High-precision wafer pre-alignment mechanism

Abstract

The application belongs to the technical field of semiconductor packaging, and provides a high-precision wafer pre-alignment mechanism, which comprises a bottom plate, a top plate fixedly installed at the top end of the bottom plate, a support rod fixedly connected between the four corners of the side of the bottom plate close to the top plate and the top plate, a mechanical finger movably arranged at the top end of the top plate, a wafer adsorbed on one side of the mechanical finger, and a wafer NOTCH notch formed on one side of the wafer. The compatibility of the application greatly saves the design time and also saves the equipment cost. The application realizes the precise pre-alignment of wafers with different sizes of 6 inches to 12 inches in the same mechanism, improves the compatibility of the equipment, reduces the equipment cost, realizes the high-precision alignment of the wafer notch direction, solves the skew phenomenon that is prone to occur in the traditional conical surface sliding positioning mode, and provides a strong guarantee for the subsequent process in the semiconductor chip manufacturing process.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor packaging, and particularly relates to a high-precision wafer pre-alignment mechanism. BACKGROUND

[0002] In the highly precise and complex industrial field of semiconductor chip manufacturing, wafer pre-alignment, as a key link connecting front-end wafer preparation and back-end packaging testing, is self-evident in importance. With the development of semiconductor packaging technology, wafer size gradually moves towards the direction of super large size. 6-inch to 12-inch wafers are the mainstream size in current market applications. The first process of the wafer bonding process of the large-size wafer temporary bonding equipment is the glue coating process, and the uniformity of the glue film thickness after coating has a great influence on the yield of the subsequent bonded products. The offset of the wafer center relative to the center of the glue coating disc during glue coating will cause vibration of the high-speed rotating glue coating disc, which will make the uniformity (TTV value) of the glue film after coating worse. In practical applications, the offset precision of the wafer center and the center of the glue coating disc is determined by the pre-alignment mechanism. Therefore, realizing fast and precise wafer pre-alignment is the guarantee for improving the product yield of temporary bonding.

[0003] However, the wafer pre-alignment technology widely used in the current market is a traditional scheme based on taper sliding positioning, which has gradually exposed many drawbacks and is difficult to meet the needs of advanced manufacturing processes. For example, long-time physical contact and sliding will cause wear on the taper and wafer surface, which not only reduces the positioning accuracy, but also may introduce contaminants, affecting the wafer quality. Taper sliding positioning is prone to fluctuations and deviations during wafer transmission, causing unstable wafer position and affecting subsequent processing quality. This level of precision often cannot meet the requirements. SUMMARY

[0004] The purpose of the present application is to provide a high-precision wafer pre-alignment mechanism to solve the problems raised in the background art.

[0005] To achieve the above purpose, the present application provides the following technical scheme:

[0006] A high-precision wafer pre-alignment mechanism, comprising:

[0007] A bottom plate, a top plate fixedly installed at the top end of the bottom plate, a support rod fixedly connected between the four corners of the bottom plate close to the top plate and the top plate, a mechanical finger movably arranged at the top end of the top plate, a wafer adsorbed on one side of the mechanical finger, and a wafer NOTCH notch formed on one side of the wafer.

[0008] A positioning assembly arranged on one side of the top plate, the positioning assembly comprising a positioning sliding table movably installed on one side of the top plate, a positioning pin seat connected to the top end of the positioning sliding table, and a plurality of positioning pins fixedly installed on one side of the positioning pin seat.

[0009] The pressing assembly is arranged on the top end of the top plate away from the positioning sliding table, and comprises a pressing sliding table movably arranged on one side of the top plate, a pressing guide rail mounting plate fixedly arranged on the top end of the pressing sliding table, a pressing guide rail fixedly arranged on one side of the pressing guide rail mounting plate, a guide rail connecting plate movably arranged on one side of the pressing guide rail, and a pressing block fixedly connected on one side of the guide rail connecting plate.

[0010] The adjusting assembly is arranged on one side of the bottom plate, and comprises a thimble mounting plate movably arranged in the top plate, thimbles fixedly arranged on four corners of one side of the thimble mounting plate, the top plate movably connected with the thimble mounting plate through a slot, a suction disc connecting shaft movably arranged in the thimble mounting plate, a suction disc fixedly connected on one end of the suction disc connecting shaft, and the suction disc facing the wafer.

