A continuous wafer cleaning device

Abstract

The present invention provides a continuous wafer cleaning device, which relates to the field of wafer cleaning technology and includes a support platform, wherein the upper end of the support platform is equipped with a driving device for limiting the position of the regenerated wafer and controlling the directional rotation of the regenerated wafer, and further includes a cleaning bar for continuously cleaning the surface of the regenerated wafer and a guide structure for guiding the cleaning bar, wherein the guide structure includes at least one first guide device and a second guide device, and the first guide device and the second guide device are used to control the cleaning bar to abut against the surface of the regenerated wafer to complete continuous cleaning; the cleaning bar is a closed ring, and the lower end of the support platform is also equipped with a purification tank located on the moving path of the cleaning bar, and the purification tank includes a containing body for containing cleaning liquid. The invention can continuously clean multiple regenerated wafers without replacing the cleaning bar, greatly improving the effect and efficiency of continuous cleaning of the regenerated wafer surface.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning, and in particular to a continuous wafer cleaning device. Background Art

[0002] The surface of the regenerated wafer can be flattened through processes such as film removal, polishing, and cleaning to meet the standards for reuse, which can reduce resource waste and lower production costs.

[0003] The cleaning strip can replace the roller brush cleaning method to efficiently clean the surface of the regenerated wafer to remove most of the residual particles on its surface.

[0004] However, due to the limitations of the winding structure on both sides and the limited cleaning length of the cleaning strip, the cleaning strip is continuously consumed during the continuous cleaning of the regenerated wafer surface. After the cleaning strip is consumed, it needs to be replaced, which also reduces the efficiency of cleaning the regenerated wafer. Summary of the Invention

[0005] In response to the above problems, the present invention provides a wafer continuous cleaning device, which can continuously clean multiple regenerated wafers without replacing the cleaning strips, greatly improving the effect and efficiency of continuous cleaning of the regenerated wafer surface.

[0006] In order to solve the above problems, the technical solution adopted by the present invention is:

[0007] A wafer continuous cleaning device comprises a supporting platform, wherein a driving device for limiting the position of the regenerated wafer and controlling the directional rotation of the regenerated wafer is installed at the upper end of the supporting platform, and further comprises a cleaning bar for continuously cleaning the surface of the regenerated wafer and a guiding structure for guiding the cleaning bar, wherein the guiding structure comprises at least one first guiding device and a second guiding device, and the first guiding device and the second guiding device are used to control the cleaning bar to abut against the surface of the regenerated wafer to complete continuous cleaning; the cleaning bar is a closed ring, and a purification tank located on the moving path of the cleaning bar is also installed at the lower end of the supporting platform, the purification tank comprises a containing body for containing cleaning liquid, and a cleaning body for cleaning the surface of the cleaning bar is also installed on the inner wall of the containing body, and the cleaning bar is directional and passes through the cleaning body to complete continuous cleaning.

[0008] Preferably, the cleaning body includes a first cleaning roller and a second cleaning roller arranged at intervals, the cleaning strip passes through the first cleaning roller and the second cleaning roller, and the first cleaning roller and the second cleaning roller are controlled to rotate continuously to complete the cleaning of residual particles on the surface of the cleaning strip.

[0009] Preferably, a serpentine cleaning strip is fixed on the surface of the first cleaning roller and the second cleaning roller, and the surface of the cleaning strip abuts against the surface of the cleaning strip.

[0010] Preferably, a circulation body with a filtering function is further installed outside the containing body, and the directional flow of the cleaning liquid in the containing body is controlled by the circulation body, wherein the direction of the directional flow of the clear liquid is opposite to the direction of movement of the cleaning strip.

[0011] Preferably, the circulation body includes a circulation pipe, the circulation pipe is connected to both ends of the accommodating body, and a circulation pump group is connected in series to the first end of the circulation pipe.

[0012] Preferably, two sets of guide bodies are installed on the inner wall of the containing body, and the guide bodies are located at two sides to guide the cleaning strip.

[0013] Preferably, the first guide device is provided in two groups, and the two groups of the first guide devices are symmetrically arranged according to the driving device. The cleaning strip is controlled by the two groups of the first guide devices and the second guide device to form an inverted V-shaped cleaning structure on the outside of the regenerated wafer.

