075] Alternatively, if Fig.11 and Fig.12As shown, the support substrate 11 is provided with a groove 110 matching the second protrusion 133, and the second protrusion 133 is filled in the groove 110 so as to avoid the insert body 22 of the insert base 20, thereby ensuring that the camera module 1 has a lower shoulder height.

[0076] Alternatively, if Figure 8 and Fig. 9 As shown, the second protrusion 133 and the pin 42 are staggered in the circumferential direction of the base body 21, that is, the second protrusion 133 can avoid the side where the pin 42 is located, thereby reserving more space for installing a larger lens circuit board 41 without increasing the external size of the base body 21, so as to adapt to the lens assembly's requirements for complex circuits.

[0077] For example, Fig.11 and Fig.12 As shown, the second protrusion 133 extends leftward from the left side surface of the molding base 131 to the left edge of the hard plate, so that the first protrusion 132 and the second protrusion 133 are respectively located on different sides of the molding base 131, so as to exhaust air through the groove 110 during injection molding, which is beneficial to the injection molding of the molded part 13. It can be understood that during the injection molding process of the molded part 13, the upper and lower molds will be pressed onto the upper and lower surfaces of the supporting substrate 11 when the molds are closed, so as to form a cavity, an inlet channel connected to the cavity, and a flow channel outlet connected to the groove 110 and the cavity inside; in this way, during injection molding, the molding liquid enters the cavity from the inlet channel, and after filling the cavity, the excess molding liquid flows out from the flow channel outlet and fills the groove 110; and then after the molding liquid is solidified and formed, the part filled in the inlet channel forms the first protrusion 132, the part filled in the cavity forms the molding base 131, and the part filled in the groove 110 forms the second protrusion 133.

[0078] Optionally, the cross-sectional area of ​​the first convex portion 132 is greater than the cross-sectional area of ​​the second convex portion 133, so that a pressure difference is formed inside the mold from the inflow channel to the channel outlet, so as to accelerate the flow of the molding liquid inside the mold and ensure that the molding liquid can quickly fill the mold. It is understood that the cross-sectional area mentioned in this application refers to the cross-sectional area of ​​the first convex portion 132 or the second convex portion 133 cut along a direction perpendicular to its extension direction.

[0079] Preferably, if Figure 4 and Figure 5 As shown, the thickness of the first protrusion 132 is greater than the thickness of the second protrusion 133, so as to reduce the depth of the groove 110 while ensuring that the cross-sectional area of ​​the first protrusion 132 is greater than the cross-sectional area of ​​the second protrusion 133, which helps to select a thinner supporting substrate 11.

[0080] Alternatively, if Figure 2 , Figure 7 , Figure 8 as well as Fig.11 As shown, the first convex portion 132 and the second convex portion 133 are respectively arranged adjacent to the diagonal sides of the insert base 20. For example, the first convex portion 132 is arranged adjacent to the right side wall of the base body 21; the second convex portion 133 is arranged adjacent to the rear side wall of the base body 21, so that the first convex portion 132 is located at the right front corner of the insert base 20, and the second convex portion 133 is located at the left rear corner of the insert base 20. In this way, the second convex portion 133 is far away from the first convex portion 132, so that the injection runner can be extended, so that during injection molding, the molding liquid can more easily fill the cavity inside the mold.

[0081] It is worth noting that, considering that the left side wall of the insert body 22 on the base body 21 will limit the height of the second protrusion 133, the camera module 1 of the present application has a groove 110 on the hard plate of the photosensitive circuit board 111 to accommodate the second protrusion 133, so as to reduce the shoulder height of the module. It is understandable that in other examples of the present application, the left side wall of the base body 21 can also be provided with an upper groove corresponding to the second protrusion 133, so as to form an exhaust channel during the injection molding process together with the groove 110 on the hard plate, so that after the injection molding is completed, the second protrusion 133 will be partially higher than the hard plate, which is not conducive to the design of the low shoulder height of the module.