[0011] Preferably, a positioning sliding table is movably arranged on one side of the top plate, a positioning limiting block is fixedly arranged on one side of the positioning sliding table, a positioning pin base plate is fixedly arranged on the side of the positioning sliding table away from the top plate, a positioning pin seat is fixedly arranged on one side of the positioning pin base plate, and a plurality of positioning pins are movably arranged on the top end of the positioning pin seat.

[0012] Preferably, a NOTCH detection sensor frame is fixedly arranged on the side of the top plate top end close to the positioning sliding table, and a NOTCH detection sensor is fixedly arranged on the side of the NOTCH detection sensor frame close to the wafer.

[0013] Preferably, a pressing sliding table is movably arranged on the top end of the top plate away from the positioning sliding table, a pressing guide rail mounting plate is fixedly arranged on the side of the pressing sliding table away from the top plate, a pressing guide rail is fixedly arranged on the side of the pressing guide rail mounting plate away from the pressing sliding table, and a guide rail sliding block is movably arranged on the outer side of the pressing guide rail.

[0014] Preferably, a guide rail connecting plate is fixedly arranged on the side of the guide rail sliding block away from the pressing guide rail, a pressing block is fixedly arranged on the side of the guide rail connecting plate away from the guide rail sliding block, and the pressing block is made of polyformaldehyde material.

[0015] Preferably, a spring back plate is movably arranged on the outer side of the pressing guide rail, a spring pre-tightening screw is movably arranged between the spring back plate and the guide rail connecting plate through an opening, and an open pin is threadedly and rotatably arranged on one end of the spring pre-tightening screw.

[0016] Preferably, the open pin is arranged on the side of the guide rail connecting plate away from the spring back plate, a pressing spring is connected between the spring back plate and the guide rail connecting plate, and the pressing spring is arranged on the outer side of the spring pre-tightening screw.

[0017] Preferably, the top plate is internally movably mounted with a needle mounting plate through a slot, the needle mounting plate is fixedly mounted with a needle at four corners near the wafer side, the bottom plate is fixedly mounted with a needle lifting seat on one side, the needle lifting seat is movably mounted with a needle lifting lead screw inside through a bearing, the needle lifting lead screw is externally threadedly rotatable mounted with a needle lead screw block, the needle lead screw block is fixedly connected with a needle limiting plate on one side, the needle limiting plate is fixedly connected with a needle lifting connecting plate on one side, the needle lifting connecting plate is fixedly connected with the needle mounting plate near the needle mounting plate side, the needle lifting seat is mounted with a needle lifting motor at the top end through a fixed seat, and the needle lifting motor output end is drivingly connected with the needle lifting lead screw shaft through a shaft coupling.

[0018] Preferably, the needle mounting plate is movably mounted with a suction disc connecting shaft inside through a hole, the suction disc connecting shaft is interconnected with a suction disc at one end near the wafer, the bottom plate is movably mounted with a suction disc rotating motor connecting plate near the top plate side, the suction disc rotating motor connecting plate is mounted with a suction disc rotating motor on one side through a fixed seat, the suction disc rotating motor output end is drivingly connected with the suction disc connecting shaft shaft through a shaft coupling, the suction disc rotating motor is fixedly mounted with a vacuum air nozzle away from the suction disc connecting shaft side, and the vacuum air nozzle and the suction disc connecting shaft are interconnected inside.

[0019] Preferably, the bottom plate top end is fixedly mounted with a suction disc lifting seat near the suction disc rotating motor connecting plate side, the suction disc lifting seat is movably mounted with a suction disc lifting lead screw inside through a bearing, the suction disc lifting lead screw is externally threadedly rotatable mounted with a suction disc lead screw block, the suction disc lead screw block is fixedly connected with a suction disc limiting plate on one side, the suction disc limiting plate is fixedly connected with the suction disc rotating motor connecting plate near the suction disc rotating motor connecting plate side, the suction disc lifting seat is mounted with a suction disc lifting motor at the top end through a fixed seat, and the suction disc lifting motor output end is drivingly connected with the suction disc lifting lead screw shaft through a shaft coupling.

