A photolithographic substrate processing apparatus

Abstract

The application discloses a kind of photoetching substrate processing equipment, it is related to photoetching substrate technical field, including lower support plate, the upper surface of the lower support plate is fixedly installed with upper mounting plate, the upper surface of the lower support plate is fixedly installed with support column at middle position, the upper surface of the support column is fixedly installed with fixing mechanism for fixing photoetching substrate;The upper surface of the upper mounting plate is fixedly installed with lifting cylinder at the position of the upper surface of the support column directly above;Through the cooperation of gas conveying mechanism and pretreatment mechanism, when it is needed to fill nitrogen, the rotating sleeve is rotated by the steering motor to make it fit with the fixed seat, so that the inside of the rotating sleeve is also in a sealed state when not in use, reducing contact with the outside world, when the rotating sleeve and the fixed sleeve fit, the first stopper is used to limit it, when the rotating sleeve and the fixed seat fit, the second stopper is used to limit it.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of photoetching substrate technology, and more particularly to a photoetching substrate processing device. BACKGROUND

[0002] Photoetching substrate is a material used in photoetching technology, which is a substrate for carrying photoresist and transferring patterns, and its surface is specially treated to facilitate uniform coating of photoresist and subsequent etching process; its material can be silicon wafer, metal layer, dielectric layer or other materials such as glass, sapphire, etc. In the process of manufacturing semiconductor devices, photoetching substrate not only provides physical support, but also determines the quality and performance of the final product.

[0003] The pre-treatment of substrate in the photoetching process is a crucial step, which includes removing surface contaminants (such as particles, organic matter, process residues, mobile ions) and water vapor, and pre-baking to 100-200℃ helps to enhance the adhesion of photoresist to the substrate. For hydrophilic substrates (such as SiO2, glass, noble metal film, GaAs, etc.), using adhesion enhancers (such as AR300-80 or HMDS) can increase the adhesion of the substrate to the photoresist, which is called adhesion or adhesion aid.

[0004] In related technology, a patent with publication number CN103399465A discloses a method for realizing double-side alignment photoetching by using single-side exposure machine, which belongs to the field of photoelectric technology and micro-nano processing technology. Mask plate A and mask plate B are designed to correspond to the required patterns of surface a and surface b of the substrate respectively. Inner and outer alignment marks are designed on mask plate A, which are symmetrically arranged. The inner alignment marks are within the size range of the substrate. First, mask plate A is used to perform photoetching on surface a of the substrate. Then, mask plate A is used to perform photoetching on the transparent substrate. The surface of the transparent substrate with photoetched patterns is opposite to surface a of the substrate. After the substrate and the transparent substrate are bonded, mask plate B is used to perform photoetching on surface b of the substrate. Finally, the substrate and the transparent substrate are separated by heating or dissolving, and a substrate with double-side alignment patterns is obtained. By using a transparent substrate, the problem of realizing double-side photoetching by using ordinary single-side exposure machine is solved, and the cost of double-side photoetching process is reduced.

[0005] However, due to the temperature change during the photoetching process, the substrate may experience thermal expansion and contraction, which may cause slight deformation of the substrate and affect the accurate transfer of patterns and alignment accuracy. SUMMARY

[0006] In view of the fact that the substrate may experience temperature changes during the photolithography process, resulting in thermal expansion and shrinkage, which may cause slight deformation of the substrate, affecting the accurate transfer of the pattern and the alignment accuracy, the present application aims to provide a photolithography substrate processing device.

[0007] To achieve the above object, the present application provides the following technical solutions.

[0008] A photolithography substrate processing device, comprising a lower support plate, an upper mounting plate fixedly installed on the upper surface of the lower support plate, a support column fixedly installed at the middle position of the upper surface of the lower support plate, and a fixing mechanism for fixing a photolithography substrate fixedly installed on the upper surface of the support column.

[0009] A lifting cylinder is fixedly installed on the upper surface of the upper mounting plate at a position directly above the support column, and a gas conveying mechanism for assisting in stabilizing the photolithography substrate is arranged below the lifting cylinder.

[0010] A pretreatment mechanism for applying an adhesion agent to the photolithography substrate is arranged on the left side of the upper surface of the lower support plate.

[0011] A heat conduction mechanism for maintaining the processing temperature of the photolithography substrate is arranged on the right side of the upper surface of the lower support plate.