[0082] In addition, if Figure 7 and Figure 8 As shown, the inner wall of the lens assembly is provided with an inwardly protruding convex component 60 at at least one corner, and the molded part 13 is provided with an avoidance notch group 130 at at least one corner corresponding to the convex component 60 on the molded base 131 to avoid the convex component 60, which helps to further reduce the circumferential size of the camera module 1.

[0083] Alternatively, if Figure 7 and Figure 8 As shown, the protrusion assembly 60 includes a fourth protrusion 61 protruding inward from the front corner of the lens assembly and a fifth protrusion 62 protruding inward from the rear corner of the lens assembly; the avoidance notch group 130 includes a first avoidance notch 1301 located at the front corner of the mold base 131 and avoiding the fourth protrusion 61 and a second avoidance notch 1302 located at the rear corner of the mold base 131 and avoiding the fifth protrusion 62. For example, Figure 8As shown, the front and rear ends of the right side wall of the base body 21 are respectively provided with a fourth convex portion 61 and a fifth convex portion 62; accordingly, the right front corner and the right rear corner of the mold base 131 are respectively provided with a first avoidance notch 1301 and a second avoidance notch 1302 for avoiding the fourth convex portion 61 and the fifth convex portion 62, so as to reduce the circumferential dimension of the camera module 1. It can be understood that in one embodiment, the fourth convex portion 61 and the fifth convex portion 62 can be formed by a protruding structure or a guide structure on the insert base 20.

[0084] Alternatively, if Figure 7 , Figure 8 as well as Fig.10 As shown, the insert base 20 may further include a third protrusion 23 protruding inward from the inner surface of the rear side wall of the base body 21 to increase the thickness of the rear side wall of the base body 21, thereby providing more embedded space for the insert body 22, such as increasing the width of the insert body 22 in the front-to-back direction, which helps to enhance the structural strength of the insert base 20 at the rear side wall of the base body 21.

[0085] Alternatively, if Figure 7 , Figure 8 as well as Fig. 9 As shown, the insert base 20 further has a receiving area 24 recessed inward from the outer surface of the rear side wall of the base body 21, and the pins 42 on the lens circuit board 41 are located in the receiving area 24 to protect the pins 42. It can be understood that in other examples of the present application, the insert base 20 may not be provided with the receiving area 24, so that the pins 42 are directly exposed outside the base body 21.

[0086] It is worth noting that, since the third protrusion 23 protrudes forward from the front surface of the rear side wall of the base body 21, the geometric center of the molded part 13 is closer to the front side of the insert base 20 relative to the insert base 20, so the fourth protrusion 61 located at the front end of the right side wall of the base body 21 overlaps more with the molded base 131 of the molded part 13 in the front-to-back direction. In other words, the molded base 131 needs to reserve more avoidance space on the front side of the base body 21, that is: Figure 7 and Figure 8 As shown, the second avoidance gap 1302 is larger than the first avoidance gap 1301 .

[0087] In addition, according to the above embodiments of the present application, Figure 4 , Figure 7 as well as Figure 8As shown, the lens assembly further includes a buffer 25 mounted on the insert body 22; wherein the buffer 25 is at least partially located within the cavity and below the movable portion of the lens assembly, and the buffer 25 is located outside the molded base 131 to prevent the movable portion of the lens assembly from colliding with the molded part 13 when moving downward. It can be understood that the movable portion of the lens assembly mentioned in the present application may include an optical lens 30, a magnetic member 43, a focus bracket 45, and an anti-shake bracket 46, so as to limit the downward movement of the focus bracket 45 and prevent the focus bracket 45 from colliding with the molded part 13 when moving downward along the optical axis.

[0088] Alternatively, if Figure 8 As shown, the insert body 22 partially extends to the outside of the base body 21 , and the buffer 25 is fixed to the portion of the insert body 22 located outside the base body 21 so as to stably support the buffer 25 and improve the buffering performance of the buffer 25 .