[0020] Compared with the prior art, the present application has the following advantages:

[0021] (1) The present application realizes the positioning effect of the wafer by setting the positioning pin seat and the positioning pin on one side of the top plate, and different heights of the positioning pin can be installed according to different sizes of the wafer, the positioning pin height is 10mm for a 6-inch wafer, 15mm for an 8-inch wafer, 20mm for a 10-inch wafer, and 25mm for a 12-inch wafer, the positioning pin can move back and forth with the positioning sliding table to avoid the movement of the mechanical finger to prevent damage to the mechanical finger, and the NOTCH detection sensor is set at the top end to accurately detect the direction of the wafer NOTCH gap, realize high-precision alignment of the wafer gap direction, and effectively improve the detection ability and alignment precision.

[0022] (2)The present application realizes centering alignment by setting movable pressing slide on one side of the top plate and setting pressing block with adjustable pre-tightening force size on the top end of the pressing slide, and the spring back plate position in the pressing guide installation plate can be changed according to the size of the wafer, the pre-installation hole corresponding to the wafer size is provided on the pressing guide installation plate, the open pin is rotated to adjust the pre-tightening force of the pressing block before use, and then the pressing slide is moved by using the cylinder, so that the wafer is provided with additional stability guarantee, thereby improving the stability of the whole pre-alignment mechanism.

[0023] (3)The present application realizes automatic operation by setting the thimble on one side of the thimble installation plate to support the wafer, and the thimble installation plate can move up and down to facilitate taking and placing the wafer with the mechanical fingers, the suction cup can move up and down under the driving of the suction cup connecting shaft, the vacuum nozzle provides vacuum for the suction cup to adsorb the wafer, the suction cup can drive the wafer to move up and down synchronously, and can produce rotary motion under the action of the suction cup rotating motor, so as to cooperate with the NOTCH detection sensor to calibrate the wafer NOTCH gap, compared with the traditional way, the precision is better, the wafer position is more stable, and the operation is more flexible.

[0024] (4)The compatibility of the present application greatly saves the design time and also saves the equipment cost; the present application realizes precise pre-alignment of 6-inch to 12-inch wafers of different sizes in the same mechanism, improves the compatibility of the equipment, reduces the equipment cost, realizes high-precision alignment of the wafer gap direction, solves the skew phenomenon easily appeared in the traditional conical surface sliding positioning mode, and provides strong guarantee for the subsequent process in the semiconductor chip manufacturing process. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure of the present application;

[0026] Figure 2 It is a schematic diagram of the wafer structure of the present application;

[0027] Figure 3 It is a schematic diagram of the positioning pin installation position structure of the present application;

[0028] Figure 4 It is a schematic diagram of the pressing block installation structure of the present application;

[0029] Figure 5 It is a schematic diagram of the open pin installation position structure of the present application;

[0030] Figure 6 It is a schematic diagram of the suction cup installation structure of the present application;

[0031] Figure 7 It is a schematic diagram of the thimble installation plate structure of the present application;

[0032] Figure 8 Fig. 1 is a schematic diagram of the connecting shaft structure of the chuck of the present application.

[0033] In the figure: 1, base plate; 11, top plate; 12, support rod; 13, mechanical finger; 14, wafer; 15, wafer NOTCH notch; 2, positioning assembly; 21, positioning sliding table; 22, positioning limiting block; 23, positioning pin base plate; 24, positioning pin seat; 25, positioning pin; 26, NOTCH detection sensor rack; 27, NOTCH detection sensor; 3, pressing assembly; 31, pressing sliding table; 32, pressing guide rail mounting plate; 33, pressing guide rail; 34, guide rail sliding block; 35, guide rail connecting plate; 36, pressing block; 37, spring back plate; 38, spring pre-tightening screw; 39, split pin; 310, pressing spring; 4, adjusting assembly; 41, thimble mounting plate; 42, thimble; 43, thimble lifting seat; 44, thimble lifting lead screw; 45, thimble lead screw block; 46, thimble limiting plate; 47, thimble lifting connecting plate; 48, thimble lifting motor; 49, chuck connecting shaft; 410, chuck; 411, chuck rotating motor connecting plate; 412, chuck rotating motor; 413, vacuum air nozzle; 414, chuck lifting seat; 415, chuck lifting lead screw; 416, chuck lead screw block; 417, chuck limiting plate; 418, chuck lifting motor. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0035] Embodiment one:

[0036] Please refer to Figure 1 - Figure 3 As shown in the figure, a high-precision wafer pre-alignment mechanism comprises:

[0037] A base plate 1 is fixedly installed with a top plate 11 at the top end. Support rods 12 are fixedly connected between the four corners of the side close to the top plate 11 of the base plate 1 and the top plate 11. A mechanical finger 13 is movably arranged at the top end of the top plate 11. A wafer 14 is adsorbed on one side of the mechanical finger 13. A wafer NOTCH notch 15 is formed on one side of the wafer 14.