[0012] Preferably, the fixing mechanism comprises a fixing sleeve fixedly installed on the upper surface of the support column, and a three-claw snap ring for fixing the photolithography substrate fixedly connected inside the fixing sleeve.

[0013] Preferably, the gas conveying mechanism comprises a hollow lifting rod, the upper end of the hollow lifting rod is connected to the telescopic end below the lifting cylinder, a lifting sleeve is fixedly connected below the hollow lifting rod, a gas conveying chamber is formed in the inside of the lifting sleeve, a rotating connection pipe is rotatably connected at the middle position of the hollow lifting rod, and a corrugated connection pipe is fixedly connected to the side surface of the rotating connection pipe.

[0014] A nitrogen gas conveying pump is fixedly installed on the right side of the lifting cylinder on the upper surface of the upper mounting plate, the gas outlet of the nitrogen gas conveying pump is in communication with the corrugated connection pipe, and the gas inlet of the nitrogen gas conveying pump is in communication with a nitrogen gas conveying pipe.

[0015] Preferably, the hollow lifting rod and the rotating connection pipe are rotatably connected through a sliding groove, the hollow lifting rod and the rotating connection pipe are hollow inside, the corrugated connection pipe and the rotating connection pipe are fixedly connected, and the inside of the corrugated connection pipe and the rotating connection pipe is in communication.

[0016] Preferably, the pretreatment mechanism comprises a steering motor, an output shaft of the steering motor is fixedly connected with a connecting rotating shaft, an upper end of the connecting rotating shaft is fixedly connected with a rotating seat, a side of the rotating seat away from the connecting rotating shaft is fixedly connected with a rotating sleeve, an inner top end middle position of the rotating sleeve is fixedly installed with a spraying chamber, the spraying chamber is hollow, and an inner bottom end of the spraying chamber is provided with a spraying opening for discharging.

[0017] Preferably, the pretreatment mechanism further comprises a fixing seat, the fixing seat is fixedly installed on the upper surface of the lower supporting plate, and the size of the fixing seat is consistent with the size of the rotating sleeve, a second stopper is fixedly installed on the side of the fixing sleeve, and a first stopper is installed on the side of the fixing sleeve.

[0018] Preferably, in the state that the telescopic end of the lifting cylinder is not extended, the distance between the lifting sleeve and the fixing sleeve is equal to the height of the rotating sleeve, and the shapes of the lifting sleeve and the fixing sleeve are consistent.

[0019] Preferably, a sealing clamping groove is formed at the upper surface edge of the fixing sleeve, and a sealing ring consistent with the sealing clamping groove is fixedly installed at the upper end edge position of the lifting sleeve.

[0020] Preferably, the heat conduction mechanism comprises a heater, the heater is fixedly installed on the upper surface of the lower supporting plate at a position right of the fixing sleeve, a heat conduction rod is embeddedly installed at an inner middle position of the heater, and one end of the heat conduction rod away from the heater is connected with the fixing sleeve.

[0021] Preferably, the inner side of the fixing sleeve is made of copper material, and the heat conduction rod is attached to the surface of the fixing sleeve and the inner side of the fixing sleeve.

[0022] Beneficial effects: through the cooperation of the gas conveying mechanism and the pretreatment mechanism, when nitrogen needs to be filled, the rotating sleeve is driven to rotate by the steering motor to be attached to the fixing seat, so that the inside of the rotating sleeve is also in a sealed state when not in use, reducing the contact with the outside world, when the rotating sleeve is attached to the fixing sleeve, the first stopper is used for limiting, when the rotating sleeve is attached to the fixing seat, the second stopper is used for limiting, it should be noted that the rotating angle of the steering motor is a preset angle, and interference with the first stopper and the second stopper will not occur, which can reduce the interference of the external environment during spraying as much as possible, and the closed processing environment can be maintained during processing.

[0023] Through the cooperation of the heat conduction mechanism and the pretreatment mechanism, the processing environment can be preheated in advance, and the influence of external temperature can be reduced through the cooperation of the subsequent sealing environment, so that the internal temperature is kept constant. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 is a perspective view of the present application.

[0025] Figure 2 is a schematic view of the present application after part of the structure is cut open.

[0026] Figure 3 is a partial directional view of the present application.

[0027] Figure 4 is a schematic view of the present application from another perspective.

[0028] Figure 5 is a partial sectional view of the present application.

[0029] Figure 6 is a partial structural schematic view of the present application. Figure 5

[0030] Figure 7 is a top view of the present application after part of the structure is cut open.