[0089] For example, Figure 8 As shown, the insert body 22 may include a rear embedding arm 221 extending left and right along the rear side wall of the base body 21, a left embedding arm 222 extending forward from the left end of the rear embedding arm 221 along the left side wall of the base body 21, a right embedding arm 223 extending forward from the right end of the rear embedding arm 221 along the right side wall of the base body 21, and a pair of support arms 224 extending inward from the front and rear ends of the right embedding arm 223 to embed into the third protrusion 23; the buffer 25 is fixedly connected to the support arm 224 to better support the buffer 25 and ensure that the buffer 25 can have a better buffering effect.

[0090] In addition, if Figure 8 As shown, the inner side of the left embedded arm 222 may also be protruded with a pair of support arms 224 arranged at intervals, and the buffer component 25 is fixedly installed on each support arm 224, so that the multiple buffer components 25 can be distributed as evenly as possible in the circumferential direction, so that the buffer component 25 can exert a more uniform buffering effect on the movable part of the lens assembly, and the movable part of the lens assembly can be prevented from being skewed under the buffering effect of the buffer component 25.

[0091] It is worth noting that, since the support arm 224 at the front end of the right embedded arm 223 is adjacent to the edge of the embedded body 22, the support arm 224 at the front end of the right embedded arm 223 is easily deformed during the solidification molding process of the base body 21, thereby affecting the position accuracy of the buffer 25 at the front end of the right embedded arm 223, and it is difficult to ensure that the four buffers 25 remain flush. In this way, when the focus bracket 45 moves downward along the optical axis to collide with the buffer 25, the focus bracket 45 is prone to tilt; therefore, if Figure 8As shown, the insert body 22 may further include a partial insert arm 225 extending from the front end of the right insert arm 223 along the front side wall of the base body 21 toward the first protrusion 132, so as to enhance the strength of the insert body 22 adjacent to the front end of the right insert arm 223, reduce the deformation of the support arm 224 located at the front end of the right insert arm 223 in the insert body 22 during the curing molding process of the base body 21, ensure that the four buffers 25 remain flush, and prevent the focusing bracket 45 from being skewed due to collision with the buffer 25.

[0092] In addition, if Figure 7 and Fig. 9 As shown, the motor assembly 40 may further include a ball 47 rollably disposed between the insert base 20 and the focus bracket 45 to allow the motor assembly 40 to drive the optical lens 30 to move along the optical axis.

[0093] Alternatively, if Figure 7 and Fig. 9 As shown, the front and rear ends of the left side wall of the base body 21 are provided with a first half groove 210 partially matching the ball 47 and recessed outward; the focus bracket 45 is provided with a second half groove 450 corresponding to the first half groove 210 and recessed inward, and the first half groove 210 and the second half groove 450 together form a rolling groove structure for accommodating the ball 47 as another fourth convex portion 61 and another fifth convex portion 62. At the same time, as Figure 7 and Figure 8 As shown, the left front corner and the left rear corner of the mold base 131 are respectively provided with a first avoidance gap 1301 for avoiding the fourth protrusion 61 and a second avoidance gap 1302 for avoiding the fifth protrusion 62, so as to reduce the circumferential size of the camera module 1.

[0094] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0095] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention.

Claims

1. A camera module, characterized in that: include: A photosensitive component, comprising a supporting substrate, a photosensitive chip, and a molded part injection-molded on the supporting substrate; and A lens assembly, comprising an insert base and an optical lens disposed on the insert base and located in the light sensing path of the light sensing chip; the insert base comprises a base body and an insert body embedded in the base body, the base body is fixed to the support substrate and defines a cavity together with the support substrate; The molded part includes a molding base located on the inner side of the periphery of the supporting substrate and within the cavity, and a first protrusion extending outward from the molding base to the outside of the cavity, and the insert body and the first protrusion are staggered with each other in the circumferential direction of the base body to allow the insert body and the first protrusion to overlap with each other in the height direction of the camera module.