[0038] A positioning assembly 2 is arranged on one side of the top end of the top plate 11. The positioning assembly 2 comprises a positioning sliding table 21 movably installed on one side of the top plate 11. A positioning pin seat 24 is connected to the top end of the positioning sliding table 21. A plurality of positioning pins 25 are fixedly installed on one side of the positioning pin seat 24.

[0039] The pressing assembly 3 is arranged on the top end of the top plate 11 away from the positioning sliding table 21, and comprises a pressing sliding table 31 movably arranged on one side of the top plate 11, a pressing guide rail mounting plate 32 fixedly arranged on the top end of the pressing sliding table 31, a pressing guide rail 33 fixedly arranged on one side of the pressing guide rail mounting plate 32, a guide rail connecting plate 35 movably arranged on one side of the pressing guide rail 33, and a pressing block 36 fixedly connected on one side of the guide rail connecting plate 35.

[0040] The adjusting assembly 4 is arranged on one side of the bottom plate 1, and comprises a top pin mounting plate 41 movably arranged in the top plate 11, a top pin 42 fixedly arranged on the four corners of one side of the top pin mounting plate 41, and a suction disc 410 fixedly connected on one end of a suction disc connecting shaft 49 movably arranged in the top pin mounting plate 41.

[0041] Specifically, the positioning sliding table 21 is movably arranged on one side of the top plate 11, the positioning limiting block 22 is fixedly arranged on one side of the positioning sliding table 21, the positioning pin base plate 23 is fixedly arranged on the side of the positioning sliding table 21 away from the top plate 11, the positioning pin seat 24 is fixedly arranged on one side of the positioning pin base plate 23, the positioning pins 25 are movably arranged on the top end of the positioning pin seat 24, the NOTCH detection sensor rack 26 is fixedly arranged on one side of the top plate 11 close to the positioning sliding table 21, and the NOTCH detection sensor 27 is fixedly arranged on one side of the NOTCH detection sensor rack 26 close to the wafer 14.

[0042] As can be seen from the above, the positioning pin seat 24 and the positioning pins 25 (the outer side of the positioning pins 25 is provided with a resin pin sleeve) are arranged on one side of the top plate 11 to achieve the positioning effect of the wafer 14, and different heights of the positioning pins 25 can be installed according to the different sizes of the wafer 14. For a 6-inch wafer 14, the height of the positioning pins 25 is 10 mm, for an 8-inch wafer 14, the height of the positioning pins 25 is 15 mm, for a 10-inch wafer 14, the height of the positioning pins 25 is 20 mm, and for a 12-inch wafer 14, the height of the positioning pins 25 is 25 mm. The positioning pins 25 can move back and forth with the positioning sliding table 21 to avoid moving the mechanical fingers 13 to prevent damage to the mechanical fingers 13. At the same time, the NOTCH detection sensor 27 is arranged at the top end to accurately detect the direction of the wafer NOTCH gap 15, achieve high-precision alignment of the wafer 14 in the direction, and effectively improve the detection capability and alignment precision.

[0043] Embodiment Two:

[0044] Please refer to Figure 1 and Figure 4 - Figure 5As shown, the top end of the top plate 11 is movably mounted with a pressing slide 31 away from the positioning slide 21, the pressing slide 31 is fixedly mounted with a pressing guide rail mounting plate 32 away from the top plate 11, the pressing guide rail mounting plate 32 is fixedly mounted with a pressing guide rail 33 away from the pressing slide 31, the outer side of the pressing guide rail 33 is movably mounted with a guide rail sliding block 34, the guide rail sliding block 34 is fixedly mounted with a guide rail connecting plate 35 away from the pressing guide rail 33, the guide rail connecting plate 35 is fixedly mounted with a pressing block 36 away from the guide rail sliding block 34, and the pressing block 36 is made of polyformaldehyde material.

[0045] Specifically, the outer side of the pressing guide rail 33 is movably mounted with a spring back plate 37, the spring back plate 37 and the guide rail connecting plate 35 are movably mounted with a spring pre-tightening screw 38 through an opening, one end of the spring pre-tightening screw 38 is threadedly rotatably mounted with a split pin 39, the split pin 39 is arranged on the side of the guide rail connecting plate 35 away from the spring back plate 37, the spring back plate 37 and the guide rail connecting plate 35 are connected with a pressing spring 310, and the pressing spring 310 is arranged on the outer side of the spring pre-tightening screw 38.