[0031] In the figure, 1 is a lower support plate, 2 is an upper mounting plate, 3 is a lifting cylinder, 4 is a nitrogen gas delivery pump, 5 is a support column, 6 is a heater, 7 is a heat conduction rod, 8 is a fixed sleeve, 9 is a gas delivery chamber, 10 is a fixed seat, 11 is a steering motor, 12 is a rotating seat, 13 is a rotating sleeve, 14 is a first stop block, 15 is a lifting sleeve, 16 is a hollow lifting rod, 17 is a rotating connection pipe, 18 is a corrugated connection pipe, 19 is a nitrogen gas delivery pipe, 20 is a connecting rotating shaft, 21 is a spraying chamber, 22 is a feeding pipe, 23 is a three-claw snap ring, 24 is a sealing clamping groove, 25 is a sealing ring, and 26 is a second stop block. DETAILED DESCRIPTION

[0032] Reference Figures 1 to 7 :

[0033] A photolithography substrate processing device, comprising a lower support plate 1, an upper mounting plate 2 is fixedly installed on the upper surface of the lower support plate 1, a support column 5 is fixedly installed at the middle position of the upper surface of the lower support plate 1, and a fixing mechanism for fixing a photolithography substrate is fixedly installed on the upper surface of the support column 5; it should be noted that the upper surface of the lower support plate 1 is fixedly connected with the upper mounting plate 2 through four support columns.

[0034] ​The upper surface of the upper mounting plate 2 is fixedly installed with a lifting cylinder 3 at the position directly above the support column 5, and a gas conveying mechanism is arranged below the lifting cylinder 3 for assisting the stability of the photoetching substrate; it should be noted that during the pre-treatment of the substrate, the cleanliness and humidity control of the environment are also very important, and trace amounts of water vapor or other chemical substances can affect the adhesion of the photoresist and the pattern transfer quality, therefore, the pre-treatment usually needs to be carried out in a strictly controlled environment, in this embodiment, dry nitrogen is input into the processing environment of the photoetching substrate through the gas conveying mechanism, which not only maintains the stability of the environment, but also reduces the humidity of the environment

[0035] The upper surface of the lower supporting plate 1 is provided with a pre-treatment mechanism on the left side for coating the photoetching substrate with an adhesion promoter; it should be noted that for hydrophilic substrates, the use of an adhesion promoter can increase the adhesion of the substrate to the photoresist, and the adhesion promoter is sprayed onto the surface of the photoetching substrate through the pre-treatment mechanism;

[0036] The upper surface of the lower supporting plate 1 is provided with a heat conduction mechanism on the right side for maintaining the processing temperature of the photoetching substrate, it should be noted that pre-baking is to enhance the adhesion of the photoresist to the substrate, but improper temperature control can cause premature curing of the photoresist or incomplete evaporation of the solvent, affecting the subsequent photoetching process, the heat conduction mechanism can maintain the stability of the processing environment temperature, and the pre-baking temperature is controlled between 100 and 200℃.

[0037] As an optional embodiment, the fixing mechanism comprises a fixing sleeve 8 fixedly installed on the upper surface of the support column 5, and a three-jaw snap ring 23 is fixedly connected inside the fixing sleeve 8 for fixing the photoetching substrate; it should be noted that the photoetching substrate is placed inside the fixing sleeve 8 before processing, and the three-jaw snap ring 23 is used to fix the photoetching substrate.

[0038] As an optional embodiment, the gas conveying mechanism comprises a hollow lifting rod 16, the upper end of the hollow lifting rod 16 is connected to the telescopic end below the lifting cylinder 3, and a lifting sleeve 15 is fixedly connected below the hollow lifting rod 16, a gas conveying chamber 9 is formed in the inside of the lifting sleeve 15, a rotating connection pipe 17 is rotatably connected at the middle position of the hollow lifting rod 16, and a corrugated connection pipe 18 is fixedly connected to the side surface of the rotating connection pipe 17;

[0039] A nitrogen gas conveying pump 4 is fixedly installed on the upper surface of the upper mounting plate 2 at the right side of the lifting cylinder 3, the gas outlet of the nitrogen gas conveying pump 4 is in communication with the corrugated connection pipe 18, and the gas inlet of the nitrogen gas conveying pump 4 is in communication with a nitrogen gas conveying pipe 19, it should be noted that the conveying of dry nitrogen is realized through the gas conveying mechanism, and the specific working mode is as follows:

[0040] Dry nitrogen enters nitrogen conveying pump 4 through nitrogen conveying pipe 19, is pumped to corrugated connecting pipe 18 by nitrogen conveying pump 4, and finally enters the gas conveying chamber 9 inside the lifting sleeve 15. The corrugated connecting pipe 18 is a hose, which can maintain the output of airflow when bending and deforming.