[0014] Preferably, the second guide device includes a guide bracket, the inner wall of which is fixed with a reversing roller for the cleaning strip to pass around, and a pressing roller is installed on both sides below the reversing roller. The two pressing rollers are both located outside the cleaning strip and press against the cleaning strip.

[0015] The beneficial effects of the present invention are:

[0016] Compared with the existing technology, through the above method and the above structural design, multiple regenerated wafers can be continuously cleaned without breaking the cleaning strip, and there is no need to replace the cleaning strip, which greatly improves the effect and efficiency of continuous cleaning of the regenerated wafer surface; at the same time, it also reduces the burden of staff operation and realizes continuous and automatic cleaning of the regenerated wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0018] Figure 2 For the present invention Figure 1 Schematic diagram of the top view structure.

[0019] Figure 3 For the present invention Figure 1 Schematic diagram of the side structure.

[0020] Figure 4 For the present invention Figure 3 AA cross-sectional structural diagram.

[0021] Figure 5 For the present invention Figure 4 Schematic diagram of the enlarged structure at point B.

[0022] Figure 6 For the present invention Figure 4 Enlarged structural diagram at C.

[0023] In the figure: 100, supporting platform; 200, purification tank; 210, containing body; 220, guiding body; 230, cleaning body; 231, first cleaning roller; 232, second cleaning roller; 240, circulation body; 241, circulation pump group; 242, circulation pipeline; 300, first guide device; 310, electric guide rail; 320, mounting plate; 330, first guide assembly; 340, second guide assembly; 341, telescopic rod; 342, guide base; 343, guide wheel; 400, driving device; 410, driving mounting seat; 420, driving roller; 500, regenerated wafer; 600, second guide device; 610, guide bracket; 611, adjusting opening; 612, positioning rod; 620, pressing roller; 630, reversing roller; 700, cleaning strip. DETAILED DESCRIPTION

[0024] The present invention will be further described below with reference to the accompanying drawings and examples.

[0025] The surface of the regenerated wafer can be flattened through processes such as film removal, polishing, and cleaning to meet the standards for reuse, which can reduce resource waste and lower production costs.

[0026] The cleaning strip can replace the roller brush cleaning method to efficiently clean the surface of the regenerated wafer to remove most of the residual particles on its surface.

[0027] First, due to the limitations of wafer thickness and processing methods, cleaning with a cleaning strip only cleans one side of the wafer, and both sides of the regenerated wafer need to be deeply cleaned. After cleaning one side, the cleaning position of the regenerated wafer needs to be adjusted. It is difficult to clean both sides of the wafer stably and effectively using traditional cleaning equipment, which reduces the cleaning effect and efficiency of the regenerated wafer.

[0028] Second, due to the limitations of the winding structure on both sides and the limited cleaning length of the cleaning strip, the cleaning strip is continuously consumed during the continuous cleaning of the regenerated wafer surface. After the cleaning strip is consumed, it needs to be replaced, which also reduces the efficiency of cleaning the regenerated wafer.

[0029] In order to solve the first problem raised above, a continuous wafer cleaning device is now proposed. Figure 1 -Attached Figure 6A continuous wafer cleaning device includes a support platform 100, and a driving device 400 is installed on the upper end of the support platform 100 to limit the regenerated wafer 500. The driving device 400 can control the regenerated wafer 500 to rotate around the axis in a vertical state; two groups of first guide devices 300 are also installed on the upper end of the support platform 100, and the two groups of first guide devices 300 are symmetrically distributed according to the driving device 400.

[0030] A second guide device 600 is also installed above the driving device 400. The cleaning bar 700 can be guided by two groups of first guide devices 300 and second guide devices 600, and the cleaning bar 700 can be controlled to move in a predetermined direction along a predetermined path to complete deep cleaning of the surface of the regenerated wafer 500.

[0031] Specifically, during the cleaning process, the two groups of first guide devices 300 are controlled to approach each other, which can push the corresponding positions of the cleaning bars 700 on both sides to move toward the direction close to the regenerated wafer 500, so that the cleaning bars 700 can fit the surface of the regenerated wafer 500. Subsequently, the regenerated wafer 500 is controlled to rotate around the axis while the cleaning bars 700 are controlled to move in a predetermined direction along the path. The cleaning bars 700 can continuously clean the residual particulate matter on both sides of the regenerated wafer 500, thereby achieving the cleaning of both sides of the surface of the regenerated wafer 500.