[0046] As can be seen from the above, the movable pressing slide 31 is arranged on one side of the top plate 11, and the pressing block 36 with adjustable pre-tightening force is arranged at the top end of the pressing slide 31, the wafer 14 is clamped by the pressing block 36 to realize centering and alignment, and the position of the spring back plate 37 on the pressing guide rail mounting plate 32 can be changed according to the size of the wafer 14, there are pre-installed holes corresponding to the size of the wafer 14 on the pressing guide rail mounting plate 32, the pre-tightening force of the pressing block 36 is adjusted by rotating the split pin 39 before use, and then the pressing slide 31 is moved by using the cylinder, thereby providing additional stability for the wafer 14, and the stability of the whole pre-alignment mechanism is improved.

[0047] Embodiment three:

[0048] Please refer to Figure 1 and Figure 6 - Figure 8 As shown, the inside of the top plate 11 is movably mounted with a thimble mounting plate 41 through a slot, the thimble mounting plate 41 is fixedly mounted with thimbles 42 on four corners of the side close to the wafer 14, the bottom plate 1 is fixedly mounted with a thimble lifting seat 43 on one side, the thimble lifting seat 43 is movably mounted with a thimble lifting lead screw 44 inside through a bearing, the thimble lifting lead screw 44 is threadedly rotatably mounted with a thimble lead screw block 45 on the outer side, the thimble lead screw block 45 is fixedly connected with a thimble limiting plate 46 on one side, the thimble limiting plate 46 is fixedly connected with a thimble lifting connecting plate 47 on one side, the thimble lifting connecting plate 47 is fixedly connected with the thimble mounting plate 41 on the side close to the thimble mounting plate 41, and the thimble lifting seat 43 is mounted with a thimble lifting motor 48 on the top end through a fixed seat, and the output end of the thimble lifting motor 48 is drivingly connected with the shaft of the thimble lifting lead screw 44 through a shaft coupling.

[0049] As can be seen, the top pin 42 is arranged on the side of the top pin mounting plate 41, and the top pin 42 is used to support the wafer 14, and the top pin mounting plate 41 is movable up and down, and cooperates with the mechanical fingers 13 to facilitate the taking and placing of the wafer 14, and realizes the automatic operation. The top pin lifting screw rod 44 can drive the top pin screw block 45 to move up and down, and then drives the top pin limiting plate 46 to move up and down, so as to drive the top pin mounting plate 41 to move up and down through the top pin lifting connecting plate 47, and realizes the change of the height of the wafer 14.

[0050] Specifically, the suction cup connecting shaft 49 is movably arranged in the top pin mounting plate 41 through the opening, the suction cup connecting shaft 49 is connected with the suction cup 410 at the end close to the wafer 14, the bottom plate 1 is movably arranged with the suction cup rotating motor connecting plate 411 on the side close to the top plate 11, the suction cup rotating motor connecting plate 411 is arranged with the suction cup rotating motor 412 on the side through the fixing seat, the output end of the suction cup rotating motor 412 is connected with the shaft of the suction cup connecting shaft 49 through the shaft coupling, the suction cup rotating motor 412 is fixedly arranged with the vacuum air nozzle 413 on the side away from the suction cup connecting shaft 49, the vacuum air nozzle 413 is arranged in the suction cup connecting shaft 49, the top end of the bottom plate 1 is fixedly arranged with the suction cup lifting seat 414 on the side close to the suction cup rotating motor connecting plate 411, the suction cup lifting seat 414 is movably arranged with the suction cup lifting screw rod 415 through the bearing inside, the suction cup lifting screw rod 415 is arranged with the suction cup screw block 416 on the outside through the screw thread, the suction cup screw block 416 is fixedly connected with the suction cup limiting plate 417 on the side, the suction cup limiting plate 417 is fixedly connected with the suction cup rotating motor connecting plate 411 on the side close to the suction cup rotating motor connecting plate 411, the top end of the suction cup lifting seat 414 is arranged with the suction cup lifting motor 418 through the fixing seat, and the output end of the suction cup lifting motor 418 is connected with the shaft of the suction cup lifting screw rod 415 through the shaft coupling.