[0041] As an optional embodiment, the hollow lifting rod 16 and the rotating connecting pipe 17 are connected by a sliding groove, and the hollow lifting rod 16 and the rotating connecting pipe 17 are hollow inside. The corrugated connecting pipe 18 and the rotating connecting pipe 17 are fixedly connected, and the interiors of the corrugated connecting pipe 18 and the rotating connecting pipe 17 are connected.

[0042] It should be noted that the hollow lifting rod 16 and the rotating connecting pipe 17 are connected by a sliding groove, and the rotation of the rotating connecting pipe 17 does not affect the supply of nitrogen.

[0043] As an optional embodiment, the pretreatment mechanism includes a steering motor 11, and an output shaft above the steering motor 11 is fixedly connected with a connecting shaft 20. The upper end of the connecting shaft 20 is fixedly connected with a rotating seat 12. The side, away from the connecting shaft 20, of the rotating seat 12 is fixedly connected with a rotating sleeve 13. The inside top end of the rotating sleeve 13 is fixedly installed with a spraying chamber 21 at the middle position. The inside of the spraying chamber 21 is hollow, and the inside bottom end of the spraying chamber 21 is provided with a spraying opening for discharging. The rear end of the spraying chamber 21 is fixedly connected with a feeding pipe 22.

[0044] It should be noted that the pretreatment mechanism sprays the adhesion agent to the surface of the photoetching wafer. The adhesion agent enters the inside of the spraying chamber 21 through the feeding pipe 22, and then falls to the surface of the photoetching wafer through the spraying opening for discharging at the inside bottom end of the spraying chamber 21. In the initial state, as shown in the figure, the rotating sleeve 13 and the fixed sleeve 8 form a closed space, which reduces the intervention of the external environment during the spraying process of the photoetching wafer. Figure 1

[0045] ​As an optional embodiment, the pre-processing mechanism further comprises a fixed seat 10 fixedly installed on the upper surface of the lower supporting plate 1, and the size of the fixed seat 10 is matched with the size of the rotating sleeve 13, and a second stopper 26 is fixedly installed on the side surface of the fixed seat 10, and a first stopper 14 is installed on the side surface of the fixed sleeve 8. When nitrogen needs to be filled, the rotating sleeve 13 is driven to rotate by the steering motor 11 to be attached to the fixed seat 10, so that the inside of the rotating sleeve 13 is also in a sealed state when not in use, reducing the contact with the outside world. When the rotating sleeve 13 and the fixed sleeve 8 are attached, the first stopper 14 is used for limiting, and when the rotating sleeve 13 and the fixed seat 10 are attached, the second stopper 26 is used for limiting. It should be noted that the rotating angle of the steering motor 11 is a preset angle, which does not interfere with the first stopper 14 and the second stopper, and can reduce the interference of the external environment during spraying as much as possible.

[0046] As an optional embodiment, the distance between the lifting sleeve 15 and the fixed sleeve 8 is equal to the height of the rotating sleeve 13 when the telescopic end of the lifting cylinder 3 is not extended, and the shape of the lifting sleeve 15 is matched with the shape of the fixed sleeve 8. It should be noted that before the photolithography wafer is pre-processed, the lifting sleeve 15 is lowered to extend into the inside of the fixed sleeve 8 to deliver dry nitrogen to the fixed sleeve 8.

[0047] As an optional embodiment, a sealing groove 24 is formed at the edge of the upper surface of the fixed sleeve 8, and a sealing ring 25 matched with the sealing groove 24 is fixedly installed at the edge position of the upper end of the lifting sleeve 15. It should be noted that during the process of lowering the lifting sleeve 15 to extend into the inside of the fixed sleeve 8, the sealing ring 25 extends into the sealing groove 24, further increasing the sealing of the connection.

[0048] As an optional embodiment, the heat conduction mechanism comprises a heater 6 fixedly installed on the upper surface of the lower supporting plate 1 at a position right of the fixed sleeve 8, and a heat conduction rod 7 is embedded and installed at the middle position in the inside of the heater 6, and one end of the heat conduction rod 7 away from the heater 6 is connected with the fixed sleeve 8. Before processing, the heat conduction rod 7 delivers heat from the heater to the inside of the fixed sleeve 8 to preheat the processing environment, and cooperates with the subsequent sealed environment to reduce the influence of the external temperature and maintain the constant internal temperature.