2. The camera module according to claim 1, characterized in that: The supporting substrate includes a photosensitive circuit board electrically connected to the photosensitive chip; the lens assembly also includes a lens circuit board arranged on the side wall of the base body, wherein the lens circuit board is provided with pins electrically connected to the photosensitive circuit board, and the pins and the first protrusion are located on different sides of the base body.

3. The camera module according to claim 2, characterized in that: The first protrusion and the pin are respectively located at the front and rear sides of the base body.

4. The camera module according to claim 2, characterized in that: The lens assembly includes a magnetic component connected to the optical lens and a coil disposed on the lens circuit board and arranged corresponding to the magnetic component, and the coil is located on a side wall of the base body that is different from the side where the first protrusion is located.

5. The camera module according to claim 4, characterized in that: The lens circuit board is provided with the coils on the left and right side walls of the base body respectively.

6. The camera module according to claim 5, characterized in that: The lens circuit board is located on the inner surface and / or outer surface of the base body, the insert base has a receiving notch opened on the side wall of the base body for accommodating the coil, and the insert body is partially embedded in the interior of the base body and located below the receiving notch.

7. The camera module according to claim 1, characterized in that: An upper surface of the first protrusion is lower than an upper surface of the molding base.

8. The camera module according to claim 7, characterized in that: A step portion is provided on the outer side wall of the base body, and the step surface of the step portion is higher than the insert body; wherein the lens assembly further comprises a shell body covered on the base body, and the lower edge of the shell body is located above the step surface of the step portion.

9. The camera module according to claim 2, characterized in that: The molded part further includes a second protrusion extending from the mold base to outside the cavity.

10. The camera module according to claim 9, characterized in that: The first convex portion and the second convex portion are respectively arranged adjacent to opposite corners of the insert base.

11. The camera module according to claim 10, characterized in that: The second protrusion and the pin are staggered with each other in a circumferential direction of the base body.

12. The camera module according to claim 1, characterized in that: The molded part further includes a second protrusion extending from the mold base to outside the cavity.

13. The camera module according to claim 12, characterized in that: The support substrate is provided with a groove matching with the second protrusion, and the second protrusion is filled in the groove.

14. The camera module according to claim 12, characterized in that: The cross-sectional area of ​​the first protrusion is greater than the cross-sectional area of ​​the second protrusion.

15. The camera module according to claim 1, characterized in that: The insert base also includes a third protrusion protruding inwardly from the inner surface of the rear side wall of the base body.

16. The camera module according to claim 15, characterized in that: The inner side wall of the lens assembly is provided with a convex component protruding inward at at least one corner, and the molded part is provided with an avoidance notch group at at least one corner corresponding to the convex component on the molded base.

17. The camera module according to claim 16, characterized in that: The protrusion assembly includes a fourth protrusion protruding inward from the front corner of the lens assembly and a fifth protrusion protruding inward from the rear corner of the lens assembly; the avoidance notch group includes a first avoidance notch located at the front corner of the molding base and avoiding the fourth protrusion and a second avoidance notch located at the rear corner of the molding base and avoiding the fifth protrusion; the second avoidance notch is larger than the first avoidance notch.

18. The camera module according to claim 15, characterized in that: The insert base has a receiving area recessed inward from the outer surface of the rear side wall of the base body, wherein the lens assembly also includes a lens circuit board arranged on the side wall of the base body and provided with pins, and the pins on the lens circuit board are located within the receiving area.

19. The camera module according to any one of claims 1 to 18, characterized in that: The lens assembly further includes a buffer mounted on the insert body; wherein the buffer is at least partially located within the cavity and below the movable portion of the lens assembly, and the buffer is located outside the mold base.

20. An electronic device, characterized in that include: Equipment body; and The camera module as described in any one of claims 1 to claim 19 is assembled on the device body.

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