[0051] As can be seen, the suction cup 410 can move up and down under the driving of the suction cup connecting shaft 49, the vacuum air nozzle 413 provides vacuum for the suction cup 410 to adsorb the wafer 14, after the suction cup 410 adsorbs the wafer 14, the wafer 14 can be synchronously driven to move up and down, and can be rotated under the action of the suction cup rotating motor 412, so as to cooperate with the NOTCH detection sensor 27 to calibrate the wafer NOTCH gap 15, and the lifting of the suction cup 410 can also be realized through the cooperation of the suction cup lifting screw rod 415, the suction cup screw block 416 and the suction cup limiting plate 417.

[0052] Working principle: first through the mechanical finger 13 adsorbed a wafer 14, and transported to the predetermined position, the ejector pin 42 rises to hold the wafer 14, the mechanical finger 13 withdraws, and then the suction cup 410 is operated to rise and adsorb the wafer 14, the NOTCH detection sensor 27 detects, and at the same time, the suction cup rotating motor 412 drives the wafer 14 to rotate until the wafer NOTCH gap 15 position is aligned, and then the suction cup 410 is controlled to descend, the wafer 14 falls on the ejector pin 42, the suction cup 410 withdraws the adsorption force, and then the positioning slide table 21 advances to the predetermined position, the pressing slide table 31 advances to clamp the wafer 14 to realize the centering alignment, and then the mechanical finger 13 adsorbs the wafer 14, the positioning slide table 21 and the pressing slide table 31 are withdrawn synchronously, and the mechanical finger 13 takes away the wafer 14.

[0053] While the embodiments of the application have been illustrated and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the application, which is defined by the appended claims and their equivalents.

Claims

1. A high precision wafer pre-alignment mechanism, characterized by, Include: The base plate (1), the top plate (11) is fixedly installed at the top end of the base plate (1), the base plate (1) is fixedly connected between the four corners of the top plate (11) side near the top plate (11), the top plate (11) is movably provided with a mechanical finger (13) at the top end, the mechanical finger (13) is adsorbed with a wafer (14) on one side, and the wafer (14) is provided with a wafer NOTCH notch (15) on one side; The positioning assembly (2) is arranged on one side of the top plate (11), the positioning assembly (2) includes a positioning sliding table (21) movably installed on one side of the top plate (11), the positioning sliding table (21) is connected with a positioning pin seat (24) at the top end, and a plurality of positioning pins (25) are arranged on one side of the positioning pin seat (24), and the positioning pins (25) of different heights are installed according to the size of the wafer (14); The top plate (11) is movably installed with a positioning sliding table (21) on one side, the positioning sliding table (21) is fixedly installed with a positioning limiting block (22) on one side, the positioning sliding table (21) is fixedly installed with a positioning pin bottom plate (23) away from the top plate (11) on one side, the positioning pin bottom plate (23) is fixedly installed with a positioning pin seat (24) on one side, and a plurality of positioning pins (25) are movably installed on the top end of the positioning pin seat (24); The top plate (11) is fixedly installed with a NOTCH detection sensor rack (26) on one side near the positioning sliding table (21) at the top end, and the NOTCH detection sensor rack (26) is fixedly installed with a NOTCH detection sensor (27) on one side near the wafer (14); The compression assembly (3) is arranged on one side of the top plate (11) away from the positioning sliding table (21), the compression assembly (3) includes a compression sliding table (31) movably installed on one side of the top plate (11), the compression sliding table (31) is fixedly installed with a compression guide rail mounting plate (32) at the top end, the compression guide rail mounting plate (32) is fixedly installed with a compression guide rail (33) on one side, the compression guide rail (33) is movably installed with a guide rail connecting plate (35) on one side, and the guide rail connecting plate (35) is fixedly connected with a compression block (36) on one side; The adjusting assembly (4) is arranged on one side of the base plate (1), the adjusting assembly (4) includes a thimble mounting plate (41) movably installed in the top plate (11), the thimble mounting plate (41) is fixedly installed with a thimble (42) on one side of the four corners, the top plate (11) is movably connected with the thimble mounting plate (41) through the slot, the thimble mounting plate (41) is movably installed with a suction disc connecting shaft (49) in the hole, the suction disc connecting shaft (49) is fixedly connected with a suction disc (410) on one end, and the suction disc (410) faces the wafer (14).