[0049] As an optional embodiment, the inside of the fixed sleeve 8 is made of copper material, and the heat conduction rod 7 is attached to the inside of the fixed sleeve 8 through the surface of the fixed sleeve 8.

[0050] Working principle:

[0051] Before processing, the photolithography substrate is placed inside the fixing sleeve 8 and fixed by the three-claw clamp ring 23 .

[0052] The delivery of dry nitrogen is achieved through the gas delivery mechanism, and the specific working method is as follows:

[0053] Dry nitrogen enters the nitrogen delivery pump 4 through the nitrogen delivery pipe 19, is then pumped to the corrugated connecting pipe 18 by the nitrogen delivery pump 4, and finally enters the gas delivery chamber 9 inside the lifting sleeve 15. The lifting sleeve 15 is driven down by the lifting cylinder 3. The corrugated connecting pipe 18 is a hose that can maintain the output of airflow when it is bent and deformed.

[0054] The hollow lifting rod 16 and the rotating connecting pipe 17 are rotatably connected via a sliding groove, and the rotation of the rotating connecting pipe 17 does not affect the supply of nitrogen.

[0055] The adhesion promoter is sprayed onto the surface of the photolithography substrate through the pretreatment mechanism. The adhesion promoter enters the interior of the spray chamber 21 through the feed pipe 22, and then falls onto the surface of the photolithography substrate through the spray port for discharging the material provided at the bottom of the spray chamber 21. In the initial state, Figure 1 The rotating sleeve 13 and the fixed sleeve 8 are combined into a closed space, which reduces the interference of the external environment during the spraying process of the photolithography substrate.

[0056] When nitrogen needs to be filled, the steering motor 11 drives the rotating sleeve 13 to rotate so that it fits with the fixed seat 10. When not in use, the interior of the rotating sleeve 13 is also in a sealed state to reduce contact with the outside world. When the rotating sleeve 13 and the fixed sleeve 8 fit together, they are limited by the first stopper 14. When the rotating sleeve 13 and the fixed seat 10 fit together, they are limited by the second stopper 26. It should also be noted that the rotation angle of the steering motor 11 is a preset angle and will not interfere with the first stopper 14 and the second stopper, which can minimize the interference of the external environment during spraying.

[0057] When the lifting sleeve 15 is lowered and inserted into the fixed sleeve 8, the sealing ring 25 is inserted into the sealing groove 24, thereby further improving the sealing performance of the connection.

[0058] Through cooperation of the gas conveying mechanism and the pretreatment mechanism, when nitrogen needs to be filled, the rotating sleeve is rotated by the steering motor to be attached to the fixed seat, so that the inside of the rotating sleeve is also in a sealed state when not in use, reducing contact with the outside world. When the rotating sleeve and the fixed sleeve are attached, the first stopper is used to limit it. When the rotating sleeve and the fixed seat are attached, the second stopper is used to limit it. It should be noted that the rotating angle of the steering motor is a preset angle and does not interfere with the first stopper and the second stopper. The interference of the external environment during spraying can be minimized, and the processing environment can be kept closed during processing.

[0059] Through cooperation of the heat conduction mechanism and the pretreatment mechanism, the processing environment can be preheated in advance, and the influence of external temperature can be reduced through subsequent sealing environment to maintain the constant internal temperature. Pre-baking is to enhance the adhesion of photoresist and substrate, but improper temperature control may cause premature curing of photoresist or incomplete evaporation of solvent, affecting the subsequent photoetching process. The heat conduction mechanism can maintain the stability of the processing environment temperature, and the pre-baking temperature is controlled between 100 and 200℃.

[0060] The above is only the preferred embodiment of the present application, and the protection scope of the present application is not limited to the above-mentioned embodiments. Any technical solution falling within the concept of the present application shall fall within the protection scope of the present application. It should be noted that for ordinary skilled persons in the art, some improvements and refinements without departing from the principles of the present application shall also be considered as the protection scope of the present template.