[0032] It should be noted here that the cleaning bar 700 is selected as a rope-like structure with an adsorption effect on the surface. During the directional movement of the cleaning bar 700, it can continuously contact the surface of the regenerated chip 500, and clean and discharge the residual particulate matter under the action of friction.

[0033] In summary, through the above method, the cleaning bar 700 can be controlled to move according to a predetermined trajectory, forming an inverted V-shaped cleaning structure on the outside of the regenerated wafer 500, which can deeply clean the surfaces on both sides of the regenerated wafer 500. The cleaning bar 700 can take away particulate impurities during the directional movement, thereby avoiding the residue of pollutants to the greatest extent and ensuring that the cleanliness of both sides of the finished regenerated wafer 500 meets the requirements; in this way, the synchronous and continuous cleaning of both sides of the regenerated wafer 500 can be achieved, which greatly improves the efficiency of the regenerated wafer cleaning.

[0034] It should be noted here that the inverted V-shaped structure here means that the top of the cleaning bar 700 is closed and the bottom is open. The cleaning bars 700 on both sides of the regenerated chip 500 can be cleaned in a V-shaped tilted manner, and can also be cleaned in a parallel manner.

[0035] It should be noted that the first guide device 300 here includes a first guide component 330 and a second guide component 340, which can effectively guide the cleaning bar 700. The first guide device 300 also includes a mounting plate 320 and an electric guide rail 310 for controlling the directional movement of the mounting plate 320. The first guide component 330 and the second guide component 340 are both installed on the surface of the mounting plate 320. The first guide component 330 is located on the outside of the mounting plate 320, and the second guide component 340 is located on the inside of the mounting plate 320. The positions of the first guide component 330 and the second guide component 340 can be adjusted through the electric guide rail 310 to adjust the moving trajectory of the cleaning bar 700.

[0036] It should also be noted that during the cleaning process, the electric guide rail 310 is used to control the second guide assembly 340 to be in a position close to the regenerated wafer 500, so that the cleaning bar 700 can fit the surface of the regenerated wafer 500 as closely as possible; during the cleaning process, the cleaning bars 700 on both sides of the regenerated wafer 500 are controlled to be in a V-shaped state, and the two ends of the V-shaped cleaning structure need to be controlled to be located at the center of the regenerated wafer 500. During the directional rotation of the regenerated wafer 500, the cleaning bar 700 can deeply clean the entire surface of the regenerated wafer 500 to ensure the overall cleaning effect.

[0037] The second guide assembly 340 here includes a telescopic rod 341, a guide base 342 and a guide wheel 343. The telescopic rod 341 can push the guide base 342 and the guide wheel 343 toward the regenerated wafer 500, and can accurately adjust the position of the cleaning strips 700 on both sides of the regenerated wafer 500.

[0038] The V-shaped cleaning structure can also be controlled to be located below the center of the circle, thereby further improving the cleaning effect of the surface of the regenerated wafer 500.

[0039] In order to control the cleaning strip 700 to fit the surface of the regenerated wafer 500, it is necessary to control the top angle of the cleaning strip 700 to be as small as possible. The angle of the cleaning strip 700 can be adjusted by arranging an inclined roller, but the position of the roller needs to be deflected around the vertical axis, resulting in the cleaning strips 700 on both sides of the regenerated wafer 500 being in a cross-state, which affects the cleaning stability and causes certain wear. The angle of the cleaning strips 700 on both sides can be greatly reduced by designing a hanging ring structure, but the friction between the hanging ring structure and the cleaning strip 700 is large, and the friction loss of the cleaning strip 700 is large, which affects the service life of the cleaning strip 700.

[0040] In order to solve the above problem, the second guide device 600 is designed to include a guide bracket 610, two pressing rollers 620 and a reversing roller 630 located above the two pressing rollers 620. The cleaning strip 700 is arranged according to the attached Figure 5The posture shown bypasses the reversing roller 630, and the pressing rollers 620 on both sides can clamp the cleaning bar 700 located in the middle to reduce the distance between the cleaning bars 700 on both sides of the regenerated wafer 500, thereby completing efficient cleaning of the surface of the regenerated wafer 500.