2. The high precision wafer pre-alignment mechanism of claim 1, wherein, The top plate (11) top end is away from the positioning sliding table (21) side movable installation has the pressure tight sliding table (31), the pressure tight sliding table (31) is away from the top plate (11) side fixed mounting has the pressure tight guide rail mounting plate (32), the pressure tight guide rail mounting plate (32) is away from the pressure tight guide rail mounting plate (32) side fixed mounting has the pressure tight guide rail (33), the pressure tight guide rail (33) outside movable installation has the guide rail sliding block (34).

3. The high precision wafer pre-alignment mechanism of claim 2, wherein, The guide rail sliding block (34) is away from the pressure tight guide rail (33) side fixed mounting has the guide rail connecting plate (35), the guide rail connecting plate (35) is away from the guide rail sliding block (34) side fixed mounting has the pressure tight block (36), the pressure tight block (36) is made of polyformaldehyde material.

4. The high precision wafer pre-alignment mechanism of claim 3, wherein, The pressure tight guide rail (33) outside movable installation has spring back plate (37), spring back plate (37) and guide rail connecting plate (35) between through the aperture movable installation has spring pre-tightening screw (38), spring pre-tightening screw (38) one end is through the thread and spring back plate (37) rotation, the other end is installed with split pin (39).

5. A high precision wafer pre-alignment mechanism according to claim 4, wherein, The split pin (39) is located in the guide rail connecting plate (35) away from the spring back plate (37) side setting, the spring back plate (37) and guide rail connecting plate (35) between the connection has pressure tight spring (310), the pressure tight spring (310) is located in the spring pre-tightening screw (38) outside setting.

6. The high precision wafer pre-alignment mechanism of claim 1, wherein, The top plate (11) is installed with a needle mounting plate (41) through the groove, the needle mounting plate (41) is fixedly installed with a needle (42) on the four corners near the wafer (14), the bottom plate (1) is fixedly installed with a needle lifting seat (43), the needle lifting seat (43) is movably installed with a needle lifting lead screw (44) through a bearing inside, the needle lifting lead screw (44) is rotatably installed with a needle lead screw block (45) through a thread outside, the needle lead screw block (45) is fixedly connected with a needle limiting plate (46) on one side, the needle limiting plate (46) is fixedly connected with a needle lifting connecting plate (47) on one side, the needle lifting connecting plate (47) is fixedly connected with the needle mounting plate (41) near the needle mounting plate (41) on one side, the needle lifting seat (43) is installed with a needle lifting motor (48) through a fixing seat on the top end, the needle lifting motor (48) is drivingly connected with the shaft of the needle lifting lead screw (44) through a shaft coupling on the output end.

7. A high precision wafer pre-alignment mechanism according to claim 6, wherein, The top needle mounting plate (41) is internally movably mounted with a suction disc connecting shaft (49), the suction disc connecting shaft (49) is movably connected with a suction disc (410) at one end close to the wafer (14), the bottom plate (1) is movably mounted with a suction disc rotating motor connecting plate (411) at one side close to the top plate (11), the suction disc rotating motor connecting plate (411) is mounted with a suction disc rotating motor (412) at one side through a fixing base, the suction disc rotating motor (412) is drivingly connected with the shaft of the suction disc connecting shaft (49) through a shaft coupling at the output end, the suction disc rotating motor (412) is fixedly mounted with a vacuum air nozzle (413) at the side away from the suction disc connecting shaft (49), and the vacuum air nozzle (413) is in intercommunication with the inside of the suction disc connecting shaft (49).

8. The high precision wafer pre-alignment mechanism of claim 7, wherein, The top end of the bottom plate (1) is fixedly mounted with a suction disc lifting seat (414) at one side close to the suction disc rotating motor connecting plate (411), the suction disc lifting seat (414) is movably mounted with a suction disc lifting lead screw (415) through a bearing in the inside, the suction disc lifting lead screw (415) is movably mounted with a suction disc lead screw block (416) through a screw thread at the outside, one side of the suction disc lead screw block (416) is fixedly connected with a suction disc limiting plate (417), the suction disc limiting plate (417) is fixedly connected with the suction disc rotating motor connecting plate (411) at one side close to the suction disc rotating motor connecting plate (411), the top end of the suction disc lifting seat (414) is mounted with a suction disc lifting motor (418) through a fixing base, and the output end of the suction disc lifting motor (418) is drivingly connected with the shaft of the suction disc lifting lead screw (415) through a shaft coupling.

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