Claims

1. A photolithography substrate processing device, characterized in that: It comprises a lower support plate (1), an upper mounting plate (2) is fixedly mounted on the upper surface of the lower support plate (1), a support column (5) is fixedly mounted at a middle position of the upper surface of the lower support plate (1), and a fixing mechanism for fixing a photolithography substrate is fixedly mounted on the upper surface of the support column (5); A lifting cylinder (3) is fixedly mounted on the upper surface of the upper mounting plate (2) at a position directly above the support column (5), and a gas delivery mechanism for assisting in stabilizing the photolithography substrate is provided below the lifting cylinder (3); A pre-treatment mechanism for coating the photolithography substrate with an adhesion promoter is provided on the left side of the upper surface of the lower support plate (1); A heat conduction mechanism for maintaining the processing temperature of the photolithography substrate is provided on the right side of the upper surface of the lower support plate (1); The fixing mechanism comprises a fixing sleeve (8), the fixing sleeve (8) being fixedly mounted on the upper surface of the support column (5), and a three-claw clamping ring (23) for fixing the photolithography substrate being fixedly connected inside the fixing sleeve (8); The gas delivery mechanism includes a hollow lifting rod (16), the upper end of the hollow lifting rod (16) is connected to the telescopic end below the lifting cylinder (3), and the lower part of the hollow lifting rod (16) is fixedly connected to a lifting sleeve (15), the interior of the lifting sleeve (15) is provided with a gas delivery chamber (9), the middle position of the hollow lifting rod (16) is rotatably connected to a rotating connecting pipe (17), and the side of the rotating connecting pipe (17) is fixedly connected to a corrugated connecting pipe (18); A nitrogen delivery pump (4) is fixedly mounted on the upper surface of the upper mounting plate (2) at a position on the right side of the lifting cylinder (3); the air outlet of the nitrogen delivery pump (4) is connected to the corrugated connecting pipe (18), and the air inlet of the nitrogen delivery pump (4) is fixedly connected to the nitrogen delivery pipe (19); The pretreatment mechanism includes a steering motor (11), an output shaft above the steering motor (11) is fixedly connected to a connecting shaft (20), an upper end of the connecting shaft (20) is fixedly connected to a rotating seat (12), a side of the rotating seat (12) away from the connecting shaft (20) is fixedly connected to a rotating sleeve (13), a spray chamber (21) is fixedly installed at a middle position of the internal top end of the rotating sleeve (13), the interior of the spray chamber (21) is hollow, and a spray port for discharging material is provided at the internal bottom end of the spray chamber (21), and a rear end of the spray chamber (21) is fixedly connected to a feed pipe (22); The pretreatment mechanism further comprises a fixed seat (10), the fixed seat (10) being fixedly mounted on the upper surface of the lower support plate (1), and the size of the fixed seat (10) being consistent with the size of the rotating sleeve (13), a second stopper (26) being fixedly mounted on the side of the fixed seat (10), and a first stopper (14) being mounted on the side of the fixed sleeve (8); When the telescopic end below the lifting cylinder (3) is not extended, the distance between the lifting sleeve (15) and the fixed sleeve (8) is equal to the height of the rotating sleeve (13), and the shapes of the lifting sleeve (15) and the fixed sleeve (8) are consistent.

2. The photolithography substrate processing equipment according to claim 1, characterized in that: The hollow lifting rod (16) and the rotating connecting tube (17) are rotatably connected via a sliding groove, and the interiors of the hollow lifting rod (16) and the rotating connecting tube (17) are hollow. The corrugated connecting tube (18) and the rotating connecting tube (17) are fixedly connected, and the interiors of the corrugated connecting tube (18) and the rotating connecting tube (17) are communicated.

3. The photolithography substrate processing equipment according to claim 2, characterized in that: A sealing groove (24) is provided at the edge of the upper surface of the fixed sleeve (8), and a sealing ring (25) that matches the sealing groove (24) is fixedly installed at the upper edge of the lifting sleeve (15).

4. The photolithography substrate processing equipment according to claim 1, characterized in that: The heat conduction mechanism comprises a heater (6), which is fixedly mounted on the upper surface of the lower support plate (1) at the right side of the fixed sleeve (8), and a heat conduction rod (7) is embedded in the middle position of the interior of the heater (6), and the end of the heat conduction rod (7) away from the heater (6) is connected to the fixed sleeve (8).

5. The photolithography substrate processing equipment according to claim 4, characterized in that: The inner side of the fixed sleeve (8) is made of copper, and the heat conducting rod (7) passes through the surface of the fixed sleeve (8) and fits into the inner side of the fixed sleeve (8).

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