[0041] Through the above-mentioned arrangement, the cleaning bars 700 on both sides can be controlled to be in a relatively parallel state, and various positions on the surface of the regenerated wafer 500 can be cleaned deeply and stably.

[0042] In addition, an adjustment opening 611 is opened on the side wall of the guide bracket 610, which can adjust the distance between the two pressing rollers 620 according to the thickness of the regenerated wafer 500 to meet the needs of adaptive cleaning of the wafer surface.

[0043] A positioning rod 612 is installed at the upper end of the guide bracket 610. The top of the positioning rod 612 is connected to an elastic locking structure, which can adjust the overall height of the second guide device 600, so that the second guide device 600 is located above the regenerated chip 500 in a taut state, and can allow the cleaning bar 700 to move in a directional manner in the taut state, thereby ensuring the normal transportation and cleaning effect of the cleaning bar 700.

[0044] In order to solve the second problem of the existing operation that the cleaning strip is continuously consumed and needs to be replaced after it is consumed, a purification tank 200 is designed under the support platform 100, and the cleaning strip 700 is designed to be a ring-shaped closed shape. The bottom of the cleaning strip 700 can pass through the purification tank 200 for deep cleaning. The cleaning strip 700 in a cleaning state can be moved out from the first side of the purification tank 200, and after deep cleaning the surface of the regenerated chip 500, it is moved into the second side of the purification tank 200, and the cycle is continued to ensure the deep cleaning effect of the surface of the regenerated chip 500.

[0045] The purification tank 200 here includes a containing body 210 for containing cleaning liquid and a guide body 220 installed on both sides of the containing body 210. The guide body 220 can guide the cleaning bar 700 to prevent the cleaning bar 700 from contacting other structures during movement.

[0046] A plurality of cleaning bodies 230 are also installed in the accommodating body 210, through which the surface of the cleaning bar 700 can be deeply cleaned. The cleaning body 230 here includes a first cleaning roller 231 and a second cleaning roller 232 arranged at intervals. During the directional rotation of the first cleaning roller 231 and the second cleaning roller 232, the cleaning bar 700 located in the middle can be deeply cleaned, thereby removing the metal particulate matter remaining on the surface of the cleaning bar 700 to the greatest extent.

[0047] Serpentine-shaped cleaning strips are also installed on the surface of the first cleaning roller 231 and the second cleaning roller 232. During the directional rotation of the first cleaning roller 231 and the second cleaning roller 232, the serpentine cleaning strips can apply tangential force to the cleaning strip 700, which can further improve the cleaning effect on the surface of the cleaning strip 700.

[0048] In addition, in order to ensure the cleanliness of the cleaning liquid in the containing body 210, a circulation body 240 is also installed on the outside of the containing body 210. The circulation body 240 here includes a circulation pump group 241 and a circulation pipe 242. A filtering device is also installed in the circulation pump group 241. The circulation pump group 241 and the circulation pipe 242 can control the directional circulation flow of the cleaning liquid in the containing body 210, and can collect the residual particulate impurities in the cleaning liquid in a direction, thereby realizing continuous purification of the cleaning liquid, ensuring the cleaning effect of the surface of the cleaning strip 700, and ultimately improving the cleaning quality of the surface of the regenerated chip 500.

[0049] It should be noted here that the cleaning liquid is controlled to move in a first direction by the circulation body 240. The direction of movement of the cleaning liquid is opposite to the direction of movement of the cleaning bar 700, which can maximize the cleaning effect of particulate impurities on the surface of the cleaning bar 700.

[0050] In summary, through the above-mentioned structural design, multiple regenerated wafers 500 can be continuously cleaned without breaking the cleaning strip 700, and there is no need to replace the cleaning strip 700, which greatly improves the effect and efficiency of continuous cleaning of the surface of the regenerated wafer 500; at the same time, it also reduces the burden of staff operation and realizes continuous and automatic cleaning of the regenerated wafers.

[0051] Finally, it should be noted that the driving device 400 here includes a driving mount 410 and multiple driving rollers 420. The multiple driving rollers 420 are located on a virtual circular line. The driving rollers 420 can drive the regenerated chip 500 to rotate in a directional manner around its own axis, thereby realizing drive control during the cleaning process.

[0052] During the process of loading and unloading the regenerated wafer 500, the first guide devices 300 on both sides can be controlled to move toward the outside, staggered with the regenerated wafer 500, and opened to a predetermined angle to realize the loading and unloading of the regenerated wafer 500; at the same time, after the first guide devices 300 on both sides move toward the inside, the cleaning strips 700 on both sides can form a V-shaped structure, which can effectively limit the regenerated wafer 500, thereby ensuring the stability of the regenerated wafer 500 during the directional rotation cleaning process to the greatest extent.

[0053] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wafer continuous cleaning device, comprising a support platform (100), wherein the upper end of the support platform (100) is provided with a driving device (400) for limiting the position of a regenerated wafer (500) and controlling the directional rotation of the regenerated wafer (500), and further comprising a cleaning bar (700) for continuously cleaning the surface of the regenerated wafer (500) and a guide structure for guiding the cleaning bar (700), characterized in that: The guide structure comprises two groups of first guide devices (300) and one group of second guide devices (600), the two groups of the first guide devices (300) are symmetrically arranged on both sides of the driving device (400), and the second guide device (600) is located at a predetermined position above the driving device (400); the cleaning bar (700) passes through the first first guide device (300), the second guide device (600), and the second first guide device (300) in sequence to form an inverted V-shaped structure, and the cleaning bar (700) is controlled by the first guide device (300) and the second guide device (600) to abut against the two side surfaces of the regenerated wafer (500) to complete continuous cleaning; The cleaning strip (700) is in a closed annular shape, and a purification tank (200) is installed at the lower end of the support platform (100) and is located on the moving path of the cleaning strip (700). The purification tank (200) includes a receiving body (210) for receiving a cleaning liquid, and a cleaning body (230) for cleaning the surface of the cleaning strip (700) is installed on the inner wall of the receiving body (210). The cleaning strip (700) is directed through the cleaning body (230) to complete continuous cleaning. The second guide device (600) includes a guide bracket (610), and the inner wall of the guide bracket (610) is provided with two sets of spaced-apart pressing rollers (620), and a reversing roller (630) located above the two pressing rollers (620). The cleaning bar (700) is reversing around the reversing roller (630), and the two pressing rollers (620) are both located outside the cleaning bar (700) and abut against the cleaning bar (700); An adjustment opening (611) is formed on the side wall of the guide bracket (610), and the two pressing rollers (620) are both located in the adjustment opening (611). An adjustment component for controlling the distance between the two pressing rollers (620) is installed in the adjustment opening (611).

2. A continuous wafer cleaning device according to claim 1, characterized in that: The cleaning body (230) comprises a first cleaning roller (231) and a second cleaning roller (232) arranged at intervals, and the cleaning strip (700) passes through the first cleaning roller (231) and the second cleaning roller (232), and the first cleaning roller (231) and the second cleaning roller (232) are controlled to rotate continuously to complete the cleaning of residual particles on the surface of the cleaning strip (700).

3. The continuous wafer cleaning device according to claim 2, characterized in that: Snake-shaped cleaning strips are fixed on the surfaces of the first cleaning roller (231) and the second cleaning roller (232), and the surfaces of the cleaning strips are in contact with the surface of the cleaning strip (700).

4. The continuous wafer cleaning device according to claim 1, characterized in that: A circulation body (240) having a filtering function is further installed outside the containing body (210), and the directional flow of the cleaning liquid in the containing body (210) is controlled by the circulation body (240), wherein the direction of the directional flow of the clean liquid is opposite to the direction of movement of the cleaning strip (700).

5. The continuous wafer cleaning device according to claim 4, characterized in that: The circulation main body (240) comprises a circulation pipe (242), the circulation pipe (242) is connected to both ends of the accommodating main body (210), and a circulation pump group (241) is connected in series to the first end of the circulation pipe (242).

6. The continuous wafer cleaning device according to claim 1, characterized in that: Two sets of guide bodies (220) are also installed on the inner wall of the containing body (210), and the guide bodies (220) are located at two sides to guide the cleaning strip (700).

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